Large-aperture light and thin active array heat dissipation integrated framework

Abstract

The invention relates to the technical field of heat dissipation of electronic equipment, and particularly discloses a large-caliber light and thin active array heat dissipation integrated framework. Comprising a heat dissipation bearing structure, a heat dissipation assembly and a function module which are installed in the heat dissipation bearing structure, a plurality of groups of radio frequency sub-arrays which are installed on the heat dissipation assembly and are connected with the function module, and antenna arrays which are installed on the radio frequency sub-arrays and are vertically interconnected. The heat dissipation assembly comprises a heat dissipation liquid cooling plate assembly installed in the heat dissipation bearing structure, a heat exchange liquid cooling plate installed in the heat dissipation bearing structure and conducting heat exchange with an external heat sink, and a liquid supply mechanism connected between the heat dissipation liquid cooling plate assembly and the heat exchange liquid cooling plate. According to the invention, the requirements of the active array on large aperture, lightness, thinness and expandability are met. A plurality of groups of closed fluid loops are integrated in the array, heat is led out through contact between the internal heat exchange liquid cooling plate and the external heat sink, external liquid supply is not needed, and the array heat dissipation integration problem in a windless / liquid-free environment can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation for electronic devices, and more specifically, to a large-aperture, thin, and light active array heat dissipation integrated architecture. Background Art

[0002] Active arrays are increasingly widely used in radar / communication systems due to their advantages such as flexible and controllable beam scanning, large power-aperture product, easy full-solidification, and high reliability. Active arrays are developing towards large aperture, thin and light, high performance, and high integration, which makes the heat flux density of TR components continuously increase. In particular, some platforms face problems such as lack of heat dissipation (wind, liquid) resources and harsh heat dissipation environments. Based on this, there is an urgent need for a structure and heat dissipation integrated architecture for large-aperture, thin, and light active arrays under wind / liquid-free conditions to solve the above problems.

[0003] Currently, the structural integration of large-aperture arrays mainly simplifies the array surface into modular sub-arrays, and then adjusts the number and layout form of the sub-arrays to achieve the expansion and adjustment of system functions. Active arrays can be divided into different integration forms such as brick type, tile type, and brick-tile hybrid type. The TR components of the brick-type array are placed perpendicular to the antenna array surface, which has the characteristics of simple structure, low integration density, and high profile, and is suitable for large-aperture array integration. The TR components of the tile-type array are placed parallel to the antenna array surface, which has the characteristics of high integration density and low profile, and is suitable for thin and light array integration. The TR components of the brick-tile hybrid type array are brick-type TRs, and the remaining components (such as feeding components, power supply components, routing components, etc.) are designed as tile-type.

[0004] Patent CN202410941789.4 proposes a large-aperture and scalable array architecture, in which a number of installation grid cavities are arranged side by side within the structural framework, and the sub-arrays are respectively installed in the installation grid cavities. The remaining functional devices are designed as a number of brick-type modules, and each brick-type module is connected to the sub-array antenna array surface through an adapter board.

[0005] Patent CN202022615685.4 proposes an ultra-large array surface active array antenna interconnection structure, which is composed of a number of brick-type TR module arrays arranged in a row; the module arrays are installed on the front end surface of the framework; the wave control mother board and the wave control distribution board are both installed on the rear end surface of the framework; the wave control mother board is connected to each wave control distribution board through low-frequency cables respectively.

[0006] Patent CN202411008785.7 proposes a spaceborne large-aperture tile-type array antenna, which arranges a number of antenna units and TR units on a PCB board, sets a number of sparse channels on the antenna array surface, and arranges a number of distributed power supply modules on the side of the sparse channels for power supply to the surrounding antenna units.

[0007] Patent CN201610305652.5 proposes an integrated architecture of an active array antenna with a brick-tile hybrid structure. It designs the TR components into brick-like forms, the feeding network, wave control module, and power supply module into tile-like forms, and then vertically stacks the two.

[0008] Currently, the heat dissipation integration methods for large-aperture, thin, and light array systems are mainly air-cooled heat dissipation and liquid-cooled heat dissipation. Air-cooled heat dissipation has low efficiency, but it has good maintainability, strong interchangeability, low cost, and does not require external redundant equipment. Liquid-cooled heat dissipation usually has relatively high efficiency, but its disadvantages are poor maintainability, and it is difficult for the heat exchange equipment and component units to form an integrated device, and independent layout is required.

[0009] Patent CN202210777000.7 proposes a low-profile tile-like integrated digital array antenna, which adopts an air-cooled heat dissipation architecture. The active sub-arrays are arranged in a tile-like manner and embedded in the frame, and the air ducts are arranged at the rear of the frame and opposite to the position of the active antenna. Patent CN201610343067.4 proposes an array antenna structure with a Ka-band tile structure, where the TR arrangement is between the liquid-cooled metal box and the antenna unit, and the heat of the TR components is carried away by the coolant in the metal box.

[0010] In summary, the current large-aperture active arrays mainly adopt the integrated forms of brick-like, tile-like, and brick-tile hybrid structures; mainly adopt air-cooled or liquid-cooled heat dissipation methods. However, for the active array integration under the conditions of no air / liquid heat dissipation, there has been no extensive research on large-aperture, thin, high-power, and scalable active arrays. Summary of the Invention

[0011] The technical problem to be solved by the present invention is to provide a heat dissipation integration architecture for a large-aperture, thin, and light active array, which meets the requirements of the active array for large aperture, thinness, and scalability. Multiple groups of closed fluid circuits are integrated inside the array, and heat is exported by contacting the internal heat exchange liquid-cooled plate with an external heat sink, without external liquid supply, which can be used to solve the problem of heat dissipation integration of the array in a no-air / liquid environment;

[0012] The solution adopted by the present invention to solve the technical problem is:

[0013] A heat dissipation integration architecture for a large-aperture, thin, and light active array, comprising a heat dissipation bearing structure, heat dissipation components and functional modules installed in the heat dissipation bearing structure, radio frequency sub-arrays installed on the heat dissipation components and connected to the functional modules, and antenna arrays installed on the radio frequency sub-arrays and vertically interconnected;

[0014] The heat dissipation components include a heat dissipation liquid-cooled plate assembly installed in the heat dissipation bearing structure, a heat exchange liquid-cooled plate installed in the heat dissipation bearing structure and performing heat exchange with an external heat sink, and a liquid supply mechanism respectively connected between the heat dissipation liquid-cooled plate assembly and the heat exchange liquid-cooled plate.

[0015] In some possible embodiments, the heat dissipation liquid cooling plate assembly includes multiple groups of connected heat dissipation liquid cooling plates; multiple groups of the heat dissipation liquid cooling plates cooperate with a liquid supply mechanism and a heat exchange liquid cooling plate to form several independent liquid circuits.

[0016] In some possible embodiments, adjacent heat dissipation liquid cooling plates are connected through a fluid interconnection plate;

[0017] The fluid interconnection plate includes an interconnection plate having a connecting flow channel, cores installed on the interconnection plate and respectively connected to both ends of the connecting flow channel and arranged in one-to-one correspondence; a sealing ring is sleeved outside the cores; the cores are communicated with the heat dissipation liquid cooling plates.

[0018] In some possible embodiments, the liquid supply mechanism includes a liquid supply component and a first liquid cooling hose for connecting the liquid supply component with the heat exchange liquid cooling plate or the heat dissipation liquid cooling plate; the heat exchange liquid cooling plate and the heat dissipation liquid cooling plate are connected through a second liquid cooling hose.

[0019] In some possible embodiments, the heat dissipation and load-bearing structure includes a main load-bearing frame provided with a heat dissipation cavity and a functional installation cavity; an upper cover plate and a lower cover plate for closing the functional installation cavity are provided on the main load-bearing frame; the heat exchange liquid cooling plate is installed in the heat dissipation cavity and is located at the bottom of the heat dissipation component.

[0020] In some possible embodiments, in the heat dissipation cavity, there are partition bars provided for dividing the heat dissipation cavity into multiple chambers for installing heat dissipation liquid cooling plates; grooves with openings downward and inserted and matched with the partition bars are provided on the interconnection plate.

[0021] In some possible embodiments, the heat dissipation liquid cooling plate includes a group of first heat dissipation liquid cooling plates, two groups of second heat dissipation liquid cooling plates, and a group of third heat dissipation liquid cooling plates; the liquid supply components are two groups; the heat exchange liquid cooling plates are two groups;

[0022] Among them, a group of the first heat dissipation liquid cooling plates, a group of second heat dissipation liquid cooling plates, a group of third heat dissipation liquid cooling plates, a group of liquid supply components, and a group of heat exchange liquid cooling plates cooperate to form a first liquid circuit;

[0023] Another group of the second heat dissipation liquid cooling plates, third heat dissipation liquid cooling plates, a group of liquid supply components, and a group of heat exchange liquid cooling plates form a second liquid circuit.

[0024] In some possible embodiments, the antenna array includes multiple groups of antenna array surfaces, and the antenna array surfaces are vertically and blindly plugged and interconnected with radio frequency sub-arrays; the radio frequency sub-arrays are laid flat on the heat dissipation liquid cooling plate assembly and are arranged at equal intervals.

[0025] In some possible embodiments, the functional modules are divided into multiple groups, and each group of the functional modules includes a module body made of aluminum alloy and installed in a heat dissipation bearing structure, a low-frequency socket and a mixed socket arranged on the module body, and a circuit structure arranged in the module body and connected to the low-frequency socket and the mixed socket.

[0026] A heat dissipation method according to the above-mentioned large-caliber, lightweight, active array heat dissipation integrated architecture. When in use, the fluid in the liquid supply mechanism flows through the heat dissipation liquid cold plate assembly to take away the heat generated by the functional module and the RF sub-array. After the fluid passes through the heat exchange liquid cold plate, the heat is transferred to the external heat sink. Then the fluid returns to the liquid supply mechanism to form a closed loop, completing a fluid heat absorption and heat release.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The present invention connects the heat dissipation liquid cooling plates with different uses to the main load-bearing frame structure through screws, and has the functions of structural bearing, flow distribution, component heat dissipation, and external heat exchange. Each heat dissipation liquid cooling plate is laid horizontally and is highly independent of each other;

[0029] The present invention can reasonably divide and combine the cold plates according to the array layout form, and can also expand the types and quantities of cold plates as needed according to the array scale, so as to realize the heat dissipation structure integration of large-caliber arrays;

[0030] The antenna array and the radio frequency sub-array of the present invention are connected by vertical blind plugging, and the heat dissipation bearing structure is reasonably arranged between the antenna array and the radio frequency sub-array; the radio frequency sub-array and the functional module are horizontally tiled without vertical stacking, thereby realizing the lightness and thinness of the active array;

[0031] The heat dissipation bearing structure of the present invention integrates a heat exchange liquid cooling plate and a liquid supply component, which can form multiple closed-loop fluid circuits. The heat exchange liquid cooling plate is in contact with an external heat sink to achieve heat extraction, and the array does not require external liquid supply. It can be used to solve the problem of array heat dissipation integration in a windless / liquidless environment.

[0032] The heat dissipation liquid cooling plates of the present invention are interconnected through fluid interconnection plates and liquid cooling hoses, and the fluid circuits can be quickly plugged in and out to form different flow distribution network forms as needed, supporting rapid expansion of fluid topology forms.

[0033] The present invention can realize the integration of multiple antenna components, RF sub-arrays and functional modules, and components of multiple different architectures in the same array, supporting multi-functional heterogeneous function expansion; when there are new requirements, the type, quantity and layout of antenna components and RF sub-arrays can be adjusted as needed, and rapid output can be achieved by simply redesigning the structure, reducing R&D costs and shortening the R&D cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1Schematic structural diagram of the present invention;

[0035] Figure 2 Schematic structural diagram of the heat dissipation and load-bearing structure, radio frequency sub-array, functional module, and electrical interface in the present invention;

[0036] Figure 3 Schematic layout diagram of the heat dissipation and load-bearing structure in the present invention;

[0037] Figure 4 Schematic integration diagram of the heat dissipation and load-bearing structure in the present invention;

[0038] Figure 5 Schematic diagram of the fluid topology structure in the present invention;

[0039] Figure 6 Schematic layout diagram of the first heat dissipation liquid cooling plate, second heat dissipation liquid cooling plate, and third heat dissipation liquid cooling plate in the present invention;

[0040] Figure 7 Schematic structural diagram of the fluid interconnection plate in the present invention;

[0041] Figure 8 Schematic structural diagram of the first liquid cooling hose in the present invention;

[0042] Figure 9 Schematic structural diagram of the liquid supply assembly in the present invention;

[0043] Figure 10 Schematic external shape structure diagram of the present invention;

[0044] Wherein: 1 - heat dissipation and load-bearing structure, 11 - through groove, 12 - first heat dissipation liquid cooling plate, 121 - flow channel, 13 - second heat dissipation liquid cooling plate, 131 - first flow channel, 132 - second flow channel, 133 - liquid flow channel, 14 - third heat dissipation liquid cooling plate, 141 - liquid flow channel A, 15 - heat exchange liquid cooling plate, 16 - fluid interconnection plate, 161 - interconnection plate; 162 - core body, 163 - sealing ring, 17 - first liquid cooling hose, 18 - liquid supply assembly, 181 - liquid return port, 182 - liquid supply port, 19 - main load-bearing frame, 20 - second liquid cooling hose, 2 - radio frequency sub-array, 3 - functional module, 4 - electrical interface, 5 - upper cover plate, 6 - lower cover plate, 7 - antenna array. Specific embodiments

[0045] In the present invention, unless otherwise clearly specified and defined, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a direct connection, or an indirect connection through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. The "first", "second" and similar terms mentioned in this application do not represent any sequence, quantity or importance, but are only used to distinguish different components. Similarly, terms such as "a" or "one" do not represent a quantity limit, but indicate that there is at least one. In the implementation of this application, "and / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In the description of the embodiments of this application, unless otherwise stated, the meaning of "a plurality" refers to two or more. For example, a plurality of positioning posts means two or more positioning posts. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] The present invention will be described in detail below.

[0047] As Figures 1 - 10 shown:

[0048] A large-aperture thin and light active array heat dissipation integrated architecture includes a heat dissipation carrier structure 1, a heat dissipation component and a functional module 3 installed in the heat dissipation carrier structure 1, several groups of radio frequency sub-arrays 2 installed on the heat dissipation component and connected to the functional module 3, and an antenna array 7 installed on the radio frequency sub-array 2 and vertically interconnected;

[0049] The heat dissipation component includes a heat dissipation liquid cooling plate assembly installed in the heat dissipation carrier structure 1, a heat exchange liquid cooling plate 15 installed in the heat dissipation carrier structure 1 and performing heat exchange with an external heat sink, and a liquid supply mechanism respectively connected between the heat dissipation liquid cooling plate assembly and the heat exchange liquid cooling plate 15; the heat dissipation liquid cooling plate assembly includes multiple groups of connected heat dissipation liquid cooling plates; multiple groups of the heat dissipation liquid cooling plates cooperate with the liquid supply mechanism and the heat exchange liquid cooling plate 15 to form several independent liquid circuits; the heat dissipation liquid cooling plate is used for fluid to flow and exchange heat with the radio frequency sub-array 2 and the functional module 3.

[0050] The antenna array 7 includes multiple groups of antenna array surfaces, and the antenna array surfaces are vertically blind-inserted and interconnected with the radio frequency sub-array 2. By adjusting the size of the antenna array surface and controlling the number of radio frequency interfaces thereon, the alignment accuracy and insertion and extraction force of the radio frequency interfaces during blind insertion and interconnection are ensured to meet the requirements; the radio frequency sub-array 2 is laid flat on the heat dissipation liquid cooling plate assembly and arranged at equal intervals.

[0051] The antenna array 7 is divided into multiple and / or various antenna array surfaces, and each antenna array surface is blindly inserted and interconnected to the radio frequency sub-array 2 in sequence.

[0052] The liquid supply mechanism is used to provide the flow pumping power of the fluid inside the heat dissipation bearing structure 1; the fluid flows out from the liquid supply component 18, flows through the heat dissipation liquid cooling plate to dissipate heat from all the radio frequency sub-arrays 2 and the functional modules 3, and then transfers the heat to the external heat sink in contact with it after flowing through the heat exchange liquid cooling plate 15, and finally returns to the liquid supply component 18 to form a fluid cycle, completing the heat absorption and heat release of the fluid once.

[0053] The radio frequency sub-array 2 includes multiple groups of radio frequency components. Each group of radio frequency components includes a radio frequency motherboard, multiple radio frequency devices installed on the radio frequency motherboard, and a low-frequency socket A and a mixed socket A installed at the bottom of the radio frequency motherboard; the low-frequency socket A is used for external power supply connection, and the mixed socket A is used for external control and radio frequency signal connection;

[0054] The radio frequency sub-array 2 is arranged in the lower middle area of the heat dissipation bearing structure 1 and is vertically installed on the heat dissipation liquid cooling plate from bottom to top; several groups of radio frequency sub-arrays 2 are radio frequency sub-arrays 2 of various different architectures, which can be combined and tiled as needed. Each radio frequency sub-array 2 is arranged at equal intervals and can be flexibly expanded in the X direction and the Y direction along the horizontal direction, and the layout form and array scale can be adjusted according to needs.

[0055] In some possible implementation manners, the adjacent heat dissipation liquid cooling plates are connected through a fluid interconnection plate 16; the fluid interconnection plate 16 realizes the short-distance rigid fluid interconnection of the heat dissipation liquid cooling plates. Its internal contains connected connecting channels, which can realize the sealed connection between the required heat dissipation liquid cooling plates. It has the characteristics of being solder-free and having a small flow resistance, improving the manufacturability of the heat dissipation bearing structure 1.

[0056] Specifically, the fluid interconnection plate 16 includes an interconnection plate 161 with connecting channels, cores 162 installed on the interconnection plate 161 and respectively connected to the two ends of the connecting channels in a one-to-one correspondence; a sealing ring 163 is sleeved outside the cores 162; the cores 162 are communicated with the heat dissipation liquid cooling plate.

[0057] In some possible implementation manners, the liquid supply mechanism includes a liquid supply component 18 and a liquid cooling hose 17 for connecting the liquid supply component 18 to the heat exchange liquid cooling plate 15 or the heat dissipation liquid cooling plate; the heat exchange liquid cooling plate 15 and the heat dissipation liquid cooling plate are connected through a liquid cooling hose 20.

[0058] The liquid supply component 18 is a product of the prior art, and its internal integrates components such as a driving motor, a fluid pump, an expansion tube, and a control module; it provides fluid driving force and fluid volume compensation for the liquid circuit of the present invention;

[0059] The liquid supply assembly 18 is provided with a liquid return port 181 and a liquid supply port 182. The fluid enters the first liquid cooling hose 17 connected to the liquid supply port 182 under the control of the liquid supply assembly 18, then flows through the heat dissipation liquid cooling plate assembly and the heat exchange liquid cooling plate 15, and exchanges heat with the radio frequency subarray 2 and the functional module 3. After flowing through the heat exchange liquid cooling plate 15, it transfers the heat to the external heat sink in contact with it, and then returns to the liquid supply assembly 18 through the first liquid cooling hose 17 connected to the liquid return port 181.

[0060] The liquid cooling hoses (the first liquid cooling hose 17 and the second liquid cooling hose 20) all adopt quick-release self-sealing liquid cooling connectors to achieve long-distance flexible fluid interconnection. They have the characteristics of being detachable and having a large tolerance, which improves the maintainability of the heat dissipation load-bearing structure 1.

[0061] In some possible implementation manners, the heat dissipation load-bearing structure 1 includes a main load-bearing frame 19 provided with a heat dissipation cavity and a functional installation cavity; an upper cover plate 5 and a lower cover plate 6 for closing the functional installation cavity are arranged on the main load-bearing frame 19; the heat exchange liquid cooling plate 15 is installed in the heat dissipation cavity and is located at the bottom of the heat dissipation assembly.

[0062] Specifically, an electrical interface 4 is arranged on the frame structure for realizing external electrical connection;

[0063] Preferably, the heat dissipation cavity is a rectangular structure, and the functional installation cavity is an L-shaped structure and is located outside the heat dissipation cavity; the functional module 3 can be a power module, a control module, a routing module, etc. Different functional modules 3 can be configured according to actual needs, or can be stacked in multiple layers in the vertical direction to achieve multi-functional large-scale stacked integration; preferably, in order to control the profile thickness of the active array, the stacking layer number is generally 1-2 layers.

[0064] In some possible implementation manners, partition bars for dividing the heat dissipation cavity into multiple chambers for installing heat dissipation liquid cooling plates are arranged in the heat dissipation cavity; grooves opening downward and inserted and matched with the partition bars are arranged on the interconnection board.

[0065] In some possible implementation manners, the heat dissipation liquid cooling plate includes a group of first heat dissipation liquid cooling plates 12, two groups of second heat dissipation liquid cooling plates 13, and a group of third heat dissipation liquid cooling plates 14; there are two groups of the liquid supply assemblies 18; there are two groups of the heat exchange liquid cooling plates 15;

[0066] Among them, a group of the first heat dissipation liquid cooling plates 12, a group of the second heat dissipation liquid cooling plates 13, a group of the third heat dissipation liquid cooling plates 14, a group of the liquid supply assemblies 18, and a group of the heat exchange liquid cooling plates 15 cooperate to form a first liquid circuit;

[0067] The other group of the second heat dissipation liquid cooling plates 13, the third heat dissipation liquid cooling plates 14, a group of the liquid supply assemblies 18, and a group of the heat exchange liquid cooling plates 15 form a second liquid circuit.

[0068] In some possible embodiments, the functional modules 3 are installed in a functional installation cavity in groups, and each group of the functional modules 3 includes a module body made of aluminum alloy and installed in the heat dissipation bearing structure 1, a low-frequency socket and a mixed socket arranged on the module body, and a circuit structure arranged in the module body and connected to the low-frequency socket and the mixed socket.

[0069] A heat dissipation method according to the above-mentioned large-caliber, thin and light active array heat dissipation integrated architecture. When in use, the fluid in the liquid supply mechanism flows through the heat dissipation liquid cold plate assembly to take away the heat generated by the functional module 3 and the RF sub-array 2. After the fluid passes through the heat exchange liquid cold plate 15, the heat is transferred to the external heat sink. Then the fluid returns to the liquid supply mechanism to form a closed loop, completing a fluid heat absorption and heat release.

[0070] Embodiment 1:

[0071] A large-aperture, thin, active array integrated architecture, such as Figures 1 - 10 As shown, it includes a heat dissipation bearing structure 1, a radio frequency sub-array 2, a functional module 3, and an antenna array 7;

[0072] The number of the RF sub-arrays 2 is 9 groups, arranged in 3X3; the number of the functional modules 3 is 6 groups and they are located in the L-shaped functional installation cavity of the heat dissipation bearing structure 1, with 3 layers on each side and 1 group on each layer. The functional modules 3 specifically include a power module, a control module and a RF routing module.

[0073] The heat dissipation bearing structure 1 has a diameter slightly larger than that of the antenna array 7; it includes a main load-bearing frame 19 in a frame structure, a first heat dissipation liquid cooling plate 12, a second heat dissipation liquid cooling plate 13, a third heat dissipation liquid cooling plate 14, a heat exchange liquid cooling plate 15, a liquid supply component 18, a fluid interconnection plate 16, a liquid cooling hose 1 17 and a liquid cooling hose 2 20.

[0074] The main load-bearing frame 19 has a plurality of heat dissipation cavities with a size of 1350mmX1350mmX85mm, and the preferred material is aluminum alloy.

[0075] The first heat dissipation liquid cold plate 12 is a group with a size of 300mmX280mmX8mm, the second heat dissipation liquid cold plate 13 is two groups with a size of 684mmX280mmX8mm, and the third heat dissipation liquid cold plate 14 is a group with a size of 733mmX733mmX10mm; they all have a flanged flange structure and are installed to the heat dissipation cavity of the main load-bearing frame 19 by screws.

[0076] There are two sets of the heat exchange liquid cooling plates 15, with dimensions of 685mm X 280mm X 10mm, and they also have a flanged mounting structure; the heat exchange liquid cooling plates 15 are installed on the main load-bearing frame 19 by screws, with one side facing the inside of the array and the other side facing the outside of the array. The outside can be in contact with an external heat sink for heat exchange.

[0077] At both ends of the flow channels connected inside the fluid interconnection plate 16, there are liquid cooling connectors. The liquid cooling connectors include a core body and a sealing ring sleeved outside the core body. As Figure 7 shown, the fluid interconnection plate 16 is used to connect the first heat dissipation liquid cooling plate 12, the second heat dissipation liquid cooling plate 13, and the third heat dissipation liquid cooling plate 14 to jointly form a combined heat dissipation liquid cooling plate area of the array.

[0078] As Figure 6 shown, the heat dissipation liquid cooling plates include a set of first heat dissipation liquid cooling plates 12, two sets of second heat dissipation liquid cooling plates 13, and a set of third heat dissipation liquid cooling plates 14 with two liquid flow channels A141.

[0079] One set of the first heat dissipation liquid cooling plates 12, one set of the second heat dissipation liquid cooling plates 13, one set of the third heat dissipation liquid cooling plates 14, one set of liquid supply mechanisms, and one set of heat exchange liquid cooling plates 15 form a first heat dissipation liquid cooling area with a first liquid circuit; the first liquid circuit is formed by three sets of fluid interconnection plates 16, two sets of first liquid cooling hoses 17, one set of second liquid cooling hoses 20, and one set of liquid supply assemblies 18.

[0080] Specifically: as Figure 5 shown, there is a flow channel 121 with an inlet and an outlet arranged inside one set of the first heat dissipation liquid cooling plates 12. The second heat dissipation liquid cooling plate 13 used in conjunction with the flow channel 121 in the first heat dissipation liquid cooling plate 12 has a first flow channel 131 communicating with the inlet of the flow channel 121 and a second flow channel 132 communicating with the outlet of the flow channel 121.

[0081] The first flow channel 131 is connected to the inlet, and the second flow channel 132 is connected to the outlet respectively through the fluid interconnection plate 16; the outlet of the second flow channel 132 is connected to the inlet of one set of liquid flow channels A141 in the third heat dissipation liquid cooling plate 14 through the fluid interconnection plate 16. The outlet of the liquid flow channel A141 is connected to the inlet of the heat exchange liquid cooling plate 15 through the second liquid cooling hose 20; the outlet of the heat exchange liquid cooling plate 15 is connected to the liquid supply assembly 18 through one set of first liquid cooling hoses 17; the inlet of the first flow channel 131 is connected to the liquid supply assembly 18 through the first liquid cooling hose 17.

[0082] The second liquid circuit is formed by one set of fluid interconnection plates 16, two sets of first liquid cooling hoses 17, one set of second liquid cooling hoses 20, and one set of liquid supply assemblies 18.

[0083] Specifically, a liquid flow channel 133 with an inlet and an outlet is provided in another group of second heat dissipation liquid cooling plates 13. The inlet of the liquid flow channel 133 is communicated with a liquid supply component 18 through a group of liquid cooling hoses 17. The outlet of the liquid flow channel 133 is communicated with the inlet of another group of liquid flow channels A141 through a fluid interconnection plate 16. The outlet of this group of liquid flow channels A141 is then communicated with the inlet of another group of heat exchange liquid cooling plates 15 through a group of liquid cooling hoses 20. The outlet of the heat exchange liquid cooling plate 15 is communicated with the liquid supply component 18 through a group of liquid cooling hoses 17, and the inlet of the liquid flow channel 133 is also communicated with the liquid supply component 18 through a group of liquid cooling hoses 17.

[0084] One end of the liquid cooling hose 17 is a quick-release liquid cooling joint, which is connected to the liquid inlet of the first flow channel 131, and the other side is an elbow flange.

[0085] A liquid return port 181 and a liquid supply port 182 are provided outside the liquid supply component 18, and its sealing form is flange sealing.

[0086] After the fluid flows out from the liquid supply port 182, it flows through the second heat dissipation liquid cooling plate 13, the first heat dissipation liquid cooling plate 12, the third heat dissipation liquid cooling plate 14 or flows through the second heat dissipation liquid cooling plate 13 and the third heat dissipation liquid cooling plate 14 to take away the heat of the radio frequency sub-array 2 and the functional module 3, and then flows through the heat exchange liquid cooling plate 15 to transfer the heat to the external heat sink. Finally, the fluid returns to the liquid return port 181 to form a closed loop, completing one cycle of fluid heat absorption and heat release.

[0087] A group of electrical interfaces 4 are also installed on the main load-bearing frame 19. The cables passing through the electrical interfaces 4 are connected to the functional module 3 for realizing external electrical connection.

[0088] The radio frequency sub-array 2 is composed of 9 radio frequency components. 64 radio frequency devices are installed on the upper surface of the radio frequency component, and 1 low-frequency socket A and 1 mixed socket A are installed on the lower surface of the radio frequency component. The low-frequency socket A is used to realize power supply connection with the functional module 3; the mixed socket A is used to realize control and radio frequency signal connection with the functional module 3. The radio frequency devices on the radio frequency component are in contact with the combined heat dissipation liquid cooling plate area through heat-conducting insulating pads, as Figure 1 shown, to transfer the heat to the fluid inside it.

[0089] The antenna array 7 and the radio frequency sub-array 2 are interconnected by blind plugging of radio frequency connectors to realize radio frequency signal transmission. Preferably, both the radio frequency interface and the radio frequency connector are SMP.

[0090] The functional module 3 includes a module body, a low-frequency socket, and a mixed socket; the circuit structure is located inside the module body; preferably, the module body is made of aluminum alloy, and the low-frequency socket is a rectangular connector capable of transmitting large current; the functional module 3 is installed on the main load-bearing frame 19, and heat is transferred through the path of the functional module 3, the main load-bearing frame 19, and the heat dissipation liquid cooling plates (the first heat dissipation liquid cooling plate 12, the second heat dissipation liquid cooling plate 13, and the third heat dissipation liquid cooling plate 14), and finally the heat is taken away by the fluid inside the heat dissipation liquid cooling plates (the first heat dissipation liquid cooling plate 12, the second heat dissipation liquid cooling plate 13, and the third heat dissipation liquid cooling plate 14).

[0091] In this embodiment, the active array has a sectional thickness of 85 mm, can be flexibly expanded along the X and Y directions in the horizontal direction, and has obvious features of being thin, light, and expandable.

[0092] The present invention is not limited to the foregoing specific embodiments. The present invention extends to any new feature or any new combination disclosed in this specification, as well as any new method or process step or any new combination disclosed.

Claims

1. A large-aperture, thin and light active array heat dissipation integrated architecture, characterized in that It includes a heat dissipation and load-bearing structure, a heat dissipation component and a functional module installed in the heat dissipation and load-bearing structure, several groups of radio frequency sub-arrays installed on the heat dissipation component and connected to the functional module, and an antenna array installed on the radio frequency sub-array and vertically interconnected; The heat dissipation component includes a heat dissipation liquid cooling plate component installed in the heat dissipation and load-bearing structure, a heat exchange liquid cooling plate installed in the heat dissipation and load-bearing structure and performing heat exchange with an external heat sink, and a liquid supply mechanism respectively connected between the heat dissipation liquid cooling plate component and the heat exchange liquid cooling plate.

2. The large-diameter thin and light active array heat dissipation integrated architecture according to claim 1, wherein The heat dissipation liquid cooling plate component includes multiple groups of connected heat dissipation liquid cooling plates; the multiple groups of heat dissipation liquid cooling plates cooperate with the liquid supply mechanism and the heat exchange liquid cooling plate to form several independent liquid circuits.

3. A large-aperture thin and light active array heat dissipation integrated architecture according to claim 2, characterized in that Adjacent heat dissipation liquid cooling plates are connected through a fluid interconnection plate; The fluid interconnection plate includes an interconnection plate with a connecting flow channel, cores installed on the interconnection plate and respectively connected to both ends of the connecting flow channel and arranged in one-to-one correspondence; a sealing ring is sleeved outside the core; the core is communicated with the heat dissipation liquid cooling plate.

4. A large-aperture thin and light active array heat dissipation integrated architecture according to claim 2, wherein The liquid supply mechanism includes a liquid supply component and a first liquid cooling hose for connecting the liquid supply component to the heat exchange liquid cooling plate or the heat dissipation liquid cooling plate; the heat exchange liquid cooling plate and the heat dissipation liquid cooling plate are connected through a second liquid cooling hose.

5. A large-aperture thin and light active array heat dissipation integrated architecture according to claim 3, characterized in that, The heat dissipation and load-bearing structure includes a main load-bearing frame provided with a heat dissipation cavity and a functional installation cavity; an upper cover plate and a lower cover plate for closing the functional installation cavity are arranged on the main load-bearing frame; the heat exchange liquid cooling plate is installed in the heat dissipation cavity and located at the bottom of the heat dissipation component.

6. The large-aperture thin and light active array heat dissipation integrated architecture according to claim 5, characterized in that In the heat dissipation cavity, there are partition bars for dividing the heat dissipation cavity into multiple chambers for installing heat dissipation liquid cooling plates; on the interconnection plate, there are grooves with openings downward and inserted and matched with the partition bars.

7. A large-aperture thin and light active array heat dissipation integrated architecture according to claim 4, characterized in that The heat dissipation liquid cooling plate includes a group of first heat dissipation liquid cooling plates, two groups of second heat dissipation liquid cooling plates, and a group of third heat dissipation liquid cooling plates; the liquid supply components are two groups; the heat exchange liquid cooling plates are two groups; Among them, a group of the first heat dissipation liquid cooling plates, a group of second heat dissipation liquid cooling plates, a group of third heat dissipation liquid cooling plates, a group of liquid supply components, and a group of heat exchange liquid cooling plates cooperate to form a liquid circuit one; The other group of second heat dissipation liquid cooling plates, third heat dissipation liquid cooling plates, a group of liquid supply components, and a group of heat exchange liquid cooling plates form a liquid circuit two.

8. A large-aperture thin and light active array heat dissipation integrated architecture according to claim 1, characterized in that The antenna array includes multiple groups of antenna array surfaces, and the antenna array surfaces are vertically blind plugged and interconnected with the radio frequency sub-arrays; the radio frequency sub-arrays are laid flat on the heat dissipation liquid cooling plate component and arranged at equal intervals.

9. The large-aperture thin and light active array heat dissipation integrated architecture according to claim 1, characterized in that The functional modules are multiple groups, and each group of functional modules includes a module body made of aluminum alloy and installed in the heat dissipation and load-bearing structure, a low-frequency socket and a mixed socket arranged on the module body, and a circuit structure arranged in the module body and connected to the low-frequency socket and the mixed socket.

10. A heat dissipation method for a large-aperture thin and light active array heat dissipation integrated architecture according to any one of claims 1-9, characterized in that, During use, the fluid in the liquid supply mechanism flows through the heat dissipation liquid cooling plate component to take away the heat generated by the functional module and the radio frequency sub-array, and the fluid transfers the heat to the external heat sink after passing through the heat exchange liquid cooling plate, and then the fluid returns to the liquid supply mechanism to form a closed loop, completing one cycle of fluid heat absorption and heat release.

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