Temperature control method, system and device, chip, equipment and storage medium

Abstract

The invention provides a temperature control method, system and device, a chip, equipment and a storage medium, and relates to the technical field of temperature control. Firstly, load information of a target circuit is determined according to a power consumption value and event information of the target circuit in a first time period, then a temperature control threshold value is determined according to the load information, then a predicted temperature of the target circuit in a next time period is determined according to the load information, the power consumption value and a current temperature value, and finally the predicted temperature of the target circuit in a next time period is determined according to the relation between the predicted temperature and the temperature control threshold value. And determining a temperature control strategy. Therefore, the dynamic temperature control of the circuit is realized, so that the temperature of the circuit can be kept in a temperature range which does not affect the system performance in real time, the situation that the system performance is unstable due to the fact that the temperature of the circuit is too high or too low is effectively avoided, the performance and stability of system operation are ensured, and the service life of the system is prolonged. And the accuracy and the reliability of temperature control are improved.

Description

Technical Field

[0001] The present disclosure relates to the field of temperature control technology, and in particular, to a temperature control method, system, device, chip, equipment and storage medium. Background Art

[0002] As the size of integrated circuits continues to decrease and the circuit density of integrated circuits continues to increase, the heat generated by integrated circuits also increases. However, excessive heat will cause the circuit system to operate unstably and affect the system operation performance. How to provide a fast, efficient and reliable temperature control method to ensure the stability of the system operation and meet the operation performance and energy efficiency goals is an urgent problem to be solved at present. Summary of the Invention

[0003] The present disclosure aims to solve at least one of the technical problems in the related art to some extent.

[0004] A first aspect embodiment of the present disclosure provides a temperature control method, including:

[0005] Determining the load information of the target circuit according to the power consumption value and event information of the target circuit in the first time period;

[0006] Determining a temperature control threshold according to the load information;

[0007] Determining the predicted temperature of the target circuit in the next time period according to the load information, power consumption value and current temperature value;

[0008] Determining a temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold;

[0009] Controlling the target circuit based on the temperature control strategy.

[0010] A second aspect embodiment of the present disclosure provides a temperature control system, including: a monitoring unit, a load classification unit, a temperature control threshold determination unit, a temperature prediction unit and a control strategy determination unit that are connected in sequence;

[0011] Wherein, the monitoring unit is configured to detect the target circuit and determine the power consumption value, event information and temperature value of the target circuit in each time period;

[0012] The load classification unit is configured to determine the load information of the target circuit based on the power consumption value and event information of the first time period determined by the monitoring unit;

[0013] The temperature threshold determination unit is configured to determine a temperature control threshold according to the load information;

[0014] The temperature prediction unit is configured to determine the predicted temperature of the circuit in the next time period according to the load information, power consumption value, and the current temperature value.

[0015] The control strategy determination unit is configured to determine a temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold.

[0016] An embodiment of the third aspect of the present disclosure provides a temperature control device, including:

[0017] A first determination module, configured to determine the load information of the target circuit according to the power consumption value and event information of the target circuit in the first time period;

[0018] A second determination module, configured to determine a temperature control threshold according to the load information;

[0019] A third determination module, configured to determine the predicted temperature of the target circuit in the next time period according to the load information, power consumption value, and the current temperature value;

[0020] A fourth determination module, configured to determine a temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold.

[0021] An embodiment of the fourth aspect of the present disclosure provides a computer-readable storage medium storing a computer program, which when executed by a processor, implements the temperature control method provided in the embodiment of the first aspect of the present disclosure.

[0022] An embodiment of the fifth aspect of the present disclosure provides a chip, including a processing circuit configured to execute the temperature control method provided in the embodiment of the first aspect.

[0023] An embodiment of the sixth aspect of the present disclosure provides an electronic device, including a circuit and a temperature control system. The temperature control system is configured to detect the circuit, determine the power consumption value, event information, and temperature value of the circuit in each time period, and determine a temperature control strategy based on the power consumption value, event information, and temperature value of the circuit in each time period to control the circuit.

[0024] The temperature control method, system, device, chip, equipment, and storage medium provided by the present disclosure have the following beneficial effects:

[0025] In the embodiments of the present disclosure, first, according to the power consumption value and event information of the target circuit in the first time period, the load information of the target circuit is determined. Then, according to the load information, the temperature control threshold is determined. After that, according to the load information, the power consumption value, and the current temperature value, the predicted temperature of the target circuit in the next time period is determined. Finally, according to the relationship between the predicted temperature and the temperature control threshold, the temperature control strategy is determined. Thus, by determining the load information of the circuit according to the power consumption value and event information of the circuit, and determining the temperature control threshold according to the load information, then determining the predicted temperature of the next time period according to the load information, the power consumption value, and the current temperature value, and determining the control strategy according to the relationship between the predicted temperature and the temperature control threshold to control the circuit, dynamic temperature control of the circuit is realized, so that the temperature of the circuit can be kept in real time within the temperature range that does not affect the system performance, effectively avoiding the situation of unstable system performance caused by too high or too low circuit temperature, ensuring the performance and stability of the system operation, and improving the accuracy and reliability of temperature control.

[0026] Additional aspects and advantages of the present disclosure will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and / or additional aspects and advantages of the present disclosure will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, where:

[0028] Figure 1 is a schematic flowchart of a temperature control method provided by an embodiment of the present disclosure;

[0029] Figure 2 is a schematic flowchart of a temperature control method provided by an embodiment of the present disclosure;

[0030] Figure 3 is a schematic flowchart of a temperature control method provided by another embodiment of the present disclosure;

[0031] Figure 4 is a schematic diagram of the effect of high-temperature temperature control of a circuit provided by an embodiment of the present disclosure;

[0032] Figure 5 is a schematic diagram of the effect of low-temperature temperature control of a circuit provided by an embodiment of the present disclosure;

[0033] Figure 6 is a schematic flowchart of a temperature control method provided by another embodiment of the present disclosure;

[0034] Figure 7 is a schematic structural diagram of a temperature control system provided by another embodiment of the present disclosure;

[0035] Figure 8Schematic diagram of the temperature control system provided by the embodiments of the present disclosure;

[0036] Figure 9 Schematic diagram of the temperature control device provided by another embodiment of the present disclosure;

[0037] Figure 10 Schematic diagram of the chip proposed by the embodiments of the present disclosure. Detailed implementation manners

[0038] The embodiments of the present disclosure will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present disclosure, and should not be construed as a limitation to the present disclosure.

[0039] The temperature control methods, systems, devices, chips, equipment and storage media of the embodiments of the present disclosure will be described below with reference to the accompanying drawings.

[0040] Figure 1 Flow chart of a temperature control method provided by the embodiments of the present disclosure.

[0041] As Figure 1 shown, the temperature control method may include the following steps:

[0042] Step 101, determine the load information of the target circuit according to the power consumption value and event information of the target circuit within the first time period.

[0043] Among them, the first time period may be the current temperature control monitoring time period of the target circuit, which may be preset or may also be determined according to the actual situation. The present disclosure does not make any limitation thereto.

[0044] It should be noted that the power consumption value of the target circuit within the first time period may be calculated by a power consumption monitor according to the measured input current and output current of the components, combined with information such as voltage and time window, or may also be calculated according to the relationship between the signal and power consumption and the currently measured signal. The present disclosure does not make any limitation thereto.

[0045] Among them, the event information may be the operation information executed by the system, or may also be the event information related to power consumption screened according to the relationship between each type of event information recorded by the system and power consumption. For example, the event information may be the instruction information executed by the system, the number of times of accessing the memory, etc. The present disclosure does not make any limitation thereto.

[0046] It should be noted that the system can be a Central Processing Unit (CPU) system, a Graphics Processing Unit (GPU) system, a Neural network Processing Unit (NPU) system, etc. The present disclosure does not limit this.

[0047] It should be noted that the load information of the target circuit can include the type of load that the circuit is currently operating, or the size of the load that is working. For example, the load type can be a resistive load, an inductive load, or a capacitive load, and the load size can be that the working module or system is lightly loaded, medium loaded, or heavily loaded, etc. The present disclosure does not limit this.

[0048] In the present disclosure, before determining the temperature control strategy, first, according to the power consumption value and event information of the target circuit in the first time period, the load information of the target circuit is determined, so as to provide a data basis for determining the temperature control strategy.

[0049] In some possible implementation forms, when determining the load information of the target circuit according to the power consumption value and event information of the target circuit in the first time period, in order to improve the accuracy and reliability of the determined load information, the load information corresponding to the power consumption value and event information in the first time period can be determined according to the reference power consumption and reference events associated with each type of load. The present disclosure does not limit this.

[0050] Among them, the reference power consumption and reference events associated with each type of load can be pre-set. The present disclosure does not limit this.

[0051] In some possible implementation forms, when determining the load information of the target circuit according to the power consumption value and event information of the target circuit in the first time period, in order to improve the efficiency and reliability of determining the load information, the power consumption value and event information can also be input into a first pre-set model to obtain the load information output by the model. The present disclosure does not limit this.

[0052] Among them, the first pre-set model can be a model used to determine the load information of the target circuit, which is pre-set. The present disclosure does not limit this.

[0053] Step 102: Determine the temperature control threshold according to the load information.

[0054] Among them, the temperature control threshold can be the temperature critical value when controlling the temperature of the target circuit, and it can be determined according to the actual situation. For example, since the temperature of the target circuit being too high or too low will affect the system operation stability and performance, the temperature threshold can include a high-temperature control threshold and a low-temperature control threshold, which are not limited in this disclosure.

[0055] It should be noted that different load information may result in different determined temperature control thresholds. For example, taking the load type included in the load information as an example, for a resistive load, since the current and voltage are in the same phase, electrical energy is mainly converted into heat energy. Therefore, a relatively high temperature will be generated in the circuit when the resistive load is working. For an inductive load, since the current phase lags behind the voltage phase, electrical energy is mainly converted into mechanical energy or magnetic field energy. Therefore, the temperature generated in the circuit when the inductive load is working is relatively lower than that of the resistive load. For a capacitive load, since the current phase leads the voltage load, electrical energy is mainly stored in the electric field. Therefore, the temperature generated in the circuit when the capacitive load is working is lower than that of the resistive load and the inductive load. Thus, the high-temperature control threshold of the resistive load can be greater than those of the inductive load and the capacitive load, and the high-temperature control threshold of the inductive load can be greater than that of the capacitive load, etc. Taking the load magnitude included in the load information as an example, under light load, the current and heat generated in the circuit are relatively small, while under medium load, the current and heat generated in the circuit are larger than those under light load. Therefore, the high-temperature control threshold corresponding to medium load can be greater than that corresponding to light load. Under heavy load, since the current and heat generated in the circuit are larger than those under light load and medium load, the high-temperature control threshold corresponding to heavy load can be greater than that corresponding to light load and that corresponding to medium load, which is not limited in this disclosure.

[0056] Among them, the high-temperature control threshold can be the high-temperature critical value of the circuit when the system is working normally, and the low-temperature control threshold can be the low-temperature critical value of the circuit when the system is working normally, both of which can be determined according to the actual situation and are not limited in this disclosure.

[0057] In this disclosure, after determining the load information of the target circuit, the temperature control threshold can be determined according to the load information, thereby improving the flexibility of the determined temperature control threshold, achieving the dynamic control effect on the target circuit, realizing the prediction of power integrity (PI) circuit problems and triggering the defense mechanism, and effectively avoiding the PI circuit stability risk.

[0058] Step 103: Determine the predicted temperature of the target circuit in the next time period according to the load information, power consumption value, and the current temperature value.

[0059] It should be noted that the current temperature value of the target circuit can be measured by a temperature sensor, which is not limited in this disclosure.

[0060] In the present disclosure, after determining the temperature control threshold according to the load information, the predicted temperature of the target circuit in the next time period can be determined based on the load information, the power consumption value, and the current temperature value, thereby providing conditions for determining the temperature control strategy of the target circuit.

[0061] It should be noted that when determining the predicted temperature of the circuit in the next time period according to the load information, the power consumption value, and the current temperature value, the predicted temperature can also be determined in combination with event information, and the present disclosure does not limit this.

[0062] Step 104: Determine the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold.

[0063] Among them, the temperature control strategy can be a strategy for controlling the temperature of the target circuit.

[0064] In the present disclosure, after determining the predicted temperature of the target circuit in the next time period, in order to accurately and reliably determine the temperature control strategy of the target circuit, the relationship between the predicted temperature and the temperature control threshold can be first determined, and then the temperature control strategy can be determined according to the relationship.

[0065] In some possible implementation forms, when the predicted temperature is greater than or equal to the high-temperature control threshold, it can be determined that the temperature of the target circuit in the next time period may be too high. To ensure the normal operation of the system, at this time, the temperature control strategy can be determined to reduce the working voltage and / or frequency of the circuit in the next time period, thereby realizing the control of the working voltage and / or frequency of the circuit of the target circuit in the next time period, and the present disclosure does not limit this.

[0066] In some possible implementation forms, when the predicted temperature is less than or equal to the low-temperature control threshold, it can be determined that the temperature of the target circuit in the next time period may be too low. To ensure the performance and stability of the system operation, at this time, the temperature control strategy can be determined to increase the working voltage and / or frequency of the target circuit, and the present disclosure does not limit this.

[0067] In the present disclosure, after determining the temperature control strategy of the target circuit, the target circuit can be controlled based on the temperature control strategy. For example, according to the temperature control strategy, the working voltage and / or frequency of the target circuit can be adjusted, thereby controlling the temperature of the target circuit and ensuring the normal operation of the system.

[0068] It should be noted that after the target circuit triggers high-temperature control, when it is monitored that the temperature of the target circuit is less than the preset high-temperature control cancellation threshold, the control of the working voltage and / or frequency of the target circuit can be cancelled, and the working voltage and / or frequency of the target circuit can be adjusted to the voltage and / or frequency during normal operation, so as to improve the working performance and efficiency of the system, and the present disclosure does not limit this.

[0069] Among them, the high-temperature temperature control cancellation threshold can be the temperature critical value for canceling the high-temperature temperature control of the circuit. It can be preset or can also be determined according to the actual situation. The present disclosure does not limit this.

[0070] It should be noted that after the target circuit triggers low-temperature temperature control, when it is detected that the temperature of the target circuit is greater than the preset low-temperature temperature control cancellation threshold, the control of the voltage and / or frequency of the target circuit's operation can be cancelled, and the operating voltage and / or frequency of the target circuit can be adjusted to the voltage and / or frequency during normal operation. The present disclosure does not limit this.

[0071] Among them, the low-temperature temperature control cancellation threshold can be the temperature critical value for canceling the low-temperature temperature control of the circuit. It can be preset or can also be determined according to the actual situation. The present disclosure does not limit this.

[0072] In the embodiments of the present disclosure, first, according to the power consumption value and event information of the target circuit in the first time period, the load information of the target circuit is determined. Then, according to the load information, the temperature control threshold is determined. After that, according to the load information, the power consumption value, and the current temperature value, the predicted temperature of the target circuit in the next time period is determined. Finally, according to the relationship between the predicted temperature and the temperature control threshold, the temperature control strategy is determined. Thus, by determining the load information of the circuit according to the power consumption value and event information of the target circuit, and determining the temperature control threshold according to the load information, then determining the predicted temperature of the next time period according to the load information, the power consumption value, and the current temperature value, and determining the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold, the target circuit is controlled, thereby realizing dynamic temperature control of the circuit, enabling the temperature of the circuit to be always maintained within the temperature range that does not affect the system performance, effectively avoiding the situation of unstable system performance caused by too high or too low circuit temperature, ensuring the performance and stability of the system operation, and improving the accuracy and reliability of temperature control.

[0073] Figure 2 It is a schematic flowchart of a temperature control method provided by the embodiments of the present disclosure.

[0074] As Figure 2 shown, the temperature control method may include the following steps:

[0075] Step 201, determine the load information of the target circuit according to the power consumption value and event information of the target circuit in the first time period.

[0076] In the present disclosure, by determining the load information of the target circuit according to the power consumption value of the target circuit in the first time period and in combination with the event information, the accuracy and reliability of the determined load information are improved.

[0077] For example, when determining the load information based on the power consumption value of the target circuit during the first time period and in combination with the event information, the load type can be determined by determining the relationship between the power consumption value and the voltage or current of the load of the target circuit. When the power consumption value and the current or voltage have a relatively stable linear relationship, that is, when the current or voltage increases, the power consumption value also increases, it can be determined that the load type of the target circuit is a resistive load. When the power consumption value and the voltage or current of the load of the target circuit are not in a linear relationship and the target circuit generates a large instantaneous power when the load starts or switches, it can be determined that the load type of the target circuit is an inductive load or a capacitive load. Further, the load type of the target circuit being an inductive load or a capacitive load can be determined by the phase difference between the current and voltage of the load of the target circuit. For example, when the phase difference is positive, it can be determined that the load type of the target circuit is an inductive load, and when the phase difference is negative, it can be determined that the load information of the target circuit is a capacitive load. When determining the load size based on the power consumption value of the target circuit during the first time period, since the load in the target circuit is small under light load and the energy consumed is relatively small, the power consumption value is relatively low. Under medium load, the load in the target circuit is moderate and the energy consumed is relatively more than that under light load, so the power consumption value of the target circuit under medium load is also relatively high. Under heavy load, the load in the target circuit is large and more energy is required to maintain the normal operation of the load. Therefore, the power consumption value under heavy load is usually higher than that under light load and medium load. The present disclosure does not make any limitations in this regard.

[0078] When determining the load type of a target circuit based on the event information of the target circuit within a first time period, when the event information is the instruction information executed by the system, in the case of a resistive load, since a resistive load is a load that operates through resistive components and its current is in phase with the voltage, the system usually executes instructions related to data operations (usually internal data operations of the system) and transmission, and these instructions are usually directly related to the changes in the current and voltage of the circuit. In the case of an inductive load, since an inductive load is a load with inductive parameters and its current lags behind the voltage, the system usually executes instructions related to the calculation and control of the phase difference between the current and the voltage. In the case of a capacitive load, since a capacitive load is a load with capacitive parameters and its current leads the voltage, the system usually executes instructions related to the calculation and control of the capacitor charging and discharging process. Therefore, the content of the instruction information executed in the system can be used to assist in determining the load type of the target circuit based on the power consumption value. When determining the load magnitude of the target circuit based on the event information of the target circuit within the first time period, it can be determined according to aspects such as the instruction execution efficiency and the instruction scheduling strategy. For example, under a light load, the system load is low, and the system has sufficient computing power and storage space to process more instructions. Therefore, the system has a high instruction execution efficiency and can allocate resources more flexibly, select the optimal instruction execution order to improve system performance. Under a medium load, the system load is moderate, neither too high nor too low, and the system resources can be reasonably allocated and utilized, and the instruction execution efficiency is relatively stable without obvious fluctuations. While ensuring the performance, in order to balance the allocation and utilization of resources, the system may adopt a more balanced instruction scheduling strategy more often. Under a heavy load, the system load is high. Since the system resources may be tight and insufficient, the instructions may not be processed and executed in a timely manner, resulting in a low instruction execution efficiency. And due to the insufficient system resources, the resource allocation and utilization are restricted. In order to ensure the stability and reliability of the system, the system may not be able to adopt a flexible instruction scheduling strategy but adopt a relatively conservative scheduling strategy, etc. The present disclosure does not make any limitations on this.

[0079] When the event information is the number of times of accessing the memory, since inductive loads require the system to control the change of current and capacitive loads require the system to control the change of voltage, the system may need to access the memory more frequently to read or write the corresponding information under inductive and capacitive loads than under resistive loads. Specifically, when further differentiating between inductive and capacitive loads, it can be determined according to the information read or written by the system. When determining the load size of the target circuit based on the number of times of accessing the memory, since the system resources are sufficient under light loads, the program can be executed more efficiently, and the cache hit rate is relatively high, so the number of times the system accesses the memory is relatively low. Under heavy loads, the system resources are tense, the program execution may be affected, and the cache hit rate may be low, so the number of times the system accesses the memory is relatively high. The number of times the system accesses the memory under medium loads may be between the number of times the system accesses the memory corresponding to light loads and the number of times the system accesses the memory corresponding to heavy loads. The present disclosure does not limit this.

[0080] Step 202: Determine the temperature control threshold according to the load information.

[0081] Among them, the specific implementation forms of steps 201 to 202 can refer to the detailed descriptions of other embodiments of the present disclosure and will not be elaborated here.

[0082] Step 203: Determine the temperature prediction parameter according to the load information.

[0083] It should be noted that the temperature prediction parameter can be determined according to actual needs. To improve the accuracy of temperature prediction, the temperature prediction parameter can include coefficients corresponding to the power consumption value, the current temperature value, and the event information, etc. These coefficients can participate in calculating the predicted temperature. The present disclosure does not limit this.

[0084] In the present disclosure, after determining the temperature control threshold, to accurately and reliably determine the predicted temperature of the circuit in the next time period, the temperature prediction parameter can be determined first according to the load information.

[0085] Step 204: Determine the predicted temperature of the next time period based on the temperature prediction parameter, the current temperature value, and the power consumption value.

[0086] In the present disclosure, after determining the temperature prediction parameter, the predicted temperature of the next time period can be determined according to the temperature prediction parameter, the current temperature value, and the power consumption value, so as to improve the reliability of the predicted temperature.

[0087] Step 205: Determine the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold.

[0088] Among them, the specific implementation form of step 205 can refer to the detailed descriptions of other embodiments of the present disclosure and will not be elaborated here.

[0089] In the embodiments of the present disclosure, first, according to the power consumption value and event information of the target circuit within the first time period, the load information of the target circuit is determined. Then, according to the load information, the temperature control threshold is determined, and according to the load information, the temperature prediction parameter is determined. After that, based on the temperature prediction parameter, the current temperature value and the power consumption value, the predicted temperature for the next time period is determined. Finally, according to the relationship between the predicted temperature and the temperature control threshold, the temperature control strategy is determined. Thus, after determining the current load information of the circuit, according to the load information, the temperature control threshold and the temperature prediction parameter are determined, and based on the temperature prediction parameter, the current temperature value and the power consumption value of the target circuit, the predicted temperature for the next time period is determined. Based on the relationship between the predicted temperature and the temperature control threshold, the temperature control strategy of the target circuit is determined, and the target circuit is controlled, thereby improving the reliability and efficiency of temperature control.

[0090] Figure 3 It is a schematic flowchart of a temperature control method provided by another embodiment of the present disclosure.

[0091] As Figure 3 shown, the temperature control method may include the following steps:

[0092] Step 301, according to the power consumption value and event information of the target circuit within the first time period, determine the load information of the target circuit.

[0093] Step 302, according to the load information, determine the temperature control threshold.

[0094] Step 303, according to the load information, the power consumption value and the current temperature value, determine the predicted temperature of the target circuit for the next time period.

[0095] Among them, for the specific implementation forms of steps 301 to 303, reference may be made to the detailed descriptions of other embodiments of the present disclosure, which will not be elaborated here.

[0096] Step 304, when the predicted temperature is less than the high-temperature control threshold and greater than the low-temperature control threshold, determine that the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range.

[0097] It should be noted that the rated voltage and / or rated frequency range of the target circuit may be pre-set, and the present disclosure does not limit this.

[0098] In the present disclosure, after determining the predicted temperature of the target circuit for the next time period, when the predicted temperature is less than the high-temperature control threshold and greater than the low-temperature control threshold, it can be determined that the temperature of the target circuit in the next time period may not be too high or too low, affecting the system operation performance and stability. In order to ensure the safe operation of the target circuit, it can be determined that the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range.

[0099] Step 305: Based on the temperature control strategy, control at least one of the following: the output voltage of the power supply for the target circuit, and the frequency of the clock generator associated with the target circuit.

[0100] It should be noted that the specific type of the power supply for the target circuit can be determined according to the actual situation. For example, the power supply for the target circuit can be a battery, etc., and the present disclosure does not limit this.

[0101] Among them, the clock generator associated with the target circuit can be used to control the operating frequency of the target circuit.

[0102] In the present disclosure, after determining that the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range, the output voltage of the power supply for the target circuit and / or the frequency of the clock generator associated with the target circuit can be controlled based on the temperature control strategy. For example, when performing high-temperature temperature control on the target circuit, frequency limiting can be performed on the frequency of the target circuit, or frequency limiting and voltage limiting can be performed on the power supply voltage and the frequency of the target circuit. When the predicted temperature of the target circuit is less than the high-temperature temperature control threshold and greater than the low-temperature temperature control threshold, it can be determined that the predicted temperature is neither too high nor too low and is within the temperature range that does not affect the system performance. The high-temperature temperature control of the target circuit can be cancelled, and at this time, the frequency limiting or frequency limiting and voltage limiting of the target circuit can be lifted.

[0103] When performing low-temperature temperature control on the target circuit, the power supply voltage of the target circuit can be boosted, or the power supply voltage of the target circuit can be boosted and the frequency of the target circuit can be increased. When the predicted temperature of the target circuit is less than the high-temperature temperature control threshold and greater than the low-temperature temperature control threshold, the low-temperature temperature control of the target circuit can be cancelled, and at this time, the boosting or boosting and frequency increasing of the target circuit can be lifted.

[0104] In the embodiments of the present disclosure, first, according to the power consumption value and event information of the target circuit in the first time period, the load information of the target circuit is determined. Then, according to the load information, the temperature control threshold is determined, and according to the load information, the power consumption value and the current temperature value, the predicted temperature of the target circuit in the next time period is determined. When the predicted temperature is less than the high-temperature control threshold and greater than the low-temperature control threshold, it is determined that the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range. Finally, based on the temperature control strategy, at least one of the following is controlled: the output voltage of the power supply of the target circuit, the frequency of the clock generator associated with the target circuit. Thus, after determining the load information of the target circuit, according to the load information, the temperature control threshold is determined, and based on the load information, the power consumption value and the current temperature value, the predicted temperature of the target circuit in the next time period is determined. When the predicted temperature is less than the high-temperature control threshold and greater than the low-temperature control threshold, the output voltage of the power supply of the target circuit and / or the frequency of the clock generator associated with the target circuit are controlled, so that the target circuit operates within the rated voltage and / or rated frequency range, thereby improving the safety of the target circuit operation and the reliability of temperature control.

[0105] The following Figure 4 、 Figure 5 are used to illustrate the effect of the temperature control method provided by the embodiments of the present disclosure by way of example. Figure 4 is a schematic diagram showing the effect of high-temperature circuit temperature control provided by the embodiments of the present disclosure, Figure 5 is a schematic diagram showing the effect of low-temperature circuit temperature control provided by the embodiments of the present disclosure.

[0106] Among them, Figure 4 、 Figure 5 the temperature control monitoring period is the time period for temperature control monitoring; Figure 4 a, Figure 5 a are respectively schematic diagrams of the circuit temperature control effect before using the temperature control method provided by the present disclosure, Figure 4 b, Figure 5 b are respectively schematic diagrams of the circuit temperature control effect after using the temperature control method provided by the present disclosure.

[0107] Since the temperature control method of the present disclosure predicts the predicted temperature of the target circuit in the next time period based on the power consumption value, the current temperature value and the load information of the target circuit, determines the temperature control threshold according to the load information, and finally determines the temperature control strategy based on the relationship between the predicted temperature and the temperature control threshold, and controls the target circuit by controlling the frequency of the clock generator associated with the target circuit and / or the output voltage of the power supply of the target circuit. Before using the temperature control method of the present disclosure, the circuit is usually controlled by a software method. Compared with Figure 4 a, Figure 5 the temperature control monitoring period shown in a,Figure 4 b, Figure 5 The temperature control monitoring period shown in b is shorter. Additionally, by predicting the predicted temperature in the next time period based on the power consumption value and the current temperature value of the circuit, the high-temperature temperature control threshold and the low-temperature temperature control threshold can be effectively increased. For example, Figure 4 the high-temperature temperature control threshold shown in b is higher than Figure 4 the high-temperature temperature control threshold shown in a, Figure 5 the low-temperature temperature control threshold shown in b is lower than Figure 5 the low-temperature temperature control threshold shown in a. Therefore, by adopting the temperature control method provided in the present disclosure, the high-performance operation duration of the system can be effectively extended, and the efficiency and reliability of temperature control can be improved.

[0108] Figure 6 It is a schematic flowchart of a temperature control method provided by another embodiment of the present disclosure.

[0109] As Figure 6 shown, the temperature control method may include the following steps:

[0110] Step 601: Determine the load information of the target circuit according to the power consumption value and event information of the target circuit in the first time period.

[0111] Step 602: Determine the temperature control threshold according to the load information.

[0112] Step 603: Determine the predicted temperature of the target circuit in the next time period according to the load information, power consumption value, and current temperature value.

[0113] Step 604: When the predicted temperature is greater than or equal to the high-temperature temperature control threshold, determine that the temperature control strategy is to reduce the working voltage and / or frequency of the target circuit.

[0114] Step 605: When the predicted temperature is less than or equal to the low-temperature temperature control threshold, determine that the temperature control strategy is to increase the working voltage and / or frequency of the target circuit.

[0115] Step 606: When the predicted temperature is less than the high-temperature temperature control threshold and greater than the low-temperature temperature control threshold, determine that the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range.

[0116] It should be noted that steps 604 to 606 respectively correspond to the steps under different relationships between the predicted temperature of the target circuit in the next time period and the high-temperature temperature control threshold and / or the low-temperature temperature control threshold. For example, when the predicted temperature is greater than or equal to the high-temperature temperature control threshold, the predicted temperature of the target circuit in the next time period is too high. At this time, step 604 can be executed to determine that the temperature control strategy is to reduce the operating voltage and / or frequency of the target circuit. When the predicted temperature is less than or equal to the low-temperature temperature control threshold, the predicted temperature of the target circuit in the next time period is too low. At this time, step 605 can be executed to determine that the temperature control strategy is to increase the operating voltage and / or frequency of the target circuit. When the predicted temperature is less than the high-temperature temperature control threshold and greater than the low-temperature temperature control threshold, the predicted temperature of the target circuit in the next time period is neither too high nor too low and is within the temperature range that does not affect the system performance. At this time, step 606 can be executed to determine that the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range, so that the target circuit operates within the rated voltage and / or rated frequency in the next time period.

[0117] Step 607, based on the temperature control strategy, control at least one of the following: the output voltage of the power supply for the target circuit, the frequency of the clock generator associated with the target circuit.

[0118] In the present disclosure, after determining the temperature control strategy, the output voltage of the power supply for the target circuit and / or the frequency of the clock generator associated with the target circuit can be controlled based on the temperature control strategy. For example, when the temperature control strategy is to reduce the operating voltage and / or frequency of the target circuit, the output voltage of the power supply for the target circuit and / or the frequency of the clock generator associated with the target circuit can be reduced. When the temperature control strategy is to increase the operating voltage and / or frequency of the target circuit, the output voltage of the power supply for the target circuit and / or the frequency of the clock generator associated with the target circuit can be increased. When the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range, the output voltage of the power supply for the target circuit can be controlled within the rated voltage range, and / or the frequency of the clock generator associated with the target circuit can be controlled within the rated frequency range.

[0119] Among them, the specific implementation forms of steps 601 to 607 can refer to the detailed descriptions of other embodiments of the present disclosure and will not be elaborated here.

[0120] In an embodiment of the present disclosure, first, based on the power consumption value and event information of the target circuit in the first time period, the load information of the target circuit is determined, and based on the load information, the temperature control threshold is determined. Then, based on the load information, the power consumption value, and the current temperature value, the predicted temperature of the target circuit in the next time period is determined. After that, when the predicted temperature is greater than or equal to the high-temperature control threshold, the temperature control strategy is determined to be reducing the operating voltage and / or frequency of the target circuit; or when the predicted temperature is less than or equal to the low-temperature control threshold, the temperature control strategy is determined to be increasing the operating voltage and / or frequency of the target circuit; or when the predicted temperature is less than the high-temperature control threshold and greater than the low-temperature control threshold, the temperature control strategy is determined to be controlling the target circuit to operate within the rated voltage and / or rated frequency range. Finally, based on the temperature control strategy, at least one of the following is controlled: the output voltage of the power supply of the target circuit, the frequency of the clock generator associated with the target circuit. Thus, by determining the load information of the circuit based on the power consumption value and event information of the circuit, and determining the temperature control threshold based on the load information, then determining the predicted temperature of the next time period based on the load information, the power consumption value, and the current temperature value, and determining the corresponding control strategy for the operating voltage and / or operating frequency of the circuit according to the relationship between the predicted temperature, the high-temperature control threshold, and the low-temperature control threshold, and adjusting the operating voltage and / or operating frequency of the circuit based on the control strategy, dynamic temperature control of the circuit is achieved, effectively avoiding the situation of unstable system performance caused by too high or too low circuit temperature, and ensuring the performance and stability of system operation.

[0121] Figure 7 FIG. is a schematic structural diagram of a temperature control system provided by another embodiment of the present disclosure.

[0122] As Figure 7 shown, the temperature control system 700 may include: a monitoring unit 701, a load classification unit 702, a temperature control threshold determination unit 703, a temperature prediction unit 704, and a control strategy determination unit 705 that are connected in sequence;

[0123] Among them, the monitoring unit 701 is configured to detect the target circuit and determine the power consumption value, event information, and temperature value of the target circuit in each time period;

[0124] The load classification unit 702 is configured to determine the load information of the target circuit based on the power consumption value and event information of the first time period determined by the monitoring unit 701;

[0125] The temperature threshold determination unit 703 is configured to determine the temperature control threshold according to the load information;

[0126] The temperature prediction unit 704 is configured to determine the predicted temperature of the circuit in the next time period according to the load information, the power consumption value, and the current temperature value;

[0127] A control strategy determination unit 705 is configured to determine a temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold.

[0128] It should be noted that different monitoring units 701 can be corresponding to different monitoring contents. For example, the monitoring unit 701 can be a temperature detection unit, an event monitoring unit, and a power consumption monitoring unit. The present disclosure does not limit this.

[0129] It should be noted that the specific type of the monitoring unit 701 can be determined according to the actual situation. For example, the type of the monitoring unit 701 can be a sensor, etc. The present disclosure does not limit this.

[0130] In the present disclosure, after determining the temperature control strategy of the target circuit through the temperature control system, the temperature control strategy can be sent to the V / F controller to control the voltage and / or frequency at which the target circuit operates. The present disclosure does not limit this.

[0131] Among them, the V / F controller is a Voltage / Frequency controller.

[0132] It should be noted that the V / F controller can control the frequency of the clock generator associated with the target circuit and the output voltage of the power supply of the target circuit to control the operating frequency and operating voltage of the target circuit. The present disclosure does not limit this.

[0133] In the embodiment of the present disclosure, first, the power consumption value, event information, and temperature value of the target circuit in each time period are determined through the monitoring unit in the temperature control system, then the load information of the target circuit is determined through the load classification unit based on the power consumption value and event information in the first time period determined by the monitoring unit, and the temperature control threshold is determined through the temperature threshold determination unit according to the load information. Then, the predicted temperature of the circuit in the next time period is determined through the temperature prediction unit according to the load information, power consumption value, and current temperature value. Finally, the temperature control strategy is determined through the control strategy determination unit according to the relationship between the predicted temperature and the temperature control threshold, thereby realizing automatic dynamic temperature control through hardware, improving the response speed of the system temperature control, effectively avoiding system performance instability caused by too high or too low temperature, and improving the timeliness and reliability of temperature control.

[0134] The following Figure 8 is used to give an example of the structure of the temperature control system provided by the embodiment of the present disclosure. Figure 8 is a schematic structural diagram of the temperature control system provided by the embodiment of the present disclosure.

[0135] Such as Figure 8As shown, the temperature monitoring unit, power consumption monitoring unit, and event monitoring unit included in the temperature control system are respectively used to monitor the power consumption value, temperature value, and event information of the target circuit.

[0136] The temperature controller included in the temperature control system includes a temperature prediction unit, which can be used to predict the temperature of the circuit in the next time period; a temperature control monitoring unit, which can be used to determine whether the target circuit triggers temperature control; a load classification unit, which can be used to classify the load of the target circuit; and a voltage / frequency calculation unit, which can be used to determine the voltage and / or frequency at which the target circuit operates in the temperature control strategy.

[0137] The V / F controller included in the temperature control system is used to control the clock generator and the power supply manager. Among them, the clock generator can control the operating frequency of the target circuit, and the power supply manager can control the output voltage of the power supply for the target circuit.

[0138] In the present disclosure, after the temperature monitoring unit, power consumption monitoring unit, and event monitoring unit respectively obtain the current temperature value, power consumption value, and event information of the target circuit, they send the temperature value, power consumption value, and event information to the temperature controller. After receiving the temperature value, power consumption value, and event information, the temperature controller determines the load information of the target circuit by using the load classification unit based on the power consumption value and event information, and then determines the predicted temperature of the circuit in the next time period by using the temperature prediction unit based on the load information, power consumption value, and temperature value. Then, it uses the temperature control monitoring unit to judge the relationship between the predicted temperature and the temperature control threshold corresponding to the load information, determines the corresponding temperature control strategy, and finally determines the voltage and / or frequency at which the target circuit operates in the temperature control strategy through the voltage / frequency calculation unit and the temperature control strategy, and sends it to the V / F controller. The V / F controller controls the power supply manager and / or the clock generator according to the received voltage value and / or frequency value in the temperature control strategy, thereby realizing the control of the circuit temperature and improving the accuracy and reliability of temperature control.

[0139] Figure 9 It is a schematic structural diagram of the temperature control device provided by another embodiment of the present disclosure.

[0140] As Figure 9 shown, the temperature control device 900 may include: a first determination module 901, a second determination module 902, a third determination module 903, and a fourth determination module 904.

[0141] The first determination module 901 is used to determine the load information of the target circuit according to the power consumption value and event information of the target circuit in the first time period;

[0142] The second determination module 902 is configured to determine a temperature control threshold according to the load information;

[0143] The third determination module 903 is configured to determine the predicted temperature of the target circuit in the next time period according to the load information, the power consumption value, and the current temperature value;

[0144] The fourth determination module 904 is configured to determine a temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold.

[0145] Optionally, the first determination module 901 is specifically configured to:

[0146] Determine the load information corresponding to the power consumption value and the event information in the first time period according to the reference power consumption and the reference event associated with each type of load; or,

[0147] Input the power consumption value and the event information into a first preset model to obtain the load information output by the model.

[0148] Optionally, the third determination module 903 is specifically configured to:

[0149] Determine temperature prediction parameters according to the load information;

[0150] Based on the temperature prediction parameters, the current temperature value, and the power consumption value, determine the predicted temperature in the next time period.

[0151] Optionally, the fourth determination module 904 is specifically configured to:

[0152] When the predicted temperature is greater than or equal to the high-temperature control threshold, determine that the temperature control strategy is to reduce the operating voltage and / or frequency of the target circuit; or,

[0153] When the predicted temperature is less than or equal to the low-temperature control threshold, determine that the temperature control strategy is to increase the operating voltage and / or frequency of the target circuit.

[0154] Optionally, the fourth determination module 904 is further configured to:

[0155] When the predicted temperature is less than the high-temperature control threshold and greater than the low-temperature control threshold, determine that the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range.

[0156] Optionally, the fourth determination module 904 is further configured to:

[0157] Based on the temperature control strategy, control at least one of the following: the output voltage of the power supply of the target circuit, the frequency of the clock generator associated with the target circuit.

[0158] For the functions and specific implementation principles of the above-mentioned modules in the embodiments of the present disclosure, reference may be made to the above-mentioned method embodiments, which will not be elaborated herein.

[0159] The temperature control device according to the embodiments of the present disclosure first determines the load information of the target circuit according to the power consumption value and event information of the target circuit in the first time period, then determines the temperature control threshold according to the load information, and then determines the predicted temperature of the target circuit in the next time period according to the load information, power consumption value and current temperature value, and finally determines the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold. Thus, by determining the load information of the target circuit according to the power consumption value and event information of the target circuit, determining the temperature control threshold according to the load information, then determining the predicted temperature in the next time period according to the load information, power consumption value and current temperature value, and determining the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold, the dynamic temperature control of the circuit is realized, so that the temperature of the circuit is kept in real time within the temperature range that does not affect the system performance, effectively avoiding the situation that the system performance is unstable due to too high or too low circuit temperature, ensuring the performance and stability of the system operation, and improving the accuracy and reliability of temperature control.

[0160] To implement the above embodiments, the present disclosure also proposes a computer-readable storage medium storing a computer program, which when executed by a processor, implements the temperature control method proposed in the foregoing embodiments of the present disclosure.

[0161] Figure 10 It is a schematic structural diagram of a chip proposed in the embodiments of the present disclosure. Reference may be made to Figure 10 the schematic structural diagram of the chip 1000 shown in the figure, but not limited thereto.

[0162] The chip 1000 includes a processing circuit 1001 configured to execute any of the above methods.

[0163] In some embodiments, the chip 1000 further includes one or more interface circuits 1002. Optionally, the interface circuit 1002 is connected to the memory 1003. The interface circuit 1002 can be used to receive signals from the memory 1003 or other devices, and the interface circuit 1002 can be used to send signals to the memory 1003 or other devices. For example, the interface circuit 1002 can read the instructions stored in the memory 1003 and send the instructions to the processing circuit 1001.

[0164] In some embodiments, the interface circuit 1002 executes at least one of the communication steps such as sending and / or receiving in the above method, and the processing circuit 1001 executes other steps.

[0165] In some embodiments, terms such as interface circuit, interface, transceiver pin, transceiver, etc. can be replaced with each other.

[0166] In some embodiments, the chip 1000 further includes one or more memories 1003 for storing instructions. Optionally, all or part of the memories 1003 may be outside the chip 1000.

[0167] To implement the above embodiments, the present disclosure also proposes an electronic device, including a circuit and a temperature control system. The temperature control system is configured to detect the circuit, determine the power consumption value, event information, and temperature value of the circuit in each time period, and determine a temperature control strategy based on the power consumption value, event information, and temperature value of the circuit in each time period to control the circuit.

[0168] It should be noted that the specific type of the electronic device can be determined according to the actual situation. For example, the electronic device can be a mobile phone, a computer, or other electronic devices, and the present disclosure does not limit this.

[0169] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0170] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0171] Any process or method description in the flowchart or described in other ways herein can be understood as representing a module, segment, or part of code including one or more executable instructions for implementing a customized logic function or process, and the scope of the preferred embodiments of the present disclosure includes additional implementations, where the functions may be executed in a substantially simultaneous manner or in an opposite order according to the involved functions, rather than in the order shown or discussed, which should be understood by those skilled in the art of the embodiments of the present disclosure.

[0172] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a definite sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or used in combination with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: an electrical connection portion with one or more wirings (electronic device), a portable computer diskette (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which a program can be printed, because the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or other suitable processing as necessary, and then stored in a computer memory.

[0173] It should be understood that various parts of the present disclosure can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), and the like.

[0174] Those of ordinary skill in the art of this technology can understand that all or part of the steps carried by the method of implementing the above embodiments can be completed by a program instructing relevant hardware, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0175] In addition, each functional unit in various embodiments of the present disclosure may be integrated into a processing module, may exist physically alone for each unit, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. If the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0176] The above-mentioned storage medium may be a read-only memory, a magnetic disk, an optical disc, etc. Although the embodiments of the present disclosure have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present disclosure. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present disclosure.

Claims

1. A temperature control method, characterized in that, Including: Determine the load information of the target circuit according to the power consumption value and event information of the target circuit in the first period; Determine the temperature control threshold according to the load information; Determine the predicted temperature of the target circuit in the next period according to the load information, power consumption value and current temperature value; Determine the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold.

2. The method according to claim 1, characterized in that The determining the load information of the target circuit according to the power consumption value and event information of the target circuit in the first period includes: Determine the load information corresponding to the power consumption value and event information in the first period according to the reference power consumption and reference events associated with each type of load; or, Input the power consumption value and event information into a first preset model to obtain the load information output by the model.

3. The method according to claim 1, characterized in that The determining the predicted temperature of the target circuit in the next period according to the load information, power consumption value and current temperature value includes: Determine the temperature prediction parameter according to the load information; Based on the temperature prediction parameter, current temperature value and power consumption value, determine the predicted temperature in the next period.

4. The method according to claim 1, wherein The determining the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold includes: When the predicted temperature is greater than or equal to the high-temperature control threshold, determine that the temperature control strategy is to reduce the operating voltage and / or frequency of the target circuit; or, When the predicted temperature is less than or equal to the low-temperature control threshold, determine that the temperature control strategy is to increase the operating voltage and / or frequency of the target circuit.

5. The method according to any one of claims 1-4, characterized in that The determining the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold includes: When the predicted temperature is less than the high-temperature control threshold and greater than the low-temperature control threshold, determine that the temperature control strategy is to control the target circuit to operate within the rated voltage and / or rated frequency range.

6. The method according to claim 5, wherein After determining the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold, it further includes: Based on the temperature control strategy, control at least one of the following: the output voltage of the power supply of the target circuit, the frequency of the clock generator associated with the target circuit.

7. A temperature control system, characterized in that, Including: A monitoring unit, a load classification unit, a temperature control threshold determination unit, a temperature prediction unit and a control strategy determination unit connected in sequence; Wherein, the monitoring unit is used to detect the target circuit and determine the power consumption value, event information and temperature value of the target circuit in each period; The load classification unit is used to determine the load information of the target circuit based on the power consumption value and event information in the first period determined by the monitoring unit; The temperature threshold determination unit is used to determine the temperature control threshold according to the load information; The temperature prediction unit is used to determine the predicted temperature of the circuit in the next period according to the load information, power consumption value and current temperature value; The control strategy determination unit is used to determine the temperature control strategy according to the relationship between the predicted temperature and the temperature control threshold.

8. A temperature control device, characterized in that, Including: A first determination module, configured to determine the load information of the target circuit according to the power consumption value and event information of the target circuit in the first period; A second determination module, configured to determine a temperature control threshold according to the load information; A third determination module, configured to determine a predicted temperature of the target circuit in the next time period according to the load information, a power consumption value, and a current temperature value; A fourth determination module, configured to determine a temperature control strategy according to a relationship between the predicted temperature and the temperature control threshold.

9. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, the temperature control method according to any one of claims 1-6 is implemented.

10. A chip, characterized in that, The chip includes a processing circuit, and the processing circuit is configured to execute the temperature control method according to any one of claims 1-6.

11. An electronic device, characterized in that, It includes a circuit and a temperature control system. The temperature control system is configured to detect the circuit, determine a power consumption value, event information, and a temperature value of the circuit in each time period, and determine a temperature control strategy based on the power consumption value, event information, and temperature value of the circuit in each time period to control the circuit.

Images