Heating and ventilation controller and heating and ventilation system

Abstract

The invention discloses a heating and ventilation controller and a heating and ventilation system, and the heating and ventilation controller comprises a circuit wiring substrate, the first side surface of the circuit wiring substrate is provided with a power device and a peripheral circuit device, and the peripheral circuit device is connected with the power device; the heat dissipation assembly is in contact with the heat dissipation surface of the power device; the supporting piece comprises a supporting plate and an enclosure, the supporting plate and the enclosure are integrally formed, the supporting plate is arranged between the body of the power device and the circuit wiring substrate, the enclosure encloses pins of the power device and the peripheral circuit devices to form a plurality of enclosure areas, and the enclosure areas are arranged between the pins of the power device and the peripheral circuit devices. Therefore, the fluid-shaped three-proofing glue is poured into the enclosure area, and the pins and the peripheral circuit devices are well sealed after the three-proofing glue is cured, so that an anti-corrosion or anti-condensation effect is achieved.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and in particular to a HVAC controller and a HVAC system. Background Art

[0002] The HVAC controller includes multiple power devices such as rectifier bridge, PFC (Power Factor Corrector) switch tube, diode, inverter module, etc. These power devices will generate a lot of heat when working. In order to ensure their normal operation and life, heat dissipation treatment is required.

[0003] At present, a commonly used heat dissipation method is to set a radiator above the power device, flow a refrigerant through the radiator, and take away the heat generated by the power device through the heat transfer effect of the refrigerant, thereby achieving the purpose of heat dissipation.

[0004] However, since the power device and the peripheral circuit devices near the power device will be fixed under the heat sink and blocked by the heat sink, it is more difficult to cover the pins of the power device and the peripheral circuit devices near the power device with the three-proof adhesive, resulting in the pins of the power device and the peripheral circuit devices near the power device being at risk of corrosion or condensation short circuit. Summary of the invention

[0005] The purpose of this application is to propose a HVAC controller and a HVAC system to address the deficiencies of the above-mentioned prior art, and this purpose is achieved through the following technical solutions.

[0006] The first aspect of the present application provides a HVAC controller, comprising:

[0007] A circuit wiring substrate, wherein a power device and a peripheral circuit device are arranged on a first side surface of the circuit wiring substrate, and the peripheral circuit device is connected to the power device;

[0008] A heat dissipation component, the heat dissipation component is in contact with a heat dissipation surface of the power device;

[0009] A support member, wherein the support member includes a support plate and an enclosure, wherein the support plate and the enclosure are integrally formed, and wherein the support plate is disposed between the body of the power device and the circuit wiring substrate, and wherein the enclosure encloses the pins of the power device and the peripheral circuit devices and forms a plurality of enclosure areas, wherein the enclosure areas are used for glue pouring.

[0010] In some embodiments of the present application, the enclosure includes a first type of enclosure and a second type of enclosure;

[0011] The first type of enclosure surrounds a portion of the edge of the power device, and a portion of the first type of enclosure and the second type of enclosure together form the enclosure area.

[0012] In some embodiments of the present application, the height of the enclosure is greater than the height of the pins of the power device relative to the first side surface of the circuit wiring substrate;

[0013] The height of the enclosure is greater than the height of the peripheral circuit device relative to the first side surface of the circuit wiring substrate.

[0014] In some embodiments of the present application, the shape of the enclosure area includes a regular shape and / or an irregular shape;

[0015] In some embodiments of the present application, a first positioning hole and a second positioning hole are provided on the support plate, and the first positioning hole and the second positioning hole are located in a contact area of the support plate with the body of the power device;

[0016] The power device is provided with a third positioning hole matching the first positioning hole and a fourth positioning hole matching the second positioning hole.

[0017] In some embodiments of the present application, a first boss is provided on a side of the support plate close to the circuit wiring substrate, and a limiting hole corresponding to and matching the first boss is provided on the circuit wiring substrate.

[0018] In some embodiments of the present application, the first positioning hole passes through the first boss.

[0019] In some embodiments of the present application, a first screw is further included, and the first screw passes through the limiting hole of the circuit wiring substrate, the first positioning hole of the support plate, and the third positioning hole of the power device to be fixedly connected.

[0020] In some embodiments of the present application, a second screw is further included, and the second screw passes through the second positioning hole of the support plate and is fixedly connected to the fourth positioning hole of the power device.

[0021] In some embodiments of the present application, the heat dissipation assembly includes a radiator, a refrigerant heat dissipation pipe, and a cover plate;

[0022] The cover plate is covered on the radiator, an accommodating channel is provided between the radiator and the cover plate, the refrigerant heat dissipation pipe is passed through the accommodating channel, and the surface of the radiator facing away from the cover plate contacts the heat dissipation surface of the power device.

[0023] In some embodiments of the present application, space for a glue spray gun is reserved between the second type of enclosure and the radiator.

[0024] In some embodiments of the present application, the height of the enclosure is smaller than the height of a surface of the heat sink away from the power device relative to the first side surface of the circuit wiring substrate.

[0025] In some embodiments of the present application, a second boss is provided on a surface of the support plate close to the power device, and the second boss is located in a non-contact area of the support plate with the body of the power device;

[0026] A limiting hole matching the second boss is provided on the surface of the radiator.

[0027] In some embodiments of the present application, a third screw is further included, and a fifth positioning hole is further provided on the support plate, and the fifth positioning hole is located in a non-contact area of the support plate with the body of the power device;

[0028] The third screw passes through the fifth positioning hole to make the heat dissipation surface of the power device contact with the surface of the radiator.

[0029] In some embodiments of the present application, the refrigerant heat dissipation pipe is arranged in a meandering shape between the radiator and the cover plate.

[0030] In some embodiments of the present application, the refrigerant heat dissipation pipe is U-shaped.

[0031] In some embodiments of the present application, a first heat-conducting medium layer is provided on a surface of the radiator in contact with the power device.

[0032] In some embodiments of the present application, a second heat-conducting medium layer is provided on a contact surface of the accommodating channel with the radiator.

[0033] In some embodiments of the present application, the height of the support plate relative to the first side surface of the circuit wiring substrate is a preset height, and the preset height makes the length of the pins of the power device protruding from the second side surface of the circuit wiring substrate be a preset length.

[0034] In some embodiments of the present application, pads matching the pins of the power device are provided on the second side surface of the circuit wiring substrate, and the pins of the power device are connected to the pads.

[0035] In some embodiments of the present application, the power device includes at least one of a rectifier bridge, a power factor correction PFC switch tube, a diode, and an inverter module.

[0036] In some embodiments of the present application, the rectifier bridge, the PFC switch tube, the diode, and the inverter module are arranged along the extending direction of the heat dissipation assembly.

[0037] In some embodiments of the present application, a packaged device is also provided on the first side surface of the circuit wiring substrate, and the packaged device includes at least two of a rectifier bridge, a PFC switch tube, a diode and an inverter module, and the power device includes the packaged device.

[0038] In some embodiments of the present application, the support member is made of insulating material.

[0039] A second aspect of the present application provides a HVAC system, comprising a HVAC controller as described in the first aspect.

[0040] Based on the above HVAC controller and HVAC system, the technical solution of this application has the following beneficial effects or advantages:

[0041] By designing a support member formed of a support plate and an enclosure in one piece, the support plate is set between the body of the power device and the circuit wiring substrate to position and support the power device, so that there is a certain distance between the body of the power device and the circuit wiring substrate, ensuring that the length of the pins of the power device after extending out of the circuit wiring substrate is appropriate, thereby improving the welding effect, and the pins of the power device and peripheral circuit devices set near the power device are enclosed by the enclosure to form multiple enclosure areas, so that by pouring fluid-like three-proof glue into the enclosure area, the pins and peripheral circuit devices are well sealed after the three-proof glue is cured, thereby achieving the effect of corrosion prevention or condensation prevention. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0043] Figure 1 A circuit wiring substrate diagram of a HVAC controller according to an exemplary embodiment of the present application is shown;

[0044] Figure 2 This is a schematic diagram showing the arrangement of a support member on a circuit wiring substrate according to an exemplary embodiment of the present application;

[0045] Figure 3 A top view of a support member according to an exemplary embodiment of the present application;

[0046] Figure 4 A cross-sectional view of a circuit wiring substrate according to an exemplary embodiment of the present application is shown

[0047] Figure 5A perspective view of a support member shown according to an exemplary embodiment of the present application;

[0048] Figure 6 A side view of a support member shown according to an exemplary embodiment of the present application;

[0049] Figure 7 A perspective view of another support member shown according to an exemplary embodiment of the present application.

[0050] In the above figures:

[0051] 1 - Circuit wiring substrate;

[0052] 10 - Power device, 20 - Peripheral circuit device, 30 - Heat dissipation component, 40 - Support member;

[0053] 101 - Third positioning hole, 102 - Fourth positioning hole, E - Rectifier bridge, F - Encapsulated device, G - Inverter module;

[0054] 301 - Heat sink, 302 - Refrigerant heat dissipation pipe, 303 - Cover plate, H - Accommodating channel, 304 - First heat conducting medium layer, 305 - Second heat conducting medium layer;

[0055] 401 - Support plate, 402 - Enclosure, 4021 - First type of enclosure, 4022 - Second type of enclosure, 403 - First positioning hole, 404 - Second positioning hole, 405 - First boss, 406 - Second boss, 407 - Fifth positioning hole;

[0056] A - First enclosure area, B - Second enclosure area, C - Third enclosure area, D - Fourth enclosure area.

[0057] The realization of the purpose of the present application, functional features and advantages will be further described in conjunction with the embodiments with reference to the accompanying drawings. Detailed implementation manners

[0058] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0059] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0060] In addition, the descriptions of "first", "second", etc. in this application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0061] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0062] In addition, the technical solutions between the various embodiments of the present application can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0063] In order to solve the problem of power devices under the radiator and peripheral circuit devices near the power devices being corroded or short-circuited due to condensation, the present application proposes a design scheme for a HVAC controller, by designing a support member formed in one piece by a support plate and a fence, which plays a positioning and limiting role for the power device during production and installation, and the support plate is arranged between the body of the power device and the circuit wiring substrate to support the power device, so that there is a certain distance between the body of the power device and the circuit wiring substrate, ensuring that the length of the pins of the power device after extending out of the circuit wiring substrate is appropriate, thereby improving the welding effect, and the fence encloses the pins of the power device and the peripheral circuit devices arranged near the power device to form multiple enclosure areas, so that by pouring fluid-like three-proof glue into the enclosure area, the pins and peripheral circuit devices are well sealed after the three-proof glue is cured, thereby achieving the effect of corrosion prevention or condensation prevention.

[0064] To this end, the present application provides the following embodiments to solve or improve the problems existing in the prior art. In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0065] Embodiment 1:

[0066] See also Figures 1 to 3As shown in the figure, the HVAC controller includes a circuit wiring substrate 1, a power device 10, a peripheral circuit device 20, a heat dissipation component 30, and a support member 40. The power device 10 and the peripheral circuit device 20 are disposed on the first side surface of the circuit wiring substrate 1, and the heat dissipation component 30 is in contact with the heat dissipation surface of the power device 10.

[0067] Among them, the peripheral circuit device 20 is connected to the power device 10, and the heat dissipation component 30 is in contact with the heat dissipation surface of the power device 10. The support member 40 includes a support plate 401 and a fence 402. The support plate 401 and the fence 402 are integrally formed. The support plate 401 is disposed between the body of the power device 10 and the circuit wiring substrate 1, and the fence 402 encloses the pins of the power device 10 and the peripheral circuit device 20 to form a plurality of enclosed areas for potting glue.

[0068] The above-mentioned power device 10 is composed of a body and pins, and is used to process high-frequency signals in the HVAC controller. Its power density is relatively high and a large amount of heat will be generated. Therefore, in order to ensure its normal operation and lifespan, heat dissipation treatment is required. The heat dissipation surface of the power device 10 is the upper surface of the body.

[0069] The peripheral circuit device 20 can be understood as an electronic component disposed near the power device 10, which is used to process the input signal and output signal of the power device 10. Since the input signal and output signal of the power device 10 are strong electrical signals, the peripheral circuit device 20 of the power device 10 is usually disposed closely around the power device 10 to reduce circuit noise.

[0070] The heat dissipation component 30 is used to exchange heat with the power device 10. That is, when the power device 10 operates and generates heat, the temperature rises, and the heat is transferred to the heat dissipation component 30. There is a low-temperature refrigerant flowing in the heat dissipation component 30, and the temperature rise of the heat dissipation component 30 is reduced by the low-temperature refrigerant, so that the heat of the power device 10 is continuously transferred to the heat dissipation component 30 and taken away, ensuring that the power device 10 is maintained within a reliable operating temperature range.

[0071] The support member 40 can be understood as a structural member that plays a limiting and positioning role for the power device 10. The support plate 401 of the support member 40 is used to support the body of the power device 10, so that the length of the pins of the power device 10 extending out of the circuit wiring substrate 1 is appropriate, improving the welding effect. The fence 402 of the support member 40 encloses the pins of the power device 10 and the peripheral circuit device 20, which can ensure that the potted three-proof glue will not flow away. Since the support plate 401 and the fence 402 are integrally formed to form the support member 40, it is easy to be fixedly connected to the circuit wiring substrate 1 and the heat dissipation component 30 during production and installation.

[0072] Applying the solution of the embodiment of the present application, by designing a support member integrally formed by a support plate and a fence, the support plate is arranged between the body of the power device and the circuit wiring substrate to position and support the power device, so that there is a certain distance between the body of the power device and the circuit wiring substrate, ensuring that the length of the pins of the power device extending out of the circuit wiring substrate is appropriate, improving the welding effect, and the fence encloses the pins of the power device and the peripheral circuit devices arranged near the power device to form a plurality of fence areas. Thus, by pouring a fluid-shaped three-proof glue into the fence areas, the pins and the peripheral circuit devices can be well sealed after the three-proof glue is cured, achieving the effect of anti-corrosion or anti-condensation.

[0073] It should be noted here that the support member 40 is made of an insulating material, which can avoid introducing electromagnetic interference into the circuit.

[0074] In some embodiments of the present application, the power device 10 includes at least one of a rectifier bridge, a PFC (Power Factor Corrector) switch tube, a diode, and an inverter module.

[0075] Among them, the electrical flow direction of the HVAC controller is rectification processing → power factor correction and boost → inversion processing. Therefore, the circuit of the HVAC controller mainly includes a power filter circuit, a rectifier circuit, a PFC circuit, and an inverter circuit.

[0076] In this embodiment, the rectifier bridge belongs to the electronic component in the rectifier circuit, the PFC switch tube and the diode both belong to the electronic components in the PFC circuit, and the inverter module belongs to the electronic component in the inverter circuit, and can also be called an IPM (Intelligent Power Module) module.

[0077] Furthermore, the rectifier bridge, the PFC switch tube, the diode, and the inverter module are arranged along the extension direction of the heat dissipation component 30, that is, the rectifier bridge, the PFC switch tube, the diode, and the inverter module are arranged in sequence on the circuit wiring substrate 1, which is beneficial for the heat dissipation component 30 to cover these power devices below.

[0078] It is worth noting here that the rectifier bridge, the PFC switch tube, the diode, and the inverter module included in the above power device 10 can be respectively set as single devices according to functions, or these devices can be all or partially integrated into a co-packaged device. Therefore, the co-packaged device includes at least two of the rectifier bridge, the PFC switch tube, the diode, and the inverter module.

[0079] The setting form of the power device 10 is different, and the shape of the corresponding support plate 401 is different, such as Figure 2 and Figure 3As shown, the PFC switch tube and the diode are integrated into a sealed device F, the rectifier bridge E and the inverter module G are set as a single device, the rectifier bridge E, the sealed device F, and the inverter module G are arranged along the extension direction of the heat dissipation component 30, and the support plate 401 provides corresponding placement positions for the rectifier bridge E, the sealed device F, and the inverter module G.

[0080] Of course, if the rectifier bridge, PFC switch tube, diode and inverter module are all integrated into a sealed device, then the support plate 401 only needs to provide a placement position.

[0081] It can be seen that the shape of the support plate 401 is designed according to the shape requirements of the power device, and this application does not make any specific limitation on this.

[0082] In some embodiments of the present application, Figure 3 As shown, the enclosure 402 includes a first type of enclosure 4021 and a second type of enclosure 4022 . The first type of enclosure 4021 surrounds a portion of the edge of the power device 10 , and a portion of the first type of enclosure 4021 and the second type of enclosure 4022 together form an enclosure area.

[0083] That is to say, the second type of enclosure 4022 can be regarded as a structural member extending from the edge of the support plate 401, and the first type of enclosure 4021 is a structural member located on the support plate 401, but the first type of enclosure 4021, the second type of enclosure 4022 and the support plate 402 are made of one piece.

[0084] For a power device 10 with a single-sided pin, the first type of enclosure 4021 surrounds the three side edges of the power device 10. For a power device 10 with a double-sided pin, the first type of enclosure 4021 surrounds the two side edges of the power device 10. That is to say, the non-pin side edges of the power device 10 need to be provided with the first type of enclosure 4021 to limit the power device 10 and prevent the power device 10 from rotating due to the rotational force during the screw tightening process when the power device 10 is fixed on the heat dissipation assembly 30 and the support plate 401, thereby causing the pins to deform on the circuit wiring substrate 1 due to the force.

[0085] In addition, the first type of enclosure 4021 not only limits the power device 10 , but also part of the first type of enclosure 4021 and the second type of enclosure 4022 form an enclosure area.

[0086] In this embodiment, the edge of the power device 10 is partially enclosed by the first-type enclosure 4021, which can limit the power device 10 and prevent the power device 10 from being damaged due to force. The pins and peripheral circuit devices of the power device 10 are enclosed by part of the first-type enclosure 4021 and the second-type enclosure 4022, so that the pins and peripheral circuit devices can be sealed using a three-proof adhesive.

[0087] In some embodiments of the present application, the height of the enclosure 402 is greater than the height of the pins of the power device 10 relative to the first side surface of the circuit wiring substrate 1, and the height of the enclosure 402 is greater than the height of the peripheral circuit device 20 relative to the first side surface of the circuit wiring substrate 1.

[0088] Since the enclosure 402 includes the first type of enclosure 4021 and the second type of enclosure 4022, the first type of enclosure 4021 is located on the support plate 401, and the second type of enclosure 4022 is in contact with the first side surface of the circuit wiring substrate 1. In order to unify the reference object, the height of the enclosure 402 can be understood as the height relative to the circuit wiring substrate 1, that is, the height of the first type of enclosure 4021 relative to the first side surface of the circuit wiring substrate 1 and the height of the second type of enclosure 4022 relative to the first side surface of the circuit wiring substrate 1.

[0089] For example, Figure 4 As shown, Figure 4 It can be understood as Figure 1 The cross-sectional view obtained after cutting the section line shown in Figure 4 The second type of enclosure 4022 shown in the figure has a height h1 that is greater than a height h2 of the pin of the power device 10 relative to the first side surface of the circuit wiring substrate 1, and a height h1 of the second type of enclosure 4022 that is greater than a height h3 of the peripheral circuit device 20 relative to the first side surface of the circuit wiring substrate 1.

[0090] That is, h1>h2 and h1>h3.

[0091] In this embodiment, by setting the height of the enclosure 402 higher than the height of the pins of the power device 10 and higher than the height of the peripheral circuit device 20, it can be ensured that the pins of the power device 10 and the peripheral circuit device 20 can be fully covered by the three-proof adhesive.

[0092] In some embodiments of the present application, the shape of the enclosure area includes a regular shape and / or an irregular shape. The shape of the enclosure area can be designed according to the arrangement of the peripheral circuit device 20 around the power device 10, as long as the peripheral circuit device 20 and the pins of the power device 10 can be enclosed.

[0093] By the above Figure 2 and Figure 3 It can be seen that there are 4 enclosure areas: the first enclosure area A, the second enclosure area B, the third enclosure area C and the fourth enclosure area D. The second enclosure area B, the third enclosure area C and the fourth enclosure area D are regular squares, and the first enclosure area A is an irregular shape.

[0094] The first enclosure area A encloses components such as the pins of the co-packaged device F, the peripheral resistors, and the peripheral capacitors. The second enclosure area B encloses components such as the overcurrent protection circuit and the sampling detection circuit of the co-packaged device F. The third enclosure area C encloses components such as one side pins of the inverter module G and the sampling resistors. The fourth enclosure area D encloses components such as the other side pins of the inverter module G, the bootstrap circuit, and the signal detection circuit.

[0095] It should be noted that the above-mentioned 4 enclosure areas are only for exemplary illustration. The present application does not specifically limit the number of enclosure areas, and the number of enclosure areas is designed according to the circuit setting. For example, the first enclosure area A and the third enclosure area C can be combined into one enclosure area, and the second enclosure area B and the fourth enclosure area D can be combined into one enclosure area, so that 2 enclosure areas are formed.

[0096] In some embodiments of the present application, as Figure 2 and Figure 3 shown, the support plate 401 is provided with a first positioning hole 403 and a second positioning hole 404. The first positioning hole 403 and the second positioning hole 404 are located in the contact area of the support plate 401 with the body of the power device 10. Further, the power device 10 is provided with a third positioning hole 101 matching the first positioning hole 403 and a fourth positioning hole 102 matching the second positioning hole 404.

[0097] Both the first positioning hole 403 and the second positioning hole 404 are used to fix the power device 10 on the support plate 401.

[0098] In Figure 2 and Figure 3 , there are 2 third positioning holes 101, one on the rectifier bridge E and the other on the co-packaged device F. There are also 2 fourth positioning holes 102, both on the inverter module G.

[0099] In this embodiment, by providing mutually matching positioning holes on the support plate 401 and the power device 10, the power device 10 can be closely attached to the support plate 401.

[0100] In some embodiments of the present application, as Figure 5 shown, the side of the support plate 401 close to the circuit wiring substrate 1 is provided with a first boss 405. Correspondingly, the circuit wiring substrate 1 is provided with a limiting hole matching the first boss 405.

[0101] By inserting the first boss 405 into the limiting hole on the circuit wiring substrate 1, the support 40 can be limited to the circuit wiring substrate 1, so that the pins of the power device 10 on the support plate 401 can also be inserted into the pad holes of the circuit wiring substrate 1.

[0102] It should be noted here that, as Figure 6 shown, since the first boss 405 on the support plate 401 needs to be inserted into the circuit wiring substrate 1, the height of the first boss 405 should be higher than that of the enclosure 402 of the support member 40 to ensure close fitting between the support member 40 and the circuit wiring substrate 1.

[0103] In the above Figure 5 , two first bosses 405 are provided, so that the support member 40 can be stably positioned on the circuit wiring substrate 1. Of course, the present application does not specifically limit the number of the first bosses 405.

[0104] In this embodiment, by respectively providing the matching first bosses 405 and limiting holes on the support plate 401 and the circuit wiring substrate 1, the support member 40 can be positioned on the circuit wiring substrate 1, facilitating the placement of the pins of the power device 10 into the corresponding pad holes.

[0105] Furthermore, continuing as Figure 5 shown, the first positioning hole 403 penetrates through the first boss 405. That is to say, the first boss 405 can be regarded as a hollow cylinder. In this way, while positioning the support member 40 on the circuit wiring substrate 1, it is also convenient to fix the support member 40 to the circuit wiring substrate 1.

[0106] Still further, by using the first screw to pass through the limiting hole of the circuit wiring substrate 1, the first positioning hole 403 of the support plate 401 and the third positioning hole 101 of the power device 10 for fixed connection, the circuit wiring substrate 1, the support member 40 and the power device 10 can be tightly fixed together.

[0107] Still further, by using the second screw to pass through the second positioning hole 404 of the support plate 401 and the fourth positioning hole 102 of the power device 10 for fixed connection, the support member 40 and the power device 10 can also be tightly fixed together.

[0108] In some embodiments of the present application, continuing as Figure 1 and Figure 4 shown, the heat dissipation assembly 30 includes a radiator 301, a refrigerant heat dissipation pipe 302 and a cover plate 303.

[0109] The cover plate 303 covers the radiator 301. An accommodation channel H is provided between the radiator 301 and the cover plate 303. The refrigerant heat dissipation pipe 302 is arranged in the accommodation channel H. The surface of the radiator 301 facing away from the cover plate 303 is in contact with the heat dissipation surface of the power device 10.

[0110] The refrigerant heat dissipation pipe 302 includes a refrigerant inlet and a refrigerant outlet. The refrigerant inlet can be connected to the refrigerant pipeline of the condenser, so that a part of the refrigerant passing through the refrigerant pipeline will flow from the refrigerant inlet into the refrigerant heat dissipation pipe 302, take away the heat of the power device 10, flow out from the refrigerant outlet, and finally be transmitted to the compressor. Therefore, the refrigerant that continuously circulates in the refrigerant heat dissipation pipe 302 can ensure that the power device 10 is kept within a reliable operating temperature range.

[0111] Furthermore, the coolant heat dissipation pipe 302 and the radiator 301 can be fastened with screws through the cover plate 303 , so that the coolant heat dissipation pipe 302 and the radiator 301 are closely fitted, thereby improving the heat dissipation efficiency of the power device 10 .

[0112] In this embodiment, a refrigerant heat dissipation assembly is realized by using a cover plate, a radiator, and a refrigerant heat dissipation pipe. The cover plate is covered on the radiator so that the refrigerant heat dissipation pipe and the radiator are fitted together, which is beneficial to reducing the temperature rise of the radiator, thereby achieving a good heat dissipation effect of the power device.

[0113] In some embodiments of the present application, during the production and installation process, after the heat sink 301 is installed above the power device 10 , a three-proof adhesive is first injected into the enclosure area, and then the cover plate 303 is covered on the heat sink 301 .

[0114] Based on this, Figure 4 As shown, a space for a glue spray gun must be reserved between the second type of enclosure 4022 and the radiator 301, that is, the distance between the second type of enclosure 4022 and the radiator 301 is set to L, and the distance L is used to reserve the space for the glue spray gun, so that the nozzle of the glue spray equipment can inject the three-proof glue into the enclosure area through the glue spray gun space.

[0115] In some embodiments of the present application, the height of the enclosure 402 is smaller than the height of the side of the heat sink 301 away from the power device 10 relative to the first side surface of the circuit wiring substrate 1 .

[0116] Since the enclosure 402 includes the first type of enclosure 4021 and the second type of enclosure 4022, the first type of enclosure 4021 is located on the support plate 401, and the second type of enclosure 4022 is in contact with the first side surface of the circuit wiring substrate 1. In order to unify the reference object, the height of the enclosure 402 can be understood as the height relative to the circuit wiring substrate 1, that is, the height of the first type of enclosure 4021 relative to the first side surface of the circuit wiring substrate 1 and the height of the second type of enclosure 4022 relative to the first side surface of the circuit wiring substrate 1.

[0117] For example, in the above Figure 4The second type of enclosure 4022 shown in the figure has a height h1 that is less than the height h4 of the side of the heat sink 301 away from the power device 10 relative to the first side surface of the circuit wiring substrate 1, that is, h1 < h4. This can prevent the thickness of the three-proof glue injected into the enclosure area from being too thick, causing the heat sink 301 to be covered by the three-proof glue and reducing the heat dissipation effect.

[0118] In some embodiments of the present application, as Figure 7 shown, a second boss 406 is provided on the side of the support plate 401 close to the power device 10. The second boss 406 is located in the non-contact area of the support plate 401 with the body of the power device 10. Correspondingly, a limiting hole matching the second boss 406 is provided on the surface of the heat sink 301.

[0119] By inserting the second boss 406 into the limiting hole on the heat sink 301, the heat sink 301 can be limited to the support 40, facilitating the fixing of the heat sink 301 on the support 40.

[0120] It should be noted here that, as Figure 7 shown, since the second boss 406 on the support plate 401 needs to be inserted into the heat sink 301, the second boss 406 should be higher than the height of the enclosure 402 of the support 40 to ensure close fitting between the support 40 and the heat sink 301.

[0121] In the above Figure 7 example, 2 second bosses 406 are provided, which can stably limit the heat sink 301 on the support 40. Of course, the present application does not specifically limit the number of the second bosses 406.

[0122] In this embodiment, by respectively providing a first boss 405 and a limiting hole that match each other on the support plate 401 and the heat sink 301, the heat sink 301 can be limited to the support 40, facilitating the fixing of the heat sink 301 on the support 40.

[0123] Furthermore, as Figure 3 shown, a fifth positioning hole 407 is also provided on the support plate 401. The fifth positioning hole 407 is located in the non-contact area of the support plate 401 with the body of the power device 10. By using a third screw to pass through the fifth positioning hole 407, the heat dissipation surface of the power device 10 can be brought into contact with the surface of the heat sink 301, thereby tightly fixing the heat sink 301 and the support 40 together.

[0124] In some embodiments of the present application, the refrigerant heat dissipation tube 302 is arranged in a meandering shape between the heat sink 301 and the cover plate 303. This can increase the amount of circulating refrigerant between the heat sink 301 and the cover plate 303, thereby improving the heat dissipation efficiency of the power device 10.

[0125] Furthermore, if Figure 1 As shown, the refrigerant heat dissipation pipe 302 can be designed in a U shape between the radiator 301 and the cover plate 303. Of course, in addition to the U-shaped design, the refrigerant heat dissipation pipe 302 can also be designed in other forms, such as a square design.

[0126] In some embodiments of the present application, Figure 4 As shown, a first heat-conducting medium layer 304 is provided on the surface of the heat sink 301 that contacts the power device 10 , which is beneficial for quickly transferring the heat of the power device 10 to the heat sink 301 .

[0127] In some embodiments of the present application, Figure 4 As shown, the contact surface between the accommodating channel H and the radiator 301 is provided with a second heat-conducting medium layer 305 , which is beneficial to the heat exchange between the radiator 301 and the refrigerant heat pipe 302 .

[0128] In some embodiments of the present application, Figure 4 As shown, the height of the support plate 401 relative to the first side surface of the circuit wiring substrate 1 is a preset height h5. The preset height h5 makes the length of the pin of the power device 10 extending from the second side surface of the circuit wiring substrate 1 a preset length. The preset length is the optimal welding length of the pin, and the tinning effect of the pin is good, which also reduces the process of cutting off a part of the pin due to excessive length.

[0129] In some embodiments of the present application, a pad matching with a pin of the power device 10 is disposed on the second side surface of the circuit wiring substrate 1 , and the pin of the power device 10 is connected to the pad.

[0130] It should be noted that the second side surface of the circuit wiring substrate 1 and the first side surface of the circuit wiring substrate 1 are two opposite surfaces.

[0131] Based on the description of the above embodiments, by installing a support member made of insulating material between the power device and the circuit wiring substrate, in addition to solving the problem of the pins of the power device and the peripheral circuit components being covered with the three-proof adhesive, the support member can also play the following positioning and limiting roles for the power device and the heat dissipation component during production and installation:

[0132] Positioning function 1: It is convenient for the pins of the power device to be placed on the corresponding pad holes of the circuit wiring substrate;

[0133] Positioning function 2: Align the screw mounting holes of the heat sink and power device;

[0134] Limiting function 1: It can control the height of the power device, ensure that the length of the pin extending out of the circuit wiring substrate is appropriate, so that the pin tinning effect is good, ensure good electrical connection, and avoid the pin being too long and increasing the process of cutting off the excess length;

[0135] Limiting function 2: When using screws to fix the heat dissipation component on the power device, it prevents the rotational force generated during the screw tightening process from causing the power device to rotate, resulting in stress on the device pins on the circuit wiring substrate, leading to pin deformation and device displacement.

[0136] Embodiment 2:

[0137] Corresponding to the foregoing embodiments of the HVAC controller, the embodiment of the present application further provides an HVAC system, and the HVAC system includes the HVAC controller described in any of the foregoing embodiments.

[0138] The foregoing are only the preferred embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structural transformation made under the concept of the present application by using the content of the specification and drawings of the present application, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A heating, ventilation and air conditioning (HVAC) controller, characterized in that, Comprising: A circuit wiring substrate, on the first side surface of which a power device and peripheral circuit devices are provided, and the peripheral circuit devices are connected to the power device; A heat dissipation component, which is in contact with the heat dissipation surface of the power device; A support member, which includes a support plate and a retaining wall. The support plate and the retaining wall are integrally formed. The support plate is arranged between the body of the power device and the circuit wiring substrate. The retaining wall encloses the pins of the power device and the peripheral circuit devices and forms a plurality of retaining wall areas, and glue is filled in the retaining wall areas.

2. The HVAC controller according to claim 1, wherein, The retaining wall includes a first type of retaining wall and a second type of retaining wall; The first type of retaining wall surrounds part of the edge of the power device, and part of the first type of retaining wall and the second type of retaining wall together enclose the retaining wall area.

3. The HVAC controller according to claim 1, characterized in that, The height of the retaining wall is greater than the height of the pins of the power device relative to the first side surface of the circuit wiring substrate; The height of the retaining wall is greater than the height of the peripheral circuit devices relative to the first side surface of the circuit wiring substrate.

4. The HVAC controller according to claim 1, characterized in that, The shape of the retaining wall area includes regular shapes and / or irregular shapes.

5. The HVAC controller according to claim 1, characterized in that, The support plate is provided with a first positioning hole and a second positioning hole, and the first positioning hole and the second positioning hole are located in the contact area of the support plate with the body of the power device; The power device is provided with a third positioning hole matching the first positioning hole and a fourth positioning hole matching the second positioning hole.

6. The HVAC controller according to claim 5, wherein, One side of the support plate close to the circuit wiring substrate is provided with a first boss, and the circuit wiring substrate is provided with a limiting hole matching the first boss.

7. The HVAC controller according to claim 6, characterized in that, The first positioning hole penetrates through the first boss.

8. The HVAC controller according to claim 7, wherein, It further includes a first screw, and the first screw passes through the limiting hole of the circuit wiring substrate, the first positioning hole of the support plate and the third positioning hole of the power device for fixed connection.

9. The HVAC controller according to claim 5, wherein It further includes a second screw, and the second screw passes through the second positioning hole of the support plate and the fourth positioning hole of the power device for fixed connection.

10. The HVAC controller according to claim 2, wherein, The heat dissipation component includes a radiator, a refrigerant heat dissipation pipe and a cover plate; The cover plate covers the radiator, and an accommodation channel is provided between the radiator and the cover plate. The refrigerant heat dissipation pipe is arranged in the accommodation channel, and the surface of the radiator facing away from the cover plate is in contact with the heat dissipation surface of the power device.

11. The HVAC controller according to claim 10, characterized in that, A glue injection gun space is reserved between the second type of retaining wall and the radiator.

12. The HVAC controller according to claim 10, characterized in that, The height of the retaining wall is less than the height of the surface of the radiator away from the power device relative to the first side surface of the circuit wiring substrate.

13. The HVAC controller according to claim 10, characterized in that, One side of the support plate close to the power device is provided with a second boss, and the second boss is located in the non-contact area of the support plate with the body of the power device; The surface of the radiator is provided with a limiting hole matching the second boss.

14. The HVAC controller according to claim 10, wherein It further includes a third screw, and the support plate is further provided with a fifth positioning hole, and the fifth positioning hole is located in the non-contact area of the support plate with the body of the power device; The third screw passes through the fifth positioning hole to make the heat dissipation surface of the power device in contact with the surface of the radiator.

15. The HVAC controller according to claim 10, characterized in that, The refrigerant heat dissipation pipe is arranged in a meandering shape between the radiator and the cover plate.

16. The HVAC controller according to claim 15, characterized in that, The refrigerant heat dissipation pipe is U-shaped.

17. The HVAC controller according to claim 10, wherein A first heat conduction medium layer is provided on the surface of the radiator in contact with the power device.

18. The HVAC controller according to claim 10, wherein, A second heat conduction medium layer is provided on the contact surface of the accommodation channel and the radiator.

19. The HVAC controller according to claim 1, characterized in that, The height of the support plate relative to the first side surface of the circuit wiring substrate is a preset height, and the preset height makes the length of the pin of the power device protruding from the second side surface of the circuit wiring substrate a preset length.

20. The HVAC controller according to claim 19, characterized in that, Pads matching the pins of the power device are provided on the second side surface of the circuit wiring substrate, and the pins of the power device are connected to the pads.

21. The HVAC controller according to any one of claims 1-20, characterized in that, The power device includes at least one of a rectifier bridge, a power factor correction PFC switch tube, a diode, and an inverter module.

22. The HVAC controller according to claim 21, wherein, The rectifier bridge, the PFC switch tube, the diode, and the inverter module are arranged along the extension direction of the heat dissipation assembly.

23. The HVAC controller according to any one of claims 1-20, characterized in that, A co-packaged device is further provided on the first side surface of the circuit wiring substrate. The co-packaged device includes at least two of a rectifier bridge, a PFC switch tube, a diode, and an inverter module, and the power device includes the co-packaged device.

24. The HVAC controller according to any one of claims 1-20, characterized in that, The support member is made of an insulating material.

25. A heating, ventilation and air conditioning (HVAC) system, characterized in that, Including the HVAC controller according to any one of claims 1-24.

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