Testing device and testing method for heat-conducting interface material
By designing a special thermal interface material test device, controlling the heating power and testing environment, and calculating the thermal conductivity coefficient using Fourier's thermal conductivity law, the problem of low testing accuracy in the existing technology is solved, and efficient and accurate evaluation of thermal interface material is achieved.
Patent Information
- Application Number
- CN202410115293.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-07-29
AI Technical Summary
In the prior art, the thermal conductivity coefficient test accuracy of thermally conductive interface materials is relatively low, and is greatly affected by uncontrollable factors in actual electronic products, resulting in inaccurate test results.
A thermal interface material testing device including a protective cover, mount, heating plate, heat dissipation piece, position adjustment component and thermal sensor is designed. By controlling the heating power and test environment, the thermal conductivity coefficient is calculated using Fourier's thermal conductivity law to reduce interference from heat dissipation pathways.
It improves the testing accuracy of thermally conductive interface materials, ensures consistency in heating power for each test, shortens the test time, provides quantifiable evaluation data, and improves testing efficiency and accuracy.
Smart Images
Figure CN120385718A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of thermal testing, and particularly relates to a testing device and a testing method for a thermal conductive interface material. Background Art
[0002] A thermal conductive interface material (TIM) is a material used to fill the gap between a CPU and a heat sink. Its function is to conduct the heat dissipated by the CPU to the heat sink, so that the CPU temperature can be maintained at a stable working level, preventing the CPU from being damaged due to poor heat dissipation. Therefore, the thermal conductivity coefficient of the thermal conductive interface material is an important factor to measure its quality.
[0003] In the related art, users usually conduct multiple tests on the thermal conductivity coefficient of the thermal conductive interface material based on the actual application of electronic products to obtain the thermal conductivity ability of the thermal conductive interface material. However, when testing based on actual electronic products, there are many uncontrollable factors, resulting in low testing accuracy. Summary of the Invention
[0004] The present disclosure aims to at least solve one of the technical problems in the related art to some extent. To this end, embodiments of the present disclosure provide a testing device and a testing method for a thermal conductive interface material with high testing accuracy.
[0005] The testing device for the thermal conductive interface material of the present disclosure includes a protective cover, a mounting seat, a heating sheet, a heat dissipation member, a position adjusting assembly, a first thermal sensor, and a second thermal sensor. The mounting seat is arranged inside the protective cover. The mounting seat has a mounting surface. The heating sheet is arranged on the mounting surface. The position adjusting assembly is arranged on the mounting seat and is movable relative to the mounting seat along a first direction. The position adjusting assembly is connected to the heat dissipation member for adjusting the relative position between the heat dissipation member and the heating sheet in the first direction to clamp the to-be-tested thermal conductive interface material between the heat dissipation member and the heating sheet. The first thermal sensor is used to detect the temperature of the to-be-tested thermal conductive interface material on the side adjacent to the heating sheet in the first direction, and the second thermal sensor is used to detect the temperature of the to-be-tested thermal conductive interface material on the side adjacent to the heat dissipation member in the first direction.
[0006] In some embodiments, the mounting seat is made of an adiabatic material.
[0007] In some embodiments, the testing device for the thermal conductive interface material of the present disclosure includes a clamping plate. The clamping plate is arranged between the heating sheet and the heat dissipation member and is parallel to the mounting surface. The clamping plate has a mounting through groove extending in the first direction. The groove side wall of the mounting through groove and the heating sheet enclose a mounting cavity for mounting the to-be-tested thermal conductive interface material.
[0008] In some embodiments, one of the clamping plates and the mounting base is provided with a positioning hole, and the other of the clamping plates and the mounting base is provided with a positioning post, and the positioning post is inserted and matched with the positioning hole.
[0009] In some embodiments, the mounting surface has a protrusion, the heating sheet is disposed on the end surface of the protrusion, and the end surface of one end of the clamping plate adjacent to the heating sheet has a groove, and at least a part of the protrusion extends into the groove and is matched with the groove.
[0010] In some embodiments, the end surface of the protrusion has a stepped hole, the stepped hole includes a first hole and a second hole, the aperture of the first hole is larger than the aperture of the second hole, the first hole is adjacent to the clamping plate, and the heating sheet is disposed on the stepped surface of the stepped hole.
[0011] In some embodiments, the position adjustment assembly includes a slide rail and a slider, the slide rail is disposed on the mounting base and extends along the first direction, the slider is slidably matched with the slide rail along the extending direction of the slide rail, and the heat dissipation member is connected to the slider.
[0012] In some embodiments, at least one ventilation hole is provided on the protective cover.
[0013] In some embodiments, the thermal interface material testing device of the present disclosure further includes a cold row and a cooling fan, the cold row is disposed on the protective cover, the cold row has a cooling channel, a channel inlet and a channel outlet, the cooling fan is disposed on the cold row for dissipating heat from the cold row, the heat dissipation member has a liquid inlet and a liquid outlet, the liquid inlet is communicated with the channel outlet through a liquid inlet pipeline, and the liquid outlet is communicated with the channel inlet through a liquid outlet pipeline.
[0014] The thermal interface material testing method of the present disclosure is implemented based on the thermal interface material testing device described in any of the above embodiments, and is characterized by including:
[0015] Measuring the heat transfer cross-sectional area of the to-be-tested thermal interface material as S and the thickness as A;
[0016] Obtaining the heating power of the heating sheet as P = U2 / R;
[0017] In the initial state, obtaining the temperatures of the first thermal sensor and the second thermal sensor as T1 and T2 respectively;
[0018] In the thermal equilibrium state, obtaining the temperatures of the first thermal sensor and the second thermal sensor as T1' and T2' respectively;
[0019] The thermal conductivity coefficient of the to-be-tested thermal interface material is λ:
[0020] λ = PA / [S(T2’ - T2 - T1’ + T1)].
[0021] For the thermal interface material testing device of the present disclosure, the protective cover can effectively control the air flow state inside the testing environment, fully avoid the interference of the external environment, ensure that the multiple testing environments are consistent, and get rid of the environmental constraints. By obtaining the applied voltage and resistance of the heating sheet, the heating power of the heat source can be obtained, making the power of the heat source controllable and ensuring that the heating power of each test is exactly the same. The heat dissipation path is through the heat dissipation component, greatly reducing the heat dissipation path and avoiding the interference of excessive heat dissipation paths on the accuracy of the test results. Therefore, the thermal interface material testing device of the present disclosure can greatly reduce or even avoid the uncontrollable factors in the related art and the influence on the test accuracy of the thermal conductivity coefficient of the thermal interface material, resulting in a relatively high test accuracy.
[0022] Therefore, the thermal interface material testing device of the embodiments of the present disclosure has the advantage of high test accuracy. Description of the Drawings
[0023] Figure 1 It is a schematic structural diagram of the thermal interface material testing device of the embodiments of the present invention.
[0024] Figure 2 It is a partial schematic structural diagram of the thermal interface material testing device of the embodiments of the present invention.
[0025] Figure 3 It is a front view of the thermal interface material testing device of the embodiments of the present invention.
[0026] Figure 4 is Figure 3 an enlarged schematic diagram of part A in
[0027] Figure 5 It is a schematic structural diagram of the mounting seat of the embodiments of the present invention.
[0028] Figure 6 It is a schematic structural diagram of the clamping plate of the embodiments of the present invention.
[0029] Figure 7 It is a connection schematic diagram of the heat dissipation component and the slider of the embodiments of the present invention.
[0030] Reference Signs:
[0031] 100. Thermal interface material testing device; 200. Thermal interface material to be tested; 1. Protective cover; 101. Vent hole; 2. Mounting base; 201. Mounting surface; 2011. Protrusion; 20111. Step hole; 202. Positioning hole; 3. Heating sheet; 4. Heat sink; 5. Clamping plate; 501. Mounting through slot; 502. Positioning post; 503. Groove; 6. Installation cavity; 7. Slide rail; 8. Slide block; 9. Radiator; 10. Cooling fan; 11. Liquid inlet pipeline; 12. Liquid outlet pipeline. Detailed implementation manners
[0032] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention and should not be construed as a limitation to the present invention.
[0033] It should be noted that when a user conducts multiple tests on the thermal conductivity coefficient of a thermal interface material based on the actual application of electronic products, the uncontrollable factors mainly include the heating power, heat dissipation path, and test environment of the actual electronic products, resulting in low test accuracy. Specifically, the actual electronic products are limited by the logic of software and hardware. The heat generation of the circuit board during multiple tests is not completely consistent, and the power consumption cannot be quantified, resulting in uncontrollable heating power. Due to the excessive heat dissipation paths of physical objects, the heat dissipation paths are uncontrollable, and it is impossible to specifically explain the quality of the heat conduction ability of the thermal interface material. The air flow caused by the people coming and going during the test process interferes with the test. Multiple tests cannot fully ensure the consistency of the environment, resulting in uncontrollable test environment. Based on the above uncontrollable factors, the test accuracy of the thermal conductivity coefficient of the thermal interface material will be low.
[0034] The technical solutions of the present application will be described in detail below with reference to the accompanying drawings.
[0035] As Figures 1 to 7 shown, the thermal interface material testing device 100 according to the embodiment of the present invention includes a protective cover 1, a mounting base 2, a heating sheet 3, a heat sink 4, a position adjustment assembly, a first thermal sensor, and a second thermal sensor. The mounting base 2 is arranged inside the protective cover 1. The mounting base 2 has a mounting surface 201, and the heating sheet 3 is arranged on the mounting surface 201. The position adjustment assembly is arranged on the mounting base 2 and is movable relative to the mounting base 2 along a first direction. The position adjustment assembly is connected to the heat sink 4 for adjusting the relative position of the heat sink 4 and the heating sheet 3 in the first direction to clamp the thermal interface material 200 to be tested between the heat sink 4 and the heating sheet 3. The first thermal sensor is used to detect the temperature of the thermal interface material 200 to be tested on the side adjacent to the heating sheet 3 in the first direction, and the second thermal sensor is used to detect the temperature of the thermal interface material 200 to be tested on the side adjacent to the heat sink 4 in the first direction.
[0036] To facilitate the description of the technical solution of this application, the following takes the case where the first direction is consistent with the up-down direction as an example to further describe the technical solution of this application, where the first direction is as Figures 1 to 3 shown. Additionally, as Figure 4 shown, the heating sheet 3 and the thermal conductive interface material 200 to be measured are both rectangular blocks with the same area for testing. The thermal conductive interface material 200 to be measured is attached to the surface of the heating sheet 3 to facilitate the measurement of the area and thickness of the heat transfer direction of the thermal conductive interface material 200 to be measured.
[0037] When the thermal conductive interface material testing device 100 of the embodiment of the present invention is in use, by moving the position adjustment component upward to increase the distance between the heating sheet 3 and the heat dissipation member 4 (as Figure 2 shown), sufficient space is provided between the heating sheet 3 and the heat dissipation fin for placing the thermal conductive interface material 200 to be measured. While placing the thermal conductive interface material 200 to be measured on the heating sheet 3, a first thermal sensor is placed between the heating sheet 3 and the thermal conductive interface material 200 to be measured to detect the temperature of the thermal conductive interface material 200 on the side adjacent to the heating sheet 3 in the up-down direction. Then, the position adjustment component is moved downward to decrease the distance between the heating sheet 3 and the heat dissipation member 4, and a second thermal sensor is placed between the thermal conductive interface material 200 to be measured and the heat dissipation member 4 to detect the temperature of the thermal conductive interface material 200 on the side adjacent to the heat dissipation member 4 in the up-down direction.
[0038] After the thermal conductive interface material 200 to be measured is installed, the heating sheet 3 is connected to a DC power supply. The heating element 3 converts electrical energy into heat energy, and the heat generated by the heating sheet 3 is dissipated by being transferred through the thermal conductive interface material 200 to the heat dissipation member 4. By adjusting the input voltage of the DC power supply, the heating power of the heating sheet 3 can be accurately controlled, that is, P = U2 / R. After a single group of tests is completed, the relative position between the heat dissipation member 4 and the heating sheet 3 can be adjusted through the position adjustment component to replace the thermal conductive interface material 200 to be measured.
[0039] It can be understood that the heat transfer cross-sectional area of the thermal conductive interface material 200 to be measured is S, the thickness is A, the heating power of the heating sheet 3 is obtained as P = U2 / R. In the initial state, the temperatures of the first thermal sensor and the second thermal sensor are obtained as T1 and T2 respectively. In the thermal equilibrium state, the temperatures of the first thermal sensor and the second thermal sensor are obtained as T1' and T2' respectively. It should be noted that the initial state refers to the state of the thermal conductive interface material 200 to be measured when the heating sheet 3 is not connected to the DC voltage, and the thermal equilibrium state refers to the state when the heating sheet 3 is heated for a certain period of time and the temperature of the thermal conductive interface material 200 remains stable and unchanged.
[0040] According to Fourier's law of heat conduction: Q = λA(Th - Tc) / δ, where:
[0041] A is the area perpendicular to the heat transfer direction, with the unit of ㎡;
[0042] Th and Tc are the temperatures on both sides of the heat transfer direction of the heat-conducting interface material 200 to be measured;
[0043] δ is the distance between both sides of the heat-conducting interface material 200 to be measured in the heat transfer direction, with the unit of m;
[0044] The DC voltage of the heating sheet 3 is only used for heating, so Q = P = U2 / R.
[0045] Substitute the parameters T1, T2, P, T1', and T2' obtained from the above tests, as well as the cross-sectional area S and thickness A of the heat-conducting interface material 200 to be measured in the heat transfer direction, into Fourier's law of heat conduction, and the derivation formula for the thermal conductivity λ can be obtained: λ = PA / [S(T2' - T2 - T1' + T1)].
[0046] Therefore, for the heat-conducting interface material testing device 100 according to the embodiment of the present invention, the protective cover 1 can effectively control the air flow state inside the test environment, fully avoid the interference of the external environment, ensure that the multiple test environments are consistent, and get rid of the environmental constraints. By obtaining the applied voltage and resistance of the heating sheet 2, the heating power of the heat source can be obtained, making the power of the heat source controllable and ensuring that the heating power of each test is exactly the same. The heat dissipation path is through the heat dissipation component 4, and the heat dissipation path is greatly reduced, avoiding the interference of too many heat dissipation paths on the accuracy of the test results. Therefore, the heat-conducting interface material testing device 100 according to the embodiment of the present invention can greatly reduce or even avoid the uncontrollable factors in the related art and the influence on the test accuracy of the thermal conductivity of the heat-conducting interface material, resulting in a higher test accuracy.
[0047] Therefore, the heat-conducting interface material testing device 100 according to the embodiment of the present invention has the advantage of high test accuracy.
[0048] In addition, in the related art, a complete electronic product is usually used to test a certain heat-conducting interface material 200 to be measured. The test time for a single product is too long. It takes about two hours to reach the thermal equilibrium state before it has the test conditions. However, the heat-conducting interface material testing device 100 according to the embodiment of the present invention can shorten the test duration of a single product to fifteen minutes, with higher efficiency. It can conveniently, quickly, and accurately obtain the performance parameters of products provided by different manufacturers and provide quantifiable evaluation data, with a significant improvement in the test efficiency.
[0049] Optionally, the heating sheet 2 is a ceramic heating sheet. The ceramic heating sheet has the following advantages as a heat source:
[0050] High temperature stability: The ceramic heating element can provide stable heating performance in a high-temperature environment. Ceramic materials can generally withstand high temperatures and have good heat resistance and thermal cycling performance, making them perform excellently in high-temperature heating applications.
[0051] Uniform heating: The ceramic heating element can provide a relatively uniform heating distribution. Its surface design and the layout of the heating elements can achieve uniform heat dispersion, enabling the object to be heated to obtain a uniform temperature distribution and avoiding local overheating or cooling caused by heat concentration.
[0052] Quick response: The ceramic heating element has low thermal inertia and can quickly respond to heating requirements. They can quickly reach the required operating temperature and remain stable, providing efficient heating performance.
[0053] Corrosion resistance: Ceramic materials generally have good corrosion resistance and can resist the erosion of many chemical substances. This gives ceramic heating elements an advantage in specific environments that require corrosion resistance, such as heating applications in chemical laboratories or corrosive gas environments.
[0054] High insulation: Ceramic heating elements usually have good insulation performance, which can effectively isolate the heat source from the external environment, reducing energy loss and electromagnetic interference.
[0055] Customizability: The design and manufacture of ceramic heating elements are relatively flexible and can be customized according to specific requirements. This means that they can be customized according to the size, shape, and power requirements of the heating needs to meet the needs of specific applications.
[0056] Optionally, the mounting base 2 is made of heat-insulating materials. For example, materials such as fiberglass, asbestos, rock wool, and silicate are used to prevent the heat loss generated by the heating element 3 from dissipating through the mounting base 2, so that more than 98% (obtained by simulation calculation) of the heat loss generated by the heating element 3 is dissipated through the heat sink 4. This further helps to reduce the heat dissipation path of the heat source, making most of the heat loss generated by the heating element 3 dissipated through the heat sink 4, which further helps to improve the test accuracy.
[0057] In some embodiments, the thermal interface material testing device 100 of the embodiments of the present invention includes a clamping plate 5. The clamping plate 5 is arranged between the heating element 3 and the heat sink 4 and is parallel to the mounting surface 201. The clamping plate 5 has a mounting through groove 501 extending in the first direction. The groove side wall of the mounting through groove 501 and the heating element 3 enclose a mounting cavity 6, and the mounting cavity 6 is used to mount the thermal interface material 200 to be tested.
[0058] For example, as Figures 2 to 6As shown, when installing the splint 5, place the splint 5 between the heating sheet 3 and the heat dissipation member 4, and make the installation through groove 501 correspond to the position of the heating sheet 3, so that the heating sheet 3 and the groove side wall of the installation through groove 501 form an installation cavity 6. When installing the thermal interface material 200 to be tested, place the thermal interface material 200 to be tested in the installation cavity 6 and make it contact with the heating sheet 3, which can realize the rapid installation of the thermal interface material 200 to be tested, is beneficial to improving the installation efficiency of the thermal interface material 200 to be tested, and is beneficial to shortening the test time.
[0059] In some embodiments, one of the splint 5 and the mounting base 2 has a positioning hole 202, and the other of the splint 5 and the mounting base 2 has a positioning post 502, and the positioning post 502 is inserted and fitted with the positioning hole 202.
[0060] For example, as Figure 4 and Figure 6 shown, the splint 5 has a plurality of positioning posts 502, and the mounting surface 201 of the mounting base 2 has a plurality of positioning holes 202. The plurality of positioning posts 502 correspond to and cooperate with the plurality of positioning holes 202 one by one, and the positioning posts 502 are inserted into the corresponding positioning holes 202, so as to facilitate the positioning installation of the splint 5, thereby improving the assembly efficiency of the splint 5.
[0061] In some embodiments, as Figures 3 to 5 shown, the mounting surface 201 has a protrusion 2011, the heating sheet 3 is provided on the end surface of the protrusion 2011, and the end surface of one end of the splint 5 adjacent to the heating sheet 3 has a groove 503. At least a part of the protrusion 2011 extends into the groove 503 and cooperates with the groove 503 to perform limit installation on the heating sheet 3 and the splint 5, which is further beneficial to improving the assembly efficiency of the splint 5.
[0062] Optionally, the end surface of the protrusion 2011 has a stepped hole 20111, the stepped hole 20111 includes a first hole and a second hole, the aperture of the first hole is larger than the aperture of the second hole, the first hole is adjacent to the splint 5, and the heating sheet 3 is provided on the stepped surface of the stepped hole 20111.
[0063] As Figure 4 and Figure 5 shown, since the heating sheet 3 is provided on the stepped surface of the stepped hole 20111, the contact area between the heating sheet 3 and the mounting base 2 can be reduced, thereby reducing the heat transferred from the heating sheet 3 to the mounting base 2, so that most of the heat generated by the heating sheet 3 is dissipated through the thermal interface material 200 to be tested to the heat dissipation member 4, which is further beneficial to improving the test accuracy.
[0064] In some embodiments, the position adjustment assembly includes a slide rail 7 and a slider 8. The slide rail 7 is provided on the mounting base 2 and extends along a first direction. The slider 8 is slidably engaged with the slide rail 7 along the extension direction of the slide rail 7, and the heat dissipation member 4 is connected to the slider 8.
[0065] For example, as Figure 3 , Figure 4 and Figure 7 shown, the number of slide rails 7 is two. The two slide rails 7 are spaced apart on the mounting base 2 and extend in the up and down direction. The slider 8 has two sliding holes corresponding to the slide rails 7, and the slider 8 is engaged with the two slide rails 7 through the sliding holes. The middle part of the slider 8 has an avoidance hole. The heat dissipation member 4 is provided at the upper end of the slider 8 and contacts the thermal interface material 200 to be measured through the avoidance hole to dissipate heat from the thermal interface material 200 to be measured.
[0066] Optionally, at least one ventilation hole 101 is provided on the protective cover 1. For example, as Figure 1 shown, the top plate, bottom plate and side panels of the protective cover 2 have a plurality of ventilation holes 101, and the ventilation holes on the top plate, bottom plate and side panels are arranged in a matrix. The ventilation holes 101 can prevent the temperature inside the protective cover 1 from being too high due to thermal radiation, which is beneficial to the use safety of the thermal interface material testing device 100 of the embodiments of the present invention.
[0067] In some embodiments, the thermal interface material testing device 100 of the embodiments of the present invention further includes a cold row 9 and a cooling fan 10. The cold row 9 is provided on the protective cover 1. The cold row 9 has a cooling channel, a channel inlet and a channel outlet. The cooling fan 10 is provided on the cold row 9 to dissipate heat from the cold row 9. The heat dissipation member 4 has a liquid inlet and a liquid outlet. The liquid inlet is communicated with the channel outlet through a liquid inlet pipeline 11, and the liquid outlet is communicated with the channel inlet through a liquid outlet pipeline 12.
[0068] For example, as Figures 1 to 3 shown, the heat dissipation member 4 is a coolant circulation pump. Water is used as the coolant in the coolant circulation pump. Under the action of the coolant circulation pump, the cooling water circulates between the coolant circulation pump and the cold row 9. After the cooling water exchanges heat with the thermal interface material 200 to be measured, the heat is brought into the cold row 9 through the liquid outlet pipeline 12. The cooling fan 10 rotates to cool the cooling water, and the cooled cooling water enters the coolant circulation pump through the liquid inlet pipeline 11 to continue cooling the thermal interface material 200 to be measured.
[0069] Thus, the thermal interface material testing device 100 according to the embodiments of the present invention is independent of physical electronic products during the testing process, with controllable power consumption of the heat source, and can ensure that each test is exactly the same. It is free from environmental constraints and does not rely on other equipment. The testing time for a single product is shortened from two hours to fifteen minutes, with higher efficiency. The thermal interface material testing device 100 according to the embodiments of the present invention can greatly simplify the testing process, improve the testing accuracy, and quantify the testing data, providing sufficient and reliable data support for the evaluation of different thermal interface materials.
[0070] The embodiments of the present invention also disclose a method for testing a thermal interface material. This method is executed based on the thermal interface material testing device 100 in any of the above embodiments, and includes:
[0071] Measure the heat transfer cross-sectional area of the thermal interface material 200 to be tested as S and the thickness as A;
[0072] Obtain the heating power of the heating sheet 3 as P = U2 / R;
[0073] In the initial state, obtain the temperatures of the first thermal sensor and the second thermal sensor as T1 and T2 respectively;
[0074] In the thermal equilibrium state, obtain the temperatures of the first thermal sensor and the second thermal sensor as T1' and T2' respectively;
[0075] The thermal conductivity coefficient of the thermal interface material 200 to be tested is λ:
[0076] λ = PA / [S(T2' - T2 - T1' + T1)].
[0077] Therefore, the method for testing a thermal interface material according to the embodiments of the present invention has the advantage of high testing accuracy.
[0078] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.
[0079] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.
[0080] In the present invention, unless otherwise clearly defined and limited, terms such as "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or communicable with each other; it may be directly connected, or indirectly connected through an intermediate medium, and may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0081] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.
[0082] In the present invention, terms such as "an embodiment", "some embodiments", "example", "specific example", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0083] Although the above embodiments have been shown and described, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions, and variations made by those of ordinary skill in the art to the above embodiments are within the protection scope of the present invention.
Claims
1. A thermal interface material testing device, characterized in that, Comprising: A protective cover; A mounting base which is arranged inside the protective cover and has a mounting surface; A heating sheet which is arranged on the mounting surface; A heat dissipation component and a position adjustment component. The position adjustment component is arranged on the mounting base and is movable relative to the mounting base along a first direction. The position adjustment component is connected to the heat dissipation component for adjusting the relative position between the heat dissipation component and the heating sheet in the first direction so as to clamp the thermal conductive interface material to be measured between the heat dissipation component and the heating sheet; And A first thermal sensor and a second thermal sensor. The first thermal sensor is used for detecting the temperature of the thermal conductive interface material to be measured on the side adjacent to the heating sheet in the first direction, and the second thermal sensor is used for detecting the temperature of the thermal conductive interface material to be measured on the side adjacent to the heat dissipation component in the first direction.
2. The thermal interface material testing device according to claim 1, wherein The mounting base is made of heat-insulating material.
3. The thermal interface material testing device according to claim 2, characterized in that, Comprising a clamping plate which is arranged between the heating sheet and the heat dissipation component and is parallel to the mounting surface. The clamping plate has a mounting through groove extending in the first direction. The groove side wall of the mounting through groove and the heating sheet enclose to form a mounting cavity for mounting the thermal conductive interface material to be measured.
4. The thermal interface material testing device according to claim 3, wherein, One of the clamping plate and the mounting base has a positioning hole, and the other of the clamping plate and the mounting base has a positioning post. The positioning post and the positioning hole are inserted and matched.
5. The thermal interface material testing device according to claim 3, characterized in that, There are protrusions on the mounting surface. The heating sheet is arranged on the end surface of the protrusion. There is a groove on the end surface of the end of the clamping plate adjacent to the heating sheet. At least a part of the protrusion extends into the groove and cooperates with the groove.
6. The thermal interface material testing device according to claim 5, wherein, There is a stepped hole on the end surface of the protrusion. The stepped hole includes a first hole and a second hole. The aperture of the first hole is larger than that of the second hole. The first hole is adjacent to the clamping plate. The heating sheet is arranged on the stepped surface of the stepped hole.
7. The thermal interface material testing device according to claim 1, wherein, The position adjustment component includes a slide rail and a slider. The slide rail is arranged on the mounting base and extends along the first direction. The slider is slidably matched with the slide rail along the extension direction of the slide rail. The heat dissipation component is connected to the slider.
8. The thermal interface material testing device according to any one of claims 1-7, characterized in that, At least one ventilation hole is provided on the protective cover.
9. The thermal interface material testing device according to claim 8, characterized in that, It further includes a cold row and a cooling fan. The cold row is arranged on the protective cover. The cold row has a cooling channel, a channel inlet and a channel outlet. The cooling fan is arranged on the cold row for dissipating heat from the cold row. The heat dissipation component has a liquid inlet and a liquid outlet. The liquid inlet is communicated with the channel outlet through a liquid inlet pipeline, and the liquid outlet is communicated with the channel inlet through a liquid outlet pipeline.
10. A method for testing a thermal interface material, which is carried out based on the thermal interface material testing device described in any one of claims 1-9, characterized in that, Comprising: Measuring that the heat transfer cross-sectional area of the thermal conductive interface material to be measured is S and the thickness is A; Obtaining that the heating power of the heating sheet is P = U2 / R; In the initial state, obtaining that the temperatures of the first thermal sensor and the second thermal sensor are T1 and T2 respectively; In the thermal equilibrium state, obtaining that the temperatures of the first thermal sensor and the second thermal sensor are T1' and T2' respectively; The thermal conductivity coefficient of the thermal conductive interface material to be measured is λ: λ = PA / [S(T2’ - T2 - T1’ + T1)].