Wireless signal transmission equipment

Abstract

The invention relates to wireless signal transmission equipment, which comprises a shell and a plurality of communication modules, a plurality of mounting parts are arranged on the inner side wall of the shell at intervals; the plurality of communication modules are respectively arranged on the plurality of mounting parts; each communication module comprises a circuit board arranged on the shell, a signal receiving and transmitting unit arranged on the shell and connected with one end of the circuit board, and a first cooling fin installed on the shell and connected with the signal receiving and transmitting unit. Through a plurality of communication modules which are arranged in a surrounding manner, receiving dead angles can be reduced, and network information receiving and transmitting benefits can be effectively improved.

Description

Technical Field

[0001] The present invention relates to a communication technology, and more particularly to a wireless signal transmission device that reduces signal reception dead zones. Background Art

[0002] The fifth generation wireless systems (5G) is an evolution after the fourth generation wireless systems (4G) and belongs to a newer generation of mobile communication technology. The performance goals of 5G technology are to increase data transmission rates, reduce latency, and increase system capacity and large-scale device connectivity, etc.

[0003] For products that rely on network data transmission, such as network cameras, the speed at which the product accesses the network is an important factor affecting the performance of the product. Improving the network speed means improving data transmission and thus improving product quality, which directly affects the user experience of the product.

[0004] From 4G technology to the existing 5G technology, most of the changes are aimed at improving the network transmission rate and do not effectively expand the communication range. Therefore, if the communication device is installed in an improper position, signal reception dead zones may occur, affecting network data transmission.

[0005] In view of this, if a device that can effectively improve network transceiver speed and reduce signal reception dead zones can be invented, the above problems can be effectively improved. Summary of the Invention

[0006] The main object of the present invention is to provide a wireless signal transmission device that can reduce signal reception dead zones and improve the efficiency of network signal transmission and reception.

[0007] To achieve the above object, the present invention provides a wireless signal transmission device, including a housing and a plurality of communication modules. A plurality of installation parts are spaced on the inner sidewall of the housing, and the plurality of communication modules are respectively disposed on the plurality of installation parts. Each communication module includes a circuit board disposed on the housing, a signal transceiver unit disposed on the housing and connected to one end of the circuit board, and a first heat sink mounted on the housing and connected to the signal transceiver unit.

[0008] It is characterized in that the signal transceiver unit is a millimeter wave signal transceiver unit.

[0009] It is characterized in that the first heat sink includes a body with an installation recess, and the installation recess covers the signal transceiver unit and the circuit board. Heat dissipation fins are disposed on the body and on the other side relative to the installation recess.

[0010] It is characterized in that the wireless signal transmission device further includes a connection unit disposed on the signal transceiver unit, and the signal transceiver unit is attached to the installation recess through the connection unit.

[0011] It is characterized in that the wireless signal transmission device further comprises a plurality of locking components, which penetrate through the first heat sink to fix the first heat sink on the housing.

[0012] It is characterized in that the wireless signal transmission device further comprises a plurality of filling units respectively filled between the installation recess and the circuit board, and between the first heat sink and the housing.

[0013] It is characterized in that the plurality of filling units are foams.

[0014] It is characterized in that the wireless signal transmission device further comprises an insulating unit disposed between the circuit board and the filling unit.

[0015] It is characterized in that the wireless signal transmission device further comprises an electronic device disposed in the housing and connected to the circuit board, and the electronic device can generate signals and transmit them to the circuit board, so that the circuit board controls the signal transceiver unit to transmit the signals.

[0016] It is characterized in that the wireless signal transmission device further comprises a second heat sink, which is disposed in the housing and connected to the electronic device. Description of the Drawings

[0017] Figure 1 It is a three-dimensional installation schematic diagram of an embodiment of the present invention.

[0018] Figure 2 It is a three-dimensional internal structure schematic diagram of an embodiment of the present invention.

[0019] Figure 3 It is an exploded view of the communication module assembly of an embodiment of the present invention.

[0020] Figure 4 It is a block diagram of an embodiment of the present invention.

[0021] Description of the Main Component Symbols

[0022] Wireless signal transmission device 1

[0023] Housing 10

[0024] Bottom plate 12

[0025] Inner side wall 14

[0026] Installation part 16

[0027] Installation part 16'

[0028] Installation part 16''

[0029] Communication module 20

[0030] Communication module 20'

[0031] Communication module 20''

[0032] Circuit board 21

[0033] First signal port 210

[0034] Second signal port 212

[0035] Power supply port 214

[0036] Signal transceiver unit 22

[0037] Signal surface 220

[0038] Connection surface 222

[0039] First heat sink 23

[0040] Locking component 230

[0041] Body 232

[0042] Fixed seat 232a

[0043] Installation recess 234

[0044] Heat dissipation fins 236

[0045] Connection unit 24

[0046] Filling unit 25

[0047] Power cord 26

[0048] Insulating unit 27

[0049] Electronic device 30

[0050] Second heat sink 32

[0051] External device 40

[0052] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific embodiments

[0053] For the convenience of those of ordinary skill in the art to understand and implement the present invention, the following is a further detailed description of the present invention in conjunction with the drawings and embodiments. It should be understood that the embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0054] The present invention provides a wireless signal transmission device, which can be combined with an electronic device to provide the electronic device with high-speed communication transmission technology, such as 5G technology, and can provide a 360-degree signal reception range technology. Please refer to Figure 1, in this embodiment, the electronic device can be a camera. The wireless signal transmission device 1 can be a wireless camera transmission device. The wireless signal transmission device 1 can be installed on the ceiling or wall as a monitor to transmit the captured images to the cloud device for image information management.

[0055] Next, please refer to Figure 2 , to illustrate the structure of the wireless signal transmission device 1. The wireless signal transmission device 1 includes a housing 10, a plurality of communication modules 20, 20', 20", and an electronic device 30. The housing 10 has a bottom plate 12 and an inner sidewall 14. The inner sidewall 14 is substantially perpendicular to the bottom plate 12 and extends along the Z-axis direction, and the inner sidewall 14 surrounds the bottom plate 12. A plurality of mounting portions 16, 16', 16" are spaced apart on the inner sidewall 14. In this embodiment, the plurality of mounting portions 16, 16', 16" are arranged at equal intervals around the inner sidewall 14 and extend along the Z-axis direction.

[0056] The plurality of communication modules 20, 20', 20" can be network communication modules, such as 5G network communication modules. The plurality of communication modules 20, 20', 20" are respectively arranged on the plurality of mounting portions 16, 16', 16". Due to the arrangement of the plurality of communication modules 20, 20', 20" at equal intervals around the inner sidewall 14, the communication ranges of the plurality of communication modules 20, 20', 20" can complement each other, and signals at any angle can be effectively received and transmitted, reducing signal reception dead spots and having good communication effects.

[0057] Please refer to Figure 2 and in conjunction with reference to Figure 3 , to illustrate in detail the structure of the communication modules 20, 20', 20". Since the structures of each of the communication modules 20, 20', 20" are the same, only the communication module 20 will be described here, and the structures of the remaining communication modules 20', 20" will not be elaborated. The communication module 20 includes a circuit board 21, a signal transceiver unit 22, a first heat sink 23, a connection unit 24, a plurality of filling units 25, and a power line 26.

[0058] The circuit board 21 is disposed on the housing 10 and connected to the electronic device 30. The circuit board 21 can be a printed circuit board or a flexible circuit board. In this embodiment, the circuit board 21 is a flexible circuit board. One end of the circuit board 21 is disposed on the bottom plate 12 and extends towards the central region of the bottom plate 12. One end of the circuit board 21 is provided with a first signal port 210 to connect to the electronic device 30. The other end of the circuit board 21 is bent along the inner sidewall 14 and disposed on the inner sidewall 14, extending along the Z-axis direction. The other end of the circuit board 21 is provided with a second signal port 212 and a power port 214. The second signal port 212 and the power port 214 are arranged side by side along the Z-axis direction. The signal port 210 is connected to the signal transceiver unit 22. The power port 214 is connected to the power line 26. The circuit board 21 can be used to control the operation of the signal transceiver unit 22 and exchange signals with the electronic device 30.

[0059] The power line 26 is disposed within the housing 10 and connects the circuit board 21 and the electronic device 30. The power line 26 is a general wire capable of transmitting electrical energy. The power line 26 is connected to the circuit board 21 through the power port 212 to supply the electrical energy of the electronic device 30 to the circuit board 21, enabling the circuit board 21 to operate and supply electrical energy to the signal transceiver unit 22, so that the signal transceiver unit 22 can emit signals.

[0060] The signal transceiver unit 22 is disposed on the sidewall 14 of the housing 10, connected to one end of the circuit board 21, and located on top of the circuit board 21. The signal transceiver unit 22 is in a long strip structure and can extend along the Z direction. In this embodiment, the signal transceiver unit 22 can be a millimeter wave (mmWave) signal transceiver unit 22, such as a millimeter wave antenna or a millimeter wave transceiver chip, or other devices capable of transmitting and receiving millimeter wave signals.

[0061] The first heat sink 23 is installed on the housing 10 and adjacent to the inner sidewall 14. In this embodiment, the first heat sink 23 is fixed to the housing 10 by a plurality of locking components 230. The first heat sink 23 is also connected to the signal transceiver unit 22 to guide the heat energy generated by the signal transceiver unit 22 and dissipate the heat energy. The first heat sink 23 includes a body 232, a mounting recess 234, and a heat dissipation fin 236. A fixing base 232a extends vertically from the bottom of the body 232, and the plurality of locking components 230 pass through 232a to lock the first heat sink 23 to the bottom plate 12 of the housing 10. The mounting recess 234 is provided on one side of the body 232. The mounting recess 234 can be a strip-shaped structure and can extend along the Z-axis direction. The heat dissipation fin 236 is also provided on the body 232 and is on the other side relative to the mounting recess 234. The heat dissipation fin 236 extends outward along the X-axis direction. The signal transceiver unit 22 is located in the mounting recess 234. The transceiver unit 22 has a signal surface 220 and a connection surface 222. The signal surface 220 is exposed in the mounting recess 234 and faces the sidewall 14. The connection surface 222 is connected to the connection unit 24. The mounting recess 234 can cover the signal transceiver unit 22.

[0062] The connection unit 24 is provided on the signal transceiver unit 22, and the signal transceiver unit 22 is attached to the mounting recess 234 through the connection unit 24. In this embodiment, the connection unit 24 can be a tape for electrical and electronic devices. Attaching the signal transceiver unit 22 to the mounting recess 234 can effectively transfer the heat energy to the first heat sink 23, and dissipate the heat energy through the heat dissipation fin 236.

[0063] A plurality of filling units 25 are respectively filled between the mounting recess 234 and the circuit board 21, and between the first heat sink 23 and the housing 10. In this embodiment, the filling unit 25 is a foam, such as an ethylene-vinyl acetate (EVA) filler, to fix the signal transceiver unit 22 and the circuit board 21 and prevent the signal transceiver unit 22 and the circuit board 21 from shaking. In addition, an insulating unit 27 can be provided between the circuit board 21 and the filling unit 25 to insulate the circuit board 21 and prevent leakage. In this embodiment, the insulating unit 27 can be an insulating material such as a polyester film (Mylar).

[0064] Please reply with reference to Figure 2 , to illustrate the installation position of the electronic device 30. The electronic device 30 is arranged in the housing 10 and connected to the communication modules 20, 20', 20". A second heat sink 32 is also provided in the housing 10 and on the electronic device 30 to dissipate the heat energy generated by the electronic device 30. Please refer to Figure 4, the electronic device 30 is signal - connected to the signal transceiver unit 22 through the connection circuit board 21. The electronic device 30 can generate a signal and transmit it to the circuit board 21, enabling the circuit board 21 to control the signal transceiver unit 22 to transmit the signal.

[0065] For example, the electronic device 30 of this embodiment can be a photographic device. The electronic device 30 includes a circuit board 21 and a photographic lens, etc. The photographic lens is connected to the circuit board 21 to receive the control of the circuit board 21. The structure of the photographic device belongs to the structure of a camera of a general monitor, so it will not be described in detail. When the photographic device takes an image, the image can be transmitted from the first signal port 210 to the circuit board 21, and then passed to the signal transceiver unit 22 through the second signal port 212. The circuit board 21 also controls the signal transceiver unit 22 to enable the signal transceiver unit 22 to transmit the image to an external device 40, store the image in the external device 40, or perform other data processing. The external device 40 can be a cloud calculator such as a background server that can store data or perform data operations.

[0066] Similarly, when the external device 40 wants to control the photographic device, it can also transmit a control signal to the signal transceiver unit 22 for reception, and then transmit it to the circuit board 21. The circuit board 21 then passes the control signal to the photographic device to make the photographic device act according to the control signal. Since the structures and signal - transmission methods of each communication module 20, 20', 20'' are the same, the communication modules 20', 20'' can also send signals to the external device 40. Therefore, only the communication module 20 will be described in this embodiment, and the signal - transmission methods of the remaining communication modules 20', 20'' will not be described in detail.

[0067] As described above, in this embodiment, by arranging the signal transceiver units around in various angles, the signal - receiving ranges are complementary, reducing the signal - receiving dead - angles, increasing the transmission efficiency, and thus effectively improving the efficiency of network signal reception and transmission.

[0068] In summary, the present invention meets the requirements of an invention patent, and thus a patent application is filed in accordance with the law. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the described embodiment. Equivalent modifications or changes made by those skilled in the art in accordance with the spirit of the present invention should all be covered by the following patent application scope.

Claims

1. A wireless signal transmission device, characterized in that, Comprising: A housing, with a plurality of mounting parts spaced on the inner sidewall; And A plurality of communication modules, respectively disposed on the plurality of mounting parts, and the plurality of communication modules respectively include: A circuit board, disposed on the housing; A signal transceiver unit, disposed on the housing and connected to one end of the circuit board; and A first heat sink, mounted on the housing and connected to the signal transceiver unit.

2. The wireless signal transmission device according to claim 1, wherein The signal transceiver unit is a millimeter-wave signal transceiver unit.

3. The wireless signal transmission device according to claim 1, characterized in that, The first heat sink includes: A body, provided with a mounting recess, and the mounting recess covers the signal transceiver unit; and Heat dissipation fins, disposed on the body and on the other side relative to the mounting recess.

4. The wireless signal transmission device according to claim 3, wherein, Further includes a connecting unit, disposed on the signal transceiver unit, and the signal transceiver unit is attached to the mounting recess through the connecting unit.

5. The wireless signal transmission device as claimed in claim 1, wherein, Further includes a plurality of locking components, passing through the first heat sink to fix the first heat sink on the housing.

6. The wireless signal transmission device as claimed in claim 3, wherein, Further includes a plurality of filling units respectively filling between the mounting recess and the circuit board, and between the first heat sink and the housing.

7. The wireless signal transmission device according to claim 6, wherein, The plurality of filling units are foams.

8. The wireless signal transmission device as claimed in claim 6, wherein Further includes an insulating unit disposed between the circuit board and the filling unit.

9. The wireless signal transmission device according to claim 1, wherein Further includes an electronic device disposed in the housing and connected to the circuit board, and the electronic device can generate a signal and transmit it to the circuit board, so that the circuit board controls the signal transceiver unit to transmit the signal.

10. The wireless signal transmission device according to claim 9, wherein Further includes a second heat sink, disposed in the housing and connected to the electronic device.

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