Driving backboard, preparation method thereof and display panel

Abstract

The invention discloses a driving backboard and a preparation method thereof, and a display panel, the driving backboard comprises a first substrate, a bonding layer and a second substrate which are stacked in sequence, and further comprises a first side edge wire, a second side edge wire and a connecting piece, the first substrate comprises a first surface deviating from the second substrate and a first side surface connected with the first surface, and the second substrate comprises a second surface deviating from the second surface and a second side surface connected with the second surface; the second substrate comprises a second surface deviating from the first substrate and a second side surface connected with the second surface, the first surface is provided with a first bonding pad, and the second surface is provided with a second bonding pad; the first side wire is electrically connected with the first bonding pad and extends to the first side surface along the first surface; the second side wire is electrically connected with the second bonding pad and extends to the second side surface along the second surface; the connecting piece is arranged on the side, facing the first side wire and the second side wire, of the bonding layer and electrically connected with the first side wire and the second side wire. According to the scheme, the reliability of side wiring can be improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a driving backplane, a preparation method thereof, and a display panel. Background Art

[0002] Micro-LEDs have been widely used in the field of display technologies due to their advantages such as high brightness, good luminous efficiency, and low power consumption. Currently, side routing is provided on the side of the Micro-LED driving backplane to reduce the border width of each display panel.

[0003] However, the reliability problem of the side routing of the existing display panel needs to be solved urgently. Summary of the Invention

[0004] The main technical problem to be solved by the present application is to provide a driving backplane, a preparation method thereof, and a display panel to improve the reliability of the side routing.

[0005] To solve the above technical problem, a technical solution adopted by the present application is: providing a driving backplane, including a first substrate, an adhesive layer, and a second substrate which are sequentially stacked, further including a first side routing, a second side routing, and a connecting member. Among them, the first substrate includes a first surface facing away from the second substrate and a first side surface connected to the first surface, the second substrate includes a second surface facing away from the first substrate and a second side surface connected to the second surface, the first surface is provided with a first pad, and the second surface is provided with a second pad; the first side routing is electrically connected to the first pad and extends along the first surface to the first side surface; the second side routing is electrically connected to the second pad and extends along the second surface to the second side surface; the connecting member is disposed on a side of the adhesive layer facing the first side routing and the second side routing, and is electrically connected to the first side routing and the second side routing.

[0006] Preferably, the first side surface is provided with a first groove, the first groove communicates with a third surface of the first substrate facing away from the first surface, and the connecting member is located in the first groove; and / or, the second side surface is provided with a second groove, the second groove communicates with a fourth surface of the second substrate facing away from the second surface, and the connecting member is located in the second groove.

[0007] Preferably, the first side routing extends into the first groove, and / or, the second side routing extends into the second groove.

[0008] Preferably, a second groove is provided on the second side surface. The second groove communicates with a fourth surface of the second substrate facing away from the second surface. The second side-walk routing extends into the second groove. At the same time, the first groove and the second groove enclose a receiving groove, and the connecting member is located in the receiving groove.

[0009] Preferably, the connecting member has a spherical structure.

[0010] Preferably, the material of the connecting member includes tin.

[0011] Preferably, the number of the first side-walk routings, the second side-walk routings, and the connecting members is multiple, and the multiple first side-walk routings, the multiple second side-walk routings, and the multiple connecting members are all arranged at intervals along a first direction.

[0012] Preferably, the first grooves are provided in one-to-one correspondence with the first side-walk routings, and / or the second grooves are provided in one-to-one correspondence with the second side-walk routings.

[0013] Preferably, the opening area of the first groove and / or the second groove gradually increases from the groove bottom to the groove opening.

[0014] Preferably, the first groove includes a first side wall. The first side-walk routing passes through the first side wall, and the first side wall is inclined relative to the first side surface, and / or the second groove includes a second side wall. The second side-walk routing passes through the second side wall, and the second side wall is inclined relative to the second side surface.

[0015] To solve the above technical problems, another technical solution adopted by the present application is: to provide a display panel, including the driving backplane and the light-emitting device according to any embodiment. The light-emitting device is disposed on the first surface of the first substrate and / or the second surface of the second substrate. The light-emitting device is electrically connected to the first substrate, and / or the light-emitting device is electrically connected to the second substrate.

[0016] To solve the above technical problems, another technical solution adopted by this application is to provide a method for manufacturing a driving backplane, including: forming a first pad on a first surface of a first substrate; forming a first side-walking trace on the first surface, the first side-walking trace being electrically connected to the first pad and extending along the first surface to the first side; forming a second pad on a second surface of a second substrate; forming a second side-walking trace on the second surface, the second side-walking trace being electrically connected to the second pad and extending along the second surface to the second side; forming an adhesive layer between the first substrate and the second substrate to bond the first substrate and the second substrate, such that the first surface and the second surface are disposed opposite to each other; forming a connecting member on a side of the adhesive layer facing the first side-walking trace and the second side-walking trace, the connecting member being electrically connected to the first side-walking trace and the second side-walking trace.

[0017] Preferably, before the step of forming a first side-walking trace on the first surface, the first side-walking trace being electrically connected to the first pad and extending along the first surface to the first side, it further includes: forming a first groove on the first side, the first groove communicating with a third surface of the first substrate opposite to the first surface; and / or, before the step of forming a second side-walking trace on the second surface, the second side-walking trace being electrically connected to the second pad and extending along the second surface to the second side, it further includes: forming a second groove on the second side, the second groove communicating with a fourth surface of the second substrate opposite to the second surface.

[0018] Preferably, the step of forming a connecting member on a side of the adhesive layer facing the first side-walking trace and the second side-walking trace, the connecting member being electrically connected to the first side-walking trace and the second side-walking trace, further includes: forming the connecting member in the first groove and / or the second groove.

[0019] Preferably, the step of forming a first groove on the first side, the first groove communicating with a third surface of the first substrate opposite to the first surface; forming a second groove on the second side, the second groove communicating with a fourth surface of the second substrate opposite to the second surface includes: fitting the first substrate and the second substrate such that the first surface and the second surface are disposed opposite to each other, and the first side and the second side are flush; synchronously forming the first groove and the second groove on a surface where the first side and the second side are located.

[0020] The beneficial effects of this application are as follows: Different from the prior art, the driving backplane provided in this application sets the side routing in segments, namely the first side routing on the first side of the first substrate and the second side routing on the second side of the second substrate. And a connecting member is provided outside the bonding layer, which is used to electrically connect the first side routing and the second side routing, so that the first pad and the second pad are electrically connected, reducing the probability of breakage or damage of the side routing at the splicing position of the two substrates and improving the reliability of the side routing. The driving backplane provided in this application first forms the first side routing and the second side routing on the first substrate and the second substrate respectively, and then bonds the first substrate and the second substrate together. Since the side routing is formed first, the bonding layer will not be deformed by the influence of the side routing preparation process, thus avoiding the influence of the bonding layer deformation on the quality of the side routing. Finally, the first side routing and the second side routing are electrically connected through the connecting member, improving the reliability of the connection between the first side routing and the second side routing. Description of the Drawings

[0021] Figure 1 is a schematic structural diagram of an embodiment of the driving backplane of this application;

[0022] Figure 2 is a right view of an embodiment of the driving backplane of this application;

[0023] Figure 3 is a schematic structural diagram of another embodiment of the driving backplane of this application;

[0024] Figure 4 is a schematic structural diagram of another embodiment of the driving backplane of this application;

[0025] Figure 5 is a schematic structural diagram of another embodiment of the driving backplane of this application;

[0026] Figure 6 is a schematic flow chart of an embodiment of the manufacturing method of the driving backplane of this application;

[0027] Figures 7a - 7b is a schematic structural diagram of each step of an embodiment of the manufacturing method of the driving backplane of this application;

[0028] Figure 8 is a schematic flow chart of another embodiment of the manufacturing method of the driving backplane of this application;

[0029] Figure 9 is a schematic structural diagram of an embodiment of step S210 of the manufacturing method of the driving backplane of this application;

[0030] Figure 10 is a schematic structural diagram of another embodiment of step S210 of the manufacturing method of the driving backplane of this application;

[0031] Figure 11 It is a schematic structural diagram of an embodiment of step S220 in the method for preparing the driving backplane of the present application. Specific embodiments

[0032] To make the objectives, technical solutions and effects of the present application clearer and more definite, the following further describes the present application in detail with reference to the accompanying drawings and by way of examples. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0033] Refer to Figure 1 , Figure 1 It is a schematic structural diagram of an embodiment of the driving backplane of the present application. The driving backplane 10 includes a first substrate 1, an adhesive layer 3, and a second substrate 2 that are sequentially stacked. Among them, the first substrate 1 includes a first surface 1a and a third surface 1c that face away from each other, and a first side surface 1b that connects the first surface 1a and the third surface 1c. The first surface 1a faces away from the second substrate 2, and the first surface 1a can be a light-emitting surface for arranging light-emitting devices (not shown) and a first pad 11. The second substrate 2 includes a second surface 2a and a fourth surface 2c that face away from each other, and a second side surface 2b that connects the second surface 2a and the fourth surface 2c. The second surface 2a faces away from the first substrate 1, and the second surface 2a can be a light-emitting surface for arranging light-emitting devices and a second pad 22. The adhesive layer 3 is used to bond the third surface 1c and the fourth surface 2c.

[0034] The driving backplane 10 further includes a first side-walk routing 11, a second side-walk routing 21, and a connector 4. The first side-walk routing 11 is arranged on the first side surface 1b and extends to the first surface 1a and is electrically connected to the first pad 12. The second side-walk routing 21 is arranged on the second side surface 2b and extends to the second surface 2a and is electrically connected to the second pad 22. The connector 4 is arranged on one side of the adhesive layer 3 facing the first side-walk routing 11 and the second side-walk routing 21, and electrically connects the first side-walk routing 11 and the second side-walk routing 21. The driving backplane 10 provided by the present application segments the side-walk routing, and a connector 4 is arranged between the first side-walk routing 11 and the second side-walk routing 21. The connector 4 is arranged outside the adhesive layer 3 and is used to electrically connect the first side-walk routing 11 and the second side-walk routing 21, reducing the influence of the adhesive layer 3 on the side-walk routing and improving the reliability of the side-walk routing at the splicing position of the two substrates.

[0035] Optionally, the connecting member 4 has a spherical structure, which increases the contact surfaces between the connecting member 4 and the first side routing 11 and the second side routing 21, improving the connection reliability. The material of the connecting member 4 includes tin, that is, the connecting member 4 can be a tin ball to ensure electrical conductivity. Of course, in other embodiments, the connecting member 4 can include other conductive materials.

[0036] Optionally, referring to Figure 2 , Figure 2 is a right view of an embodiment of the driving backplane of the present application. The number of the first side routings 11, the second side routings 21, and the connecting members 4 is multiple, and the multiple first side routings 11, the multiple second side routings 21, and the multiple connecting members 4 are all arranged at intervals along the first direction ( Figure 2 the X direction in

[0037] Referring to Figure 3 , Figure 3 is a schematic structural view of another embodiment of the driving backplane of the present application. The difference from the embodiment shown in Figure 1 is that the first side surface 1b is provided with a first groove 1d, the first groove 1d communicates with the third surface 1c, the first side routing 11 extends into the first groove 1d, and the connecting member 4 is located in the first groove 1d. The first groove 1d is used to accommodate the connecting member 4, providing a receiving space for the connecting member 4, avoiding excessive protrusion of the connecting member 4 from the first side surface 1b, thereby reducing the border of the display panel and avoiding an overly large splicing seam of the display panel. Since the first side routing 11 extends into the first groove 1d, the connecting member 4 can be electrically connected to the first side routing 11. The first groove 1d can also be provided on the second side surface 2b and communicate with the fourth surface 2c.

[0038] Referring to Figure 4 , Figure 4 is a schematic structural view of another embodiment of the driving backplane of the present application. The difference from the embodiment shown in Figure 3 is that the first side surface 1b is not provided with the first groove 1d, the second side surface 2b is provided with a second groove 2d, the second groove 2d communicates with the fourth surface 2c, the second side routing 21 extends to the edge of the second groove 2d, and the connecting member 4 is located in the second groove 2d and overlaps with the second side routing 21 and the first side routing 11 to achieve electrical connection.

[0039] Referring to Figure 5 , Figure 5 is a schematic structural view of another embodiment of the driving backplane of the present application. The difference from the embodiment shown in Figure 3The difference of the illustrated embodiment lies in that a second groove 2d is further provided on the second side surface 2b. The second groove 2d communicates with the fourth surface 2c. The second side-walk line 21 extends into the second groove 2d. Meanwhile, the first groove 1d and the second groove 2d enclose to form a receiving groove, and the connecting member 4 is located in the receiving groove. The second groove 2d and the first groove 1d enclose to expand the volume of the receiving groove, further increasing the accommodation space for the connecting member 4 and further reducing the frame, avoiding an overly large splicing seam.

[0040] Optionally, the first groove 1d and the second groove 2d are both arranged at intervals along the first direction and are correspondingly arranged with the first side-walk line 11 and the second side-walk line 21, so that the connecting members 4 in the first groove 1d or the receiving groove are arranged at intervals along the first direction and are electrically connected to the first side-walk line 11 and the second side-walk line 21. The spaced-apart receiving grooves prevent adjacent connecting members 4 from contacting, so that the connecting members 4 are not connected to each other, avoiding short-circuit of the side-walk lines.

[0041] Optionally, continue to refer to Figure 5 , the opening area of the first groove 1d gradually increases from the groove bottom to the groove opening. This facilitates forming the connecting member 4 in the first groove 1d. Optionally, the second groove 2d is symmetrically arranged with the first groove 1d. In this embodiment, the inner wall of the first groove 1d is an arc-shaped concave surface, which can be more adapted to the spherical connecting member 4. In other embodiments, the inner wall of the first groove 1d can also be an inclined surface. The opening shape of the first groove 1d on the first side surface 1b can be a quarter circle or a rectangle, etc., and the present application does not make specific limitations.

[0042] Optionally, the first groove 1d includes a first side wall 1d1. The first side-walk line 11 passes through the first side wall 1d1, and the first side wall 1d1 is inclined relative to the first side surface 1b. The first side wall 1d1 can be an inclined surface or an inclined curved surface, so that the metal layer formed on the first side wall 1d1 can be exposed on the first side surface 1b, facilitating the etching laser to act on the metal layer to form a plurality of spaced-apart first side-walk lines 11. And since the corner between the first side wall 1d1 and the first side surface 1b is an obtuse angle, the probability of breakage of the first side-walk line 11 is reduced. Optionally, the shape of the second groove 2d can be the same as that of the first groove 1d.

[0043] The present application also provides a display panel, including the driving backplane 10 of any embodiment and a light-emitting device. The light-emitting device is arranged on the first surface 1a of the first substrate 1 and the second surface 2a of the second substrate 2 and is electrically connected to the first substrate 1 and the second substrate 2 to achieve double-sided display of the display panel. In other embodiments, the light-emitting device can also be arranged only on one of the first surface 1a of the first substrate 1 or the second surface 2a of the second substrate 2, and the other surface can be provided with driving chips, flexible circuit boards, etc.

[0044] Refer to Figure 6, this application also provides a method for manufacturing a driving backplane, and this method includes the following steps:

[0045] Step S110: Form a first pad 12 on the first surface 1a of the first substrate 1.

[0046] Step S120: As Figure 7a shown, form a first side-walking trace 11 on the first surface 1a. The first side-walking trace 11 is electrically connected to the first pad 12 and extends along the first surface 1a to the first side surface 1b.

[0047] Step S130: Form a second pad 22 on the second surface 2a of the second substrate 1.

[0048] Step S140: Continuing to refer to Figure 7a , form a second side-walking trace 21 on the second surface 2a. The second side-walking trace 21 is electrically connected to the second pad 22 and extends along the second surface 2a to the second side surface 2b.

[0049] The order of step S110 and step S130 is not limited, and the order of step S120 and step S140 is not limited either, and they can also be formed simultaneously. Taking the first side-walking trace 11 as an example, forming the first side-walking trace 11 may specifically include: First, coat and form a first metal layer on the first side surface 1b and a part of the first surface 1a connected to the first side surface 1b by physical vapor deposition (PVD) or other methods; then remove part of the first metal layer by laser etching to form a plurality of first side-walking traces 11 arranged at intervals.

[0050] Step S150: As Figure 7b shown, form an adhesive layer 3 between the first substrate 1 and the second substrate 2, bond the first substrate 1 and the second substrate 2, so that the first surface 1a and the second surface 2a are arranged back to back. Specifically, the adhesive layer 3 can be first formed on the third surface 1c or the fourth surface 2c, and then the third surface 1c and the fourth surface are pasted. The laser etching steps in step S120 and S140 make the positions where the first side-walking trace 11 and the second side-walking trace 21 are formed at a high temperature. Since the laser etching step precedes the formation of the adhesive layer 3, the adhesive layer 3 will not be deformed due to the high temperature of the laser, thereby avoiding the influence of the adhesive layer 3 on the first side-walking trace 11. The same applies to the second side-walking trace 21 and the first side-walking trace 11, thus ensuring the reliability of the first side-walking trace 11 and the second side-walking trace 21.

[0051] Step S160: As Figure 1As shown, a connector 4 is formed on the side of the adhesive layer 3 facing the first side wiring 11 and the second side wiring 21, and the connector 4 electrically connects the first side wiring 11 and the second side wiring 21. The connector 4 is arranged corresponding to the intersection of the first side wiring 11 and the second side wiring 21, and is arranged outside the adhesive layer 3, so that the first side wiring 11 and the second side wiring 21 are connected.

[0052] See also Figure 8 The present application also provides another method for preparing a driving backplane, the method comprising the following steps:

[0053] Step S210: Figure 9 As shown, a first groove 1d is formed on the first side 1b, the first groove 1d is connected to the third surface 1c of the first substrate 1, and a second groove 2d is formed on the second side 2b, the second groove 2d is connected to the fourth surface 2c of the second substrate 2. In this embodiment, after the first substrate 1 and the second substrate 2 are spliced, the first groove 1d and the second groove 2d are combined to form a receiving groove. In other embodiments, only the first groove 1d or the second groove 2d may be provided.

[0054] Further, see Figure 10 This step may also include: laminating the first substrate 1 and the second substrate 2 so that the first surface 1a and the second surface 2a are arranged back to back, and the first side surface 1b and the second side surface 2b are arranged flush.

[0055] A first groove 1d and a second groove 2d are formed on the surface where the first side surface 1b and the second side surface 2b are located. The two can be formed simultaneously to improve the preparation efficiency and ensure the shape and size of the formed receiving groove. In this step, the first groove 1d and the second groove 2d are semicircular grooves, which are surrounded to form a circular groove. In other embodiments, the receiving groove can also be a semicircular groove, a trapezoidal groove, a rectangular groove, etc., which is not specifically limited in this application.

[0056] Optionally, in this step, it may also include: forming a first chamfer 1e at the intersection of the first side 1b and the first surface 1a, and / or forming a second chamfer 2e at the intersection of the second side 2b and the second surface 2a. The above chamfer design can reduce the probability of the first side edge trace 11 and the second side edge trace 21 being broken at the corner.

[0057] Step S220: Figure 11As shown, a first side-walking trace 11 is formed on the first surface 1a. The first side-walking trace 11 is electrically connected to the first pad 12 and extends to the first side surface 1b and the first groove 1d. A second side-walking trace 21 is formed on the second surface 2a. The second side-walking trace 21 is electrically connected to the second pad 22 and extends to the second side surface 2b and the second groove 2d. To ensure that the subsequent connector 4 can contact and be electrically connected to the first side-walking trace 11 and the second side-walking trace 21. In other embodiments where only the first groove 1d is provided, the first side-walking trace 11 extends to the first groove 1d, and the second side-walking trace 21 extends to the junction of the second side surface 2b and the fourth surface 2c. In other embodiments, the first side-walking trace 11 and the second side-walking trace 21 may also only extend to the edges of the first groove 1d and the second groove 2d, as long as the lap joint between the connector 4 and the traces can be achieved.

[0058] Step S230: Form the connector 4 in the accommodation groove. In other embodiments, the connector 4 may also be formed only in the first groove 1d or the second groove 2d. Since the connector 4 is located in the accommodation groove, the degree of protrusion of the connector 4 from the first side surface 1b and the second side surface 2b is reduced, thereby narrowing the frame. And the accommodation groove can prevent the overflow of the connector 4 and reduce the probability of contact and short circuit between two adjacent connectors 4.

[0059] The above is only the implementation mode of this application, and it does not limit the patent scope of this application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of this application.

Claims

1. A driving backplane, characterized in that, Comprising: A first substrate, an adhesive layer, and a second substrate stacked in sequence, wherein the first substrate includes a first surface facing away from the second substrate and a first side surface connected to the first surface, the second substrate includes a second surface facing away from the first substrate and a second side surface connected to the second surface, the first surface is provided with a first pad, and the second surface is provided with a second pad; A first side-walking trace, electrically connecting the first pad and extending along the first surface to the first side surface; A second side-walking trace, electrically connecting the second pad and extending along the second surface to the second side surface; A connecting member, disposed on a side of the adhesive layer facing the first side-walking trace and the second side-walking trace, and electrically connecting the first side-walking trace and the second side-walking trace.

2. The driving backplane according to claim 1, wherein: The first side surface is provided with a first groove, the first groove communicates with a third surface of the first substrate facing away from the first surface, and the connecting member is located in the first groove; and / or, The second side surface is provided with a second groove, the second groove communicates with a fourth surface of the second substrate facing away from the second surface, and the connecting member is located in the second groove; Preferably, the first side-walking trace extends into the first groove, and / or, the second side-walking trace extends into the second groove.

3. The driving backplane according to claim 2, wherein: When the first side surface is provided with a first groove and the second side surface is provided with a second groove, the first groove and the second groove enclose a receiving groove, and the connecting member is located in the receiving groove.

4. The driving backplane according to claim 2, wherein: The connecting member has a spherical structure; Preferably, the material of the connecting member includes tin; Preferably, the number of the first side-walking traces, the second side-walking traces, and the connecting members is multiple, and the multiple first side-walking traces, the multiple second side-walking traces, and the multiple connecting members are all arranged at intervals in a first direction; Preferably, the first grooves are arranged in one-to-one correspondence with the first side-walking traces, and / or, the second grooves are arranged in one-to-one correspondence with the second side-walking traces.

5. The driving backplane according to claim 2, wherein: The opening area of the first groove and / or the second groove gradually increases from the groove bottom to the groove opening; Preferably, the first groove includes a first side wall, the first side-walking trace passes through the first side wall, and the first side wall is inclined relative to the first side surface; and / or, the second groove includes a second side wall, the second side-walking trace passes through the second side wall, and the second side wall is inclined relative to the second side surface.

6. A display panel, characterized in that, Comprising: The driving backplane according to any one of claims 1-5; A light-emitting device, disposed on the first surface of the first substrate and / or the second surface of the second substrate, the light-emitting device is electrically connected to the first substrate, and / or, the light-emitting device is electrically connected through the second substrate.

7. A method for preparing a driving backplane, characterized in that, Comprising: Forming a first pad on the first surface of the first substrate; Form a first side running trace on the first surface, the first side running trace being electrically connected to the first pad and extending along the first surface to the first side surface; Form a second pad on the second surface of the second substrate; Form a second side running trace on the second surface, the second side running trace being electrically connected to the second pad and extending along the second surface to the second side surface; Form an adhesive layer between the first substrate and the second substrate to bond the first substrate and the second substrate so that the first surface and the second surface are disposed opposite to each other; Form a connecting member on a side of the adhesive layer facing the first side running trace and the second side running trace, the connecting member being electrically connected to the first side running trace and the second side running trace.

8. The manufacturing method of the driving backplane according to claim 7, wherein Before the step of forming a first side running trace on the first surface, the first side running trace being electrically connected to the first pad and extending along the first surface to the first side surface, further includes: Form a first groove on the first side surface, the first groove communicating with a third surface of the first substrate opposite to the first surface; and / or, Before the step of forming a second side running trace on the second surface, the second side running trace being electrically connected to the second pad and extending along the second surface to the second side surface, further includes: Form a second groove on the second side surface, the second groove communicating with a fourth surface of the second substrate opposite to the second surface.

9. The manufacturing method of the driving backplane according to claim 8, wherein, The step of forming a connecting member on a side of the adhesive layer facing the first side running trace and the second side running trace, the connecting member being electrically connected to the first side running trace and the second side running trace, further includes: Form the connecting member in the first groove and / or the second groove.

10. The method for preparing a driving backplane according to claim 8, wherein Form a first groove on the first side surface, the first groove communicating with a third surface of the first substrate opposite to the first surface; The step of forming a second groove on the second side surface, the second groove communicating with a fourth surface of the second substrate opposite to the second surface, includes: Bond the first substrate and the second substrate so that the first surface and the second surface are disposed opposite to each other, and the first side surface and the second side surface are flush; Simultaneously form the first groove and the second groove on the plane where the first side surface and the second side surface are located.

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