Display panel, preparation method thereof and display module

Abstract

The invention provides a display panel, a preparation method thereof and a display module, relates to the technical field of display, and improves the packaging effect of the display panel. According to the embodiment of the invention, at least one first opening is formed in the first dam, so that the organic packaging layer in the first dam is guided to the space between the first dam and the second dam, and the organic packaging layer between the first dam and the second dam is used for raising the inorganic packaging layer between the first dam and the second dam; therefore, the climbing height of the inorganic packaging layer is reduced, and the stress of the inorganic packaging layer is released by utilizing the elasticity of the organic packaging layer, so that the concentrated stress in the stretching process is reduced, the risk that the inorganic packaging layer generates cracks in the stretching process is reduced, and the packaging effect of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel, a preparation method thereof, and a display module. Background Art

[0002] In recent years, with the development of display technologies, stretchable display panels have gradually come into people's view and have broad application prospects in fields such as display and lighting. However, the encapsulation effect of existing stretchable display panels is poor, and problems such as encapsulation failure are likely to occur.

[0003] Therefore, how to improve the encapsulation effect of display panels has become an urgent problem to be solved. Summary of the Invention

[0004] To solve the above technical problems, the present application is proposed. An embodiment of the present application provides a display panel, a preparation method thereof, and a display module.

[0005] In a first aspect, an embodiment of the present application provides a display panel. The display panel has an island region, and the island region includes a display region and an edge region surrounding the display region; the display panel includes a substrate, sub-pixels, dams, and an encapsulation structure layer. Among them, the sub-pixels are located on one side of the substrate and in the display region; the dams are located in the edge region. The dams include a plurality of dam units. The dams and the sub-pixels are on the same side of the substrate. The plurality of dam units include a first dam and at least one second dam. The first dam surrounds the sub-pixels. The first dam has at least one first opening. In the direction from the display region to the edge region, the first opening penetrates the first dam. The second dam is located on the side of the first opening away from the display region; the encapsulation structure layer is stacked on the side of the sub-pixels and the plurality of dam units away from the substrate. The encapsulation structure layer includes a stacked inorganic encapsulation layer and an organic encapsulation layer. The orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the sub-pixels and the plurality of dam units on the substrate. The organic encapsulation layer is located in the display region, inside the first opening, and between the first dam and the second dam.

[0006] In combination with the first aspect, in some implementation manners of the first aspect, in the thickness direction of the display panel, the height of the second dam is less than the height of the first dam.

[0007] In combination with the first aspect, in some implementation manners of the first aspect, at least one second dam includes one second dam, and the second dam surrounds the first dam.

[0008] Preferably, at least one first opening includes a plurality of first openings, and the plurality of first openings are arranged at intervals in the direction of surrounding the sub-pixels.

[0009] In combination with the first aspect, in some implementations of the first aspect, the display panel further has a bridging region, which is located outside the island region and connected to the island region; the edge region includes a connecting sub-region, the connecting sub-region is connected to the bridging region, and at least a part of the first opening is located in the connecting sub-region.

[0010] Preferably, the connecting sub-region, the first opening, and the second dam are in one-to-one correspondence.

[0011] In combination with the first aspect, in some implementations of the first aspect, the plurality of dam units further include a third dam, the third dam is located on the side of the first dam close to the display region, the third dam surrounds the sub-pixel, the third dam includes at least one second opening, in the direction from the display region to the edge region, the second opening penetrates the third dam, and the organic encapsulation layer is also located in the second opening and between the third dam and the first dam.

[0012] Preferably, at least a part of the second opening and the first opening are coaxial.

[0013] Preferably, at least one second opening includes a plurality of second openings, and the plurality of second openings are arranged at intervals along the direction of surrounding the sub-pixel.

[0014] Preferably, in the thickness direction of the display panel, the height of the third dam is greater than or equal to the height of the first dam.

[0015] In combination with the first aspect, in some implementations of the first aspect, the dam further includes a dam base, the dam base is stacked on the side of the plurality of dam units close to the substrate, and the orthographic projection of the plurality of dam units on the substrate is within the orthographic projection range of the dam base on the substrate. The dam base includes at least one groove, and the groove is located on the side of the dam unit close to the display region.

[0016] Preferably, the orthographic projection of at least a part of the first opening on the substrate is within the orthographic projection range of the groove on the substrate.

[0017] In combination with the first aspect, in some implementations of the first aspect, the second dam includes a first surface close to the substrate and a second surface facing away from the substrate, and the orthographic projection of the first surface on the substrate is within the orthographic projection range of the second surface on the substrate.

[0018] Second aspect, an embodiment of the present application provides a method for manufacturing a display panel. The manufacturing method includes: preparing a plurality of sub-pixels and dams on one side of a substrate. The dams include a plurality of dam units. The plurality of dam units include a first dam and at least one second dam. The first dam surrounds the sub-pixels, and the second dam is located on the side of the first dam away from the sub-pixels; forming at least one first opening in the first dam. Wherein, the at least one second dam includes one second dam, and the second dam is in a ring structure, or the at least one second dam includes a plurality of second dams, and at least part of the second dams are located on the side of the first opening away from the sub-pixels; preparing an encapsulation structure layer on the side of the sub-pixels and the plurality of dam units away from the substrate. The encapsulation structure layer includes a stacked inorganic encapsulation layer and an organic encapsulation layer. The orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the sub-pixels and the plurality of dam units on the substrate. The corresponding organic encapsulation material of the organic encapsulation layer fills the area surrounded by the first dam and overflows through the first opening to between the first dam and the second dam; etching a hollow pattern between adjacent second dams to form a plurality of island regions and bridging regions connecting adjacent island regions, obtaining a display panel. The island region includes sub-pixels and a plurality of dam units surrounding the sub-pixels. The sub-pixels include a plurality of conductive layers, and at least one conductive layer includes a bridge wire located in the bridging region. The bridge wire connects the sub-pixels of adjacent island regions.

[0019] In combination with the second aspect, in some implementation manners of the second aspect, the dam further includes a dam base. The dam base is stacked on the side of the plurality of dam units close to the substrate. The orthographic projection of the plurality of dam units on the substrate is within the orthographic projection of the dam base on the substrate. Before preparing the encapsulation structure layer on the side of the sub-pixels and the plurality of dam units away from the substrate, it further includes: etching at least one groove in the dam base. The groove is located on the side of the dam unit close to the sub-pixels.

[0020] Third aspect, an embodiment of the present application provides a display module. The display module includes the display panel provided in any of the above embodiments.

[0021] The display panel provided by the embodiment of the present application has an island area, and the island area includes a display area and an edge area surrounding the display area; the display panel includes a substrate, sub-pixels, dams, and a packaging structure layer. Among them, the sub-pixels are located on one side of the substrate and within the display area; the dams are located in the edge area. The dams include a plurality of dam units. The dams and the sub-pixels are located on the same side of the substrate. The plurality of dam units include a first dam and at least one second dam. The first dam surrounds the sub-pixels. The first dam has at least one first opening. In the direction from the display area to the edge area, the first opening penetrates the first dam. The second dam is located on the side of the first opening away from the display area; the packaging structure layer is stacked on the side of the sub-pixels and the plurality of dam units away from the substrate. The packaging structure layer includes a stacked inorganic packaging layer and an organic packaging layer. The orthographic projection of the inorganic packaging layer on the substrate covers the orthographic projection of the sub-pixels and the plurality of dam units on the substrate. The organic packaging layer is located within the display area, the first opening, and between the first dam and the second dam. In the embodiment of the present application, the organic packaging layer between the first dam and the second dam raises the inorganic packaging layer between the first dam and the second dam, thereby reducing the climbing height of the inorganic packaging layer, and using the elasticity of the organic packaging layer at this place to release the stress of the inorganic packaging layer, thereby reducing the stress concentrated during the stretching process, and further reducing the risk of cracks in the inorganic packaging layer during the stretching process, thereby improving the packaging effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] By describing the embodiments of the present application in more detail in conjunction with the drawings, the above and other objects, features, and advantages of the present application will become more obvious. The drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. They are used to explain the present application together with the embodiments of the present application and do not constitute a limitation to the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0023] Figure 1 The top view structural schematic diagram of the display panel provided by an embodiment of the present application is shown.

[0024] Figure 2a The cross-sectional structural schematic diagram of the display panel provided by an embodiment of the present application is shown.

[0025] Figure 2b The cross-sectional structural schematic diagram of the display panel provided by another embodiment of the present application is shown.

[0026] Figure 3 The top view structural schematic diagram of the display panel provided by another embodiment of the present application is shown.

[0027] Figure 4 The top view structural schematic diagram of the display panel provided by another embodiment of the present application is shown.

[0028] Figure 5The figure shows a top - view structural schematic diagram of a display panel provided by another embodiment of the present application.

[0029] Figure 6 The figure shows a cross - sectional structural schematic diagram of a display panel provided by another embodiment of the present application.

[0030] Figure 7 The figure shows a cross - sectional structural schematic diagram of a display panel provided by another embodiment of the present application.

[0031] Figure 8 The figure shows a cross - sectional structural schematic diagram of a display panel provided by another embodiment of the present application.

[0032] Figure 9 The figure shows a cross - sectional structural schematic diagram of a display panel provided by another embodiment of the present application.

[0033] Figure 10 The figure shows a flowchart of a preparation method of a display panel provided by an embodiment of the present application.

[0034] Figure 11 The figure shows a structural schematic diagram of a display device provided by an embodiment of the present application.

[0035] Reference numerals: display panel 100; island region A; display region A1; edge region A2; bridging region B; connection sub - region A21; substrate 110; sub - pixel 120; first dam dam1; second dam dam2; third dam dam3; inorganic encapsulation layer 131; organic encapsulation layer 132; dam base dam; first groove C1; second groove C2; first surface D1; second surface D2; display device 10. Detailed embodiments

[0036] As described in the background art, in the existing stretchable display panel, since the distance between the side of the dam closest to the bridging region in the island region away from the substrate surface and the side of the dam close to the substrate surface is relatively large, the climbing height of the inorganic encapsulation layer on the side of the dam away from the sub - pixel is relatively large. During the stretching process, the stress on the inorganic encapsulation layer on the side of the dam away from the sub - pixel is relatively large, so that cracks are likely to occur, resulting in encapsulation failure and poor encapsulation effect.

[0037] To solve the above technical problems, the present application is proposed. In the embodiments of the present application, at least one first opening is formed in the first dam, so as to drain the organic encapsulation layer in the first dam to the space between the first dam and the second dam. The organic encapsulation layer between the first dam and the second dam is used to raise the inorganic encapsulation layer between the first dam and the second dam, thereby reducing the climbing height of the inorganic encapsulation layer. The stress of the inorganic encapsulation layer is released by the elasticity of the organic encapsulation layer at this place, thereby reducing the stress concentrated in the stretching process, and further reducing the risk of cracks generated in the inorganic encapsulation layer during the stretching process, thus improving the encapsulation effect of the display panel.

[0038] Next, the technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0039] In addition, for better illustration of the present application, numerous specific details are given in the following specific implementation manners. Those skilled in the art should understand that the present application can be implemented without some specific details. In some instances, methods and means well known to those skilled in the art are not described in detail to highlight the gist of the present application.

[0040] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0041] In addition, terms such as "first" and "second" are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0042] Figure 1 The top view structural schematic diagram of the display panel provided by an embodiment of the present application is shown. Figure 2a The cross-sectional structural schematic diagram of the display panel provided by an embodiment of the present application is shown. Figure 2a Shown is along Figure 1 The cross-sectional structural schematic diagram of the line N1-N2 in. Combining Figure 1 and 2aAs shown in the figure, an embodiment of the present application provides a display panel 100. The display panel 100 has an island region A, and the island region A includes a display region A1 and a peripheral region A2 surrounding the display region A1. The display panel 100 includes a substrate 110, sub-pixels 120, dams, and an encapsulation structure layer. Among them, the sub-pixels 120 are located on one side of the substrate 110 and within the display region A1. The dams are located in the peripheral region A2. The dams include a plurality of dam units. The dams and the sub-pixels 120 are located on the same side of the substrate 110. The plurality of dam units include a first dam dam1 and at least one second dam dam2. The first dam dam1 surrounds the sub-pixels 120. The first dam dam1 has at least one first opening. In the direction from the display region A1 to the peripheral region A2, the first opening penetrates the first dam dam1. The second dam dam2 is located on the side of the first opening away from the display region A1. Figure 1 (not labeled) and an organic encapsulation layer 132. The orthographic projection of the inorganic encapsulation layer 131 on the substrate 110 covers the orthographic projections of the sub-pixels 120 and the plurality of dam units on the substrate 110. The organic encapsulation layer 132 is located within the display region A1, the first opening, and between the first dam dam1 and the second dam dam2.

[0043] Reference Figure 1 and 2a , taking the example that at least one second dam dam2 includes four second dams dam2, where two second dams dam2 are respectively located on opposite sides of the first dam dam1, and the other two second dams dam2 are respectively located on the other opposite sides of the first dam dam1. At least one first opening includes four first openings, where two first openings are respectively located on opposite sides of the sub-pixels 120, and the other two first openings are respectively located on the other opposite sides of the sub-pixels 120. Each second dam dam2 is located on the side of the first opening away from the display region A1 to block the organic encapsulation layer 132 on the side of the second dam dam2 close to the display region A1, without causing the organic encapsulation layer 132 to overflow and affect the encapsulation effect of the bridging region.

[0044] In an embodiment of the present application, at least one first opening is formed in the first dam (dam1), so as to drain the organic encapsulation layer 132 in the first dam (dam1) between the first dam (dam1) and the second dam (dam2). The inorganic encapsulation layer 131 between the first dam (dam1) and the second dam (dam2) is raised by the organic encapsulation layer 132 between the first dam (dam1) and the second dam (dam2), thereby reducing the climbing height of the inorganic encapsulation layer 131. The stress of the inorganic encapsulation layer 131 is released by the elasticity of the organic encapsulation layer 132 at this position, thereby reducing the stress concentrated during the stretching process, further reducing the risk of cracks generated in the inorganic encapsulation layer 131 during the stretching process, and thus improving the encapsulation effect of the display panel 100.

[0045] Reference Figure 2a , in the thickness direction of the display panel 100, the height of the second dam (dam2) is less than the height of the first dam (dam1).

[0046] In the display panel 100 provided by the embodiment of the present application, the height of the second dam (dam2) is small, thereby further reducing the climbing height of the inorganic encapsulation layer 131, further reducing the stress concentrated during the stretching process, further reducing the risk of cracks generated in the inorganic encapsulation layer 131 during the stretching process, and thus further improving the encapsulation effect of the display panel 100.

[0047] Figure 2b The figure shows a schematic cross-sectional structure diagram of a display panel provided by another embodiment of the present application. Figure 2b The figure shows along Figure 1 The cross-sectional structure diagram of the line N1-N2 in Figure 1 and 2b As shown, preferably, the sub-pixel 120 includes a first semiconductor layer (PSI1) and a plurality of first conductive layers stacked in a direction gradually away from the substrate 110. The dam unit includes a second semiconductor layer (PSI2) and at least one second conductive layer stacked in a direction gradually away from the substrate 110. Any one of the second conductive layers and a first conductive layer are arranged on the same layer, so that the first conductive layer and the second conductive layer can be formed simultaneously, reducing the process steps and improving the production efficiency.

[0048] Reference Figure 2b , the plurality of first conductive layers stacked in a direction gradually away from the substrate 110 include a first metal layer (M1), a second metal layer (M2), a third metal layer (M3) and an anode layer (Anode). The at least one second conductive layer stacked in a direction gradually away from the substrate 110 includes a first metal layer (M1), a second metal layer (M2), and a third metal layer (M3).

[0049] Preferably, the sub-pixel 120 further includes a plurality of first insulating layers located between adjacent first conductive layers; the dam unit further includes a plurality of second insulating layers located between adjacent second conductive layers. Any one of the first insulating layers and a second insulating layer are arranged on the same layer, so that the first insulating layer and the second insulating layer can be simultaneously fabricated, reducing the process steps and improving the production efficiency.

[0050] Reference Figure 2b , the plurality of first insulating layers stacked in a direction gradually away from the substrate 110 include a gate insulating layer GI, a capacitor insulating layer CI, an interlayer insulating layer ILD, and a planarization layer PLN. The plurality of second insulating layers stacked in a direction gradually away from the substrate 110 include a gate insulating layer GI, a capacitor insulating layer CI, an interlayer insulating layer ILD, and a planarization layer PLN.

[0051] Figure 3 The following is a top view structural schematic diagram of a display panel provided by another embodiment of the present application. As Figure 3 shown, in the display panel 100 provided by the embodiment of the present application, at least one second dam dam2 includes one second dam dam2, and the second dam dam2 surrounds the first dam dam1.

[0052] That is to say, the second dam dam2 is a closed structure to enclose the organic encapsulation layer 132 within the second dam dam2, thereby improving the ability of the second dam dam2 to prevent the organic encapsulation layer 132 from overflowing, which is beneficial to improving the encapsulation effect of the display panel 100.

[0053] Preferably, at least one first opening includes a plurality of first openings, and the plurality of first openings are arranged at intervals in a direction surrounding the sub-pixel 120. Reference Figure 3 , taking at least one first opening including four first openings as an example, the four first openings are respectively located above, below, to the left, and to the right of the sub-pixel 120.

[0054] Figure 4 The following is a top view structural schematic diagram of a display panel provided by another embodiment of the present application. As Figure 4 shown, in the display panel 100 provided by the embodiment of the present application, the display panel 100 further has a bridging area B, the bridging area B is located outside the island area A and is connected to the island area A; the edge area A2 includes a connecting sub-area A21, the connecting sub-area A21 is connected to the bridging area B, and at least part of the first openings are located in the connecting sub-area A21.

[0055] During the stretching process of the display panel 100 , since the connecting sub-area A21 is connected to the bridging area B, the inorganic encapsulation layer 131 of the connecting sub-area A21 is subjected to the greatest stress and is most likely to crack. Therefore, the embodiment of the present application sets the first opening in the connecting sub-area A21, and for the connecting sub-area A21, the organic encapsulation layer 132 in the first dam dam1 is drained to between the first dam dam1 and the second dam dam2, and the organic encapsulation layer 132 between the first dam dam1 and the second dam dam2 is used to raise the inorganic encapsulation layer 131 between the first dam dam1 and the second dam dam2, thereby reducing the climbing height of the inorganic encapsulation layer 131 in the connecting sub-area A21, and releasing the stress of the inorganic encapsulation layer 131 by using the elasticity of the organic encapsulation layer 132 there, thereby reducing the stress on the connecting sub-area A21 during the stretching process, and further reducing the risk of cracks in the inorganic encapsulation layer 131 in the connecting sub-area A21 during the stretching process, thereby improving the encapsulation effect of the display panel 100.

[0056] Preferably, the connection sub-region A21, the first opening, and the second dam dam2 correspond to each other. That is, each connection sub-region A21 is provided with a first opening to reduce the stress on the connection sub-region A21 during the stretching process, and a second dam dam2 is provided on the side of the first opening away from the display region A1 to prevent the organic encapsulation layer 132 from overflowing.

[0057] refer to Figure 2b Preferably, the display panel 100 further includes a bridge line I1 and a lead line I2, the bridge line I1 is located in the bridge area B, the lead line I2 is located on the side of the dam close to the substrate 110, the sub-pixel 120 includes a pixel circuit 121, and the lead line I2 connects the pixel circuit 121 and the bridge line I1.

[0058] In the embodiment of the present application, one end of the lead wire I2 is connected to the pixel circuit 121, and the other end is connected to the bridge wire I1. The bridge wire I1 is used to connect the sub-pixels 120 located in the adjacent island area A. The embodiment of the present application uses the lead wire I2 to realize the electrical connection between the pixel circuit 121 and the bridge wire I1, and uses the bridge wire I1 to realize the electrical connection between the sub-pixels 120 in the adjacent island area A.

[0059] Preferably, the display panel 110 further includes a buffer layer 150, the buffer layer 150 is located between the substrate 110 and the sub-pixel 120, and between the substrate 110 and the dam, and the lead wire I2 is located in the buffer layer 150. In the display panel 100 provided in the embodiment of the present application, the position of the buffer layer 150 does not affect the thickness of the dam, that is, the thickness of the dam is relatively large, so that the lead wire I2 is used to realize the electrical connection between the pixel circuit and the bridge wire I1, and the ability of the dam to prevent overflow of the organic encapsulation layer 132 is improved.

[0060] It should be noted that the buffer layer 150 includes two sub-buffer layers, and the lead wire I2 is located within the buffer layer 150, which means it is located between the two sub-buffer layers.

[0061] Preferably, the dam includes a conductive hole K. The conductive hole K penetrates a part of the dam along the thickness direction of the dam. The lead wire I2 is connected to the bridge wire I1 through the conductive hole K, thereby realizing the electrical connection between the pixel circuit 121 and the bridge wire I1 by means of the lead wire I2.

[0062] Figure 5 The figure shows a top view structural schematic diagram of a display panel provided by another embodiment of the present application. Figure 6 The figure shows a cross-sectional structural schematic diagram of a display panel provided by another embodiment of the present application. Figure 6 As shown along Figure 5 the cross-sectional structural schematic diagram of the line N3-N4 in Figure 5 and 6 As shown in the figure, in the display panel 100 provided by the embodiment of the present application, the plurality of dam units further include a third dam dam3. The third dam dam3 is located on the side of the first dam dam1 close to the display area A1. The third dam dam3 surrounds the sub-pixel 120. The third dam dam3 includes at least one second opening. In the direction from the display area A1 to the edge area A2, the second opening penetrates the third dam dam3. The organic encapsulation layer 132 is also located within the second opening, as well as between the third dam dam3 and the first dam dam1.

[0063] In the embodiment of the present application, by providing the third dam dam3, the ability to prevent the organic encapsulation layer 132 from overflowing is further improved. And by providing the second opening, the organic encapsulation layer 132 within the third dam dam3 is drained to the space between the third dam dam3 and the first dam dam1, and further drained to the space between the first dam dam1 and the second dam dam2 through the first opening, thereby reducing the stress on the inorganic encapsulation layer 131 during the stretching process, and further improving the encapsulation effect of the display panel 100.

[0064] Referring to Figure 5 , preferably, at least part of the second opening and the first opening are coaxial, which is beneficial to improving the drainage effect of the organic encapsulation layer 132. Specifically, the second opening and the first opening being coaxial is beneficial to draining the organic encapsulation layer 132 within the third dam dam3 to the space between the third dam dam3 and the first dam dam1 through the second opening, and further draining it to the space between the first dam dam1 and the second dam dam2 through the first opening.

[0065] Preferably, at least one second opening includes a plurality of second openings, and the plurality of second openings are arranged at intervals along the direction of surrounding the sub-pixel 120. Referring to Figure 5, a plurality of second openings are respectively located above, below, to the left, and to the right of the sub-pixel 120.

[0066] Preferably, in the thickness direction of the display panel 100, the height of the third dam dam3 is greater than or equal to the height of the first dam dam1. Refer to Figure 6 , in the display panel 100 provided by the embodiment of the present application, the height of the third dam dam3 is greater than or equal to the height of the first dam dam1, which is beneficial to preventing the organic encapsulation layer 132 in the third dam dam3 from overflowing into the bridging area B, thereby being beneficial to improving the encapsulation effect of the display panel 100 and not affecting the stretching performance of the bridging area B.

[0067] Figure 7 The following shows a schematic cross-sectional structure diagram of a display panel provided by another embodiment of the present application. Figure 7 The following shows along Figure 5 the cross-sectional structure diagram of the N5-N6 line in Figure 8 The following shows a schematic cross-sectional structure diagram of a display panel provided by another embodiment of the present application. Figure 8 The following shows another along Figure 5 the cross-sectional structure diagram of the N5-N6 line in Figure 7 and 8 As shown in

[0068] Refer to Figure 7 and 8 , in the display panel 100 provided by the embodiment of the present application, the dam further includes a dam base dam, the dam base dam is stacked on the side of the plurality of dam units close to the substrate 110, the orthographic projection of the plurality of dam units on the substrate 110 is within the orthographic projection range of the dam base dam on the substrate 110, and the dam base dam includes at least one groove, and the groove is located on the side of the dam unit close to the display area A1.

[0069] Preferably, the orthographic projection of at least part of the first opening on the substrate 110 is within the orthographic projection range of the groove on the substrate 110. Refer to Figure 7 , the orthographic projection of at least part of the first opening on the substrate 110 is within the orthographic projection range of the second groove C2 on the substrate 110. Refer to Figure 8, at least a part of the first opening and at least a part of the second opening are within the range of the orthographic projection of the second groove C2 on the substrate 110. The groove provided in the embodiment of the present application has a large space for accommodating the organic encapsulation layer 132, thereby not only slowing down the flow rate of the organic encapsulation layer 132 towards the edge area A2, but also being able to accommodate more organic encapsulation materials, thus reducing the risk of the organic encapsulation materials overflowing into the bridging area B.

[0070] Figure 9 The cross-sectional structure schematic diagram of a display panel provided by another embodiment of the present application is shown. Figure 9 Shown as another along Figure 1 The cross-sectional structure schematic diagram of the line N1-N2 in. As Figure 9 Shown, in the display panel 100 provided by the embodiment of the present application, the second dam dam2 includes a first surface D1 close to the substrate 110 and a second surface D2 facing away from the substrate 110, and the orthographic projection of the first surface D1 on the substrate 110 is within the range of the orthographic projection of the second surface D2 on the substrate 110.

[0071] The contact area between the second dam dam2 provided by the embodiment of the present application and the inorganic encapsulation layer 131 is large, so that the adhesion force between the second surface D2 of the second dam dam2 and the inorganic encapsulation layer 131 is large, so that the inorganic encapsulation layer 131 is not easily detached, improving the encapsulation effect of the display panel 100.

[0072] The structure of the display panel 100 provided by the present application has been described in detail above. Next, the manufacturing method of the display panel 100 will be introduced. It can be understood that the manufacturing method corresponds to the structure of the display panel 100. Therefore, the structures mentioned in this manufacturing method can refer to the content of the above display panel 100 and will not be repeated here.

[0073] Figure 10 The flowchart of the manufacturing method of a display panel provided by an embodiment of the present application is shown. As Figure 10 Shown, the embodiment of the present application provides a manufacturing method of a display panel, and this manufacturing method includes the following steps.

[0074] Step S1001, prepare a plurality of sub-pixels 120 and dams on one side of the substrate 110.

[0075] Among them, the dam includes a plurality of dam units, and the plurality of dam units include a first dam dam1 and at least one second dam dam2. The first dam dam1 surrounds the sub-pixel 120, and the second dam dam2 is located on the side of the first dam dam1 away from the sub-pixel 120.

[0076] Step S1002, open at least one first opening on the first dam dam1.

[0077] Among them, at least one second dam dam2 includes a second dam dam2, the second dam dam2 is a ring structure, or at least one second dam dam2 includes a plurality of second dams dam2, and at least part of the second dams dam2 is located on the side of the first opening away from the sub-pixel 120.

[0078] Step S1003, prepare an encapsulation structure layer on the side of the sub-pixel 120 and the plurality of dam units away from the substrate 110.

[0079] Among them, the encapsulation structure layer includes a stacked inorganic encapsulation layer 131 and an organic encapsulation layer 132. The orthographic projection of the inorganic encapsulation layer 131 on the substrate 110 covers the orthographic projection of the sub-pixel 120 and the plurality of dam units on the substrate 110. The organic encapsulation material corresponding to the organic encapsulation layer 132 fills the area surrounded by the first dam dam1 and overflows to between the first dam dam1 and the second dam dam2 through the first opening.

[0080] Step S1004, etch a hollow pattern between adjacent second dams dam2 to form a plurality of island regions A and bridging regions B connecting adjacent island regions A, and obtain the display panel 100.

[0081] Among them, the island region A includes the sub-pixel 120 and a plurality of dam units surrounding the sub-pixel 120. The sub-pixel 120 includes a plurality of conductive layers, and at least one conductive layer includes a bridging wire located in the bridging region B, and the bridging wire connects the sub-pixels 120 of adjacent island regions A.

[0082] The preparation method provided by the embodiment of the present application opens at least one first opening in the first dam dam1, so as to drain the organic encapsulation layer 132 in the first dam dam1 to between the first dam dam1 and the second dam dam2. The organic encapsulation layer 132 between the first dam dam1 and the second dam dam2 pads up the inorganic encapsulation layer 131 between the first dam dam1 and the second dam dam2, thereby reducing the climbing height of the inorganic encapsulation layer 131, and using the elasticity of the organic encapsulation layer 132 at this place to release the stress of the inorganic encapsulation layer 131, thereby reducing the stress concentrated in the stretching process, and further reducing the risk of cracks generated in the inorganic encapsulation layer 131 during the stretching process, thereby improving the encapsulation effect of the display panel 100.

[0083] In some implementations, the dam further includes a dam base dam, the dam base dam is stacked on the side of the plurality of dam units close to the substrate 110, and the orthographic projection of the plurality of dam units on the substrate 110 is within the orthographic projection range of the dam base dam on the substrate 110. Before preparing the encapsulation structure layer on the side of the sub-pixels 120 and the plurality of dam units away from the substrate 110, it further includes: etching at least one groove on the dam base dam, and the groove is located on the side of the dam unit close to the sub-pixels 120.

[0084] In the manufacturing method provided by the embodiments of the present application, by providing at least one groove on the dam base dam, the flow rate of the organic encapsulation layer 132 flowing towards the edge area A2 is slowed down, thereby reducing the risk that the organic encapsulation layer 132 flows out of the island area A due to too fast a flow rate towards the edge area A2, thus improving the encapsulation effect of the display panel 100 and not affecting the tensile performance of the bridging area B.

[0085] In some implementations, the plurality of dam units further includes a third dam dam3, the third dam dam3 is located on the side of the first dam dam1 close to the display area A1, the third dam dam3 surrounds the sub-pixels 120, the third dam dam3 includes at least one second opening, and in the direction from the display area A1 to the edge area A2, the second opening penetrates through the third dam dam3, the organic encapsulation layer 132 is also located within the second opening, and between the third dam dam3 and the first dam dam1.

[0086] The embodiments of the present application also provide a display module, the display module includes the display panel 100 provided in any of the above embodiments, and the technical principles and effects generated by the display module and the display panel 100 are similar, which will not be elaborated here.

[0087] Figure 11 The following is a schematic structural diagram of a display device provided by an embodiment of the present application. As Figure 11 As shown, the embodiments of the present application also provide a display device 10, the display device 10 includes the display module provided in the above embodiments, and the technical principles and effects generated by the display module and the display device 10 are similar, which will not be elaborated here.

[0088] It can be understood that the display panel 100 can be applied to the display device 10, and the display device 10 can be, for example, any product or component with a display function such as a mobile terminal, a tablet computer, a computer monitor, a television, a wearable device, or an information query machine.

[0089] The basic principles of the present application have been described in conjunction with specific embodiments. However, it should be noted that the advantages, benefits, effects, etc. mentioned in the present application are merely examples and not limitations. It cannot be considered that these advantages, benefits, effects, etc. are essential for each embodiment of the present application. Additionally, the specific details disclosed above are only for illustrative and facilitating understanding purposes, rather than limitations. These details do not limit the present application to necessarily implement using the above specific details.

[0090] It should also be noted that in the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present application. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions, and sub - combinations thereof.

Claims

1. A display panel, characterized in that, It has an island region, and the island region includes a display region and a peripheral region surrounding the display region; the display panel includes: a substrate; sub-pixels, located on one side of the substrate and within the display region; dams, located in the peripheral region, the dams including a plurality of dam units, the dams and the sub-pixels being on the same side of the substrate, the plurality of dam units including a first dam and at least one second dam, the first dam surrounding the sub-pixels, the first dam having at least one first opening, in the direction from the display region to the peripheral region, the first opening penetrating through the first dam, and the second dam being located on the side of the first opening away from the display region; and an encapsulation structure layer, stacked on the side of the sub-pixels and the plurality of dam units away from the substrate; the encapsulation structure layer includes a stacked inorganic encapsulation layer and an organic encapsulation layer, the orthographic projection of the inorganic encapsulation layer on the substrate covering the orthographic projection of the sub-pixels and the plurality of dam units on the substrate, and the organic encapsulation layer being located within the display region, within the first opening, and between the first dam and the second dam.

2. The display panel according to claim 1, wherein In the thickness direction of the display panel, the height of the second dam is less than the height of the first dam; Preferably, the sub-pixels include a first semiconductor layer and a plurality of first conductive layers stacked in a direction gradually away from the substrate, and the dam unit includes a second semiconductor layer and at least one second conductive layer stacked in a direction gradually away from the substrate, and any one of the second conductive layers is arranged on the same layer as one of the first conductive layers; Preferably, the sub-pixels further include a plurality of first insulating layers located between adjacent first conductive layers; the dam unit further includes a plurality of second insulating layers located between adjacent second conductive layers, and any one of the first insulating layers is arranged on the same layer as one of the second insulating layers.

3. The display panel according to claim 1, wherein The at least one second dam includes one second dam, and the second dam surrounds the first dam; Preferably, the at least one first opening includes a plurality of first openings, and the plurality of first openings are arranged at intervals in the direction surrounding the sub-pixels.

4. The display panel according to claim 1, characterized in that, It also has a bridging region, the bridging region being located outside the island region and connected to the island region; the peripheral region includes a connecting sub-region connected to the bridging region; at least part of the first opening is located in the connecting sub-region; Preferably, the display panel further includes a bridge wire and a lead wire, the bridge wire being located in the bridging region, the lead wire being located on the side of the dam close to the substrate, the sub-pixels including a pixel circuit, and the lead wire connecting the pixel circuit and the bridge wire; Preferably, the display panel further includes a buffer layer, the buffer layer being located between the substrate and the sub-pixels, and between the substrate and the dam, and the lead wire being located within the buffer layer; Preferably, the dam includes a conductive hole, the conductive hole penetrating through a part of the dam in the thickness direction of the dam, and the lead wire is connected to the bridge wire through the conductive hole; Preferably, the connecting sub-region, the first opening, and the second dam correspond to each other one by one.

5. The display panel according to claim 1, wherein The plurality of dam units further includes a third dam, which is located on the side of the first dam close to the display area, and the third dam surrounds the sub-pixel; the third dam includes at least one second opening, and in the direction from the display area to the edge area, the second opening penetrates through the third dam; the organic encapsulation layer is also located within the second opening, and between the third dam and the first dam; Preferably, at least a part of the second opening and the first opening are coaxial; Preferably, the at least one second opening includes a plurality of second openings, and the plurality of second openings are arranged at intervals along the direction of surrounding the sub-pixel; Preferably, in the thickness direction of the display panel, the height of the third dam is greater than or equal to the height of the first dam.

6. The display panel according to claim 1, characterized in that, The dam further includes a dam base, the dam base is stacked on the side of the plurality of dam units close to the substrate, the orthographic projection of the plurality of dam units on the substrate is within the orthographic projection range of the dam base on the substrate, and the dam base includes at least one groove, and the groove is located on the side of the dam unit close to the display area; Preferably, the orthographic projection of at least a part of the first opening on the substrate is within the orthographic projection range of the groove on the substrate.

7. The display panel according to any one of claims 1 to 6, characterized in that, The second dam includes a first surface close to the substrate and a second surface facing away from the substrate, and the orthographic projection of the first surface on the substrate is within the orthographic projection range of the second surface on the substrate.

8. A method for manufacturing a display panel, characterized in that, Comprising: Preparing a plurality of sub-pixels and dams on one side of the substrate, the dam includes a plurality of dam units, the plurality of dam units includes a first dam and at least one second dam, the first dam surrounds the sub-pixel, and the second dam is located on the side of the first dam facing away from the sub-pixel; Opening at least one first opening in the first dam, wherein, the at least one second dam includes a second dam, the second dam is a ring structure, or the at least one second dam includes a plurality of second dams, and at least a part of the second dams is located on the side of the first opening facing away from the sub-pixel; Preparing an encapsulation structure layer on the side of the sub-pixel and the plurality of dam units facing away from the substrate, the encapsulation structure layer includes a stacked inorganic encapsulation layer and an organic encapsulation layer, the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the sub-pixel and the plurality of dam units on the substrate, and the organic encapsulation material corresponding to the organic encapsulation layer fills the area surrounded by the first dam and overflows to between the first dam and the second dam through the first opening; Etching a hollow pattern between adjacent second dams to form a plurality of island regions and a bridging region connecting adjacent island regions, obtaining the display panel, the island region includes the sub-pixel and a plurality of the dam units surrounding the sub-pixel, the sub-pixel includes a plurality of conductive layers, and at least one of the conductive layers includes a bridge wire located in the bridging region, and the bridge wire connects the sub-pixels of adjacent island regions.

9. The preparation method according to claim 8, characterized in that, The dam further includes a dam base, the dam base is stacked on the side of the plurality of dam units close to the substrate, and the orthographic projection of the plurality of dam units on the substrate is within the orthographic projection range of the dam base on the substrate. Before preparing the encapsulation structure layer on the side of the sub-pixels and the plurality of dam units away from the substrate, it further includes: Etching at least one groove on the dam base, and the groove is located on the side of the dam unit close to the sub-pixel.

10. A display module, characterized in that, A display panel according to any one of claims 1 to 7.

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