Power supply and electronic device

Abstract

The application provides a power supply and an electronic device. The power supply comprises a functional device, a filter module and an electromagnetic shielding structure. The filter module comprises a differential mode capacitor and a filter device which are electrically connected to each other. The differential mode capacitor is arranged close to an input port of the power supply and is electrically connected to the input port to form a differential mode loop structure. The electromagnetic shielding structure is arranged on a side of the differential mode capacitor close to the filter device and the functional device to electromagnetically isolate the differential mode loop structure from the filter device and the functional device. The embodiment of the application is beneficial to reducing the interference of the interference magnetic field generated by the functional device on the differential mode loop structure, reducing or eliminating the induced current generated on the differential mode loop structure due to the interference magnetic field, and further improving the EMC performance and use performance of the power supply.

Description

Technical Field

[0001] This application belongs to the field of computing technology, and in particular relates to a power supply and electronic device. Background Technology

[0002] A switched-mode power supply (SMPS) is a power supply device that maintains a stable output voltage by controlling the on-time and off-time ratio of a switching transistor. However, the EMC (Electromagnetic Compatibility) performance of a switched-mode power supply directly affects its overall performance. Summary of the Invention

[0003] The purpose of this application is to provide a power supply and electronic device that can improve the EMC performance of the power supply, thereby having better performance.

[0004] A first aspect of this application provides a power supply, comprising:

[0005] Functional devices;

[0006] A filter module is disposed between the functional device and the input port of the power supply. The filter module includes a differential-mode capacitor and a filter element that are electrically connected to each other. The filter element is electrically connected to the functional device. The differential-mode capacitor is disposed close to the input port of the power supply and is electrically connected to the input port to form a differential-mode loop structure.

[0007] An electromagnetic shielding structure is provided on the side of the differential-mode capacitor close to the filter device and the functional device to electromagnetically isolate the differential-mode circuit structure from the filter device and the functional device.

[0008] For example, the functional device is a device that generates a magnetic field during power supply operation. In this embodiment, an electromagnetic shielding structure is disposed between the differential-mode capacitor and the functional device, thereby electromagnetically isolating the differential-mode circuit structure and the functional device. This helps to reduce the interference of the interfering magnetic field generated by the functional device on the differential-mode circuit structure, thereby reducing or eliminating the induced current on the differential-mode circuit structure caused by the aforementioned interfering magnetic field, and thus improving the EMC performance and usability of the power supply.

[0009] For example, the functional device includes a power conversion element and / or a transformer element. Specifically, the power conversion element can be a rectifier element or an inverter element. The transformer element can be a boost element or a buck element. Rectifier elements, inverter elements, boost elements, and buck elements are prone to generating currents with large instantaneous changes, which can easily generate interfering magnetic fields.

[0010] In some implementations of this application, an electromagnetic shielding cavity is formed within the electromagnetic shielding structure, and the differential mode circuit structure is disposed within the electromagnetic shielding cavity.

[0011] In this way, setting up an electromagnetic shielding cavity is beneficial for multi-directional shielding of the differential mode circuit structure, which in turn helps to improve the EMC performance and usability of the power supply.

[0012] In some implementations of this application, the power supply further includes a housing, which is electrically connected to the electromagnetic shielding structure to jointly define an electromagnetic shielding cavity, and the differential mode circuit structure is disposed within the electromagnetic shielding cavity.

[0013] In this way, an electromagnetic shielding cavity can be formed by utilizing part of the outer shell structure, which helps to save internal space of the power supply.

[0014] In some implementations of this application, the power supply further includes a circuit board disposed within the housing, the filter module and the functional devices disposed on the circuit board, and the electromagnetic shielding structure electrically connected to the ground plane of the circuit board and the housing.

[0015] In this way, the electromagnetic shielding structure and the outer shell are grounded through the circuit board, thereby grounding the entire electromagnetic shielding cavity and achieving the electromagnetic shielding effect of the electromagnetic shielding cavity.

[0016] In other implementations, the electromagnetic shielding structure can be connected to other fixed locations to achieve its electromagnetic shielding effect.

[0017] In some implementations of this application, the power supply further includes a connecting portion, which is a conductive structure; the connecting portion is disposed between the outer shell and the electromagnetic shielding structure, and forms line contact or surface contact with the outer shell and the electromagnetic shielding structure.

[0018] Understandably, compared to point contact structures, line contact or surface contact structures have a larger current-carrying area, which helps to reduce the impedance of the connection between the outer shell and the electromagnetic shielding structure.

[0019] In some implementations of this application, the power supply includes a connection part, which is a conductive structure. The connection part is disposed between the electromagnetic shielding structure and the ground plane of the circuit board, and forms line contact or surface contact with the electromagnetic shielding structure and the ground plane of the circuit board.

[0020] This increases the current-carrying area between the electromagnetic shielding structure and the circuit board, thereby reducing the impedance of the connection between the electromagnetic shielding structure and the circuit board.

[0021] In some implementations of this application, the electromagnetic shielding structure includes a first shielding plate and a second shielding plate, which are arranged crosswise to form an electromagnetic shielding cavity and a shielding area. The differential mode circuit structure is disposed within the electromagnetic shielding cavity, and the functional device is disposed within the shielding area.

[0022] In some examples, there can be one or more electromagnetic shielding cavities and shielding areas.

[0023] Understandably, the differential-mode capacitor circuit can be placed inside an electromagnetic shielding cavity, and the functional device can be placed within the shielding area. On the one hand, the shielding plates within the shielding area can shield the interference magnetic field emitted by the functional device from the source, preventing the interference magnetic field from leaking out. On the other hand, the electromagnetic shielding cavity can enclose the differential-mode circuit structure, preventing it from receiving interference from the interference magnetic field.

[0024] In some implementations of this application, the electromagnetic shielding structure is provided with heat dissipation holes.

[0025] In some implementations of this application, the filter module further includes a common-mode capacitor, which is located near the input port of the power supply and electrically connected to the input port. The electromagnetic shielding structure is also disposed between the common-mode capacitor and the functional device to electromagnetically isolate the common-mode capacitor from the functional device.

[0026] Since common-mode capacitors require grounding, they may form a common-mode loop structure through the grounding structure at the input port. This common-mode loop structure may also be affected by interfering magnetic fields, resulting in current. In the implementation of this application, an electromagnetic shielding structure is set between the common-mode capacitor and the functional device, which helps to reduce the impact of the common-mode capacitor on the power supply's EMC performance.

[0027] In some implementations of this application, the electromagnetic shielding structure includes a first shielding plate and a second shielding plate, which are arranged crosswise to form an electromagnetic shielding cavity and a shielding area. The common-mode capacitor is disposed in the electromagnetic shielding cavity, and the functional device is disposed in the shielding area.

[0028] In some examples, there can be one or more electromagnetic shielding cavities and shielding areas.

[0029] Understandably, common-mode capacitors can be placed inside an electromagnetic shielding cavity, while functional devices are placed within the shielding area. On the one hand, the interference magnetic field emitted by the functional devices can be shielded from the source by the shielding plate in the shielding area, preventing the interference magnetic field from leaking out. On the other hand, the common-mode structure can be sealed off by the electromagnetic shielding cavity to prevent it from receiving interference from the interference magnetic field.

[0030] Secondly, embodiments of this application also provide an electronic device, including a power supply and a load as described in any one of claims 1 to 9, wherein the power supply is used to supply power to the load.

[0031] Thirdly, this application also provides a test system, which includes a line impedance stabilization network and a power supply as described above; the line impedance stabilization network is connected to the input port of the power supply.

[0032] Setting up an electromagnetic shielding structure as described above helps improve the accuracy of the current at the input port, which in turn improves the accuracy of the test system. Attached Figure Description

[0033] Figure 1 A schematic diagram of the power supply structure provided in an embodiment of this application;

[0034] Figure 2 This is a schematic diagram of the power supply structure provided in one implementation of this application;

[0035] Figure 3 This is a schematic diagram of the power supply structure provided in another implementation of this application;

[0036] Figure 4 This is a schematic diagram of the power supply provided in yet another implementation of this application;

[0037] Figure 5 This is a schematic diagram of the power supply provided in another implementation of this application;

[0038] Figure 6 This is a schematic diagram of the power supply provided in yet another implementation of this application;

[0039] Figure 7 This is a schematic diagram of the power supply structure provided in another implementation of this application;

[0040] Figure 8 This is a schematic diagram of the circuit structure of the power supply provided in one implementation of this application;

[0041] Figure 9 A schematic diagram of the circuit structure of the power supply provided in another implementation of this application;

[0042] Figure 10 This is a schematic diagram of the framework structure of a test system provided in an embodiment of this application.

[0043] Specific component symbol explanations: 100-Power supply, 110-Input port, 120-Functional device, 130-Filter module, 131-Differential mode capacitor, 132-Filtering device, 140-Electromagnetic shielding structure, 141-First shielding plate, 142-Second shielding plate, 143-Heat dissipation hole, 150-First power supply line, 160-Second power supply line, 170-Housing shell, 180-Connection part, a-First direction, b-Second direction. Detailed Implementation

[0044] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0045] It should be noted that when a component is referred to as being "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0047] The switching power supply provided in this application embodiment can be applied in computing devices. For example, taking a server as an example, in a server, the switching power supply can be the power supply unit (PSU) of the server or server node, providing a stable power supply to the server node; it can also be the onboard power supply of the server, providing a stable power supply to various onboard devices (such as CPU, memory, hard disk, etc.). The switching power supply in this application embodiment can also be applied in the field of new energy charging. For example, in a charging host, the switching power supply can be set in the charging module of the charging host. Or, for example, in a charging terminal, the switching power supply can provide power to the control board of the liquid cooling distribution unit (CDU). In addition, the switching power supply can be a power supply for monitoring equipment in scenarios such as communication base stations and data centers. For example, in a transformer output scenario, the switching power supply can convert single-phase input AC power into lower voltage DC power.

[0048] Please see Figure 1 , Figure 1A schematic diagram of the power supply 100 provided in this embodiment is shown. The power supply 100 of this embodiment includes a functional device 120, a filter module 130, and an electromagnetic shielding structure 140. The filter module 130 is disposed between the functional device and the input port of the power supply. The filter module 130 includes a differential-mode capacitor 131 and a filter element 132 electrically connected to each other. The differential-mode capacitor 131 is disposed near the input port 110 of the power supply 100 and electrically connected to the input port 110 to form a differential-mode loop structure. The filter element 132 is connected to the functional device. The electromagnetic shielding structure 140 is disposed on the side of the differential-mode capacitor near the filter element 132 and the functional device to electromagnetically shield the differential-mode loop structure from the filter element 132 and the functional device 120.

[0049] It should be explained that functional device 120 refers to a component that can perform a certain function during the operation of the power supply 100 in this embodiment of the application; and when the power supply 100 is in the working state, functional device 120 will generate a significantly changing current, thereby generating an interfering magnetic field. For example, the switching transistor in the rectifier element, by controlling the switching transistor to quickly turn on / off, realizes the voltage regulation function of the switching power supply 100, but the rapid turning on / off of the switching transistor will generate an interfering magnetic field. Filter module 130 refers to a module in the power supply that can filter interference signals. Filtering device 132 can be a common-mode inductor, differential-mode inductor, or other devices in the filter module 130.

[0050] It is understood that the differential-mode capacitor 131 is typically used to filter differential-mode noise in a circuit. In this embodiment, the differential-mode capacitor refers to one directly connected to the input port, with no DC filtering components such as inductors between the capacitor and the input port. Specifically, at least two power supply lines are connected to the input port, and the differential-mode capacitor is connected between these two lines. For the differential-mode capacitor 131 in this embodiment, since it is positioned close to the input port 110, and there are no DC filtering components between the input port and the capacitor to filter interference current, the interference current generated by the interference magnetic field flows directly into the input port 110.

[0051] In this embodiment, an electromagnetic shielding structure 140 is placed between the differential mode circuit structure and the functional device 120. This helps to reduce the interference of the interference magnetic field generated by the functional device 120 on the differential mode circuit structure, thereby reducing or eliminating the induced current generated on the differential mode circuit structure by the aforementioned interference magnetic field. This, in turn, helps to improve the EMC performance and usability of the power supply 100.

[0052] In some implementations, the electromagnetic shielding structure 140 is made of a conductive material (such as a metallic conductive material), and the electromagnetic shielding function is achieved by grounding or connecting the electromagnetic shielding structure 140 to a fixed location.

[0053] In some exemplary descriptions, functional device 120 includes power conversion elements and / or transformer elements. It should be explained that the power conversion elements can be rectifier elements or inverter elements. The transformer elements can be boost elements or buck elements. Rectifier elements, inverter elements, boost elements, and buck elements are prone to generating currents with large instantaneous changes, which can easily generate interfering magnetic fields.

[0054] For example, if the rectifier element is provided with a rectifier bridge formed by a combination of multiple switching elements, the switching elements need to be continuously turned on / off when the power supply 100 is working, thereby generating a changing current, which in turn generates a changing interference magnetic field.

[0055] In some exemplary descriptions, functional device 120 includes a parasitic diode. Due to the reverse current pulse during the recovery of the parasitic diode, a changing interfering magnetic field can also be generated in the parasitic loop.

[0056] For some implementation details in this application, please refer to [link / reference]. Figure 2 and Figure 3 , Figure 2 This diagram shows the structure of the power supply 100 provided in this implementation. Figure 3 Another structural schematic diagram of the power supply 100 provided in this implementation is shown. An electromagnetic shielding cavity is formed within the electromagnetic shielding structure 140 of this implementation, and a differential mode circuit structure is disposed within the electromagnetic shielding cavity.

[0057] Understandably, setting up an electromagnetic shielding cavity is beneficial for providing multi-directional shielding of the differential mode circuit structure, which in turn helps improve the EMC performance and usability of the power supply 100.

[0058] Please refer to the partial implementation details in this application. Figure 2 The electromagnetic shielding structure 140 is partially L-shaped, and the functional device 120 consists of multiple ( Figure 2 When the two functional devices shown are distributed on adjacent sides of the differential mode circuit structure, the L-shaped electromagnetic shielding structure 140 can shield the interfering magnetic field extending from different directions.

[0059] Please continue reading. Figure 3 This can also be understood as follows: part of the interference magnetic field generated by the functional device 120 is a magnetic field extending directly from the functional device 120 toward the differential mode circuit structure (first direction a in the figure), and another part is a magnetic field entering from the side of the differential mode circuit structure along the curved direction of the functional device 120 (second direction b in the figure). The L-shaped electromagnetic shielding structure 140 can shield the interference magnetic field extending from both the front and side directions.

[0060] For some implementation details in this application, please refer to [link / reference]. Figure 4 , Figure 4 A schematic diagram of the power supply 100 provided in this implementation is shown; the power supply 100 in this implementation also includes a housing 170, which is electrically connected to the electromagnetic shielding structure 140 to jointly define the electromagnetic shielding cavity, and the differential mode circuit structure is disposed in the electromagnetic shielding cavity.

[0061] It is understandable that an electromagnetic shielding cavity can be formed by using part of the structure of the outer shell 170, which helps to save internal space of the power supply 100.

[0062] In some implementations of this application, the power supply 100 also includes a circuit board, which is disposed inside the housing. The filter module 130 and functional devices are disposed on the circuit board, and the electromagnetic shielding structure is electrically connected to the ground plane of the circuit board and to the housing.

[0063] It should be explained that the outer casing can be connected to the ground plane of the circuit board via the electromagnetic shielding structure, or it can be directly connected to the ground plane of the circuit board. Grounding the outer casing 170 of the power supply 100 not only helps prevent the risk of electric shock due to leakage or static electricity buildup from the power supply 100, but also helps to discharge any potential electromagnetic interference. It is understood that the electromagnetic shielding effect of the electromagnetic shielding cavity is achieved by grounding the entire electromagnetic shielding cavity. In other implementations, the electromagnetic shielding structure 140 can also be connected to other fixed locations to achieve its electromagnetic shielding effect.

[0064] For some implementation details in this application, please refer to [link / reference]. Figure 5 , Figure 5 A schematic diagram of the power supply 100 provided in this implementation is shown; the power supply 100 in this implementation also includes a connecting part 180, which is a conductive structure. The connecting part 180 is disposed between the outer shell 170 and the electromagnetic shielding structure 140, and forms line contact or surface contact with the outer shell 170 and the electromagnetic shielding structure 140.

[0065] It should be explained that, compared with point contact structures, line contact structures or surface contact structures have a larger current-carrying area, which is beneficial to reducing the impedance of the connection 180 between the outer shell 170 and the electromagnetic shielding structure 140.

[0066] In some implementations of this application, the connection portion is disposed between the electromagnetic shielding structure and the ground plane of the circuit board, forming a line contact or surface contact with the ground plane of the electromagnetic shielding structure and the circuit board. This increases the current-carrying area between the electromagnetic shielding structure and the circuit board, thereby reducing the impedance of the connection portion between the electromagnetic shielding structure and the circuit board.

[0067] In some implementations, the connector 180 is made of conductive adhesive material.

[0068] For some implementation details in this application, please refer to [link / reference]. Figure 6 , Figure 6 A schematic diagram of the power supply 100 provided in this implementation is shown. The electromagnetic shielding structure 140 of this implementation includes a first shielding plate 141 and a second shielding plate 142, which are arranged crosswise to form at least one electromagnetic shielding cavity and at least one shielding area. The differential mode circuit structure is disposed in the electromagnetic shielding cavity, and the functional devices are disposed in the shielding area.

[0069] It is understandable that the differential mode capacitor 131 circuit can be placed in an electromagnetic shielding cavity, and the functional device 120 can be placed in the shielding area. On the one hand, the shielding plate in the shielding area can shield the interference magnetic field emitted by the functional device 120 from the source, preventing the interference magnetic field from leaking out. On the other hand, the electromagnetic shielding cavity can seal the differential mode circuit structure to prevent it from receiving interference from the interference magnetic field.

[0070] In some implementations, the cross-arrangement of the first shielding plate 141 and the second shielding plate 142 can define two shielding areas and, together with the outer shell, define two electromagnetic shielding cavities. In cases where there are many functional devices 120 and the functional devices 120 are prone to mutual interference, the functional devices can be placed in different shielding areas, and the differential mode circuit structure and other easily affected devices can be separated in different electromagnetic shielding cavities to improve the anti-interference performance of the power supply.

[0071] In some implementations, the included angle between the first shielding plate 141 and the second shielding plate 142 is approximately 90°.

[0072] In some implementations, the included angle between the first shielding plate and the second shielding plate can be approximately 30°, 45°, 60°, etc.

[0073] For some implementation details in this application, please refer to [link / reference]. Figure 7 , Figure 7 A schematic diagram of the power supply 100 provided in this implementation is shown. The electromagnetic shielding structure 140 of this implementation is provided with heat dissipation holes 143.

[0074] Understandably, the internal components of the power supply 100 can dissipate heat through the heat dissipation holes 143 to balance the internal temperature of the power supply 100 and improve the operating stability of the power supply 100.

[0075] For some implementation details in this application, please refer to [link / reference]. Figure 8 , Figure 8 A schematic diagram of the circuit structure of the power supply 100 provided in this implementation is shown. Figure 8As shown, the preset impedance of the LISN (Line Impedance Stabilization Network) is set to 25 ohms as an example. Figure 8 In this implementation, SCREEN corresponds to the electromagnetic shielding structure 140 mentioned above. T1 and T2 are both common-mode inductors in the subsequent circuit, and C1 is a differential-mode capacitor 131. Taking the power supply 100 connected to the line impedance stabilization network 200 as an example, the power supply 100 in this implementation includes a first power supply line 150 and a second power supply line 160, and the differential-mode capacitor 131 is connected to both the first power supply line 150 and the second power supply line 160.

[0076] It is understandable that when there is a voltage difference between the first power supply line 150 and the second power supply line 160, the differential mode capacitor 131 can play a filtering role.

[0077] For some implementation details, please refer to [link / reference]. Figure 8 In this configuration, the first power supply line 150 is the live wire, and the second power supply line 160 is the neutral wire. In some other implementations, the first power supply line 150 is the positive wire, and the second power supply line 160 is the negative wire.

[0078] In some implementations of this application, the first power supply line 150 has a first portion located between the input port 110 and the differential-mode capacitor 131, and the second power supply line 160 has a second portion located between the input port 110 and the differential-mode capacitor 131. The differential-mode capacitor 131, the first portion, and the second portion form a differential-mode circuit structure.

[0079] For some implementation details in this application, please refer to [link / reference]. Figure 9 , Figure 9 A schematic diagram of the circuit structure of the power supply 100 provided in this implementation is shown. In this implementation, C2 is taken as a common-mode capacitor, and in this implementation, the power supply 100 is connected to a line impedance stabilization network. The filter module 130 of this implementation also includes a common-mode capacitor. The common-mode capacitor is located near the input port 110 of the power supply 100 and is electrically connected to the input port. The electromagnetic shielding structure 140 is also disposed between the common-mode capacitor and the functional device to electromagnetically shield the common-mode capacitor and the functional device 120.

[0080] It is understood that the common-mode capacitor in this implementation is a common-mode capacitor directly connected to the input port, meaning that there is no DC filtering device 132 between the common-mode capacitor and the input port. Specifically, the common-mode capacitor consists of two grounded capacitors, each connected to a different power supply line. Since the common-mode capacitor needs to be grounded, it may form a common-mode loop structure through the grounding structure at the input port 110. This common-mode loop structure may also be affected by interfering magnetic fields, resulting in current. In this implementation, an electromagnetic shielding structure 140 is provided to electromagnetically shield the common-mode capacitor from the functional device 120, which helps to reduce the impact of the common-mode capacitor on the EMC performance of the power supply 100.

[0081] In some implementations of this application, the electromagnetic shielding structure 140 includes a first shielding plate 141 and a second shielding plate 142, which are arranged crosswise to form at least one electromagnetic shielding cavity and at least one shielding area. The common-mode capacitor is disposed in the electromagnetic shielding cavity, and the functional device is disposed in the shielding area.

[0082] Understandably, the common-mode capacitor can be placed inside the electromagnetic shielding cavity, and the functional device 120 can be placed within the shielding area. On the one hand, the interference magnetic field emitted by the functional device 120 can be shielded from the source by the shielding plate of the shielding area, preventing the interference magnetic field from leaking out. On the other hand, the common-mode structure can be sealed by the electromagnetic shielding cavity to prevent it from receiving interference from the interference magnetic field.

[0083] For some implementation details, please refer to [link / reference]. Figure 9 The common-mode capacitor includes at least two sub-capacitors (grounding capacitors). The two sub-capacitors include a first sub-capacitor and a second sub-capacitor. The first sub-capacitor is disposed between the first power supply line 150 and the grounding terminal, and the second sub-capacitor is disposed between the second power supply line 160 and the grounding terminal. The electromagnetic shielding structure 140 is disposed between at least one sub-capacitor and the functional device 120.

[0084] Furthermore, in order to better implement the power supply 100 in any of the above embodiments or implementations, based on the power supply 100, embodiments of this application also provide an electronic device including the power supply 100.

[0085] In some embodiments, the electronic device may be a computer, server, communication equipment, monitoring equipment, transformer equipment, etc.

[0086] Furthermore, in order to better implement the power supply 100 in any of the above embodiments or implementations, please continue to refer to the following based on the power supply 100 described above. Figure 8 , Figure 9 And see Figure 10 , Figure 10A schematic diagram of the framework structure of the test system provided in this implementation is shown; embodiments of this application also provide a test system, which includes a line impedance stabilization network 200. The line impedance stabilization network 200 is connected to the input port 110 of the power supply 100.

[0087] It should be explained that the line impedance stabilization network 200 is a key piece of equipment in EMC testing, used to isolate power supply 100 interference and provide stable test impedance. In conducted emission (CE) and radiated emission (RE) testing, the line impedance stabilization network 200 ensures that the interference measured is from the product itself, rather than power supply 100 noise.

[0088] Specifically, in the test system, a line impedance stabilization network 200 is installed at the input port 110 of the power supply 100. The line impedance stabilization network 200 simulates the impedance characteristics of a real circuit and ensures that the input impedance of the power supply 100 input port 110 remains stable during the test. In some exemplary instances, the LISN also has the ability to filter out interference signals, helping to ensure the purity of the test environment. In some embodiments, the preset impedance of the LISN can be 25-100Ω; specifically, the preset impedance of the LISN can be any one of 25Ω, 50Ω, or 100Ω.

[0089] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0090] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0091] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0092] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0093] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A power supply, characterized by, The power supply comprises: a functional device; a filter module arranged between the functional device and an input port of the power supply, the filter module comprising a differential mode capacitor and a filter device electrically connected to each other, the filter device being electrically connected to the functional device, the differential mode capacitor being arranged close to the input port of the power supply and being electrically connected to the input port to form a differential mode loop structure; an electromagnetic shielding structure, the electromagnetic shielding structure forming an electromagnetic shielding cavity, the differential mode loop structure being arranged in the electromagnetic shielding cavity to electromagnetically isolate the differential mode loop structure from the filter device and the functional device.

2. The power supply of claim 1, wherein, The power supply further comprises a housing, the housing being electrically connected to the electromagnetic shielding structure to jointly define the electromagnetic shielding cavity, the differential mode loop structure being arranged in the electromagnetic shielding cavity.

3. The power supply of claim 2, wherein, The power supply further comprises a circuit board, the filter module and the functional device being arranged on the circuit board, the electromagnetic shielding structure being electrically connected to a ground plane of the circuit board and to the housing.

4. The power supply of claim 3, wherein, The power supply further comprises a connecting portion, the connecting portion being a conductive structure; the connecting portion being arranged between the housing and the electromagnetic shielding structure and forming a line contact or a surface contact with the housing and the electromagnetic shielding structure; and / or, the connecting portion being arranged between the electromagnetic shielding structure and the ground plane of the circuit board and forming a line contact or a surface contact with the electromagnetic shielding structure and the ground plane of the circuit board.

5. The power supply according to any one of claims 1 to 4, characterized in that The electromagnetic shielding structure comprises a first shielding plate and a second shielding plate, the first shielding plate and the second shielding plate being arranged in a cross manner to form an electromagnetic shielding cavity and a shielding region, the differential mode loop structure being arranged in the electromagnetic shielding cavity, and the functional device being arranged in the shielding region.

6. The power supply of any one of claims 1 to 4, wherein The filter module further comprises a common mode capacitor, the common mode capacitor being arranged close to the input port of the power supply and being electrically connected to the input port, the electromagnetic shielding structure being further arranged between the common mode capacitor and the functional device to electromagnetically isolate the common mode capacitor from the functional device.

7. The power supply of claim 6, wherein, The electromagnetic shielding structure comprises a first shielding plate and a second shielding plate, the first shielding plate and the second shielding plate being arranged in a cross manner to form an electromagnetic shielding cavity and a shielding region, the common mode capacitor being arranged in the electromagnetic shielding cavity, and the functional device being arranged in the shielding region.

8. The power supply of any one of claims 1 to 4, wherein The electromagnetic shielding structure is provided with heat dissipation holes.

9. An electronic device, comprising: The power supply of any one of claims 1 to 8 is used to supply power to a load.

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