Wafer buffer type positioning bracket for gluing developing machine

Abstract

The invention provides a wafer buffer type positioning bracket for a gluing developer, and relates to the field of wafer processing and positioning, the wafer buffer type positioning bracket comprises a supporting platform and a feeding assembly, the right side of the upper end face of the supporting platform is provided with a gluing developer shell, and the upper end face of the supporting platform is provided with a frame; the feeding assembly comprises a moving seat, the moving seat is in sliding connection with the frame, and a centering position adjusting assembly, a centering driving mechanism, an adsorption type bracket assembly and a blowing and sucking type dust removal mechanism are arranged on the moving seat. Through cooperation of the centering position adjusting assembly and the centering driving mechanism, manual operation is not needed in the centering positioning process of the wafer, time and labor are saved, and the moving distance of the rubber clamping block can be accurately controlled; the problems that when a wafer positioning bracket commonly used in a gluing developing machine is used for centering and positioning a wafer, a clamping structure often needs to be manually operated, time and labor are wasted through a manual operation mode, and the moving distance of a clamping block is difficult to accurately control are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing and positioning, and particularly relates to a wafer buffer positioning bracket for a spin coater and developer. Background Art

[0002] A spin coater and developer is a key device used in semiconductor manufacturing for photolithography processes. Its main functions include a series of processes such as coating, developing, rinsing, and drying the wafer. As the core carrier for semiconductor chip manufacturing, the processing accuracy of the wafer directly determines the performance and reliability of the chip. Therefore, during the spin coating and developing process, the positioning and fixation of the wafer are crucial.

[0003] Currently, when the commonly used wafer positioning bracket in a spin coater and developer centers the wafer, it often requires manual operation of the clamping structure. The manual operation is not only time-consuming and laborious, but also the moving distance of the clamping block is difficult to accurately control, and it is easy to have a situation where the clamping and positioning force is too large. If the clamping and positioning force during manual operation is too large, it is easy to cause damage to the wafer. In addition, after the commonly used clamping and positioning structure on the current wafer positioning bracket clamps the wafer, since the clamping block is close to the wafer, it is easy to cause occlusion and obstruction during the coating of the wafer surface edge. Summary of the Invention

[0004] Embodiments of the present disclosure relate to a wafer buffer positioning bracket for a spin coater and developer. Through the cooperation of a centering adjustment component and a centering driving mechanism, during the centering positioning process of the wafer, it is not necessary to manually operate, which is not only time-saving and laborious, but also the moving distance of the rubber clamping block can be accurately controlled, avoiding the phenomenon of wafer damage caused by excessive clamping and positioning force; through the setting of the adsorption type bracket component, by adsorbing and fixing the wafer to the upper surface of the rubber pad, the six rubber clamping blocks can be simultaneously adjusted in the direction away from the axis position of the support housing. At this time, since the six rubber clamping blocks are far from the wafer, it is possible to avoid the occlusion and obstruction during the coating of the wafer surface edge.

[0005] In the first aspect of the present disclosure, a wafer buffer positioning bracket for a spin coater and developer is provided, specifically including: a support platform and a feeding component. A spin coater and developer housing is installed on the right side of the upper end surface of the support platform, and a frame is installed on the upper end surface of the support platform; the feeding component includes a moving seat, the moving seat is slidably connected to the frame, and a centering adjustment component, a centering driving mechanism, an adsorption bracket component, and a blowing and suction dust removal mechanism are arranged on the moving seat; the centering adjustment component includes sliding seats, slide rails, adjustment push blocks, and driving columns. The number of sliding seats is six, and two slide rails fixed to the upper end surface of the moving seat are slidably connected to each sliding seat. An adjustment push block is fixedly connected to the upper end surface of each sliding seat, and a driving column is fixedly connected to the bottom of each sliding seat; the centering driving mechanism includes a support cylinder, an annular rotating disk, a worm gear, a driving motor, a worm, and a guiding through hole. The support cylinder is fixedly connected to the upper end surface of the moving seat, an annular rotating disk is rotatably connected to the outside of the support cylinder, a worm gear is fixedly installed on the outside of the annular rotating disk, the driving motor is fixedly installed on the upper end surface of the moving seat, a worm is connected to the rotating shaft of the driving motor through a coupling, the worm is meshed with the worm gear, and six guiding through holes are arranged in an annular array on the upper end surface of the annular rotating disk, and the six guiding through holes are respectively slidably connected to the six driving columns.

[0006] In at least some embodiments, a rectangular through hole is provided on the bottom end surface of the support platform, a strip-shaped sliding groove is provided on each of the front and rear side surfaces inside the frame, and a strip-shaped sliding block is provided on each of the front and rear side surfaces of the moving seat, and the two strip-shaped sliding blocks are respectively slidably connected to the two strip-shaped sliding grooves.

[0007] In at least some embodiments, the feeding component further includes a driving motor, a driving screw, a driving nut, and a square through hole. The driving motor is fixedly installed on the rear side of the left end surface of the frame, a driving screw is fixedly connected to the rotating shaft of the driving motor, the right end of the driving screw is rotatably connected to the right side of the frame, a square through hole is provided on the rear side of the left end surface of the moving seat, a driving nut is fixedly installed inside the square through hole, and the driving nut is threadedly connected to the driving screw.

[0008] In at least some embodiments, the centering adjustment component further includes rubber clamping blocks. The number of rubber clamping blocks is six, the six rubber clamping blocks are respectively arranged on the six adjustment push blocks, and an arc-shaped clamping groove is provided on the clamping surface of each rubber clamping block.

[0009] In at least some embodiments, the centering driving mechanism further includes an annular rotating groove and an annular rotating block. An annular rotating block is fixedly connected to the upper side of the outside of the support cylinder, and an annular rotating groove is provided on the inner peripheral surface of the annular rotating disk, and the annular rotating groove is rotatably connected to the annular rotating block.

[0010] In at least some embodiments, when the annular rotating disk is in the counterclockwise rotation state, the six driving columns respectively drive six sliding seats, six position-adjusting push blocks and six rubber clamping blocks to move inward.

[0011] In at least some embodiments, the adsorption bracket assembly includes a support housing, an air suction pipe, a three-way pipe, a one-way valve, an air extraction pump, a solenoid valve and a rubber pad. The support housing is fixedly connected to the middle of the upper end surface of the moving seat through a support rod. An air suction pipe is communicated with the bottom of the support housing. The air suction pipe penetrates through the moving seat. The lower end of the air suction pipe is connected with a three-way pipe. A one-way valve and a solenoid valve are respectively installed at the left and right ends of the three-way pipe. The air outlet of the left end of the one-way valve is connected to the air extraction port of the air extraction pump. The air extraction pump is fixedly installed at the bottom of the moving seat. The upper end surface of the support housing is evenly provided with adsorption holes. A rubber pad is pasted on the upper end surface of the support housing. Circular through holes are evenly provided on the upper end surface of the rubber pad. The positions of the circular through holes on the rubber pad coincide with the positions of the adsorption holes on the support housing.

[0012] In at least some embodiments, the blowing and suction dust removal mechanism includes a dust blowing housing cover, a dust suction housing cover, a blowing hose, a suction fan, a filter box and a dust suction hose. The dust blowing housing cover is fixedly installed on the top of a position-adjusting push block at the front side. The air inlet of the dust blowing housing cover is connected with a blowing hose. The other end of the blowing hose is connected to the air outlet of the suction fan. The suction fan is fixedly installed at the bottom of the moving seat. The dust suction housing cover is fixedly installed on the top of a position-adjusting push block at the rear side. The air outlet of the dust suction housing cover is connected with a dust suction hose. The other end of the dust suction hose is connected to the air inlet of the filter box. The air outlet of the filter box is connected to the air suction port of the suction fan through a pipeline.

[0013] The present invention provides a wafer buffer type positioning bracket for a glue coating and developing machine, which has the following beneficial effects: Through the cooperation of the centering position-adjusting component and the centering driving mechanism, the centering driving mechanism can finally drive the six rubber clamping blocks to move towards the axis position of the support housing simultaneously, so that the wafer can be automatically centered and positioned. Moreover, during the centering positioning process of the wafer, the distance between the rubber clamping blocks and the axis of the support housing can be adjusted according to the diameter of the wafer, which can be specifically realized by controlling the number of rotation turns of the driving motor shaft. Thus, manual operation is not required, which not only saves time and effort, but also the moving distance of the rubber clamping blocks can be accurately controlled, avoiding the phenomenon of wafer damage caused by excessive clamping and positioning force.

[0014] Through the setting of the adsorption bracket assembly, after the wafer is positioned, the air extraction pump can be started by an external controller, so that negative pressure is generated inside the support housing, and then the wafer is adsorbed and fixed on the upper surface of the rubber pad through the adsorption holes on the support housing. At this time, the six rubber clamping blocks can be simultaneously adjusted in the direction away from the axis position of the support housing, so that the six rubber clamping blocks are away from the edge of the wafer. At this time, since the six rubber clamping blocks are away from the wafer, it can avoid the influence of occlusion and obstruction during glue coating at the edge of the wafer surface.

[0015] By setting up the blowing and suction dust removal mechanism, when the suction fan is started, external air enters the inside of the dust blowing housing through the dust suction housing cover, dust suction hose, filter box, suction fan and blowing hose, and finally the air is dispersed onto the upper surface of the wafer through the air outlet of the dust blowing housing, blowing the dust falling on the upper surface of the wafer backward, and then the blown dust is sucked through the air suction port on the dust suction housing and conveyed into the filter box. After being filtered by the filter bag inside the filter box, it remains in the filter box, and then the separated air is discharged through the suction fan, blowing hose and dust blowing housing, realizing the integrated blowing and suction dust removal function and improving the quality of the wafer during processing such as glue coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below.

[0017] The drawings in the following description only relate to some embodiments of the present invention and do not limit the present invention.

[0018] In the drawings: Figure 1 It shows a schematic structural diagram of the first perspective of the present application; Figure 2 It shows a schematic structural diagram of the second perspective of the present application; Figure 3 It shows a schematic structural diagram of the present application in a disassembled state; Figure 4 It shows a schematic structural diagram of the support platform, the housing of the spin coater / developer and the frame of the present application; Figure 5 It shows a schematic structural diagram of the feeding assembly of the present application; Figure 6 It shows a schematic structural diagram of the moving seat, the centering adjustment assembly and the centering driving mechanism of the present application; Figure 7 It shows a schematic structural diagram of the centering adjustment assembly of the present application; Figure 8 It shows a schematic structural diagram of the support cylinder and the annular rotating disk of the present application after being disassembled; Figure 9 It shows a schematic structural diagram of the moving seat and the adsorption bracket assembly of the present application; Figure 10 It shows a schematic structural diagram of the support housing and the rubber pad of the present application after being disassembled; Figure 11 It shows a schematic structural diagram of the dust removal mechanism of the present application.

[0019] LIST OF REFERENCE NUMERALS 1. Support platform; 101. Coating and developing machine housing; 102. Frame; 103. Strip-shaped chute; 104. Rectangular through-hole; 2. Feeding component; 201. Moving seat; 202. Driving motor; 203. Driving screw; 204. Driving nut; 205. Square through-hole; 3. Centering and positioning component; 301. Sliding seat; 302. Slide rail; 303. Positioning push block; 304. Rubber clamping block; 305. Driving column; 4. Centering driving mechanism; 401. Support cylinder; 402. Ring-shaped rotating disk; 403. Worm gear; 404. Driving motor; 405. Worm; 406. Guide through-hole; 407. Ring-shaped rotating groove; 408. Ring-shaped rotating block; 5. Adsorption bracket component; 501. Support housing; 502. Suction pipe; 503. Three-way pipe; 504. Check valve; 505. Air extraction pump; 506. Solenoid valve; 507. Rubber pad; 6. Blowing and suction dust removal mechanism; 601. Dust blowing housing cover; 602. Dust suction housing cover; 603. Blowing hose; 604. Suction fan; 605. Filter box; 606. Dust suction hose. Specific implementation mode

[0020] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0021] Example 1: Please refer to Figures 1 to 11 : The present invention provides a wafer buffer positioning bracket for a spin coater and developer, comprising: a support platform 1 and a feeding assembly 2. On the right side of the upper end surface of the support platform 1, a spin coater and developer housing 101 is installed, and a frame 102 is installed on the upper end surface of the support platform 1; the feeding assembly 2 includes a moving seat 201, the moving seat 201 is slidably connected to the frame 102, and a centering adjustment assembly 3, a centering driving mechanism 4, a suction bracket assembly 5 and a blowing and suction dust removal mechanism 6 are arranged on the moving seat 201; the centering adjustment assembly 3 includes sliding seats 301, slide rails 302, adjustment push blocks 303 and driving columns 305. The number of sliding seats 301 is six. Two slide rails 302 fixed to the upper end surface of the moving seat 201 are slidably connected to each sliding seat 301. An adjustment push block 303 is fixedly connected to the upper end surface of each sliding seat 301, and a driving column 305 is fixedly connected to the bottom of each sliding seat 301; the centering driving mechanism 4 includes a support cylinder 401, an annular rotating disk 402, a worm gear 403, a driving motor 404, a worm 405 and a guiding through hole 406. The support cylinder 401 is fixedly connected to the upper end surface of the moving seat 201. An annular rotating disk 402 is rotatably connected to the outside of the support cylinder 401. A worm gear 403 is fixedly installed on the outside of the annular rotating disk 402. The driving motor 404 is fixedly installed on the upper end surface of the moving seat 201. A worm 405 is connected to the rotating shaft of the driving motor 404 through a coupling. The worm 405 meshes with the worm gear 403. Six guiding through holes 406 are formed in the upper end surface of the annular rotating disk 402 in an annular array. The six guiding through holes 406 are respectively slidably connected to the six driving columns 305; through the cooperation of the centering adjustment assembly 3 and the centering driving mechanism 4, the wafer can be automatically centered and positioned, and during the centering positioning process of the wafer, the distance between the rubber clamping block 304 and the axis of the support housing 501 can be adjusted according to the diameter of the wafer, which can be specifically achieved by controlling the number of rotation turns of the rotating shaft of the driving motor 404. Therefore, manual operation is not required, which not only saves time and effort, but also the moving distance of the rubber clamping block 304 can be accurately controlled, avoiding the phenomenon of wafer damage caused by excessive clamping and positioning force.

[0022] A rectangular through hole 104 is formed in the bottom end surface of the support platform 1. A strip-shaped sliding groove 103 is formed in each of the front and rear side surfaces inside the frame 102. A strip-shaped sliding block is arranged on each of the front and rear side surfaces of the moving seat 201. The two strip-shaped sliding blocks are respectively slidably connected to the two strip-shaped sliding grooves 103.

[0023] The feeding assembly 2 further includes a driving motor 202, a driving screw 203, a driving nut 204 and a square through hole 205. The driving motor 202 is fixedly installed at the rear side of the left end face of the frame 102. A driving screw 203 is fixedly connected to the rotating shaft of the driving motor 202. The right end of the driving screw 203 is rotatably connected to the right side of the frame 102. A square through hole 205 is formed at the rear side of the left end face of the moving seat 201. A driving nut 204 is fixedly installed inside the square through hole 205. The driving nut 204 is threadedly connected to the driving screw 203.

[0024] The centering adjustment assembly 3 further includes rubber clamping blocks 304. The number of the rubber clamping blocks 304 is six. The six rubber clamping blocks 304 are respectively arranged on the six adjustment push blocks 303. An arc-shaped clamping groove is formed on the clamping surface of each rubber clamping block 304. Through the rubber buffering effect of the rubber clamping blocks 304 themselves, the wafer can be buffered and protected during centering positioning.

[0025] The centering driving mechanism 4 further includes an annular rotating groove 407 and an annular rotating block 408. An annular rotating block 408 is fixedly connected to the upper side of the outer part of the support cylinder 401. An annular rotating groove 407 is formed on the inner peripheral surface of the annular rotating disc 402. The annular rotating groove 407 is rotatably connected to the annular rotating block 408.

[0026] When the annular rotating disc 402 is in a counterclockwise rotation state, the six driving columns 305 respectively drive the six sliding seats 301, the six adjustment push blocks 303 and the six rubber clamping blocks 304 to move inward.

[0027] The adsorption bracket assembly 5 includes a support housing 501, an air suction pipe 502, a three-way pipe 503, a one-way valve 504, an air extraction pump 505, a solenoid valve 506 and a rubber pad 507. The support housing 501 is fixedly connected to the middle part of the upper end face of the moving seat 201 through a support rod. The bottom of the support housing 501 is communicated with an air suction pipe 502. The air suction pipe 502 penetrates through the moving seat 201. The lower end of the air suction pipe 502 is connected with a three-way pipe 503. A one-way valve 504 and a solenoid valve 506 are respectively installed at the left and right ends of the three-way pipe 503. Through the setting of the one-way valve 504, air can only enter the air extraction pump 505 from the inside of the three-way pipe 503, and the air inside the air extraction pump 505 cannot enter the inside of the three-way pipe 503, ensuring the reliability of the adsorption bracket assembly 5 when adsorbing and fixing the wafer; through the setting of the solenoid valve 506, when the wafer needs to be taken off from the upper surface of the rubber pad 507 after being processed, only by opening the solenoid valve 506 through an external controller, the negative pressure effect inside the support housing 501 can be lost, and at this time, the wafer can be easily taken off from the upper surface of the rubber pad 507; The left end air outlet of the one-way valve 504 is connected to the air suction port of the air suction pump 505. The air suction pump 505 is fixedly installed at the bottom of the moving seat 201. The upper end surface of the support housing 501 is evenly provided with adsorption holes. A rubber pad 507 is pasted on the upper end surface of the support housing 501. The upper end surface of the rubber pad 507 is evenly provided with circular through holes. The positions of the circular through holes on the rubber pad 507 coincide with the positions of the adsorption holes on the support housing 501. The axis of the support housing 501 and the axis of the annular rotating disk 402 are on the same axis.

[0028] Embodiment 2, on the basis of Embodiment 1, as Figure 1 and Figure 11 shown, the blowing and suction dust removal mechanism 6 includes a blowing dust housing 601, a suction dust housing 602, a blowing hose 603, a suction fan 604, a filter box 605 and a suction hose 606. The blowing dust housing 601 is fixedly installed on the top of a front adjustment push block 303. The air inlet of the blowing dust housing 601 is connected to the blowing hose 603. The other end of the blowing hose 603 is connected to the air outlet of the suction fan 604. The suction fan 604 is fixedly installed at the bottom of the moving seat 201. The suction dust housing 602 is fixedly installed on the top of a rear adjustment push block 303. The air outlet of the suction dust housing 602 is connected to the suction hose 606. The other end of the suction hose 606 is connected to the air inlet of the filter box 605. The air outlet of the filter box 605 is connected to the air suction port of the suction fan 604 through a pipeline; through the setting of the blowing and suction dust removal mechanism 6, the integrated blowing and suction dust removal function is realized, and the quality of the wafer during processing such as glue coating is improved.

[0029] The working principle of this embodiment: When in use, first place the wafer on the upper part of the support housing 501 through the robotic arm. At this time, the upper surface of the rubber pad 507 contacts the bottom end surface of the wafer. Then, control the rotation of the shaft of the driving motor 404 to rotate forward through the external controller, drive the worm gear 403 and the annular rotating disk 402 to rotate counterclockwise, and then drive the six driving columns 305 to move towards the axis position of the annular rotating disk 402 through the six guiding through holes 406 respectively. Then, drive the six sliding seats 301, six adjustment push blocks 303 and six rubber clamping blocks 304 to move towards the axis position of the support housing 501 through the six driving columns 305 respectively. Finally, the wafer is automatically centered and positioned. And during the centering and positioning process of the wafer, the distance between the rubber clamping block 304 and the axis of the support housing 501 can be adjusted according to the diameter of the wafer, which can be specifically realized by controlling the number of rotation turns of the shaft of the driving motor 404.

[0030] After the wafer is positioned, the air extraction pump 505 is started through the peripheral controller to create a negative pressure inside the support housing 501. Then, the wafer is adsorbed and fixed onto the upper surface of the rubber pad 507 through the adsorption holes on the support housing 501. Then, the peripheral controller is used to control the reverse rotation of the rotating shaft of the driving motor 404, driving the worm gear 403 and the annular rotating disk 402 to rotate clockwise. Then, through the six guiding ports 406, the six driving columns 305 are respectively driven to move simultaneously in a direction away from the axis position of the annular rotating disk 402. Then, through the six driving columns 305, the six sliding seats 301, the six position-adjusting push blocks 303, and the six rubber clamping blocks 304 are respectively driven to move simultaneously in a direction away from the axis position of the support housing 501.

[0031] After the wafer is adsorbed and fixed onto the upper surface of the rubber pad 507, the suction fan 604 is started through the peripheral controller, so that external air enters the inside of the dust blowing housing 601 through the dust suction housing cover 602, the dust suction hose 606, the filter box 605, the suction fan 604, and the blowing hose 603. Finally, the air is dispersed onto the upper surface of the wafer through the air outlet of the dust blowing housing 601, and the dust falling on the upper surface of the wafer is blown backward. Then, the blown dust is sucked and conveyed into the filter box 605 through the suction port on the dust suction housing cover 602. After being filtered by the filter bag inside the filter box 605, it remains inside the filter box 605. Then, the separated air is discharged through the suction fan 604, the blowing hose 603, and the dust blowing housing 601, realizing the integrated dust removal function of blowing and suction; Then, the peripheral controller is used to control the rotation of the rotating shaft of the driving motor 202, thereby driving the driving screw 203 to rotate. Then, under the action of the thread, the driving nut 204 drives the moving seat 201, the centering position-adjusting assembly 3, the centering driving mechanism 4, the adsorption bracket assembly 5, the blowing and suction dust removal mechanism 6, and the adsorbed and fixed wafer to move to the right. Finally, the adsorbed and fixed wafer is conveyed into the inside of the coating and developing machine housing 101, and then the upper surface of the wafer can be processed such as coating.

[0032] In this article, the following points need to be noted: 1. The drawings of the embodiments of the present disclosure only relate to the structures involved in the embodiments of the present disclosure, and other structures can refer to the general design.

[0033] 2. Without conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0034] The above is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A wafer buffer positioning bracket for a spin coater and developer, comprising: A support platform (1) and a feeding component (2), wherein a glue coating and developing machine housing (101) is installed on the right side of the upper end surface of the support platform (1), and a frame (102) is installed on the upper end surface of the support platform (1); characterized in that the feeding component (2) includes a moving seat (201), the moving seat (201) is slidably connected to the frame (102), and a centering adjustment component (3), a centering driving mechanism (4), an adsorption bracket component (5) and a blowing and suction dust removal mechanism (6) are arranged on the moving seat (201); The centering adjustment component (3) includes sliding seats (301), slide rails (302), adjustment push blocks (303) and driving columns (305). The number of the sliding seats (301) is six. Two slide rails (302) fixed on the upper end surface of the moving seat (201) are slidably connected to each sliding seat (301). An adjustment push block (303) is fixedly connected to the upper end surface of each sliding seat (301), and a driving column (305) is fixedly connected to the bottom of each sliding seat (301); The centering driving mechanism (4) includes a support cylinder (401), an annular rotating disc (402), a worm gear (403), a driving motor (404), a worm (405) and a guiding through hole (406). The support cylinder (401) is fixedly connected to the upper end surface of the moving seat (201). An annular rotating disc (402) is rotatably connected to the outside of the support cylinder (401). A worm gear (403) is fixedly installed on the outside of the annular rotating disc (402). The driving motor (404) is fixedly installed on the upper end surface of the moving seat (201). A worm (405) is connected to the rotating shaft of the driving motor (404) through a coupling. The worm (405) meshes with the worm gear (403). Six guiding through holes (406) are formed in the upper end surface of the annular rotating disc (402) in an annular array, and the six guiding through holes (406) are respectively slidably connected to the six driving columns (305).

2. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 1, characterized in that: A rectangular through hole (104) is formed in the bottom end surface of the support platform (1), and a strip-shaped sliding groove (103) is formed in each of the front and rear side surfaces inside the frame (102). A strip-shaped sliding block is arranged on each of the front and rear side surfaces of the moving seat (201), and the two strip-shaped sliding blocks are respectively slidably connected to the two strip-shaped sliding grooves (103).

3. A wafer buffer positioning bracket for a glue coating and developing machine according to claim 1, characterized in that: The feeding component (2) further includes a driving motor (202), a driving screw (203), a driving nut (204) and a square through hole (205). The driving motor (202) is fixedly installed on the rear side of the left end surface of the frame (102). A driving screw (203) is fixedly connected to the rotating shaft of the driving motor (202). The right end of the driving screw (203) is rotatably connected to the right side of the frame (102). A square through hole (205) is formed in the rear side of the left end surface of the moving seat (201). A driving nut (204) is fixedly installed inside the square through hole (205), and the driving nut (204) is in threaded connection with the driving screw (203).

4. A wafer buffer positioning bracket for a glue coating and developing machine according to claim 1, characterized in that: The centering position adjustment component (3) further includes rubber clamping blocks (304). The number of the rubber clamping blocks (304) is six. The six rubber clamping blocks (304) are respectively arranged on six position adjustment push blocks (303). An arc-shaped clamping groove is formed on the clamping surface of each rubber clamping block (304).

5. The wafer buffer positioning bracket for a glue coating and developing machine according to claim 1, characterized in that: The centering driving mechanism (4) further includes an annular rotating groove (407) and an annular rotating block (408). An annular rotating block (408) is fixedly connected to the upper side of the outer part of the support cylinder (401). An annular rotating groove (407) is formed on the inner peripheral surface of the annular rotating disc (402). The annular rotating groove (407) is rotationally connected with the annular rotating block (408).

6. The wafer buffer type positioning bracket for a spin coater / developer, according to claim 4, wherein: When the annular rotating disc (402) is in the counterclockwise rotation state, the six driving columns (305) respectively drive the six sliding seats (301), the six position adjustment push blocks (303) and the six rubber clamping blocks (304) to move inwards.

7. A wafer buffer type positioning bracket for a glue coating and developing machine, characterized in that: The adsorption bracket assembly (5) includes a support housing (501), an air suction pipe (502), a three-way pipe (503), a one-way valve (504), an air extraction pump (505), a solenoid valve (506) and a rubber pad (507). The support housing (501) is fixedly connected to the middle of the upper end surface of the moving seat (201) through a support rod. The bottom of the support housing (501) is communicated with an air suction pipe (502). The air suction pipe (502) penetrates through the moving seat (201). The lower end of the air suction pipe (502) is connected with a three-way pipe (503). The one-way valve (504) and the solenoid valve (506) are respectively installed at the left and right ends of the three-way pipe (503). The air outlet of the left end of the one-way valve (504) is connected with the air extraction port of the air extraction pump (505). The air extraction pump (505) is fixedly installed at the bottom of the moving seat (201). Adsorption holes are uniformly formed on the upper end surface of the support housing (501). A rubber pad (507) is pasted on the upper end surface of the support housing (501). Circular through holes are uniformly formed on the upper end surface of the rubber pad (507). The positions of the circular through holes on the rubber pad (507) coincide with the positions of the adsorption holes on the support housing (501).

8. A wafer buffer type positioning bracket for a glue coating and developing machine, characterized in that: The blowing and suction dust removal mechanism (6) includes a dust blowing housing cover (601), a dust suction housing cover (602), a blowing hose (603), a suction fan (604), a filter box (605) and a dust suction hose (606). The dust blowing housing cover (601) is fixedly installed on the top of a front position adjustment push block (303). The air inlet of the dust blowing housing cover (601) is connected with a blowing hose (603). The other end of the blowing hose (603) is connected with the air outlet of the suction fan (604). The suction fan (604) is fixedly installed at the bottom of the moving seat (201). The dust suction housing cover (602) is fixedly installed on the top of a rear position adjustment push block (303). The air outlet of the dust suction housing cover (602) is connected with a dust suction hose (606). The other end of the dust suction hose (606) is connected with the air inlet of the filter box (605). The air outlet of the filter box (605) is connected with the air suction port of the suction fan (604) through a pipeline.

Images