Gas cell, molecular clock, and gas cell balancing method
By setting up a micro leakage module in the gas chamber to control the gas flow rate, the three-chamber dynamic balance is achieved, which solves the problems of gas purity and air pressure changes in traditional gas chamber packaging, and improves the stability and accuracy of the molecular clock.
Patent Information
- Application Number
- CN202510847464.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-24
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2045-06-24
AI Technical Summary
In traditional clock air chamber packaging solutions, material effluent or inspiratory problems lead to changes in the ambient gas purity and air pressure of the gas chamber, affecting the accuracy and long-term stability of the molecular clock.
An air chamber structure is designed, including a first sealing chamber, a second sealing chamber and a third sealing chamber. By setting a micro leakage module to control the gas flow rate, the gas purity and air pressure in the second sealing chamber are maintained unchanged, and a three-chamber dynamic balanced air seal packaging is achieved.
Stabilizes the performance of the molecular clock, provides its long-term stability, improves the stability of gas purity and air pressure, and ensures timing accuracy.
Smart Images

Figure CN120370653A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of high-precision instrument measurement. Specifically, it relates to a gas chamber, a molecular clock, and a gas chamber balancing method. Background Art
[0002] The molecular clock gas chamber is a key component in high-precision molecular clock products. It is mainly used to accommodate polar gas molecules, providing a space for the interaction between electromagnetic waves and polar gas molecules. The quantization of the rotational energy levels of polar gas molecules under the action of an electromagnetic field generates an electromagnetic molecular rotational spectrum, thereby realizing a high-precision timing function. The molecular clock uses the rotation spectrum peak of high-frequency electromagnetic waves penetrating polar gas molecules in the gas chamber as a frequency reference. The encapsulation of polar gas molecules in the molecular clock gas chamber is a key process for realizing the performance of molecular clock products. For example, the performance of the molecular clock is affected by factors such as the purity, gas pressure, and ambient temperature of polar gas molecules.
[0003] Traditional clock gas chamber encapsulation schemes mainly involve filling polar gas molecules into a clock gas chamber with a low leak rate and high vacuum through an inflation device. However, there are always problems of gas outgassing or gas absorption in the gas chamber. The gases released or absorbed by the materials will affect the gas pressure in the gas chamber environment and the purity of polar gases, resulting in unstable accuracy of the molecular clock and its long-term stability being easily affected. Summary of the Invention
[0004] The purpose of the embodiments of this application is to provide a gas chamber, a molecular clock, and a gas chamber balancing method to solve the problems that the current clock gas chamber encapsulation scheme affects the purity and gas pressure of the gas in the gas chamber environment due to gas outgassing or gas absorption of the material itself, resulting in unstable accuracy of the molecular clock and its long-term stability being easily affected.
[0005] In a first aspect, this application provides a gas chamber, which includes: a first sealed chamber, a second sealed chamber, and a third sealed chamber; wherein, the first sealed chamber and the second sealed chamber are configured to accommodate a target gas, and an absorption medium is provided in the third sealed chamber; the second sealed chamber is disposed in the first sealed chamber; a first micro-leakage module is provided on the second sealed chamber, and the first micro-leakage module connects the first sealed chamber and the second sealed chamber; the third sealed chamber is disposed in the second sealed chamber; a second micro-leakage module is provided on the third sealed chamber, and the second micro-leakage module connects the second sealed chamber and the third sealed chamber; wherein, the absorption medium is used to absorb the target gas in the third sealed chamber; wherein, the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber is equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber.
[0006] The air chamber provided by this solution. In this solution, a first micro-leakage module is arranged between the first sealed chamber (gas source chamber) and the second sealed chamber (air chamber), and a second micro-leakage module is arranged between the second sealed chamber (air chamber) and the third sealed chamber (getter chamber). Moreover, the flow rate of the target gas released from the first sealed chamber flowing through the first micro-leakage module to the second sealed chamber is controlled to be equal to the flow rate of the target gas released from the second sealed chamber flowing through the second micro-leakage module to the third sealed chamber. As a result, the purity of the target gas and the gas pressure in the second sealed chamber are basically maintained unchanged, achieving a three-chamber dynamic balance airtight package, thereby solving the problem of the influence of the release or absorption of the target gas by the material in the second sealed chamber on the gas molecule purity and pressure in the second sealed chamber, and further stabilizing the performance of the molecular clock and providing its long-term stability.
[0007] In an optional implementation manner of the first aspect, the ratio of the air pressure in the second sealed chamber to the air pressure in the first sealed chamber is equal to the target leakage rate ratio; the target leakage rate ratio is the ratio of the first leakage rate of the first micro-leakage module to the second leakage rate of the second micro-leakage module.
[0008] In the above implementation manner, this solution controls the ratio of the air pressure in the second sealed chamber to the air pressure in the first sealed chamber to be equal to the target leakage rate ratio, thereby controlling the flow rate of the first micro-leakage module flowing to the second sealed chamber to be equal to the flow rate of the target gas released from the second sealed chamber flowing through the second micro-leakage module to the third sealed chamber. Furthermore, through the accurate control of the air pressure ratio, the three-chamber dynamic balance can be achieved, improving the implementation accuracy and controllability of the purity of the target gas and the gas pressure in the second sealed chamber being basically maintained unchanged.
[0009] In an optional implementation manner of the first aspect, the first micro-leakage module includes a first opening, a second opening, and a plurality of first micro-leakage channels connecting the first opening and the second opening; wherein, the first opening is located in the first sealed chamber, and the second opening is located in the second sealed chamber; the second micro-leakage module includes a third opening, a fourth opening, and a plurality of second micro-leakage channels connecting the third opening and the fourth opening; wherein, the third opening is located in the second sealed chamber, and the fourth opening is located in the third sealed chamber.
[0010] In an optional implementation manner of the first aspect, the first micro-leakage module and the second micro-leakage module are formed by bonding a first silicon wafer and a second silicon wafer; the first opening and the fourth opening are formed on the first silicon wafer, the second opening and the third opening are formed on the second silicon wafer, and the first micro-leakage channels and the second micro-leakage channels are formed between the first silicon wafer and the second silicon wafer.
[0011] In an alternative embodiment of the first aspect, the first micro-leakage module has a first leakage rate related to the number of channels, as well as the channel width, depth, and length of the first micro-leakage channel, and the second micro-leakage module has a second leakage rate related to the number of channels, as well as the channel width, depth, and length of the second micro-leakage channel.
[0012] In the above-mentioned various embodiments, the present solution constructs the micro-leakage channel structure of the micro-leakage module through lithography technology and multi-layer bonding technology of silicon wafers, so that the leakage rate of the micro-leakage module can be accurately controlled, and the leakage rate of the micro-leakage module can achieve nanoscale accuracy; at the same time, silicon has good chemical inertness to most gases (such as air, nitrogen, oxygen, inert gases, etc.) at room temperature and is not easy to react with gases, ensuring the long-term stability of the leakage rate.
[0013] In an alternative embodiment of the first aspect, the gas absorption medium is any one of a vapor-deposited getter, a non-vapor-deposited getter, and a composite getter.
[0014] In the above-mentioned embodiment, the present solution can use various types of gas absorption media to achieve gas absorption in the third sealed chamber, thereby improving the universality of the present solution.
[0015] In an alternative embodiment of the first aspect, a limiting groove is provided in the second sealed chamber, and the third sealed chamber is arranged in the limiting groove.
[0016] In the above-mentioned embodiment, the present solution designs the limiting groove to arrange the third sealed chamber, so that the third sealed chamber is more firmly arranged in the second sealed chamber, thereby improving the tightness between the chambers.
[0017] In a second aspect, the present application provides a molecular clock, which includes the gas chamber described in any one of the alternative embodiments of the first aspect.
[0018] In the molecular clock designed above, in the present solution, a first micro-leakage module is provided between the first sealed chamber (gas source chamber) and the second sealed chamber (gas chamber), and a second micro-leakage module is provided between the second sealed chamber (gas chamber) and the third sealed chamber (getter chamber), and the flow rate of the target gas released from the first sealed chamber flowing through the first micro-leakage module to the second sealed chamber is controlled to be equal to the flow rate of the target gas released from the second sealed chamber flowing through the second micro-leakage module to the third sealed chamber, so that the purity and gas pressure of the target gas in the second sealed chamber are basically maintained unchanged, realizing a three-chamber dynamic equilibrium gas seal, thereby solving the problem of the influence of the release or absorption of the target gas by the material in the second sealed chamber on the gas molecule purity and gas pressure in the second sealed chamber, and further stabilizing the performance of the molecular clock and providing its long-term stability.
[0019] In a third aspect, the present application provides a method for balancing air chambers. This method is applied to an air chamber, which includes a first sealed chamber, a second sealed chamber, and a third sealed chamber. Among them, the first sealed chamber and the second sealed chamber are configured to accommodate a target gas, and an absorption medium is provided in the third sealed chamber. The second sealed chamber is disposed within the first sealed chamber. A first micro-leakage module is provided on the second sealed chamber, and the first micro-leakage module connects the first sealed chamber and the second sealed chamber. The third sealed chamber is disposed within the second sealed chamber. A second micro-leakage module is provided on the third sealed chamber, and the second micro-leakage module connects the second sealed chamber and the third sealed chamber. Among them, the absorption medium is used to absorb the target gas in the third sealed chamber. The method includes: obtaining a first leakage rate corresponding to the first micro-leakage module and a second leakage rate corresponding to the second micro-leakage module; controlling the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber to be equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber according to the first leakage rate and the second leakage rate.
[0020] For the air chamber balancing method designed above, in this solution, a first micro-leakage module is provided between the first sealed chamber (gas source chamber) and the second sealed chamber (air chamber), and a second micro-leakage module is provided between the second sealed chamber (air chamber) and the third sealed chamber (sorbent chamber). Moreover, it is controlled that the flow rate of the target gas released from the first sealed chamber flowing to the second sealed chamber through the first micro-leakage module is equal to the flow rate of the target gas released from the second sealed chamber flowing to the third sealed chamber through the second micro-leakage module. Thus, the purity and gas pressure of the target gas in the second sealed chamber are basically maintained unchanged, realizing a three-chamber dynamic balanced airtight package, thereby solving the problem of the influence of the release or absorption of the target gas by the material of the second sealed chamber on the gas molecule purity and gas pressure of the second sealed chamber, and further stabilizing the performance of the molecular clock and providing its long-term stability.
[0021] In an optional implementation manner of the third aspect, controlling the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber to be equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber according to the first leakage rate and the second leakage rate includes: calculating the leakage rate ratio of the first leakage rate to the second leakage rate; controlling the charging amount of the target gas in the second sealed chamber and the first sealed chamber until the pressure ratio of the second sealed chamber to the first sealed chamber is equal to the leakage rate ratio, and then stop charging.
[0022] For the above implementation manner, this solution controls the charging amount of the target gas in the second sealed chamber and the first sealed chamber based on the leakage rate ratio, thereby achieving that the pressure ratio of the second sealed chamber to the first sealed chamber is equal to the leakage rate ratio. Furthermore, the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber is equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber, and further improving the stability of the purity and gas pressure of the target gas in the second sealed chamber.
[0023] In a fourth aspect, the present invention provides an electronic device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, it performs the method described in the third aspect or any optional implementation manner in the third aspect.
[0024] In a fifth aspect, the present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it performs the method described in the third aspect or any optional implementation manner in the third aspect.
[0025] In a sixth aspect, the present invention provides a computer program product, including a computer program / instructions. When the computer program / instructions are executed by a processor, they perform the method described in the third aspect or any optional implementation manner in the third aspect.
[0026] The above description is only an overview of the technical solutions of this application. In order to be able to understand the technical means of this application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of this application more obvious and understandable, the following specifically gives the specific implementation manners of this application. Description of the Drawings
[0027] In order to more clearly illustrate the technical solutions of the embodiments of this application, the following will briefly introduce the drawings required to be used in the embodiments of this application. It should be understood that the following drawings only show some embodiments of this application, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.
[0028] Figure 1 It is the first structural schematic diagram of the air chamber provided by the embodiment of this application; Figure 2 It is the second structural schematic diagram of the air chamber provided by the embodiment of this application; Figure 3 It is the structural schematic diagram of the first micro-leakage module and the second micro-leakage module provided by the embodiment of this application; Figure 4 It is the third structural schematic diagram of the air chamber provided by the embodiment of this application; Figure 5 It is the structural schematic diagram of the molecular clock provided by the embodiment of this application; Figure 6 It is the flow schematic diagram of the air chamber balancing method provided by the embodiment of this application; Figure 7 It is the structural schematic diagram of the electronic device provided by the embodiment of this application.
[0029] Icons: 1 - gas chamber; 2 - molecular clock; 10 - first sealed chamber; 20 - second sealed chamber; 210 - limiting groove; 30 - third sealed chamber; 310 - suction medium; 40 - first micro-leakage module; 410 - first opening; 420 - second opening; 430 - first micro-leakage channel; 50 - second micro-leakage module; 510 - third opening; 520 - fourth opening; 530 - second micro-leakage channel; 7 - electronic device; 701 - processor; 702 - memory; 703 - communication bus. Detailed implementation manners
[0030] The embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to illustrate the technical solutions of the present application more clearly, so they are only examples and cannot be used to limit the protection scope of the present application.
[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion.
[0032] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, "a plurality" means more than two unless otherwise specifically defined.
[0033] Referring to "embodiments" herein means that the specific features, structures or characteristics described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0034] In the description of the embodiments of this application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally represents an "or" relationship between the associated objects before and after.
[0035] In the description of the embodiments of the present application, the term "plurality" means more than two (including two). Similarly, "multiple groups" means more than two groups (including two groups), and "multiple pieces" means more than two pieces (including two pieces).
[0036] In the description of the embodiments of the present application, for technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the embodiments of the present application.
[0037] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.
[0038] The molecular clock gas cell is a key component in high-precision molecular clock products. It is mainly used to accommodate polar gas molecules, providing a space for the interaction between electromagnetic waves and polar gas molecules. The electromagnetic molecular rotational spectrum generated by the quantization of the rotational energy levels of polar gas molecules under the action of an electromagnetic field enables high-precision timing. The molecular clock uses the rotation spectrum peak of high-frequency electromagnetic waves penetrating polar gas molecules in the gas cell as a frequency reference. The encapsulation of polar gas molecules in the molecular clock gas cell is a key process for realizing the performance of molecular clock products. For example, the performance of the molecular clock is affected by factors such as the purity, gas pressure, and ambient temperature of polar gas molecules.
[0039] Traditional clock gas cell encapsulation schemes mainly involve filling polar gas molecules into a clock gas cell with low leakage rate and high vacuum through an inflation device. However, there are always problems of outgassing or gas absorption of the materials inside the gas cell. The gases released or absorbed by the materials will affect the gas pressure in the gas cell environment and the purity of the polar gas, resulting in unstable accuracy of the molecular clock and its long-term stability being easily affected.
[0040] Based on the above problems, the present application designs an air chamber, a molecular clock, and an air chamber balancing method. By setting a first micro-leakage module between the first sealed chamber (gas source chamber) and the second sealed chamber (air chamber), and setting a second micro-leakage module between the second sealed chamber (air chamber) and the third sealed chamber (getter chamber), and controlling the flow rate of the target gas released from the first sealed chamber flowing through the first micro-leakage module to the second sealed chamber to be equal to the flow rate of the target gas released from the second sealed chamber flowing through the second micro-leakage module to the third sealed chamber, so as to keep the purity and gas pressure of the target gas in the second sealed chamber basically unchanged, realizing a three-chamber dynamic balance airtight package, thereby solving the problem of the influence of the material precipitation or absorption of the target gas in the second sealed chamber on the gas molecular purity and gas pressure of the second sealed chamber, and further stabilizing the performance of the molecular clock and providing its long-term stability.
[0041] Based on the above idea, the present application first provides an air chamber. Among them, the air chamber provided by the present application represents an air chamber packaging structure for accommodating polar gas molecules in a molecular clock. A molecular clock is a precision measurement tool that uses the characteristic rotational energy level transitions of polar gas molecules in an electromagnetic field to generate characteristic rotational spectra (such as resonance signals in the microwave or radio frequency bands) for timing. It combines molecular spectroscopy and quantum technology and has extremely high frequency stability and accuracy.
[0042] The air chamber packaging structure provides a space for the interaction between the electromagnetic wave of the molecular clock and polar gas molecules, and the electromagnetic molecular rotational spectrum generated by the quantum rotational energy level transitions of polar gas molecules under the action of an electromagnetic field realizes the high-precision timing function.
[0043] The micro-leakage module refers to a module device with extremely small channels (such as micron-scale gaps, pores, or defects). The target gas in the sealed chamber can slowly and slightly leak through the extremely small channels (such as micron-scale gaps, pores, or defects) in the micro-leakage module.
[0044] Long-term stability refers to the timing accuracy of the molecular clock during long-term use, which is affected by the purity and pressure of the polar gas molecules in the air chamber packaging structure of the molecular clock. When the purity of the polar gas molecules decreases or the pressure changes, the long-term stability of the molecular clock will decrease.
[0045] Specifically, as Figure 1As shown, the air chamber designed in this scheme includes a first sealed chamber 10, a second sealed chamber 20 and a third sealed chamber 30. The first sealed chamber 10 and the second sealed chamber 20 contain target gas, and the third sealed chamber 30 is provided with an air-absorbing medium 310, wherein the target gas can be a polar gas, which can generate an electromagnetic molecular rotation spectrum generated by quantized rotational energy level transition under the action of an electromagnetic field, thereby realizing a high-precision timing function; the air-absorbing medium 310 can absorb gas by chemical reaction or physical adsorption, thereby maintaining a vacuum environment, removing impurity gas or extending the life of the equipment.
[0046] Please continue to refer to Figure 1 The second sealed chamber 20 designed in this scheme is arranged in the first sealed chamber 10, and the second sealed chamber 20 is provided with a first micro-leakage module 40, and the first micro-leakage module 40 connects the first sealed chamber 10 with the second sealed chamber 20; the third sealed chamber 30 is arranged in the second sealed chamber 20, and the third sealed chamber 30 is provided with a second micro-leakage module 50, and the second micro-leakage module 50 connects the second sealed chamber 20 with the third sealed chamber 30.
[0047] In the above-designed air chamber structure, the gas pressure of the target gas in the designed first sealed chamber 10 is greater than the gas pressure of the target gas in the second sealed chamber 20. Therefore, the target gas precipitated in the first sealed chamber 10 can enter the second sealed chamber 20 through the first micro-leakage module 40. The gas pressure of the target gas in the designed second sealed chamber 20 is greater than the gas pressure in the third sealed chamber 30. Therefore, the target gas precipitated in the second sealed chamber can enter the third sealed chamber 30 through the second micro-leakage module 50, and the air absorption medium 310 in the third sealed chamber 30 can absorb the target gas entering the third sealed chamber.
[0048] Among them, in the air chamber structure designed in this scheme, the flow rate of the target gas flowing from the first sealed chamber 10 to the second sealed chamber 20 through the first micro-leakage module 40 is equal to the flow rate of the target gas flowing from the second sealed chamber 20 to the third sealed chamber 30 through the second micro-leakage module 50, so that the purity of the target gas and the gas pressure in the second sealed chamber 20 are basically maintained unchanged, realizing the three-chamber dynamic balance airtight packaging, thereby further stabilizing the performance of the molecular clock and providing its long-term stability.
[0049] For the gas chamber designed above, in this solution, a first micro-leakage module is arranged between the first sealed chamber (gas source chamber) and the second sealed chamber (gas chamber), and a second micro-leakage module is arranged between the second sealed chamber (gas chamber) and the third sealed chamber (getter chamber). Moreover, the flow rate of the target gas released from the first sealed chamber flowing through the first micro-leakage module to the second sealed chamber is controlled to be equal to the flow rate of the target gas released from the second sealed chamber flowing through the second micro-leakage module to the third sealed chamber. Thus, the purity and gas pressure of the target gas in the second sealed chamber are basically maintained unchanged, realizing a three-chamber dynamically balanced gas seal packaging, thereby solving the problem of the influence of the release or absorption of the target gas by the material in the second sealed chamber on the gas molecular purity and pressure in the second sealed chamber, and further stabilizing the performance of the molecular clock and providing its long-term stability.
[0050] In an alternative implementation of this embodiment, this solution can adjust the gas pressure of the target gas in the first sealed chamber 10 and the second sealed chamber 20 based on the first leakage rate corresponding to the first micro-leakage module 40 and the second leakage rate corresponding to the second micro-leakage module 50, so as to achieve that the flow rate of the target gas flowing from the first sealed chamber 10 through the first micro-leakage module 40 to the second sealed chamber 20 is equal to the flow rate of the target gas flowing from the second sealed chamber 20 through the second micro-leakage module 50 to the third sealed chamber 30.
[0051] Specifically, this solution can design the ratio of the gas pressure in the second sealed chamber 20 to the gas pressure in the first sealed chamber 10 to be equal to the ratio of the target leakage rates, where the ratio of the target leakage rates is the ratio of the first leakage rate of the first micro-leakage module 40 to the second leakage rate of the second micro-leakage module 50.
[0052] The above process can be derived as follows: The definition of the leakage rate (the leakage rate mentioned above) is: the total differential of the gas quantity with respect to time t, that is: ; During the measurement period, the volume of the system remains unchanged, so the leakage rate is simplified to: , that is: ; where Q is the leakage rate, P is the gas pressure, and V is the volume.
[0053] Since the flow rate Q1 of the target gas flowing from the first sealed chamber 10 through the first micro-leakage module 40 to the second sealed chamber 20 is equal to the flow rate Q2 of the target gas flowing from the second sealed chamber 20 through the second micro-leakage module 50 to the third sealed chamber 30, that is: Q1 = Q2; Among them, Q1 is the flow rate of the target gas flowing from the first sealed chamber 10 to the second sealed chamber 20 through the first micro-leakage module 40, and Q2 is the flow rate of the target gas flowing from the second sealed chamber 20 to the third sealed chamber 30 through the second micro-leakage module 50.
[0054] ; ; Among them, is the air pressure of the first sealed chamber, is the air pressure of the second sealed chamber, is the atmospheric pressure of 101325 Pa, is the standard air leakage rate of the second sealed chamber, that is, the first leakage rate corresponding to the first micro-leakage module 40, is the standard air leakage rate of the third sealed chamber, that is, the second leakage rate corresponding to the second micro-leakage module 50. Since , it can be approximately considered that: ; Therefore, it can be known that the ratio of the standard air leakage rate of the second sealed chamber to the standard air leakage rate of the third sealed chamber is equal to the ratio of the air pressure of the second sealed chamber to the air pressure of the first sealed chamber, that is, the ratio of the first leakage rate to the second leakage rate is equal to the ratio of the air pressure of the second sealed chamber to the air pressure of the first sealed chamber. Thus, the flow rate Q1 of the target gas flowing from the first sealed chamber 10 to the second sealed chamber 20 through the first micro-leakage module 40 can be made equal to the flow rate Q2 of the target gas flowing from the second sealed chamber 20 to the third sealed chamber 30 through the second micro-leakage module 50, thereby realizing the three-chamber dynamic balance gas seal.
[0055] Based on the above derivation, since the leakage rates corresponding to the first micro-leakage module 40 and the second micro-leakage module can be determined when the micro-leakage modules are produced, therefore, this solution can adjust the air pressure ratio of the target gas filled into the first sealed chamber 10 and the second sealed chamber 20 according to the ratio of the first leakage rate corresponding to the first micro-leakage module 40 and the second leakage rate corresponding to the second micro-leakage module 50, so that the air pressure ratio of the target gas filled into the first sealed chamber 10 and the second sealed chamber 20 approaches the leakage rate ratio of the first leakage rate to the second leakage rate, thereby enabling the flow rate Q1 of the target gas flowing from the first sealed chamber 10 to the second sealed chamber 20 through the first micro-leakage module 40 to be equal to the flow rate Q2 of the target gas flowing from the second sealed chamber 20 to the third sealed chamber 30 through the second micro-leakage module 50.
[0056] In an alternative implementation manner of this embodiment, as a possible implementation manner, the first micro-leakage module 40 and the second micro-leakage module 50 designed in this solution can control the required leakage rate by using porous co-fired ceramic sintering (or glass insulator sintering).
[0057] In an alternative embodiment of the present embodiment, as Figure 2 and Figure 3 shown, the first micro-leakage module 40 designed in this solution may include a first opening 410, a second opening 420, and a plurality of first micro-leakage channels 430 connecting the first opening 410 and the second opening 420. Among them, the first opening 410 is located in the first sealed chamber 10, and the second opening 420 is located in the second sealed chamber 20.
[0058] Similarly, the second micro-leakage module 50 designed in this solution may include a third opening 510, a fourth opening 520, and a plurality of second micro-leakage channels 530 connecting the third opening 510 and the fourth opening 520. Among them, the third opening 510 is located in the second sealed chamber 20, and the fourth opening 520 is located in the third sealed chamber 30.
[0059] For the first micro-leakage module 40 designed as above, the target gas precipitated in the first sealed chamber 10 can enter the plurality of first micro-leakage channels 430 through the first opening 410, and then slowly and slightly leak to the second opening 420 through the plurality of first micro-leakage channels 430, so as to flow into the second sealed chamber 20. Similarly, for the second micro-leakage module 50, the target gas precipitated in the second sealed chamber 20 can enter the plurality of second micro-leakage channels 530 through the third opening 510, and then slowly and slightly leak to the fourth opening 520 through the plurality of second micro-leakage channels 530, so as to flow into the third sealed chamber 30.
[0060] As a specific embodiment, the first micro-leakage module 40 and the second micro-leakage module 50 designed in this solution may be integrally formed. Specifically, the first micro-leakage module 40 and the second micro-leakage module 50 of this solution are formed by bonding a first silicon wafer Si1 and a second silicon wafer Si2. Among them, the first opening 410 and the fourth opening 520 are formed on the first silicon wafer Si1, the second opening 420 and the third opening 510 are formed on the second silicon wafer Si2, the first micro-leakage channels 430 and the second micro-leakage channels 530 are formed between the first silicon wafer Si1 and the second silicon wafer Si2, and the first silicon wafer Si1 and the second silicon wafer Si2 can be bonded together by means of gold-gold thermocompression bonding.
[0061] Specifically, the fabrication method of the integrally formed first micro-leakage module 40 and second micro-leakage module 50 designed above is as follows: First, apply photoresist to the first silicon wafer Si1. After lithography, leave the positions of the first micro-leakage channel 430, the second micro-leakage channel 530, the first opening 410, the second opening 420, the third opening 510, and the fourth opening 520, and the rest is protected by photoresist. Then, use dry etching to etch the first micro-leakage channel 430 and the second micro-leakage channel 530, and etch the first opening 410, the second opening 420, the third opening 510, and the fourth opening 520 to the required depth of the micro-leakage channel, and remove the photoresist; then reapply photoresist to the first silicon wafer Si1. After lithography, leave the positions of the first opening 410 and the fourth opening 520, and the rest is protected by photoresist. Use dry etching to etch the first opening 410 and the fourth opening 520 until the first opening 410 and the fourth opening 520 are etched through, and remove the photoresist; apply photoresist to the silicon wafer Si2. After lithography, leave the positions of the second opening 420 and the third opening 510, and use dry etching to etch the second opening 420 and the third opening 510 until the second opening 420 and the third opening 510 are etched through, and remove the photoresist; sputter titanium tungsten with a thickness of 50 nm on the front and back of the first silicon wafer Si1 and the second silicon wafer Si2 by magnetron sputtering, and then electroplate gold with a thickness of 3 um; finally, after sputtering, align the first opening 410 and the fourth opening 520 in the first silicon wafer Si1 and the second silicon wafer Si2, and bond the two silicon wafers together by gold-gold thermocompression bonding.
[0062] In the above embodiment, in this solution, the micro-leakage channel structure of the micro-leakage module is constructed through lithography technology and the multi-layer bonding technology of silicon wafers, so that the leakage rate of the micro-leakage module can be accurately controlled, and the leakage rate of the micro-leakage module can achieve nanometer-level accuracy; at the same time, silicon has good chemical inertness to most gases (such as air, nitrogen, oxygen, inert gases, etc.) at room temperature and is not easy to react with gases, ensuring the long-term stability of the leakage rate.
[0063] In an alternative embodiment of this embodiment, based on the first micro-leakage module 40 and the second micro-leakage module 50 designed above, the first leakage rate corresponding to the first micro-leakage module 40 designed in this solution is related to the number of channels and the channel width of the first micro-leakage channel 430, and the second leakage rate corresponding to the second micro-leakage module 50 is related to the number of channels and the channel width of the second micro-leakage channel 530. Furthermore, the number of channels and the channel width of the micro-leakage channel can be accurately adjusted based on the lithography technology and bonding technology of the silicon wafer, so as to achieve precise control of the leakage rate of the micro-leakage module.
[0064] In an alternative embodiment of the present embodiment, as described above in the present solution, an inhalation medium is provided in the third sealed chamber 30. As a possible embodiment, the inhalation medium designed in the present solution may be any one of an evaporable getter, a non-evaporable getter, and a composite getter. Among them, all three types of getters need to be activated at a high temperature in a vacuum environment below 1E-2 Pa. Preferably, the inhalation medium designed in the present solution may adopt a non-evaporable getter, and its inhalation mechanism is mainly surface adsorption and internal diffusion, so as to improve the purity of the vacuum in the third sealed chamber, and further improve the purity of the target gas in the entire gas chamber.
[0065] In an alternative embodiment of the present embodiment, as Figure 4 shown, the third sealed chamber 30 may be disposed in the second sealed chamber 20. In this regard, a limiting groove 210 may be provided in the second sealed chamber 20 designed in the present solution, and the third sealed chamber 30 is disposed in the limiting groove 210.
[0066] Specifically, the gas chamber described above may be packaged in the following manner. First, the inhalation medium 310 is placed in the third sealed chamber 30, and then the third sealed chamber 30 is vacuum-sealed, and the inhalation medium 310 is activated at a high temperature. Among them, a second micro-leakage module 50 is sintered on the cover plate of the third sealed chamber 30, and then the third sealed chamber 30 after the inhalation medium 310 is activated is welded into the limiting groove 210 of the second sealed chamber 20, and then the second sealed chamber 20 is capped and evacuated. Among them, a first micro-leakage module 40 is sintered on the cover plate of the second sealed chamber 20. After filling a first target pressure amount of polar gas molecules into the second sealed chamber 20 through a specific gas filling device, it is sealed. The sealed second sealed chamber 20 is welded into the first sealed chamber 10, the first sealed chamber 10 is capped and evacuated, and a second target pressure amount of polar gas molecules is filled into the first sealed chamber 10 through a specific gas filling device and then sealed, thereby completing the packaging of the gas chamber. Among them, the ratio of the first target pressure amount to the second target pressure amount is equal to the ratio of the leakage rates of the first leakage rate corresponding to the first micro-leakage module 40 to the second leakage rate corresponding to the second micro-leakage module 50.
[0067] In an alternative embodiment of the present embodiment, the present solution verifies the above design through the following simulation calculation process. Specifically: Assume that the standard air leakage rate provided by the third sealed chamber (the second leakage rate of the second micro-leakage module) is: , the vacuum pressure provided by the third sealed chamber is , the standard air leakage rate of the second sealed chamber is , the volume of the second sealed chamber is , the volume of the first sealed chamber is , at this time: ; Among them, the condition for the normal operation of the molecular clock is that the purity of the polar gas molecules in the second sealed chamber exceeds 50%. Assume that the air pressure in the gas chamber is 25 Pa, then the air pressure in the gas source chamber is 10,000 Pa.
[0068] When t = 3.85E8 s, the total air pressure in the second sealed chamber is 46.075 pa, among which the air pressure of polar gas molecules accounts for 23.15 Pa, the impurity gas accounts for 22.925 Pa, and the total amount of gas absorbed by the getter is 5.4 Pa.L.
[0069] On the premise that the getter can meet the gas absorption capacity, the hermetic packaging life of the three-chamber dynamic equilibrium scheme in this case is t = 3.85E8 s (12.2 years).
[0070] If the life is to be more than 12 years, an ideal combination is that the first leakage rate of the first micro-leakage module is controlled at 1E-10 Pa·m 3 / s, the second leakage rate corresponding to the second micro-leakage module is 4E-8 Pa·m 3 / s, and the total gas absorption capacity of the getter needs to be greater than 5.4 Pa.L. From this, it can be seen that when controlling the air pressure ratio of the second sealed chamber to the first sealed chamber to be equivalent to the ratio of the first leakage rate to the second leakage rate, the life of the molecular clock can be significantly improved. Among them, 4E-8 Pa·m3 / s means that under standard conditions (usually room temperature, one atmosphere), the product of the volume and pressure of the gas leaking through the leak hole per second in the standard state is 4×10 −8 Pascal·cubic meter; 1E-10 Pa·m 3 / s means that under standard conditions (usually room temperature, one atmosphere), the product of the volume and pressure of the gas leaking through the leak hole per second in the standard state is 1×10 −10 Pascal·cubic meter.
[0071] Of course, in addition to being 1E-10 Pa·m 3 / s, the first leakage rate of the first micro-leakage module designed in this scheme can also be other leakage rate values. Similarly, in addition to being 4E-8 Pa·m 3 / s, the second leakage rate corresponding to the second micro-leakage module can also be other leakage rate values. The specific leakage rate values can be adaptively adjusted according to the actual application requirements. The first leakage rate of the first micro-leakage module can be in the range of [1E-9 Pa·m 3 / s ~ 1E-13 Pa·m 3 / s], and the second leakage rate corresponding to the second micro-leakage module can be in the range of [1E-7 Pa·m 3 / s ~ 1E-11 Pa·m 3The range of [ / s]. It is sufficient that the ratio of the first leakage rate of the first micro-leakage module to the corresponding second leakage rate of the second micro-leakage module is equal to the ratio of the air pressure in the second sealed chamber to the air pressure in the first sealed chamber.
[0072] The present application also provides a molecular clock, as Figure 5 shown, the molecular clock 2 includes the air chamber 1 of any of the optional embodiments described above.
[0073] The present application also provides an air chamber balancing method, which is applied to the air chamber described in any of the above optional embodiments, as Figure 6 shown, the air chamber balancing method can be implemented in the following manner, including: Step S600: Obtain the first leakage rate corresponding to the first micro-leakage module and the second leakage rate corresponding to the second micro-leakage module.
[0074] Step S610: According to the first leakage rate and the second leakage rate, control the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber to be equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber.
[0075] In the above embodiment, the leakage rate of the micro-leakage module described above can be determined when the micro-leakage module is produced. Therefore, the first leakage rate corresponding to the first micro-leakage module and the second leakage rate corresponding to the second micro-leakage module can be obtained through the manufacturer's parameters. When the first leakage rate corresponding to the first micro-leakage module and the second leakage rate corresponding to the second micro-leakage module are known, the present solution can control the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber to be equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber according to the first leakage rate and the second leakage rate.
[0076] Specifically, as a possible implementation manner, the present solution can first calculate the leakage rate ratio of the first leakage rate to the second leakage rate; then, when encapsulating the air chamber, control the charging amount of the target gas in the second sealed chamber and the first sealed chamber until the air pressure ratio of the second sealed chamber to the first sealed chamber is equal to the leakage rate ratio, and then stop charging. Among them, the charging of the target gas can be carried out by a special charging device for polar gases, and the charging amount of the target gas in the second sealed chamber and the first sealed chamber can be detected by a gas pressure detection device. When the air pressure ratio of the second sealed chamber to the first sealed chamber is equal to the leakage rate ratio, stop charging the polar gas, so as to achieve that the air pressure ratio of the second sealed chamber to the first sealed chamber is equal to the leakage rate ratio, and further make the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber.
[0077] For the gas chamber balance method of the above design, in this solution, a first micro-leakage module is provided between the first sealed chamber (gas source chamber) and the second sealed chamber (gas chamber), and a second micro-leakage module is provided between the second sealed chamber (gas chamber) and the third sealed chamber (getter chamber). Then, the flow rate of the target gas released from the first sealed chamber flowing through the first micro-leakage module to the second sealed chamber is controlled to be equal to the flow rate of the target gas released from the second sealed chamber flowing through the second micro-leakage module to the third sealed chamber, so that the purity and gas pressure of the target gas in the second sealed chamber are basically maintained unchanged, realizing a three-chamber dynamic balance gas seal packaging, thereby solving the problem of the influence of the target gas precipitated or absorbed by the material of the second sealed chamber on the gas molecule purity and gas pressure of the second sealed chamber, and further stabilizing the performance of the molecular clock and providing its long-term stability.
[0078] The present application also provides a gas chamber packaging method, which is applied to the gas chamber described above. The gas chamber packaging method includes: First, put the getter medium into the third sealed chamber, then perform vacuum sealing on the third sealed chamber and activate the getter medium at high temperature. Among them, a second micro-leakage module is sintered on the cover plate of the third sealed chamber. Then, weld the third sealed chamber after activating the getter medium into the limiting groove of the second sealed chamber. Then, cover and evacuate the second sealed chamber. Among them, a first micro-leakage module is sintered on the cover plate of the second sealed chamber. After filling the second sealed chamber with a first target pressure amount of polar gas molecules through a specific gas filling device, seal it. Weld the sealed second sealed chamber into the first sealed chamber, cover and evacuate the first sealed chamber, and fill the first sealed chamber with a second target pressure amount of polar gas molecules through a specific gas filling device and then seal it, thereby completing the packaging of the gas chamber. Among them, the ratio of the first target pressure amount to the second target pressure amount is equal to the ratio of the leakage rates of the first leakage rate corresponding to the first micro-leakage module to the second leakage rate corresponding to the second micro-leakage module.
[0079] According to some embodiments of the present application, as Figure 7 shown, the present application provides an electronic device 7, including: a processor 701 and a memory 702. The processor 701 and the memory 702 are interconnected and communicate with each other through a communication bus 703 and / or other forms of connection mechanisms (not marked). The memory 702 stores a computer program executable by the processor 701. When the computing device runs, the processor 701 executes the computer program to execute the method of any optional implementation manner, such as steps S600 to S610: obtaining the first leakage rate corresponding to the first micro-leakage module and the second leakage rate corresponding to the second micro-leakage module; according to the first leakage rate and the second leakage rate, controlling the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber to be equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber.
[0080] The present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is run by a processor, it executes the method in any of the foregoing optional implementation manners.
[0081] Among them, the storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM for short), electrically erasable programmable read-only memory (EEPROM for short), erasable programmable read-only memory (EPROM for short), programmable read-only memory (PROM for short), read-only memory (ROM for short), magnetic memory, flash memory, a magnetic disk or an optical disc.
[0082] The present application provides a computer program product. When the computer program product runs on a computer, it causes the computer to execute the method in any of the optional implementation manners.
[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be covered by the scope of the claims and the description of the present application. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions that fall within the scope of the claims.
Claims
1. A gas chamber, characterized in that, The gas chamber comprises: a first sealed chamber, a second sealed chamber and a third sealed chamber; wherein the first sealed chamber and the second sealed chamber are configured to contain target gas, and an air-intake medium is provided in the third sealed chamber; The second sealed chamber is arranged in the first sealed chamber; a first micro-leakage module is arranged on the second sealed chamber, and the first micro-leakage module connects the first sealed chamber and the second sealed chamber; The third sealed chamber is arranged in the second sealed chamber; a second micro-leakage module is arranged on the third sealed chamber, and the second micro-leakage module connects the second sealed chamber and the third sealed chamber; wherein the air-absorbing medium is used to absorb the target gas in the third sealed chamber; The flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber is equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber.
2. The air chamber according to claim 1, characterized in that, in, The ratio of the air pressure of the second sealed chamber to the air pressure of the first sealed chamber is equal to the target leakage rate ratio; the target leakage rate ratio is the ratio of the first leakage rate of the first micro leakage module to the second leakage rate of the second micro leakage module.
3. The air chamber according to claim 1, characterized in that, The first micro-leakage module comprises a first opening, a second opening, and a plurality of first micro-leakage channels connecting the first opening and the second opening; wherein the first opening is located in the first sealed chamber, and the second opening is located in the second sealed chamber; The second micro-leakage module includes a third opening, a fourth opening, and a plurality of second micro-leakage channels connecting the third opening and the fourth opening; wherein the third opening is located in the second sealed chamber, and the fourth opening is located in the third sealed chamber.
4. The air chamber according to claim 3, characterized in that, The first micro-leak module and the second micro-leak module are formed by bonding a first silicon wafer to a second silicon wafer; The first opening and the fourth opening are opened on the first silicon wafer, the second opening and the third opening are opened on the second silicon wafer, and the first micro-leakage channel and the second micro-leakage channel are opened between the first silicon wafer and the second silicon wafer.
5. The air chamber according to claim 3, characterized in that, The first leakage rate of the first micro leakage module is related to the number of channels and the channel width, depth and length of the first micro leakage channel, and the second leakage rate of the second micro leakage module is related to the number of channels and the channel width, depth and length of the second micro leakage channel.
6. The air chamber according to claim 1, characterized in that, The getter medium is any one of an evaporable getter, a non-evaporable getter, and a composite getter.
7. The air chamber according to claim 1, wherein A limiting groove is arranged in the second sealing chamber, and the third sealing chamber is arranged in the limiting groove.
8. A molecular clock, characterized in that, The molecular clock comprises the gas cell of any one of claims 1-7.
9. A chamber balance method, characterized in that, The method is applied to an air chamber, and the air chamber includes a first sealed chamber, a second sealed chamber, and a third sealed chamber; wherein, the first sealed chamber and the second sealed chamber are configured to accommodate a target gas, and an inhalation medium is provided in the third sealed chamber; the second sealed chamber is disposed in the first sealed chamber; a first micro-leakage module is provided on the second sealed chamber, and the first micro-leakage module communicates the first sealed chamber with the second sealed chamber; the third sealed chamber is disposed in the second sealed chamber; a second micro-leakage module is provided on the third sealed chamber, and the second micro-leakage module communicates the second sealed chamber with the third sealed chamber; wherein, the inhalation medium is used to absorb the target gas in the third sealed chamber: The method includes: Obtaining a first leakage rate corresponding to the first micro-leakage module and a second leakage rate corresponding to the second micro-leakage module; According to the first leakage rate and the second leakage rate, controlling the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber to be equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber.
10. The method according to claim 9, characterized in that, The step of controlling the flow rate of the target gas flowing from the first sealed chamber to the second sealed chamber to be equal to the flow rate of the target gas flowing from the second sealed chamber to the third sealed chamber according to the first leakage rate and the second leakage rate includes: Calculating a leakage rate ratio of the first leakage rate to the second leakage rate; Controlling the charging amount of the target gas in the second sealed chamber and the first sealed chamber until the pressure ratio of the second sealed chamber to the first sealed chamber is equal to the leakage rate ratio, and then stopping the charging.
Citation Information
Patent Citations
Molecular flow standard leak hole and manufacturing method thereof
CN105738038A
Measuring device and method for vacuum sealing performance
CN106226000A
Nitrogen and hydrogen mixed gas vacuum leak hole calibration device and method
CN109752139A
Preparation method of alkali metal atom micro air chamber based on MEMS process
CN110759314A
Method and system for detecting leakage rate of atomic gas chamber
CN112378603A