Substrate detection device

Abstract

A substrate detection apparatus includes an illumination portion for irradiating illumination light to a photographing area including a plurality of substrates inserted into a plurality of holding grooves of a substrate holder, a photographing portion for photographing the plurality of substrates, a storage portion, a search portion, and a determination portion. The shooting part is used for shooting the shooting area and generating a shooting image, and the shooting image comprises a plurality of pixel blocks representing the side surfaces of the plurality of substrates; the storage part is used for storing a reference grid, a plurality of detection positions and a reference width of the side surface of the single substrate, the reference grid comprises a search area and a bad area, the plurality of detection positions comprise at least two detection positions configured for each holding groove, the search part is used for searching pixel blocks in images, located in the reference grid, of shot images at the detection positions, and the bad area is located in the search positions; outputting search information of the pixel blocks in the reference grid; the determination unit determines a holding state of the plurality of substrates in the corresponding holding grooves based on the search information. According to the invention, abnormal substrates on the substrate support can be found in time.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a substrate detection device. Background Art

[0002] Figure 1 The structural schematic diagrams of a flipping device and a loading device are shown; Figure 2 The top view structural schematic diagram of a loading device is shown. In Figure 1 , the flipping device 200' flips a plurality of substrates 100 from a horizontal posture to a vertical posture. Referring to Figure 1 and Figure 2 , when transporting a plurality of substrates 100 in a semiconductor device, first, a manipulator takes out a plurality of substrates 100 in a horizontal posture from a cassette in a loading area, and transports the plurality of substrates 100 to the flipping device 200'. Then, the flipping device 200' rotates to flip the plurality of substrates 100 from a horizontal posture to a vertical posture, and transfers the plurality of substrates 100 in a vertical posture to the loading device 300'. The loading device 300' can move up and down. With reference to Figure 2 , the loading device 300' includes a substrate support 310'. The substrate support 310' has a plurality of holding grooves 312'. Each holding groove 312' includes a pair of clamping grooves 311'. Each pair of clamping grooves 311' is oppositely arranged. The sides of each substrate 100 are inserted into a corresponding pair of clamping grooves 311' to hold the plurality of substrates 100 in a vertical posture. Finally, the manipulator takes away the plurality of substrates 100 from the substrate support 310' and transports the plurality of substrates 100 to a process tank, immersing the plurality of substrates 100 in the liquid medicine in the process tank together to perform batch wet processing on the plurality of substrates 100 in a vertical posture.

[0003] However, during the repeated transportation of a plurality of substrates 100, for some reason, such as the deformation of the substrates 100, abnormalities such as substrate 100 missing, laminating, and skew insertion may occur, resulting in unsuccessful wafer transfer or interference breakage during wafer transfer.

[0004] Therefore, during the process of transporting substrates, adding a substrate detection device to timely detect abnormal substrates is extremely important. Summary of the Invention

[0005] The purpose of the present invention is to provide a substrate detection device that can timely and effectively detect abnormal substrates.

[0006] To achieve the above purpose, an embodiment of the present invention provides a substrate detection device, including:

[0007] A lighting unit for irradiating illumination light to a shooting area including a plurality of substrates, wherein the plurality of substrates are inserted into a plurality of holding grooves of a substrate holder and arranged along a specified arrangement direction;

[0008] A shooting unit for shooting the shooting area and generating a shooting image, the shooting image including a plurality of pixel blocks representing the sides of the plurality of substrates;

[0009] A storage unit for storing a reference grid, a plurality of detection positions, and a reference width of the side of a single substrate, wherein the reference grid includes a search area and a defective area, at least two spaced detection positions are arranged in each holding groove, and the reference grid is used to search for pixel blocks in the image within the reference grid of the shooting image at each detection position and output search information of the pixel blocks in the reference grid;

[0010] A judgment unit for judging the holding state of the plurality of substrates in the corresponding holding grooves based on the search information.

[0011] The substrate detection device of the present invention irradiates illumination light to a shooting area including a plurality of substrates by means of the lighting unit, shoots the shooting area by using the shooting unit and generates a shooting image, searches for pixel blocks in the image within the reference grid of the shooting image at each detection position through the reference grid and outputs search information of the pixel blocks in the reference grid, and then judges the holding state of the plurality of substrates in the corresponding holding grooves by the judgment unit based on the search information, so that the purpose of timely detecting abnormal substrates on the substrate holder can be achieved, and further the failure of wafer transfer or interference breakage during wafer transfer can be avoided.

[0012] Other features and corresponding beneficial effects of the present invention are described and explained in the following part of the specification, and it should be understood that at least some of the beneficial effects are obvious from the description in the specification of the present invention. Description of the Drawings

[0013] Figure 1 It is a schematic structural diagram of a flipping device and a wafer receiving device;

[0014] Figure 2 It is a top view structural diagram of a wafer receiving device;

[0015] Figure 3 (a) is a schematic diagram when a plurality of substrates of the present application are inserted into a plurality of holding grooves of a substrate holder and the plurality of substrates are in a normal state;

[0016] Figure 3 (b) to Figure 3 (e) are schematic diagrams when a plurality of substrates of the present application are inserted into a plurality of holding grooves of a substrate holder and the plurality of substrates are in an abnormal state;

[0017] Figure 4Schematic structural diagram of the substrate detection device according to Embodiment 1 of the present application;

[0018] Figure 5 Top view structural diagram of the substrate holder according to Embodiment 1 of the present application;

[0019] Figure 6 Schematic structural diagram of the substrate detection device according to Embodiment 1 of the present application from another perspective;

[0020] Figure 7 Schematic diagram of the captured image and the reference grid according to Embodiment 1 of the present application;

[0021] Figure 8 Schematic diagram of the reference grid according to Embodiment 1 of the present application;

[0022] Figure 9 (a) to Figure 9 (c) Schematic diagrams of three configuration modes of the reference grid and the detection positions according to Embodiment 1 of the present application;

[0023] Figures 10(a) to 10(d) Schematic diagram of the search information of the pixel blocks in the reference grid under different holding states of the substrate according to Embodiment 1 of the present application;

[0024] Figure 11 Schematic diagram of the captured image and the reference grid according to Embodiment 2 of the present application; and

[0025] Figure 12 (a) and Figure 12 (b) show schematic diagrams of the reference grid according to Embodiment 2 of the present application. Detailed implementation manners

[0026] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiments, this does not mean that the features of this invention are limited to this implementation manner. On the contrary, the purpose of introducing the invention in conjunction with the implementation manner is to cover other alternatives or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present invention, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0027] It should be noted that in this specification, similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0028] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative work shall fall within the protection scope of the present invention.

[0029] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0031] To make the purpose, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0032] The substrate detection device provided by this application is applied in semiconductor equipment and is used to detect whether there are abnormalities such as substrate missing, laminating, warping, and skew insertion on multiple substrates on a substrate holder.

[0033] Figure 3 (a) shows a schematic diagram of a normal state of multiple substrates when multiple substrates are inserted into multiple holding slots of a substrate holder; Figure 3 (b) to Figure 3 (e) show schematic diagrams of abnormal states of multiple substrates when multiple substrates are inserted into multiple holding slots of a substrate holder.

[0034] Refer to Figure 3 (a), the normal state means that multiple substrates 100 are held in their respective holding slots 312. Refer to Figure 3 (b) to Figure 3 (e), the abnormal states include substrate missing abnormality, laminating abnormality, warping abnormality, skew insertion abnormality, etc. As Figure 3(As shown in (b), the abnormality of the absence of the substrate 100 means that there is no substrate 100 in at least one holding groove 312, and the number of substrates 100 held in the plurality of holding grooves 312 is less than the normal number; for example, Figure 3 (As shown in (c), the abnormality of lamination means that at least two substrates 100 are inserted into one holding groove 312; for example, Figure 3 (As shown in (d), the abnormality of warping means that the warping degree of the substrate 100 inserted into one holding groove 312 does not meet the regulations; for example, Figure 3 (As shown in (e), the abnormality of oblique insertion means that one substrate 100 is inserted into two different holding grooves 312.)

[0035] Embodiment 1:

[0036] Figure 4 shows a schematic structural diagram of the substrate detection device according to Embodiment 1 of the present application; Figure 5 shows a top view structural diagram of the substrate support according to Embodiment 1 of the present application; Figure 6 shows a schematic structural diagram of another perspective of the substrate detection device according to Embodiment 1 of the present application. For convenience, the illumination unit 400 is marked in Figure 6 .

[0037] Referring to Figures 4 to 6 , the substrate detection device provided in this embodiment includes an illumination unit 400, a photographing unit 500, a storage unit, and a judgment unit. With reference to Figure 3 (a), the illumination unit 400 is configured to irradiate illumination light to a photographing area including a plurality of substrates 100, wherein the plurality of substrates 100 are inserted into a plurality of holding grooves 312 of the substrate support 310 and are arranged along a specified arrangement direction. The photographing unit 500 is configured to photograph the photographing area and generate a photographed image.

[0038] In this embodiment, as Figure 4 and Figure 5 shown, the substrate support 310 includes a base portion 313 and a plurality of holding grooves 312. The base portion 313 is generally concave, and the plurality of holding grooves 312 are provided on the base portion 313 and are arranged along the arrangement direction of the substrates 100. Each holding groove 312 includes a pair of clamping grooves 311, and the pair of clamping grooves 311 are oppositely arranged on both sides of the base portion 313 ( Figure 4 are the left and right sides in

[0039] ), and the sides of each substrate 100 are inserted into the corresponding pair of clamping grooves 311, so as to hold the plurality of substrates 100 in a vertical posture. In some other embodiments, the substrate support 310 may be configured on the aforementioned feeding device 300, or may be configured on a flipping device, or may be configured in a process tank, or may be a transfer robot, etc. Figures 4 to 7, in Embodiment 1, the illumination unit 400 is disposed below the plurality of substrates 100, and the photographing unit 500 is disposed above the plurality of substrates 100. Among them, the illumination unit 400 is disposed on the side of the base 313 facing the substrate 100, so that the irradiation light of the illumination unit 400 passes through the gap between the plurality of substrates 100. The photographing unit 500 is configured to photograph the photographing area after the irradiation light passes through the gap between the plurality of substrates 100 and generate a photographed image. Figure 7 The schematic diagram of the photographed image and the reference grid of Embodiment 1 of the present application is shown. As Figure 7 shown, the photographed image includes a plurality of pixel blocks 610 representing the plurality of substrates 100. In this example, the plurality of pixel blocks 610 are a plurality of dark blocks where the illumination light is blocked by the side surfaces of the plurality of substrates 100. In some other embodiments, both the illumination unit 400 and the photographing unit 500 are disposed above the plurality of substrates 100. Among them, the illumination light of the illumination unit 400 irradiates the side surfaces of the plurality of substrates 100, and the photographing unit 500 is configured to photograph the photographing area after the illumination light of the illumination unit 400 irradiates the side surfaces of the plurality of substrates 100 and generate a photographed image. The plurality of pixel blocks 610 included in the photographed image are bright blocks of the reflected light where the illumination light irradiates the side surfaces of the plurality of substrates 100. It should be noted that the present application does not particularly limit the number of light bars and cameras. The illumination unit 400 may include at least one light bar, for example, two light bars, and the light bar may be an LED light bar; the photographing unit 500 may include at least one camera, for example, one camera. In the following description, Figure 4 the example shown is used for illustration.

[0040] The storage unit is configured to store the reference grid 700, a plurality of detection positions, and the reference width of the side surface of a single substrate 100. In this embodiment, the storage unit may include, but is not limited to, magnetic storage devices (for example, hard disks, floppy disks, magnetic strips), optical discs (for example, compact discs (CDs), digital versatile discs (DVDs)), smart cards, and flash memory devices (for example, electrically erasable programmable read-only memories (EPROMs), cards, sticks, key drives). Refer to Figure 8 , the reference grid 700 includes a search area 710 and two defective areas 720. The two defective areas 720 are respectively established on both sides of the search area 710. The search area 710 represents the area that appears when the substrate 100 is normally held in the holding groove 312 (such as Figure 3 the holding groove 312 shown), and the defective area 720 represents the area that appears when the substrate 100 is abnormally held in the holding groove 312. Refer to Figure 5 and Figure 7 , the plurality of detection positions include at least two detection positions configured for each holding groove 312. In the Figure 7 shown photographed image, the holding groove 312 is not shown, but the positions where the plurality of detection positions are located correspond to the positions of the respective holding grooves 312. For convenience, in Figure 7Only two detection positions (a first detection position 31401 and a second detection position 31402) configured for one holding slot 312 are schematically shown, and these two detection positions are spaced apart. It should be understood that actually each holding slot 312 is configured with two detection positions. The purpose of designing the detection positions in this embodiment is to achieve the positioning of the reference grid 700. Each detection position is located on the center line of the corresponding holding slot 312. When the reference grid 700 is positioned at the corresponding detection position, the center of the search area 710 of the reference grid 700 coincides with the corresponding detection position. In other embodiments, each holding slot 312 may be configured with more than two detection positions for complementing each other to enhance the detection effect. In Figure 7 it, a first image acquisition area 601 (the upper virtual frame in the figure) and a second image acquisition area 602 (the lower virtual frame in the figure) are also shown in the captured image. Both the first image acquisition area 601 and the second image acquisition area 602 include pixel blocks representing a plurality of substrates 100. When detecting a plurality of substrates 100 in a plurality of holding slots 312, the two detection positions corresponding to each holding slot 312 are respectively located in the first image acquisition area 601 and the second image acquisition area 602 of the captured image. The search unit is used to search for pixel blocks 610 in the partial image located within the reference grid 700 in the captured image at each detection position, and output search information of the pixel blocks 610 in the reference grid 700. The search information includes the presence or absence of pixel blocks 610 in the search area 710, the width of the pixel blocks 610 in the search area 710, and the presence or absence of pixel blocks 610 in the defective area 720. The determination unit is used to determine the holding state of a plurality of substrates 100 in the holding slot 312 based on the above search information. It should be noted that the pixel block 610 mentioned in this embodiment refers to the pixel block representing the side of the substrate 100. In this embodiment, the search unit and the determination unit are configured as data processors such as a CPU capable of performing various arithmetic processes. The processor may be one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof.

[0041] Figure 9 (a) to Figure 9 c) show schematic diagrams of three configuration modes of the reference grid and the detection positions in Embodiment 1 of the present application. In Figure 9 (a) and Figure 9 (b), only the detection positions corresponding to two holding slots 312 are schematically shown, and the movable reference grid after movement is represented by a dotted outline; in Figure 9 (c), only the detection positions corresponding to four holding slots 312 are schematically shown. In Figure 9 (a) to Figure 9In (c), two detection bits are respectively provided corresponding to each holding slot 312, denoted as a first detection bit 31401 and a second detection bit 31402, and each detection bit is located on the center line of the corresponding holding slot 312.

[0042] In some embodiments, the reference grid 700 includes at least one movable reference grid. In Figure 9 In the example shown in (a), the reference grid 700 includes a movable reference grid, and the movable reference grid can move between the first detection bit 31401 and the second detection bit 31402 configured in one holding slot 312 to perform searches at these two detection bits respectively, so as to detect the holding state of the substrate 100 in this one holding slot 312. After the movable reference grid completes the search at the position of this one holding slot 312, it moves to the two detection bits corresponding to the next holding slot 312 to perform searches at the first detection bit 31401 and the second detection bit 31402 configured in the next holding slot 312 respectively. In this way, the movable reference grid sequentially detects the holding states of the substrates 100 in multiple holding slots 312.

[0043] In Figure 9 In the example shown in (b), the reference grid 700 includes a pair of movable reference grids, and the pair of movable reference grids simultaneously perform searches at the two detection bits configured in one holding slot 312, and then move to the position of the next holding slot 312 to simultaneously perform searches at the first detection bit 31401 and the second detection bit 31402 configured in the next holding slot 312. In this way, the movable reference grid 700 sequentially detects the holding states of the substrates 100 in multiple holding slots 312.

[0044] In some other embodiments, referring to Figure 9 In (c), the reference grid 700 includes a plurality of fixed reference grids, and the plurality of fixed reference grids are respectively located at a plurality of detection bits. That is to say, the first detection bit 31401 and the second detection bit 31402 configured in each holding slot 312 each correspond to a fixed reference grid, so that the plurality of fixed reference grids simultaneously detect the holding states of the substrates 100 in the plurality of holding slots 312.

[0045] Referring to Figure 9(a), the width W1 of the search area 710 involved in this embodiment is not greater than the opening width W2 of the holding groove 312. For example, the width W1 is one-half, three-fifths, or three-fourths of the width W2, etc., so as to improve the accuracy of detecting the holding state of the detection substrate in the corresponding holding groove 312. The overall width of the reference grid 700, that is, the sum of the width W1 of the search area 710 and the width of the defective area does not exceed the distance d between the centerlines of two holding grooves 312, so as to avoid interference between the detection data in the previous reference grid 700 and the detection data in the next reference grid 700. It should be noted that the size of the width W1 of the search area 710 and the overall width size of the reference grid 700 can be determined according to the actual on-site process, and the present application does not make special limitations on this. Figures 10(a) to 10(d) respectively show the schematic diagrams of the search information of the pixel blocks in the reference grid under different holding states of the substrate in Embodiment 1 of the present application. For convenience, Figures 10(a) to 10(d) simultaneously shows the search information of the reference grid 700 at multiple detection positions corresponding to multiple holding grooves 312.

[0046] Exemplarily, Figure 7 the shown captured image shows the first image acquisition area 601 and the second image acquisition area 602. Each holding groove 312 is configured with a first detection position 31401 and a second detection position 31402. The first detection position 31401 is located in the first image acquisition area 601, and the second detection position 31402 is located in the second image acquisition area 602. The reference grid 700 includes a pair of movable reference grids, and the pair of movable reference grids are used to simultaneously correspond to the two detection positions configured for one holding groove 312. In such a case:

[0047] Combined with Figure 7 and Fig. 10(a), for the same holding groove 312, when the search information output by the reference grid 700 at the first detection position 31401 is: there is a pixel block 610 in the search area 710 of the reference grid 700 and the width of the pixel block 610 conforms to the reference width, and there is no pixel block 610 in the defective area 720 of the reference grid 700. At the same time,

[0048] the search information output by the reference grid 700 at the second detection position 31402 is: there is a pixel block 610 in the search area 710 of the reference grid 700 and the width of the pixel block 610 conforms to the reference width, and there is no pixel block 610 in the defective area 720 of the reference grid 700, the judgment unit judges that the detected substrate 100 is in a normal holding state. On the contrary, the judgment unit judges that the detected substrate 100 is in an abnormal holding state. That is to say, the detected substrate 100 is normally held in the corresponding holding groove 312 and there is no interference from adjacent substrates 100.

[0049] Combined with Figure 7And in FIGS. 10(b), for the same holding groove 312, when the search information output by the reference cell 700 at the first detection position 31401 is that there is a pixel block 610 in the search area 710 of the reference cell 700 and the width of the pixel block 610 does not conform to the reference width, and there is no pixel block 610 in the defective area 720 of the reference cell 700, and at the same time,

[0050] when the search information output by the reference cell 700 at the second detection position 31402 is that there is a pixel block 610 in the search area 710 of the reference cell 700 and the width of the pixel block 610 does not conform to the reference width, and there is no pixel block 610 in the defective area 720 of the reference cell 700, the judgment unit judges that the detected substrate 100 has a lamination or warpage abnormality. The fact that the width of the pixel block 610 in the search area 710 mentioned in this embodiment does not conform to the reference width means that the width of the pixel block 610 in the search area 710 is greater than the reference width, indicating that at least two substrates 100 are inserted into the holding groove 312 simultaneously at the detection position where the reference cell 700 is located (see Figure 3 (c)), or the warpage degree of one substrate 100 in the holding groove 312 does not meet the requirements (see Figure 3 d). Whether it is a lamination abnormality or a warpage abnormality can be confirmed by on-site manual inspection.

[0051] Combined with Figure 7 and FIGS. 10(c), for the same holding groove 312, when the search information output by the reference cell 700 at the first detection position 31401 is that there is no pixel block 610 in the search area 710 of the reference cell 700, and there is no pixel block 610 in the defective area 720 of the reference cell 700, and at the same time,

[0052] when the search information output by the reference cell 700 at the second detection position 31402 is that there is no pixel block 610 in the search area 710 of the reference cell 700, and there is no pixel block 610 in the defective area 720 of the reference cell 700, the judgment unit judges that the detected substrate 100 has a missing abnormality. That is to say, at the detection position where the reference cell 700 is located, there is no substrate 100 in the holding groove 312. It should be noted that the missing abnormality described in this application means that it is detected that there is no substrate 100 in the holding groove 312 where there should be a substrate 100. It can be understood that in a compliant situation, vacancies may occur in multiple holding grooves 312. For example, one hundred holding grooves 312 normally hold one hundred substrates 100, or one hundred holding grooves 312 may normally hold fifty substrates 100, and there is a vacancy between any two adjacent substrates 100 among these fifty substrates 500. At this time, for this vacancy, it belongs to the normal situation, and the judgment unit should not judge that there is a missing abnormality.

[0053] Combined with Figure 7As shown in FIGS. 10(d), when the search information output by the reference cell 700 at the first detection position 31401 is that there is a pixel block 610 in the defective area 720 of the reference cell 700, or

[0054] when the search information output by the reference cell 700 at the second detection position 31402 is that there is a pixel block 610 in the defective area 720 of the reference cell 700, the determination unit determines that the substrate 100 being detected has an abnormal skew insertion. That is to say, at the detection position where the reference cell 700 is located, a substrate 100 appears in the abnormally held area. In this embodiment, at the detection position where the reference cell 700 is located, regardless of whether there is a substrate 100 in the holding groove 312, if a pixel block 610 is found in the defective area 720 of the reference cell 700, it can be considered that the substrate 100 corresponding to the pixel block 610 in the defective area 720 has an abnormal skew insertion.

[0055] In some embodiments, the substrate detection device further includes an alarm unit for alarming when the determination unit determines that the substrate 100 being detected is abnormal. The alarm unit includes, for example, at least one of a display and a speaker.

[0056] After the substrate detection device of the present application detects a plurality of substrates 100 on the substrate holder 310, the plurality of substrates 100 will be sent into a process tank and immersed in the liquid medicine in the process tank for wet processing. Different from the above embodiments, the substrate detection device of the present application can also detect a plurality of substrates 100 in the process tank. In this case, the substrate holder 310 is disposed in the process tank, the light irradiation unit 400 of the substrate detection device can be disposed outside the process tank and below the process tank. The process tank is made of a light-transmitting material. The light irradiation unit 400 emits light toward the process tank, and the light will pass through the gaps between the plurality of substrates 100. The photographing unit 500 is disposed above the process tank and photographs a photographing area including the plurality of substrates 100 in the process tank and generates a photographed image. The determination logic regarding the detection position, the reference cell 700, and the determination unit is similar to the relevant descriptions above and will not be elaborated here.

[0057] Embodiment 2:

[0058] Figure 11 FIGS. show schematic diagrams of the photographed image and the reference cell according to Embodiment 2 of the present application. Figure 12 (a) and Figure 12(b) shows a schematic diagram of the reference grid in Embodiment 2 of the present application. The differences between Embodiment 2 and Embodiment 1 are as follows: First, the defective area 720 of the reference grid 700 provided in Embodiment 2 is configured such that when there is a pixel block 610 in the search area 710, the defective area 720 is established on both sides of the pixel block 610. That is to say, if no pixel block 610 is found in the search area 710, the defective area 720 will not be established. Second, there are differences in the judgment logic of the judgment unit for judging the missing abnormality and the skew insertion abnormality of the detected substrate 100. It should be noted that the pixel block 610 mentioned in this embodiment refers to the pixel block representing the side of the substrate 100 in the captured image. For the size of the search area of the reference grid involved in Embodiment 2, the principle of its determination is similar to the principle of determining the size of the search area in Embodiment 1. The size of the defective area of the reference grid involved in Embodiment 2 is determined according to the actual on-site process, as long as it can avoid interference between the substrate and the docking mechanism (such as a flipping device or a material receiving device) during the wafer transfer process.

[0059] Figure 11 The shown captured image shows a first image acquisition area 601 (the upper virtual frame in the figure) and a second image acquisition area 602 (the lower virtual frame in the figure). Each holding groove 312 is configured with a first detection position 31401 and a second detection position 31402. The first detection position 31401 is located in the first image acquisition area 601, and the second detection position 31402 is located in the second image acquisition area 602. The reference grid 700 includes a pair of movable reference grids, and the pair of movable reference grids are used to simultaneously correspond to the first detection position 31401 and the second detection position 31402 configured for one holding groove 312. In such a case, the judgment logic of the judgment unit for judging the missing abnormality and the skew insertion abnormality of the detected substrate 100 in this embodiment is described as follows:

[0060] When the search information output by the reference grid 700 at the first detection position 31401 is that for the same holding groove 312, there is no pixel block 610 in the search area 710 of the reference grid 700, and at the same time,

[0061] the search information output by the reference grid 700 at the second detection position 31402 is that there is no pixel block 610 in the search area 710 of the reference grid 700, the judgment unit judges that the detected substrate 100 has a missing abnormality. That is to say, at the detection position where the reference grid 700 is located, there is no substrate 100 in the holding groove 312. In this embodiment, at the first detection position 31401 and the second detection position 31402, no pixel block 610 is found in the search area 710 of the reference grid 700. Therefore, the defective area 720 will not be established on both sides of the pixel block 610, and thus no pixel block 610 will be searched in the defective area 720.

[0062] When the search information output by the reference cell 700 at the first detection position 31401 is: there is a pixel block 610 in the search area 710 of the reference cell 700, and there is a pixel block 610 in the defective area 720 of the reference cell 700, or,

[0063] When the search information output by the reference cell 700 at the second detection position 31402 is: there is a pixel block 610 in the search area 710 of the reference cell 700, and there is a pixel block 610 in the defective area 720 of the reference cell 700, the judgment unit determines that the detected substrate 100 has an abnormal skew insertion. In this embodiment, at the first detection position 31401 or the second detection position 31402, a pixel block 610 is searched in the search area 710 of the reference cell 700, and two defective areas 720 are established on both sides of the pixel block 610. If a pixel block 610 is searched in at least one of the defective areas 720, it can be considered that the substrate 100 corresponding to the pixel block 610 in the defective area 720 has an abnormal skew insertion. In this case, the width of the pixel block 610 searched in the search area 710 may conform to the reference width or be greater than the reference width. When the width of the pixel block 610 is greater than the reference width, it is possible that the substrate 100 corresponding to the pixel block 610 has a lamination or warping abnormality. At this time, whether to alarm the lamination or warping abnormality first or the skew insertion abnormality first can be determined according to the actual process.

[0064] It should be noted that the embodiments of the present application only illustrate a judgment condition when the substrate 100 is in the above abnormal holding state (for example, abnormal skew insertion). It can be understood that those skilled in the art may also judge the abnormal holding state (for example, abnormal skew insertion) through another judgment condition based on the substrate detection principle of the embodiments of the present application.

[0065] In addition, the embodiments of the present application exemplify substrate lamination or warping abnormalities, missing abnormalities, and skew insertion abnormalities, and do not exhaust all abnormalities. As long as it does not deviate from the main idea of this article, various abnormality judgments can be made, which are specifically determined according to the actual process.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A substrate detection device, characterized in that, Comprising: A lighting unit for irradiating illumination light to a shooting area including a plurality of substrates, wherein the plurality of substrates are inserted into a plurality of holding grooves of a substrate holder and arranged in a specified arrangement direction; A shooting unit for shooting the shooting area and generating a shooting image, the shooting image including a plurality of pixel blocks representing the sides of the plurality of substrates; A storage unit for storing a reference grid, a plurality of detection positions, and a reference width of the side of a single substrate, wherein the reference grid includes a search area and a defective area, and the plurality of detection positions include at least two detection positions configured for each of the holding grooves; A search unit for searching for the pixel blocks in the image of the shooting image located within the reference grid at each of the detection positions and outputting search information of the pixel blocks in the reference grid; A determination unit for determining the holding state of the plurality of substrates in the corresponding holding grooves based on the search information.

2. The substrate detection device according to claim 1, wherein The search information includes the presence or absence of the pixel blocks in the search area, the width of the pixel blocks in the search area, and the presence or absence of the pixel blocks in the defective area.

3. The substrate detection device according to claim 2, wherein The reference grid includes one search area and two defective areas, and the two defective areas are respectively established on both sides of the search area.

4. The substrate detection device according to claim 2, wherein The reference grid includes one search area and two defective areas, wherein the two defective areas are configured to be established on both sides of the pixel block when there is the pixel block in the search area.

5. The substrate detection device according to claim 3 or 4, characterized in that, The at least two detection positions for each of the holding grooves include a first detection position and a second detection position; The search information output by the reference grid at the first detection position is that there is the pixel block in the search area of the reference grid and the width of the pixel block conforms to the reference width, and there is no pixel block in the defective area of the reference grid. At the same time, When the search information output by the reference grid at the second detection position is that there is the pixel block in the search area of the reference grid and the width of the pixel block conforms to the reference width, and there is no pixel block in the defective area of the reference grid, the determination unit determines that the detected substrate is in a normal holding state. Otherwise, the determination unit determines that the detected substrate is in an abnormal holding state.

6. The substrate detection device according to claim 3 or 4, characterized in that The at least two detection positions for each of the holding grooves include a first detection position and a second detection position; The search information output by the reference grid at the first detection position is that there is the pixel block in the search area of the reference grid but the width of the pixel block does not conform to the reference width, and there is no pixel block in the defective area of the reference grid. At the same time, When the search information output by the reference grid at the second detection position is that there is the pixel block in the search area of the reference grid but the width of the pixel block does not conform to the reference width, and there is no pixel block in the defective area of the reference grid, the determination unit determines that the detected substrate has a lamination or warping abnormality.

7. The substrate detection device according to claim 3, wherein, The at least two detection positions for each of the holding grooves include a first detection position and a second detection position; The search information output by the reference grid at the first detection position is that there is no pixel block in the search area of the reference grid, and there is no pixel block in the defective area of the reference grid. At the same time, The search information output by the reference cell at the second detection position is that when there is no such pixel block in the search area of the reference cell and there is no such pixel block in the defective area of the reference cell, the judgment unit determines that the detected substrate has a missing abnormality.

8. The substrate detection device according to claim 4, wherein The at least two detection positions of each holding groove include a first detection position and a second detection position; The search information output by the reference cell at the first detection position is that there is no such pixel block in the search area of the reference cell, and at the same time, The search information output by the reference cell at the second detection position is that when there is no such pixel block in the search area of the reference cell, the judgment unit determines that the detected substrate has a missing abnormality.

9. The substrate detection device according to claim 3, wherein The at least two detection positions of each holding groove include a first detection position and a second detection position; The search information output by the reference cell at the first detection position is that there is such pixel block in the defective area of the reference cell, or The search information output by the reference cell at the second detection position is that when there is such pixel block in the defective area of the reference cell, the judgment unit determines that the detected substrate has an inclined insertion abnormality.

10. The substrate detection device according to claim 4, characterized in that, The at least two detection positions of each holding groove include a first detection position and a second detection position; The search information output by the reference cell at the first detection position is that there is such pixel block in the search area of the reference cell and there is such pixel block in the defective area of the reference cell, or The search information output by the reference cell at the second detection position is that when there is such pixel block in the search area of the reference cell and there is such pixel block in the defective area of the reference cell, the judgment unit determines that the detected substrate has an inclined insertion abnormality.

11. The substrate detection device according to claim 1, wherein The illumination unit is arranged below the multiple substrates, so that the irradiation light of the illumination unit passes through the gaps between the multiple substrates; The photographing unit is arranged above the multiple substrates and is used for photographing the photographing area after the irradiation light passes through the gap and generating the photographed image. The multiple pixel blocks included in the photographed image are multiple dark blocks where the illumination light is blocked by the side surfaces of the multiple substrates.

12. The substrate detection device according to claim 11, wherein The illumination unit is arranged on the substrate support.

13. The substrate detection device according to claim 1, wherein, The illumination unit is arranged above the multiple substrates, so that the illumination light of the illumination unit irradiates the side surfaces of the multiple substrates; The photographing unit is arranged above the multiple substrates and is used for photographing the photographing area after the illumination light of the illumination unit irradiates the side surfaces of the multiple substrates and generating the photographed image. The multiple pixel blocks included in the photographed image are bright blocks of the reflected light where the illumination light irradiates the side surfaces of the multiple substrates.

14. The substrate detection device according to claim 1, characterized in that, The photographing unit includes at least one camera.

15. The substrate detection device according to claim 1, characterized in that, The illumination unit includes at least one light bar.

16. The substrate detection device according to claim 1, wherein, The reference cell includes at least one movable reference cell, and the movable reference cell can move to the multiple detection positions.

17. The substrate detection device according to claim 1, wherein, The reference cell includes multiple fixed reference cells, and the multiple fixed reference cells are respectively located at the multiple detection positions.

18. The substrate detection device according to claim 1, wherein It further includes: An alarm unit for alarming when the judgment unit determines that the detected substrate has an abnormality.

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