Semiconductor heating device with efficient temperature control function

Abstract

The invention discloses a semiconductor heating device with an efficient temperature control function, and relates to the technical field of semiconductor heating devices. Comprising a support, a cavity, a heating disc, an upper cover, a heat energy snifting valve, a compensation positioning device, a cooling plate and a conveying pipe, the heat energy snifting valve is used for recycling part of heat in the heating and cooling process, when a control system detects that the temperature of the cavity is ultrahigh, the heat energy snifting valve is automatically opened, and a piston head converts the recycled heat into kinetic energy; kinetic energy is transmitted to the air injection piston through the hydraulic medium, the air injection piston quickly extrudes low-temperature inert gas in the air storage chamber into the arc-shaped spray heads, and the arc-shaped spray heads uniformly spray low-temperature airflow to the wafer from the periphery, so that the wafer is cooled without dead angles, and displacement caused by unbalanced stress of the wafer is also prevented; and the purpose of stable cooling compensation of the wafer is achieved. The gas storage chamber is arranged in the cooling plate, and the cooling liquid in the cooling plate is used for protecting the temperature of the inert gas in the gas storage chamber.

Description

Technical Field

[0001] The present invention relates to the technical field of heating devices for semiconductors, and specifically to a heating device for semiconductors with an efficient temperature control function. Background Art

[0002] As the semiconductor manufacturing process evolves towards smaller line widths and three-dimensional integration, the accuracy and uniformity of wafer heat treatment have become key factors affecting device performance. Existing heating devices mainly consist of mechanisms such as a heating chamber part, a temperature control part, a vacuum part, and a cooling part. Wafer heating devices are widely used in processes such as thin film deposition, rapid thermal annealing, oxidation, and chemical vapor deposition, and their core function is to achieve precise control of the wafer surface temperature.

[0003] However, existing heating devices still have defects in temperature control. During the heating process and the cooling process, when the temperature in the heating device chamber exceeds the preset value due to temperature control errors, the control system will adjust the temperature of the coolant in the chiller, causing the chiller to produce coolant at a lower temperature to replace the previous coolant. This process will generate a certain time interval, resulting in a lag in the cooling of the chamber by the cooling plate and increasing the risk of overheating and damage to the wafer. Summary of the Invention

[0004] The purpose of the present invention is to provide a heating device for semiconductors with an efficient temperature control function to solve the problems raised in the prior art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A heating device for semiconductors with an efficient temperature control function, including a bracket, on which a chamber is installed. A top cover is rotatably installed at the top of the chamber. A heating plate is installed inside the chamber. A number of cooling plates are provided inside the chamber. A compensation positioning device is installed on the cooling plate, and the compensation positioning device is slidably connected to the heating plate. A thermal energy jet valve is installed on the cooling plate, and a delivery pipe is installed on the thermal energy jet valve. The delivery pipe is connected to the compensation positioning device.

[0006] The heating device is externally connected to a control system, which is used to control the entire heating device. A water flow channel is provided inside the cooling plate, and the cooling plate is externally connected to a chiller, which is used to deliver coolant into the water flow channel of the cooling plate. A number of temperature measurement sensors are provided inside the heating plate, and the surface temperature of the heating plate is fed back to the control system through the number of temperature measurement sensors, so as to obtain the surface temperature and temperature uniformity of the heating plate. Heating wires are also provided inside the heating plate, which are used to heat the heating plate. The outside of the chamber is connected to a vacuum pump, which is used to keep the chamber in a vacuum state. The delivery pipe uses a flexible telescopic pipeline.

[0007] Further, the compensation positioning device includes a first electric telescopic rod, which is installed on the cooling plate. A sliding housing is installed on the output shaft of the first electric telescopic rod. A number of sliding grooves are provided on the heating plate, and the sliding housing is slidably connected to the heating plate through the sliding grooves. A jet positioning assembly is slidably installed in the sliding housing. A protective spring is installed between the jet positioning assembly and the sliding housing. The jet positioning assembly is connected to the delivery pipe.

[0008] Further, the jet positioning assembly includes a vertical rod. A positioning block is installed on the vertical rod. A flexible cushion is installed on the side of the positioning block close to the wafer. A sliding tube is installed at the bottom end of the vertical rod. An arc-shaped nozzle is installed at the top end of the vertical rod. The sliding tube is slidably connected to the sliding housing. The vertical rod is slidably connected to the sliding housing. A protective spring is installed between the vertical rod and the sliding housing.

[0009] Further, an air jet channel is provided in the vertical rod. The air jet channel penetrates through the sliding tube. The sliding tube is communicated with the delivery pipe. An arc-shaped flow channel is provided in the arc-shaped nozzle. The arc-shaped flow channel is communicated with the air jet channel. A duckbill is provided on the arc-shaped nozzle.

[0010] Place the wafer on the heating plate. The control system starts the first electric telescopic rod. The output shaft of the first electric telescopic rod drives the sliding housing to extend forward. The sliding housing slides in the sliding groove and drives the jet positioning assembly to approach the wafer. The positioning block on the jet positioning assembly pushes the wafer from all around, making the wafer move to the center. Since a flexible cushion is provided on the positioning block, the side of the wafer can be prevented from being knocked. When the sliding housing is displaced excessively, the positioning block cannot move due to the obstruction of the side of the wafer. Under the reverse force of the wafer, the entire jet positioning assembly generates a reverse displacement relative to the sliding housing and retracts. The protective spring is compressed and contracts, avoiding excessive extrusion of the side of the wafer by the positioning block and causing damage to the wafer. After the centering is completed, the control system controls the output shaft of the first electric rod to drive the sliding housing to retract, so that the arc-shaped nozzle is in the best spraying position.

[0011] After that, turn on the vacuum pump to evacuate the cavity. After the vacuum degree reaches the set value, the heating plate is turned on for heating. The control system controls the chiller to start according to the electrical signal transmitted by the temperature measurement sensor. The chiller delivers the coolant at the corresponding temperature to the cooling plate to stabilize the temperature inside the cavity and prevent the inside of the cavity from overheating. After the heating is completed, turn off the heating plate. The control system cools the inside of the cavity using the cooling plate according to the temperature feedback by the temperature measurement sensor. After the cooling is completed, the control system turns off the vacuum pump and the chiller, and opens the air release valve to make the pressure inside the cavity consistent with the atmospheric pressure, and at the same time sends a signal to prompt to take away the wafer.

[0012] Furthermore, the thermal energy jet valve includes a valve body installed on a cooling plate. An expansion chamber is provided inside the valve body, filled with an expansion medium. A damping tube is provided inside the valve body, with several extrusion holes on it. A hydraulic chamber is provided inside the valve body, filled with a hydraulic medium. A gas storage chamber is provided inside the valve body. An air outlet is provided on the valve body, and an electric valve is provided at the air outlet. A connector is installed on the valve body, and an air supply device is externally connected to the connector. Both the gas storage port and the connector are located at the position of the gas storage chamber, and the gas storage chamber is located inside the cooling plate.

[0013] The air supply device is used to quantitatively input low-temperature inert gas into the gas storage chamber. The expansion medium is a medium with a high coefficient of thermal expansion, and the hydraulic medium uses a hydraulic oil with a low coefficient of thermal expansion. Since the gas storage chamber is located inside the cooling plate, the coolant inside the cooling plate can play a role in protecting the temperature of the inert gas inside the gas storage chamber, preventing the inert gas from heating up. A hydraulic chamber is arranged between the expansion chamber and the gas storage chamber to avoid the connection between the expansion chamber and the gas storage chamber, resulting in heat exchange and causing the inert gas to heat up.

[0014] Furthermore, the thermal energy jet valve further includes a jet piston, a transmission piston, an electric valve rod, a second electric telescopic rod, and a thermal energy damper. The jet piston is slidably installed inside the valve body, located between the hydraulic chamber and the gas storage chamber. The transmission piston is slidably installed inside the damping tube. The electric valve rod is installed inside the valve body, and a valve plate is installed on the output shaft of the electric valve rod. The valve plate is slidably connected to the valve body. The second electric telescopic rod is installed on the cooling plate, and the output shaft of the second electric telescopic rod penetrates the valve body. The thermal energy damper is installed inside the damping tube.

[0015] The electric valve rod can be electrically controlled to expand and contract, and is used to drive the valve plate to expand and contract and slide.

[0016] During the working process, the inside of the cavity is gradually heated due to the influence of thermal radiation. After the valve body is heated, it recovers the heat and transfers it to the expansion chamber. The expansion medium inside the expansion chamber expands when heated, increasing the pressure inside the expansion chamber. When the valve plate is opened, under the action of the pressure, the piston head is pressed and quickly pops out. The higher the temperature inside the cavity, the greater the pressure, and the longer the sliding distance and the faster the speed of the piston head.

[0017] During the heating process and the cooling process, when the control system detects that the temperature of the cavity is too high, it will also synchronously open the electric valve at the air outlet and the electric valve rod. The electric valve rod drives the valve plate to retract. The piston head that loses the block quickly pops out. The piston head slides and pushes the hydraulic medium, and the hydraulic medium acts on the jet piston with the thrust. The jet piston quickly squeezes out the low-temperature inert gas inside the gas storage chamber. The inert gas enters the conveying pipe from the air outlet, enters the arc-shaped flow channel through the jet hole channel, and finally sprays out from the duckbill to form a single-strand fan-shaped low-temperature air flow. Multiple arc-shaped nozzles spray low-temperature air flow evenly on the wafer from all around, not only cooling the wafer without dead angles, but also preventing the wafer from being displaced due to unbalanced force, achieving the purpose of stable temperature compensation for the wafer.

[0018] After the cooling compensation is completed, the control system closes the electric valve at the air outlet, and then turns on the second electric telescopic rod and the air supply device. The output shaft of the second electric telescopic rod pushes the transmission piston to reset. After resetting, the control valve plate descends to reset the transmission piston, and the air supply device replenishes the low-temperature inert gas in the air storage chamber.

[0019] Further, the transmission piston includes a piston rod. The piston rod is slidably installed in the damping tube. A plurality of corrugated grooves are provided on the piston rod. One end of the piston rod is provided with a piston head. The piston head is slidably connected to the valve body. The piston head is located between the expansion chamber and the hydraulic chamber.

[0020] Further, the thermal energy damper includes a transmission rod. The transmission rod is slidably installed in the damping tube. A pressing piece is installed at the top end of the transmission rod. An extrusion head is installed at the bottom end of the transmission rod. A damping spring is installed between the pressing piece and the damping tube. The extrusion hole is located at the top end of the pressing piece. Both the pressing piece and the extrusion head are slidably connected to the damping tube.

[0021] The pressure generated in the expansion chamber acts not only on the piston head, but also on the pressing piece through the extrusion hole. After being pressed, the pressing piece overcomes the elastic force of the damping spring and drives the transmission rod to move downward. The transmission rod drives the extrusion head to move downward. The extrusion head moves downward and is embedded in the corrugated groove. When the piston head drives the piston rod to slide, the extrusion head prevents the piston rod from sliding through the corrugated groove, thereby generating a damping effect on the piston rod.

[0022] Under the action of damping, the movement of the transmission piston is slowed down. Through adjustment and matching, the movement time of the transmission piston is made consistent with the cooling hysteresis time. Indirectly, the discharge time of the inert gas in the air storage chamber is consistent with the cooling hysteresis time, and the spraying time of a single-strand fan-shaped low-temperature air flow corresponds to the coolant switching interval time in the cooling plate, thereby making up for the hysteresis of coolant switching and improving the temperature control effect.

[0023] The higher the temperature in the cavity, the greater the pressure in the expansion chamber, the greater the pressure on the pressing piece, and the greater the displacement generated by driving the extrusion head. As a result, the degree to which the extrusion head is embedded in the corrugated groove is greater, the damping effect on the piston rod is greater, and the effect of slowing down the displacement speed of the transmission piston is better. This enables the thermal energy damper to automatically adjust the damping force according to the temperature, avoid the transmission piston from moving too fast, and ensure sufficient spraying time of the low-temperature air flow.

[0024] Compared with the prior art, the beneficial effects of the present invention are: 1. Use the first electric telescopic rod to drive the compensation positioning device to move and expand in the middle of the heating plate, thereby driving the wafer to displace and align, ensuring that the wafer is centered on the heating plate, making the heat absorption and dissipation of the wafer uniform around. Through the flexible cushion provided on the positioning block, prevent the wafer from being knocked on the side; use the characteristic that the jet positioning component slides and rebounds relative to the sliding housing to avoid excessive displacement of the sliding housing, and prevent the positioning block from over-extruding the side of the wafer and causing damage to the wafer, thereby realizing non-destructive alignment of the wafer.

[0025] 2. Use the thermal energy damper to convert part of the thermal energy absorbed by the thermal energy jet valve into damping force on the transmission piston, making the injection time of the single-strand fan-shaped low-temperature air flow correspond to the coolant switching interval time in the cooling plate, thereby compensating for the lag of coolant switching and improving the temperature control effect. And the thermal energy damper can automatically adjust the damping force according to the temperature to avoid the transmission piston from moving too fast and ensure that the low-temperature air flow is injected for enough time.

[0026] 3. Use the thermal energy jet valve to recover part of the heat during the heating and cooling processes. When the control system detects that the cavity temperature is too high, automatically open the thermal energy jet valve. The piston head converts the recovered heat into kinetic energy, and transfers the kinetic energy to the jet piston through the hydraulic medium. The jet piston quickly squeezes the low-temperature inert gas in the gas storage chamber into the arc-shaped nozzles, and multiple arc-shaped nozzles uniformly inject low-temperature air flow from all around to the wafer, which not only cools the wafer without dead angles, but also prevents the wafer from being displaced due to unbalanced force, achieving the purpose of stable temperature reduction compensation for the wafer.

[0027] 4. Set the gas storage chamber in the cooling plate, and use the coolant in the cooling plate to protect the temperature of the inert gas in the gas storage chamber to prevent the inert gas from heating up. A hydraulic chamber is set between the expansion chamber and the gas storage chamber to avoid the connection between the expansion chamber and the gas storage chamber, resulting in heat exchange and causing the inert gas to heat up. Thus, the purpose of multiple temperature protections for the inert gas is achieved. Brief Description of the Drawings

[0028] Figure 1 is the overall three-dimensional view of the heating device of the present invention; Figure 2 is the three-dimensional Figure 1 ; Figure 3 is the three-dimensional Figure 2 ; Figure 4 is the three-dimensional view of the thermal energy jet valve and the compensation positioning device of the present invention; Figure 5 is the three-dimensional view of the compensation positioning device of the present invention; Figure 6 is the three-dimensional view of the jet positioning component of the present invention; Figure 7Isometric view of the thermal energy jet valve of the present invention; Figure 8 Of the present invention Figure 7 Partial enlarged view of area A in; Figure 9 Isometric view of the valve body of the present invention; Figure 10 Isometric view of the drive piston of the present invention; Figure 11 Isometric view of the thermal energy damper of the present invention.

[0029] In the figure: 1, bracket; 2, cavity; 3, heating plate; 4, upper cover; 5, thermal energy jet valve; 6, compensation positioning device; 7, cooling plate; 8, delivery pipe; 31, chute; 61, first electric telescopic rod; 62, sliding housing; 63, jet positioning assembly; 64, protective spring; 631, arc-shaped nozzle; 632, sliding pipe; 633, jet hole channel; 634, positioning block; 635, vertical rod; 6311, arc-shaped flow channel; 6312, duckbill; 51, valve body; 52, second electric telescopic rod; 53, drive piston; 54, jet piston; 55, thermal energy damper; 56, electric valve rod; 57, valve plate; 511, connector; 512, air outlet; 513, expansion chamber; 514, hydraulic chamber; 515, damping pipe; 516, gas storage chamber; 517, extrusion hole; 531, piston head; 532, piston rod; 533, corrugated groove; 551, extrusion head; 552, pressing piece; 553, drive rod; 554, damping spring. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] As Figures 1-11 Shown, the present invention provides a technical solution for a heating device for semiconductor with high-efficiency temperature control function: including a bracket 1, a cavity 2 is installed on the bracket 1, an upper cover 4 is rotatably installed at the top of the cavity 2, a heating plate 3 is installed in the cavity 2, several cooling plates 7 are arranged in the cavity 2, a compensation positioning device 6 is installed on the cooling plate 7, the compensation positioning device 6 is slidably connected with the heating plate 3, a thermal energy jet valve 5 is installed on the cooling plate 7, a delivery pipe 8 is installed on the thermal energy jet valve 5, and the delivery pipe 8 is connected with the compensation positioning device 6.

[0032] The heating device is externally connected to a control system, which is used to control the entire heating device. The cooling plate 7 is provided with a water flow channel, and the cooling plate 7 is externally connected to a chiller, which is used to transport coolant into the water flow channel of the cooling plate 7. The heating plate 3 is provided with a number of temperature sensors, and the surface temperature of the heating plate 3 is fed back to the control system through the number of temperature sensors, so as to obtain the surface temperature and temperature uniformity of the heating plate 3; the heating plate 3 is also provided with heating wires, which are used to heat the heating plate 3. The cavity 2 is externally connected to a vacuum pump, which is used to keep the cavity 2 in a vacuum state. The conveying pipe 8 adopts a flexible telescopic pipe.

[0033] The compensation positioning device 6 includes a first electric telescopic rod 61, the first electric telescopic rod 61 is installed on the cooling plate 7, a sliding outer shell 62 is installed on the output shaft of the first electric telescopic rod 61, a number of sliding grooves 31 are provided on the heating plate 3, and the sliding outer shell 62 is slidably connected to the heating plate 3 through the sliding grooves 31. A jet positioning component 63 is slidably installed in the sliding outer shell 62, a protective spring 64 is installed between the jet positioning component 63 and the sliding outer shell 62, and the jet positioning component 63 is connected to the conveying pipe 8.

[0034] The jet positioning component 63 includes a vertical rod 635, a positioning block 634 is installed on the vertical rod 635, a flexible cushion is installed on the side of the positioning block 634 close to the wafer, a sliding tube 632 is installed at the bottom end of the vertical rod 635, an arc-shaped nozzle 631 is installed at the top end of the vertical rod 635, the sliding tube 632 is slidably connected to the sliding outer shell 62, the vertical rod 635 is slidably connected to the sliding outer shell 62, and a protective spring 64 is installed between the vertical rod 635 and the sliding outer shell 62.

[0035] The vertical rod 635 is provided with a jet hole channel 633, the jet hole channel 633 penetrates through the sliding tube 632, the sliding tube 632 is communicated with the conveying pipe 8, the arc-shaped nozzle 631 is provided with an arc-shaped flow channel 6311, the arc-shaped flow channel 6311 is communicated with the jet hole channel 633, and the arc-shaped nozzle 631 is provided with a duckbill 6312.

[0036] The thermal energy jet valve 5 includes a valve body 51, the valve body 51 is installed on the cooling plate 7, an expansion chamber 513 is provided in the valve body 51, an expansion medium is filled in the expansion chamber 513, a damping tube 515 is provided in the valve body 51, a number of extrusion holes 517 are provided on the damping tube 515, a hydraulic chamber 514 is provided in the valve body 51, a hydraulic medium is filled in the hydraulic chamber 514, a gas storage chamber 516 is provided in the valve body 51, an air outlet 512 is provided on the valve body 51, an electric valve is provided at the air outlet 512, a connector 511 is installed on the valve body 51, a gas supply device is externally connected to the connector 511, the gas storage port and the connector 511 are both located at the position of the gas storage chamber 516, and the gas storage chamber 516 is located in the cooling plate 7.

[0037] The gas supply device is used to quantitatively input low-temperature inert gas into the gas storage chamber 516. The expansion medium is a medium with a high coefficient of thermal expansion, and the hydraulic medium uses a hydraulic oil with a low coefficient of thermal expansion. Since the gas storage chamber 516 is located in the cooling plate 7, the coolant in the cooling plate 7 can play a role in protecting the temperature of the inert gas in the gas storage chamber 516, preventing the inert gas from heating up. A hydraulic chamber 514 is provided between the expansion chamber 513 and the gas storage chamber 516 to prevent the expansion chamber 513 from being connected to the gas storage chamber 516, resulting in heat exchange and causing the inert gas to heat up.

[0038] The thermal energy jet valve 5 further includes a jet piston 54, a transmission piston 53, an electric valve stem 56, a second electric telescopic rod 52, and a thermal energy damper 55. The jet piston 54 is slidably installed in the valve body 51. The jet piston 54 is located between the hydraulic chamber 514 and the gas storage chamber 516. The transmission piston 53 is slidably installed in the damping tube 515. The electric valve stem 56 is installed in the valve body 51. A valve plate 57 is installed on the output shaft of the electric valve stem 56. The valve plate 57 is slidably connected to the valve body 51. The second electric telescopic rod 52 is installed on the cooling plate 7. The output shaft of the second electric telescopic rod 52 penetrates the valve body 51. The thermal energy damper 55 is installed in the damping tube 515. The electric valve stem 56 can be electrically controlled to expand and contract, and is used to drive the valve plate 57 to expand and contract and slide.

[0039] During the working process, the inside of the cavity 2 is gradually heated by thermal radiation and the temperature rises. After the valve body 51 is heated, it recovers and transfers the heat to the expansion chamber 513. The expansion medium in the expansion chamber 513 expands due to heat, increasing the pressure in the expansion chamber 513. When the valve plate 57 is opened, under the action of the pressure, the piston head 531 is pressed and quickly pops out. The higher the temperature in the cavity 2, the greater the pressure, and the longer the sliding distance and the faster the speed of the piston head 531.

[0040] The transmission piston 53 includes a piston rod 532. The piston rod 532 is slidably installed in the damping tube 515. A number of corrugated grooves 533 are provided on the piston rod 532. One end of the piston rod 532 is installed with a piston head 531. The piston head 531 is slidably connected to the valve body 51. The piston head 531 is located between the expansion chamber 513 and the hydraulic chamber 514.

[0041] The thermal energy damper 55 includes a transmission rod 553. The transmission rod 553 is slidably installed in the damping tube 515. A pressing piece 552 is installed at the top of the transmission rod 553. An extrusion head 551 is installed at the bottom of the transmission rod 553. A damping spring 554 is installed between the pressing piece 552 and the damping tube 515. The extrusion hole 517 is located at the top of the pressing piece 552. Both the pressing piece 552 and the extrusion head 551 are slidably connected to the damping tube 515.

[0042] Working principle of the present invention: Place the wafer on the heating plate 3. The control system starts the first electric telescopic rod 61. The output shaft of the first electric telescopic rod 61 drives the sliding housing 62 to extend forward. The sliding housing 62 slides in the chute 31 and drives the jet positioning assembly 63 to approach the wafer. The positioning blocks 634 on the jet positioning assembly 63 push the wafer from all around, making the wafer move to the center. Since the positioning blocks 634 are provided with flexible pads, the side of the wafer can be prevented from being bumped. When the sliding housing 62 is displaced excessively, the positioning blocks 634 are blocked by the side of the wafer and cannot move. Under the reverse force of the wafer, the entire jet positioning assembly 63 generates a reverse displacement relative to the sliding housing 62 and retracts, and the protective spring 64 is compressed and contracts, avoiding excessive extrusion of the positioning blocks 634 on the side of the wafer and causing damage to the wafer. After centering is completed, the control system controls the output shaft of the first electric rod to drive the sliding housing 62 to retract, so that the arc nozzle is in the best spraying position.

[0043] After that, turn on the vacuum pump to evacuate the cavity 2. After the vacuum degree reaches the set value, the heating plate 3 is turned on for heating. The control system controls the chiller to start according to the electrical signal transmitted by the temperature measurement sensor. The chiller delivers the coolant at the corresponding temperature to the cooling plate 7 to stabilize the temperature inside the cavity 2 and prevent the inside of the cavity 2 from overheating. After heating is completed, turn off the heating plate 3. The control system cools the inside of the cavity 2 using the cooling plate 7 according to the temperature feedback by the temperature measurement sensor. After cooling is completed, the control system turns off the vacuum pump and the chiller, and opens the air release valve to make the pressure inside the cavity 2 consistent with the atmospheric pressure, and at the same time sends a signal to prompt to take away the wafer.

[0044] During the heating process and the cooling process, when the control system detects that the temperature of the cavity 2 is too high, the electric valve at the air outlet 512 and the electric valve rod 56 will be synchronously opened. The electric valve rod 56 drives the valve plate 57 to retract. The piston head 531 that loses the block quickly pops out. The piston head 531 slides and pushes the hydraulic medium. The hydraulic medium acts on the jet piston 54 with the thrust. The jet piston 54 quickly squeezes out the low-temperature inert gas in the gas storage chamber 516. The inert gas enters the delivery pipe 8 from the air outlet 512, enters the arc flow channel 6311 through the jet hole channel 633, and finally sprays out from the duckbill 6312 to form a single-strand fan-shaped low-temperature air flow. Multiple arc nozzles 631 spray the low-temperature air flow uniformly on the wafer from all around, not only cooling the wafer without dead angles, but also preventing the wafer from being displaced due to unbalanced force, achieving the purpose of stable temperature reduction compensation for the wafer.

[0045] After the temperature reduction compensation is completed, the control system closes the electric valve at the air outlet 512, and then turns on the second electric telescopic rod 52 and the air supply device. The output shaft of the second electric telescopic rod pushes the transmission piston 53 to reset. After resetting, the control valve plate 57 descends to reset the transmission piston 53, and the air supply device replenishes the low-temperature inert gas to the gas storage chamber 516.

[0046] The pressure generated by the expansion chamber 513 acts not only on the piston head 531, but also on the pressing piece 552 through the extrusion holes 517. After being pressed, the pressing piece 552 overcomes the elastic force of the damping spring 554 and drives the transmission rod 553 to move downward. The transmission rod 553 drives the extrusion head 551 to move downward. The extrusion head 551 moves downward and engages with the corrugated groove 533. When the piston head 531 drives the piston rod 532 to slide, the extrusion head 551 prevents the piston rod 532 from sliding through the corrugated groove 533, thereby generating a damping effect on the piston rod 532.

[0047] Under the action of damping, the movement of the transmission piston 53 is slowed down. Through adjustment and matching, the movement time of the transmission piston 53 is made consistent with the cooling delay time. Indirectly, the discharge time of the inert gas in the gas storage chamber 516 is consistent with the cooling delay time, and the injection time of the single-strand fan-shaped low-temperature air flow corresponds to the coolant switching interval time in the cooling plate 7, thereby compensating for the delay in coolant switching and improving the temperature control effect.

[0048] The higher the temperature in the cavity 2, the greater the pressure in the expansion chamber 513, the greater the pressure on the pressing piece 552, the greater the displacement generated by driving the extrusion head 551, so that the degree of the extrusion head 551 engaging with the corrugated groove 533 is greater, the greater the damping effect on the piston rod 532, and the better the effect of slowing down the displacement speed of the transmission piston 53. This enables the thermal energy damper 55 to automatically adjust the damping force according to the temperature, prevent the transmission piston 53 from moving too fast, and ensure sufficient time for the injection of the low-temperature air flow.

[0049] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed within the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A heating device for semiconductors with an efficient temperature control function, characterized in that: The heating device includes a bracket (1), on which a cavity (2) is installed. A top cover (4) is rotatably installed at the top of the cavity (2). A heating plate (3) is installed inside the cavity (2). A number of cooling plates (7) are provided inside the cavity (2). A compensation positioning device (6) is installed on the cooling plate (7). The compensation positioning device (6) is slidably connected to the heating plate (3). A thermal energy jet valve (5) is installed on the cooling plate (7). A delivery pipe (8) is installed on the thermal energy jet valve (5). The delivery pipe (8) is connected to the compensation positioning device (6).

2. The heating device for semiconductor with an efficient temperature control function according to claim 1, characterized in that: The compensation positioning device (6) includes a first electric telescopic rod (61), which is installed on the cooling plate (7). A sliding outer shell (62) is installed on the output shaft of the first electric telescopic rod (61). A number of sliding grooves (31) are provided on the heating plate (3). The sliding outer shell (62) is slidably connected to the heating plate (3) through the sliding grooves (31). A jet positioning assembly (63) is slidably installed inside the sliding outer shell (62). A protective spring (64) is installed between the jet positioning assembly (63) and the sliding outer shell (62). The jet positioning assembly (63) is connected to the delivery pipe (8).

3. The heating device for semiconductor with an efficient temperature control function according to claim 2, wherein: The jet positioning assembly (63) includes a vertical rod (635), on which a positioning block (634) is installed. A flexible gasket is installed on the side of the positioning block (634) close to the wafer. A sliding tube (632) is installed at the bottom end of the vertical rod (635). An arc-shaped nozzle (631) is installed at the top end of the vertical rod (635). The sliding tube (632) is slidably connected to the sliding outer shell (62). The vertical rod (635) is slidably connected to the sliding outer shell (62). A protective spring (64) is installed between the vertical rod (635) and the sliding outer shell (62).

4. The heating device for semiconductor with an efficient temperature control function according to claim 3, characterized in that: A jet hole channel (633) is provided inside the vertical rod (635). The jet hole channel (633) penetrates through the sliding tube (632). The sliding tube (632) is communicated with the delivery pipe (8). An arc-shaped flow channel (6311) is provided inside the arc-shaped nozzle (631). The arc-shaped flow channel (6311) is communicated with the jet hole channel (633). A duckbill (6312) is provided on the arc-shaped nozzle (631).

5. The heating device for semiconductor with an efficient temperature control function according to claim 1, characterized in that: The thermal energy jet valve (5) includes a valve body (51). The valve body (51) is installed on a cooling plate (7). An expansion chamber (513) is provided in the valve body (51), and an expansion medium is filled in the expansion chamber (513). A damping tube (515) is provided in the valve body (51), and a number of extrusion holes (517) are provided on the damping tube (515). A hydraulic chamber (514) is provided in the valve body (51), and a hydraulic medium is filled in the hydraulic chamber (514). An air storage chamber (516) is provided in the valve body (51). An air outlet (512) is provided on the valve body (51), and an electric valve is provided at the air outlet (512). A connector (511) is installed on the valve body (51), and an air supply device is externally connected to the connector (511). The air storage port and the connector (511) are both located at the position of the air storage chamber (516), and the air storage chamber (516) is located in the cooling plate (7).

6. The heating device for semiconductor with an efficient temperature control function according to claim 5, characterized in that: The thermal energy jet valve (5) further includes a jet piston (54), a transmission piston (53), an electric valve rod (56), a second electric telescopic rod (52) and a thermal energy damper (55). The jet piston (54) is slidably installed in the valve body (51), and the jet piston (54) is located between the hydraulic chamber (514) and the air storage chamber (516). The transmission piston (53) is slidably installed in the damping tube (515). The electric valve rod (56) is installed in the valve body (51), and a valve plate (57) is installed on the output shaft of the electric valve rod (56). The valve plate (57) is slidably connected to the valve body (51). The second electric telescopic rod (52) is installed on the cooling plate (7), and the output shaft of the second electric telescopic rod (52) penetrates the valve body (51). The thermal energy damper (55) is installed in the damping tube (515).

7. The heating device for semiconductor with an efficient temperature control function according to claim 6, wherein: The transmission piston (53) includes a piston rod (532). The piston rod (532) is slidably installed in the damping tube (515). A number of corrugated grooves (533) are provided on the piston rod (532). A piston head (531) is installed at one end of the piston rod (532). The piston head (531) is slidably connected to the valve body (51), and the piston head (531) is located between the expansion chamber (513) and the hydraulic chamber (514).

8. The heating device for semiconductor with an efficient temperature control function according to claim 6, wherein: The thermal energy damper (55) includes a transmission rod (553). The transmission rod (553) is slidably installed in the damping tube (515). A pressing piece (552) is installed at the top end of the transmission rod (553), and an extrusion head (551) is installed at the bottom end of the transmission rod (553). A damping spring (554) is installed between the pressing piece (552) and the damping tube (515). The extrusion holes (517) are located at the top end of the pressing piece (552). Both the pressing piece (552) and the extrusion head (551) are slidably connected to the damping tube (515).

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