Temperature control method and device, electronic equipment and storage medium

Abstract

The invention provides a temperature control method and device, electronic equipment and a storage medium, and the method comprises the steps: responding to a system-on-chip (SOC) of the electronic equipment in a low-power-consumption mode, monitoring whether a first temperature value of a first sensor arranged outside the SOC is obtained or not, responding to the obtained first temperature value of the first sensor, and according to the first temperature value, controlling the temperature of the first sensor according to the obtained first temperature value. According to the method, the first target temperature value of the SOC is determined, the temperature of the SOC is controlled according to the first target temperature value, and under the condition that the SOC of the electronic equipment is in the low-power-consumption mode, the temperature value is obtained through the sensor outside the SOC to control the temperature of the SOC, so that stable operation of the SOC in the low-power-consumption mode is ensured, and power consumption is reduced.

Description

Technical Field

[0001] This application relates to the technical field of temperature control, and particularly relates to a temperature control method, device, electronic device, and storage medium. Background Art

[0002] When an electronic device is in a low-temperature environment, it often faces a series of challenges. Low temperature will affect the performance and stability of the system on chip (SOC). Therefore, temperature control has always been a very important consideration in the field of SOC technology.

[0003] When the electronic device is in the low-power mode and also in a low-temperature environment, it is necessary to detect the temperature value of the electronic device to determine whether the electronic device is in a low-temperature environment in order to execute the temperature control strategy. However, frequent temperature detection will cause the SOC to be unable to enter the low-power mode, increase power consumption, and shorten the battery life. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems in the related art to some extent.

[0005] To this end, this application proposes a temperature control method, device, electronic device, and storage medium. When the system on chip (SOC) of the electronic device is in the low-power mode, the temperature value is obtained through a sensor outside the SOC to control the temperature of the SOC, ensuring the stable operation of the SOC in the low-power mode and reducing power consumption.

[0006] An embodiment of one aspect of this application proposes a temperature control method, including:

[0007] In response to the system on chip (SOC) of the electronic device being in the low-power mode, monitoring whether the first temperature value of the first sensor set outside the SOC is obtained;

[0008] In response to obtaining the first temperature value of the first sensor, determining the first target temperature value of the SOC according to the first temperature value;

[0009] Performing temperature control on the SOC according to the first target temperature value.

[0010] An embodiment of another aspect of this application proposes a temperature control device, including:

[0011] A monitoring module, configured to monitor whether the first temperature value of the first sensor set outside the SOC is obtained in response to the system on chip (SOC) of the electronic device being in the low-power mode;

[0012] A determining module, configured to determine the first target temperature value of the SOC according to the first temperature value in response to obtaining the first temperature value of the first sensor;

[0013] A control module, configured to perform temperature control on the SOC according to the first target temperature value.

[0014] Another embodiment of this application provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the program, the method described in the foregoing aspect is implemented.

[0015] Another embodiment of this application provides a non-transitory computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the method described in the foregoing aspect is implemented.

[0016] Another embodiment of this application provides a computer program product, on which a computer program is stored. When the program is executed by a processor, the method described in the foregoing aspect is implemented.

[0017] For the temperature control method, device, electronic device, and storage medium provided by this application, in response to the system on chip (SOC) of the electronic device being in a low-power mode, it monitors whether the first temperature value of the first sensor set outside the SOC is obtained. In response to obtaining the first temperature value of the first sensor, according to the first temperature value, the first target temperature value of the SOC is determined, and according to the first target temperature value, temperature control is performed on the SOC. When the system on chip (SOC) of the electronic device is in a low-power mode, the temperature value is obtained through the sensor outside the SOC to perform temperature control on the SOC, ensuring the stable operation of the SOC in the low-power mode and reducing power consumption.

[0018] Additional aspects and advantages of this application will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of this application. Description of the Drawings

[0019] The above-mentioned and / or additional aspects and advantages of this application will become apparent and easy to understand from the following description of the embodiments in conjunction with the drawings, where:

[0020] Figure 1 is a schematic flowchart of a temperature control method provided by an embodiment of this application;

[0021] Figure 2 is a schematic diagram of the structure of a mobile phone provided by an embodiment of this application;

[0022] Figure 3 is a schematic diagram of the structure of an electronic device provided by an embodiment of this application;

[0023] Figure 4 is a schematic flowchart of another temperature control method provided by an embodiment of this application;

[0024] Figure 5 The structural schematic diagram of a temperature control device provided by an embodiment of the present application;

[0025] Figure 6 The structural schematic diagram of an electronic device provided by an embodiment of the present application. Detailed implementation manners

[0026] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as a limitation to the present application.

[0027] The temperature control method, device, electronic device, and storage medium according to the embodiments of the present application will be described below with reference to the accompanying drawings.

[0028] Figure 1 The flowchart of a temperature control method provided by an embodiment of the present application.

[0029] In the embodiments of the present application, it is exemplified that the temperature control method is configured in a temperature control device, and the temperature control device can be applied to any electronic device so that the electronic device can perform the temperature control function.

[0030] Among them, the electronic device can be any device with computing capabilities. For example, it can be a mobile terminal. The mobile terminal can be, for example, a mobile phone, a tablet computer, a personal digital assistant, a wearable device, and other hardware devices with various operating systems, touch screens, and / or display screens.

[0031] As Figure 1 shown, the method may include the following steps:

[0032] Step 101, in response to the system-on-chip (SOC) of the electronic device being in the low-power mode, monitor whether the first temperature value of the first sensor disposed outside the SOC is obtained.

[0033] Among them, the electronic device includes multiple sensors, including sensors disposed outside the system-on-chip, also known as System-on-a-Chip (SOC), and temperature sensors disposed inside the SOC. For the sake of distinction, the sensors disposed outside the SOC are referred to as the first sensors, and the temperature sensors disposed inside the SOC are referred to as the second sensors. As an example, Figure 2 The structural schematic diagram of a mobile phone provided by an embodiment of the present application, as Figure 2As shown, the mobile phone includes an SOC processor, a first sensor disposed outside the SOC, also known as a peripheral sensor, and a second sensor disposed inside the SOC, also known as a Tsensor.

[0034] In the embodiments of the present application, when the electronic device enters the standby state, the SOC will enter the low-power mode. In the low-power mode, a subsystem in the SOC will be retained to interact with external components. Other subsystems in the SOC and the internally installed temperature sensor will be powered down and enter the sleep state and cannot work to reduce power consumption. Therefore, the subsystem in the SOC that is not powered down executes the temperature control method of the present application. As an example, Figure 3 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As Figure 3 shown, the subsystem in the SOC that is not powered down is identified as Subsystem A, the Tsensor is the temperature sensor inside the SOC, that is, the second sensor, and the peripheral sensor is the first sensor disposed outside the SOC. When the SOC is in the low-power mode, the Tsensor will be powered down and cannot collect the temperature data of the SOC.

[0035] In the related art, when the SOC is in the low-power mode, in order to avoid the influence of low temperature on the performance of the SOC, the SOC will frequently wake up the second sensor inside for temperature measurement. However, the frequent wake-up of the second sensor makes the SOC unable to enter the low-power mode, increasing power consumption. To solve the problem of excessive power consumption in the standby mode, the temperature value obtained in the embodiments of the present application is the temperature value stored inside the first sensor outside the SOC, and there is no need to wake up the second sensor inside the SOC to collect the temperature value. This is because when the SOC is in the low-power mode, the first sensor outside the SOC is usually in the working mode to interact with the user. As an example, in one scenario, the first sensor is an accelerometer, a gyroscope, a light sensor, etc. The first sensor will be calibrated by the ambient temperature sensor as needed, so that the first sensor stores temperature data; in another scenario, the first sensor is an ambient temperature sensor, and the ambient temperature sensor will collect ambient temperature data as needed. Therefore, Subsystem A in the SOC can obtain the current temperature data from the first sensor. As an example, the electronic device is a mobile phone. When the mobile phone is in the standby state, the accelerometer and gyroscope in the mobile phone are still in the working state, such as for the step counting function. The processor in the mobile phone will obtain relevant data from the accelerometer and gyroscope according to a set time length, such as 50 milliseconds, to implement the step counting function. At the same time, the ambient temperature sensor data can be obtained, which can be used for the temperature calibration of the accelerometer and gyroscope, and the temperature information can also be used for temperature recognition.

[0036] It should be noted that in the standby mode, the second sensor is powered off and does not work, while the first sensor is different sensors in different service scenarios. In one scenario, when the motion recording service of the electronic device is being executed and the step counting function is enabled, the first sensor is the accelerometer and the gyroscope. In another scenario, when the electronic device starts an application for temperature detection, the first sensor is the ambient temperature sensor. That is to say, the specific sensors corresponding to the first sensor are different in different service scenarios, and they are not listed one by one in this embodiment.

[0037] Step 102: In response to obtaining the first temperature value of the first sensor, determine the first target temperature value of the SOC according to the first temperature value.

[0038] In the embodiment of the present application, the first sensor is usually also in an on state when the SOC is in the standby state, so that the first temperature value of the first sensor can be obtained. The first temperature value is usually the ambient temperature value collected by the ambient temperature sensor. As an implementation manner, the first temperature value is used as the first target temperature value of the SOC, and the first target temperature value is used for low-temperature detection.

[0039] Step 103: Perform temperature control on the SOC according to the first target temperature value.

[0040] In the embodiment of the present application, it is identified whether the SOC is in a low-temperature scenario according to the first target temperature value. If it is in a low-temperature scenario, temperature control needs to be performed. Since the SOC is in a low-power mode and there will not be too much power consumption and heat generation, the first target temperature value is determined based on the ambient temperature detected by the first sensor outside the SOC, which is close to the SOC temperature, and a certain low-temperature margin is set to ensure the timeliness of low-temperature protection. Among them, temperature control means adjusting at least one of the clock frequency and voltage of the SOC. As an implementation manner, the clock frequency of the SOC is reduced; as another implementation manner, the voltage of the SOC is raised. As a third implementation manner, the clock frequency of the SOC is reduced while the voltage of the SOC is raised.

[0041] In the temperature control method of the embodiment of the present application, in response to the system on chip (SOC) of the electronic device being in a low-power mode, it is monitored whether the first temperature value of the first sensor arranged outside the SOC is obtained. In response to obtaining the first temperature value of the first sensor, the first target temperature value of the SOC is determined according to the first temperature value, and temperature control is performed on the SOC according to the first target temperature value. When the system on chip (SOC) of the electronic device is in a low-power mode, the temperature value is obtained through the sensor outside the SOC to perform temperature control on the SOC, ensuring the stable operation of the SOC in the low-power mode and reducing power consumption.

[0042] Based on the above embodiments, Figure 4The flowchart of another temperature control method provided by an embodiment of this application is shown as follows Figure 4 The method includes the following steps:

[0043] Step 401: In response to the system on chip (SOC) of the electronic device being in the low power consumption mode, set the polling period corresponding to the low power consumption mode as the first polling period.

[0044] Among them, the polling period is used for the SOC to obtain the temperature value and perform low temperature judgment and temperature control of the SOC based on the obtained temperature value. In the low power consumption mode, the set first polling period is longer than the second polling period in the non - low power consumption mode. For example, the first polling period is 5 seconds, and the second polling period is 100 milliseconds.

[0045] Step 402: During the target period of the first polling period, monitor whether the first temperature value of the first sensor set outside the SOC is obtained.

[0046] In an embodiment of this application, in the low power consumption mode, the subsystem A that is not powered down in the SOC will monitor whether the first temperature value of the first sensor set outside the SOC is obtained during the target period of the first polling period. This is because in the low power consumption mode, the first sensor needs to keep working, so that the subsystem A can perform data interaction with the first sensor based on the set interaction period to process various user scenarios, and the first temperature value can be obtained during the interaction process. Among them, the interaction period is usually in milliseconds. Therefore, after the first temperature value of the first sensor is obtained, the timer of the first polling period is reset, that is, the timer starts timing again according to the first polling period, without triggering the action of waking up the second sensor Tsensor set inside the SOC, thereby reducing power consumption.

[0047] Step 403: In response to obtaining the first temperature value of the first sensor, obtain the calibration value of the first temperature value.

[0048] In an embodiment of this application, the first calibrated temperature in the first sensor is the ambient temperature, and the second calibrated temperature collected by the second sensor is the internal temperature of the SOC. Therefore, there is a deviation between the temperature in the first sensor and the actual temperature in the SOC. To improve the accuracy of judging whether the SOC is in a low temperature state, the calibration value can be used to calibrate the first temperature value of the first sensor. Among them, the calibration value can be a set temperature value, or can be determined according to the temperature value detected in the usage scenario of the electronic device to increase the accuracy of determining the calibration value.

[0049] Among them, regarding the method for determining the calibration value, as an implementation, the electronic device will not always be in the low-power mode. In response to the SOC being in the non-low-power mode, in the non-low-power mode, the polling period of the SOC will change from the first polling period to the second polling period, where the second polling period is less than the first polling period. During the target period of the second polling period corresponding to the non-low-power mode, the first calibration temperature collected by the first sensor and the second calibration temperature collected by the second sensor set inside the SOC are synchronously obtained. According to the difference between the first calibration temperature and the second calibration temperature, the calibration value is determined. Among them, the first calibration temperature in the first sensor is the ambient temperature, and the second calibration temperature collected by the second sensor is the internal temperature of the SOC. This calibration value indicates the difference between the ambient temperature and the internal temperature of the SOC.

[0050] Step 404: Calibrate the first temperature value using the calibration value, and use the calibrated first temperature value as the first target temperature value and use the second temperature value as the first target temperature value.

[0051] In the embodiments of the present application, based on the calibration value, the first temperature value collected by the first sensor in the low-power mode can be calibrated to obtain the first target temperature value, which is used as the temperature value inside the SOC, improving the accuracy of determining the internal temperature of the SOC.

[0052] For example, if the first calibration temperature is 7 degrees Celsius and the second calibration temperature is 4 degrees Celsius, then the calibration value is 3 degrees Celsius. In the low-temperature mode, if the temperature collected by the first sensor is 8 degrees Celsius, then subtract the calibration value of 3 degrees Celsius from 8 degrees Celsius to obtain the calibrated first target temperature value of 5 degrees Celsius.

[0053] Step 405: In response to not obtaining the first temperature value of the first sensor during the target period of the first polling period, wake up the second sensor set inside the SOC, and control the second sensor to collect the second temperature value of the SOC.

[0054] Step 406: Use the second temperature value as the first target temperature value.

[0055] In the embodiments of the present application, if the first temperature value of the first sensor is still not obtained during the target period of the first polling period, it may be that the first sensor is turned off and unable to obtain temperature information. Then, it is necessary to wake up the second sensor set inside the SOC, that is, Tsensor, control the second sensor to collect the temperature value of the SOC to obtain the second temperature value, and use the second temperature value as the first target temperature value.

[0056] It should be understood that in the low-power mode, the polling period is set to the first polling period, and the first polling period is greater than the second polling period, which can ensure that in the low-power mode, the frequency of waking up the second sensor is reduced, and the power consumption in the low-power scenario can also be reduced. In the non-low-power mode, since the power consumption does not need to be considered, a shorter second polling period can be selected to increase the frequency of obtaining the temperature value from the second sensor, thereby improving the accuracy of judging whether the SOC is in a low-temperature state. By dynamically adjusting the polling period, the power consumption during the operation of the SOC is further saved.

[0057] Step 407, perform temperature control on the SOC according to the first target temperature value.

[0058] In an implementation manner of the embodiment of the present application, the first target temperature value is compared with the first temperature threshold. In response to the first target temperature value being less than the first temperature threshold, it is determined that the SOC enters the low-temperature state, and then the clock frequency of the SOC is adjusted to the first frequency value and / or the voltage is adjusted to the first voltage value.

[0059] Further, continue to obtain the second target temperature value of the target sensor, and compare the second target temperature value with the second temperature threshold. In response to the second target temperature value being greater than the second temperature threshold, it is determined that the SOC exits the low-temperature state, and the first frequency value of the clock frequency of the SOC is adjusted to the second frequency value and / or the voltage is adjusted from the first voltage value to the second voltage value.

[0060] It should be noted that in order to prevent the problem of temperature detection lag, a certain margin is set for the low-temperature threshold, that is, the first temperature threshold is less than the second temperature threshold. As an example, the first temperature threshold is 5 degrees Celsius, and the second temperature threshold is 10 degrees Celsius. That is to say, when the temperature is lower than the first temperature threshold, it is determined that the SOC enters the low-temperature state, that is, the clock frequency of the SOC is adjusted to the first frequency value and / or the voltage is adjusted to the first voltage value. At the same time, in order to prevent the temperature value from jittering, the second temperature threshold for determining that the SOC exits the low-temperature state is larger than the first temperature threshold. That is, when it is detected that the temperature is greater than the second temperature threshold, it is determined that the SOC exits the low-temperature protection, that is, exits the low-temperature state, and the clock frequency and / or voltage of the SOC are readjusted again to meet the requirements of different scenarios.

[0061] Among them, the target sensor includes a first sensor or a second sensor. Specifically, in one scenario, the target sensor includes the first sensor. For example, the first polling period is 5 seconds. That is to say, when the SOC is in the low-power mode, the second temperature value of the first sensor set outside the SOC is obtained within a 5-second period, and the second target temperature value is determined based on the second temperature value. Among them, the method for determining the second target temperature value based on the second temperature value and performing temperature control on the SOC based on the second target temperature value can refer to the relevant explanations of the first target temperature value in the foregoing embodiments. The principle is the same and will not be elaborated here.

[0062] In another scenario, for example, the first polling period is 5 seconds, and the target sensor includes the second sensor. That is to say, when the SOC is in the low-power mode, within a 5-second period, the first sensor set outside the SOC cannot obtain the temperature value. Then, at the end of the 5-second duration, the second sensor set inside the SOC is awakened, and the temperature inside the SOC is collected by the second sensor as the second target temperature. Among them, the method for performing temperature control on the SOC based on the second target temperature value can refer to the relevant explanations in the foregoing embodiments. The principle is the same and will not be elaborated here.

[0063] Among them, the adjustment of the clock frequency and / or voltage can refer to the relevant explanations in the foregoing embodiments. The principle is the same and will not be elaborated here.

[0064] In the temperature control method of the embodiment of the present application, in the low-power scenario, that is, the standby scenario, the SOC can be made to enter the low-power mode, and the second sensor Tsensor can be turned off to reduce power consumption. In order to continue monitoring the current temperature, an ambient temperature sensor is integrated in the peripheral sensors in hardware. The first sensor in the periphery can be used to determine whether the current temperature is lower than a certain temperature threshold, so as to determine whether the SOC is in a low-temperature state. If it is in a low-temperature state, the clock frequency and / or voltage of the SOC are adjusted. If the temperature returns to normal, the clock frequency and / or voltage of the SOC are restored. In this way, while ensuring the stable operation of the SOC, the power consumption of the SOC can be saved as much as possible, the standby time of the mobile terminal device can be extended, and the battery life can be increased, thereby improving the user experience.

[0065] To implement the above embodiments, the embodiment of the present application also proposes a temperature control device.

[0066] Figure 5 It is a schematic structural diagram of a temperature control device provided by an embodiment of the present application.

[0067] As Figure 5 shown, the device may include:

[0068] The monitoring module 51 is configured to monitor whether a first temperature value of a first sensor disposed outside the SOC is obtained in response to the system on chip (SOC) of the electronic device being in a low power consumption mode.

[0069] The determination module 52 is configured to determine a first target temperature value of the SOC according to the first temperature value in response to obtaining the first temperature value of the first sensor.

[0070] The control module 53 is configured to perform temperature control on the SOC according to the first target temperature value.

[0071] Furthermore, in an implementation manner of the embodiment of the present application, the monitoring module 51 is further configured to:

[0072] Set a polling period corresponding to the low power consumption mode as a first polling period;

[0073] Monitor whether a first temperature value of a first sensor disposed outside the SOC is obtained within a target period of the first polling period.

[0074] In an implementation manner of the embodiment of the present application, the determination module 52 is further configured to:

[0075] Obtain a calibration value; calibrate the first temperature value by using the calibration value, and use the calibrated first temperature value as the first target temperature value.

[0076] In an implementation manner of the embodiment of the present application, the determination module 52 is further configured to:

[0077] In response to the SOC being in a non - low power consumption mode, within a target period of a second polling period corresponding to the non - low power consumption mode, obtain a first calibrated temperature collected by the first sensor and a second calibrated temperature collected by a second sensor disposed inside the SOC; wherein, the second polling period is less than the first polling period;

[0078] Determine the calibration value according to a difference between the first calibrated temperature and the second calibrated temperature.

[0079] In an implementation manner of the embodiment of the present application, the determination module 52 is further configured to:

[0080] In response to the first temperature value of the first sensor not being obtained within the target period of the first polling period, wake up the second sensor disposed inside the SOC, and control the second sensor to collect a second temperature value of the SOC;

[0081] Use the second temperature value as the first target temperature value.

[0082] In an implementation manner of the embodiment of the present application, the control module 53 is further configured to:

[0083] Compare the first target temperature value with the first temperature threshold;

[0084] In response to the first target temperature value being less than the first temperature threshold, it is determined that the SOC enters the low-temperature state, and then the clock frequency of the SOC is adjusted to the first frequency value and / or the voltage is adjusted to the first voltage value.

[0085] In an implementation manner of the embodiment of the present application, the control module 53 is further configured to:

[0086] Obtain the second target temperature value of the target sensor, and compare the second target temperature value with the second temperature threshold; wherein, the target sensor includes the first sensor or the second sensor;

[0087] In response to the second target temperature value being greater than the second temperature threshold, it is determined that the SOC exits the low-temperature state, and then the first frequency value of the clock frequency of the SOC is adjusted to the second frequency value and / or the voltage is adjusted from the first voltage value to the second voltage value.

[0088] It should be noted that the foregoing explanations of the method embodiments also apply to the devices of this embodiment, and will not be elaborated here.

[0089] In the temperature control device proposed by the present application, in response to the system on chip (SOC) of the electronic device being in the low-power mode, it monitors whether the first temperature value of the first sensor set outside the SOC is obtained. In response to obtaining the first temperature value of the first sensor, according to the first temperature value, the first target temperature value of the SOC is determined, and according to the first target temperature value, temperature control is performed on the SOC. When the system on chip (SOC) of the electronic device is in the low-power mode, the temperature value is obtained through the sensor outside the SOC to perform temperature control on the SOC, ensuring the stable operation of the SOC in the low-power mode and reducing power consumption.

[0090] To implement the above embodiment, the present application also proposes an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the program, the method described in the foregoing method embodiment is implemented.

[0091] To implement the above embodiment, the present application also proposes a non-transitory computer-readable storage medium, on which a computer program is stored. When the program is executed by a processor, the method described in the foregoing method embodiment is implemented.

[0092] To implement the above embodiments, the present application also provides a computer program product, on which a computer program is stored. When the computer program is executed by a processor, the method described in the foregoing method embodiments is implemented.

[0093] Figure 6 FIG. 4 is a block diagram of an electronic device provided in an embodiment of the present application. For example, the electronic device 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0094] Referring to Figure 6 , the electronic device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0095] The processing component 802 generally controls the overall operation of the electronic device 800, such as operations associated with display, telephone calls, data communication, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above method. In addition, the processing component 802 may include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0096] The memory 804 is configured to store various types of data to support the operation of the electronic device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 may be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, a magnetic disk, or an optical disk.

[0097] The power component 806 provides power to various components of the electronic device 800. The power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 800.

[0098] The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors can sense not only the boundaries of touch or swipe actions but also detect the duration and pressure associated with the touch or swipe operations. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the electronic device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each of the front camera and the rear camera can be a fixed optical lens system or have a focal length and optical zoom capabilities.

[0099] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC) that is configured to receive external audio signals when the electronic device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals can be further stored in the memory 804 or transmitted via the communication component 816. In some embodiments, the audio component 810 further includes a speaker for outputting audio signals.

[0100] The I / O interface 812 provides an interface between the processing component 802 and a peripheral interface module, and the peripheral interface module can be a keyboard, a click wheel, buttons, etc. These buttons can include but are not limited to: a home button, a volume button, a power button, and a lock button.

[0101] The sensor component 814 includes one or more sensors for providing an assessment of the status of various aspects of the electronic device 800. For example, the sensor component 814 can detect the on / off state of the electronic device 800, the relative positioning of components, such as the display and the keypad of the electronic device 800. The sensor component 814 can also detect a change in the position of the electronic device 800 or a component of the electronic device 800, the presence or absence of user contact with the electronic device 800, the orientation or acceleration / deceleration of the electronic device 800, and the temperature change of the electronic device 800. The sensor component 814 can include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor component 814 can also include a light sensor, such as a CMOS or a CCD image sensor, for use in imaging applications. In some embodiments, the sensor component 814 can further include an acceleration sensor, a gyro sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0102] The communication component 816 is configured to facilitate communication between the electronic device 800 and other devices in a wired or wireless manner. The electronic device 800 can access a communication standard-based wireless network, such as WiFi, 4G, or 5G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on Radio Frequency Identification (RFID) technology, Infrared Data Association (IrDA) technology, Ultra-Wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0103] In an exemplary embodiment, the electronic device 800 can be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components for performing the above method.

[0104] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, and the above instructions can be executed by a processor 820 of the electronic device 800 to complete the above method. For example, the non-transitory computer-readable storage medium can be a ROM, Random Access Memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0105] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0106] Furthermore, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0107] Any process or method description represented in a flowchart or otherwise described herein can be understood to represent a module, segment, or portion of code including one or more executable instructions for implementing a customized logic function or process. The scope of the preferred embodiments of the present application includes additional implementations, where functions may be performed in a substantially simultaneous manner or in a reverse order according to the functions involved, rather than in the order shown or discussed, which should be understood by those skilled in the art to which the embodiments of the present application pertain.

[0108] The logic and / or steps represented in a flowchart or otherwise described herein, for example, can be considered a sequenced list of executable instructions for implementing a logical function, and can be embodied specifically in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of the computer-readable medium include the following: an electrical connection portion having one or more wirings (electronic device), a portable computer diskette (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable medium on which the program can be printed, as the program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpretation, or other appropriate processing as necessary, and then stored in a computer memory.

[0109] It should be understood that various parts of the present application can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), and the like.

[0110] Those of ordinary skill in the art can understand that all or part of the steps carried out in the method of the above embodiments can be completed by instructing relevant hardware through a program. The program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0111] In addition, each functional unit in the various embodiments of the present application can be integrated into a processing module, or each unit can exist physically alone, or two or more units can be integrated into one module. The above integrated module can be implemented in the form of hardware or in the form of a software functional module. When the above integrated module is implemented in the form of a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0112] The above-mentioned storage medium can be a read-only memory, a magnetic disk or an optical disc, etc. Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present application.

Claims

1. A temperature control method, characterized in that, The method includes: In response to the system on chip (SOC) of an electronic device being in a low power consumption mode, monitoring whether a first temperature value of a first sensor disposed outside the SOC is obtained; In response to obtaining the first temperature value of the first sensor, determining a first target temperature value of the SOC according to the first temperature value; Performing temperature control on the SOC according to the first target temperature value.

2. The method according to claim 1, wherein The monitoring of whether the first temperature value of the first sensor disposed outside the SOC is obtained includes: Setting a polling period corresponding to the low power consumption mode as a first polling period; During a target period of the first polling period, monitoring whether the first temperature value of the first sensor disposed outside the SOC is obtained.

3. The method according to claim 1 or 2, characterized in that The determining of the first target temperature value of the SOC according to the first temperature value includes: Obtaining a calibration value; Calibrating the first temperature value by using the calibration value, and using the calibrated first temperature value as the first target temperature value.

4. The method according to claim 3, wherein The method further includes: In response to the SOC being in a non-low power consumption mode, during a target period of a second polling period corresponding to the non-low power consumption mode, obtaining a first calibrated temperature collected by the first sensor and a second calibrated temperature collected by a second sensor disposed inside the SOC; wherein, the second polling period is less than the first polling period; Determining the calibration value according to a difference between the first calibrated temperature and the second calibrated temperature.

5. The method according to claim 2, characterized in that After the monitoring of whether the first temperature value of the first sensor disposed outside the SOC is obtained, it further includes: In response to the first temperature value of the first sensor not being obtained during the target period of the first polling period, waking up the second sensor disposed inside the SOC and controlling the second sensor to collect a second temperature value of the SOC; Using the second temperature value as the first target temperature value.

6. The method according to claim 1, wherein The performing of temperature control on the SOC according to the first target temperature value includes: Comparing the first target temperature value with a first temperature threshold; In response to the first target temperature value being less than the first temperature threshold, determining that the SOC enters a low temperature state, and then adjusting a clock frequency of the SOC to a first frequency value and / or a voltage to a first voltage value.

7. The method according to claim 6, wherein After the adjusting of the clock frequency of the SOC to the first frequency value and / or the voltage to the first voltage value, it further includes: Obtaining a second target temperature value of a target sensor, and comparing the second target temperature value with a second temperature threshold; wherein, the target sensor includes the first sensor or the second sensor; In response to the second target temperature value being greater than the second temperature threshold, determining that the SOC exits the low temperature state, and then adjusting the first frequency value of the clock frequency of the SOC to a second frequency value and / or adjusting the voltage from the first voltage value to a second voltage value.

8. A temperature control device, characterized in that, The device includes: A monitoring module, configured to monitor whether a first temperature value of a first sensor disposed outside the SOC is obtained in response to the system on chip (SOC) of an electronic device being in a low power consumption mode; A determination module, configured to determine a first target temperature value of the SOC according to the first temperature value in response to obtaining the first temperature value of the first sensor; A control module, configured to perform temperature control on the SOC according to the first target temperature value.

9. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the program, the method according to any one of claims 1-7 is implemented.

10. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, the method according to any one of claims 1-7 is implemented.

11. A computer program product, characterized in that, It includes a computer program, which, when executed by the processor, implements the method according to any one of claims 1-7.

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