Preparation method of pure tungsten material thin-wall structure based on additive manufacturing and electronic equipment

Abstract

The invention discloses a preparation method of a pure tungsten material thin-wall structure based on additive manufacturing and electronic equipment, and relates to the technical field of additive manufacturing. The method comprises the steps of performing product partitioning based on structural features of a part three-dimensional model to obtain an initial part three-dimensional model structure with a grid remaining part removed; entity support adding processing is conducted on the initial part three-dimensional model structure, and a target part three-dimensional model structure is obtained; generating a block-shaped support according to a preset grid size based on the three-dimensional model structure of the target part; the block-shaped support is guided out, the corresponding upper solid support part in the solid support is cut, and the block-shaped support is guided in; and the pure tungsten material thin-wall structure is prepared. Product partitioning is carried out on the structural characteristics of the three-dimensional model of the part, an internal entity part is optimized into a block-shaped support, the block-shaped support is a linear scanning path and is a single strip, and related processing data only comprise corresponding conventional simple data in the printing process, so that the quality of a printed finished product can be optimized.

Description

Technical Field

[0001] This application relates to the field of additive manufacturing technology, and particularly to a preparation method for a thin-walled structure of pure tungsten material based on additive manufacturing and an electronic device. Background Art

[0002] Selective laser melting (SLM for short) is a widely used and highly mature process method. Based on the basic idea of rapid prototyping, it adopts an additive manufacturing method of layer-by-layer cladding. According to the three-dimensional model of the part, the model is sliced and layered by a certain thickness, and then under the control of the numerical control system, a laser is used to control the melting of metal powder through a galvanometer scanner to directly form a part with a specific geometric shape. During the SLM forming process, the metal powder is completely melted to produce metallurgical bonding. The formed part has good density, high tissue performance, etc., and can form high-precision complex-shaped metal parts.

[0003] With the increasing maturity of selective laser melting technology, its application fields are becoming more and more extensive, and more and more new materials are being used in selective laser melting technology. More and more parts that cannot be realized by traditional processes are manufactured by selective laser melting technology. As the technology matures and industrializes, more and more parts are mass-produced through selective laser melting technology.

[0004] Tungsten, as the metal with the highest melting point, has its unique physical and chemical properties. Tungsten and its alloys are widely used in many fields such as lighting engineering, electronics, manufacturing, aerospace, military, medical, and nuclear industries. In the medical field, this material is often used to prepare anti-scattering grids for absorbing scattered X-rays to improve imaging quality. Traditional grid parts are prepared by traditional forming methods such as powder metallurgy. They are traditionally processed and formed through processes such as powder metallurgy billet making, extrusion, forging, rolling, spinning, and drawing. The cost is high and the cycle is long. At the same time, there are restrictions on the complexity of the part structures that can be formed.

[0005] In recent years, the selective laser melting process has been applied to the preparation of tungsten grid parts. However, due to the small wall thickness of the grid, high dimensional accuracy, low overall stiffness of the part, it is very easy to cause dimensional tolerance and grid structure damage during the printing forming and post-processing processes. The qualified rate is low and the cost is high, which limits the application and popularization of this technology. Summary of the Invention

[0006] The purpose of this application is to provide a preparation method for a thin-walled structure of pure tungsten material based on additive manufacturing and an electronic device to solve the problems that the existing parts have low overall stiffness, are very easy to cause dimensional tolerance and grid structure damage during the printing forming and post-processing processes, the qualified rate is low, the cost is high, and the application and popularization of this technology are limited.

[0007] In a first aspect, the present application provides a method for preparing a thin-walled structure of pure tungsten material based on additive manufacturing, including:

[0008] Obtain a three-dimensional model of a grid part input by the user;

[0009] Perform product zoning based on the structural features of the three-dimensional model of the part to obtain an initial three-dimensional model structure of the part with the grid removed and the remaining part retained;

[0010] Perform entity support addition processing on the initial three-dimensional model structure of the part to obtain a target three-dimensional model structure of the part;

[0011] After exporting the target three-dimensional model structure of the part, generate a block support based on the target three-dimensional model structure according to a preset grid size;

[0012] Export the block support, cut the corresponding upper entity support part in the entity support and import the block support to obtain a part with the block support added;

[0013] Import the part with the block support added into the equipment, use a substrate fixture to clamp the substrate of the part with the block support added, and complete the powder cleaning process;

[0014] After completing the powder cleaning process, sequentially perform preset manufacturing process steps to prepare the thin-walled structure of pure tungsten material.

[0015] In the case of adopting the above technical solution, the preparation method of the pure tungsten material thin-walled structure based on additive manufacturing provided by the embodiment of the present application includes: obtaining a three-dimensional model of a grid part input by a user; performing product zoning based on the structural features of the three-dimensional model of the part to obtain an initial three-dimensional model structure of the part with the grid removed and the remaining part retained; performing entity support addition processing on the initial three-dimensional model structure of the part to obtain a target three-dimensional model structure of the part; after exporting the target three-dimensional model structure of the part, generating a block support according to a preset grid size based on the target three-dimensional model structure of the part; exporting the block support, cutting the corresponding upper entity support part in the entity support and importing the block support to obtain a part after adding the block support; importing the part after adding the block support into a device, and using a substrate fixture to clamp the substrate of the part with the block support to complete the powder cleaning process; after completing the powder cleaning process, sequentially performing preset manufacturing process steps to prepare the pure tungsten material thin-walled structure. Since the product zoning is performed on the structural features of the three-dimensional model of the part and the internal entity part is optimized into a block support, without changing its overall structure, since the block support is a linear scanning path and it is a single strip, the relevant processing data is only the corresponding conventional simple data during the printing process, such as the adjustment of printing speed, printing power, etc. In the case where the overall stiffness of the part is low, the quality of the printed product is optimized. And since the block support is exported, the corresponding upper entity support part in the entity support is cut and the block support is imported to obtain a part after adding the block support, and then the part after adding the block support is imported into the device, the size of the block support can be kept consistent without replacement. After exporting the block support, corresponding stretching and other process treatments can be performed on the upper entity support or other entity parts, and finally the block support is imported. The block support does not need to be repeatedly prepared, ensuring the dimensional accuracy of the part during the preparation process, enabling it to be integrally formed by the selective laser melting forming process, with simple subsequent processing procedures, cost savings, and further cycle shortening. It has extremely high efficiency and qualification rate for batch printing and forming corresponding parts.

[0016] In one possible implementation manner, the performing product zoning based on the structural features of the three-dimensional model of the part to obtain an initial three-dimensional model structure of the part with the grid removed and the remaining part retained includes:

[0017] Based on the structural features of the three-dimensional model of the part, determining the entity structure as the installation area and the non-entity area as the grid core area;

[0018] Removing the grid core area to obtain the initial three-dimensional model structure of the part with the grid removed and the remaining part retained.

[0019] In a possible implementation, importing the part with the block support added into the device, clamping the substrate of the part with the block support using a substrate fixture, and completing the powder cleaning process includes:

[0020] Performing slicing on the part with the block support added, and importing it into the corresponding printing device for thin-wall printing;

[0021] Using a substrate fixture to hold the substrate of the part with the block support added, and completing the powder cleaning process through multi-angle vibration.

[0022] In a possible implementation, performing slicing on the part with the block support added, and importing it into the corresponding printing device for thin-wall printing includes:

[0023] Adjusting the printing parameter power of the printing device to a preset printing power;

[0024] Adjusting the printing speed of the printing device to a preset printing speed;

[0025] At the preset printing power and the preset printing speed, performing slicing on the part with the block support added, and importing it into the corresponding printing device for thin-wall printing.

[0026] In a possible implementation, after completing the powder cleaning process, successively performing preset manufacturing process steps to obtain the pure tungsten material thin-wall structure includes:

[0027] Using an ultrasonic cleaning machine to clean the floating powder on the surface of the part;

[0028] Putting the part with the substrate into the furnace for annealing heat treatment;

[0029] Taking down the part using medium wire electrical discharge machining;

[0030] Adopting pickling to clean the remaining stubborn sticking powder;

[0031] Using an ultrasonic cleaning agent to clean for a preset duration to remove the residual acid solution;

[0032] Performing drying treatment to obtain the pure tungsten material thin-wall structure.

[0033] In a possible implementation, taking down the part using medium wire electrical discharge machining includes:

[0034] Clamping the substrate on one side, and using a fixing tool such as a chuck to fix the other side of the block support of the part on the other side, and taking down the part using medium wire electrical discharge machining.

[0035] In a possible implementation, taking down the part using medium wire electrical discharge machining includes:

[0036] Fill the position of the block-shaped support void with a preset organic substance, and cut the part using medium wire;

[0037] Lift the cut part using a spacer block;

[0038] Clear the preset organic substance by heating in a low-temperature oven.

[0039] In a possible implementation, after cleaning the surface powder of the part using an ultrasonic cleaning agent and before annealing the part with the substrate in a furnace, the method further includes:

[0040] Dry the part for a preset drying duration at a preset drying temperature using a dryer.

[0041] In a possible implementation, annealing the part with the substrate in a furnace includes:

[0042] Perform annealing heat treatment with air cooling at a preset annealing temperature range for a preset annealing duration on the part with the substrate in a furnace.

[0043] In a second aspect, the present application further provides an electronic device, including: one or more processors; and one or more machine-readable media storing instructions thereon, which when executed by the one or more processors, cause the preparation method of a pure tungsten material thin-walled structure based on additive manufacturing described in any possible implementation of the first aspect to be executed.

[0044] The beneficial effects of the electronic device provided in the second aspect are the same as those of the preparation method of the pure tungsten material thin-walled structure based on additive manufacturing described in the first aspect or any possible implementation of the first aspect, and will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation to the present application. In the drawings:

[0046] Figure 1 Shows a schematic flowchart of a preparation method of a pure tungsten material thin-walled structure based on additive manufacturing provided by an embodiment of the present application;

[0047] Figure 2 Shows a schematic flowchart of another preparation method of a pure tungsten material thin-walled structure based on additive manufacturing provided by an embodiment of the present application;

[0048] Figure 3 Shows a schematic structural diagram of a grid part provided by an embodiment of the present application;

[0049] Figure 4 Shows a schematic structural diagram of a three-dimensional model of a grille part provided by an embodiment of the present application;

[0050] Figure 5 Shows a schematic diagram of the structure of an initial part three-dimensional model after removing the remaining part of the grille provided by an embodiment of the present application;

[0051] Figure 6 Shows a schematic diagram of the structure of a target part three-dimensional model after adding an entity support provided by an embodiment of the present application;

[0052] Figure 7 Shows a schematic diagram of the structure of a part after adding a block support provided by an embodiment of the present application;

[0053] Figure 8 Shows a schematic diagram of the structure of another part after adding a block support provided by an embodiment of the present application;

[0054] Figure 9 Shows a schematic diagram of the structure of a substrate fixture provided by an embodiment of the present application;

[0055] Figure 10 Is a schematic hardware structure diagram of an electronic device provided by an embodiment of the present application;

[0056] Figure 11 Is a schematic diagram of the structure of a chip provided by an embodiment of the present application. Detailed implementation manners

[0057] For the convenience of clearly describing the technical solutions of the embodiments of the present application, in the embodiments of the present application, terms such as "first" and "second" are used to distinguish the same items or similar items with basically the same functions and effects. For example, the first threshold and the second threshold are only used to distinguish different thresholds, and do not limit their sequence. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and terms such as "first" and "second" do not necessarily limit to be different.

[0058] It should be noted that in the present application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly speaking, using words such as "exemplary" or "for example" aims to present relevant concepts in a specific way.

[0059] In this application, "at least one" means one or more, and "a plurality" means two or more. "And / or" describes the relationship between related objects and indicates that there can be three relationships. For example, A and / or B can represent: A exists alone, both A and B exist simultaneously, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the related objects before and after are in an "or" relationship. "At least one (item)" or a similar expression refers to any combination of these items, including any combination of single item(s) or multiple item(s). For example, at least one (item) of a, b, or c can represent: a, b, c, the combination of a and b, the combination of a and c, the combination of b and c, or the combination of a, b, and c, where a, b, and c can be single or multiple.

[0060] Figure 1 FIG. shows a schematic flow chart of a preparation method for a thin-walled structure of pure tungsten material based on additive manufacturing provided by an embodiment of the present application. As Figure 1 shown, the preparation method for the thin-walled structure of pure tungsten material based on additive manufacturing includes:

[0061] Step 101: Obtain a three-dimensional model of a grid part input by the user.

[0062] In this application, the manufacturing method is the selective laser melting forming method. The selective laser melting forming uses pure tungsten spherical powder with a raw material specification of 0 to 25 micrometers (μm), and the substrate used in the selective laser melting forming is a tungsten or tungsten alloy substrate, which can ensure a tight combination with the formed part.

[0063] Step 102: Perform product zoning based on the structural features of the three-dimensional model of the part to obtain an initial three-dimensional model structure of the part with the grid removed and the remaining part retained.

[0064] In this application, the grid core area can be removed to obtain the initial three-dimensional model structure of the part with the grid removed and the remaining part retained; the grid core area is removed to obtain the initial three-dimensional model structure of the part with the grid removed and the remaining part retained.

[0065] Step 103: Perform entity support addition processing on the initial three-dimensional model structure of the part to obtain a target three-dimensional model structure of the part.

[0066] Step 104: After exporting the target three-dimensional model structure of the part, generate a block support based on the target three-dimensional model structure according to a preset grid size.

[0067] Step 105: Export the block support, cut the corresponding upper entity support part in the entity support, and import the block support to obtain the part after adding the block support.

[0068] In the present application, the block support can be derived, the corresponding upper solid support part in the solid support can be cut and the block support can be introduced to obtain the part after adding the block support.

[0069] Step 106: Introduce the part after adding the block support into the device, and use the substrate fixture to clamp the substrate of the part with the block support, and complete the powder cleaning process.

[0070] In the present application, the part after adding the block support can be sliced, introduced into the corresponding printing device for thin-wall printing, the substrate of the part with the block support is clamped by the substrate fixture, and the powder cleaning process is completed by multi-angle vibration.

[0071] Step 107: After completing the powder cleaning process, the preset manufacturing process steps are sequentially carried out to prepare the pure tungsten material thin-wall structure.

[0072] The preparation method of the pure tungsten material thin-walled structure based on additive manufacturing provided by the embodiment of the present application includes: obtaining a three-dimensional model of a grid part input by a user; performing product zoning based on the structural features of the three-dimensional model of the part to obtain an initial three-dimensional model structure of the part with the grid removed and the remaining part retained; performing entity support addition processing on the initial three-dimensional model structure of the part to obtain a target three-dimensional model structure of the part; after exporting the target three-dimensional model structure of the part, generating a block support according to a preset grid size based on the target three-dimensional model structure; exporting the block support, cutting the corresponding upper entity support part in the entity support and importing the block support to obtain a part with the block support added; importing the part with the block support added into the equipment, using a substrate fixture to clamp the substrate of the part with the block support, and completing the powder cleaning process; after completing the powder cleaning process, sequentially performing preset manufacturing process steps to prepare the pure tungsten material thin-walled structure. Since product zoning is performed on the structural features of the three-dimensional model of the part and the internal entity part is optimized into a block support, without changing its overall structure, because the block support is a linear scanning path and it is a single strip, the relevant processing data are only the corresponding conventional simple data during the printing process, such as the adjustment of printing speed, printing power, etc. When the overall stiffness of the part is low, the quality of the printed product is optimized. And because the block support is exported, the corresponding upper entity support part in the entity support is cut and the block support is imported to obtain a part with the block support added, and then the part with the block support added is imported into the equipment, the size of the block support can be kept consistent and there is no need to replace it. After exporting the block support, corresponding stretching and other process treatments can be performed on the upper entity support or other entity parts, and finally the block support is imported. The block support does not need to be repeatedly prepared, which ensures the dimensional accuracy of the part during the preparation process, enables it to be integrally formed by the selective laser melting forming process, the subsequent processing procedures are simple, cost is saved, and the cycle can be further shortened. It has extremely high efficiency and qualification rate for batch printing and forming corresponding parts.

[0073] Optionally, Figure 2 The flowchart showing another preparation method of the pure tungsten material thin-walled structure based on additive manufacturing provided by the embodiment of the present application is shown in Figure 2 The preparation method of the pure tungsten material thin-walled structure based on additive manufacturing includes:

[0074] Step 201: Obtain a three-dimensional model of a grid part input by a user.

[0075] In the present application, the manufacturing method is the selective laser melting forming method. The selective laser melting forming uses pure tungsten spherical powder with a raw material specification of 0 to 25 micrometers (μm), and the selective laser melting forming uses a substrate made of tungsten or tungsten alloy substrate, which can ensure tight bonding with the formed part.

[0076] Optionally, Figure 3 The structural schematic diagram of a grille part provided by an embodiment of the present application is shown. As Figure 3 shown, the wall thickness of the grille part is 0.08 to 0.15 millimeters, the spacing between adjacent grilles is 0.5 to 5.0 millimeters, and the wall thickness on one side of the long side of the grille is larger, being 1.0 to 5.0 millimeters.

[0077] Figure 4 The structural schematic diagram of a three-dimensional model of a grille part provided by an embodiment of the present application is shown. As Figure 4 shown, the three-dimensional model of the grille part can be drawn according to the drawing size requirements of the part.

[0078] Step 202: Based on the structural features of the three-dimensional model of the part, determine the solid structure as the installation area and the non-solid area as the grille core area.

[0079] In the present application, the solid structure in the three-dimensional model of the part can be determined as the installation area, and the non-solid area can be determined as the grille core area.

[0080] Exemplarily, in the present application, the middle area is also the non-solid area, which is the grille core area; the two sides are the solid areas, which are the installation areas.

[0081] Step 203: Remove the grille core area to obtain the initial part three-dimensional model structure with the grille removed and the remaining part retained.

[0082] Figure 5 The structural schematic diagram of an initial part three-dimensional model structure after removing the grille and retaining the remaining part provided by an embodiment of the present application is shown. As Figure 5 shown, the grille core area, that is, the non-solid area in the middle area, can be removed to obtain the initial part three-dimensional model structure with the grille removed and the remaining part retained.

[0083] Step 204: Perform solid support addition processing on the initial part three-dimensional model structure to obtain the target part three-dimensional model structure.

[0084] Figure 6 The structural schematic diagram of a target part three-dimensional model structure after adding solid support provided by an embodiment of the present application is shown. Solid support can be added to Figure 5 the initial part three-dimensional model structure shown as Figure 6 shown to obtain the target part three-dimensional model structure shown as

[0085] Step 205: After exporting the target part three-dimensional model structure, generate block supports based on the target part three-dimensional model structure according to the preset grille size.

[0086] In this application, the three-dimensional model structure of the target part can be exported. Among them, both the triangular tolerance and the adjacent tolerance are set to 0.0025. The embodiments of this application do not make specific limitations on this either, and specific settings can be made according to the actual application scenario.

[0087] Further, Figure 7 The schematic diagram of the part structure after adding the block support provided by the embodiment of this application is shown. The three-dimensional model structure of the target part can be opened, and the block support 01 is generated according to the preset grid size.

[0088] Optionally, the preset grid size can be a size of 1*1 mm for each grid, or a size of 10*10 mm. The embodiments of this application do not make specific limitations on the specific grid size. It can be between 1*1 mm and 10*10 mm, or other specific sizes, and specific settings can be made according to the specific application scenario.

[0089] Step 206: Export the block support, cut the corresponding upper solid support part in the solid support, and import the block support to obtain the part after adding the block support.

[0090] In this application, the block support can be exported, and the upper solid support part can be cut.

[0091] Figure 8 The schematic diagram of another part structure after adding the block support provided by the embodiment of this application is shown. As Figure 8 shown, the block support 01 can be imported to obtain the part after adding the block support 01.

[0092] Step 207: Perform slicing processing on the part after adding the block support, and import it into the corresponding printing device for thin-wall printing.

[0093] In this application, the specific implementation process of the above step 207 may include the following sub-steps:

[0094] Sub-step A1: Adjust the printing parameter power of the printing device to the preset printing power.

[0095] Optionally, the preset printing power can be 100 to 150 watts (W). The embodiments of this application do not limit the specifically set printing power, and the specific printing power can be selected according to the actual application scenario.

[0096] Sub-step A2: Adjust the printing speed of the printing device to the preset printing speed.

[0097] Optionally, the preset printing speed can be 600 - 1000 millimeters per second (mm / s). The embodiments of this application do not limit its specific printing speed, and specific selection can be made according to the actual application scenario.

[0098] Sub-step A3: At the preset printing power and the preset printing speed, slice the part after adding the block support, and import it into the corresponding printing device for thin-wall printing.

[0099] In this application, the spot diameter range of the corresponding printing device is 30 to 60 microns, and the substrate heating unit is 80°C to 150°C.

[0100] Step 208: Use a substrate fixture to hold the substrate of the part with the block support, and complete the powder cleaning process through multi-angle vibration.

[0101] Figure 9 The structure diagram of a substrate fixture provided by an embodiment of this application is shown. As Figure 9 shown, the substrate fixture 02 can be used to hold the substrate of the part A with the block support 01, and the powder cleaning process can be completed through multi-angle vibration.

[0102] Step 209: After completing the powder cleaning process, perform the preset manufacturing process steps in sequence to obtain the pure tungsten material thin-wall structure.

[0103] In this application, the specific implementation process of the above step 209 may include the following sub-steps:

[0104] Sub-step B1: Use an ultrasonic cleaning machine to clean the floating powder on the surface of the part.

[0105] In this application, after initially completing the powder cleaning process, an ultrasonic cleaning machine can be used to clean the floating powder on the surface of the part.

[0106] Sub-step B2: Use a dryer to dry the part at a preset drying temperature for a preset drying duration.

[0107] In this application, the preset drying temperature can be 80 degrees Celsius, or other temperature values. The embodiments of this application do not make specific limitations on this, and can be specifically set according to the actual application scenario.

[0108] The preset drying duration can be 2 to 4 hours. The embodiments of this application do not make specific limitations on this, and can also be other durations, and can be specifically set according to the specific application scenario.

[0109] Sub-step B3: Put the part with the substrate into the furnace for annealing treatment.

[0110] Optionally, perform annealing treatment with air cooling at a preset annealing temperature range for a preset annealing duration on the part with the substrate put into the furnace.

[0111] Among them, the preset annealing temperature range can be 1200 to 1500 ± 10 degrees Celsius; the preset annealing duration can be 1.5 to 4 hours. In the embodiments of the present application, no specific limitations are imposed on the above two specific set values, and specific settings can be made according to the actual application scenario.

[0112] Sub-step B4: Use medium wire electrical discharge machining to remove the part.

[0113] Among them, the voltage range corresponding to the medium wire is 3 to 4 amperes (A), the stepping speed is 15 to 25 mm / s, and the corresponding water pressure is the minimum water pressure.

[0114] In the present application, the above sub-step B4 can be implemented through any one of the following two processes, specifically including:

[0115] In the first example, fix one side of the substrate by clamping, and fix the other side of the block support of the part using a fixing tool such as a chuck, and use medium wire electrical discharge machining to remove the part.

[0116] In the second example, fill the void position of the block support with a preset organic substance, use medium wire electrical discharge machining to cut the part; lift the cut part with a spacer; heat it in a low-temperature oven to remove the preset organic substance.

[0117] Among them, the preset organic substance can be paraffin or similar organic substances. In the embodiments of the present application, no specific limitations are imposed on this, and specific selections can be made according to the actual application scenario.

[0118] Sub-step B5: Clean the remaining stubborn adherent powder by pickling.

[0119] In the present application, the pickling formula can be hydrochloric acid: nitric acid: hydrofluoric acid = 2:1:2. Further, the part can be immersed in the pickling solution for a preset pickling time to clean the remaining stubborn adherent powder. Among them, the preset pickling time can be 10 to 30 seconds. In the embodiments of the present application, no specific limitations are imposed on the specific pickling time, and specific settings can be made according to the actual application scenario.

[0120] Sub-step B6: Use an ultrasonic cleaning agent to clean for a preset duration to remove the residual acid solution.

[0121] In the present application, the preset duration can be 20 minutes, or it can also be 21 minutes or other durations. In the embodiments of the present application, no specific limitations are imposed on this, and specific selections can be made according to the actual application scenario.

[0122] Sub-step B7: Perform drying treatment to obtain the thin-walled structure of pure tungsten material.

[0123] Specifically, it can be dried at 80 degrees Celsius for 2 to 4 hours to obtain the thin-walled structure of pure tungsten material.

[0124] The preparation method of a pure tungsten material thin-walled structure based on additive manufacturing provided by the embodiments of the present application includes: obtaining a three-dimensional model of a grid part input by a user; performing product zoning based on the structural features of the three-dimensional model of the part to obtain an initial three-dimensional model structure of the part with the grid removed and the remaining part retained; performing entity support addition processing on the initial three-dimensional model structure of the part to obtain a target three-dimensional model structure of the part; after exporting the target three-dimensional model structure of the part, generating block supports according to a preset grid size based on the target three-dimensional model structure of the part; exporting the block supports, cutting the corresponding upper entity support part in the entity support and importing the block supports to obtain the part after adding the block supports; importing the part after adding the block supports into the equipment, using a substrate fixture to clamp the substrate of the part with the block supports, and completing the powder cleaning process; after completing the powder cleaning process, successively performing preset manufacturing process steps to prepare the pure tungsten material thin-walled structure. Since product zoning is performed on the structural features of the three-dimensional model of the part and the internal entity part is optimized into block supports, without changing its overall structure, because the block support is a linear scanning path and it is a single strip, the relevant processing data are only the corresponding conventional simple data during the printing process, such as the adjustment of printing speed, printing power, etc. When the overall stiffness of the part is low, the quality of the printed product is optimized. And because the block supports are exported, the corresponding upper entity support part in the entity support is cut and the block supports are imported to obtain the part after adding the block supports, and then the part after adding the block supports is imported into the equipment, the size of the block supports can be kept consistent without replacement. After exporting the block supports, corresponding stretching and other process treatments can be performed on the upper entity support or other entity parts, and finally the block supports are imported. The block supports do not need to be repeatedly prepared, ensuring the dimensional accuracy of the part during the preparation process, enabling it to be integrally formed through the selective laser melting forming process, with simple subsequent processing procedures, cost savings, and further shortening of the cycle, having extremely high efficiency and qualified rate for batch printing and forming corresponding parts.

[0125] The electronic device in the embodiments of the present application may be a device, or a component, an integrated circuit, or a chip in a terminal. The device may be a mobile electronic device or a non-mobile electronic device. Exemplarily, the mobile electronic device may be a mobile phone, a tablet computer, a laptop computer, a handheld computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and the non-mobile electronic device may be a server, a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc. The embodiments of the present application do not make specific limitations.

[0126] The electronic device in the embodiments of the present application may be a device with an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems. The embodiments of the present application do not make specific limitations.

[0127] Figure 10 The schematic diagram of the hardware structure of an electronic device provided by the embodiments of the present application is shown. As Figure 10 shown, the electronic device 300 includes a processor 310.

[0128] As Figure 10 shown, the above-mentioned processor 310 may be a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of the program of the solution of the present application.

[0129] As Figure 10 shown, the above-mentioned electronic device 300 may further include a communication line 340. The communication line 340 may include a path for transmitting information between the above-mentioned components.

[0130] Optionally, as Figure 10 shown, the above-mentioned electronic device may further include a communication interface 320. The communication interface 320 may be one or more. The communication interface 320 may use any transceiver-like device for communicating with other devices or communication networks.

[0131] Optionally, as Figure 10As shown in the figure, the electronic device may further include a memory 330. The memory 330 is used to store computer-executable instructions for implementing the solution of this application, and is controlled by the processor for execution. The processor is used to execute the computer-executable instructions stored in the memory, so as to implement the method provided in the embodiments of this application.

[0132] As Figure 10 shown in the figure, the memory 330 may be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a random access memory (RAM) or other types of dynamic storage devices that can store information and instructions, or may also be an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compact discs, laser discs, optical discs, digital versatile discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto. The memory 330 may exist independently and be connected to the processor 310 through a communication line 340. The memory 330 may also be integrated with the processor 310.

[0133] Optionally, the computer-executable instructions in the embodiments of this application may also be referred to as application code, and the embodiments of this application do not make specific limitations thereto.

[0134] In a specific implementation, as an embodiment, as Figure 10 shown in the figure, the processor 310 may include one or more CPUs, such as Figure 10 CPU0 and CPU1 in

[0135] In a specific implementation, as an embodiment, as Figure 10 shown in the figure, the terminal device may include multiple processors, such as Figure 10 the first processor 3101 and the second processor 3102 in

[0136] Figure 11 is a schematic structural diagram of a chip provided in the embodiments of this application. As Figure 11 shown in the figure, the chip 400 includes one or more than two (including two) processors 310.

[0137] Optionally, as Figure 11As shown, the chip further includes a communication interface 320 and a memory 330. The memory 330 may include a read-only memory and a random access memory, and provide operation instructions and data to the processor. A part of the memory may also include a non-volatile random access memory (NVRAM).

[0138] In some embodiments, as Figure 11 shown, the memory 330 stores the following elements, execution modules or data structures, or subsets thereof, or extended sets thereof.

[0139] In the embodiments of the present application, as Figure 11 shown, by invoking the operation instructions stored in the memory (the operation instructions may be stored in the operating system), corresponding operations are executed.

[0140] As Figure 11 shown, the processor 310 controls the processing operations of any one of the terminal devices. The processor 310 may also be referred to as a central processing unit (CPU).

[0141] As Figure 11 shown, the memory 330 may include a read-only memory and a random access memory, and provide instructions and data to the processor. A part of the memory 330 may also include NVRAM. For example, in the application, the memory, the communication interface, and the memory are coupled together through a bus system. The bus system may include a power bus, a control bus, a status signal bus, etc. in addition to the data bus. However, for the sake of clarity, in Figure 11 all kinds of buses are labeled as the bus system 440.

[0142] As Figure 11As shown, the method disclosed in the embodiments of the present application can be applied to a processor or implemented by a processor. The processor may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the integrated logic circuit in the hardware of the processor or the instructions in the form of software. The above-mentioned processor may be a general-purpose processor, a digital signal processor (DSP), an ASIC, a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. It can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present application. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in combination with the embodiments of the present application can be directly embodied as being executed by the hardware decoding processor, or executed by the combination of the hardware and software modules in the decoding processor. The software module may be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. This storage medium is located in the memory, and the processor reads the information in the memory and combines its hardware to complete the steps of the above method.

[0143] On the one hand, a computer-readable storage medium is provided. Instructions are stored in the computer-readable storage medium, and when the instructions are run, the functions executed by the terminal device in the above embodiments are implemented.

[0144] On the one hand, a chip is provided. The chip is applied to a terminal device. The chip includes at least one processor and a communication interface. The communication interface is coupled to the at least one processor, and the processor is used to run instructions to implement the functions executed by the preparation method of the pure tungsten material thin-walled structure based on additive manufacturing in the above embodiments.

[0145] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer programs or instructions. When the computer program or instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are executed in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, a terminal, a user device, or other programmable devices. The computer program or instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer program or instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center in a wired or wireless manner. The computer-readable storage medium can be any available medium that can be accessed by a computer, or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium, such as a floppy disk, a hard disk, or a magnetic tape; it can also be an optical medium, such as a digital video disc (DVD); or it can be a semiconductor medium, such as a solid state drive (SSD).

[0146] Although the present application has been described in conjunction with various embodiments, however, in the process of implementing the claimed present application, those skilled in the art can understand and implement other variations of the disclosed embodiments by viewing the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "one" does not exclude a plurality. A single processor or other unit can implement several functions recited in the claims. Certain measures are recited in mutually different dependent claims, but this does not mean that these measures cannot be combined to produce good results.

[0147] Although the present application has been described in conjunction with specific features and their embodiments, it is obvious that various modifications and combinations can be made without departing from the spirit and scope of the present application. Accordingly, the present specification and the drawings are merely exemplary illustrations of the present application defined by the appended claims, and are considered to have covered any and all modifications, variations, combinations, or equivalents within the scope of the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these changes and modifications.

Claims

1. A preparation method for a thin-walled structure of pure tungsten material based on additive manufacturing, characterized in that, The method includes: Obtaining a three-dimensional model of a grille part input by a user; Performing product zoning based on the structural features of the three-dimensional model of the part to obtain an initial three-dimensional model structure of the part with the grille removed and the remaining part retained; Performing entity support addition processing on the initial three-dimensional model structure of the part to obtain a target three-dimensional model structure of the part; After exporting the target three-dimensional model structure of the part, generating a block support based on the target three-dimensional model structure according to a preset grille size; Exporting the block support, cutting the corresponding upper entity support part in the entity support and importing the block support to obtain the part after adding the block support; Importing the part after adding the block support into a device, using a substrate fixture to clamp the substrate of the part with the block support, and completing the powder cleaning process; After completing the powder cleaning process, sequentially performing preset manufacturing process steps to prepare the pure tungsten material thin-walled structure.

2. The method according to claim 1, wherein The performing product zoning based on the structural features of the three-dimensional model of the part to obtain an initial three-dimensional model structure of the part with the grille removed and the remaining part retained includes: Based on the structural features of the three-dimensional model of the part, determining the solid structure as the installation area and the non-solid area as the grille core area; Removing the grille core area to obtain the initial three-dimensional model structure of the part with the grille removed and the remaining part retained.

3. The method according to claim 1, wherein The importing the part after adding the block support into a device, using a substrate fixture to clamp the substrate of the part with the block support, and completing the powder cleaning process includes: Performing slicing processing on the part after adding the block support and importing it into a corresponding printing device for thin-walled printing; Using a substrate fixture to hold the substrate of the part with the block support and completing the powder cleaning process through multi-angle vibration.

4. The method according to claim 3, wherein The performing slicing processing on the part after adding the block support and importing it into a corresponding printing device for thin-walled printing includes: Adjusting the printing parameter power of the printing device to a preset printing power; Adjusting the printing speed of the printing device to a preset printing speed; At the preset printing power and the preset printing speed, performing slicing processing on the part after adding the block support and importing it into a corresponding printing device for thin-walled printing.

5. The method according to claim 1, characterized in that, The sequentially performing preset manufacturing process steps to prepare the pure tungsten material thin-walled structure after completing the powder cleaning process includes: Using an ultrasonic cleaning machine to clean the floating powder on the surface of the part; Putting the part with the substrate into a furnace for annealing heat treatment; Taking down the part by using medium wire cutting; Cleaning the remaining stubborn sticky powder by pickling; Using an ultrasonic cleaning agent to clean for a preset duration to remove the residual acid solution; Performing drying and drying treatment to obtain the pure tungsten material thin-walled structure.

6. The method according to claim 5, wherein The taking down the part by using medium wire cutting includes: Fixing the other side of the block support of the part by using a chuck or other fixing tools on one side and clamping the substrate on the other side, and taking down the part by using medium wire cutting.

7. The method according to claim 5, characterized in that, The taking down the part by using medium wire cutting includes: Filling the void positions of the block support with a preset organic substance and cutting the part by using medium wire cutting; Lifting the cut part with a spacer; Heating in a low-temperature oven to remove the preset organic substance.

8. The method according to claim 4, characterized in that, After cleaning the floating powder on the surface of the parts with an ultrasonic cleaning agent, before annealing the parts with the substrate in the furnace, the method further includes: Performing a drying process on the parts for a preset drying duration at a preset drying temperature using a dryer.

9. The method according to claim 4, characterized in that, Annealing the parts with the substrate in the furnace includes: Performing an annealing heat treatment with air cooling for a preset annealing duration on the parts with the substrate in the furnace within a preset annealing temperature range.

10. An electronic device, characterized in that, Including: One or more processors; And one or more machine-readable media storing instructions that, when executed by the one or more processors, cause the execution of the preparation method of the thin-walled structure of pure tungsten material based on additive manufacturing according to any one of claims 1-9.

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