Silicon wafer drying equipment, silicon wafer drying method, silicon wafer drying device, control equipment and medium
By using a combination of adsorption structure and dry pump in the silicon wafer drying equipment, filtering and pumping water, combined with the combination of blowing and transporting mechanisms, the flatness measurement error and secondary condensation problems caused by water droplet migration on the surface of the silicon wafer are solved, and more efficient silicon wafer drying and accurate flatness testing are achieved.
Patent Information
- Application Number
- CN202510680670.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-26
- Publication Date
- 2025-07-29
AI Technical Summary
In the prior art, water droplets remaining on the surface of the silicon wafer form a migration trajectory during the rotation test, resulting in inaccurate flatness measurement data, and high humidity environments are prone to secondary condensation, making it difficult to ensure the blow-drying effect of the silicon wafer.
The adsorption structure and dry pump combination are used to filter the moisture in the blown air and absorb the moisture on the surface of the silicon wafer. The dry pump extracts the gas in the accommodating space to form a vacuum or low vacuum environment, and purges the surface of the silicon wafer through the blowing mechanism, combining the movement of the transport mechanism to ensure that the silicon wafer is dry in all directions.
It effectively improves the blow-drying effect of the silicon wafer, reduces the flatness test error, ensures the accuracy of flatness measurement, and avoids secondary condensation.
Smart Images
Figure CN120385215A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor manufacturing, and particularly to a wafer drying device, a wafer drying method, a device, a control device and a medium. Background Art
[0002] After being processed by a double-sided polishing process, chemical media such as polishing liquid and surfactant will remain on the surface of the wafer. Although most of the residues can be removed through the water tank cleaning process, a water film will form on the surface of the wafer after cleaning. After being blown dry by the loading and unloading equipment, there may still be invisible liquid droplets remaining to the naked eye. When the wafer enters the surface flatness detection link, the wafer will be rotated and tested in the equipment at a certain speed. Under this working condition, the residual liquid droplets on the wafer surface move on the wafer surface under the action of centrifugal force, forming a migration trajectory, which causes the equipment to mistakenly include the liquid film thickness in the wafer surface topography parameters on the scanning path, and finally results in inaccurate flatness measurement data.
[0003] The side wall of the existing drying tank is made of metal material. Although it has good mechanical strength, it does not absorb water. Therefore, after the wafer is placed in the drying tank, the wafer can only be dried by blowing air through the drying tank. Moreover, there are multiple water tanks in the loading and unloading mechanism of the double-sided polishing machine, resulting in a relatively high humidity in the working environment. This high humidity working condition is likely to cause secondary dew condensation on the surface of the dried wafer, making it difficult to ensure the drying effect of the wafer. Summary of the Invention
[0004] The present invention provides a wafer drying device, a wafer drying method, a device, a control device and a medium, which can effectively improve the drying effect of the wafer.
[0005] In order to achieve the above object, the technical solution adopted in the embodiment of the present invention is:
[0006] A wafer drying device, comprising:
[0007] A housing with an accommodation space inside;
[0008] An adsorption structure provided on the inner wall of the housing;
[0009] A blowing mechanism for blowing a preset gas into the accommodation space. The first blowing port of the blowing mechanism is provided on the inner wall of the housing and is located below the adsorption structure. The blowing direction of the first blowing port faces the lower surface of the adsorption structure. The second blowing port of the blowing mechanism is used to blow air into a preset area in the accommodation space;
[0010] A dry pump provided in the accommodation space, and the dry pump is used to extract gas from the accommodation space to the external environment;
[0011] A transport mechanism for transporting wafers to a preset area within the accommodation space.
[0012] In some embodiments, a plurality of the adsorption structures are arranged in layers along the axial direction on the inner wall of the housing, and each layer of the adsorption structures is in a continuous closed annular structure or is arranged in a uniformly discrete manner.
[0013] In some embodiments, the blowing direction of the second blowing port forms a first preset angle with the surface of the wafer, and the first preset angle is in the range of 32° to 37°.
[0014] In some embodiments, the lower surface of the adsorption structure forms a second preset angle with the inner wall, and the second preset angle is in the range of 61° to 65°.
[0015] In some embodiments, the dry pump is arranged at the bottom of the accommodation space.
[0016] To achieve the above object, an embodiment of the present invention further provides a wafer drying method, which is applied to the wafer drying equipment as described above. The method includes:
[0017] Controlling the dry pump to operate for a preset duration, so that the dry pump extracts gas from the accommodation space to the external environment to form a vacuum environment in the accommodation space;
[0018] Controlling the blowing mechanism to blow a preset gas into the accommodation space from the first blowing port, so that the inside of the accommodation space is in an atmospheric state;
[0019] Controlling the transport mechanism to transport the wafer into the accommodation space;
[0020] Controlling the blowing mechanism to blow the preset gas into the accommodation space from the second blowing port, and controlling the dry pump to extract gas from the accommodation space to the external environment.
[0021] To achieve the above object, an embodiment of the present invention further provides a wafer drying device, which is applied to the wafer drying equipment as described above. The device includes:
[0022] A vacuum manufacturing module for controlling the dry pump to operate for a preset duration, so that the dry pump extracts gas from the accommodation space to the external environment to form a vacuum environment in the accommodation space;
[0023] A first blowing module for controlling the blowing mechanism to blow a preset gas into the accommodation space from the first blowing port, so that the inside of the accommodation space is in an atmospheric state;
[0024] A wafer transport module for controlling the transport mechanism to transport the wafer into the accommodation space;
[0025] A second blowing module is configured to control the blowing mechanism to blow the preset gas into the accommodating space from the second blowing port, and control the dry pump to extract gas from the accommodating space to the external environment.
[0026] An embodiment of the present invention further provides a control device, including a memory, a processor, and a computer program stored on the memory and executable on the processor; when the processor executes the computer program, the silicon wafer drying method described above is implemented.
[0027] To achieve the above object, an embodiment of the present invention further provides a computer program product, including computer instructions, and when the computer instructions are executed by a processor, the steps of the silicon wafer drying method described above are implemented.
[0028] To achieve the above object, an embodiment of the present invention provides a readable storage medium, on which a program or instruction is stored, and when the program or instruction is executed by a processor, the steps in the silicon wafer drying method described above are implemented.
[0029] The beneficial effects of the present invention are:
[0030] In this embodiment, an adsorption structure and a dry pump are provided in the housing. On the one hand, the adsorption structure can filter the moisture in the gas blown out by the blowing mechanism, and on the other hand, it can absorb the moisture blown off from the silicon wafer. The dry pump can extract gas from the accommodating space to the outside, thereby taking away the moisture in the accommodating space. In this way, the drying effect of the silicon wafer can be effectively improved, and the flatness test error caused by the moisture on the surface of the silicon wafer can be effectively reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Figure 1 A schematic structural diagram of the silicon wafer drying device according to an embodiment of the present invention;
[0032] Figure 2 A schematic diagram of flatness test data of a silicon wafer after drying in the prior art;
[0033] Figure 3 A schematic diagram of flatness test data of a silicon wafer dried by the silicon wafer drying device according to an embodiment of the present invention;
[0034] Figure 4 A flowchart of the silicon wafer drying method according to an embodiment of the present invention;
[0035] Figure 5 A flowchart of the silicon wafer drying device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention fall within the scope of protection of the present invention.
[0037] To solve the above technical problems, embodiments of the present invention provide a silicon wafer drying device, a silicon wafer drying method, a device, a control device, and a medium, which can effectively improve the drying effect of the silicon wafer.
[0038] Embodiments of the present invention provide a silicon wafer drying device, including: a housing 1, an adsorption structure 3, a blowing mechanism, a dry pump 6, and a conveying mechanism.
[0039] Among them, the housing 1 has an accommodation space 2 inside; the adsorption structure 3 is arranged on the inner wall of the housing 1.
[0040] In some specific examples, the adsorption structure 3 can be prepared from activated carbon material or some other water-absorbing and relatively hard materials. In this way, the adsorption structure 3 can adsorb the moisture in the gas in the accommodation space 2 and the moisture blown off from the surface of the silicon wafer 7.
[0041] The blowing mechanism is used to blow a preset gas into the accommodation space 2. The first blowing port 4 of the blowing mechanism is arranged on the inner wall of the housing 1 and is located below the adsorption structure 3. The blowing direction of the first blowing port 4 faces the lower surface of the adsorption structure 3. The second blowing port 5 of the blowing mechanism is used to blow air into a preset area in the accommodation space 2.
[0042] It should be noted that the preset gas blown out by the blowing mechanism can specifically be dry compressed air or an inert gas (such as nitrogen). Since the blowing direction of the first blowing port 4 faces the lower surface of the adsorption structure 3 (as Figure 1 shown, the first blowing port 4 blows obliquely upward), the adsorption structure 3 can filter the moisture in the gas blown out by the first blowing port 4.
[0043] Specifically, the angle between the blowing direction of the first blowing port 4 and the lower surface of the adsorption structure 3 can be specifically set according to the actual situation. For example, it can be set to 90° (that is, the blowing direction of the first blowing port 4 is perpendicular to the lower surface of the adsorption structure 3). In this way, the adsorption structure 3 can better filter the moisture in the gas blown out by the first blowing port 4.
[0044] The dry pump 6 is arranged in the accommodation space 2, and the dry pump 6 is used to extract gas from the accommodation space 2 to the external environment.
[0045] It should be noted that the dry pump 6 can evacuate the accommodation space, and a part of the moisture in the accommodation space can be taken away by the extracted gas, achieving a better drying effect for the silicon wafer.
[0046] A conveying mechanism for conveying the silicon wafer 7 to a preset area within the accommodation space 2.
[0047] Here, the conveying mechanism may specifically include a robotic arm. A gripper is provided on the robotic arm. The robotic arm can move, and the gripper can grasp the silicon wafer 7, thereby realizing the conveyance of the silicon wafer 7. Among them, the gripper can clamp the edge of the silicon wafer 7 to avoid affecting the drying effect of the silicon wafer 7. In addition, it can be understood that since the position of the second air blowing port 5 is fixed, after the conveying mechanism conveys the silicon wafer 7 to the preset area, during the drying process of the silicon wafer 7, the conveying mechanism can also regularly move the silicon wafer 7 within the preset area (such as moving along a preset path), so that all parts of the surface of the silicon wafer 7 can be purged by the second air blowing port 5, thereby ensuring the drying effect of the silicon wafer 7.
[0048] It should be noted that the silicon wafer drying device provided by the embodiments of the present invention may specifically be equipment for loading and unloading in semiconductor manufacturing. In this way, after the double-sided polishing process is completed, the moisture on the surface of the silicon wafer 7 can be dried in the loading and unloading equipment, so that the result of the silicon wafer flatness test is more accurate.
[0049] In this embodiment, an adsorption structure 3 and a dry pump 6 are provided in the housing 1. On the one hand, the adsorption structure 3 can filter the moisture in the gas blown out by the blowing mechanism, and on the other hand, it can absorb the moisture blown off from the silicon wafer 7. The dry pump 6 can evacuate the accommodation space 2 to take away the moisture in the accommodation space 2. In this way, the drying effect of the silicon wafer can be effectively improved, and thus the flatness test error caused by the moisture on the surface of the silicon wafer can be effectively reduced.
[0050] In some specific embodiments, a plurality of the adsorption structures 3 are arranged in layers along the axial direction on the inner wall of the housing 1, and each layer of the adsorption structure 3 is in a continuous closed annular structure or is arranged in a uniformly discrete arrangement.
[0051] That is to say, one or more layers of adsorption structures 3 can be set according to actual needs. For example, Figure 1 In the shown embodiment, three layers of adsorption structures 3 are provided to achieve a better water absorption effect. In each layer, the adsorption structure 3 can be a closed annular structure formed by connecting activated carbon in a circle, or can be arranged on the inner wall of the housing 1 in a manner that a plurality of dispersed activated carbons are evenly and spacedly arranged in a circle.
[0052] In some specific embodiments, the blowing direction of the second blowing port 5 forms a first preset angle with the surface of the silicon wafer 7, and the first preset angle is in the range of 32° to 37°.
[0053] In this embodiment, the installation angle of the nozzle of the blowing mechanism (the nozzle has the second blowing port 5) in the accommodation space 2 can be adjusted so that the blowing direction of the second blowing port 5 forms a suitable angle (such as 35°) with the surface of the silicon wafer 7. In this way, the efficiency of drying the silicon wafer 7 can be improved, and a better drying effect can be achieved.
[0054] In some specific embodiments, the lower surface of the adsorption structure 3 forms a second preset angle with the inner wall, and the second preset angle is in the range of 61° to 65°.
[0055] In this embodiment, the adsorption structure 3 is inclined on the inner wall of the accommodation space 2 (for example, the lower surface of the adsorption structure 3 forms an included angle of 63° with the inner wall). In this way, the moisture in the gas in the accommodation space 2 can be better adsorbed, and the moisture blown off from the surface of the silicon wafer 7 can also be adsorbed, achieving a better water absorption effect.
[0056] In some embodiments, the dry pump 6 is disposed at the bottom of the accommodation space 2.
[0057] In this embodiment, the dry pump 6 is installed at the bottom of the accommodation space 2. In this way, when the dry pump 6 pumps air outwards, the gas in the accommodation space 2 can be made to move downward, so that part of the moisture can better fall on the adsorption structure 3.
[0058] Here, the specific process of drying the silicon wafer using the silicon wafer drying device according to the embodiments of the present invention will be described:
[0059] In a specific embodiment, before the silicon wafer 7 enters the accommodation space 2, the dry pump 6 can be used to pump the accommodation space 2 to a low vacuum state, so as to ensure that there is as little water vapor as possible in the accommodation space 2. When the silicon wafer 7 is about to enter the accommodation space 2, dry compressed air is blown out through the first blowing port 4 provided on the inner wall of the housing 1 to restore the atmospheric state in the accommodation space 2. The silicon wafer 7 is placed into the accommodation space 2 through the conveying mechanism. The second blowing port 5 blows air towards the silicon wafer 7, and the dry pump 6 can also pump air out of the accommodation space 2 to take away part of the moisture in the gas in the accommodation space 2, and can also make the air in the accommodation space 2 move downward, so that another part of the moisture can better fall on the adsorption structure 3, effectively improving the moisture adsorption effect and achieving a better silicon wafer drying effect.
[0060] The experimental results show that in the prior art, after the silicon wafer 7 undergoes the drying process, due to the interference of the water droplet movement path, there are significant deviations in the flatness measurement data (such asFigure 2 As shown, the line with larger data is the detection data affected by the path of the water droplet movement on the surface of the silicon wafer 7). In the embodiment of the present invention, after the silicon wafer drying device performs a drying operation on the silicon wafer 7, the influence of the moisture on the surface of the silicon wafer on the flatness measurement is effectively suppressed. As Figure 3 shown, the actual measurement highly coincides with the actual topography of the silicon wafer, and the true flatness data of the silicon wafer can be measured more accurately. The comparison shows that the silicon wafer drying device in the embodiment of the present invention can achieve a good drying effect on the silicon wafer, thereby effectively reducing the flatness measurement error caused by the moisture on the surface of the silicon wafer.
[0061] In this embodiment, an adsorption structure 3 and a dry pump 6 are provided in the housing 1. On the one hand, the adsorption structure 3 can filter the moisture in the gas blown out by the blowing mechanism, and on the other hand, it can absorb the moisture blown off from the silicon wafer 7. The dry pump 6 can pump air out of the accommodation space 2, thereby taking away the moisture in the accommodation space 2. In this way, the drying effect of the silicon wafer can be effectively improved, and the flatness measurement error caused by the moisture on the surface of the silicon wafer can be effectively reduced.
[0062] As Figure 4 shown, the embodiment of the present invention also provides a silicon wafer drying method, which is applied to the silicon wafer drying device as described above. The method includes:
[0063] Step 401, controlling the dry pump 6 to work for a preset duration, so that the dry pump 6 extracts gas from the accommodation space 2 to the external environment to form a vacuum environment in the accommodation space 2.
[0064] It can be understood that the vacuum environment here is not necessarily a completely vacuum state, but a low vacuum state. In this way, it can be ensured as much as possible that the accommodation space 2 is dry before the silicon wafer 7 enters the accommodation space 2.
[0065] It should be noted that the preset duration can be set according to specific circumstances. Here, after the dry pump 6 is turned on to work for the preset duration, the dry pump 6 can be temporarily turned off.
[0066] Step 402, controlling the blowing mechanism to blow a preset gas into the accommodation space 2 from the first blowing port 4, so that the inside of the accommodation space 2 is in an atmospheric state.
[0067] Step 403, controlling the conveying mechanism to transport the silicon wafer 7 into the accommodation space 2.
[0068] Here, the silicon wafer 7 can be transported to a preset area in the accommodation space 2 for purging the moisture of the silicon wafer 7.
[0069] Step 404: Control the air blowing mechanism to blow the preset gas into the accommodation space 2 from the second air blowing port 5, and control the dry pump 6 to extract gas from the accommodation space 2 to the external environment.
[0070] In this step, when the dry pump 6 extracts air outwards, part of the moisture in the gas in the accommodation space 2 can be taken away by the extracted gas, and the air in the accommodation space 2 can be made to move downward, so that another part of the moisture can better fall on the adsorption structure 3, effectively improving the moisture adsorption effect and achieving a better silicon wafer drying effect.
[0071] In this embodiment, on the one hand, the adsorption structure 3 can filter the moisture in the gas blown out by the air blowing mechanism, and on the other hand, it can absorb the moisture blown off from the silicon wafer 7. The dry pump 6 can extract gas from the accommodation space 2 to the outside, thereby taking away the moisture in the accommodation space 2. In this way, the drying effect of the silicon wafer can be effectively improved, and the flatness test error caused by the moisture on the surface of the silicon wafer can be effectively reduced.
[0072] As Figure 5 shown, an embodiment of the present invention further provides a silicon wafer drying device, which is applied to the silicon wafer drying equipment as described above, and includes:
[0073] A vacuum manufacturing module 51, configured to control the dry pump 6 to operate for a preset duration, so that the dry pump 6 extracts gas from the accommodation space 2 to the external environment to form a vacuum environment in the accommodation space 2;
[0074] A first air blowing module 52, configured to control the air blowing mechanism to blow the preset gas into the accommodation space 2 from the first air blowing port 4, so that the inside of the accommodation space 2 is in an atmospheric state;
[0075] A silicon wafer transportation module 53, configured to control the transportation mechanism to transport the silicon wafer 7 into the accommodation space 2;
[0076] A second air blowing module 54, configured to control the air blowing mechanism to blow the preset gas into the accommodation space 2 from the second air blowing port 5, and control the dry pump 6 to extract gas from the accommodation space 2 to the external environment.
[0077] In this embodiment, on the one hand, the adsorption structure 3 can filter the moisture in the gas blown out by the air blowing mechanism, and on the other hand, it can absorb the moisture blown off from the silicon wafer 7. The dry pump 6 can extract gas from the accommodation space 2 to the outside, thereby taking away the moisture in the accommodation space 2. In this way, the drying effect of the silicon wafer can be effectively improved, and the flatness test error caused by the moisture on the surface of the silicon wafer can be effectively reduced.
[0078] An embodiment of the present application further provides a control device, including a memory, a processor, and a computer program stored on the memory and executable on the processor; when the processor executes the computer program, the silicon wafer drying method described above is implemented.
[0079] An embodiment of the present application further provides a computer program product, including computer instructions, which implement each process of the method embodiment shown above when executed by a processor, and can achieve the same technical effects. To avoid repetition, it will not be elaborated here. Figure 4 and can achieve the same technical effects. To avoid repetition, it will not be elaborated here.
[0080] An embodiment of the present invention further provides a readable storage medium, on which a program or instruction is stored, and when the program or instruction is executed by a processor, the steps in the silicon wafer drying method described above are implemented.
[0081] It should be noted that the embodiments in this specification are all described in a progressive manner. The same or similar parts between the embodiments can be referred to each other, and the differences between each embodiment and other embodiments are emphasized. In particular, for the method embodiment, since it is basically similar to the product embodiment, the description is relatively simple, and the relevant parts can be referred to the description of the product embodiment.
[0082] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should have the ordinary meaning understood by those of ordinary skill in the field to which this disclosure belongs. The "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or objects appearing before this term cover the elements or objects listed after this term and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left", "right" are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.
[0083] It can be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element, or there may be intermediate elements.
[0084] In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in a suitable manner in any one or more embodiments or examples.
[0085] As described above, it is only the specific implementation manner of the present disclosure. However, the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claimed rights.
Claims
1. A silicon wafer drying device, characterized in that, Comprising: A housing (1) with an accommodation space (2) provided inside; An adsorption structure (3) disposed on the inner wall of the housing (1); A blowing mechanism for blowing a preset gas into the accommodation space (2). A first blowing port (4) of the blowing mechanism is disposed on the inner wall of the housing (1) and is located below the adsorption structure (3). The blowing direction of the first blowing port (4) faces the lower surface of the adsorption structure (3). A second blowing port (5) of the blowing mechanism is used for blowing the preset gas into a preset area inside the accommodation space (2); A dry pump (6) disposed in the accommodation space (2), and the dry pump (6) is used for extracting gas from the accommodation space (2) to the external environment; A conveying mechanism for conveying a silicon wafer (7) to the preset area inside the accommodation space (2).
2. The silicon wafer drying equipment according to claim 1, characterized in that, A plurality of the adsorption structures (3) are arranged in layers along the axial direction on the inner wall of the housing (1). Each layer of the adsorption structure (3) is in a continuous closed annular structure or is arranged in a uniformly discrete manner.
3. The silicon wafer drying equipment according to claim 1, characterized in that, The blowing direction of the second blowing port (5) forms a first preset angle with the surface of the silicon wafer (7), and the first preset angle is in the range of 32° to 37°.
4. The silicon wafer drying equipment according to claim 1, characterized in that, The lower surface of the adsorption structure (3) forms a second preset angle with the inner wall, and the second preset angle is in the range of 61° to 65°.
5. The silicon wafer drying equipment according to claim 1, characterized in that, The dry pump (6) is disposed at the bottom of the accommodation space (2).
6. A method for drying a silicon wafer, characterized in that, Applied to the silicon wafer drying equipment according to any one of claims 1 to 5, the method includes: Controlling the dry pump (6) to operate for a preset duration so that the dry pump (6) extracts gas from the accommodation space (2) to the external environment to form a vacuum environment inside the accommodation space (2); Controlling the blowing mechanism to blow a preset gas into the accommodation space (2) from the first blowing port (4) so that the inside of the accommodation space (2) is in an atmospheric state; Controlling the conveying mechanism to transport the silicon wafer (7) into the accommodation space (2); Controlling the blowing mechanism to blow the preset gas into the accommodation space (2) from the second blowing port (5), and controlling the dry pump (6) to extract gas from the accommodation space (2) to the external environment.
7. A silicon wafer drying device, characterized in that, Applied to the silicon wafer drying equipment according to any one of claims 1 to 5, including: A vacuum manufacturing module for controlling the dry pump (6) to operate for a preset duration so that the dry pump (6) extracts gas from the accommodation space (2) to the external environment to form a vacuum environment inside the accommodation space (2); A first blowing module for controlling the blowing mechanism to blow a preset gas into the accommodation space (2) from the first blowing port (4) so that the inside of the accommodation space (2) is in an atmospheric state; A silicon wafer conveying module for controlling the conveying mechanism to transport the silicon wafer (7) into the accommodation space (2); A second blowing module for controlling the blowing mechanism to blow the preset gas into the accommodation space (2) from the second blowing port (5), and controlling the dry pump (6) to extract gas from the accommodation space (2) to the external environment.
8. A control device, comprising a memory, a processor, and a computer program stored on the memory and executable on the processor; characterized in that, When the processor executes the computer program, it implements the silicon wafer drying method as described in claim 6.
9. A computer program product, characterized in that, It includes computer instructions, and when the computer instructions are executed by a processor, the steps of the silicon wafer drying method as described in claim 6 are implemented.
10. A readable storage medium, on which a program or instructions are stored, characterized in that, When the program or instructions are executed by a processor, the steps in the silicon wafer drying method as described in claim 6 are implemented.