A device for automatic wafer edge positioning and thickness measurement

Abstract

The present invention discloses a device for automatic wafer edge positioning and thickness measurement, comprising a mounting frame, a horizontal moving component, a vertical moving component, a drive motor, a wafer suction cup, a laser micrometer and a thickness measuring mechanism. The horizontal moving component is arranged on the mounting frame, the vertical moving component is installed on the moving mechanism of the horizontal moving component, the drive motor is installed on the moving mechanism of the vertical moving component, and the wafer suction cup is arranged on the top of the rotating shaft; a wafer placement bar is provided on each side of the wafer suction cup, and the laser micrometer and the thickness measuring mechanism are both installed on the mounting frame. The technical effects achieved are: it is compatible with wafers of various sizes, can realize automatic edge positioning of the wafer, can quickly determine the center of the wafer itself and the position of the wafer cut edge or groove; at the same time, the laser micrometer and the wafer suction cup are used in combination to greatly improve the positioning accuracy; by setting up the thickness measuring mechanism, one device can simultaneously realize the measurement of wafer thickness, which can save space and cost.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer center confirmation and thickness measurement, and in particular to a device for automatic wafer edge positioning and thickness measurement. Background Art

[0002] Semiconductor technology is rapidly penetrating traditional industries such as healthcare, energy, and agriculture, supporting their intelligent and digital transformation. Third-generation semiconductor materials, represented by silicon carbide (SiC) and gallium nitride (GaN), are rapidly developing, demonstrating significant advantages in high-temperature, high-frequency, and high-power applications. They are gradually gaining widespread adoption in related fields, with wafers of various sizes, including 4-inch, 6-inch, 8-inch, and 12-inch, now being produced on the same production line. During chip production, wafer size consistency significantly impacts subsequent manufacturing processes. Therefore, wafer centering and thickness measurement are crucial in wafer manufacturing. Existing wafer positioning devices typically employ a clamping mechanism, requiring a unique clamping mold for wafers of varying diameters. This results in poor compatibility, complex structure, and difficulty ensuring accuracy. After positioning, the wafer's orientation cannot be determined, making it difficult to directly integrate with wafer manufacturing equipment. Furthermore, existing mechanisms cannot simultaneously perform thickness measurement. Summary of the Invention

[0003] To this end, the present invention provides a device for automatic wafer edge detection and positioning and thickness measurement to solve the above-mentioned problems in the prior art.

[0004] In order to achieve the above object, the present invention provides the following technical solutions:

[0005] According to a first aspect of the present invention, a device for automatic edge positioning and thickness measurement of a wafer comprises a mounting frame, a horizontal moving assembly, a vertical moving assembly, a drive motor, a wafer suction cup, a laser micrometer and a thickness measuring mechanism, wherein the horizontal moving assembly is arranged on the mounting frame, the vertical moving assembly is mounted on the moving mechanism of the horizontal moving assembly, the drive motor is mounted on the moving mechanism of the vertical moving assembly, and the rotating shaft of the drive motor is arranged vertically upward, and the wafer suction cup is arranged on the top of the rotating shaft; a wafer placement bar is respectively provided on both sides of the wafer suction cup, the wafer placement bar is arranged along the horizontal moving direction of the horizontal moving assembly, and the two wafer placement bars are respectively arranged symmetrically along the axis of the wafer suction cup;

[0006] The laser micrometer and the thickness measuring mechanism are both installed on the mounting frame, and are both located above the vertical moving component, and are both located at the end of the horizontal moving direction of the horizontal moving component. The laser micrometer is used to measure and determine the edge position information of the wafer during rotation, and use the edge position information of the wafer to stop the wafer at a fixed angle so that the offset of the entire center of the wafer is located in the horizontal moving direction of the horizontal moving component, and at the same time determine the horizontal moving distance required for the wafer suction cup to move to the center of the wafer; the thickness measuring mechanism is used to measure the thickness of the wafer.

[0007] Furthermore, the laser micrometer includes a signal emitting end and a signal receiving end, a gap is provided between the signal emitting end and the signal receiving end, and the signal emitting end and the signal receiving end are installed opposite to each other.

[0008] Furthermore, the thickness measuring mechanism includes a second telescopic cylinder and a displacement sensor, the second telescopic cylinder is arranged on the mounting frame, and the telescopic rod of the second telescopic cylinder is arranged vertically downward;

[0009] The displacement sensor includes an upper contact point and a lower contact point, the lower contact point is arranged on the mounting frame, and the lower contact point and the top of the wafer placement bar are located in the same plane; the upper contact point is located above the lower contact point, and the upper contact point is installed on the telescopic rod of the second telescopic cylinder.

[0010] Furthermore, the horizontal moving assembly includes a screw module, a slide rail and a horizontal moving plate, there are two slide rails, and the two slide rails are respectively arranged parallel to each other along the length direction of the mounting frame; the horizontal moving plate is slidably set on the slide rail, the screw module is installed on the mounting frame, and the screw module is used to drive the horizontal moving plate to move along the slide rail.

[0011] Furthermore, the screw module includes a servo motor, a screw nut and a screw body, the servo motor is arranged on the mounting frame, the screw body and the slide rail are arranged parallel to each other, the output shaft of the servo motor is transmission-connected to the screw body, the screw nut is threadedly connected to the screw body, and the screw nut is installed on the horizontal movable plate.

[0012] Furthermore, the vertical movement assembly includes a first telescopic cylinder, a lifting platform and a mounting plate, the first telescopic cylinder is mounted on the horizontal movement plate, and the telescopic rod of the first telescopic cylinder is vertically upward;

[0013] The mounting plate is arranged on the horizontal movable plate, a guide rail is provided on the mounting plate, the guide rail is vertically arranged, the lifting platform is slidably connected to the guide rail, and the lifting platform is located above the horizontal movable plate, and the telescopic rod of the first telescopic cylinder is connected to the lifting platform.

[0014] Furthermore, the mounting frame includes a lower support plate, an upper support plate and columns, the upper support plate is arranged above the lower support plate, and a plurality of columns are provided between the upper support plate and the lower support plate.

[0015] Furthermore, a strip hole is provided on the upper support plate, the strip hole is arranged along the length direction of the upper support plate, and the strip hole passes through the upper support plate, and the two wafer placement bars are respectively arranged parallel to each other on both sides of the strip hole.

[0016] Furthermore, it also includes side plates and shock-absorbing pads, the side plates are arranged between the upper support plate and the lower support plate, and a plurality of shock-absorbing pads are provided at the bottom of the lower support plate.

[0017] Furthermore, a circular arc step is provided on the top of the wafer placement bar, and the circular arc step is used to realize manual positioning and placement of the wafer.

[0018] The present invention has the following advantages: the horizontal moving component, the vertical moving component, the driving motor, the wafer suction cup and the laser micrometer are used in conjunction with each other, are compatible with wafers of various sizes, can realize rapid automatic edge finding and positioning of the wafer, can quickly determine the center of the wafer itself and the position of the wafer cutting edge or groove; at the same time, the laser micrometer and the wafer suction cup are used in conjunction to replace the existing mechanical clamping for wafer positioning, greatly improving the positioning accuracy; by setting up a thickness measuring mechanism, one device can simultaneously realize the measurement of wafer thickness, which can save space and cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are merely illustrative, and those skilled in the art can derive other implementation drawings based on the provided drawings without inventive effort.

[0020] The structures, proportions, sizes, etc. illustrated in this specification are intended solely to complement the contents disclosed herein and to facilitate understanding and reading by persons skilled in the art. They are not intended to limit the conditions under which the present invention may be implemented and therefore have no substantive technical significance. Any structural modifications, changes in proportions, or adjustments in sizes, without affecting the efficacy and objectives of the present invention, shall remain within the scope of the technical contents disclosed herein.

[0021] Figure 1 A first-perspective view of an apparatus for automatic wafer edge positioning and thickness measurement provided in some embodiments of the present invention, with the side panels removed.

[0022] Figure 2 A second perspective view of an apparatus for automatic wafer edge positioning and thickness measurement provided in some embodiments of the present invention with the side panels removed.

[0023] Figure 3 A third-perspective view of an apparatus for automatic wafer edge positioning and thickness measurement provided in some embodiments of the present invention, with the side panels removed.

[0024] Figure 4 A schematic diagram of the partial structure of a device for automatic wafer edge positioning and thickness measurement provided in some embodiments of the present invention, with the side panels removed.

[0025] Figure 5 A first perspective view of an apparatus for automatic wafer edge positioning and thickness measurement provided in some embodiments of the present invention.

[0026] Figure 6 A second perspective view of an apparatus for automatic wafer edge positioning and thickness measurement provided in some embodiments of the present invention.

[0027] Figure 7 A schematic structural diagram of a mechanism installed on an upper support plate of an apparatus for automatic wafer edge positioning and thickness measurement provided in some embodiments of the present invention.

[0028] Figure 8 A schematic structural diagram of a mechanism installed on a lower support plate of an apparatus for automatic wafer edge positioning and thickness measurement provided in some embodiments of the present invention.

[0029] In the figure: 1. Lower support plate, 2. Horizontal moving plate, 3. First telescopic cylinder, 4. Drive motor, 5. Wafer suction cup, 6. Upper support plate, 7. Wafer placement bar, 8. Laser micrometer, 9. Second telescopic cylinder, 10. Displacement sensor, 11. Rotating axis, 12. Bar hole, 13. Screw module, 14. Column, 15. Slide rail, 16. Shock pad, 17. Side panel, 18. Arc step, 19. Servo motor, 20. Screw nut, 21. Screw body, 22. Mounting plate, 23. Guide rail, 24. Lifting platform. DETAILED DESCRIPTION

[0030] The following describes the implementation of the present invention using specific embodiments. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. Obviously, the embodiments described are only a portion of the present invention, not all of it. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are intended to fall within the scope of protection of the present invention.

[0031] Example 1

[0032] like Figures 1 to 8 As shown, a device for automatic wafer edge positioning and thickness measurement in an embodiment of the first aspect of the present invention includes a mounting frame, a horizontal moving component, a vertical moving component, a drive motor 4, a wafer suction cup 5, a laser micrometer 8 and a thickness measuring mechanism. The horizontal moving component is arranged on the mounting frame, and the vertical moving component is installed on the moving mechanism of the horizontal moving component. The drive motor 4 adopts a DDR motor (direct drive rotary motor), and the drive motor 4 is installed on the moving mechanism of the vertical moving component, and the rotating shaft 11 of the drive motor 4 is arranged vertically upward. The wafer suction cup 5 is arranged on the top of the rotating shaft 11, and the rotating shaft of the equipment adopts a DDR motor, which is directly connected to the rotating shaft 11, which simplifies the transmission mechanism, makes the measurement accuracy higher, and has stronger stability; a wafer placement bar 7 is provided on each side of the wafer suction cup 5, and the wafer placement bar 7 is arranged along the horizontal moving direction of the horizontal moving component, and The two wafer placement bars 7 are symmetrically arranged along the axis of the wafer suction cup 5, and an arc step 18 is provided on the top of each wafer placement bar 7. The outer contour of the arc step 18 is adapted to the outer contour of the wafer. The arc steps 18 on the two wafer placement bars 7 together form a wafer positioning and placement station. After the wafer is placed on the top of the two wafer placement bars 7, the edge of the wafer is fit with the arc step 18 to realize manual positioning and placement of the wafer, so that the center of the wafer is roughly on the symmetry line of the two wafer placement bars 7; specifically, a plurality of arc steps 18 are provided on the top of each wafer placement bar 7, and the plurality of arc steps 18 are arranged in sequence along the length direction of the wafer placement bar 7, and the curvature of each arc step 18 is different from each other. The curvature of each arc step 18 is set according to wafers of different sizes, and each arc step 18 is used to place wafers of a certain fixed size.

[0033] The laser micrometer 8 and the thickness measuring mechanism are both mounted on the mounting frame. The laser micrometer 8 and the thickness measuring mechanism are both located above the vertical moving assembly, and are both located at the end of the horizontal moving direction of the horizontal moving assembly. The laser micrometer 8 is used to measure and determine the edge position information of the wafer during its rotation, and use the edge position information of the wafer to stop the wafer at a fixed angle so that the offset of the center of the entire wafer is located in the horizontal moving direction of the horizontal moving assembly (corresponding to the X-axis direction), and at the same time determine the horizontal movement distance required for the wafer chuck 5 to move to the center of the wafer;

[0034] The laser micrometer 8 uses the edge position information of the wafer to determine the center of the wafer itself. The specific principle of the laser micrometer 8 is as follows: the wafer chuck 5 moves the wafer together with the wafer to a preset point at the center of the corresponding wafer. At this time, the outer contour of the wafer is exactly within the detection range of the laser micrometer 8. The wafer chuck 5 then rotates the wafer. The laser micrometer 8 uses CCD measurement to scan multiple points (at least three points) of the outer contour of the wafer. The three-point center determination method is used to calculate the actual center coordinates of the wafer from the coordinate positions of the sampling points. The angle between the actual center coordinates of the wafer and the rotation axis of the wafer chuck 5 and the X-axis is then determined. The wafer chuck 5 is rotated by the corresponding angle to rotate the actual center of the wafer to the X-axis. The wafer chuck 5 then releases the vacuum, releasing the wafer onto the wafer placement bar 7. The wafer chuck 5 then moves along the X-axis so that the center of the wafer chuck 5 is coaxial with the center of the wafer. Finally, the wafer chuck 5 rises and absorbs the wafer, completing the concentric positioning of the wafer and the wafer chuck 5.

[0035] After the wafer center is positioned, the wafer suction cup 5 drives the wafer back to the preset point of the wafer of the corresponding specification. The wafer suction cup 5 drives the wafer to rotate, and the laser micrometer 8 scans the periphery of the wafer to determine the wafer cutting edge (Flat) or groove (Notch) position through the change in the wafer periphery position.

[0036] The thickness measuring mechanism is used to measure the thickness of the wafer.

[0037] In this embodiment, it should be noted that the horizontal movement component is used to realize the movement of the wafer suction cup 5 in the X-axis direction, and the vertical movement component is used to realize the movement of the wafer suction cup 5 in the Z-axis direction. The wafer suction cup 5 increases the movement in the Z direction, and through the pick-up and placement action, combined with the X-direction lateral movement, the center alignment can be achieved. Compared with the X / Y direction movement alignment, the structure is simple and easy to adjust. After the adjustment is completed, the wafer and the wafer suction cup 5 can be concentric, which is convenient for reducing the influence of the large concentricity error when the subsequent robot takes and places the wafer; by adding the X-direction lateral movement axis of the wafer suction cup 5, it can be compatible with wafers of various specifications and sizes; the wafer suction cup 5 increases the movement in the Z direction, which can realize compatibility with multiple specifications and sizes when manually placing the wafer;

[0038] The working principle of the entire device is as follows: in the initial state, the vertical moving component descends, and the drive motor 4 and the wafer suction cup 5 are lowered, so that the wafer suction cup 5 is under the wafer placement bar 7, and the wafer is placed manually or by using a robotic arm on the wafer positioning and placement station on the wafer placement bar 7; then the horizontal moving component is used to move the wafer suction cup 5 to just below the wafer, and the vertical moving component rises to move the wafer suction cup 5, and at the same time, the wafer suction cup 5 sucks the vacuum to adsorb and fix the wafer, and the vertical moving component continues to rise to move the wafer above the wafer placement bar 7; the horizontal moving component moves the wafer suction cup 5 horizontally close to the laser micrometer 8 until the edge of the wafer on the wafer suction cup 5 moves to the measuring station of the laser micrometer 8, and then the drive motor 4 drives the wafer suction cup 5 to rotate through the rotating shaft 11, and the laser micrometer 8 The edge position of the wafer is detected at multiple points, and the offset of multiple points relative to the rotation axis 11 is detected, and the wafer center offset is adjusted to the horizontal movement direction of the horizontal moving component according to the offset; then the wafer suction cup 5 breaks the vacuum, and at the same time the vertical moving component descends to place the wafer on the wafer placement bar 7; then, through the known horizontal offset of the wafer center, the horizontal moving component is used to horizontally move the wafer suction cup 5 by the corresponding horizontal offset of the wafer center to reach directly below the center of the wafer, and then the vertical moving component is used to rise, and the wafer suction cup 5 is raised in a vacuum state to adsorb and fix the wafer, at this time, it can be ensured that the center of the wafer is consistent with the center of the wafer suction cup 5; finally, the horizontal moving component moves the wafer suction cup 5 horizontally so that the wafer is in the measuring position of the thickness measuring mechanism, and the thickness of the wafer can be measured.

[0039] The technical effects achieved by this embodiment are as follows: the horizontal moving component, the vertical moving component, the drive motor 4, the wafer suction cup 5 and the laser micrometer 8 are used in conjunction with each other, are compatible with wafers of various sizes, can realize rapid automatic edge finding and positioning of the wafer, and can quickly determine the center of the wafer itself and the position of the wafer cutting edge or groove; at the same time, the laser micrometer 8 and the wafer suction cup 5 are used in conjunction to replace the existing mechanical clamping for positioning the wafer, greatly improving the positioning accuracy; by setting up a thickness measuring mechanism, one device can simultaneously realize the measurement of wafer thickness, which can save space and cost.

[0040] Example 2

[0041] like Figures 1 to 8 As shown, this embodiment provides another device for automatic wafer edge positioning and thickness measurement, the structure of which includes all the contents of Example 1, and only the different parts are described below.

[0042] In this embodiment, the laser micrometer 8 adopts a CCD laser micrometer. The laser micrometer 8 includes a signal transmitting end and a signal receiving end. A gap is provided between the signal transmitting end and the signal receiving end, and the signal transmitting end and the signal receiving end are installed relative to each other. Specifically, the signal transmitting end is located directly above the signal receiving end. The height of the gap between the signal transmitting end and the signal receiving end is 10 mm to 20 mm. The wafer is moved into the gap through the horizontal moving component. The wafer is driven by the driving motor 4 and the wafer suction cup 5 to rotate, and the wafer is taken and placed by the vertical moving component and the wafer suction cup 5, so that the center of the wafer can be located.

[0043] In this embodiment, it should be noted that the thickness measuring mechanism includes a second telescopic cylinder 9 and a displacement sensor 10. The second telescopic cylinder 9 is arranged on a mounting frame, and the telescopic rod of the second telescopic cylinder 9 is arranged vertically downward.

[0044] The displacement sensor 10 includes an upper contact point and a lower contact point. The lower contact point is set on the mounting frame, and the lower contact point and the top of the wafer placement bar 7 are located in the same plane; the upper contact point is located above the lower contact point, and the upper contact point is installed on the telescopic rod of the second telescopic cylinder 9. There is an 8mm gap between the upper contact point and the lower contact point. The wafer is moved into this gap through the horizontal moving component, and the wafer is placed on the lower contact point of the sensor through the vertical moving component. The upper contact point is contacted with the upper surface of the wafer through the extension and contraction of the second telescopic cylinder 9, so that its thickness can be measured.

[0045] Example 3

[0046] like Figures 1 to 8 As shown, this embodiment provides another device for automatic wafer edge positioning and thickness measurement, the structure of which includes all the contents of Example 1, and only the different parts are described below.

[0047] In this embodiment, the horizontal moving assembly includes a screw module 13, a slide rail 15 and a horizontal moving plate 2. There are two slide rails 15, and the two slide rails 15 are respectively arranged parallel to each other along the length direction of the mounting frame; the horizontal moving plate 2 is slidably set on the slide rail 15, and the screw module 13 is installed on the mounting frame, and the screw module 13 is used to drive the horizontal moving plate 2 to move back and forth along the slide rail 15, and the distance between the wafer and the laser micrometer and the thickness measuring mechanism can be changed at will, and it is compatible with the positioning measurement of 6-inch to 12-inch wafers.

[0048] In this embodiment, it should be noted that the screw module 13 includes a servo motor 19, a screw nut 20 and a screw body 21. The servo motor 19 is arranged on the mounting frame, the screw body 21 and the slide rail 15 are arranged parallel to each other, and the screw body 21 is arranged along the symmetry line of the two slide rails 15. The output shaft of the servo motor 19 is transmission-connected to one end of the screw body 21, and the other end of the screw body 21 is rotationally connected to the mounting frame through a mounting seat. The screw nut 20 is threadedly connected to the screw body 21, and the screw nut 20 is installed on the horizontal movable plate 2. During use, the servo motor 19 controls the forward or reverse rotation of the screw body 21, and can drive the horizontal movable plate 2 to make a linear reciprocating motion along the slide rail 15 through the screw nut 20.

[0049] Furthermore, the vertical moving assembly includes a first telescopic cylinder 3, a lifting platform 24 and a mounting plate 22. The first telescopic cylinder 3 is mounted on the horizontal moving plate 2, and the telescopic rod of the first telescopic cylinder 3 is vertically upward.

[0050] The mounting plate 22 is arranged on the horizontal moving plate 2, and a guide rail 23 is provided on the mounting plate 22. The guide rail 23 is vertically arranged. The lifting platform 24 is slidably connected to the guide rail 23, and the lifting platform 24 is located above the horizontal moving plate 2. The telescopic rod of the first telescopic cylinder 3 is connected to the lifting platform 24, and the driving motor 4 is installed on the lifting platform 24. During use, the first telescopic cylinder 3 can drive the lifting platform 24 to reciprocate in the vertical direction by controlling the extension and contraction of the telescopic rod.

[0051] The technical effect achieved by this embodiment is that the horizontal moving component and the vertical moving component have simple structures and can accurately control the horizontal movement and vertical lifting of the wafer suction cup 5.

[0052] Example 4

[0053] like Figures 1 to 8 As shown, this embodiment provides another device for automatic wafer edge positioning and thickness measurement, the structure of which includes all the contents of Example 1, and only the different parts are described below.

[0054] In this embodiment, the mounting frame includes a lower support plate 1, an upper support plate 6 and a column 14. The upper support plate 6 is arranged directly above the lower support plate 1. The upper support plate 6 and the lower support plate 1 are both rectangular, and the upper support plate 6 and the lower support plate are arranged parallel to each other. A plurality of columns 14 are provided between the upper support plate 6 and the lower support plate 1. The two ends of each column 14 are respectively connected to the upper support plate 6 and the lower support plate 1; specifically, the number of the columns 14 is four, and the four columns 14 are distributed in a rectangular shape;

[0055] The upper support plate 6 is provided with a strip hole 12, which is arranged along the length direction of the upper support plate 6 and passes through the upper support plate 6. The two wafer placement bars 7 are respectively arranged parallel to each other on both sides of the strip hole 12;

[0056] The upper support plate 6 and the lower support plate 1 form a double-layer structure. The horizontal moving component is installed on the top of the lower support plate 1, the vertical moving component is located between the lower support plate 1 and the upper support plate 6, and the laser micrometer 8 and the thickness measuring mechanism are both installed on the upper support plate 6.

[0057] In this embodiment, it should be noted that it also includes side panels 17 and shock-absorbing pads 16. The side panels 17 are arranged between the upper support plate 6 and the lower support plate 1. The side panels 17 are enclosed between the upper support plate 6 and the lower support plate 1 to form a chamber. The columns 14, the horizontal moving components and the vertical moving components are located in the chamber. To facilitate inspection and maintenance, cabinet doors can be opened on the side panels 17. By setting the side panels 17, the overall structure is more regular; a plurality of shock-absorbing pads 16 are provided at the bottom of the lower support plate 1, and the specific number of shock-absorbing pads 16 is four. The four shock-absorbing pads 16 are respectively arranged at the four corners of the bottom of the lower support plate 1. By setting the shock-absorbing pads 16, the entire device has shock-absorbing performance, which can further ensure the detection accuracy.

[0058] Although the present invention has been described in detail above using general descriptions and specific embodiments, it will be apparent to those skilled in the art that modifications and improvements may be made thereto. Therefore, such modifications and improvements, without departing from the spirit of the present invention, are intended to be within the scope of protection claimed herein.

[0059] The terms "upper", "lower", "left", "right", "middle", etc. used in this specification are only for the convenience of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships should be regarded as within the scope of the present invention without substantially changing the technical content.

Claims

1. A device for automatic wafer edge positioning and thickness measurement, characterized in that: The invention comprises a mounting frame, a horizontal moving component, a vertical moving component, a driving motor (4), a wafer suction cup (5), a laser micrometer (8) and a thickness measuring mechanism, wherein the horizontal moving component is arranged on the mounting frame, the vertical moving component is installed on the moving mechanism of the horizontal moving component, the driving motor (4) is installed on the moving mechanism of the vertical moving component, and the rotating shaft (11) of the driving motor (4) is arranged vertically upward, and the wafer suction cup (5) is arranged on the top of the rotating shaft (11); a wafer placement bar (7) is provided on each side of the wafer suction cup (5), the wafer placement bar (7) is arranged along the horizontal moving direction of the horizontal moving component, and the two wafer placement bars (7) are symmetrically arranged along the axis of the wafer suction cup (5); The laser micrometer (8) and the thickness measuring mechanism are both mounted on the mounting frame, the laser micrometer (8) and the thickness measuring mechanism are both located above the vertical moving assembly, and the laser micrometer (8) and the thickness measuring mechanism are both located at the end of the horizontal moving direction of the horizontal moving assembly, the laser micrometer (8) is used to measure and determine the edge position information of the wafer during the rotation process, and use the edge position information of the wafer to stop the wafer at a fixed angle so that the offset of the center of the wafer is located in the horizontal moving direction of the horizontal moving assembly, and at the same time determine the horizontal moving distance required for the wafer suction cup (5) to move to the center of the wafer; the thickness measuring mechanism is used to measure the thickness of the wafer; The thickness measuring mechanism comprises a second telescopic cylinder (9) and a displacement sensor (10), wherein the second telescopic cylinder (9) is arranged on the mounting frame, and the telescopic rod of the second telescopic cylinder (9) is arranged vertically downward; The displacement sensor (10) includes an upper contact point and a lower contact point, wherein the lower contact point is arranged on the mounting frame and is located in the same plane as the top of the wafer placement bar (7); the upper contact point is located above the lower contact point and is mounted on the telescopic rod of the second telescopic cylinder (9).

2. The device for automatic wafer edge positioning and thickness measurement according to claim 1, characterized in that: The laser micrometer (8) comprises a signal emitting end and a signal receiving end, a gap is provided between the signal emitting end and the signal receiving end, and the signal emitting end and the signal receiving end are installed opposite to each other.

3. The device for automatic wafer edge detection, positioning and thickness measurement according to claim 1, characterized in that: The horizontal moving assembly includes a screw module (13), a slide rail (15) and a horizontal moving plate (2), wherein the slide rails (15) are two and are respectively arranged parallel to each other along the length direction of the mounting frame; the horizontal moving plate (2) is slidably arranged on the slide rails (15), the screw module (13) is installed on the mounting frame, and the screw module (13) is used to drive the horizontal moving plate (2) to move along the slide rails (15).

4. The device for automatic wafer edge positioning and thickness measurement according to claim 3, characterized in that: The screw module (13) includes a servo motor (19), a screw nut (20) and a screw body (21), wherein the servo motor (19) is arranged on the mounting frame, the screw body (21) and the slide rail (15) are arranged parallel to each other, the output shaft of the servo motor (19) is transmission-connected to the screw body (21), the screw nut (20) is threadedly connected to the screw body (21), and the screw nut (20) is mounted on the horizontal movable plate (2).

5. The device for automatic wafer edge detection, positioning and thickness measurement according to claim 3, characterized in that: The vertical moving assembly comprises a first telescopic cylinder (3), a lifting platform (24) and a mounting plate (22), wherein the first telescopic cylinder (3) is mounted on the horizontal moving plate (2), and the telescopic rod of the first telescopic cylinder (3) is arranged vertically upward; The mounting plate (22) is arranged on the horizontal movable plate (2), and a guide rail (23) is provided on the mounting plate (22). The guide rail (23) is vertically arranged, and the lifting platform (24) is slidably connected to the guide rail (23). The lifting platform (24) is located above the horizontal movable plate (2), and the telescopic rod of the first telescopic cylinder (3) is connected to the lifting platform (24).

6. The device for automatic wafer edge positioning and thickness measurement according to claim 1, characterized in that: The mounting frame comprises a lower support plate (1), an upper support plate (6) and columns (14); the upper support plate (6) is arranged above the lower support plate (1); and a plurality of columns (14) are provided between the upper support plate (6) and the lower support plate (1).

7. The device for automatic wafer edge positioning and thickness measurement according to claim 6, characterized in that: The upper support plate (6) is provided with a strip hole (12), the strip hole (12) is arranged along the length direction of the upper support plate (6), and the strip hole (12) passes through the upper support plate (6), and the two wafer placement bars (7) are respectively arranged parallel to each other on both sides of the strip hole (12).

8. The device for automatic wafer edge detection, positioning and thickness measurement according to claim 7, characterized in that: It also includes side plates (17) and shock-absorbing pads (16), wherein the side plates (17) are arranged between the upper support plate (6) and the lower support plate (1), and a plurality of shock-absorbing pads (16) are provided at the bottom of the lower support plate (1).

9. The device for automatic wafer edge detection, positioning and thickness measurement according to claim 1, characterized in that: A circular arc step (18) is provided on the top of the wafer placement bar (7), and the circular arc step (18) is used to realize manual positioning and placement of the wafer.

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