Heat dissipation structure of photovoltaic inverter

Abstract

The invention provides a heat dissipation structure of a photovoltaic inverter. The heat dissipation structure comprises a shell, a circuit board, at least one first heat dissipation assembly, at least one second heat dissipation assembly and two third heat dissipation assemblies. The circuit board is installed on the shell. The first heat dissipation assembly comprises a first radiator which is installed on the circuit board. The second heat dissipation assembly comprises a second heat dissipation device, and the second heat dissipation device is installed on the circuit board. The two third heat dissipation assemblies are installed on the shell and located at the two ends, in the second direction, of the circuit board correspondingly. The third heat dissipation assembly comprises a driver and a heat dissipation fan, the driver is installed on the shell, and the heat dissipation fan is installed at the output end of the driver and moves in the first direction under driving of the driver. According to the heat dissipation structure of the photovoltaic inverter provided by the invention, the number of the heat dissipation fans is greatly reduced, so that the energy consumption of the heat dissipation fans can be reduced, the heat dissipation cost is reduced, the heat dissipation fans can accurately dissipate heat of the heat dissipater with relatively high temperature, and the heat dissipation efficiency is high.

Description

Technical Field

[0001] The present application relates to the technical field of electronic components, and in particular to a heat dissipation structure for a photovoltaic inverter. Background Art

[0002] A photovoltaic inverter can convert the variable DC voltage generated by a photovoltaic (PV) solar panel into AC power at the commercial power frequency, which can be fed back into the commercial power transmission system or used for an off-grid power grid.

[0003] Currently, during the operation of a photovoltaic inverter, it can be divided into the following three stages: a rectification stage, an inversion stage, and a filtering stage. During these three stages, a large number of electronic components such as diodes, transistors, and inductors are required in the photovoltaic inverter, such as rectifier diodes, switching triodes, insulated gate bipolar transistors (IGBTs), etc. A large amount of heat is generated when using electronic components such as diodes, transistors, and inductors, which easily causes faults in the photovoltaic inverter. Therefore, in the prior art, a radiator and a cooling fan are usually installed on the photovoltaic inverter to dissipate heat from the electronic components and prevent faults in the photovoltaic inverter. However, in the prior art, when using a cooling fan to dissipate heat from the electronic components, there is usually a problem of high energy consumption, and the structure is complex, greatly increasing the cost. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a heat dissipation structure for a photovoltaic inverter to solve the technical problems of complex structure and high energy consumption existing in the prior art for photovoltaic inverters.

[0005] To achieve the above purpose, the technical solution adopted by the present application is: providing a heat dissipation structure for a photovoltaic inverter, including: A housing; A circuit board, installed in the housing; At least one first heat dissipation component; the first heat dissipation component includes a first radiator, the first radiator is installed on the circuit board and is configured to dissipate heat from diodes and / or transistors; At least one second heat dissipation component; the second heat dissipation component includes a second radiator, the second radiator is installed on the circuit board and is configured to dissipate heat from inductors, and is spaced from the first radiator along a first direction; Two third heat dissipation components, both installed in the housing and located at both ends of the circuit board along a second direction; the third heat dissipation component includes a driver and a cooling fan, the driver is installed in the housing, the cooling fan is installed at the output end of the driver and moves along the first direction under the drive of the driver.

[0006] Optionally, the first heat dissipation component further includes a first temperature sensor, which is installed on the first radiator and is used to detect the temperature of the first radiator; Therefore, the second heat dissipation component further includes a second temperature sensor, which is installed on the second radiator and is used to detect the temperature of the second radiator.

[0007] Optionally, the first heat dissipation component further includes at least one fixing member, and at least one of the fixing members is installed on the first radiator and is used to fix the diode and / or the transistor on the surface of the first radiator.

[0008] Optionally, the fixing member includes two insulating and heat-conducting layers, a pressing strip and a fixing screw. The two insulating and heat-conducting layers are both arranged on the surface of the first radiator. The pressing strip is arranged on the side of the insulating and heat-conducting layer facing away from the first radiator. The fixing screw is screwed to the first radiator, passes through the pressing strip, and is located between the two insulating and heat-conducting layers, and is further configured to be able to press the diode and / or the transistor between the insulating and heat-conducting layer and the pressing strip.

[0009] Optionally, the fixing member further includes a first limiting rod and two first auxiliary pressing blocks. The first limiting rod is installed on the pressing strip, and the two first auxiliary pressing blocks are both sleeved on the first limiting rod and can slide along the second direction.

[0010] Optionally, at least one of the second limiting rods is provided on the side of the first limiting rod facing away from the pressing strip; The fixing member further includes two second auxiliary pressing blocks. The two second auxiliary pressing blocks are arranged in one-to-one correspondence with the two first auxiliary pressing blocks. The second auxiliary pressing block is sleeved on at least one of the second limiting rods and can slide along the third direction.

[0011] Optionally, the second radiator includes two spliced radiators and an installation space. One of the spliced radiators is installed on the circuit board, and the other spliced radiator is installed on one of the spliced radiators and encloses the installation space with one of the spliced radiators. The installation space is used to install the inductor.

[0012] Optionally, the spliced radiator includes a heat dissipation main board and a plurality of heat dissipation support boards. The plurality of heat dissipation support boards are all connected to the heat dissipation main board and are uniformly arranged along the circumferential direction around the axis of the heat dissipation main board; Wherein, the distance between any two adjacent heat dissipation support boards is equal everywhere.

[0013] Optionally, the first heat dissipation component further includes a first insulating board, which is installed between the circuit board and the first radiator.

[0014] Optionally, the second heat dissipation component further includes a second insulating plate, which is installed between the circuit board and the second radiator.

[0015] The beneficial effects of the heat dissipation structure of a photovoltaic inverter provided by this application are as follows: During use, through the driver, the cooling fan can be driven to move in the first direction so that the cooling fan is aligned with the radiator with a higher temperature. Compared with the prior art, the number of cooling fans is greatly reduced, thereby reducing the energy consumption of the cooling fans, reducing the cooling cost, and enabling the cooling fan to accurately dissipate heat from the radiator with a higher temperature, with high cooling efficiency. Description of the Drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of this application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 It is a three-dimensional view of a heat dissipation structure of a photovoltaic inverter provided in Embodiment 1 of this application; Figure 2 It is an exploded view of a heat dissipation structure of a photovoltaic inverter provided in Embodiment 1 of this application; Figure 3 It is a three-dimensional view of the first heat dissipation component of a heat dissipation structure of a photovoltaic inverter provided in Embodiment 1 of this application; Figure 4 It is an exploded view of the second heat dissipation component of a heat dissipation structure of a photovoltaic inverter provided in Embodiment 1 of this application; Figure 5 It is a plan view of the spliced radiator of a heat dissipation structure of a photovoltaic inverter provided in Embodiment 1 of this application; Figure 6 It is an exploded view of the second heat dissipation component of a heat dissipation structure of a photovoltaic inverter provided in Embodiment 2 of this application; Figure 7 It is a three-dimensional view of the internal radiator of a heat dissipation structure of a photovoltaic inverter provided in Embodiment 2 of this application.

[0018] Among them, the reference numerals in the drawings: 1. Circuit board; 2. First heat dissipation component; 21. First radiator; 22. First temperature sensor; 23. Fixing member; 231. Insulating and heat-conducting layer; 232. Strapping; 233. Fixing screw; 234. First limiting rod; 235. First auxiliary pressing block; 236. Second limiting rod; 237. Second auxiliary pressing block; 24. First insulating board; 3. Second heat dissipation component; 31. Second radiator; 311. Heat dissipation main board; 312. Heat dissipation support board; 32. Installation space; 33. Second insulating board; 34. Internal radiator; 341. Hollow heat dissipation tube; 342. Heat conducting ring; 3421. Inner heat conducting ring; 3422. Outer heat conducting ring; 3423. Heat conducting fin; 4. Third heat dissipation component; 41. Driver; 42. Heat dissipation fan. Detailed implementation manners

[0019] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following further elaborates on this application in combination with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0020] It should be noted that when an element is referred to as being "installed on", "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0021] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more unless otherwise specifically defined.

[0022] In this application, the term "and / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. Wherein A and B can be singular or plural. The character " / " generally represents that the associated objects before and after are in an "or" relationship.

[0023] Embodiment 1 As Figure 1 and Figure 2As shown, the present application provides a heat dissipation structure for a photovoltaic inverter, which includes a housing, a circuit board 1, at least one first heat dissipation component 2, at least one second heat dissipation component 3, and two third heat dissipation components 4. The circuit board 1 is installed in the housing. There is at least one first heat dissipation component 2. The first heat dissipation component 2 includes a first radiator 21, and the first radiator 21 is installed on the circuit board 1 and is configured to dissipate heat from diodes and / or transistors. There is at least one second heat dissipation component 3. The second heat dissipation component 3 includes a second radiator 31, and the second radiator 31 is installed on the circuit board 1 and is configured to dissipate heat from inductors, and is spaced from the first radiator 21 in a first direction. The two third heat dissipation components 4 are both installed in the housing and are respectively located at both ends of the circuit board 1 in a second direction; the third heat dissipation component 4 includes a driver 41 and a cooling fan 42, the driver 41 is installed in the housing, the cooling fan 42 is installed at the output end of the driver 41, and moves in the first direction under the drive of the driver 41.

[0024] It should be noted here that the above and below first direction refers to the two-way direction of the shortest connection line between the first heat dissipation component 2 and the second heat dissipation component 3, specifically as shown in Figure 2 the X-axis shown in. The above and below second direction refers to the two-way direction of the shortest connection line between the two third heat dissipation components 4, specifically as shown in Figure 2 the Y-axis shown in.

[0025] It should also be noted that in this embodiment, one of the cooling fans 42 is an intake fan and the other cooling fan 42 is an exhaust fan.

[0026] For the heat dissipation structure of the photovoltaic inverter provided by the present application, under the action of the first radiator 21, it can dissipate heat from diodes and / or transistors, thereby effectively preventing the diodes and / or transistors from being damaged due to overheating. Under the action of the second radiator 31, it can dissipate heat from inductors, thereby effectively preventing the inductors from being damaged due to overheating.

[0027] Under the action of the two cooling fans 42, it can dissipate heat from the first radiator 21 and the second radiator 31, thereby enhancing the heat dissipation effect of the first radiator 21 and the second radiator 31. Since one of the cooling fans 42 is an intake fan and the other cooling fan 42 is an exhaust fan, the intake fan and the exhaust fan can form a convection on the surface of the circuit board 1, and can quickly dissipate heat from the first radiator 21 and the second radiator 31, which helps to further enhance the heat dissipation effect of the first radiator 21 and the second radiator 31.

[0028] Under the action of the driver 41, the cooling fan 42 can be driven to move in the first direction so that the cooling fan 42 is aligned with the radiator with a higher temperature. Compared with the prior art, the number of cooling fans 42 is greatly reduced, so that the energy consumption of the cooling fan 42 can be reduced, the cooling cost is also reduced, and the cooling fan 42 can accurately dissipate heat from the radiator with a higher temperature, and the cooling efficiency is high.

[0029] In a preferred embodiment of the present application, please refer to Figure 1 and Figure 2 , the first heat dissipation component 2 further includes a first temperature sensor 22. The first temperature sensor 22 is installed on the first radiator 21 and is used to detect the temperature of the first radiator 21.

[0030] Therefore, the second heat dissipation component 3 further includes a second temperature sensor (not shown in the figure). The second temperature sensor is installed on the second radiator 31 and is used to detect the temperature of the second radiator 31.

[0031] With such a setting, under the action of the first temperature sensor 22, it can be used to detect the temperature of the first radiator 21 and feedback the detection data to an external controller. When the temperature of the first radiator 21 exceeds a preset threshold, the external controller controls the driver 41 to move in the first direction to the position of the first radiator 21, so that the cooling fan 42 can accurately dissipate heat from the first radiator 21.

[0032] Under the action of the second temperature sensor, it can be used to detect the temperature of the second radiator 31 and feedback the detection data to an external controller. When the temperature of the second radiator 31 exceeds a preset threshold, the external controller controls the driver 41 to move in the first direction to the position of the second radiator 31, so that the cooling fan 42 can accurately dissipate heat from the second radiator 31.

[0033] In a preferred embodiment of the present application, please refer to Figures 1 to 2 , the first heat dissipation component 2 further includes at least one fixing member 23. The at least one fixing member 23 is installed on the first radiator 21 and is used to fix the diode and / or transistor on the surface of the first radiator 21.

[0034] It should be noted here that when using a radiator to dissipate heat from a diode or a transistor, the diode or the transistor needs to be attached to the surface of the radiator. In the prior art, due to the influence of the external environment, the diode or the transistor is likely to fall off from the surface of the radiator, resulting in the radiator being unable to effectively dissipate heat from the diode or the transistor, and thus the heat dissipation effect becomes poor.

[0035] With such an arrangement, under the action of the fixing member 23, the diode and / or the transistor can be closely attached to the surface of the first heat sink 21, so that the diode and / or the transistor can quickly transfer heat to the first heat sink 21, which helps to improve the heat transfer efficiency. Moreover, during use, it is possible to prevent the diode and the transistor from being affected by the external environment and separating from the first heat sink 21, which helps to improve the structural stability between the diode, the transistor and the first heat sink 21, and thus enables better heat transfer.

[0036] In a preferred embodiment of the present application, refer to Figure 2 and Figure 3 , the fixing member 23 includes two insulating and heat-conducting layers 231, a pressing strip 232 and a fixing screw 233. The two insulating and heat-conducting layers 231 are both arranged on the surface of the first heat sink 21. The pressing strip 232 is arranged on the side of the insulating and heat-conducting layer 231 facing away from the first heat sink 21. The fixing screw 233 is screwed to the first heat sink 21, passes through the pressing strip 232, and is located between the two insulating and heat-conducting layers 231, and is further configured to be able to press the diode and / or the transistor between the insulating and heat-conducting layer 231 and the pressing strip 232.

[0037] It should be noted here that during use, since the side of the diode and the transistor facing the first heat sink 21 usually has a metal layer, the diode and the transistor are prone to conduction with the first heat sink 21, resulting in damage to the electronic components in the photovoltaic inverter.

[0038] With such an arrangement, under the action of the insulating and heat-conducting layer 231, it is possible to prevent the diode and the transistor from directly contacting the first heat sink 21, so as to prevent the diode and the transistor from conducting with the first heat sink 21 and causing damage to the electronic components in the photovoltaic inverter, and effectively protect the internal electronic components of the photovoltaic inverter. Moreover, while the insulating and heat-conducting layer 231 is insulating, it can also efficiently transfer the heat generated by the diode and the transistor to the first heat sink 21 without affecting the heat transfer of the diode and the transistor.

[0039] Under the action of the pressing strip 232 and the fixing screw 233, two diodes or two transistors can be simultaneously fixed to the surface of the insulating and heat-conducting layer 231, or one diode and one transistor can be simultaneously fixed to the surface of the insulating and heat-conducting layer 231. Compared with the related art, the pressing strip 232 can fix two electronic components simultaneously, has a simple structure, good fixing effect, and is convenient for disassembly and installation, greatly improving the convenience of use.

[0040] In a preferred embodiment of the present application, please refer to Figure 2 and Figure 3, the fixing member 23 further includes a first limiting rod 234 and two first auxiliary pressing blocks 235. The first limiting rod 234 is installed on the pressing strip 232, and the two first auxiliary pressing blocks 235 are sleeved on the first limiting rod 234 and can slide along the second direction.

[0041] With such a setting, under the action of the pressing strip 232 and the first limiting rod 234, the positions of the two first auxiliary pressing blocks 235 in the second direction can be adjusted, so that the first auxiliary pressing blocks 235 can always face the diode or transistor, which helps to improve the applicable range of the fixing member 23. Moreover, under the action of the pressing strip 232 and the first limiting rod 234, the two first auxiliary pressing blocks 235 can be guided, which helps to improve the moving stability of the two first auxiliary pressing blocks 235 in the second direction.

[0042] In a preferred embodiment of the present application, please refer to Figure 2 and Figure 3 , at least one second limiting rod 236 is provided on the side of the first limiting rod 234 facing away from the pressing strip 232. The fixing member 23 further includes two second auxiliary pressing blocks 237. The two second auxiliary pressing blocks 237 and the two first auxiliary pressing blocks 235 are arranged in one-to-one correspondence. The second auxiliary pressing block 237 is sleeved on at least one second limiting rod 236 and can slide along the third direction.

[0043] It should be noted here that the third direction above and below refers to the extending direction of the second limiting rod, specifically the Z-axis as shown in Figure 2 .

[0044] With such a setting, under the action of the second limiting rod 236, the positions of the two second auxiliary pressing blocks 237 in the third direction can be adjusted, so that the second auxiliary pressing blocks 237 can be used to fix diodes and transistors of different heights, which helps to further improve the applicable range of the fixing member 23.

[0045] In a preferred embodiment of the present application, refer to Figure 1 , Figure 2 and Figure 4 , the second radiator 31 includes two spliced radiators and an installation space 32. One of the spliced radiators is installed on the circuit board 1, and the other spliced radiator is installed on one of the spliced radiators and encloses the installation space 32 with one of the spliced radiators. The installation space 32 is used to install the inductor.

[0046] With such a setting, the second radiator 31 is assembled by two spliced radiators. During the installation process, the installation difficulty of the inductor is reduced, the assembly is convenient, and the use convenience is improved. The installation space 32 formed after the two second spliced radiators are assembled can wrap the inductor, and the heat transfer effect is better compared with the related technology.

[0047] In a preferred embodiment of the present application, please refer to Figure 4 and Figure 5 , the spliced radiator includes a heat dissipation main board 311 and multiple heat dissipation support boards 312. The multiple heat dissipation support boards 312 are all connected to the heat dissipation main board 311 and are evenly arranged along the circumferential direction around the axis of the heat dissipation main board 311. Among them, the distance between any two adjacent heat dissipation support boards 312 is equal everywhere.

[0048] It should be noted here that the distance between any two adjacent heat dissipation support boards 312 refers to Figure 5 H in

[0049] With such a setting, under the action of the heat dissipation main board 311, the heat generated by the inductor can be transferred to the multiple heat dissipation support boards 312 and dissipated through the multiple heat dissipation support boards 312, and the heat dissipation effect is good. Since the distance between any two adjacent heat dissipation support boards 312 is equal everywhere, it can avoid the situation that the distance between the ends of the heat dissipation support boards 312 close to the heat dissipation main board 311 is too close, resulting in a deterioration of the heat dissipation effect of the heat dissipation support boards 312. Compared with the related art, the heat dissipation effect is better.

[0050] In a preferred embodiment of the present application, please refer to Figure 1 and Figure 2 , the first heat dissipation component 2 further includes a first insulating board 24, and the first insulating board 24 is installed between the circuit board 1 and the first radiator 21.

[0051] With such a setting, under the action of the first insulating board 24, it can prevent the first radiator 21 from directly contacting the circuit board 1, thereby preventing the first radiator 21 from conducting with the electronic components on the circuit board 1, and can effectively protect the electronic components of the photovoltaic inverter.

[0052] Optionally, the first insulating board 24 is set as red kraft paper.

[0053] In a preferred embodiment of the present application, refer to Figure 1 and Figure 2 , the second heat dissipation component 3 further includes a second insulating board 33, and the second insulating board 33 is installed between the circuit board 1 and the second radiator 31.

[0054] With such a setting, under the action of the second insulating board 33, it can prevent the second radiator 31 from directly contacting the circuit board 1, thereby preventing the second radiator 31 from conducting with the electronic components on the circuit board 1, and can effectively protect the electronic components of the photovoltaic inverter.

[0055] Optionally, the second insulating board 33 is set as red kraft paper.

[0056] The working principle of the heat dissipation structure of a photovoltaic inverter provided by this application is as follows: The heat generated by diodes and transistors during operation is transferred to the first radiator 21 through the insulating heat-conducting layer 231 and dissipated through the first radiator 21. The heat generated by the inductor during operation is transferred to multiple heat dissipation support plates 312 through the main heat dissipation board 311 and dissipated through the multiple heat dissipation support plates 312.

[0057] When the first radiator 21 overheats, the first temperature sensor 22 feeds back the temperature data of the first radiator 21 to the external controller, and the external controller controls the driver 41 to drive the cooling fan 42 to move in the first direction until the two cooling fans 42 are aligned with the corresponding first radiator 21.

[0058] When the second radiator 31 overheats, the second temperature sensor feeds back the temperature data of the second radiator 31 to the external controller, and the external controller controls the driver 41 to drive the cooling fan 42 to move in the first direction until the two cooling fans 42 are aligned with the second radiator 31.

[0059] Embodiment 2 This embodiment is basically the same as Embodiment 1, and the only difference is that as Figure 1 、 Figure 2 、 Figure 6 and Figure 7 shown, the second heat dissipation component 3 further includes an internal radiator 34, and the internal radiator 34 is arranged inside the second radiator 31 and transfers the heat inside the inductor to the second radiator 31.

[0060] It should be noted here that in the prior art, the radiator is usually directly arranged outside the inductor to dissipate heat from the inductor. However, in actual application, a large amount of heat is also generated inside the hollow inductor. Only dissipating heat from the outside of the inductor has a poor heat dissipation effect, and the inductor is also prone to damage.

[0061] With such an arrangement, under the action of the internal radiator 34, the heat generated inside the inductor can be transferred to the second radiator 31, preventing the heat from accumulating inside the inductor and causing damage to the inductor. Compared with the prior art, the inductor can be more effectively protected and the heat dissipation effect is good.

[0062] In a preferred embodiment of this application, please refer to Figure 2 、 Figure 6 and Figure 7 , the internal radiator 34 includes a hollow heat dissipation tube 341 and two heat conduction rings 342. The hollow heat dissipation tube 341 is arranged inside the second radiator 31 and passes through the inductor and is in contact with the inside of the inductor. The two heat conduction rings 342 are respectively arranged at both ends of the hollow heat dissipation tube 341 and are located between the second radiator 31 and the hollow heat dissipation tube 341.

[0063] With such an arrangement, the heat inside the inductor, under the action of the hollow heat dissipation tube 341, is transferred to the second radiator 31 through the two heat conduction rings 342, which can effectively dissipate the heat inside the inductor with good heat dissipation effect. Moreover, when the heat dissipation fan 42 dissipates heat from the second heat dissipation component 3, the airflow output by the heat dissipation fan 42 can flow through the inside of the hollow radiator 341, which can also effectively dissipate heat from the hollow heat dissipation tube 341, thus helping to enhance the heat dissipation effect of the internal radiator 34.

[0064] In a preferred embodiment of the present application, please refer to Figure 2 , Figure 6 and Figure 7 together. The heat conduction ring 342 includes a heat conduction inner ring 3421, a heat conduction outer ring 3422 and a plurality of heat conduction fins 3423. The heat conduction inner ring 3421 is sleeved on the outer peripheral side of the hollow heat dissipation tube 341, the heat conduction outer ring 3422 is attached to the inner peripheral side of the second radiator 31, and the plurality of heat conduction fins 3423 are all connected between the heat conduction inner ring 3421 and the heat conduction outer ring 3422 and are evenly arranged in a circumferential direction around the axis of the hollow heat dissipation tube 341.

[0065] With such an arrangement, under the action of the heat conduction inner ring 3421, the heat conduction outer ring 3422 and the heat conduction fins 3423, the heat of the hollow heat dissipation tube 341 can be transferred to the second radiator 31 for heat dissipation. Under the action of the plurality of heat conduction fins 3423, the heat at the hollow heat dissipation tube 341 can be quickly transferred to the second radiator 31, and the conduction efficiency is higher compared with only one heat conduction fin. Moreover, since the plurality of heat conduction fins 3423 are evenly arranged, the heat conduction fins 3423 can also dissipate heat during the conduction process, which helps to further enhance the heat dissipation effect of the internal radiator 34. In addition, since the plurality of heat conduction fins 3423 are evenly arranged, when the heat dissipation fan 42 dissipates heat from the second heat dissipation component 3, the airflow output by the heat dissipation fan 42 can flow through between the heat conduction fins 3423, which can also effectively dissipate heat from the plurality of heat conduction fins 3423, and also helps to further enhance the heat dissipation effect of the internal radiator 34. Finally, since the plurality of heat conduction fins 3423 are evenly arranged, it can prevent the second radiator 31 and the internal radiator 34 from completely enclosing the inductor, facilitating the airflow of the heat dissipation fan 42 to flow through the inductor, enabling the heat dissipation fan 42 to effectively dissipate heat from the inductor, and also facilitating the installation of the inductor's wire to the circuit board 1.

[0066] One or more embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of the present application shall be included within the protection scope of the present application.

Claims

1. A heat dissipation structure of a photovoltaic inverter, characterized in that, Comprising: A housing; A circuit board (1), mounted on the housing; At least one first heat dissipation component (2); the first heat dissipation component (2) includes a first heat sink (21), the first heat sink (21) is mounted on the circuit board (1), and is configured to dissipate heat from diodes and / or transistors; At least one second heat dissipation component (3); the second heat dissipation component (3) includes a second heat sink (31), the second heat sink (31) is mounted on the circuit board (1), and is configured to dissipate heat from inductors, and is spaced from the first heat sink (21) along a first direction; Two third heat dissipation components (4), both mounted on the housing, and located at two ends of the circuit board (1) along a second direction respectively; the third heat dissipation component (4) includes a driver (41) and a cooling fan (42), the driver (41) is mounted on the housing, the cooling fan (42) is mounted on the output end of the driver (41), and moves along the first direction under the drive of the driver (41).

2. The heat dissipation structure of a photovoltaic inverter according to claim 1, wherein, The first heat dissipation component (2) further includes a first temperature sensor (22), the first temperature sensor (22) is mounted on the first heat sink (21), and is used to detect the temperature of the first heat sink (21); So the second heat dissipation component (3) further includes a second temperature sensor, the second temperature sensor is mounted on the second heat sink (31), and is used to detect the temperature of the second heat sink (31).

3. The heat dissipation structure of a photovoltaic inverter according to claim 1, characterized in that, The first heat dissipation component (2) further includes at least one fixing member (23), at least one of the fixing members (23) is mounted on the first heat sink (21), and is used to fix diodes and / or transistors on the surface of the first heat sink (21).

4. The heat dissipation structure of a photovoltaic inverter according to claim 3, characterized in that, The fixing member (23) includes two insulating and heat-conducting layers (231), a pressing strip (232) and a fixing screw (233), the two insulating and heat-conducting layers (231) are both arranged on the surface of the first heat sink (21), the pressing strip (232) is arranged on the side of the insulating and heat-conducting layer (231) facing away from the first heat sink (21), the fixing screw (233) is screwed to the first heat sink (21), passes through the pressing strip (232), and is located between the two insulating and heat-conducting layers (231), and is further configured to be able to press diodes and / or transistors between the insulating and heat-conducting layer (231) and the pressing strip (232).

5. The heat dissipation structure of a photovoltaic inverter according to claim 4, characterized in that, The fixing member (23) further includes a first limiting rod (234) and two first auxiliary pressing blocks (235), the first limiting rod (234) is mounted on the pressing strip (232), the two first auxiliary pressing blocks (235) are both sleeved on the first limiting rod (234), and can slide along a second direction.

6. The heat dissipation structure of a photovoltaic inverter according to claim 5, characterized in that, At least one of the second limiting rods (236) is provided on the side of the first limiting rod (234) facing away from the pressing strip (232); The fixing member (23) further includes two second auxiliary pressing blocks (237). The two second auxiliary pressing blocks (237) are arranged in one-to-one correspondence with the two first auxiliary pressing blocks (235). The second auxiliary pressing block (237) is sleeved on at least one of the second limiting rods (236) and can slide along the third direction.

7. The heat dissipation structure of a photovoltaic inverter according to claim 1, wherein, The second radiator (31) includes two spliced radiators and an installation space (32). One of the spliced radiators is installed on the circuit board (1), and the other spliced radiator is installed on one of the spliced radiators and encloses the installation space (32) with one of the spliced radiators. The installation space (32) is used for installing an inductor.

8. The heat dissipation structure of a photovoltaic inverter according to claim 7, characterized in that, The spliced radiator includes a heat dissipation main board (311) and a plurality of heat dissipation support boards (312). The plurality of heat dissipation support boards (312) are all connected to the heat dissipation main board (311) and are uniformly arranged in the circumferential direction around the axis of the heat dissipation main board (311); Wherein, the distance between any two adjacent heat dissipation support boards (312) is equal everywhere.

9. The heat dissipation structure of a photovoltaic inverter according to claim 1, characterized in that, The first heat dissipation assembly (2) further includes a first insulating board (24). The first insulating board (24) is installed between the circuit board (1) and the first radiator (21).

10. The heat dissipation structure of a photovoltaic inverter according to claim 1, characterized in that, The second heat dissipation assembly (3) further includes a second insulating board (33). The second insulating board (33) is installed between the circuit board (1) and the second radiator (31).

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