Power supply module, method and system, electronic equipment, storage medium and program product

By using DC power modules to connect to DC transmission lines in the power supply system of the data center, and using high-density parallel modules to convert voltages, the problem of low AC-DC conversion efficiency is solved, and more efficient power supply and energy efficiency is achieved.

CN120377206AActive Publication Date: 2025-07-25INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202510875455.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-27
Publication Date
2025-07-25
Estimated Expiration
2045-06-27

AI Technical Summary

Technical Problem

In the power supply system of the data center, the power conversion efficiency caused by the AC-DC conversion process is low, resulting in large power supply losses.

Method used

The DC power module is used to connect it to the DC transmission line. The DC power is converted into DC power with an appropriate voltage through the high-density parallel module, and the power supply is directly supplied to the power board to reduce the AC-DC conversion process. A high-density parallel module is set up in the DC power module to improve the power conversion efficiency.

Benefits of technology

It reduces power supply losses, improves the power conversion efficiency of the power supply system, simplifies the power supply system architecture, and improves the energy efficiency of the data center.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a power supply module, method and system, electronic equipment, a storage medium and a program product, and relates to the technical field of computing device.The power supply module comprises a direct-current power module and a power supply board, the direct-current power module is inserted into the power supply board, and the power supply module is connected with a direct-current power transmission line through the direct-current power module; according to the power supply module, alternating-current and direct-current conversion processing does not need to be carried out in the direct-current power supply module, power supply conversion loss is reduced, the high-density parallel modules are arranged in the direct-current power supply module, the power supply conversion efficiency of the direct-current power supply module is improved, and power supply loss of the power supply module is reduced.
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Description

Technical Field

[0001] This application relates to the technical field of computing devices, and in particular to a power supply module, method, system, electronic device, storage medium, and program product. Background Art

[0002] With the rapid development of the data center and cloud computing industries, the demand for the energy efficiency, reliability, and scalability of data centers is increasing. Currently, how to reduce the power consumption loss of data centers is an urgent problem to be solved.

[0003] Data centers usually use alternating current (AC) power distribution for power supply. During this process, the power conversion efficiency of the power supply system is low, resulting in large power supply losses. Summary of the Invention

[0004] This application provides a power supply module, method, system, electronic device, storage medium, and program product to at least solve the problem that the power conversion efficiency of the power supply system in related technologies is low, resulting in large power supply losses.

[0005] This application provides a power supply module, including: a DC power supply module and a power supply board. The DC power supply module is inserted into the power supply board, and the DC power supply module is also connected to a DC power line. The DC power supply module includes a high-density parallel module. The DC power supply module converts the first direct current input by the DC power line into a second direct current through the high-density parallel module and inputs the second direct current to the power supply board. The voltage of the first direct current is greater than the voltage of the second direct current.

[0006] This application also provides an electronic device, including: a power supply module and an electrical device. The power supply module includes a DC power supply module and a power supply board. The DC power supply module is inserted into the power supply board, and the DC power supply module is also connected to a DC power line. The power supply board is also connected to the electrical device. The DC power supply module includes a high-density parallel module. The DC power supply module converts the first direct current input by the DC power line into a second direct current through the high-density parallel module and inputs the second direct current to the power supply board. The voltage of the first direct current is greater than the voltage of the second direct current. The power supply board supplies power to the electrical device according to the second direct current.

[0007] The present application also provides a power supply system, including: a voltage regulator, a power distribution unit, a DC transmission line, and an electronic device. The electronic device includes a power supply module and an electrical appliance. The power supply module includes a DC power supply module and a power supply board. Wherein, the voltage regulator is connected to the input end of the power distribution unit, the output end of the power distribution unit is connected to the DC power supply module of the electronic device through the DC transmission line, the DC power supply module is inserted on the power supply board, and the power supply board is also connected to the electrical appliance; the voltage regulator inputs the first direct current to the DC power supply module through the power distribution unit and the DC transmission line; the DC power supply module includes a high-density parallel module, and the DC power supply module converts the first direct current input by the DC transmission line into the second direct current through the high-density parallel module and inputs the second direct current to the power supply board, and the power supply board supplies power to the electrical appliance according to the second direct current, and the voltage of the first direct current is greater than the voltage of the second direct current.

[0008] The present application also provides a power supply method, including: obtaining the power consumption data and load requirements of the load electrical appliance; adjusting the operating mode of the load electrical appliance and the power supply mode of the DC power supply module according to the power consumption data and load requirements, and the DC power supply module is used to supply power to the load electrical appliance.

[0009] The present application also provides a power supply device, including: an obtaining module, configured to obtain the power consumption data and load requirements of the load electrical appliance; a processing module, configured to adjust the operating mode of the load electrical appliance and the power supply mode of the DC power supply module according to the power consumption data and load requirements, and the DC power supply module is used to supply power to the load electrical appliance.

[0010] The present application also provides an electronic device, including: a memory, configured to store a computer program; a processor, configured to implement the steps of the above power supply method when executing the computer program.

[0011] The present application also provides a computer-readable storage medium, in which a computer program is stored. Wherein, when the computer program is executed by a processor, the steps of the above power supply method are implemented.

[0012] The present application also provides a computer program product, including a computer program, and when the computer program is executed by a processor, the steps of any one of the above power supply methods are implemented.

[0013] Through the present application, since the power supply module is connected to the DC transmission line through the DC power supply module, there is no need to perform AC-DC conversion processing inside the DC power supply module, which is beneficial to reducing power conversion loss. Moreover, by setting a high-density parallel module in the DC power supply module, the power supply module is beneficial to improving the power conversion efficiency of the DC power supply module, thereby being beneficial to reducing the power supply loss of the power supply module. Description of the Drawings

[0014] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0015] Figure 1 One of the schematic diagrams of the power supply system provided by the embodiments of the present application;

[0016] Figure 2 Another schematic diagram of the power supply system provided by the embodiments of the present application;

[0017] Figure 3 One of the schematic diagrams of the structure of the power supply module provided by the embodiments of the present application;

[0018] Figure 4A One of the schematic diagrams of the structure of the first power supply adapter board provided by the embodiments of the present application;

[0019] Figure 4B Another schematic diagram of the structure of the first power supply adapter board provided by the embodiments of the present application;

[0020] Figure 5A One of the schematic diagrams of the structure of the DC power supply module provided by the embodiments of the present application;

[0021] Figure 5B Another schematic diagram of the structure of the DC power supply module provided by the embodiments of the present application;

[0022] Figure 5C Another schematic diagram of the structure of the DC power supply module provided by the embodiments of the present application;

[0023] Figure 5D Schematic diagram of the DC power supply module provided by the embodiments of the present application;

[0024] Figure 5E Schematic diagram of the position of the DC power supply module provided by the embodiments of the present application in an electronic device;

[0025] Figure 6A One of the schematic diagrams of the structure of the power supply board provided by the embodiments of the present application;

[0026] Figure 6B Another schematic diagram of the structure of the power supply board provided by the embodiments of the present application;

[0027] Figure 6C Another schematic diagram of the structure of the power supply board provided by the embodiments of the present application;

[0028] Figure 6D Another schematic diagram of the structure of the power supply board provided by the embodiments of the present application;

[0029] Figure 6E The fifth structural schematic diagram of the power supply board provided by the embodiment of the present application;

[0030] Figure 6F A schematic diagram of a power supply path of the power supply board provided by the embodiment of the present application;

[0031] Figure 7 The structural schematic diagram of the electronic device provided by the embodiment of the present application;

[0032] Figure 8 An exemplary schematic diagram of a communication topology for managing electrical appliances provided by the embodiment of the present application;

[0033] Figure 9 The flowchart of the power supply method provided by the embodiment of the present application;

[0034] Figure 10 The structural schematic diagram of the power supply device provided by the embodiment of the present application. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0036] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0037] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the present application are all information and data authorized by the user or fully authorized by all parties, and the collection, use, processing, transmission, provision, disclosure and application of relevant data and other processing all comply with relevant laws, regulations and standards, take necessary confidentiality measures, do not violate public order and good customs, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0038] With the rapid development of the data center and cloud computing industries, the demand for the energy efficiency, reliability, and scalability of data centers is increasing. In some scenarios, data centers can be deployed using a heterogeneous acceleration resource pool deployment method. Heterogeneous resource pool deployment refers to integrating multiple different types of computing resources into a resource collection through pooling technology, and providing efficient, flexible, and scalable computing power services by intelligently invoking and managing this resource collection. In this heterogeneous acceleration resource pool deployment method, the power consumption requirements of each electronic device in the data center are relatively high, which in turn leads to a relatively high power supply requirement for the electronic devices.

[0039] The data center can be powered by an uninterruptible power supply (UPS) power supply system containing an energy storage device. Next, the UPS power supply system will be described in conjunction with Figure 1 . Figure 1 One of the schematic diagrams of the power supply system provided by the embodiments of this application is shown. Please refer to Figure 1 . The power supply system can include a voltage regulator, a power distribution unit (PDU), and electronic devices. A power supply unit (PSU) and electrical appliances are provided inside the electronic devices. Inside the voltage regulator, through the process of alternating current (AC) to direct current (DC) and direct current (DC) to alternating current (AC), the 380-volt (V) alternating current input to this power supply system can be converted into 220V alternating current, and this 220V alternating current is input to the PSU through the PDU. The PSU can convert the 220V alternating current into 12V direct current that can be used by each electrical appliance inside the electronic device.

[0040] During the research process, it was found that in the Figure 1 shown power supply system, multiple AC-DC conversion processes are required from the voltage regulator to the PSU inside the electronic device. Moreover, multiple-level AC-DC conversion processing is also required inside the PSU. Conversion losses will occur during each level of AC-DC conversion process, resulting in relatively large power supply losses. For example, if the data center uses an AC power distribution method for power supply, the power loss during the AC-DC conversion process accounts for about 5% - 10% of the input power of the data center.

[0041] Therefore, the embodiments of this application provide a power supply system that can improve the power conversion efficiency and reduce the power supply loss by reducing the number of AC-DC conversions during the power supply process.

[0042] Figure 2 Another schematic diagram of the power supply system provided by the embodiments of this application is shown. Please refer to Figure 2, the power supply system may include a voltage regulator 10, a power distribution unit 11, a DC transmission line 12, and an electronic device 13. A power supply module 130 and an electrical appliance 131 are provided in the electronic device 13.

[0043] The electronic device may be a server. From an architectural perspective, the server may be a whole cabinet server, a rack server, or a high-density server; from a functional perspective, the server may be a general-purpose server or an artificial intelligence (AI) server, etc.

[0044] The electrical appliance may include a management electrical appliance and a load electrical appliance. Among them, the management electrical appliance may include a manager module, and the load electrical appliance may include at least one of the following: a processor, a memory, a radiator, a retimer, and an adapter.

[0045] Exemplarily, the manager module may include, but is not limited to, a baseboard management controller (BMC) module.

[0046] Exemplarily, the processor may include, but is not limited to, at least one of the following: a central processing unit (CPU), a graphics processing unit (GPU), or a microcontroller unit (MCU).

[0047] Exemplarily, the radiator may include, but is not limited to, a fan (FAN).

[0048] Exemplarily, the adapter may include, but is not limited to, a high-speed path adapter. For example, the high-speed path adapter may be a peripheral component interconnect express (PCIe) paddle card.

[0049] In some power supply scenarios, the direct current input from the power supply network may be converted into a first direct current by a transformer and input into the voltage regulator 10 in the power supply system. The voltage regulator 10 may input the first direct current into the power distribution unit 11, and the power distribution unit 11 may input the first direct current into the power supply module 130 through the DC transmission line 12.

[0050] For example, the direct current input from the power supply network may be 10 kilovolts (kV) direct current, and the first direct current may be 380V direct current.

[0051] The voltage stabilizer 10 can perform voltage stabilization processing on the input 380V direct current to ensure a stable voltage input to the power distribution unit in the case of voltage fluctuations in the input voltage.

[0052] The power distribution unit 11 can be used for power distribution processing. The power distribution unit 11 can be connected to at least one electronic device 13, and the power distribution unit 11 can distribute the 380V direct current input by the voltage stabilizer to at least one electronic device 13.

[0053] It should be understood that Figure 2 The number and form of the devices shown are only for illustration and do not constitute a limitation on the embodiments of the present application. In practical applications, the number of voltage stabilizers, power distribution units, DC transmission lines, electronic devices, power supply modules, and electrical appliances in the power supply system can be two or more. Figure 2 The power supply system shown is only illustrated by taking one voltage stabilizer, one power distribution unit, one DC transmission line, one electronic device, one power supply module, and one electrical appliance as an example.

[0054] Such as Figure 2 As shown, the power supply module 130 includes a DC power supply module 1300 and a power supply board 1301. Among them, the DC power supply module 1300 can be inserted on the power supply board 1301, and the DC power supply module 1300 is also connected to the DC transmission line 12.

[0055] Optionally, the DC transmission line can include, but is not limited to, a DC power supply bus for high voltage direct current (HVDC) technology.

[0056] The DC power supply module 1300 can include a high-density parallel module. The DC power supply module 1300 can convert the first direct current input by the DC transmission line 12 into a second direct current through the high-density parallel module and input the second direct current to the power supply board 1301. It should be noted that the structure of the high-density parallel module will be described in Figure 5A It will be described below.

[0057] The power supply board 1301 can also be connected to the electrical appliance 131, and the power supply board 1301 can supply power to the electrical appliance 131 according to the second direct current.

[0058] The voltage of the first direct current is greater than the voltage of the second direct current. Exemplarily, the first direct current can be 380V direct current, and the second direct current can be 12V direct current.

[0059] In the power supply system provided by the embodiments of the present application, the power supply process from the voltage regulator to the power supply module within the electronic device is all DC power supply, without the need for AC-DC conversion, thereby reducing the conversion loss during the AC-DC conversion process and being beneficial to improving the power conversion efficiency of the power supply system. Moreover, the power supply module further improves the power conversion efficiency and reduces the power supply loss of the power supply system by setting a high-density parallel module in the DC power supply module.

[0060] The power supply system provided by the embodiments of the present application can be applied to high-power load scenarios. For example, in the data center scenario, the power supply system provided by the embodiments of the present application can be used for power supply. The voltage regulator in this power supply system can provide the first direct current to the electronic device (such as a whole cabinet server) through the power distribution unit and the DC input wire (such as the HVDC DC power supply bus). During this process, there is no need for AC-DC conversion, thereby reducing the conversion loss during the AC-DC conversion process and eliminating the need to set up an AC-DC conversion module, which is beneficial to simplifying the architecture of the power supply system. By setting a DC power supply module containing a high-density parallel module in the electronic device, it is beneficial to improve the energy conversion efficiency of the electronic device and reduce the power supply loss. In summary, this power supply system is beneficial to reducing the power supply loss in the data center, improving the power conversion efficiency of the power supply system, simplifying the power supply and distribution architecture of the data center, and improving the overall energy efficiency of the data center, thereby solving the problem of large power supply loss in the power supply system under the high computing power scenario of the data center.

[0061] Next, in combination with Figure 3 , the above-mentioned power supply module 130 will be further described.

[0062] Figure 3 One of the structural schematic diagrams of the power supply module provided by the embodiments of the present application is shown in Figure 3 , based on the structure of the power supply module 130 shown in Figure 2 , the power supply module 130 may further include a first power supply adapter board 1302.

[0063] As shown in Figure 3 , the first power supply adapter board 1302 can be connected to the power supply board 1301, and the first power supply adapter board 1302 is also used to connect to the AC power supply.

[0064] Optionally, the first power supply adapter board 1302 can be inserted into the power supply board 1301.

[0065] The first power supply adapter board 1302 is used to convert the alternating current input from the AC power supply into the second direct current and input the second direct current to the power supply board 1301.

[0066] In some embodiments, in the first power transfer board 1302, the input circuit of the AC power supply may adopt an N+N redundancy design method to ensure that the AC power supply can still normally supply power to the first power transfer board 1302 through the remaining input circuits except the faulty input circuit in the case of any input circuit failure.

[0067] The power supply module provided by the embodiments of the present application can integrate a highly modular DC power module and the first power transfer board on the power supply board, making the structure of the power supply module simpler.

[0068] Next, in combination with Figure 4A and Figure 4B , the first power transfer board will be further described.

[0069] Figure 4A is one of the structural schematic diagrams of the first power transfer board provided by the embodiments of the present application. Please refer to Figure 4A , the first power transfer board 1302 may include a first power connector 1302-0 and a power converter 1302-1.

[0070] The first power connector 1302-0 can be used to connect the AC power supply, and the first power connector 1302-0 can transmit the alternating current input by the AC power supply to the power converter 1302-1.

[0071] The power converter 1302-1 can be connected to the power supply board 1301, and the power converter 1302-1 can be used to convert the alternating current input by the first power connector 1302-0 into a second direct current and input the second direct current to the power supply board 1301.

[0072] The number of the power converter 1302-1 and the first power connector 1302-0 can be at least one.

[0073] Figure 4B is the second structural schematic diagram of the first power transfer board provided by the embodiments of the present application. Please refer to Figure 4B , the first power transfer board 1302 may include 2 first power connectors 1302-0 and 4 power converters 1302-1.

[0074] As Figure 4B shown, the first power connector 1302-0 and the power converter 1302-1 can be located on different surfaces of the first power transfer board 1302.

[0075] The first power connector can be used as a power input interface to supply power to the power supply board 1301.

[0076] Optionally, the first power connector can be compatible with multiple power input specifications, enabling it to be applied to various power access scenarios. Among them, the power input specification can be used to indicate the design standards and requirements that the power input interface needs to meet.

[0077] In the power supply module provided by the embodiments of the present application, by setting the DC power module and the first power transfer board, the power supply module can be made compatible with alternating current (AC) and direct current (DC) inputs, making the power supply reliability of the power supply module higher and the supported power supply scenarios more diverse.

[0078] Next, in conjunction with Figures 5A - 5E , the above DC power module 1300 will be further described.

[0079] Figure 5A FIG. is one of the structural diagrams of the DC power module provided by the embodiments of the present application. Please refer to Figure 5A , in the DC power module 1300, a high-density parallel module 1300-0 can be included, and the high-density parallel module 1300-0 can include multiple power conversion units.

[0080] As Figure 5A shown, the input ends of multiple power conversion units are connected in parallel and connected to the DC power line 12; the output ends of multiple power conversion units are connected in series and connected to the power supply board 1301.

[0081] Exemplarily, the power conversion unit can be a high-density module daughter card.

[0082] In some data center scenarios, air-cooled power supplies or high-performance power supplies can be used to supply power to electronic devices. Exemplarily, the power density of an air-cooled power supply can reach 15-18 watts per cubic inch (W / in 3 ), and the power density of a high-performance power supply can reach 35-40 W / in 3 .

[0083] With the rapid development of artificial intelligence technology, the power demand of electronic devices in the data center has increased accordingly. For example, with 16 high-performance double-width acceleration cards installed in a 4U chassis of a heterogeneous acceleration resource pool, the single-machine power consumption will reach 9000 watts (W), and the liquid-cooled chassis may reach 10 kilowatts (kW). In this case, if the above air-cooled power supply or high-performance power supply is still used for power supply, it will result in a large number of power supplies being required to be set in the electronic device, making the occupied space of the power supply in the electronic device too large.

[0084] The high-density parallel module 1300-0 provided by the embodiments of the present application can be formed by connecting multiple power conversion units in parallel, so that the high-density parallel module has a high power density and can meet the voltage conversion requirements of high-power electronic devices. Moreover, after the multiple power conversion units inside the high-density parallel module are connected in parallel, the integration degree is high, the space occupied by the high-density parallel module is small, which is beneficial to reducing the space occupied by the DC power module in the power supply module, and further beneficial to reducing the space resources occupied by the power supply module in the electronic device.

[0085] In some embodiments, the power density of the DC power module can be determined according to the size (including length, width, and height) and output power of the DC power module, and the power density = output power / (length × width × height).

[0086] Exemplarily, the size of the DC power module can be 185 millimeters (mm) × 147.9 mm × 39 mm, the output power can be 9000 W, and the output voltage can be 12 V. It can be calculated that the power density of the DC power module is 137.93 watts per cubic inch (W / in 3 ), and the specific calculation process is as follows:

[0087] 9000 W / (185 mm × 147.9 mm × 39 mm) = 9000 W / (7.28 in × 5.82 in × 1.54 in) = 9000 W / 65.25 in 3 = 137.93 W / in 3 。

[0088] In the high-density parallel module, by connecting multiple power conversion units in parallel, it is also beneficial to improve the expandability and maintainability of the high-density parallel module.

[0089] For example, users can flexibly increase or decrease the number of power conversion units in the high-density parallel module according to the change of the power demand of the electronic device. Or, in the case where some power conversion units in the high-density parallel module fail, the other power conversion units in the high-density parallel module except these faulty power conversion units can continue to work to ensure the power supply stability of the electronic device.

[0090] Figure 5B This is the second structural schematic diagram of the DC power module provided by the embodiments of the present application. Please refer to Figure 5B ,in Figure 5A Based on the structure of the DC power module 1300 shown, the DC power module 1300 may further include a hot-swap module 1300-1 and a boost energy storage module 1300-2.

[0091] As Figure 5BAs shown, the hot-swap module 1300-1 can be connected between the DC power line 12 and the input end of the high-density parallel module 1300-0, and the boost energy storage module 1300-2 can be connected between the hot-swap module 1300-1 and the input end of the high-density parallel module 1300-0.

[0092] The hot-swap module 1300-1 can be used to perform hot-swap processing on the DC power module 1300.

[0093] Optionally, the hot-swap module 1300-1 can not only support the hot-swap processing operation of the DC power module 1300, but also maintain good electromagnetic compatibility (EMC) during the hot-swap process to ensure that the DC power module 1300 is not affected by electromagnetic interference.

[0094] The boost energy storage module 1300-2 can be used to regulate the voltage of the first direct current input to the high-density parallel module 1300-0 and input the regulated first direct current to the high-density parallel module 1300-0.

[0095] In some scenarios, the input voltage of the DC power module 1300 may be undervoltage. In this case, the boost energy storage module 1300-2 can boost the input voltage to ensure the voltage stability of the first direct current input to the high-density parallel module.

[0096] The DC power module provided by the embodiment of the present application can ensure the power supply stability of the DC power module by setting a hot-swap module and a boost energy storage module before the high-density parallel module.

[0097] Figure 5C This is the third structural schematic diagram of the DC power module provided by the embodiment of the present application. Please refer to Figure 5C , in Figure 5B Based on the structure of the DC power module 1300 shown, the DC power module 1300 may further include a liquid cooling module 1300-3.

[0098] The liquid cooling module 1300-3 is used to dissipate heat from the DC power module 1300.

[0099] Figure 5D This is the schematic diagram of the DC power module provided by the embodiment of the present application. Please refer to Figure 5D , the liquid cooling module 1300-3 can be arranged inside the DC power module 1300, and the liquid cooling module 1300-3 may include an inlet pipe and an outlet pipe.

[0100] Optionally, the liquid cooling module 1300-3 may be a high-performance and low-flow-resistance liquid cooling plate, which may include an inlet pipe and an outlet pipe. The cooling liquid may flow into the liquid cooling plate through the inlet pipe and flow out of the liquid cooling plate through the outlet pipe after heat exchange treatment in the liquid cooling plate.

[0101] The DC power supply module provided by the embodiment of the present application improves the heat dissipation efficiency of the high-density parallel module by arranging a liquid cooling module in the high-density parallel module.

[0102] Figure 5E FIG. 5E is a schematic diagram of the position of the DC power supply module provided by the embodiment of the present application in an electronic device. Please refer to FIG. 5E. There are 2 DC power supply modules 1300 arranged inside the electronic device, and the arrangement areas of the DC power supply modules 1300 are adjacent to the arrangement areas of the processor (for example, GPU) and the signal processor (for example, retimer) respectively.

[0103] In an electronic device, the processor and the signal processor consume a large amount of power. By arranging the DC power supply module 1300 close to the arrangement areas of the processor and the signal processor in the electronic device, the power supply path of the DC power supply module can be reduced, and the power supply loss can be reduced.

[0104] Next, in conjunction with Figures 6A - 6F , the above power supply board 1301 will be further described.

[0105] Figure 6A FIG. Figure 6A shows a schematic structural diagram of the power supply board provided by the embodiment of the present application. Please refer to

[0106] The power supply board 1301 may include a second power supply transfer board 1301-0 and a power supply connector 1301-1, where

[0107] The second power supply transfer board 1301-0 is respectively connected to the output end of the DC power supply module 1300 and the power supply connector 1301-1.

[0108] The second power supply transfer board 1301-0 may be used to input the second direct current provided by the DC power supply module 1300 into the power supply connector 1301-1.

[0109] The current of the second direct current input by the DC power supply module 1300 to the power supply board 1301 is very large, so that multiple power output interfaces need to be set for the DC power supply module. In this case, multiple second power connectors can also be correspondingly set in the second power transfer board 1301-0, so as to realize the expansion processing of the power input interface through the second power transfer board 1301-0.

[0110] In some embodiments, the structure of the power supply board 1301 can also be as Figure 6B shown. Figure 6B This is the second structural schematic diagram of the power supply board provided by the embodiment of the present application. Please refer to Figure 6B , in Figure 6A Based on the structure of the power supply board 1301 shown, the power supply board 1301 can also include a power input interface 1301-2.

[0111] As Figure 6B shown, the input ends of the power input interface 1301-2 can be respectively connected to the DC power supply module 1300 and the first power transfer board 1302, and the output end of the power input interface 1301-2 is connected to the power supply connector 1301-1.

[0112] Optionally, the input end of the power input interface 1301-2 can be connected to the power output interface of the DC power supply module 1300, and the input end of the power input interface 1301-2 can also be connected to the power output interface of the first power transfer board 1302.

[0113] In some embodiments, the power input interface 1301-2 can also be used as a reserved power interface to connect an external power module. The external power module can be a power module other than the power modules connected to the DC power supply module 1300 and the first power transfer board 1302. The external power module can be used to provide the second direct current for the power supply board 1301.

[0114] Optionally, the power input interface 1301-2 can be compatible with multiple power input specifications, so that the power input interface 1301-2 can be applied to multiple power access scenarios.

[0115] In the power supply module provided by the embodiment of the present application, by setting a power input interface in the power supply board, it is beneficial to realize the expansion processing of the power input interface of the power supply board, so that the power supply board can be flexibly applied to multiple power access scenarios.

[0116] In some embodiments, the structure of the power supply board 1301 can also be as Figure 6C shown. Figure 6C This is the third structural schematic diagram of the power supply board provided by the embodiment of the present application. Please refer to Figure 6C , in Figure 6BBased on the structure of the power supply board 1301 shown, the power supply board 1301 may further include a protector 1301-3.

[0117] The input end of the protector 1301-3 is connected to the power input end of the power supply board 1301, and the output end of the protector 1301-3 is connected to the power supply connector 1301-1.

[0118] The power input end may include a first power transfer board, a second power transfer board, and a power input interface.

[0119] Optionally, the power input end may include the output end of the power converter in the first power transfer board, the output end of the second power connector in the second power transfer board, and the power input interface.

[0120] The protector 1301-3 may be used to regulate the voltage of the second direct current input at the power input end, and input the regulated second direct current to the power supply connector 1301-1.

[0121] Exemplarily, the protector may include, but is not limited to, an electronic fuse (eFuse).

[0122] In the power supply module provided in the embodiments of the present application, by providing a protector in the power supply board, it is beneficial to ensure the power supply reliability.

[0123] In some embodiments, the structure of the power supply board 1301 may also be as Figure 6D shown. Figure 6D This is the fourth schematic diagram of the structure of the power supply board provided in the embodiments of the present application. Please refer to Figure 6D , in Figure 6C Based on the structure of the power supply board 1301 shown, the power supply board 1301 may further include a voltage converter 1301-4.

[0124] The input end of the voltage converter 1301-4 is connected to the output end of the protector 1301-3, and the output end of the voltage converter 1301-4 is connected to the power supply connector 1301-1;

[0125] The voltage converter 1301-4 may be used to convert the regulated second direct current input by the protector 1301-3 into a third direct current, and input the third direct current to the power supply connector 1301-1, and the voltage of the third direct current is less than the voltage of the second direct current.

[0126] Exemplarily, the voltage of the second direct current may be 12V, and the voltage of the third direct current may be at least one of the following: 5V, 3.3V, 1.8V, 1.5V, 1.2V, 0.9V.

[0127] Exemplarily, the voltage converter can be a Voltage Regulator (VR).

[0128] In the power supply module provided in the embodiments of the present application, by setting a voltage converter in the power supply board, the power supply board can supply power to electrical appliances with various different voltage requirements, so that the power supply board can be flexibly applied to various power supply scenarios.

[0129] In some embodiments, the above power supply connector 1301-1 may include at least one of the following: a first connector, a second connector, a third connector, a fourth connector, and a fifth connector.

[0130] Next, each power supply connector will be introduced in detail.

[0131] (1) First connector

[0132] The input end of the first connector can be connected to the power input end of the power supply board 1301, and the output end of the first connector can be used to connect to the processor board and the signal processing board respectively. The power input end may include a first power transfer board 1302, a second power transfer board 1301-0, and a power input interface 1301-2.

[0133] The first connector can be used to supply power to the processor board and the signal processing board respectively according to the second direct current provided by the power input end.

[0134] The processor board can be used to connect to a processor. Exemplarily, the processor board can be a GPU board, and the processor can be a GPU.

[0135] In some embodiments, the power supply board 1301 may include a first protector and a first voltage converter. Among them, the first protector is respectively connected to the power input end of the power supply board and the input end of the first voltage converter, and the output end of the first voltage converter is connected to the processor board through the first connector.

[0136] Optionally, the operating voltage required by the processor board may include voltages of at least one voltage type. Correspondingly, at least one first voltage converter may be provided on the power supply board 1301.

[0137] For example, if the voltage type of the operating voltage required by the processor board is 3.3V type, 1 first voltage converter can be correspondingly provided on the power supply board 1301 to convert the voltage of the regulated second direct current (for example, 12V) to 3.3V.

[0138] The signal processing board can be used for signal processing on the power supply board 1301. Exemplarily, the signal processing board can be a Retimer board.

[0139] In some embodiments, the power supply board 1301 may include a second voltage converter. The input end of the second voltage converter is connected to the output end of the first protector, and the output end of the second voltage converter is connected to the signal processing board through a first connector.

[0140] Optionally, the operating voltage required by the signal processing board may include voltages of at least one voltage type. Correspondingly, at least one second voltage converter may be correspondingly provided on the power supply board 1301.

[0141] For example, if the operating voltage required by the signal processing board has three voltage types, namely: 5V type, 1.8V type, and 0.9V type, three second voltage converters may be correspondingly provided on the power supply board 1301 to convert the voltage of the regulated second direct current (for example, 12V) into 5V, 1.8V, and 0.9V respectively.

[0142] The first protector can be used to regulate the second direct current input from the power input end, and input the regulated second direct current to the first voltage converter and the second voltage converter; the first voltage converter can be used to convert the voltage of the regulated second direct current into the operating voltage required by the processor board, and supply power to the processor board through the first connector; the second voltage converter can be used to convert the voltage of the regulated second direct current into the operating voltage required by the signal processing board, and supply power to the signal processing board through the first connector.

[0143] (2) Second connector

[0144] The input end of the second connector is connected to the power input end, and the output end of the second connector is used to connect to the processor, and the processor is located on the processor board. Here, the power input end is the power input end of the power supply board.

[0145] The second connector can be used to supply power to the processor according to the second direct current provided by the power input end.

[0146] Optionally, the number of processors can be at least one. Exemplarily, the processor can be a GPU.

[0147] In some embodiments, the power supply board 1301 may include a second protector, and the second protector is respectively connected to the power input end of the power supply board and the input end of the second connector.

[0148] The second protector can be used to regulate the second direct current input from the power input end, and input the regulated second direct current to the second connector, and the second connector can supply power to the processor according to the regulated second direct current.

[0149] (3) Third connector

[0150] The input end of the third connector is connected to the power input end, and the output end of the second connector is used to connect to the high-speed path adapter. Among them, the power input end is the power input end of the power supply board.

[0151] The third connector can be used to supply power to the high-speed path adapter according to the second direct current provided by the power input end.

[0152] Optionally, the number of high-speed path adapters can be at least one.

[0153] Optionally, the high-speed path adapter can support at least one communication protocol. Exemplarily, the at least one communication protocol can include but is not limited to at least one of the following: PCIe, Universal Serial Bus (USB), Ethernet.

[0154] Exemplarily, the high-speed path adapter can be a PCIe adapter card or a PCIe interface.

[0155] In some embodiments, the power supply board 1301 may include a third protector and a third voltage converter. Among them, the third protector is respectively connected to the power input end of the power supply board and the input end of the third voltage converter, and the output end of the third voltage converter is connected to the high-speed path adapter through the third connector.

[0156] The third protector can be used to perform voltage stabilization processing on the second direct current input by the power input end and input the voltage-stabilized second direct current to the third voltage converter; the third voltage converter can be used to convert the voltage of the voltage-stabilized second direct current into the working voltage required by the high-speed path adapter and supply power to the high-speed path adapter through the third connector.

[0157] Optionally, the working voltage required by the high-speed path adapter can include voltages of at least one voltage type. Correspondingly, at least one third voltage converter can be provided on the power supply board 1301.

[0158] For example, the working voltage required by the high-speed path adapter has 3 voltage types, which are: 12V type, 3.3V_STBY (standby) type, and 3.3V type. Among them, the 3.3V_STBY type is used to meet the standby power supply requirements of the high-speed path adapter; the 3.3V type is used to meet the power supply requirements for the normal operation of the high-speed path adapter. If the voltage of the second direct current is 12V, 2 third voltage converters can be correspondingly provided on the power supply board 1301 to convert the voltage of the voltage-stabilized second direct current (12V) into 3.3V_STBY and 3.3V respectively.

[0159] (4) Fourth Connector

[0160] The input end of the fourth connector is connected to the power input end, and the output end of the fourth connector is used to be connected to the radiator. Among them, the power input end is the power input end of the power supply board.

[0161] The fourth connector can be used to supply power to the radiator according to the second direct current provided by the power input end.

[0162] Optionally, the number of radiators can be at least one. Exemplarily, the radiator can be a fan.

[0163] In some embodiments, the power supply board 1301 may include a fourth protector, and the fourth protector is respectively connected to the power input end of the power supply board and the input end of the fourth connector.

[0164] The fourth protector can be used to perform voltage stabilization processing on the second direct current input by the power input end, and input the voltage-stabilized second direct current to the fourth connector. The fourth connector can supply power to the radiator according to the voltage-stabilized second direct current.

[0165] (5) The fifth connector

[0166] The input end of the fifth connector is connected to the power input end, and the output end of the fifth connector is used to be connected to the manager module. Among them, the power input end is the power input end of the power supply board.

[0167] The fifth connector can be used to supply power to the manager module according to the second direct current provided by the power input end.

[0168] Exemplarily, the manager module can be a BMC module.

[0169] In some embodiments, the power supply board 1301 may include a fifth protector and a fifth voltage converter. Among them, the fifth protector is respectively connected to the power input end of the power supply board and the input end of the fifth voltage converter, and the output end of the fifth voltage converter is connected to the manager module through the fifth connector.

[0170] The fifth protector can be used to perform voltage stabilization processing on the second direct current input by the power input end, and input the voltage-stabilized second direct current to the fifth voltage converter; the fifth voltage converter can be used to convert the voltage of the voltage-stabilized second direct current into the working voltage required by the manager module, and supply power to the manager module through the fifth connector.

[0171] Optionally, the working voltage required by the manager module can include voltages of at least one voltage type. Correspondingly, at least one fifth voltage converter can be provided on the power supply board 1301.

[0172] For example, the operating voltage required by the manager module has two voltage types, namely, the 1.5V type and the 1.2V type. If the voltage of the second direct current is 12V, two types of fifth voltage converters can be correspondingly set on the power supply board 1301 to convert the voltage of the regulated second direct current (12V) into 1.5V and 1.2V respectively.

[0173] In some embodiments, the structure of the power supply board 1301 can also be as Figure 6E shown. Figure 6E This is the fifth schematic diagram of the structure of the power supply board provided by the embodiment of the present application. Please refer to Figure 6E , two second power transfer boards 1301-0, two power input interfaces 1301-2, and a power supply connector 1301-1 can be provided on the power supply board. Among them, two second power connectors can be provided in each second power transfer board, and the power supply connector 1301-1 can include a plurality of first connectors, a plurality of second connectors, a plurality of third connectors, a plurality of fourth connectors, and a fifth connector.

[0174] To facilitate understanding of the power supply path in the power supply board, hereinafter, in combination with Figure 6F , the power supply path in the power supply board will be described. Figure 6F This is a schematic diagram of a power supply path of the power supply board provided by the embodiment of the present application. Please refer to Figure 6F , the DC power supply module 1300 or the first power transfer board 1302 can input 19 paths of second direct current with a voltage of 12V to the power input end of the power supply board. Among them:

[0175] The power supply board can convert 1 path of second direct current into 12V main power through 1 protector, and convert the 12V main power into the following 4 types of direct current through 4 voltage converters: 5V direct current, 3.3V direct current, 1.8V direct current, and 0.9V direct current, and provide 5V direct current for the signal processing board, provide 1.8V direct current and 0.9V direct current for the signal processor on the signal processing board, and provide 3.3V direct current for the pull-up processing module for signal processing on the processor board.

[0176] The power supply board can convert 16 paths of second direct current into 12V direct current required by the processor through 16 protectors and supply power to the processor (for example, GPU).

[0177] The power supply board can also convert 1 path of second direct current into 12V direct current required by the radiator through 1 protector and supply power to the radiator (for example, a fan).

[0178] The power supply board can also convert one path of second direct current into 12V_STBY direct current through one protector, and convert the 12V_STBY direct current into the following three kinds of direct current through three voltage converters respectively: 3.3V_STBY direct current, 1.5V_STBY direct current and 1.2V_STBY direct current, and provide 3.3V_STBY direct current for the high-speed path adapter (for example, PCIe interface), provide 1.5V_STBY direct current and 1.2V_STBY direct current for the manager module (for example, BMC module).

[0179] Optionally, the power supply board can also supply power to the controller based on the 3.3V_STBY direct current. Exemplarily, the controller can include at least one of the following: Field Programmable Gate Array (FPGA), Complex Programmable Logic Device (CPLD).

[0180] Optionally, the power supply board can also provide signal pull-up power for the controller module, signal processing board, pull-up processing module, signal processor on the signal processing board, and processor on the processor board based on the 3.3V_STBY direct current.

[0181] The embodiment of the present application also provides an electronic device, and the structure of the electronic device can be as Figure 7 shown. Figure 7 It is a schematic structural diagram of the electronic device provided by the embodiment of the present application. Please refer to Figure 7 , in the electronic device 13, a power supply module 130 and an electrical device 131 are provided.

[0182] The power supply module 130 can include a direct current power supply module 1300, a power supply board 1301, and a first power transfer board 1302. Among them, the direct current power supply module 1300 can include a high-density parallel module 1300-0, a hot-swap module 1300-1, a boost energy storage module 1300-2, and a liquid cooling module 1300-3. The power supply board 1301 can include a second power transfer board 1301-0, a power supply connector 1301-1, a power input interface 1301-2, a protector 1301-3, and a voltage converter 1301-4.

[0183] It should be noted that for the content of the direct current power supply module 1300, the power supply board 1301, and the first power transfer board 1302 in the power supply module 130, reference can be made to the above Figure 3 , Figure 4A and Figure 4BContent of the embodiment; for the content of the high-density parallel module 1300-0, hot-plug module 1300-1, boost energy storage module 1300-2, and liquid cooling module 1300-3 in the DC power supply module 1300, refer to the above Figures 5A - 5D Content of the embodiment; for the content of the second power transfer board 1301-0, power supply connector 1301-1, power input interface 1301-2, protector 1301-3, and voltage converter 1301-4 on the power supply board 1301, refer to the above Figures 6A - 6F Content of the embodiment, which will not be elaborated here in this embodiment.

[0184] The electrical device 131 may include a management electrical device and a load electrical device. Among them, the management electrical device is connected to the load electrical device through the first communication channel, connected to the management controller through the second communication channel, and connected to the DC power supply module through the power communication bus. The management controller may be located outside the electronic device.

[0185] The management electrical device can be used for power management of the electronic device.

[0186] Optionally, the management electrical device can be a manager module in the electronic device. For example, the BMC module.

[0187] In some embodiments, the management electrical device can be used to adjust the power supply mode of the DC power supply module and the operating mode of the load electrical device according to the power consumption data of the load electrical device and the load demand of the load electrical device sent by the management controller.

[0188] Optionally, the load electrical device may include but is not limited to at least one of the following: a processor, a signal processor, and a radiator. For example, the processor can be a GPU, the signal processor can be a Retimer, and the radiator can be a fan.

[0189] Optionally, the first communication channel can be an Inter-Integrated Circuit (I2C) bus, the second communication channel can be an I2C link and / or an Ethernet (ETH) link, and the circuit communication bus can be a Power Management Bus (PMBus).

[0190] Optionally, the management controller can be used to manage the at least one electronic device. For example, the management controller can be a server, or a processor in the server for device management.

[0191] The management controller can communicate with the management electrical device in at least one electronic device to send the load demand of the load electrical device to the management electrical device in at least one electronic device.

[0192] Optionally, the power consumption data may include at least one of the following: voltage, current, or power; the load demand may include, but is not limited to, the computing power load demand of the load electrical device. For example, the computing power load demand may include the number and capacity of processors of the processor, etc.

[0193] In some embodiments, a detector (monitor) may be provided in the load electrical device, and the management electrical device is connected to the detector (monitor) of the load electrical device through a first communication channel. The detector (monitor) may be used to obtain the power consumption data of the load electrical device, such as voltage, current, or power, etc.

[0194] In some embodiments, the management controller may also send a pre-trained AI model to the management electrical device in the electronic device. The management controller may determine the power consumption data of the load electrical device in a future period through the pre-trained AI model according to the historical power consumption data and / or real-time power consumption data of the load electrical device, and adjust the power supply mode of the DC power module and the operation mode of the load electrical device based on the power consumption data in the future period.

[0195] Pre-training is a model training strategy, the core of which is to use a large-scale dataset to preliminarily train the model so that the model learns general feature representations. This process is similar to the basic learning stage before humans learn new knowledge, accumulating experience through extensive reading and observation. The core idea of pre-training is to first train a basic model on general data to enable it to learn a wide range of feature representation capabilities, and then through transfer learning or fine-tuning, adapt the model to a specific task, thereby improving task performance and reducing training costs.

[0196] The pre-trained AI model refers to a neural network model and its parameters with strong generalization ability obtained by designing corresponding training tasks and training a large-scale neural network algorithm structure based on a large-scale dataset of load electrical devices. For subsequent other tasks, feature extraction or task fine-tuning can be performed on the basis of this model to achieve specific task purposes. By pre-training on a large-scale dataset, the AI model can learn rich feature representation capabilities. For example, according to the power consumption data and load demand of the load electrical device, it can learn the relationship between the power consumption data and load demand of the load electrical device.

[0197] Exemplarily, the large-scale dataset may include the historical power consumption data and / or real-time power consumption data of the load electrical device, and the large-scale dataset may also include the historical load demand and / or real-time load demand of the load electrical device.

[0198] Training tasks can include self-supervised learning and generative learning, etc. Among them, self-supervised learning refers to designing pre-training tasks using the structure of the data itself without manual annotation; generative learning refers to the model learning the distribution of the data and generating new data samples.

[0199] The neural network algorithm structure can be a Convolutional Neural Network (CNN), a Recurrent Neural Network (RNN), a Long Short-Term Memory (LSTM), etc., or it can be a model constructed with an attention network, such as a Generative Pre-trained Transformer (GPT), etc. This application does not make a limitation here.

[0200] An attention network refers to a network model that uses an attention mechanism for training. This model assigns different weights to each part of the input sequence, thereby extracting more important feature information from the input sequence and enabling the model to finally obtain a more accurate output.

[0201] Fine-tuning means further training on a dataset for a specific task based on a pre-trained AI model to adjust the model parameters so that it better adapts to the target task. During fine-tuning, most layers of the pre-trained AI model are usually frozen, and only the newly added layers or a small number of key layers are trained. Doing so can not only retain the features learned by the pre-trained AI model but also quickly adapt to the specific requirements of the new task. In addition, choosing appropriate learning rates and training epochs is also the key to successful fine-tuning.

[0202] Next, in combination with Figure 8 , taking the manager module in the electronic device as the manager device and the processor, signal processor, and radiator as the load devices as examples, the communication topology of the manager device provided by the embodiments of this application will be exemplarily described.

[0203] Figure 8 It is an exemplary schematic diagram of the communication topology of a manager device provided by the embodiments of this application. As Figure 8 shown, the electronic device includes a manager module, a processor, a signal processor, a radiator, and two DC power modules (DC power module 1 and DC power module 2).

[0204] The manager module is connected to the processor, signal processor, and radiator respectively through an integrated circuit bus, connected to the management controller through an Ethernet link, and connected to the two DC power modules through a power management bus. The management controller can be located outside the electronic device.

[0205] In some embodiments, detectors (monitors) may be respectively provided in the processor, the signal processor, and the radiator, and the manager module may be connected to the detectors in the processor, the detectors in the signal processor, and the detectors in the radiator respectively through an integrated circuit bus. Among them, the detector in the processor can be used to obtain the power consumption data in the processor, the detector in the signal processor can be used to obtain the power consumption data in the signal processor, and the detector in the radiator can be used to obtain the power consumption data in the radiator.

[0206] The electronic device provided by the embodiments of the present application can integrate a highly modular DC power module and a first power transfer board on the power supply board, making the structure of the power supply module simpler; by setting the DC power module and the first power transfer board, the power supply module can be made compatible with alternating current (AC) and direct current (DC) inputs, making the power supply reliability of the power supply module higher; there is no need to perform AC-DC conversion inside the power supply module, thereby reducing the conversion loss in the AC-DC conversion process; the power supply module has a high power density by setting a high-density parallel module in the DC power module, which can meet the voltage conversion requirements of high-power electronic devices and is conducive to reducing the space resources occupied by the power supply module in the electronic device; a liquid cooling module is provided in the DC power module, which is conducive to improving the heat dissipation performance of the power supply module; by reasonably arranging the power supply path on the power supply board, it is conducive to reducing power supply loss; the power management device in the electronic device can dynamically adjust the working mode of the load electrical device and the power supply mode of the DC power module according to the power consumption data and load demand of the load electrical device, which is conducive to improving the power utilization efficiency of the electronic device and reducing the energy consumption of the electronic device.

[0207] Figure 9 It is a schematic flow chart of the power supply method provided by the embodiments of the present application. As Figure 9 shown, the embodiments of the present application provide a power supply method, and the method is described in detail as follows:

[0208] S901. Obtain the power consumption data and load demand of the load electrical device.

[0209] It should be noted that the content of the load electrical device, the power consumption data, and the load demand in this step can refer to Figure 7 the content of the load electrical device, the power consumption data, and the load demand in the embodiment, and will not be elaborated here.

[0210] Optionally, the power consumption data and load demand of the load electrical device can be obtained in real time, or the power consumption data and load demand of the load electrical device can be obtained periodically.

[0211] The power consumption data can be the real-time power consumption data of the load electrical device or the historical power consumption data of the load electrical device.

[0212] The load demand may be the load demand of the load electrical device in a future time period.

[0213] S902. Adjust the operating mode of the load electrical device and the power supply mode of the DC power supply module according to the power consumption data and the load demand.

[0214] The DC power supply module can be used to supply power to the load electrical device.

[0215] Optionally, the above electronic device or the management electrical device in the electronic device can obtain the pre-trained AI model sent by the management controller, and determine the predicted power consumption data of the load electrical device in a future time period through the pre-trained AI model according to the historical power consumption data or the real-time power consumption data of the load electrical device in a historical time period.

[0216] Optionally, the electronic device or the management electrical device in the electronic device can dynamically adjust the operating mode of the load electrical device and the power supply mode of the DC power supply module according to the predicted power consumption data and the load demand of the load electrical device in a future time period.

[0217] Exemplarily, the operating mode may include a low-power consumption mode and a high-power consumption mode. When the load demand is low, the management electrical device can adopt the low-power consumption mode, that is, reduce the clock frequency or voltage of the processor in the load electrical device and reduce the frequency of the radiator to reduce the power consumption of the processor and the radiator; when the load is high, the management electrical device can adopt the high-power consumption mode, that is, restore the clock frequency or voltage of the processor to ensure the performance of the processor and restore the frequency of the radiator to ensure the heat dissipation performance.

[0218] Exemplarily, the power supply mode may include a high-power supply mode and a low-power supply mode. For example, when the load demand is large, the high-power supply mode can be adopted, that is, increase the output power of the DC power supply module; when the load demand is small, the low-power supply mode can be adopted, that is, reduce the output power of the DC power supply module.

[0219] Optionally, the management appliance analyzes the operating modes of the load devices to establish the relationships between the power consumption data of the load appliances and the load ratio (or performance), and between the power consumption data of the load power supply devices and the power supply mode of the DC power supply module. It can learn the above two relationships through a pre-trained AI model to generate a dynamic power consumption adjustment strategy. Based on this dynamic power consumption adjustment strategy, it studies and designs a corresponding dynamic power management system for the electronic device (for example, an AI energy consumption prediction platform) to automatically adjust and set the operating modes of the load appliances and the power supply mode of the DC power supply module of the electronic device through this dynamic power management system, and dynamically adjust the power output and power distribution process of the power supply module according to the operating modes of the load appliances, so as to adopt a more energy-efficient power supply scheme to reduce the energy consumption inside the electronic device while ensuring the high efficiency of the load appliances of the electronic device.

[0220] It should be noted that the content of the pre-trained AI model in this step can refer to Figure 7 the content of the pre-trained AI model in the embodiment, which will not be elaborated here.

[0221] The power supply method provided by the real-time example of this application can obtain the power consumption data and load requirements of the load appliances, and dynamically adjust the operating modes of the load appliances and the power supply mode of the DC power supply module according to the power consumption data and load requirements, so as to adopt a more energy-efficient power supply scheme to reduce the energy consumption inside the electronic device while ensuring the high efficiency of the load appliances of the electronic device.

[0222] Figure 10 It is a schematic structural diagram of the power supply device provided by the embodiment of this application. As Figure 10 shown, the embodiment of this application also provides a power supply device. The power supply device 1000 may include: an acquisition module 1001 and a processing module 1002, where

[0223] The acquisition module 1001 is used to acquire the power consumption data and load requirements of the load appliances;

[0224] The processing module 1002 is used to adjust the operating modes of the load appliances and the power supply mode of the DC power supply module according to the power consumption data and load requirements. The DC power supply module is used to supply power to the load appliances.

[0225] Optionally, the acquisition module 1001 may execute Figure 9 S901 in the embodiment.

[0226] Optionally, the processing module 1002 may execute Figure 9 S902 in the embodiment.

[0227] It should be noted that the power supply device shown in the embodiments of the present application can implement the technical solutions shown in the above method embodiments, and the implementation principles and beneficial effects are similar, so they will not be elaborated here.

[0228] In the above embodiments, it should be understood that the processor may be a central processing unit (Central Processing Unit, abbreviated as CPU), or other general-purpose processors, digital signal processors (Digital Signal Processor, abbreviated as DSP), application specific integrated circuits (Application Specific Integrated Circuit, abbreviated as ASIC), etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in combination with the application can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules in the processor.

[0229] The memory may include high-speed memory (Random Access Memory, RAM), and may also include non-volatile memory (Non-volatile Memory, NVM), such as at least one disk memory.

[0230] The bus may be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of simplicity, the buses in the drawings of the present application are not limited to only one bus or one type of bus.

[0231] The embodiments of the present application also provide a computer-readable storage medium, in which a computer program is stored, and the computer program is configured to execute the steps in the above power supply method embodiments when running.

[0232] In an exemplary embodiment, the above computer-readable storage medium may include, but is not limited to: USB flash drives, read-only memories (Read-Only Memory, abbreviated as ROM), random access memories (Random Access Memory, abbreviated as RAM), mobile hard disks, magnetic disks or optical discs, etc., which can store computer programs.

[0233] An embodiment of the present application also provides a computer program product. The computer program product includes a computer program, and when the computer program is executed by a processor, it implements the steps in any of the above-mentioned power supply method embodiments.

[0234] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium. The non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, it implements the steps in any of the above-mentioned power supply method embodiments.

[0235] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed in this document can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Skilled professionals can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this application.

[0236] The above has introduced in detail a power supply module, method, system, electronic device, storage medium, and program product provided by this application. Specific examples are used in this document to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A power supply module, characterized in that, Comprising: A DC power supply module and a power supply board, wherein, The DC power supply module is inserted on the power supply board, and the DC power supply module is also connected to a DC transmission line; The DC power supply module includes a high-density parallel module. The DC power supply module converts the first direct current input by the DC transmission line into a second direct current through the high-density parallel module, and inputs the second direct current to the power supply board. The voltage of the first direct current is greater than the voltage of the second direct current.

2. The power supply module according to claim 1, wherein The high-density parallel module includes a plurality of power conversion units, wherein, The input ends of the plurality of power conversion units are connected in parallel and connected to the DC transmission line; The output ends of the plurality of power conversion units are connected in series and connected to the power supply board.

3. The power supply module according to claim 2, wherein The DC power supply module further includes a hot-swap module and a boost energy storage module, wherein, The hot-swap module is connected between the DC transmission line and the input end of the high-density parallel module, and the boost energy storage module is connected between the hot-swap module and the input end of the high-density parallel module; The hot-swap module is used for performing hot-swap processing on the DC power supply module; The boost energy storage module is used for stabilizing the voltage of the first direct current input to the high-density parallel module, and inputting the stabilized first direct current to the high-density parallel module.

4. The power supply module according to claim 3, wherein, The DC power supply module further includes a liquid cooling module; The liquid cooling module is used for dissipating heat from the DC power supply module.

5. The power supply module according to any one of claims 1-4, characterized in that, The power supply module further includes a first power transfer board; The first power transfer board is connected to the power supply board, and the first power transfer board is also used for connecting an AC power supply; The first power transfer board is used for converting the alternating current input by the AC power supply into the second direct current, and inputting the second direct current to the power supply board.

6. The power supply module according to any one of claims 1-4, characterized in that, The power supply board includes a second power transfer board and a power supply connector, wherein, The second power transfer board is respectively connected to the output end of the DC power supply module and the power supply connector; The second power transfer board is used for inputting the second direct current provided by the DC power supply module into the power supply connector.

7. The power supply module according to claim 6, characterized in that, The power supply board further includes a power input interface; The input end of the power input interface is respectively connected to the DC power supply module and the first power transfer board; The output end of the power input interface is connected to the power supply connector.

8. The power supply module according to claim 7, characterized in that, The power supply connector includes a first connector; The input end of the first connector is connected to the power input end of the power supply board. The output end of the first connector is used for connecting to a processor board and a signal processing board respectively. The power input end includes the first power transfer board, the second power transfer board, and the power input interface; The first connector is used for supplying power to the processor board and the signal processing board respectively according to the second direct current provided by the power input end.

9. The power supply module according to claim 8, wherein The power supply connector further includes a second connector; The input end of the second connector is connected to the power input end, and the output end of the second connector is used for connecting to a processor, and the processor is located on the processor board; The second connector is configured to supply power to the processor according to the second direct current provided by the power input terminal.

10. The power supply module according to claim 9, characterized in that, The power supply connector further includes a third connector; The input end of the third connector is connected to the power input terminal, and the output end of the third connector is configured to be connected to a high-speed path adapter; The third connector is configured to supply power to the high-speed path adapter according to the second direct current provided by the power input terminal.

11. The power supply module according to claim 10, wherein The power supply connector further includes a fourth connector; The input end of the fourth connector is connected to the power input terminal, and the output end of the fourth connector is configured to be connected to a radiator; The fourth connector is configured to supply power to the radiator according to the second direct current provided by the power input terminal.

12. The power supply module according to claim 11, wherein The power supply connector further includes a fifth connector; The input end of the fifth connector is connected to the power input terminal, and the output end of the fifth connector is configured to be connected to a manager module; The fifth connector is configured to supply power to the manager module according to the second direct current provided by the power input terminal.

13. The power supply module according to claim 7, wherein The power supply board further includes a protector; The input end of the protector is connected to the power input terminal of the power supply board, and the output end of the protector is connected to the power supply connector. The power input terminal includes the first power transfer board, the second power transfer board, and the power input interface; The protector is configured to perform voltage stabilization processing on the second direct current input by the power input terminal, and input the second direct current after voltage stabilization processing to the power supply connector.

14. The power supply module according to claim 13, wherein The power supply board further includes a voltage converter; The input end of the voltage converter is connected to the output end of the protector, and the output end of the voltage converter is connected to the power supply connector; The voltage converter is configured to convert the second direct current after voltage stabilization processing input by the protector into a third direct current, and input the third direct current to the power supply connector. The voltage of the third direct current is less than the voltage of the second direct current.

15. An electronic device, characterized in that, Comprising: A power supply module and an electrical appliance. The power supply module includes a direct current power supply module and a power supply board. Among them, The direct current power supply module is inserted on the power supply board. The direct current power supply module is further connected to a direct current transmission line, and the power supply board is further connected to the electrical appliance; The direct current power supply module includes a high-density parallel module. The direct current power supply module converts the first direct current input by the direct current transmission line into a second direct current through the high-density parallel module, and inputs the second direct current to the power supply board. The voltage of the first direct current is greater than the voltage of the second direct current; The power supply board supplies power to the electrical appliance according to the second direct current.

16. The electronic device according to claim 15, wherein The electrical appliance includes a management electrical appliance and a load electrical appliance. Among them, The management electrical appliance is connected to the load electrical appliance through a first communication channel, connected to a management controller through a second communication channel, and connected to the direct current power supply module through a power supply communication bus. The management controller is located outside the electronic device; The management electrical device is configured to adjust the power supply mode of the DC power supply module and the operation mode of the load electrical device according to the power consumption data of the load electrical device and the load demand of the load electrical device sent by the management controller.

17. A power supply system, characterized in that, It includes: A voltage regulator, a power distribution unit, a DC power line, and an electronic device. The electronic device includes a power supply module and an electrical device. The power supply module includes a DC power supply module and a power supply board. Among them, The voltage regulator is connected to the input end of the power distribution unit. The output end of the power distribution unit is connected to the DC power supply module of the electronic device through the DC power line. The DC power supply module is inserted on the power supply board, and the power supply board is also connected to the electrical device; The voltage regulator inputs the first direct current to the DC power supply module through the power distribution unit and the DC power line; The DC power supply module includes a high-density parallel module. The DC power supply module converts the first direct current input by the DC power line into the second direct current through the high-density parallel module and inputs the second direct current to the power supply board. The power supply board supplies power to the electrical device according to the second direct current. The voltage of the first direct current is greater than the voltage of the second direct current.

18. A power supply method, characterized in that, It includes: Obtain the power consumption data and load demand of the load electrical device; According to the power consumption data and the load demand, adjust the operation mode of the load electrical device and the power supply mode of the DC power supply module. The DC power supply module is used to supply power to the load electrical device.

19. A computer-readable storage medium, characterized in that, A computer program is stored in the computer-readable storage medium. Among them, when the computer program is executed by a processor, the steps of the power supply method described in claim 18 are implemented.

20. A computer program product comprising a computer program, characterized in that, When the computer program is executed by a processor, the steps of the power supply method described in claim 18 are implemented.

Citation Information

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