Chassis and electronic equipment

Abstract

The present application discloses a chassis and electronic equipment, relating to the field of liquid cooling technology. The chassis includes a base plate and a fixed structural member. The base plate includes a liquid cooling area and a liquid retaining wall disposed on the periphery of the liquid cooling area. The liquid cooling area includes a guide groove portion and a raised portion, the raised portion being surrounded by the guide groove portion. The raised portion and the liquid retaining wall both protrude from the upper surface of the guide groove portion, and a guide groove is formed between the upper surface of the guide groove portion, the raised portion, and the liquid retaining wall. The fixed structural member is connected to the top of the raised portion. In this way, the electronic equipment is less likely to malfunction due to leakage from the liquid cooling component.

Description

Technical Field

[0001] The present application relates to the field of liquid cooling technology, and in particular to chassis and electronic equipment. Background Art

[0002] As the performance of electronic devices continues to improve, the heat generated during operation is increasing. Liquid cooling has the advantages of high heat dissipation efficiency and is widely used in electronic devices.

[0003] However, liquid cooling components used for liquid cooling and heat dissipation of electronic equipment are prone to leakage, and electronic equipment is prone to malfunction due to leakage of the liquid cooling components. Summary of the Invention

[0004] The embodiments of the present application provide a chassis and an electronic device to at least solve the problem in the related art that electronic devices are prone to malfunction due to leakage of liquid cooling components.

[0005] An embodiment of the present application provides a chassis comprising a base plate and a fixed structural member. The base plate includes a liquid cooling area and a liquid retaining wall disposed around the liquid cooling area. The liquid cooling area includes a flow guide groove portion and a raised portion, the raised portion being surrounded by the flow guide groove portion. The raised portion and the liquid retaining wall both protrude from the upper surface of the flow guide groove portion, forming a flow guide groove between the upper surface of the flow guide groove portion, the raised portion, and the liquid retaining wall. The fixed structural member is connected to the top of the raised portion.

[0006] An embodiment of the present application further provides an electronic device comprising a heating module, a liquid cooling assembly, and a chassis according to any of the above embodiments. The heating module and the liquid cooling assembly are both disposed within the chassis, the heating module being fixedly connected to a fixed structural member of the chassis, the liquid cooling assembly being in contact with the heating module, and the orthographic projections of the liquid cooling assembly and the heating module on a bottom plate of the chassis being both located within a liquid cooling area of ​​the bottom plate.

[0007] The present invention provides a liquid retaining wall that can prevent the liquid from leaking from the liquid cooling assembly onto the bottom plate from flowing freely, making it difficult for electronic devices located outside the liquid cooling area to be affected by the liquid cooling assembly leakage, thereby reducing the risk of electronic equipment malfunctioning due to liquid cooling assembly leakage. By providing a raised portion and a guide groove portion, and by enclosing the raised portion, the guide groove portion, and the liquid retaining wall to form a guide groove, liquid leakage generated by the liquid cooling assembly can be collected in the guide groove, making it easy to guide the liquid leakage generated by the liquid cooling assembly out of the chassis through the guidance of the guide groove, thereby reducing the risk of electronic equipment malfunctioning due to liquid cooling assembly leakage. In addition, by connecting the fixed structure to the top of the raised portion, while facilitating the stable assembly of the heating module and the bottom plate, liquid leakage generated by the liquid cooling assembly is not easy to flow to the fixed structure and leak from the fixed structure to the bottom of the chassis, thereby not easily causing damage to the device or device located below the chassis. In addition, since the leakage generated by the liquid cooling assembly is not easy to flow to the fixed structure, the sealing requirements at the connection between the fixed structure and the base plate are lower, which makes the connection method between the fixed structure and the base plate more flexible. Furthermore, the fixed structure is connected to the top of the protrusion. While facilitating the stable assembly of the heating module and the base plate, the fixed structure is not likely to block the flow of liquid in the guide groove, making the flow of liquid in the guide groove smoother and facilitating the rapid discharge of liquid in the guide groove. In addition, the formed protrusion can also play a role in increasing the strength of the base plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 An exploded diagram of an electronic device provided in an embodiment of the present application;

[0010] Figure 2 A top view of a base provided in an embodiment of the present application;

[0011] Figure 3 A schematic cross-sectional view of a base provided in an embodiment of the present application;

[0012] Figure 4 for Figure 3 Enlarged view of part A in the middle;

[0013] Figure 5 A top view of an electronic device provided in an embodiment of the present application;

[0014] Figure 6 for Figure 5Enlarged view of middle part B;

[0015] Figure 7 A schematic cross-sectional view of an electronic device provided in an embodiment of the present application;

[0016] Figure 8 for Figure 7 Enlarged view of the middle C section;

[0017] Figure 9 A schematic cross-sectional view of another electronic device provided in an embodiment of the present application;

[0018] Figure 10 for Figure 9 Enlarged view of the middle D part;

[0019] Figure 11 A schematic diagram of a gasket provided in an embodiment of the present application from one perspective;

[0020] Figure 12 A schematic diagram of a gasket provided in an embodiment of the present application from another perspective;

[0021] Figure 13 A schematic diagram of a gasket provided in an embodiment of the present application from another perspective;

[0022] Figure 14 A schematic diagram of a gasket provided in an embodiment of the present application from another perspective;

[0023] Figure 15 A partial top view of a tray provided in an embodiment of the present application.

[0024] The above drawings include the following reference numerals:

[0025] 10. Chassis; 11. Base; 12. Upper cover; 20. Front window module; 30. Rear window module; 40. Heating module; 41. Tray; 42. Mainboard assembly; 421. Mainboard; 422. Heating element; 43. Stud; 44. Screw; 45. Gasket; 451. First structural section; 452. Second structural section; 50. Liquid cooling assembly; 51. Cold plate; 52. Liquid cooling connector; 60. Piping assembly; 70. Guide strip;

[0026] 100, bottom plate; 110, liquid cooling area; 111, guide groove; 112, raised portion; 120, liquid retaining wall; 121, first wall section; 122, second wall section; 123, third wall section; 124, fourth wall section;

[0027] 200, fixed structural parts;

[0028] G1, diversion trough; G2, drainage trough; G3, connecting trough;

[0029] H1, drainage hole; H2, first through hole; H3, second through hole; H4, third through hole; H5, fourth through hole; H6, fifth through hole;

[0030] C. gap. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0032] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0033] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0034] The present invention provides an electronic device, including but not limited to a computing device, a storage device, a switching device, a power supply device, etc. The computing device may be a server, and the present invention is described using the server as an example.

[0035] Figure 1 This is an exploded diagram of an electronic device provided by an embodiment of the present application. In the coordinate system shown, the x arrow points forward, the y arrow points to the right, and the z arrow points upward.

[0036] In some examples, the size of the electronic device in the front-to-back direction is larger than the size of the electronic device in the left-to-right direction. In other examples, the size of the electronic device in the front-to-back direction is smaller than the size of the electronic device in the left-to-right direction.

[0037] like Figure 1 As shown, the electronic device includes a chassis 10, a heating module 40, a liquid cooling assembly 50 and a pipe assembly 60. The heating module 40 and the liquid cooling assembly 50 are both arranged in the chassis 10. The chassis 10 can play the role of carrying and protecting the components arranged in the chassis 10. The liquid cooling assembly 50 is connected to a cold source device arranged outside the chassis 10 through the pipe assembly 60. The liquid cooling assembly 50, the pipe assembly 60 and the cold source device are used to form a coolant circulation loop for circulating coolant. The liquid cooling assembly 50 is in contact with the heating module 40, and the liquid cooling assembly 50 is used to liquid-cool the heating module 40. Specifically, the coolant from the cold source device flows into the liquid cooling assembly 50 through the pipe assembly 60. The coolant flowing into the liquid cooling assembly 50 absorbs the heat generated by the heating module 40. After the coolant that has absorbed the heat generated by the heating module 40 in the liquid cooling assembly 50 flows out of the liquid cooling assembly 50, it flows back to the cold source device through the pipe assembly 60 to dissipate heat.

[0038] Exemplarily, the cold source device may be a cooling distribution unit (CDU).

[0039] Exemplarily, the heating module 40 may be fixedly connected to the chassis 10 .

[0040] Exemplarily, the liquid cooling assembly 50 may be fixedly connected to the heating module 40 and fixed to the chassis 10 through the heating module 40 .

[0041] Exemplarily, the piping assembly 60 includes a built-in liquid inlet pipe, a built-in liquid outlet pipe, an external liquid inlet joint and an external liquid outlet joint. The external liquid inlet joint and the external liquid outlet joint are arranged on the upper part of the chassis 10. The external liquid inlet joint is connected to the outlet of the cold source device, and the external liquid outlet joint is connected to the inlet of the cold source device. The built-in liquid inlet pipe and the built-in liquid outlet pipe are both arranged in the chassis 10. The external liquid inlet joint is connected to the inlet of the liquid cooling assembly 50 through the built-in liquid inlet pipe, and the external liquid outlet joint is connected to the outlet of the liquid cooling assembly 50 through the built-in liquid outlet pipe.

[0042] Exemplarily, the heating module 40 includes a tray 41 and a motherboard assembly 42. The motherboard assembly 42 is fixedly connected to the tray 41, and the tray 41 is fixedly connected to the chassis 10. The tray 41 can improve the strength of the motherboard assembly 42 and protect the motherboard 421. The liquid cooling assembly 50 is in contact with the motherboard assembly 42, and the liquid cooling assembly 50 is used to liquid-cool the motherboard assembly 42.

[0043] Exemplarily, the motherboard assembly 42 includes a motherboard 421 and a heating element 422. The motherboard 421 is fixedly connected to the tray 41. The heating element 422 is disposed on the motherboard 421. The heating element 422 can be located on the side of the motherboard 421 facing away from the tray 41. The motherboard 421 can support the heating element 422 and realize circuit connection. The heating element 422 contacts the liquid cooling assembly 50, which can be used to liquid-cool the heating element 422.

[0044] Exemplarily, a plurality of heat generating devices 422 may be provided on the mainboard 421. Any heat generating device 422 may include, but is not limited to, a central processing unit (CPU), a graphics processing unit (GPU), a memory, etc. For example, the memory may include, but is not limited to, dual-inline-memory modules (DIMMs), etc.

[0045] Exemplarily, the liquid cooling assembly 50 may be fixedly connected to at least one of the mainboard 421 and the heating device 422 .

[0046] Exemplarily, the chassis 10 includes a base 11 and an upper cover 12. The top of the base 11 has an opening, and the upper cover 12 is connected to the top of the base 11. The base 11 and the upper cover 12 together form an inner cavity of the chassis 10. At this time, the components installed in the chassis 10 can be maintained by opening the upper cover 12.

[0047] Exemplarily, the base 11 includes a bottom plate 100, a left side plate and a right side plate, the lower end of the left side plate is fixedly connected to the left end of the bottom plate 100, the lower end of the right side plate is fixedly connected to the right end of the bottom plate 100, the upper end of the left side plate is detachably connected to the left end of the upper cover 12, and the upper end of the right side plate is detachably connected to the right end of the upper cover 12. The bottom plate 100, the left side plate, the right side plate and the upper cover 12 are used to enclose and form the inner cavity of the chassis 10.

[0048] Exemplarily, the heating module 40 is fixedly connected to the base plate 100. Specifically, the tray 41 is fixedly connected to the base plate 100, and the motherboard assembly 42 is located on the side of the tray 41 facing away from the base plate 100. In other words, the motherboard assembly 42 is located above the tray 41. In this case, the motherboard 421 and the heating components 422 provided on the motherboard 421 are both located on the side of the tray 41 facing away from the base plate 100.

[0049] Illustratively, the liquid cooling assembly 50 can be fixed to the base plate 100 through the heating module 40 , and the liquid cooling assembly 50 can be located on the side of the heating module 40 away from the base plate 100 , that is, the liquid cooling assembly 50 can be located above the heating module 40 .

[0050] Exemplarily, the base 11 further includes a fixing structure 200, which is fixedly connected to the bottom plate 100. The heating module 40 is fixedly connected to the fixing structure 200, so that the heating module 40 is fixedly connected to the bottom plate 100 via the fixing structure 200, thereby achieving a stable assembly of the heating module 40 and the bottom plate 100. Specifically, the tray 41 is fixedly connected to the fixing structure 200, so that the tray 41 is fixedly connected to the bottom plate 100 via the fixing structure 200.

[0051] For example, the fixing structure 200 may include but is not limited to an I-nail, a stud, etc. When the fixing structure 200 is a stud, the tray 41 may be fixedly connected to the fixing structure 200 via a threaded connector (eg, a screw) threadedly connected to the fixing structure 200 .

[0052] For example, the motherboard 421 is electrically connected to the tray 41, and the tray 41 is electrically connected to the base plate 100, so that the motherboard assembly 42 is grounded through the base plate 100. For example, the fixing structure 200 can be a conductive member made of metal or other materials, and the tray 41 can be electrically connected to the base plate 100 through the fixing structure 200.

[0053] Exemplarily, the electronic device further includes a front window module 20 and a rear window module 30, which are disposed within the chassis 10, with the front window module 20 disposed in front of the heating module 40 and the rear window module 30 disposed behind the heating module 40. The base 11 further includes a front window structure and a rear window structure, with the front window structure fixedly connected to the front portion of the bottom plate 100 and the rear window structure fixedly connected to the rear portion of the bottom plate 100, and the front window structure and the rear window structure located between the bottom plate 100 and the upper cover 12. The front window module 20 is fixedly connected to the front window structure, and the rear window module 30 is fixedly connected to the rear window structure.

[0054] Exemplarily, the external liquid inlet connector and the external liquid outlet connector may be connected to the rear window structure.

[0055] Exemplarily, the front window module 20 may include one or more of a backplane, a hard disk, a fan, an IO card, and the like.

[0056] Exemplarily, the rear window module 30 may include one or more of a fan, a hard disk, a backplane, an IO card, and the like.

[0057] In the example where the server is a whole cabinet server, the electronic device further includes a cabinet, and the chassis 10 is disposed in the cabinet.

[0058] During the liquid cooling process, the liquid cooling assembly 50 is prone to leaking liquid.

[0059] In related technologies, liquid leaking from the liquid cooling assembly within a chassis can flow freely onto the baseplate, potentially damaging electronic components within the electronic device and causing them to malfunction. Furthermore, liquid leaking from the liquid cooling assembly within the chassis onto the baseplate can easily seep through fixed structural components to the underside of the chassis, potentially damaging devices or components located below.

[0060] Figure 2 A top view of a base provided in an embodiment of the present application is shown. Figure 3 This is a cross-sectional schematic diagram of a base provided in an embodiment of the present application. Figure 4 for Figure 3 Enlarged view of part A in the middle. Figure 2 In the figure, the direction pointed by the dotted arrow is the flow direction of the leaked liquid received in the guide groove G1.

[0061] Based on this, Figure 2As shown, in the embodiment of the present application, the base plate 100 includes a liquid cooling area 110 and a liquid retaining wall 120 disposed outside the liquid cooling area 110. The orthographic projections of the liquid cooling assembly 50 and the heating module 40 on the base plate 100 are both located within the liquid cooling area 110 of the base plate 100. The liquid retaining wall 120 can prevent liquid leaking from the liquid cooling assembly 50 from freely flowing onto the base plate 100, making electronic devices located outside the liquid cooling area 110 less susceptible to liquid leakage from the liquid cooling assembly 50, thereby reducing the risk of electronic equipment malfunctioning due to liquid leakage from the liquid cooling assembly 50.

[0062] For example, the liquid cooling area 110 may be determined according to the arrangement positions of the liquid cooling assembly 50 and the heating module 40 , as long as the orthographic projections of the liquid cooling assembly 50 and the heating module 40 on the base plate 100 are located within the liquid cooling area 110 .

[0063] like Figure 2 、 Figure 4 As shown, the liquid cooling area 110 includes a guide groove portion 111 and a protrusion 112, and the protrusion 112 is surrounded by the guide groove portion 111. The protrusion 112 and the liquid retaining wall 120 both protrude from the upper surface of the guide groove portion 111, and a guide groove G1 is formed between the upper surface of the guide groove portion 111 and the protrusion 112 and the liquid retaining wall 120. The guide groove G1 can be used to accommodate liquid leakage generated at the liquid cooling component 50, and can be used to guide the flow of liquid in the guide groove G1. The fixed structure 200 is connected to the top of the protrusion 112, and the heating module 40 is fixedly connected to the protrusion 112 through the fixed structure 200. Specifically, the tray 41 is fixedly connected to the protrusion 112 through the fixed structure 200.

[0064] In this way, the guide groove G1 is formed by enclosing the raised portion 112, the guide groove portion 111, and the liquid retaining wall 120, so that the leakage generated by the liquid cooling assembly 50 can be collected in the guide groove G1, and the leakage generated by the liquid cooling assembly 50 can be discharged from the chassis 10 through the guidance of the guide groove G1, thereby reducing the risk of electronic equipment malfunctioning due to leakage from the liquid cooling assembly 50. In addition, the fixed structure 200 is connected to the top of the raised portion 112, which facilitates the stable assembly of the heating module 40 and the base plate 100. At the same time, the leakage generated by the liquid cooling assembly 50 is not easy to flow to the fixed structure 200 and leak from the fixed structure 200 to the bottom of the chassis 10, thereby not easily causing damage to the device or device located below the chassis 10. In addition, because the leakage generated by the liquid cooling assembly 50 is not easy to flow to the fixed structure 200, the sealing requirements at the connection between the fixed structure 200 and the base plate 100 are lower, thereby making the connection method of the fixed structure 200 and the base plate 100 more flexible. Furthermore, the fixing structure 200 is connected to the top of the raised portion 112. While facilitating the stable assembly of the heating module 40 and the base plate 100, the fixing structure 200 is unlikely to obstruct the flow of liquid in the guide groove G1, thereby ensuring smoother flow of liquid in the guide groove G1 and facilitating rapid drainage of the liquid in the guide groove G1. Furthermore, the raised portion 112 also serves to increase the strength of the base plate 100.

[0065] Exemplarily, the liquid cooling area 110 includes a plurality of spaced-apart protrusions 112 , with guide grooves 111 between the protrusions 112 . The positions and number of the protrusions 112 can be determined according to the strength requirements of the base plate 100 and the components to be connected (e.g., the heating module 40 ).

[0066] Exemplarily, the chassis 10 has a drainage hole H1 , and the guide groove G1 is connected to the drainage hole H1 , so that the liquid in the guide groove G1 can be discharged from the chassis 10 through the drainage hole H1 .

[0067] For example, a liquid receiving pan may be provided on the outside of the chassis 10 to receive the liquid discharged from the drain hole H1. In other words, the liquid flowing out of the chassis 10 through the drain hole H1 may be received by the liquid receiving pan. For example, the liquid receiving pan may be provided below the drain hole H1.

[0068] In an example where the server is a whole-cabinet server, the liquid collection tray may be disposed inside the cabinet.

[0069] Illustratively, the height of the liquid retaining wall 120 may be greater than or equal to 1 mm, so that the liquid in the guide groove G1 is not likely to overflow from the liquid retaining wall 120 .

[0070] In some examples, the liquid retaining wall 120 may surround the liquid cooling area 110 . In this case, the guide groove portion 111 may be provided with a liquid drain hole H1 .

[0071] In some examples, the liquid retaining wall 120 may surround a portion of the liquid cooling area 110. In this case, the liquid retaining wall 120 may have a notch C connected to the guide groove G1. The drain hole H1 may be located outside the liquid cooling area 110. The guide groove G1 may be connected to the drain hole H1 through the notch C. The leaked liquid in the guide groove G1 may flow to the drain hole H1 through the notch C.

[0072] For example, the bottom plate 100 is formed with a drain groove G2, which is located outside the liquid cooling area 110. The notch C in the liquid retaining wall 120 forms the entrance to the drain groove G2, which is connected to the guide groove G1. A drainage hole H1 is provided in the wall of the drain groove G2. Liquid in the guide groove G1 can flow through the drain groove G2 to the drainage hole H1, which is used to discharge the liquid in the drain groove G2 out of the chassis 10. In other words, leaked liquid in the guide groove G1 can be discharged from the chassis 10 through the drain groove G2 and the drainage hole H1. This facilitates directing the liquid in the guide groove G1 to the drainage hole H1 outside the liquid cooling area 110 for external discharge, making the arrangement of the liquid receiving tray outside the chassis 10 more flexible and convenient.

[0073] Exemplarily, the drainage hole H1 is provided on the bottom plate 100 .

[0074] In some possible embodiments, the bottom surface of the guide groove G1 is a slope, and the bottom surface of the guide groove G1 is used to allow the leaked liquid received in the guide groove G1 to converge to the inlet of the drainage groove G2, so as to facilitate the automatic and rapid discharge of the liquid in the guide groove G1, making it less likely that the electronic equipment will malfunction due to excessive liquid accumulation in the guide groove G1.

[0075] Exemplarily, the bottom surface of the drainage trough G2 is an inclined surface, and the bottom surface of the drainage trough G2 is used to converge the liquid in the drainage trough G2 to the drainage hole H1, so that the liquid flowing into the drainage trough G2 can be automatically and quickly drained out. For example, the drainage hole H1 and the inlet of the drainage trough G2 are respectively located at the two ends of the drainage trough G2, and the bottom surface of the drainage trough G2 gradually decreases in height from the end where the inlet of the drainage trough G2 is located to the end where the drainage hole H1 is located.

[0076] For example, the notch C of the liquid retaining wall 120 is located behind the guide groove G1, and the bottom surface of the guide groove G1 is a sloped surface with a gradually decreasing height from front to back. In this case, the drain hole H1 can be located at the rear end of the bottom plate 100. This facilitates the drainage of liquid in the guide groove G1 to the drain hole H1 at the rear end of the chassis 10, making it easier to arrange a liquid receiving tray outside the chassis 10.

[0077] Exemplarily, the liquid retaining wall 120 includes a first wall section 121, a second wall section 122, a third wall section 123 and a fourth wall section 124, the first wall section 121 is located in front of the liquid cooling area 110 and between the liquid cooling area 110 and the front window module 20, the second wall section 122 is located to the right of the liquid cooling area 110 and between the liquid cooling area 110 and the right side panel, the third wall section 123 is located behind the liquid cooling area 110 and between the liquid cooling area 110 and the rear window module 30, and the fourth wall section 124 is located to the left of the liquid cooling area 110 and between the liquid cooling area 110 and the left side panel. The left and right ends of the first wall segment 121 are connected to the second wall segment 122 and the fourth wall segment 124, respectively. The third wall segment 123 is connected to one of the second wall segment 122 and the fourth wall segment 124. The third wall segment 123 is spaced apart from the other of the second wall segment 122 and the fourth wall segment 124 to form a gap C in the liquid retaining wall 120. For example, the right end of the third wall segment 123 is connected to the second wall segment 122, and the left end of the third wall segment 123 is spaced apart from the fourth wall segment 124 to form a gap C in the liquid retaining wall 120.

[0078] For example, a portion of the fourth wall segment 124 may be located between the right end of the rear window module 30 and the right side panel, a portion of the third wall segment 123 may be located between the right end of the rear window module 30 and the fourth wall segment 124, and at least a portion of the drainage groove G2 may be formed by the bottom plate 100, the portion of the fourth wall segment 124 located between the right end of the rear window module 30 and the right side panel, and the portion of the third wall segment 123 located between the right end of the rear window module 30 and the fourth wall segment 124.

[0079] In some possible implementations, the liquid retaining wall 120 , the guide groove portion 111 , and the protruding portion 112 are an integrated structure.

[0080] In this way, the sealing performance of the connection between the liquid retaining wall 120 and the raised portion 112 and the guide groove portion 111 is better, and the liquid in the guide groove G1 is not easy to flow out of the guide groove G1 through the connection between the liquid retaining wall 120 and the guide groove portion 111, and the connection between the raised portion 112 and the guide groove portion 111, so that the leakage generated by the liquid cooling component 50 is limited in the guide groove G1 and discharged through the guidance of the guide groove G1, which is beneficial to reduce the risk of malfunction of electronic equipment due to leakage of the liquid cooling component 50.

[0081] In some examples where the liquid retaining wall 120, the guide groove portion 111, and the raised portion 112 are an integral structure, at least one of the liquid retaining wall 120 and the raised portion 112 is formed by stamping the lower surface of the base plate 100 using a stamping process. In this case, the liquid retaining wall 120 and the raised portion 112 are arched upward relative to the guide groove portion 111, and the lower surfaces of the liquid retaining wall 120 and the raised portion 112 form a groove structure.

[0082] Like this, base plate 100 is easy to manufacture, and processing cost is lower, and reliability after forming is better.In addition, forming the liquid retaining wall 120 and the raised portion 112 protruding from the upper surface of base plate 100 does not need to increase material, is beneficial to the lightweight design of electronic equipment.

[0083] Illustratively, both the liquid retaining wall 120 and the raised portion 112 are structures formed by stamping the lower surface of the bottom plate 100 using a stamping process.

[0084] For example, the base plate 100 can be made of galvanized steel, so that the base plate 100 has good corrosion resistance and rust resistance. In addition, it is also convenient to form the liquid retaining wall 120 and the protrusion 112 by stamping the base plate 100.

[0085] In some examples where the liquid retaining wall 120 , the guide groove portion 111 and the protruding portion 112 are an integral structure, the liquid retaining wall 120 , the protruding portion 112 and the guide groove portion 111 may also be integrally formed by casting, machining or the like.

[0086] In some possible implementations, the liquid retaining wall 120 may be sealed and connected to the guide groove portion 111 by welding, bonding, etc. In this case, a sealant may be provided between the liquid retaining wall 120 and the guide groove portion 111 .

[0087] In some possible implementations, the protrusion 112 may be sealed and connected to the guide groove 111 by welding, bonding, etc. In this case, a sealant may be provided between the protrusion 112 and the guide groove 111 .

[0088] In some possible implementations, the fixing structure 200 is riveted to the top of the raised portion 112 .

[0089] In this way, liquid leakage from the liquid cooling assembly 50 is less likely to leak from the fixed structure 200 to the bottom of the chassis 10, and the cost of connecting the fixed structure 200 to the base plate 100 is low. In addition, the fixed structure 200 is connected to the raised portion 112 by riveting, and the riveted joint between the fixed structure 200 and the raised portion 112 has a certain sealing effect. If a small amount of liquid flows into the riveted joint between the fixed structure 200 and the raised portion 112, the liquid that has flowed into the fixed structure 200 is less likely to leak through the riveted joint between the fixed structure 200 and the raised portion 112 to the bottom of the chassis 10.

[0090] In other possible implementations, the fixed structure 200 may also be fixedly connected to the base plate 100 by welding or other methods.

[0091] Figure 5 A top view of an electronic device provided in an embodiment of the present application.

[0092] like Figure 5As shown, in some possible embodiments, the liquid cooling assembly 50 includes a cold plate 51 and a liquid cooling connector 52. The cold plate 51 is connected to the pipe assembly 60 via the liquid cooling connector 52. The cold plate 51 contacts the heating module 40 and is used to liquid-cool the heating module 40. Specifically, the cold plate 51 contacts the heating element 422 and is used to liquid-cool the heating element 422.

[0093] For example, the cold plate 51 may be fixedly connected to the heating module 40 . Specifically, the cold plate 51 may be fixedly connected to at least one of the heating device 422 and the main board 421 .

[0094] Exemplarily, the liquid cooling assembly 50 includes a plurality of liquid cooling connectors 52, including a liquid cooling inlet connector and a liquid cooling outlet connector. The inlet of the cold plate 51 is connected to the internal liquid inlet pipe via the liquid cooling inlet connector, and is then connected to the external liquid inlet connector via the internal liquid inlet pipe. The outlet of the cold plate 51 is connected to the internal liquid outlet pipe via the liquid cooling outlet connector, and is then connected to the external liquid outlet connector via the internal liquid outlet pipe.

[0095] Exemplarily, the liquid cooling assembly 50 may include a plurality of cold plates 51 , and the plurality of liquid cooling joints 52 include a plurality of liquid cooling inlet joints corresponding one-to-one to the cold plates 51 , and a plurality of liquid cooling outlet joints corresponding one-to-one to the cold plates 51 .

[0096] In an example where the liquid cooling assembly 50 includes multiple cold plates 51, the multiple liquid cooling connectors 52 may further include liquid separation connectors. The inlets of the multiple cold plates 51 may be connected to the liquid separation connectors via corresponding liquid cooling inlet connectors, and further connected to the built-in liquid inlet pipe via the liquid separation connectors. For example, when the liquid cooling assembly 50 includes two cold plates 51, the liquid separation connector may be a three-way connector, with the three ports of the liquid separation connector respectively connected to the built-in liquid inlet pipe and the corresponding liquid cooling inlet connectors of the two cold plates 51.

[0097] In some examples where the heating module 40 includes a central processing unit, the liquid cooling assembly 50 includes a cold plate 51 for liquid-cooling the central processing unit. The cold plate 51 for liquid-cooling the central processing unit can be called a central processing unit cold plate. The central processing unit cold plate can be located on a side of the central processing unit facing away from the motherboard 421 and in contact with the central processing unit.

[0098] In some examples where the heating module 40 includes a graphics processor, the liquid cooling assembly 50 includes a cold plate 51 for liquid-cooling the graphics processor. The cold plate 51 for liquid-cooling the graphics processor can be called a graphics processor cold plate. The graphics processor cold plate can be located on a side of the graphics processor facing away from the motherboard 421 and in contact with the graphics processor.

[0099] In some examples where the heating module 40 includes memory, the liquid cooling assembly 50 includes a cold plate 51 for liquid cooling the memory. The cold plate 51 for liquid cooling the memory can be called a memory cold plate. The memory cold plate can be located on a side of the memory facing away from the motherboard 421 and in contact with the memory.

[0100] The orthographic projections of all the cold plates 51 and all the liquid cooling joints 52 on the base plate 100 are located within the liquid cooling area 110 .

[0101] Figure 6 for Figure 5 The enlarged view of part B in the middle. Figure 7 A schematic cross-sectional view of an electronic device provided in an embodiment of the present application is shown. Figure 8 for Figure 7 The enlarged view of the middle C part. Figure 7 The cross section in FIG. 1 is a cross section of cutting the first through hole H2.

[0102] Since leakage is likely to occur at the liquid cooling joint 52, Figure 6 、 Figure 8 As shown, the electronic device further includes a guide bar 70 , one end of which is connected to the liquid cooling joint 52 , and the other end of which is located in the guide groove G1 . The guide bar 70 is used to guide the leaked liquid at the liquid cooling joint 52 into the guide groove G1 .

[0103] In this way, if a small amount of liquid leaks from the liquid-cooling connector 52, the leaked liquid can flow along the guide bar 70 into the guide groove G1 and out of the chassis 10 through the guide groove G1. This reduces the risk of leaked liquid from the liquid-cooling connector 52 dripping onto the components below and causing electronic equipment failure. Furthermore, by using the guide bar 70 to direct the leaked liquid from the liquid-cooling connector 52 into the guide groove G1, the arrangement of the guide bar 70 is more flexible, and it is easy to assemble and disassemble, which improves versatility and maintainability.

[0104] For example, the guide bar 70 can be made of a flexible material with low hydrophilicity. For example, the guide bar 70 can be made of a non-hydrophilic material such as silicone or rubber. This allows for more flexible and convenient placement of the guide bar 70 and facilitates directing liquid leaking from the liquid-cooling joint 52 into the guide groove G1.

[0105] For example, when the liquid cooling assembly 50 includes a plurality of liquid cooling joints 52 , each liquid cooling joint 52 may be connected to a guide bar 70 .

[0106] For example, one end of the guide bar 70 may be sleeved on the liquid cooling joint 52 , and the other end of the guide bar 70 may be fixed in the guide groove G1 .

[0107] In some possible embodiments, the mainboard 421 has a first through-hole H2 extending through the upper and lower sides of the mainboard 421. The tray 41 has a second through-hole H3 extending through the upper and lower sides of the tray 41. The guide bar 70 is disposed within the first through-hole H2 and the second through-hole H3. Liquid flowing along the guide bar 70 passes through the first through-hole H2 and the second through-hole H3 before flowing into the guide groove G1.

[0108] In this way, the routing of the guide bar 70 is more convenient, the length of the guide bar 70 is shorter, the path of the liquid flowing along the guide bar 70 is shorter, and the stability of the liquid guidance through the guide bar 70 is better. In addition, the path of the liquid flowing along the guide bar 70 is shorter, making it less likely that the liquid flowing along the guide bar 70 will flow to other devices and cause electronic equipment malfunctions.

[0109] Illustratively, the first through hole H2 and the second through hole H3 are vertically opposite to each other.

[0110] Exemplarily, projections of the first through hole H2 and the second through hole H3 on the bottom plate 100 are both located within the guide groove G1 .

[0111] For example, when the liquid cooling assembly 50 includes multiple liquid cooling connectors 52, the main board 421 may have multiple first through holes H2 corresponding one-to-one to the liquid cooling connectors 52, the tray 41 may have multiple second through holes H3 corresponding one-to-one to the liquid cooling connectors 52, and the guide bar 70 connected at the liquid cooling connector 52 is passed through the corresponding first through hole H2 and the corresponding second through hole H3.

[0112] For example, the guide bar 70 is spaced apart from the hole wall of the first through hole H2, so that the liquid flowing along the guide bar 70 is not easily flowed onto the main board 421 when passing through the first through hole H2, and the problem of electronic equipment failure caused by the liquid flowing along the guide bar 70 flowing onto the main board 421 is not easily caused.

[0113] Exemplarily, both ends of the guide bar 70 may be fixed to the liquid cooling joint 52 and the wall of the guide groove G1 respectively, and the guide bar 70 may be spaced apart from the wall of the first through hole H2 by controlling the length of the guide bar 70 .

[0114] Figure 9 This is a cross-sectional schematic diagram of another electronic device provided in an embodiment of the present application. Figure 10 for Figure 9 The enlarged view of the middle D part, Figure 11-14 Schematic diagrams of several different viewing angles of a gasket provided in an embodiment of the present application, Figure 15 This is a partial top view of a tray provided in an embodiment of the present application. Figure 9 The cross section in FIG. 1 is a cross section of cutting the third through hole H4. Figure 12 Schematic diagram of the gasket 45 facing the main board 421, Figure 13 Schematic diagram of the side of the gasket 45 facing away from the main board 421. Figure 14 45 is a side view of the gasket.

[0115] In some possible implementations, such as Figure 10 As shown, the main board 421 of the heating module 40 has a third through hole H4, which runs through the upper and lower sides of the main board 421. The third through hole H4 is used to allow the liquid on the upper surface of the main board 421 to flow to the tray 41 of the heating module 40. Figure 15 As shown, the tray 41 has a fourth through hole H5 , which passes through the upper and lower sides of the tray 41 . The fourth through hole H5 is used to allow liquid on the upper surface of the tray 41 to flow to the liquid cooling area 110 .

[0116] In this way, it is convenient for the liquid on the upper surface of the mainboard 421 and the liquid on the upper surface of the tray 41 to flow quickly into the guide groove G1 and be discharged from the chassis 10 through the guide groove G1, so that it is not easy for liquid to accumulate on the upper surface of the mainboard 421 and the upper surface of the tray 41, and the electronic equipment is not likely to malfunction due to liquid accumulation on the upper surface of the mainboard 421 and the upper surface of the tray 41.

[0117] In some possible implementations, at least a portion of the orthographic projection of the fourth through hole H5 on the bottom plate 100 is located within the guide groove G1 of the chassis 10 , so that liquid flowing out of the fourth through hole H5 can quickly flow into the guide groove G1 .

[0118] For example, the orthographic projection of the fourth through hole H5 on the base plate 100 is located in the guide groove G1 of the chassis 10, so that the liquid flowing out of the fourth through hole H5 is not easy to flow to the fixed structure 200 provided on the raised portion 112, and the problem of liquid leaking to the bottom of the chassis 10 at the fixed structure 200 is not easy to occur.

[0119] like Figure 10 As shown, in some possible embodiments, a stud 43 is provided on the tray 41, a screw 44 is passed through the third through hole H4, and the screw 44 is threadedly connected to the stud 43. The mainboard 421 and the tray 41 are fixedly connected by the screw 44 and the stud 43. A gasket 45 is provided between the screw 44 and the upper surface of the mainboard 421, and between the lower surface of the mainboard 421 and the upper surface of the tray 41.

[0120] like Figure 10 、 Figure 11 As shown, the gasket 45 has a connecting groove G3 on the side facing the main board 421 . The connecting groove G3 passes through the outer peripheral surface of the gasket 45 . The connecting groove G3 is connected to the third through hole H4 . The connecting groove G3 is also connected to the space radially outside the gasket 45 .

[0121] like Figure 15 As shown, at least a portion of the fourth through hole H5 is disposed outside the stud 43 .

[0122] like Figure 10 、 Figure 15 As shown, the connecting groove G3 of the gasket 45 provided between the screw 44 and the upper surface of the mainboard 421, the third through hole H4, the connecting groove G3 of the gasket 45 provided between the lower surface of the mainboard 421 and the upper surface of the tray 41, and the fourth through hole H5 are connected in sequence to form a flow channel for the liquid located on the upper surface of the mainboard 421 to flow to the liquid cooling area 110. The liquid on the upper surface of the mainboard 421 can flow to the upper surface of the tray 41 through the connecting groove G3 of the gasket 45 provided between the screw 44 and the upper surface of the mainboard 421, the third through hole H4, and the connecting groove G3 of the gasket 45 provided between the lower surface of the mainboard 421 and the upper surface of the tray 41. The liquid on the upper surface of the tray 41 can flow to the liquid cooling area 110 through the fourth through hole H5.

[0123] In this way, the third through hole H4, in addition to being used for fluid diversion, also serves to connect the mainboard 421 to the tray 41, resulting in fewer openings on the mainboard 421, which facilitates wiring and device layout within the mainboard 421. Providing the connecting groove G3 on the gasket 45 facilitates secure connection between the mainboard 421 and the tray 41 via the screws 44 and studs 43, while also allowing the area above the mainboard 421 to communicate with the area between the mainboard 421 and the tray 41 via the third through hole H4. This facilitates the flow of liquid on the upper surface of the mainboard 421 through the third through hole H4 to the upper surface of the tray 41.

[0124] Illustratively, the lower surface of the main board 421 is spaced apart from the upper surface of the tray 41 , so that the liquid accumulated on the upper surface of the tray 41 is unlikely to affect the main board 421 .

[0125] Exemplarily, the screws 44 , the studs 43 and the washers 45 are all made of conductive materials such as metal, and the mainboard 421 is electrically connected to the tray 41 through the screws 44 , the studs 43 and the washers 45 so as to achieve grounding through the tray 41 .

[0126] like Figure 11 As shown, the gasket 45 has a fifth through hole H6 , which passes through both sides of the gasket 45 in the thickness direction, and the screw 44 is passed through the fifth through hole H6 .

[0127] like Figure 11-14 As shown, in some possible implementations, the side of the communication groove G3 facing away from the main board 421 is a sealing structure.

[0128] In this way, the gasket 45 has better strength, making it less likely for the gasket 45 to be deformed due to extrusion, which is beneficial to maintaining the connectivity of the connecting groove G3.

[0129] Illustratively, the gasket 45 includes a first structural segment 451 and a second structural segment 452. The first structural segment 451 and the second structural segment 452 are arranged along the thickness direction of the gasket 45. The first structural segment 451 is used to abut against the main board 421, and the second structural segment 452 is used to abut against the stud 43 or the screw head of the screw 44. The communication groove G3 is provided in the first structural segment 451, and the second structural segment 452 covers the side of the communication groove G3 facing away from the main board 421.

[0130] In some possible implementations, one end of the communicating groove G3 close to the central axis of the gasket 45 is a sealed structure.

[0131] In this way, the gasket 45 has better strength, making it less likely for the gasket 45 to be deformed due to extrusion, which is beneficial to maintaining the connectivity of the connecting groove G3.

[0132] In some other possible implementations, the communication groove G3 may pass through both sides of the gasket 45 in the thickness direction.

[0133] In some other possible implementations, one end of the communicating groove G3 close to the central axis of the gasket 45 is an open structure, that is, one end of the communicating groove G3 close to the central axis of the gasket 45 is connected to the fifth through hole H6.

[0134] like Figure 15 As shown, in some possible embodiments, the gasket 45 has a plurality of communication grooves G3 spaced apart along the circumference of the gasket 45, so that the liquid on the upper surface of the mainboard 421 can quickly flow through the third through-holes H4 to the upper surface of the tray 41. The tray 41 is provided with a plurality of fourth through-holes H5 spaced apart along the circumference of the studs 43, so that the liquid on the upper surface of the tray 41 can quickly flow through the fourth through-holes H5 to the liquid cooling area 110.

[0135] Exemplarily, the orthographic projection of the stud 43 on the base plate 100 is located within the guide groove G1, so that the orthographic projection of the fourth through hole H5 arranged around the stud 43 on the base plate 100 is located within the guide groove G1, thereby facilitating the rapid flow of liquid flowing out of the fourth through hole H5 into the guide groove G1.

[0136] The cooling device and electronic device provided by the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A chassis (10), characterized in that: It includes a bottom plate (100) and a fixed structural member (200); The bottom plate (100) includes a liquid cooling area (110) and a liquid retaining wall (120) disposed on the periphery of the liquid cooling area (110); The liquid cooling area (110) includes a guide groove portion (111) and a raised portion (112), the raised portion (112) is surrounded by the guide groove portion (111), the raised portion (112) and the liquid retaining wall (120) both protrude from the upper surface of the guide groove portion (111), and a guide groove (G1) is formed between the upper surface of the guide groove portion (111), the raised portion (112) and the liquid retaining wall (120); The fixed structural member (200) is connected to the top of the raised portion (112); The bottom plate (100) is formed with a drainage groove (G2), the drainage groove (G2) is located outside the liquid cooling area (110), and the inlet of the drainage groove (G2) is connected to the guide groove (G1); The bottom surface of the guide groove (G1) is an inclined surface, and the bottom surface of the guide groove (G1) is used to allow the leaked liquid received in the guide groove (G1) to converge to the inlet of the drainage groove (G2). The bottom plate (100) is provided with a drainage hole (H1).

2. The chassis (10) according to claim 1, characterized in that The liquid retaining wall (120), the guide groove portion (111) and the raised portion (112) are an integrated structure.

3. The chassis (10) according to claim 2, characterized in that At least one of the liquid retaining wall (120) and the raised portion (112) is a structure formed by stamping the lower surface of the bottom plate (100) using a stamping process.

4. The chassis (10) according to any one of claims 1 to 3, characterized in that: The fixing structure (200) is riveted to the top of the raised portion (112).

5. The chassis (10) according to any one of claims 1 to 3, characterized in that: The liquid retaining wall (120) has a notch (C), the notch (C) is located behind the guide groove (G1), and the notch (C) forms the inlet of the drainage groove (G2); The bottom surface of the guide groove (G1) is a slope whose height gradually decreases from front to back.

6. An electronic device, characterized in that: Comprising a heating module (40), a liquid cooling component (50), and a chassis (10) according to any one of claims 1 to 5; The heating module (40) and the liquid cooling assembly (50) are both arranged in the chassis (10), the heating module (40) is fixedly connected to the fixed structural member (200) of the chassis (10), the liquid cooling assembly (50) is in contact with the heating module (40), and the orthographic projections of the liquid cooling assembly (50) and the heating module (40) on the bottom plate (100) of the chassis (10) are both located in the liquid cooling area (110) of the bottom plate (100).

7. The electronic device according to claim 6, wherein: Also included is a pipeline assembly (60) and a guide strip (70); The liquid cooling assembly (50) comprises a cold plate (51) and a liquid cooling joint (52), and the cold plate (51) is connected to the pipeline assembly (60) via the liquid cooling joint (52); One end of the guide bar (70) is connected to the liquid cooling joint (52), and the other end of the guide bar (70) is located in the guide groove (G1) of the chassis (10). The guide bar (70) is used to guide the leaked liquid at the liquid cooling joint (52) into the guide groove (G1).

8. The electronic device according to claim 7, wherein: The heating module (40) includes a tray (41) and a mainboard (421); The tray (41) is fixedly connected to the fixed structure (200), the main board (421) is fixedly connected to the tray (41), and the main board (421) is located on a side of the tray (41) facing away from the bottom board (100); The main board (421) has a first through hole (H2), the tray (41) has a second through hole (H3), and the guide bar (70) is provided through the first through hole (H2) and the second through hole (H3); The guide bar (70) is spaced apart from the hole wall of the first through hole (H2).

9. The electronic device according to claim 8, wherein: The main board (421) of the heating module (40) has a third through hole (H4), and the third through hole (H4) is used to allow liquid located on the upper surface of the main board (421) to flow to the tray (41) of the heating module (40). The tray (41) has a fourth through hole (H5), and the fourth through hole (H5) is used to allow liquid on the upper surface of the tray (41) to flow to the liquid cooling area (110).

10. The electronic device according to claim 9, wherein: At least part of the orthographic projection of the fourth through hole (H5) on the bottom plate (100) is located in the guide groove (G1) of the chassis (10).

11. The electronic device according to claim 9, wherein: The tray (41) is provided with a stud (43), the third through hole (H4) is penetrated by a screw (44), the screw (44) is threadedly connected to the stud (43), the main board (421) and the tray (41) are fixedly connected by the screw (44) and the stud (43), and the lower surface of the main board (421) is spaced apart from the upper surface of the tray (41); Gaskets (45) are provided between the screws (44) and the upper surface of the main board (421), and between the lower surface of the main board (421) and the upper surface of the tray (41); The gasket (45) has a communication groove (G3) on a side facing the main board (421), the communication groove (G3) passes through the outer peripheral surface of the gasket (45), and the communication groove (G3) is connected to the third through hole (H4); At least a portion of the fourth through hole (H5) is provided on the outside of the stud (43); The connecting groove (G3) of the gasket (45) provided between the screw (44) and the upper surface of the main board (421), the third through hole (H4), the connecting groove (G3) of the gasket (45) provided between the lower surface of the main board (421) and the upper surface of the tray (41), and the fourth through hole (H5) are connected in sequence to form a flow channel for the liquid located on the upper surface of the main board (421) to flow to the liquid cooling area (110).

12. The electronic device according to claim 11, wherein: The side of the communicating groove (G3) facing away from the main board (421) is a sealing structure.

13. The electronic device according to claim 11, wherein: One end of the communicating groove (G3) close to the central axis of the gasket (45) is a sealing structure.

14. The electronic device according to claim 11, wherein: The gasket (45) has a plurality of communicating grooves (G3) arranged at intervals along the circumference of the gasket (45); The tray (41) is provided with a plurality of fourth through holes (H5) spaced apart along the circumference of the stud (43).

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