Gold wire bonding layout method and PCB circuit system

Abstract

The invention provides a gold wire bonding layout method, and belongs to the technical field of chip packaging, and the method comprises the steps: enabling a transmitting terminal signal bonding pad to be bonded and interconnected to a transmitting radio frequency wire through a transmitting terminal S gold wire, enabling a receiving terminal signal bonding pad to be bonded and interconnected to a receiving radio frequency wire through a receiving terminal S gold wire, enabling the transmitting terminal S gold wire and the receiving terminal S gold wire to be orthogonal, and enabling the transmitting terminal S gold wire and the receiving terminal S gold wire to be orthogonal; the transmitting end G gold wire is parallel to the transmitting end S gold wire, and the receiving end G gold wire is parallel to the receiving end S gold wire; the invention further provides a PCB circuit system. A gold wire bonding wire of a transmitting end and a gold wire bonding wire of a receiving end are spatially designed to be in orthogonal cross arrangement, the current direction of an S gold wire of the transmitting end is completely perpendicular to the sensitive direction of the S gold wire of the receiving end in electromagnetic field polarization characteristics, and a near-field electromagnetic coupling path is effectively blocked by using a polarization mismatch principle. Signal crosstalk between transmitting and receiving channels is remarkably reduced, and the isolation degree of the transmitting and receiving channels is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly to a wire bonding layout method and a PCB circuit system. Background Art

[0002] In a radio frequency circuit system, especially in high-frequency applications such as Frequency Modulated Continuous Wave (FMCW) radar, the signal channels of the transmitter (TX) and the receiver (RX) usually operate in the millimeter-wave band (such as 24 GHz, 60 GHz, 77 GHz or even higher frequencies). As the frequency increases, the signal wavelength significantly shortens (for example, the wavelength corresponding to 60 GHz is about 5 mm), which makes the electromagnetic field coupling effect, crosstalk between paths, and parasitic resonance problems particularly prominent. At the same time, in chip layout, the transmitter and the receiver are usually located on two opposite sides. In the interconnection design between a chip and a printed circuit board (PCB), Chip on Board (COB) is a packaging technology that directly mounts a bare chip (unencapsulated chip) on a printed circuit board (PCB) or a substrate, realizes electrical connection through wire bonding or flip-chip soldering, and is protected with materials such as epoxy resin. It eliminates the housing of traditional packages (such as QFP, BGA) and is widely used in scenarios with requirements for miniaturization, high integration, and low cost. Wire Bonding is widely adopted as a low-cost and highly flexible connection method.

[0003] Figure 1The figure shows a top view of a traditional gold wire bonding layout. A groove 2 is provided on a PCB circuit board 1, and a chip 3 of a monolithic integrated transceiver circuit is fixed in the groove 2. A transmitting end signal pad 4 is provided at the transmitting end of the chip 3, and a transmitting RF trace 5 is provided on the corresponding PCB circuit board 1. The transmitting end signal pad 4 and the transmitting RF trace 5 are bonded and connected through a transmitting end gold wire 8. One end of the transmitting end gold wire 8 is bonded to the transmitting end signal pad 4 through a solder ball 6, and the other end of the transmitting end gold wire 8 is bonded to the transmitting RF trace 5 through a solder ball 6. A receiving end signal pad 8 is provided at the receiving end of the chip 3, and a receiving RF trace 9 is provided on the corresponding PCB circuit board 1. The receiving end signal pad 8 and the receiving RF trace 9 are bonded and connected through a receiving end gold wire 10. One end of the receiving end gold wire 10 is bonded to the receiving end signal pad 8 through a solder ball 6, and the other end of the receiving end gold wire 10 is bonded to the receiving RF trace 9 through a solder ball 6. In this traditional gold wire bonding layout, the transmitting end gold wire 8 and the receiving end gold wire 10 often adopt a parallel or approximately parallel orientation. In practical applications, due to the relatively high transmitting signal power (for example, it can reach more than 10 dBm in the 60 GHz band), the electromagnetic energy of the transmitting signal will leak to the receiving channel through the inductive coupling and capacitive coupling paths between the gold wires. Specifically, the closed loop formed by the spatially parallel transmitting end gold wire 8 and receiving end gold wire 10 will excite common mode resonance, generating a strong near-field coupling effect, resulting in a strong coupling between the transmitting end gold wire 8 and the receiving end gold wire 10. This coupling effect causes the transmitting signal to directly crosstalk to the receiving end (RX), which will directly introduce interference of the transmitting signal to the receiving channel, seriously reducing the isolation degree of the transceiver ports, causing saturation of the front end of the receiver, limited dynamic range, deterioration of the signal-to-noise ratio (SNR) and system sensitivity. In addition, the leaked signal interacts with the local oscillator signal in the mixer to generate low-frequency interference components (such as baseband spurs), further reducing the signal-to-noise ratio of the useful signal. This problem is particularly prominent in multi-channel radar or high-density integrated systems, seriously restricting the system performance and reliability.

[0004] In the prior art, in order to suppress the coupling interference introduced by gold wire bonding, methods such as increasing the gold wire spacing, introducing a shielding structure or optimizing the grounding design are usually adopted. Existing solutions often ignore the fundamental influence of the geometric distribution of gold wires on the electromagnetic field coupling mode. Especially in the millimeter wave band, the traditional parallel or approximately parallel gold wire orientation layout is prone to excite common mode resonance, further exacerbating signal leakage. Experimental data shows that the transceiver isolation degree of traditional parallel gold wire bonding in the 60 GHz band is generally lower than 25 dB, which is difficult to meet the requirement of ≥35 dB for the isolation degree of high-precision radar systems. On the other hand, the mechanical reliability of gold wire bonding is also a key challenge. In the prior art, the asymmetric layout or complex shielding structure adopted to reduce coupling may lead to problems such as uneven gold wire length and stress concentration, affecting the long-term stability. Therefore, how to balance the mechanical reliability while optimizing the electromagnetic performance has become the core problem in the design of high-frequency RF circuits. Summary of the Invention

[0005] The technical problem to be solved by the present invention is: how to solve the problem of low transceiver isolation degree existing in the layout of gold wire with parallel or approximately parallel running directions.

[0006] The present invention solves the above technical problem through the following technical solutions: a gold wire bonding layout method, the method includes: bonding and interconnecting the transmitting end signal pad to the transmitting RF trace through the transmitting end S gold wire, bonding and interconnecting the receiving end signal pad to the receiving RF trace through the receiving end S gold wire, the transmitting end S gold wire is orthogonal to the receiving end S gold wire, the transmitting end G gold wire is parallel to the transmitting end S gold wire, and the receiving end G gold wire is parallel to the receiving end S gold wire.

[0007] Preferably, the fact that the transmitting end S gold wire is orthogonal to the receiving end S gold wire means that the projection of the transmitting end S gold wire on the chip is perpendicular to the projection of the receiving end S gold wire on the chip, the fact that the transmitting end G gold wire is parallel to the transmitting end S gold wire means that the projection of the transmitting end G gold wire on the chip is parallel to the projection of the transmitting end S gold wire on the chip, and the fact that the receiving end G gold wire is parallel to the receiving end S gold wire means that the projection of the receiving end G gold wire on the chip is parallel to the projection of the receiving end S gold wire on the chip.

[0008] Preferably, the transmitting end signal pad and the receiving end signal pad are located on both sides of the center line of the PCB. The included angle α between the projection of the transmitting end S gold wire on the chip and the center line of the PCB, and the included angle between the projection of the receiving end S gold wire on the chip and the central axis of the PCB is 90° - α, where 20° ≤ α ≤ 70°.

[0009] Preferably, the included angle α between the projection of the transmitting end S gold wire on the chip and the center line of the PCB is 45°.

[0010] Preferably, the loop geometric parameters of the transmitting end S gold wire and the receiving end S gold wire are symmetrically distributed in a mirror image with the center line of the PCB as the axis of symmetry, and the loop geometric parameters of the transmitting end G gold wire and the receiving end G gold wire are symmetrically distributed in a mirror image with the center line of the PCB as the axis of symmetry.

[0011] The present invention also provides a PCB circuit system, adopting the above gold wire bonding layout method. The circuit system includes a PCB circuit board and a chip located on the PCB circuit board. The transmitting end signal pad is located at the transmitting end of the chip, the transmitting RF trace is located on the PCB circuit board and is opposite to the transmitting end, the receiving end signal pad is located at the receiving end of the chip, the receiving RF trace is located on the PCB circuit board and is opposite to the receiving end. The transmitting end and the receiving end of the chip are respectively located on two opposite sides of the chip, and ground planes are respectively arranged on both sides of the transmitting RF trace and the receiving RF trace.

[0012] Preferably, there is a transmitting-end ground pad on each side of the transmitting-end signal pad. The two transmitting-end ground pads are respectively interconnected to the ground plates on both sides of the transmitting RF trace through gold wire bonding of the transmitting-end G. There is a receiving-end ground pad on each side of the receiving-end signal pad. The two receiving-end ground pads are respectively interconnected to the ground plates on both sides of the receiving RF trace through gold wire bonding of the receiving-end G.

[0013] Preferably, the circuit system further includes solder balls. One end of the transmitting-end S gold wire is bonded to the transmitting-end signal pad through a solder ball, and the other end is bonded to the transmitting RF trace through a solder ball. One end of the transmitting-end G gold wire is bonded to the transmitting-end ground pad through a solder ball, and the other end is bonded to the ground plate through a solder ball. One end of the receiving-end S gold wire is bonded to the receiving-end signal pad through a solder ball, and the other end is bonded to the receiving RF trace through a solder ball. One end of the receiving-end G gold wire is bonded to the receiving-end ground pad through a solder ball, and the other end is bonded to the ground plate through a solder ball.

[0014] Preferably, the PCB circuit board is provided with a groove, and the chip is located in the groove.

[0015] Preferably, the circuit system further includes a transmitting antenna and a receiving antenna. The transmitting antenna is connected to the transmitting RF trace, and the receiving antenna is connected to the receiving RF trace.

[0016] The advantages provided by the present invention are as follows;

[0017] 1. In the present invention, the gold wire bonding wires at the transmitting end and the gold wire bonding wires at the receiving end are designed to be orthogonally cross-arranged in space. Through this orthogonal layout, the current direction of the transmitting-end S gold wire and the sensitive direction of the receiving-end S gold wire are completely perpendicular in terms of the electromagnetic field polarization characteristics. By using the polarization mismatch principle, the near-field electromagnetic coupling path is effectively blocked, and the electric field coupling attenuation can reach more than 20 dB. A local electromagnetic shielding structure is formed in the PCB interconnection layer, which directionally weakens the coupling electric field and magnetic field components from the transmitting end to the receiving end. Thus, the signal crosstalk between the transmitting and receiving channels is significantly reduced, the isolation degree between the transmitting and receiving channels is significantly improved, the leakage intensity of the TX signal to the RX channel is effectively suppressed, the signal-to-noise ratio (SNR) of the system is significantly improved, and the RF signal performance is improved, especially suitable for high-sensitivity scenarios such as millimeter-wave radar and 5G communication.

[0018] 2. In the present invention, at the 60 GHz frequency band, the port isolation degree from the transmitting end to the receiving end is increased from 25 dB of the traditional parallel structure to more than 35 dB.

[0019] 3. The orthogonal gold wire bonding structure of the present invention does not require an additional shielding cover or complex filtering circuit, which reduces the mechanical risk introduced by the additional structure. It is directly compatible with the existing packaging process. While achieving high-performance isolation, it takes into account the high efficiency and cost controllability of system integration. It can take into account both mechanical reliability and electromagnetic compatibility, thus solving the core problem of optimizing electromagnetic performance while taking into account mechanical reliability in high-frequency RF circuit design.

[0020] 4. The present invention can significantly suppress common mode resonance by symmetrically arranging geometric parameters of the gold wire loop. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A top view of a conventional gold wire bonding layout;

[0022] Figure 2 A top view of the gold wire bonding layout provided in Embodiment 1 of the present invention;

[0023] Figure 3 A top view of a PCB circuit system provided in Embodiment 2 of the present invention;

[0024] Figure 4 A schematic diagram showing a comparison of isolation between the gold wire bonding layout method provided in Example 1 of the present invention and a traditional gold wire bonding layout method;

[0025] In the figure: 10 PCB circuit board, 20 groove, 30 chip, 40 transmitter signal pad, 50 transmitter RF wiring, 51 transmitter grounding plate, 52 transmitter antenna, 60 solder ball, 71 transmitter S gold wire, 72 transmitter G gold wire, 80 receiver signal pad, 90 receiver RF wiring, 91 receiver grounding plate, 92 receiver antenna, 101 receiver S gold wire, 102 receiver G gold wire. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the technical solution of the present invention is clearly and completely described below in combination with specific embodiments and with reference to the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] Example 1

[0028] See also Figure 2This embodiment provides a gold wire bonding layout method, including: bonding and interconnecting the transmitter signal pad 40 to the transmitter RF trace 50 through the transmitter S gold wire 70, bonding and interconnecting the receiver signal pad 80 to the receiver RF trace 90 through the receiver S gold wire 101, the transmitter S gold wire 71 is orthogonal to the receiver S gold wire 101, the transmitter G gold wire 72 is parallel to the transmitter S gold wire 71, and the receiver G gold wire 102 is parallel to the receiver S gold wire 101.

[0029] The present invention is directed to Figure 1 The traditional parallel or nearly parallel gold wire bonding layout has the problem of insufficient isolation between transmitter and receiver due to strong electromagnetic coupling in the millimeter wave frequency band. Focusing on the fundamental influence of the geometric distribution of gold wires on the electromagnetic field coupling mode (inductive coupling is caused by the mutual inductance effect caused by the current change, and capacitive coupling is the distributed capacitance formed by the voltage difference between the gold wires), the gold wire bonding wires at the transmitting end and the gold wire bonding wires at the receiving end are designed to be orthogonally arranged in space. Through this orthogonal layout, the current direction of the S gold wire 70 at the transmitting end and the sensitive direction of the S gold wire 101 at the receiving end are in the electromagnetic field polarization characteristics. The PCB is completely vertical, and the polarization mismatch principle is used to effectively block the near-field electromagnetic coupling path. The electric field coupling attenuation can reach more than 20dB, forming a local electromagnetic shielding structure on the PCB interconnection layer, directionally weakening the coupling electric and magnetic field components from the transmitter to the receiver, thereby significantly reducing the signal crosstalk between the transmit and receive channels, significantly improving the isolation between the transmit and receive channels, and effectively suppressing the leakage strength of the TX signal to the RX channel, so that the system signal-to-noise ratio (SNR) is significantly improved, and the RF signal performance is improved, which is especially suitable for high-sensitivity scenarios such as millimeter-wave radar and 5G communication. Figure 4 , in the 60GHz frequency band, the port isolation from the transmitter to the receiver is increased from 25dB in the traditional parallel structure to more than 35dB.

[0030] In addition, the orthogonal gold wire bonding structure does not require an additional shielding cover or complex filtering circuit, reducing the mechanical risks introduced by the additional structure. It is directly compatible with existing packaging processes. While achieving high-performance isolation, it takes into account the efficiency and cost controllability of system integration. It can take into account both mechanical reliability and electromagnetic compatibility, thus solving the core problem of optimizing electromagnetic performance while taking into account mechanical reliability in high-frequency RF circuit design.

[0031] It should be noted that the S gold wire at the transmitting end of the present invention refers to the signal gold wire at the transmitting end, where S refers to Signal, and the G gold wire at the transmitting end refers to the grounding gold wire at the transmitting end, where G refers to GND. Similarly, the S gold wire at the receiving end refers to the signal gold wire at the receiving end, where S refers to Signal, and the G gold wire at the receiving end refers to the grounding gold wire at the receiving end, where G refers to GND.

[0032] The orthogonality of the transmitting - end S - wire 71 and the receiving - end S - wire 101 means that the projection of the transmitting - end S - wire 71 on the chip 30 is perpendicular to the projection of the receiving - end S - wire 101 on the chip 30. The parallelism of the transmitting - end G - wire 72 and the transmitting - end S - wire 71 means that the projection of the transmitting - end G - wire 72 on the chip 30 is parallel to the projection of the transmitting - end S - wire 71 on the chip 30. The parallelism of the receiving - end G - wire 102 and the receiving - end S - wire 101 means that the projection of the receiving - end G - wire 102 on the chip 30 is parallel to the projection of the receiving - end S - wire 101 on the chip 30.

[0033] The transmitting - end signal pad 40 and the receiving - end signal pad 80 are located on both sides of the PCB center line. The angle α between the projection of the transmitting - end S - wire 71 on the chip 30 and the PCB center line, and the angle between the projection of the receiving - end S - wire 101 on the chip 30 and the PCB central axis is 90°−α, where 20°≤α≤70°.

[0034] See Figure 3 , taking the PCB center line as the X - axis direction and the direction perpendicular to the PCB center line as the Y - axis direction. Taking the orientation in the figure as an example, the left - hand side is the - X - axis direction and the lower - hand side is the - Y - axis direction. The angle between the transmitting - end S - wire 71 and the horizontal direction (-X - axis) is 45°, and the angle between the receiving - end S - wire 101 and the horizontal direction (X - axis) is 45°. The transmitting - end S - wire 71 and the receiving - end S - wire 101 form a strictly 90° orthogonal cross - structure in three - dimensional space. Through this orthogonal layout, the current direction of the transmitting - end S - wire 71 and the sensitive direction of the receiving - end S - wire 101 are completely perpendicular in terms of the electromagnetic - field polarization characteristics, effectively blocking the near - field coupling path.

[0035] The loop geometric parameters of the transmitting - end S - wire 71 and the receiving - end S - wire 101 are mirror - symmetrically distributed with respect to the PCB center line as the axis of symmetry. The loop geometric parameters of the transmitting - end G - wire 71 and the receiving - end G - wire 101 are mirror - symmetrically distributed with respect to the PCB center line as the axis of symmetry. The loop geometric parameters include arc height and span. By the symmetric layout of the gold - wire loop geometric parameters, the common - mode resonance can be significantly suppressed.

[0036] Through the spatial orthogonal arrangement and electromagnetic - field collaborative regulation, the present invention realizes the efficient isolation of the transceiver path at the physical layer, providing a low - complexity and high - reliability solution for high - density radio - frequency system integration. The present invention is particularly suitable for FMCW systems. When the transmitting - signal frequency is relatively high (such as 60 GHz), it can reduce the direct - leakage interference and make the received echo signal clearer.

[0037] Embodiment 2

[0038] The difference between this embodiment and Embodiment 1 is as follows: This embodiment provides a PCB circuit system, adopting the gold wire bonding layout method of Embodiment 1. The circuit system includes a PCB circuit board 10 and a chip 30 located on the PCB circuit board 10. Specifically, a groove 20 is provided on the PCB circuit board 10, and the chip 30 is located within the groove 20. The transmitting end signal pad 40 is located at the transmitting end of the chip 30. The transmitting RF trace 50 is located on the PCB circuit board 10 and is opposite to the transmitting end. The receiving end signal pad 80 is located at the receiving end of the chip 30. The receiving RF trace 90 is located on the PCB circuit board 10 and is opposite to the receiving end. The transmitting end and the receiving end of the chip 30 are respectively located on two opposite sides of the chip 30. Ground planes are provided on both sides of the transmitting RF trace 50 and the receiving RF trace 90. Specifically, transmitting end ground planes 51 are provided on both sides of the transmitting RF trace 50, and receiving end ground planes 91 are provided on both sides of the receiving RF trace 90.

[0039] There is a transmitting end ground pad on each side of the transmitting end signal pad 40. The two transmitting end ground pads are respectively bonded and interconnected to the ground planes on both sides of the transmitting RF trace 50 through transmitting end G gold wires 72. Specifically, the transmitting end ground pad on the left side of the transmitting end signal pad 40 is bonded and interconnected to the transmitting end ground plane 51 on the left side of the transmitting RF trace 50 through a transmitting end G gold wire 72, and the transmitting end ground pad on the right side of the transmitting end signal pad 40 is bonded and interconnected to the transmitting end ground plane 51 on the right side of the transmitting RF trace 50 through a transmitting end G gold wire 72. There is a receiving end ground pad on each side of the receiving end signal pad 80. The two receiving end ground pads are respectively bonded and interconnected to the ground planes on both sides of the receiving RF trace 90 through receiving end G gold wires 102. Specifically, the receiving end ground pad on the left side of the receiving end signal pad 80 is bonded and interconnected to the receiving end ground plane 91 on the left side of the receiving RF trace 90 through a receiving end G gold wire 102, and the receiving end ground pad on the right side of the receiving end signal pad 80 is bonded and interconnected to the receiving end ground plane 91 on the right side of the receiving RF trace 90 through a receiving end G gold wire 102.

[0040] One end of the transmitting end S gold wire 71 is bonded to the transmitting end signal pad 40 through a solder ball 60, and the other end of the transmitting end S gold wire 71 is bonded to the transmitting RF trace 50 through a solder ball 60. One end of the transmitting end G gold wire 72 is bonded to the transmitting end ground pad through a solder ball 60, and the other end of the transmitting end G gold wire 72 is bonded to the transmitting end ground plane 51 through a solder ball 60. One end of the receiving end S gold wire 101 is bonded to the receiving end signal pad 80 through a solder ball 60, and the other end of the receiving end S gold wire 101 is bonded to the receiving RF trace 90 through a solder ball 60. One end of the receiving end G gold wire 102 is bonded to the receiving end ground pad through a solder ball 60, and the other end of the receiving end G gold wire 102 is bonded to the receiving end ground plane 91 through a solder ball 60.

[0041] See Figure 3, the circuit system further includes a transmitting antenna 52 and a receiving antenna 92. The transmitting antenna 52 is connected to a transmitting RF trace 50, and the receiving antenna 92 is connected to a receiving RF trace 90.

[0042] The PCB circuit system of the present invention is fully compatible with the existing COB packaging process, without complex structural modifications or additional masks, providing a solution with high isolation and high reliability for high-density RF systems such as millimeter-wave radars and 5G communications.

[0043] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. Gold wire bonding layout method, characterized in that: The method includes: Bonding the transmitting - end signal pad to the transmitting RF trace through the transmitting - end S gold wire bonding, bonding the receiving - end signal pad to the receiving RF trace through the receiving - end S gold wire bonding. The transmitting - end S gold wire and the receiving - end S gold wire are orthogonal. The transmitting - end G gold wire is parallel to the transmitting - end S gold wire, and the receiving - end G gold wire is parallel to the receiving - end S gold wire.

2. The gold wire bonding layout method according to claim 1, wherein: The fact that the transmitting - end S gold wire and the receiving - end S gold wire are orthogonal means that the projection of the transmitting - end S gold wire on the chip is perpendicular to the projection of the receiving - end S gold wire on the chip. The fact that the transmitting - end G gold wire is parallel to the transmitting - end S gold wire means that the projection of the transmitting - end G gold wire on the chip is parallel to the projection of the transmitting - end S gold wire on the chip. The fact that the receiving - end G gold wire is parallel to the receiving - end S gold wire means that the projection of the receiving - end G gold wire on the chip is parallel to the projection of the receiving - end S gold wire on the chip.

3. The wire bonding layout method according to claim 1, characterized in that: The transmitting - end signal pad and the receiving - end signal pad are located on both sides of the PCB center line. The angle α between the projection of the transmitting - end S gold wire on the chip and the PCB center line, and the angle between the projection of the receiving - end S gold wire on the chip and the PCB central axis is 90° - α, where 20° ≤ α ≤ 70°.

4. The gold wire bonding layout method according to claim 3, wherein: The angle α between the projection of the transmitting - end S gold wire on the chip and the PCB center line is 45°.

5. The gold wire bonding layout method according to claim 1, characterized in that: The loop geometric parameters of the transmitting - end S gold wire and the receiving - end S gold wire are mirror - symmetrically distributed with respect to the PCB center line as the axis of symmetry. The loop geometric parameters of the transmitting - end G gold wire and the receiving - end G gold wire are mirror - symmetrically distributed with respect to the PCB center line as the axis of symmetry.

6. A PCB circuit system, adopting the gold wire bonding layout method according to any one of claims 1-5, characterized in that: The circuit system includes a PCB board and a chip located on the PCB board. The transmitting - end signal pad is located at the transmitting end of the chip. The transmitting RF trace is located on the PCB board and is opposite to the transmitting end. The receiving - end signal pad is located at the receiving end of the chip. The receiving RF trace is located on the PCB board and is opposite to the receiving end. The transmitting end and the receiving end of the chip are respectively located on two opposite sides of the chip. Ground planes are respectively provided on both sides of the transmitting RF trace and the receiving RF trace.

7. The PCB circuit system according to claim 6, wherein: There is a transmitting - end ground pad on each side of the transmitting - end signal pad. The two transmitting - end ground pads are respectively bonded and interconnected to the ground planes on both sides of the transmitting RF trace through the transmitting - end G gold wire bonding. There is a receiving - end ground pad on each side of the receiving - end signal pad. The two receiving - end ground pads are respectively bonded and interconnected to the ground planes on both sides of the receiving RF trace through the receiving - end G gold wire bonding.

8. The PCB circuit system according to claim 6, wherein: The circuit system further includes solder balls. One end of the transmitting - end S gold wire is bonded to the transmitting - end signal pad through a solder ball, and the other end is bonded to the transmitting RF trace through a solder ball. One end of the transmitting - end G gold wire is bonded to the transmitting - end ground pad through a solder ball, and the other end is bonded to the ground plane through a solder ball. One end of the receiving - end S gold wire is bonded to the receiving - end signal pad through a solder ball, and the other end is bonded to the receiving RF trace through a solder ball. One end of the receiving - end G gold wire is bonded to the receiving - end ground pad through a solder ball, and the other end is bonded to the ground plane through a solder ball.

9. The PCB circuit system according to claim 6, wherein: There is a groove on the PCB board, and the chip is located in the groove.

10. The PCB circuit system according to claim 6, wherein: The circuit system further includes a transmitting antenna and a receiving antenna. The transmitting antenna is connected to the transmitting RF trace, and the receiving antenna is connected to the receiving RF trace.

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