Flexible noise suppression sheet with high thermal stability

Abstract

The invention discloses a flexible noise suppression sheet with high thermal stability, which is used for suppressing electromagnetic wave interference and comprises a magnetic suppression sheet layer, a heat conduction film layer and a surface protection film, the flexible noise suppression sheet comprises a magnetic suppression sheet layer, a heat conduction film layer and a surface protection film, the heat conduction film layer is pressed on the first surface of the magnetic suppression sheet layer in an extending mode, and the surface protection film covers the heat conduction film layer, so that the heat conduction film layer is clamped between the magnetic suppression sheet layer and the surface protection film in the thickness direction of the flexible noise suppression sheet.

Description

Technical Field

[0001] The present invention relates to electromagnetic interference shielding materials, and particularly to a flexible noise suppression sheet with high thermal stability. Background Art

[0002] With the development of miniaturization, thinness, lightness, and multi-functionality of electronic devices such as smart phones and tablet computers, the assembly density of electronic components in circuit boards has become higher. To prevent electromagnetic wave noise generated by radiation of each component from causing problems such as radio wave interference and magnetic field coupling between electronic components, a flexible noise suppression sheet with high magnetic permeability for near-field use is installed near the components. However, during actual use, as the device operates, each component generates heat, and excessive heat causes induced current inside the noise suppression sheet, increases eddy current loss, and heats itself, greatly reducing the shielding effect on electromagnetic wave interference and lowering the noise suppression effect; at the same time, mutual inductance heating between the noise suppression sheet and the components easily causes the device to overheat and be damaged. Summary of the Invention

[0003] To reduce device heating and the negative impact on the noise suppression sheet, the present invention proposes a flexible noise suppression sheet with high thermal stability. By multiplexing an insulating thin film material with excellent flexibility and ultra-high thermal conductivity coefficient with the flexible noise suppression sheet, the purpose of not reducing the magnetic permeability of the noise suppression sheet while reducing the overheat temperature between the noise suppression sheet and the components and protecting the components and the noise suppression sheet from being damaged can be achieved.

[0004] The present invention adopts the following technical solutions to achieve the above object:

[0005] A flexible noise suppression sheet with high thermal stability for suppressing electromagnetic wave interference, comprising: a magnetic suppression sheet layer, a heat-conducting thin film layer, and a surface protection film; the heat-conducting thin film layer is laminated on a first surface of the magnetic suppression sheet layer, and the surface protection film covers the heat-conducting thin film layer, such that: in the thickness direction of the flexible noise suppression sheet, the heat-conducting thin film layer is sandwiched between the magnetic suppression sheet layer and the surface protection film.

[0006] Further, the heat-conducting material of the heat-conducting thin film layer is one of BN-Ag / PVA, SiN-Ag / PVA, AlN-Ag / PVA, and SiC-Ag / PVA; wherein, BN-Ag / PVA contains 6.67-25.3 wt% of B, 13-27.48 wt% of N, 22-41.9 wt% of Ag, and 15-30.33 wt% of PVA; SiN-Ag / PVA contains 6.67-25.3 wt% of Si, 13-27.48 wt% of N, 22-41.9 wt% of Ag, and 15-30.33 wt% of PVA; AlN-Ag / PVA contains 6.67-25.3 wt% of Al, 13-27.48 wt% of N, 22-41.9 wt% of Ag, and 15-30.33 wt% of PVA; SiC-Ag / PVA contains 9.67-24.1 wt% of Si, 10-26.28 wt% of C, 22-44.3 wt% of Ag, and 15-30.33 wt% of PVA.

[0007] Further, the heat-conducting material BN-Ag / PVA is prepared from boron nitride, silver, and polyvinyl alcohol as raw materials, SiN-Ag / PVA is prepared from silicon nitride, silver, and polyvinyl alcohol as raw materials, AlN-Ag / PVA is prepared from aluminum nitride, silver, and polyvinyl alcohol as raw materials, and SiC-Ag / PVA is prepared from silicon carbide, silver, and polyvinyl alcohol as raw materials.

[0008] Further, the thermal conductivity of the heat-conducting thin film layer is 20-55 W / (m·K).

[0009] Further, the magnetic suppression sheet layer is used to shield the interference and coupling of electromagnetic waves to components in the near field, and is prepared by compounding powders of soft magnetic alloy materials and / or amorphous / nanocrystalline system materials with resin.

[0010] Further, the powders of the soft magnetic alloy materials and / or amorphous / nanocrystalline system materials contain 75-97 wt% of Fe and 1-9 wt% of Si, and also contain at least one of Al, Cr, Ni, B, Nb, Cu, Co, Zr, Mo, V, P, C, and O:

[0011] When Al is contained, the content of Al is: 0.5-8 wt%;

[0012] When Cr is contained, the content of Cr is: 0.5-8 wt%;

[0013] When Ni is contained, the content of Ni is: 0.5-8 wt%;

[0014] When B is contained, the content of B is: 0.5-8 wt%;

[0015] When containing Nb, the content of Nb is: 0.5 - 8 wt%.

[0016] When containing Cu, the content of Cu is: 0.5 - 8 wt%.

[0017] When containing Co, the content of Co is: 0.5 - 8 wt%.

[0018] When containing Zr, the content of Zr is: 0.5 - 8 wt%.

[0019] When containing Mo, the content of Mo is: 0.5 - 8 wt%.

[0020] When containing V, the content of V is: 0.5 - 8 wt%.

[0021] When containing P, the content of P is: 0.1 - 5 wt%.

[0022] When containing C, the content of C is: 0.1 - 5 wt%.

[0023] When containing O, the content of O is: 0.1 - 5 wt%.

[0024] Furthermore, the soft magnetic alloy material includes at least one of FeSiAl, FeSi, FeSiCr, and FeNi; the amorphous / nanocrystalline system material includes at least one of FePC, FeCoZrBCu, FeZrB, FeSiBCuNb, FeNiPB, FeSiBCr, FeSiBNiMo, and FeNiVSiB.

[0025] Furthermore, the thickness of the magnetic suppression sheet layer is 20 μm - 200 μm, and the thickness of the heat-conducting thin film layer is 0.1 μm - 5 μm.

[0026] Furthermore, the flexible noise suppression sheet further includes: an anti-adhesive substrate attached to the second surface of the magnetic suppression sheet layer.

[0027] Furthermore, the anti-adhesive substrate is bonded to the second surface of the magnetic suppression sheet layer by double-sided tape.

[0028] The beneficial effects of the technical solution of the present invention are reflected in that the present invention presses a heat-conducting material on the surface of a magnetic suppression sheet to form a composite structure of a heat-conducting thin film and a suppression sheet, and conducts the heat of the suppression sheet away quickly through the heat-conducting thin film, thereby reducing the local temperature of the suppression sheet. In this way, on the one hand, it can avoid the performance degradation caused by the over-high temperature of the device and the suppression sheet, and the performance of the device and the suppression sheet can be well protected; on the other hand, it reduces the interference of thermal motion on the arrangement of the internal magnetic moments of the suppression sheet, making the magnetic moments more easily arranged orderly under an external magnetic field, thereby maintaining or increasing the magnetic permeability, and the magnetic loss is reduced to a certain extent, which is beneficial to the performance protection and optimization of the suppression sheet. In addition, the suppression sheet and the heat-conducting thin film itself have good flexibility alone, and the flexibility and the basic tensile strength have a certain neutralizing effect after the two are combined, which is beneficial to the production, transportation, cutting and flexible patch use of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. is a schematic structural diagram of a flexible noise suppression sheet according to an embodiment of the present invention.

[0030] Figure 2 FIG. is a process flow chart of the preparation of a flexible noise suppression sheet according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments and examples. The purpose of providing the examples is only for illustration and not for any limitation.

[0032] In addition, for the spatial orientation terms such as "upper", "lower", "top", "bottom" and the like used in the description of the technical solution of the present invention, they are convenient for describing the relative positional relationship between the components of the product, and do not represent that the product has only the orientation shown in the figure. In the actual use process, with the different orientations of the product (such as rotating 90 degrees or other orientations), the spatial related descriptions used to describe its orientation should also be explained in a similar way.

[0033] In addition, terms such as "first" and "second" are only used to distinguish components, and it should be understood that these components should not be limited by such terms. They do not mean that these components have the foregoing ordinal numbers in themselves, nor do they represent the arrangement order of one component and another component or the order in the manufacturing method.

[0034] As we know, the magnetic permeability of magnetic materials is closely related to the orderliness of internal magnetic moments. For ferromagnetic materials, high temperature will increase atomic thermal motion, leading to disorder in the directions of magnetic moments, thereby reducing the magnetic permeability and resulting in performance degradation. During the operation of the noise suppression sheet, the surrounding components generate heat during operation, causing induced current inside the noise suppression sheet, increasing eddy current loss and self-heating, resulting in a temperature rise. Excessive temperature reduces the noise suppression performance and may even cause overheating and damage to the device. Therefore, the embodiments of the present invention provide a flexible noise suppression sheet with high thermal stability. Figure 1 The following shows a schematic structural view of the flexible noise suppression sheet in its thickness direction. Please refer to Figure 1 , the flexible noise suppression sheet provided by the embodiments of the present invention includes a magnetic suppression sheet layer 10, a heat-conducting thin film layer 20, and a surface protection film 30; the heat-conducting thin film layer 20 is laminated on the first surface (such as the upper surface shown in the figure) of the magnetic suppression sheet layer 10 to protect overheated devices and maintain the life and operating stability of the devices; the surface protection film 30 covers the heat-conducting thin film layer 20, such that: in the thickness direction of the flexible noise suppression sheet, the heat-conducting thin film layer 20 is sandwiched between the magnetic suppression sheet layer 10 and the surface protection film 30. The flexible noise suppression sheet of the embodiments of the present invention may further include an anti-sticking substrate 40, which is adhered to the second surface (such as the lower surface shown in the figure) of the magnetic suppression sheet layer 10 through a double-sided adhesive 50.

[0035] For the above flexible noise suppression sheet provided by the embodiments of the present invention, by laminating a heat-conducting material on the surface of the magnetic suppression sheet layer to form a composite structure of a heat-conducting thin film and the suppression sheet, and utilizing the good heat-conducting performance of the heat-conducting thin film, it is possible to avoid performance degradation caused by excessive temperature of the device, and the performance of the device and the suppression sheet can be well protected; and under high-temperature conditions, the suppression sheet after being compounded with the heat-conducting thin film can maintain the orderly arrangement of internal magnetic moments. Therefore, high magnetic permeability can be maintained at high temperature, the magnetic loss is reduced to a certain extent, and the magnetic permeability is increased to a certain extent, which is beneficial to the performance protection and optimization of the noise suppression sheet.

[0036] In some specific embodiments, the heat-conducting material of the heat-conducting thin film layer 20 is one of BN-Ag / PVA, SiN-Ag / PVA, AlN-Ag / PVA, and SiC-Ag / PVA, and the thermal conductivity is 20 to 55 W / (m·K). The heat-conducting material BN-Ag / PVA is prepared from boron nitride (BN), silver (Ag), and polyvinyl alcohol (PVA) as raw materials, and contains 6.67 to 25.3 wt% of B, 13 to 27.48 wt% of N, 22 to 41.9 wt% of Ag, and 15 to 30.33 wt% of PVA. The heat-conducting material SiN-Ag / PVA is prepared from silicon nitride (SiN), silver, and polyvinyl alcohol as raw materials, and contains 6.67 to 25.3 wt% of Si, 13 to 27.48 wt% of N, 22 to 41.9 wt% of Ag, and 15 to 30.33 wt% of PVA. The heat-conducting material AlN-Ag / PVA is prepared from aluminum nitride (AlN), silver, and polyvinyl alcohol as raw materials, and contains 6.67 to 25.3 wt% of Al, 13 to 27.48 wt% of N, 22 to 41.9 wt% of Ag, and 15 to 30.33 wt% of PVA. The heat-conducting material SiC-Ag / PVA is prepared from silicon carbide (SiC), silver, and polyvinyl alcohol as raw materials, and contains 9.67 to 24.1 wt% of Si, 10 to 26.28 wt% of C, 22 to 44.3 wt% of Ag, and 15 to 30.33 wt% of PVA.

[0037] For the flexible noise suppression sheet according to the embodiment of the present invention, the magnetic suppression sheet layer 10 has a high magnetic permeability (@13.56 MHz), good frequency stability at high frequencies, and is used for near-field shielding of electromagnetic wave interference and coupling to components. The magnetic suppression sheet layer 10 is in the form of a flexible thin sheet with a thickness of 20 μm to 200 μm; and the thickness of the heat-conducting thin film layer 20 laminated on the magnetic suppression sheet layer 10 is 0.1 μm to 5 μm.

[0038] In the embodiment of the present invention, the magnetic suppression sheet layer 10 is prepared by compounding powders of soft magnetic alloy materials and / or amorphous / nanocrystalline system materials with a resin, and the magnetic suppression sheet layer 10 in the embodiment of the present invention can be a single magnetic layer or a multi-magnetic layer, and different magnetic layers can be prepared according to different element content ratios. Among them, the powders of the soft magnetic alloy materials and / or amorphous / nanocrystalline system materials contain 75 to 97 wt% of Fe and 1 to 9 wt% of Si, and also contain at least one of Al, Cr, Ni, B, Nb, Cu, Co, Zr, Mo, V, P, C, and O:

[0039] When Al is contained, the content of Al is: 0.5 to 8 wt%;

[0040] When Cr is contained, the content of Cr is: 0.5 to 8 wt%;

[0041] When containing Ni, the content of Ni is: 0.5 - 8 wt%;

[0042] When containing B, the content of B is: 0.5 - 8 wt%;

[0043] When containing Nb, the content of Nb is: 0.5 - 8 wt%;

[0044] When containing Cu, the content of Cu is: 0.5 - 8 wt%;

[0045] When containing Co, the content of Co is: 0.5 - 8 wt%;

[0046] When containing Zr, the content of Zr is: 0.5 - 8 wt%;

[0047] When containing Mo, the content of Mo is: 0.5 - 8 wt%;

[0048] When containing V, the content of V is: 0.5 - 8 wt%;

[0049] When containing P, the content of P is: 0.1 - 5 wt%;

[0050] When containing C, the content of C is: 0.1 - 5 wt%;

[0051] When containing O, the content of O is: 0.1 - 5 wt%.

[0052] In some specific embodiments, the soft magnetic alloy material includes at least one of FeSiAl, FeSi, FeSiCr, FeNi; the amorphous / nanocrystalline system material includes at least one of FePC, FeCoZrBCu, FeZrB, FeSiBCuNb, FeNiPB, FeSiBCr, FeSiBNiMo, FeNiVSiB. The powder morphology can be spherical powder, block powder, flat powder, etc., and is not limited thereto.

[0053] Please refer to Figure 2 , the process for preparing the flexible noise suppression sheet of the embodiments of the present invention includes:

[0054] Mix the alloy powder and resin (adhesive) in proportion and cast into a green tape for forming the magnetic suppression sheet layer 10;

[0055] Obtain a large-area foldable heat-conducting film by a weaving method combining electrospinning and hot pressing processes for forming the heat-conducting film layer 20;

[0056] Roll the heat-conducting film onto the green tape of the suppression sheet by a rolling process to complete the lamination of the heat-conducting film and the suppression sheet layer; (After this step, an anti-sticking substrate can be bonded according to requirements)

[0057] Finally, the continuously formed material is wound and cut as needed to obtain the required flexible noise suppression sheet.

[0058] The effectiveness of the present invention is verified below through specific examples and comparative examples.

[0059] Example 1

[0060] Example 1 provides a composite material for a flexible noise suppression sheet with high thermal conductivity. Among them, the suppression sheet layer adopts a casting process, and the composite of the thermal conductive film layer and the suppression sheet layer adopts a calendaring process. The material of the thermal conductive film layer is BN-Ag / PVA (12 wt% B, 26.1 wt% N, 34.9 wt% Ag, 27 wt% PVA), the thermal conductivity is 22 W / (m·K), and the thickness of the thermal conductive film is 0.5 μm; the suppression sheet layer contains 86 wt% Fe, 8 wt% Si, 4 wt% Al, 1.5 wt% C, 0.5 wt% O FeSiAl soft magnetic alloy powder. For the prepared suppression sheet sample at a use frequency of 13.56 MHz, a larger real part μ' and a smaller imaginary part μ" are required. When the use temperature is 130 °C, μ' = 145.83, μ" = 38.22, the density ρ = 3.14 g / cm3, and the thickness of the suppression sheet layer is 100 μm.

[0061] Comparative Example 1

[0062] Comparative Example 1 provides a flexible noise suppression sheet. Comparative Example 1 has no thermal conductive film layer and only a single-layer 86 wt% Fe, 8 wt% Si, 4 wt% Al, 1.5 wt% C, 0.5 wt% O FeSiAl suppression sheet (the same as the suppression sheet layer in Example 1), and its preparation process is the same as that in Example 1 and will not be elaborated. For the flexible noise suppression sheet obtained in Comparative Example 1, the magnetic permeability performance is μ' = 132 and μ" = 42 at 130 °C and 13.56 MHz, and the density ρ = 3.13 g / cm 3 , and the thickness of the suppression sheet is 100 μm.

[0063] Compared with Comparative Example 1, when the temperature is 130 °C, the magnetic permeability μ' obtained at 13.56 MHz in Example 1 is 10.48% higher than that in Comparative Example 1, and μ" is reduced by 9%, and the density is basically unchanged (slightly increased by 0.32%). It can be seen that after adding the thermal conductive film, the magnetic permeability μ' not only does not decrease but instead increases slightly, and the magnetic loss μ" decreases slightly. This trend is beneficial to the optimized use of the composite suppression sheet material.

[0064] Example 2

[0065] Example 2 provides a flexible noise suppression sheet composite material with high thermal conductivity. The suppression sheet layer adopts a casting process, and the composite of the thermal conductive film layer and the suppression sheet layer adopts a calendaring process. The thermal conductive material of the thermal conductive film layer is AlN-Ag / PVA (containing 14 wt% Al, 23 wt% N, 38 wt% Ag, and 25 wt% PVA), with a thermal conductivity of 32 W / (m·K) and a thickness of the thermal conductive film layer of 0.2 μm; the suppression sheet layer is 86 wt% Fe, 8 wt% Si, 4 wt% Al, 1.5 wt% C, 0.5 wt% O FeSiAl soft magnetic alloy powder and 75 wt% Fe 、 9 wt% Si, 9 wt% B, 1 wt% Cu, 3 wt% Nb, 1.5 wt% C, 1.5 wt% O FeSiBCuNb composite material. When the prepared suppression sheet sample is used at a frequency of 13.56 MHz, it requires a relatively large real part μ' and a relatively small imaginary part μ". When the operating temperature is 145 °C, μ' = 168.36, μ" = 66.99, the density ρ = 3.47 g / cm3, and the thickness of the suppression sheet layer is 50 μm.

[0066] Comparative Example 2

[0067] Comparative Example 2 provides a flexible noise suppression sheet. Comparative Example 2 has no thermal conductive film layer, only 86 wt% Fe, 8 wt% Si, 4 wt% Al, 1.5 wt% C, 0.5 wt% O FeSiAl soft magnetic alloy powder and 75 wt% Fe 、 9 wt% Si, 9 wt% B, 1 wt% Cu, 3 wt% Nb, 1.5 wt% C, 1.5 wt% O FeSiBCuNb composite suppression sheet (the same as the suppression sheet layer in Example 2), and its preparation process is the same as that in Example 2, which will not be elaborated here. For the flexible noise suppression sheet obtained in Comparative Example 2, the magnetic permeability performance obtains μ' = 143.95 and μ" = 77.21 at 145 °C and 13.56 MHz, the density ρ = 3.46 g / cm 3 , and the thickness of the suppression sheet is 50 μm.

[0068] Compared with Comparative Example 2, when the temperature is 145 °C, the magnetic permeability μ' obtained at 13.56 MHz in Example 2 is 16.96% higher than that in Comparative Example 2, and μ" is reduced by 15.26%. The density remains basically unchanged (slightly increased by 0.28%). It can be seen that after adding the thermal conductive film, the magnetic permeability μ' not only does not decrease but instead increases slightly, and the magnetic loss μ" decreases slightly. This trend is beneficial to the optimized use of the composite suppression sheet material.

[0069] As can be seen from the above examples and comparative examples, for the suppression sheet after being compounded with the thermal conductive film, the overheating of the device can be avoided to prevent performance degradation, and the performance of the device and the suppression sheet can be well protected. Moreover, under high-temperature conditions, the permeability μ' of the suppression sheet after being compounded with the thermal conductive film is increased to a certain extent, and the magnetic loss μ" is decreased to a certain extent. This variation law is beneficial to performance protection and optimization.

[0070] Insulating thermal conductive films with low thickness and excellent flexibility have great application value in thermal management applications such as flexible radiators, wearable technologies, personal thermal management, skin electronics, and energy storage devices. Combining its good flexibility with excellent thermal conductivity characteristics, the thermal conductive film can be compounded with the magnetic shielding noise suppression sheet to achieve the purpose of reducing the overheating temperature between the suppression sheet and the components and protecting the components and the suppression sheet from damage without reducing the magnetic permeability performance of the noise suppression sheet.

[0071] The above content is a further detailed description of the present invention in combination with specific preferred embodiments, and it cannot be determined that the specific implementation of the present invention is only limited to these descriptions. For those skilled in the technical field to which the present invention belongs, without departing from the concept of the present invention, several equivalent substitutions or obvious modifications can be made, and if the performance or use is the same, they should all be regarded as belonging to the protection scope of the present invention.

Claims

1. A flexible noise suppression sheet with high thermal stability, which is used to suppress electromagnetic wave interference, and is characterized in that, Comprising: A magnetic suppression sheet layer, a heat-conducting thin film layer, and a surface protection film; the heat-conducting thin film layer is laminated on the first surface of the magnetic suppression sheet layer, and the surface protection film covers the heat-conducting thin film layer, such that: in the thickness direction of the flexible noise suppression sheet, the heat-conducting thin film layer is sandwiched between the magnetic suppression sheet layer and the surface protection film.

2. The flexible noise suppression sheet according to claim 1, wherein The heat-conducting material of the heat-conducting thin film layer is one of BN-Ag / PVA, SiN-Ag / PVA, AlN-Ag / PVA, and SiC-Ag / PVA; wherein, BN-Ag / PVA contains 6.67 - 25.3 wt% of B, 13 - 27.48 wt% of N, 22 - 41.9 wt% of Ag, and 15 - 30.33 wt% of PVA; SiN-Ag / PVA contains 6.67 - 25.3 wt% of Si, 13 - 27.48 wt% of N, 22 - 41.9 wt% of Ag, and 15 - 30.33 wt% of PVA; AlN-Ag / PVA contains 6.67 - 25.3 wt% of Al, 13 - 27.48 wt% of N, 22 - 41.9 wt% of Ag, and 15 - 30.33 wt% of PVA; SiC-Ag / PVA contains 9.67 - 24.1 wt% of Si, 10 - 26.28 wt% of C, 22 - 44.3 wt% of Ag, and 15 - 30.33 wt% of PVA.

3. The flexible noise suppression sheet according to claim 2, wherein The heat-conducting material BN-Ag / PVA is prepared from boron nitride, silver, and polyvinyl alcohol as raw materials, SiN-Ag / PVA is prepared from silicon nitride, silver, and polyvinyl alcohol as raw materials, AlN-Ag / PVA is prepared from aluminum nitride, silver, and polyvinyl alcohol as raw materials, and SiC-Ag / PVA is prepared from silicon carbide, silver, and polyvinyl alcohol as raw materials.

4. The flexible noise suppression sheet according to any one of claims 1-3, wherein The thermal conductivity of the heat-conducting thin film layer is 20 - 55 W / (m·K).

5. The flexible noise suppression sheet according to any one of claims 1 to 3, characterized in that, The magnetic suppression sheet layer is used to shield the interference and coupling of electromagnetic waves to components in the near field, and is prepared by compounding powders of soft magnetic alloy materials and / or amorphous / nanocrystalline system materials with resin.

6. The flexible noise suppression sheet according to claim 5, wherein, The powders of the soft magnetic alloy materials and / or amorphous / nanocrystalline system materials contain 75 - 97 wt% of Fe and 1 - 9 wt% of Si, and also contain at least one of Al, Cr, Ni, B, Nb, Cu, Co, Zr, Mo, V, P, C, O: When containing Al, the content of Al is: 0.5 - 8 wt%; When containing Cr, the content of Cr is: 0.5 - 8 wt%; When containing Ni, the content of Ni is: 0.5 - 8 wt%; When containing B, the content of B is: 0.5 - 8 wt%; When containing Nb, the content of Nb is: 0.5 - 8 wt%; When containing Cu, the content of Cu is: 0.5 - 8 wt%; When containing Co, the content of Co is: 0.5 - 8 wt%; When containing Zr, the content of Zr is: 0.5 - 8 wt%; When containing Mo, the content of Mo is: 0.5 - 8 wt%; When containing V, the content of V is: 0.5 - 8 wt%; When containing P, the content of P is: 0.1 to 5 wt%; When containing C, the content of C is: 0.1 to 5 wt%; When containing O, the content of O is: 0.1 to 5 wt%.

7. The flexible noise suppression sheet according to claim 6, characterized in that, The soft magnetic alloy material includes at least one of FeSiAl, FeSi, FeSiCr, and FeNi; the amorphous / nanocrystalline system material includes at least one of FePC, FeCoZrBCu, FeZrB, FeSiBCuNb, FeNiPB, FeSiBCr, FeSiBNiMo, and FeNiVSiB.

8. The flexible noise suppression sheet according to claim 1, wherein, The thickness of the magnetic suppression sheet layer is 20 μm to 200 μm, and the thickness of the heat-conducting thin film layer is 0.1 μm to 5 μm.

9. The flexible noise suppression sheet according to claim 1, wherein, It further includes: A non-stick substrate attached to the second surface of the magnetic suppression sheet layer.

10. The flexible noise suppression sheet according to claim 9, characterized in that, The non-stick substrate is bonded to the second surface of the magnetic suppression sheet layer by double-sided tape.

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