A packaging process of 3D vertical stack package structure

Abstract

The application belongs to the technical field of chip stack packaging, and particularly relates to a 3D vertical stack packaging structure and a packaging process thereof, which comprises a substrate, the substrate is bonded with a first chip, bonding wires one are arranged between the two ends of the first chip and the substrate, the first chip is bonded with a second chip, bonding wires two are arranged between the two ends of the second chip and the substrate, the second chip is bonded with a third chip, bonding wires three are arranged between the two ends of the third chip and the substrate, the substrate, the first chip, the second chip and the third chip are all bonded with adhesive layers, the stability of the overall packaging structure is ensured, more chips can be bonded on the upper end of the third chip, the stacking of more chips is realized, the packaging area is reduced, and the installation of smaller devices is adapted.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of chip stack packaging, and particularly relates to a 3D vertical stack packaging structure and a packaging process thereof. BACKGROUND

[0002] The existing chip packaging structure is mostly flat packaging, multiple chips are laid flat on a substrate, which causes great waste of space and is not conducive to assembly in small devices, thereby limiting the use of chips.

[0003] For example, patent application No. CN201310132992.9 discloses a multi-chip packaging structure, which comprises a substrate unit, a light-emitting unit, a frame unit, a packaging unit and a lens unit. The substrate unit comprises a substrate body. The light-emitting unit comprises two first light-emitting elements arranged diagonally on the substrate body and two second light-emitting elements arranged diagonally on the substrate body. The frame unit comprises two first conductive frames arranged diagonally on the substrate body and surrounding the two first light-emitting elements and two second conductive frames arranged diagonally on the substrate body and surrounding the two second light-emitting elements. However, the substrate unit, the light-emitting unit and the frame unit are laid flat, which causes great waste of space and is not conducive to assembly in small devices, thereby limiting the use of chips. SUMMARY

[0004] The application aims to provide a 3D vertical stack packaging structure and a packaging process thereof to solve the problems in the prior art.

[0005] The 3D vertical stack packaging structure comprises a substrate. A first chip is bonded to the substrate. Bonding wires one are arranged between the two ends of the first chip and the substrate. A second chip is bonded to the first chip. Bonding wires two are arranged between the two ends of the second chip and the substrate. A third chip is bonded to the second chip. Bonding wires three are arranged between the two ends of the third chip and the substrate.

[0006] Further, the substrate is provided with a ball.

[0007] Further, the widths of the first chip, the second chip and the third chip decrease in sequence.

[0008] The packaging process of the 3D vertical stack packaging structure is used for packaging the 3D vertical stack packaging structure and comprises the following steps.

[0009] S1, the substrate, the first chip, the second chip and the third chip are stored in a rotating feeding assembly. The substrate is moved to a packaging table assembly by a transfer assembly. The transfer assembly is driven by a motor one by 270 degrees. Four substrates are placed on the transfer assembly.

[0010] S2, the motor drives the transfer assembly to rotate 90 degrees, the transmission assembly at the lower end of the transfer assembly drives the rotary feeding assembly to rotate 90 degrees, the first chip moves to the lower side of the transfer assembly, and the transfer assembly moves the first chip to the substrate;

[0011] S3, the dispensing device is used to dispense between the substrate and the first chip, and the gold wire bonding device is used to form a bonding wire one between the substrate and the first chip.

[0012] Further, the rotary feeding assembly comprises a feeding circular table, a center rotating column two is fixed at the center position of the feeding circular table, the lower end of the center rotating column two is fixedly connected with the gear one, the center rotating column two is rotationally connected with the main support, the gear one is in gear engagement with the transmission assembly, four placing grooves two are arranged in the feeding circular table, the substrate, the first chip, the second chip and the third chip are respectively stored in the four placing grooves two, the bottom of the placing groove two is connected with one end of the spring three, the other end of the spring three is fixed on the lower supporting plate, the side supporting plates are slidably connected on both sides of the placing groove two, the spring four is arranged between the side supporting plate and the inner wall of the placing groove two, the curved clamping part is arranged on the upper end of the side supporting plate, and the placing groove two is communicated with the outside through the side groove.

[0013] Further, the packaging table assembly comprises a rotating circular table, a center rotating column one is fixed at the center position of the rotating circular table, the center rotating column one is connected with the output end of the motor one, the motor one is fixed at the bottom of the main support, the rotating circular table is rotationally arranged on the supporting circular table, and the center rotating column one is rotationally connected with the supporting circular table.

[0014] Further, four placing grooves one are arranged on the rotating circular table, a plurality of suction holes are arranged in the placing groove one, the plurality of suction holes are communicated with the communication chamber arranged in the rotating circular table, the lower end of the communication chamber is communicated with the communication pipe, the gas cylinder is slidably connected in the communication pipe, and the gas cylinder is fixed in the rotating circular table.

[0015] Further, the placing groove one is provided with a baffle on both sides, the two baffles are slidably connected with the rotating circular table, end blocks are fixedly connected with the end portions of the two baffles, pull rods are slidably connected in the end blocks, springs one are arranged between the end blocks and the pull rods, the lower end of the pull rod is fixedly connected with the plug block, the plug block is inserted into the plug groove arranged on the rotating circular table, the triangular block is arranged on the end block, and the front end of the triangular block points to the scale line arranged on the rotating circular table.

[0016] Further, the transmission assembly comprises a circular frame, the circular frame is fixedly connected with the center rotating column one, the circular frame is fixedly connected with the end portion of the supporting pipe, the inner sliding rod is slidably connected in the supporting pipe, the spring two is arranged between the supporting pipe and the inner sliding rod, the sliding column is fixedly connected with the end portion of the inner sliding rod, and the sliding column slides in the sliding groove arranged at the bottom of the supporting circular table.

[0017] Further, the slide post is slidingly connected in the groove on the function wheel, the circular frame is slidingly connected with the edge of the function wheel, the function wheel is fixedly connected with the gear two through the connecting column, the connecting column is rotatably connected with the main support, and the gear two is in gear engagement transmission with the gear one.

[0018] The present application has the advantages of:

[0019] The substrate, the first chip, the second chip and the third chip are all provided with glue layers, so that the stability of the overall packaging structure is ensured, more chips can be attached to the upper end of the third chip, the stacking of more chips is realized, the packaging area is reduced, and the installation of smaller devices is adapted. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a schematic view of the 3D vertical stacked packaging structure of the present application;

[0021] Figure 2 It is a schematic view of the rotating feeding assembly and packaging table assembly structure of the present application Figure 1 ;

[0022] Figure 3 It is a schematic view of the rotating feeding assembly and packaging table assembly structure of the present application Figure 2 ;

[0023] Figure 4 It is a schematic view of the transmission assembly structure of the present application Figure 1 ;

[0024] Figure 5 It is a schematic view of the transmission assembly structure of the present application Figure 2 ;

[0025] Figure 6 It is a schematic view of the packaging table assembly structure of the present application Figure 1 ;

[0026] Figure 7 It is Figure 6 a partial enlarged view of A in the figure;

[0027] Figure 8 It is a schematic view of the packaging table assembly structure of the present application Figure 2 ;

[0028] Figure 9 It is a schematic view of the packaging table assembly structure of the present application Figure 3 ;

[0029] Figure 10 It is a schematic view of the packaging table assembly structure of the present application Figure 4 ;

[0030] Figure 11 It is Figure 10 a partial enlarged view of B in the figure;

[0031] Figure 12 Structure diagram of the rotating feeding assembly of the present application Figure 1 ;

[0032] Figure 13 Structure diagram of the rotating feeding assembly of the present application Figure 2 ;

[0033] Figure 14 For Figure 13 Partial enlarged view at C in the middle;

[0034] Figure 15 Structure diagram of the transferring assembly of the present application Figure 1 ;

[0035] Figure 16 Structure diagram of the transferring assembly of the present application Figure 2 ;

[0036] Marking description in the figure:

[0037] Substrate 1; first chip 2; second chip 3; third chip 4; bonding wire one 5; bonding wire two 6; bonding wire three 7; soldering ball 8; main body support 9; motor one 10; center rotating column one 11; supporting circular table 12; rotating circular table 13; placing groove one 14; adsorption hole 15; communication chamber 16; communication pipe 17; piston 18; air cylinder 19; baffle 20; end block 21; pull rod 22; spring one 23; insertion block 24; insertion groove 25; triangular block 26; scale line 27; sliding groove 28; circular frame 29; supporting pipe 30; inner sliding rod 31; spring two 32; sliding column 33; feeding circular table 34; center rotating column two 35; gear one 36; placing groove two 37; spring three 38; lower supporting plate 39; spring four 40; side supporting plate 41; curved clamping part 42; support two 43; motor two 44; rotating rod one 45; sliding block one 46; swinging rod 47; rotating rod two 48; sliding block two 49; upper support 50; screw rod 51; supporting rod 52; functional block 53; connecting rod one 54; curved frame 55; connecting rod two 56; long rod 57; suction disc 58; gear two 59; functional wheel 60; connecting column 61; gold wire bonding equipment 62; dispensing equipment 63; sliding plate 64; side groove 65. DETAILED DESCRIPTION

[0038] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0039] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] Example 1

[0041] like Figures 1-16 As shown, a 3D vertical stacked packaging structure includes a substrate 1, a first chip 2 bonded to the substrate 1, bonding wires 5 between both ends of the first chip 2 and the substrate 1, a second chip 3 bonded to the first chip 2, bonding wires 6 between both ends of the second chip 3 and the substrate 1, and a third chip 4 bonded to the second chip 3, bonding wires 7 between both ends of the third chip 4 and the substrate 1.

[0042] The working principle of the above technical solution is as follows: substrate 1, first chip 2, second chip 3 and third chip 4 are all provided with adhesive layers between each pair, which ensures the stability of the overall packaging structure. More chips can be attached to the top of the third chip 4 to achieve the stacking of more chips, reduce the packaging area, and adapt to the installation of smaller devices.

[0043] Example 2

[0044] like Figures 1-16 As shown, the lower end of the substrate 1 is provided with a ball 8;

[0045] The working principle of the above technical solution is as follows: the substrate 1 is connected to the equipment circuit board through the ball 8 at its lower end, which reduces the number of lead wires and reduces the space occupied.

[0046] Example 3

[0047] like Figures 1-16 As shown, the widths of the first chip 2, the second chip 3, and the third chip 4 decrease sequentially.

[0048] The working principle of the above technical solution is as follows: the chips on the substrate 1 are arranged from largest to smallest upwards to prevent the upper layer chips from squeezing the bonding wires of the lower layer chips, and to expose the bonding wire solder joints for easy observation and operation.

[0049] Example 4

[0050] like Figures 1-16As shown, a packaging process of a 3D vertical stacked packaging structure is used for packaging the 3D vertical stacked packaging structure described in any of the above, comprising the following steps:

[0051] S1, the substrate 1, the first chip 2, the second chip 3 and the third chip 4 are stored in the rotating feeding assembly, the substrate 1 is moved to the packaging table assembly by the transfer assembly, the transfer assembly is driven by the motor 10 to rotate 270 degrees, and four substrates 1 are placed on the transfer assembly;

[0052] S2, the transfer assembly is continuously driven by the motor 10 to rotate 90 degrees, the transmission assembly arranged at the lower end of the transfer assembly drives the rotating feeding assembly to rotate 90 degrees, the first chip 2 moves to the lower end of the transfer assembly, and the first chip 2 is moved to the substrate 1 by the transfer assembly;

[0053] S3, the dispensing device 63 is used to dispense between the substrate 1 and the first chip 2, and the gold wire bonding device 62 is used to form a bonding wire 5 between the substrate 1 and the first chip 2;

[0054] The gold wire bonding device 62 and the dispensing device 63 are fixed with the main support 9, and the main support 9 is fixed with the sliding plate 64;

[0055] The working principle of the above technical scheme is that four placing grooves 37 are arranged in the rotating feeding assembly, a plurality of substrates 1, a plurality of first chips 2, a plurality of second chips 3 and a plurality of third chips 4 are stacked and placed in the four placing grooves 37, in the initial state, the placing groove 37 with the substrate 1 is located at the preset position below the transfer assembly, the transfer assembly can transfer the first substrate 1 on the uppermost layer of the placing groove 37 to the packaging table assembly, the packaging table assembly is driven by the motor 10 to rotate 90 degrees, the transfer assembly transfers the second substrate 1 to the packaging table assembly, the packaging table assembly is driven by the motor 10 to rotate 90 degrees again, the transfer assembly transfers the third substrate 1 to the packaging table assembly, the packaging table assembly is driven by the motor 10 to rotate 90 degrees again, and the transfer assembly transfers the fourth substrate 1 to the packaging table assembly. At this time, the packaging table assembly rotates 270 degrees, and four substrates 1 are evenly and equidistantly placed on the packaging table assembly;

[0056] During the rotation of the packaging table assembly, the dispensing device 63 dispenses on the substrate 1;

[0057] The packaging table assembly is driven to rotate 90 degrees again by the motor 10, and the rotating feeding assembly is driven to rotate 90 degrees by the transmission assembly. At this time, the placement groove two 37 with the first chip 2 placed therein is rotated to the preset position below the transfer assembly. The transfer assembly transfers the uppermost first chip 2 in the placement groove two 37 to the substrate 1, and the substrate 1 and the first chip 2 are bonded by the glue on the substrate 1. With the continuous rotation of the packaging table assembly, the four substrates 1 each have a first chip 2 falling thereon;

[0058] When the substrate 1 with the first chip 2 falling thereon is transferred below the gold wire bonding device 62, the gold wire bonding device 62 forms a bonding wire one 5 between the substrate 1 and the first chip 2;

[0059] The above operation is repeated to glue on the first chip 2, and the second chip 3 falls on the first chip 2. The gold wire bonding device 62 forms a bonding wire two 6 between the second chip 3 and the substrate 1;

[0060] The above operation is repeated to glue on the first chip 2, and the second chip 3 falls on the first chip 2. The gold wire bonding device 62 forms a bonding wire two 6 between the second chip 3 and the substrate 1;

[0061] The above operation is repeated to glue on the first chip 2, and the second chip 3 falls on the first chip 2. The gold wire bonding device 62 forms a bonding wire two 6 between the second chip 3 and the substrate 1;

[0062] Embodiment five

[0063] As shown in Figures 1-16 The rotating feeding assembly includes a feeding circular table 34. A center rotating column two 35 is fixed at the center position of the feeding circular table 34. The lower end of the center rotating column two 35 is fixedly connected with a gear one 36. The center rotating column two 35 is rotationally connected with the main support 9. The gear one 36 is in gear engagement with the transmission assembly for transmission. Four placement grooves two 37 are arranged in the feeding circular table 34. The substrate 1, the first chip 2, the second chip 3 and the third chip 4 are respectively stored in the four placement grooves two 37. The bottom of the placement groove two 37 is connected with one end of a spring three 38. The other end of the spring three 38 is fixed on a lower support plate 39. The two sides of the placement groove two 37 are slidably connected with side support plates 41. The spring four 40 is arranged between the side support plate 41 and the inner wall of the placement groove two 37. The upper end of the side support plate 41 is provided with a curved clamping portion 42. The placement groove two 37 is in communication with the outside through a side groove 65;

[0064] The working principle of the above technical scheme is as follows: the plurality of substrates 1, the plurality of first chips 2, the plurality of second chips 3 and the plurality of third chips 4 are respectively stacked in the four placing grooves two 37, for example, the placing groove two 37 in which the substrate 1 is placed, when the uppermost substrate 1 is taken away by the transfer assembly, the uppermost substrate 1 extrudes the two end bending clamping parts 42 to move to both sides, and drives the two side support plates 41 to move to both sides, after the uppermost substrate 1 is taken away by the transfer assembly, under the elastic force of the spring three 38, the lower support plate 39 extrudes the plurality of substrates 1 to move upwards, the second substrate 1 moves upwards and is clamped by the bending clamping parts 42 at both ends, the transfer assembly is kept at the same position to suck the substrate 1, and the stability of the substrate 1 is ensured;

[0065] The remaining amount of the substrate 1 in the placing groove two 37 can be observed through the side groove 65, so that replenishment can be conveniently and timely performed;

[0066] For the placing groove two 37 in which the first chip 2 or the second chip 3 or the third chip 4 is placed, under the elastic force of the spring four 40, the two side support plates 41 can be tightly attached to the two sides of the first chip 2, and the clamping and accommodation of the chip with the width are adapted.

[0067] Embodiment six

[0068] As shown in Figures 1-16 The packaging table assembly comprises a rotating circular table 13, a center rotating column one 11 is fixed at the center position of the rotating circular table 13, the center rotating column one 11 is connected with the output end of a motor one 10, the motor one 10 is fixed at the bottom of a main body support 9, the rotating circular table 13 rotates on a supporting circular table 12, and the center rotating column one 11 is rotationally connected with the supporting circular table 12.

[0069] Four placing grooves one 14 are arranged on the rotating circular table 13, a plurality of suction holes 15 are arranged in the placing grooves one 14, the plurality of suction holes 15 are in communication with a communication chamber 16 arranged in the rotating circular table 13, the lower end of the communication chamber 16 is in communication with a communication pipe 17, a gas cylinder 19 is slidably connected in the communication pipe 17, and the gas cylinder 19 is fixed in the rotating circular table 13.

[0070] The two sides of the placing groove one 14 are both provided with a baffle 20, the two baffles 20 are both slidably connected with the rotating circular table 13, end blocks 21 are fixedly connected with the two end portions of the two baffles 20, pull rods 22 are slidably connected in the end blocks 21, springs one 23 are arranged between the end blocks 21 and the pull rods 22, plug blocks 24 are fixed at the lower ends of the pull rods 22, the plug blocks 24 are inserted into plug grooves 25 arranged on the rotating circular table 13, triangular blocks 26 are arranged on the end blocks 21, and the triangular blocks 26 are directed to scale lines 27 arranged on the rotating circular table 13.

[0071] The working principle of the above technical scheme is as follows: in the initial state, the placing groove two 37 in which the substrate 1 is placed is located at the preset position below the transfer assembly, the transfer assembly transfers the substrate 1 into the placing groove one 14 on the rotating circular table 13, the cylinder 19 is started, the piston 18 is driven to move backward in the communication pipe 17, thereby increasing the space of the communication chamber 16 and the communication pipe 17, and the negative pressure in the communication chamber 16 and the communication pipe 17 is formed, and the atmospheric pressure tightly presses the substrate 1 in the placing groove one 14, so that the substrate is not easily moved when the rotating circular table 13 rotates, and the reliability of the chip packaging is ensured.

[0072] Pulling the pull rod 22 upward, the pull rod 22 slides upward in the end block 21, the spring one 23 is stretched, the plug block 24 is driven to move upward, the plug block 24 is separated from the plug groove 25, the pull rod 22 is translated, the end block 21 and the baffle 20 are driven to slide on the rotating circular table 13, thereby changing the width of the placing groove one 14, and thereby adapting to substrates 1 or chips of different widths, when the position of the baffle 20 is adjusted to be appropriate, the upward pulling of the pull rod 22 is released, the pull rod 22 is driven to move downward under the action of the pulling force of the spring one 23, the plug block 24 is inserted into the plug groove 25, thereby preventing the end block 21 and the baffle 20 from moving automatically, and the stability of the structure is ensured, the distance between the two baffles 20 can be determined by the position of the triangular block 26 on the scale line 27, and the width of the substrate 1 or the chip can be better adapted.

[0073] Embodiment seven

[0074] As shown in Figures 1-16 The transmission assembly includes a circular frame 29, the circular frame 29 is fixedly connected with the center rotating column one 11, the circular frame 29 is fixedly connected with the end of the support pipe 30, the inner sliding rod 31 is slidingly connected in the support pipe 30, the spring two 32 is arranged between the support pipe 30 and the inner sliding rod 31, the sliding column 33 is fixedly arranged at the end of the inner sliding rod 31, and the sliding column 33 slides in the sliding groove 28 arranged at the bottom of the support circular table 12;

[0075] The sliding column 33 is slidingly and matchingly connected in the groove on the function wheel 60, the circular frame 29 is slidingly and matchingly connected with the edge of the function wheel 60, the function wheel 60 is fixedly connected with the gear two 59 through the connecting column 61, the connecting column 61 is rotationally connected with the main body support 9, and the gear two 59 is in gear engagement transmission with the gear one 36.

[0076] The working principle of the above technical solution is as follows: in the initial state, the placing groove two 37 in which the substrate 1 is placed is located at a preset position below the transfer assembly, the transfer assembly transfers the first substrate 1 into the first placing groove one 14 on the rotating table 13, the motor one 10 is started to drive the central rotating column one 11 to rotate by 90 degrees, the circular frame 29 slides with the edge of the functional wheel 60, the support pipe 30 and the inner slide rod 31 rotate with the central rotating column one 11, the slide column 33 at the front end of the inner slide rod 31 slides in the slide groove 28, the rotating table 13 rotates by 90 degrees, the transfer assembly transfers the second substrate 1 into the second placing groove one 14 on the rotating table 13, the central rotating column one 11 is driven by the motor one 10 to rotate by 90 degrees again, the circular frame 29 slides with the edge of the functional wheel 60, the support pipe 30 and the inner slide rod 31 rotate with the central rotating column one 11, the slide column 33 at the front end of the inner slide rod 31 slides in the slide groove 28, the rotating table 13 rotates by 90 degrees again, the transfer assembly transfers the third substrate 1 into the third placing groove one 14 on the rotating table 13, the central rotating column one 11 is driven by the motor one 10 to rotate by 90 degrees again, the circular frame 29 slides with the edge of the functional wheel 60, the support pipe 30 and the inner slide rod 31 rotate with the central rotating column one 11, the slide column 33 at the front end of the inner slide rod 31 slides in the slide groove 28, the rotating table 13 rotates by 90 degrees again, the transfer assembly transfers the fourth substrate 1 into the fourth placing groove one 14 on the rotating table 13, at this time, the central rotating column one 11 rotates by 270 degrees in total, and there are substrates 1 in the four placing grooves one 14 on the rotating table 13;

[0077] When the substrate 1 is transferred below the dispensing device 63, the dispensing device 63 dispenses on the substrate 1;

[0078] The central rotating column one 11 is driven by the motor one 10 to rotate by 90 degrees again, the circular frame 29 is separated from the edge of the functional wheel 60, the slide column 33 slides into the groove on the functional wheel 60, after the functional wheel 60 is driven by the slide column 33 to rotate by 90 degrees, the slide column 33 slides out of the groove on the functional wheel 60, the functional wheel 60 rotates by 90 degrees to drive the gear two 59 to rotate by 90 degrees through the connecting column 61, to drive the gear one 36 to rotate by 90 degrees, to drive the feeding table 34 to rotate by 90 degrees, at this time, the placing groove two 37 in which the first chip 2 is placed is transferred to a preset position below the transfer assembly, the first chip 2 is transferred to the substrate 1 which is dispensed by the transfer assembly, with the rotating table 13 rotating by 90 degrees at intervals, the four first chips 2 are sequentially transferred to the four substrates 1, when the substrate 1 on which the first chip 2 is attached is transferred below the gold wire bonding device 62, the gold wire bonding device 62 forms the bonding wire one 5 between the substrate 1 and the first chip 2;

[0079] The above operation is repeated to dispense on the first chip 2, the second chip 3 falls on the first chip 2, and the gold wire bonding device 62 forms the bonding wire two 6 between the second chip 3 and the substrate 1.

[0080] Dispensing on the second chip 3, the third chip 4 falls on the second chip 3, and the bonding wire three 7 is formed between the third chip 4 and the substrate 1 through the gold wire bonding device 62;

[0081] Through the above scheme, the 3D vertical stack packaging structure is packaged, the rotating circular table 13 rotates 360 degrees, the feeding circular table 34 rotates 90 degrees, the accuracy of feeding and discharging is guaranteed, the degree of automation is high, and the production efficiency is fast.

[0082] Embodiment eight

[0083] As shown in Figures 1-16 The transfer assembly includes a bracket two 43, the lower end of the bracket two 43 is fixedly connected with the main bracket 9, the bracket two 43 is fixedly connected with a motor two 44, the output end of the motor two 44 is connected with a rotating rod one 45, the rotating rod one 45 is rotationally connected with a sliding block one 46, the sliding block one 46 slides in a swing rod 47, the lower end of the swing rod 47 is rotationally connected with the bracket two 43, the swing rod 47 is slidably connected with a sliding block two 49, the sliding block two 49 is rotationally connected with a rotating rod two 48, the rotating rod two 48 is fixedly connected with a function block 53 through a connecting rod, the connecting rod rotates at the lower end of a supporting rod 52, the function block 53 is slidably connected with a connecting rod one 54, the connecting rod one 54 is rotationally connected with a bent bracket 55 at the end, the bent bracket 55 is slidably connected with a connecting rod two 56, the connecting rod two 56 is slidably connected with a long rod 57, and the bent bracket 55 is fixedly connected with a suction disc 58 at the lower end;

[0084] The long rod 57 is fixed on the upper bracket 50, the upper bracket 50 is fixedly connected with the bracket two 43, the upper bracket 50 is threadedly connected with a screw rod 51, and the lower end of the screw rod 51 is rotationally connected with the supporting rod 52, and the supporting rod 52 slides in the upper bracket 50;

[0085] The working principle of the above technical scheme is as follows: the motor two 44 is started, the rotating rod one 45 is driven to rotate, the sliding block one 46 is driven to slide in the swing rod 47, the lower end of the swing rod 47 is driven to rotate with the bracket two 43, and the upper end of the swing rod 47 reciprocates left and right, when the swing rod 47 swings to one side of the feeding circular table 34, the swing rod 47 drives the rotating rod two 48 to rotate through the sliding block two 49, drives the function block 53 to rotate, drives the connecting rod one 54 to rotate, drives the bent bracket 55 to move to one side of the feeding circular table 3, drives the connecting rod two 56 to slide on the long rod 57, and the bent bracket 55 slides up and down on the connecting rod two 56, drives the suction disc 58 to move downward, the suction disc 58 contacts the upper surface of the substrate 1 and adsorbs the substrate 1, the rotating rod one 45 continues to rotate, drives the swing rod 47 to rotate to one side of the rotating circular table 13, drives the rotating rod two 48 to rotate to one side of the rotating circular table 13, drives the function block 53 and the connecting rod one 54 to rotate to one side of the rotating circular table 13, drives the bent bracket 55 to move to one side of the rotating circular table 13, and drives the suction disc 58 to adsorb the substrate 1 and move the substrate 1 to the placing groove one 14;

[0086] Rotating the screw rod 51 drives the support rod 52 to ascend or descend in the upper support 50, thereby changing the swing range of the rotating rod 2 48, and further changing the width of the left and right movement of the curved bracket 55, and further changing the width between the placement slot 1 14 and the placement slot 2 37, thereby ensuring the transfer accuracy of the substrate 1 or the chip.

[0087] It can be understood that the present application is described by some embodiments, and those skilled in the art know that various changes or equivalent replacements can be made to the features and embodiments without departing from the spirit and scope of the present application. In addition, under the guidance of the present application, the features and embodiments can be modified to adapt to specific conditions and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are within the scope of the present application.

Claims

1. A packaging process for a 3D vertically stacked packaging structure, characterized in that, Includes the following steps: S1. The substrate (1), the first chip (2), the second chip (3) and the third chip (4) are all stored in the rotating loading assembly. The substrate (1) is moved to the packaging stage assembly by the transfer assembly. After the transfer assembly is driven 270 degrees by the motor (10), four substrates (1) are placed on the transfer assembly. S2. The transfer assembly is driven to rotate 90 degrees by motor 1 (10). The transmission assembly at the lower end of the transfer assembly drives the rotating feeding assembly to rotate 90 degrees. The first chip (2) moves to the bottom of the transfer assembly and is moved to the substrate (1) by the transfer assembly. S3. Apply adhesive between the substrate (1) and the first chip (2) using the dispensing equipment (63), and form a bonding line (5) between the substrate (1) and the first chip (2) using the gold wire bonding equipment (62). The encapsulation stage assembly includes a rotating frustum (13), with a central rotating column (11) fixed at the center of the rotating frustum (13). The central rotating column (11) is connected to the output end of a motor (10). The motor (10) is fixed at the bottom of the main support (9). The rotating frustum (13) rotates on a supporting frustum (12), and the central rotating column (11) is rotatably connected to the supporting frustum (12). The rotating truncated cone (13) is provided with four placement slots (14), and each placement slot (14) is provided with multiple adsorption holes (15). Each adsorption hole (15) is connected to a connecting chamber (16) provided in the rotating truncated cone (13). The lower end of the connecting chamber (16) is connected to a connecting pipe (17). A cylinder (19) is slidably connected in the connecting pipe (17). The cylinder (19) is fixed in the rotating truncated cone (13). Both sides of the placement slot (14) are provided with baffles (20). Both baffles (20) are slidably connected to the rotating frustum (13). Both baffles (20) are fixedly connected to end blocks (21) at their ends. A pull rod (22) is slidably connected inside the end block (21). A spring (23) is provided between the end block (21) and the pull rod (22). A plug (24) is fixed at the lower end of the pull rod (22). The plug (24) is inserted into the slot (25) provided on the rotating frustum (13). A triangular block (26) is provided on the end block (21). The front end of the triangular block (26) points to the scale line (27) provided on the rotating frustum (13).

2. The packaging process for a 3D vertical stacked packaging structure according to claim 1, characterized in that, The rotating feeding assembly includes a feeding truncated cone (34), with a central rotating column (35) fixed at the center of the feeding truncated cone (34). The lower end of the central rotating column (35) is fixedly connected to a gear (36). The central rotating column (35) is rotatably connected to the main support (9). The gear (36) meshes with the transmission assembly gear for transmission. The feeding truncated cone (34) is provided with four placement slots (37). The substrate (1), the first chip (2), the second chip (3), and the third chip (4) are respectively placed in these slots. It is stored in four placement slots (37). The bottom of the placement slot (37) is connected to one end of the spring (38). The other end of the spring (38) is fixed on the lower support plate (39). Side support plates (41) are slidably connected to both sides of the placement slot (37). A spring (40) is provided between the side support plate (41) and the inner wall of the placement slot (37). A bending clamping part (42) is provided at the upper end of the side support plate (41). The placement slot (37) is connected to the outside through the side slot (65).

3. The packaging process for a 3D vertical stacked packaging structure according to claim 1, characterized in that, The transmission assembly includes a circular frame (29), which is fixedly connected to a central rotating column (11). The circular frame (29) is fixedly connected to the end of a support tube (30). An inner slide rod (31) is slidably connected inside the support tube (30). A spring (32) is provided between the support tube (30) and the inner slide rod (31). A slide column (33) is fixed at the end of the inner slide rod (31). The slide column (33) slides in a groove (28) provided at the bottom of the support truncated cone (12).

4. The packaging process for a 3D vertical stacked packaging structure according to claim 3, characterized in that, The sliding column (33) is slidably connected to the groove on the functional wheel (60), the circular frame (29) is slidably connected to the edge of the functional wheel (60), the functional wheel (60) is fixedly connected to the gear two (59) through the connecting column (61), the connecting column (61) is rotatably connected to the main support (9), and the gear two (59) meshes with the gear one (36) for transmission.

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