Three-temperature device for testing integrated circuit chip and use method

Abstract

The invention discloses a three-temperature device for testing an integrated circuit chip and a using method, and relates to the technical field of chip testing, the three-temperature device comprises a box body, a testing clamp, an evaporator, a coolant conveying pipe, a temperature control heater and a testing nozzle, a heating device for heating gas in the box body is arranged in the box body, an environment nozzle is arranged in the box body, and the temperature control heater is arranged in the environment nozzle. A conveying track for conveying integrated circuit chips is arranged on the box body in a penetrating manner; the conveying track can convey the integrated circuit chip to the test fixture; the coolant conveying pipe is also connected with the environment nozzle so as to convey a coolant to the box body through the environment nozzle; the temperature control heater is communicated with the evaporator and is used for heating gas passing through the temperature control heater; the test nozzle is arranged on the test clamp and is connected with the temperature control heater, and the coolant evaporated in the evaporator enters the temperature control heater to be heated and then is blown to the integrated circuit chip. According to the invention, the temperature stability of the integrated circuit chip during testing can be ensured, and the detection accuracy is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly to a three-temperature device and a usage method for integrated circuit chip testing. Background Art

[0002] The packaged integrated circuit chips need to be electrically tested to understand the performance and stability of the packaged integrated circuit chips at various temperatures. When testing the packaged chips, it is necessary to test the integrated circuit chips under different temperatures to test the performance and failure problems of the chips at different temperatures. In the prior art, the devices for high-temperature testing and low-temperature testing are usually set separately. The three-temperature device is a device for performing low-temperature, normal-temperature, and high-temperature tests. Currently, when using the three-temperature device to test chips at different temperatures, the temperature fluctuation is large, the time to reach the preset temperature is long, and the efficiency is low, which cannot quickly meet the test accuracy. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a three-temperature device for integrated circuit chip testing, which can ensure the temperature stability of the integrated circuit chip during testing and improve the detection accuracy.

[0004] A three-temperature device for integrated circuit chip testing according to an embodiment of the first aspect of the present invention includes: a box body, a test fixture, an evaporator, a coolant delivery pipe, a temperature-controlled heater, and a test nozzle. A heating device for heating the gas inside the box body is provided inside the box body. An ambient nozzle is provided inside the box body. A conveying track for transporting the integrated circuit chips is penetrated through the box body. The test fixture is used to fix the integrated circuit chip being tested. The conveying track can transport the integrated circuit chip to the test fixture. The evaporator is provided inside the box body. The coolant delivery pipe is connected to the evaporator. The coolant enters the evaporator through the coolant delivery pipe, absorbs heat and evaporates to cool the gas inside the box body. The coolant delivery pipe is also connected to the ambient nozzle to deliver the coolant to the box body through the ambient nozzle. The temperature-controlled heater is connected to the evaporator. The temperature-controlled heater is used to heat the gas passing through the temperature-controlled heater. The test nozzle is provided on the test fixture and is connected to the temperature-controlled heater. The coolant evaporated in the evaporator enters the temperature-controlled heater, is heated, and then is blown from the test nozzle onto the integrated circuit chip located on the test fixture.

[0005] According to some embodiments of the present invention, an air source for providing compressed air is provided outside the box body. The air source is connected to an air heater to input compressed air into the air heater. The compressed air is heated by the air heater and then is transported to the temperature-controlled heater through a compressed air pipeline.

[0006] According to some embodiments of the present invention, a one-way valve is provided on the compressed air pipeline to prevent gas from flowing from the temperature control heater to the air heater.

[0007] According to some embodiments of the present invention, a plurality of test contact pads are provided on the test fixture to clamp a plurality of the integrated circuit chips simultaneously, and a plurality of the temperature control heaters and the test nozzles are also provided to control the gas temperature blown onto each of the integrated circuit chips respectively.

[0008] According to some embodiments of the present invention, a plurality of temperature sensors are provided on the test fixture to detect the gas temperature blown from the test nozzle onto each of the integrated circuit chips and the test contact pads respectively.

[0009] According to some embodiments of the present invention, the temperature sensors are electrically connected to a controller, and the controller adjusts the heating power of the corresponding temperature control heater according to the temperature detected by the temperature sensors, so that the air temperature at the corresponding temperature sensors is maintained at a preset value.

[0010] According to some embodiments of the present invention, a circulation fan is provided inside the box to make the gas temperature inside the box uniform.

[0011] According to some embodiments of the present invention, two sets of the circulation fan, the evaporator, the heating device, and the environment nozzle are symmetrically arranged inside the box.

[0012] According to some embodiments of the present invention, at least part of the box is made of heat-insulating material to reduce energy consumption and keep the temperatures of the integrated circuit chip and the test contact pad stable during testing.

[0013] The present invention also provides a usage method of a three-temperature device for integrated circuit chip testing, which uses the above-mentioned three-temperature device for integrated circuit chip testing. The steps include: Step S1: Open the box door, place the integrated circuit chip to be detected on the test fixture, and close the box door;

[0014] Step S2: Conduct a test on the integrated circuit chip at room temperature;

[0015] Step S3: Input coolant into the evaporator and the environment nozzle through the coolant delivery pipe to cool down the integrated circuit chip inside the box. Start the temperature control heater to heat and control the temperature of the coolant flowing through the temperature control heater. The coolant is sprayed onto the surface of the integrated circuit chip through the test nozzle to further cool down the integrated circuit chip. After the temperature of the integrated circuit chip is stable, conduct a low-temperature test on the integrated circuit chip;

[0016] Step S4: Stop delivering coolant to the coolant delivery pipe, start the heating device to heat the air inside the box, start the air source to input compressed air into the air heater, start the air heater to heat the compressed air flowing through the air heater, start the temperature control heater to control the temperature of the air flowing through the temperature control heater, and perform a high-temperature test on the integrated circuit chip after the temperature of the integrated circuit chip stabilizes.

[0017] A three-temperature device for testing integrated circuit chips according to an embodiment of the present invention has at least the following beneficial effects:

[0018] (1) Based on heating and cooling the air inside the box, a test nozzle is provided to blow high-temperature or low-temperature gas onto the integrated circuit chip to be tested, improving the efficiency of heating and cooling the integrated circuit chip while ensuring temperature stability;

[0019] (2) The evaporator vaporizes the coolant entering the temperature control heater, ensuring stable air flow ejected from the test nozzle;

[0020] (3) The temperature of multiple integrated circuit chips can be controlled separately by multiple temperature control heaters, improving the detection efficiency.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0022] The following further describes the present invention in conjunction with the drawings and embodiments, where:

[0023] Figure 1 Schematic diagram of the box body according to an embodiment of the present invention;

[0024] Figure 2 Schematic diagram of the installation structure according to an embodiment of the present invention;

[0025] Figure 3 is Figure 2 Enlarged view of part A in

[0026] Figure 4 Schematic diagram of the coolant delivery pipe and the compressed air pipeline according to an embodiment of the present invention.

[0027] Reference numerals in the drawings:

[0028] Box body 100, heating device 110, environmental nozzle 120, feed hole 130, circulation fan 140, motor 141;

[0029] Integrated circuit chip 200;

[0030] Test fixture 300, test contact piece 310, temperature sensor 320;

[0031] Evaporator 400;

[0032] Coolant delivery pipe 500;

[0033] Temperature control heater 600;

[0034] Test nozzle 700;

[0035] Gas source 800;

[0036] Air heater 900, compressed air pipeline 910. Detailed implementation manners

[0037] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0038] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0039] In the description of the present invention, "plurality" refers to more than two. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence of the indicated technical features.

[0040] In the description of the present invention, unless otherwise clearly defined, words such as "set", "install", "connect", etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0041] Refer to Figures 1 to 4As shown in the figure, a three-temperature device for integrated circuit chip testing according to an embodiment of the present invention includes: a box body 100, a test fixture 300, an evaporator 400, a coolant delivery pipe 500, a temperature-controlled heater 600, and a test nozzle 700. A heating device 110 for heating the gas inside the box body 100 is provided inside the box body 100. The heating device 110 can be a finned electric heating tube heater. An ambient nozzle 120 is provided inside the box body 100; a feed hole 130 through which a conveying track 101 passes is opened at the upper end of the box body 100. The integrated circuit chip 200 is an integrated circuit chip. To facilitate the entry and exit of the integrated circuit chip 200 into and out of the box body 100, a conveying track 101 is provided for the integrated circuit chip 200 to enter and exit the box body 100. The conveying track 101 passes through the box body 100 and guides the integrated circuit chip 200. It can be foreseen that the conveying track 101 is vertically arranged, and the specific structures of the conveying track 101 and the drive for moving the integrated circuit chip 200 are prior arts, so they will not be elaborated here. The test fixture 300 is used to fix the integrated circuit chip 200 being tested. The test fixture 300 is located at the bottom of the conveying track 101 and plays a role in fixing and positioning the integrated circuit chip 200; the integrated circuit chip 200 can slide along the conveying track 101 into the test fixture 300. The evaporator 400 is provided inside the box body 100; the evaporator 400 is a serpentine copper tube. The coolant delivery pipe 500 is connected to the evaporator 400, and the coolant delivery pipe 500 is also connected to a storage tank for storing coolant. A valve is provided on the coolant delivery pipe 500 to control the flow rate of the coolant. The coolant is selected from low-temperature air or liquid nitrogen. The coolant enters the evaporator 400 through the coolant delivery pipe 500, absorbs heat and evaporates to cool the gas inside the box body 100, and the coolant changes from a liquid state to a gaseous state in the evaporator 400. The coolant delivery pipe 500 is also connected to the ambient nozzle 120 to deliver the coolant to the box body 100 through the ambient nozzle 120; after the coolant enters the box body 100, it cools the air inside the box body 100. The temperature-controlled heater 600 is connected to the evaporator 400. The temperature-controlled heater 600 is used to heat the gas passing through the temperature-controlled heater 600. The temperature-controlled heater 600 is an electric wire heater with a relatively small mass of the heating element to reduce the lag in temperature adjustment and improve the sensitivity of temperature control. The test nozzle 700 is provided on the test fixture 300 and is connected to the temperature-controlled heater 600. The gaseous coolant evaporated in the evaporator 400 enters the temperature-controlled heater 600 and is heated, and then is blown from the test nozzle 700 onto the integrated circuit chip 200 located on the test fixture 300 to further cool the integrated circuit chip 200. Directly heating the liquid coolant easily causes violent boiling and pressure fluctuations, so the coolant is first converted into a gaseous state through the evaporator 400 and then enters the temperature-controlled heater 600.The air inside the box body 100 is heated by the heating device 110 and cooled by the coolant, so that the temperature inside the box body 100 can be converted between high temperature and low temperature, so as to realize the test of the integrated circuit chip 200 at three temperatures.

[0042] Refer to Figures 1 to 4 As shown, it can be understood that an air source 800 for providing compressed air is provided outside the box body 100, and an air compressor is selected as the air source 800. The air source 800 is connected with an air heater 900 to input compressed air into the air heater 900. After the compressed air is heated by the air heater 900, it is transported to the temperature control heater 600 through the compressed air pipeline 910. When performing a high-temperature test, the integrated circuit chip 200 requires a gas with a higher temperature for heating. Therefore, the coolant delivery pipe 500 is closed, and the heated compressed air with a higher temperature is used as the gas source for heating the integrated circuit chip 200 to improve the heating efficiency.

[0043] Refer to Figures 1 to 4 As shown, it can be understood that a one-way valve is provided on the compressed air pipeline 910 to prevent the gas from flowing from the temperature control heater 600 to the air heater 900. When performing a low-temperature test, the air source 800 for providing compressed air is closed. To prevent the coolant from flowing to the air heater 900 and causing waste of the coolant, a one-way valve is provided to prevent the gaseous coolant from flowing into the air heater 900.

[0044] Refer to Figures 1 to 4 As shown, it can be understood that 4 or 8 test contact pieces 310 are provided on the test fixture 300 to simultaneously test 4 or 8 integrated circuit chips 200, and 4 or 8 temperature control heaters 600 and test nozzles 700 are also provided to respectively control the gas temperature blown to each integrated circuit chip 200. By adjusting the power of 4 or 8 temperature control heaters 600, 4 or 8 integrated circuit chips 200 can be tested at different temperatures respectively. It can be foreseen that when performing tests at different temperatures, the temperature difference between 4 or 8 integrated circuit chips 200 at the same time does not exceed 200 degrees Celsius. When 4 or 8 integrated circuit chips 200 need to be tested at the same temperature, the separately provided temperature control heaters 600 can prevent uneven heating from causing different temperatures of the integrated circuit chips 200. The specific structure and installation method of the test contact piece 310 are prior art, so they will not be described in detail. The number of test contact pieces 310 provided on the test fixture 300 is determined by actual production requirements.

[0045] Refer to Figures 1 to 4As shown, it can be understood that a plurality of temperature sensors 320 are provided on the test fixture 300 to respectively detect the gas temperature blown from the test nozzle 700 to each integrated circuit chip 200 and the test contact piece 310. The distance between the temperature sensor 320 and the integrated circuit chip 200 does not exceed 2 cm so that the temperature detected by the temperature sensor 320 is close to the air temperature on the surface of the integrated circuit chip 200. The temperature sensor 320 includes a thermocouple sensor and a semiconductor thermistor sensor. However, due to the limited working range of the thermocouple sensor, it is usually 0 - 500 degrees Celsius. When the temperature is below 0 degrees Celsius, the accuracy of the thermocouple sensor is poor. To improve the detection accuracy, a semiconductor thermistor with better low-temperature performance is added to measure the temperature at low temperatures.

[0046] Referring to Figures 1 to 4 As shown, it can be understood that the temperature sensor 320 is electrically connected to the controller. The specific structure of the controller is prior art and will not be elaborated here. The controller adjusts the heating power of the corresponding temperature control heater 600 according to the temperature detected by the temperature sensor 320 to keep the air temperature at the corresponding temperature sensor 320 at a preset value. It can be foreseen that the gas temperature blown onto the integrated circuit chip 200 can also be controlled by adjusting the flow rate of compressed air or coolant. When the power of the temperature control heater 600 is constant, the coolant flow rate is negatively correlated with the gas temperature blown onto the integrated circuit chip 200, and the compressed air flow rate is negatively correlated with the gas temperature blown onto the integrated circuit chip 200. When adjusting the gas temperature blown onto the integrated circuit chip 200, the flow rate of compressed air or coolant can be controlled first for rough adjustment, and then the power of the temperature control heater 600 can be changed for fine adjustment.

[0047] Referring to Figures 1 to 4 As shown, it can be understood that a circulation fan 140 is provided in the box body 100 to make the gas temperature in the box body 100 uniform. This is to prevent temperature fluctuations of the integrated circuit chip 200 caused by uneven gas temperature distribution in the box body 100 during testing and improve the detection accuracy. The motor 141 that drives the circulation fan 140 to rotate is located outside the box body 100 to avoid damage to the motor 141 caused by high temperature. The circulation fan 140 is a cross-flow fan with uniform air output, and the blades of the circulation fan 140 are made of high-temperature-resistant alloy material.

[0048] Referring to Figures 1 to 4 As shown, it can be understood that two sets of the circulation fan 140, the evaporator 400, the heating device 110, and the environmental nozzle 120 are symmetrically arranged in the box body 100. This makes the gas temperature distribution in the box body 100 more uniform. Each evaporator 400 is connected to two temperature control heaters 600 to reduce the working flow rate of a single evaporator 400, so that the coolant can be fully converted into gas in the evaporator 400.

[0049] Reference Figures 1 to 4 As shown, it can be understood that at least part of the box body 100 is made of heat-insulating material to reduce energy consumption. The inner layer of the box body 100 is made of stainless steel, and the outer layer is coated with heat-insulating materials such as rock wool that can withstand high temperatures. This prevents heat from dissipating through the box body 100 during heating and also keeps the temperature inside the box body 100 stable.

[0050] The present invention also provides a method for using a three-temperature device for testing integrated circuit chips, including the following steps:

[0051] Step S1: Determine the type of test to be carried out. If a normal temperature test is to be carried out, proceed to Step S2; if a low temperature test is to be carried out, proceed to Step S3; if a high temperature test is to be carried out, proceed to Step S4;

[0052] Step S2: Slide 4 or 8 integrated circuit chips 200 to be detected onto the test fixture 300 through the conveying track 101. The test contact pieces 310 on the test fixture 300 close to clamp and fix the corresponding integrated circuit chips 200; conduct a test on the integrated circuit chips 200 at normal temperature;

[0053] Step S3: Open the valve on the coolant delivery pipe 500 and input coolant into the evaporator 400 and the ambient nozzle 120 through the coolant delivery pipe 500. After the temperature inside the box body 100 drops to the preset temperature, slide 4 or 8 integrated circuit chips 200 to be detected onto the test fixture 300 through the conveying track 101. The test contact pieces 310 on the test fixture 300 close to clamp and fix the corresponding integrated circuit chips 200. Control the temperature of the coolant flowing through the temperature control heater 600 by adjusting the valve opening of the coolant delivery pipe 500 and starting the temperature control heater 600 to heat. The coolant is sprayed onto the surface of the integrated circuit chips 200 through the test nozzle 700 to further cool the integrated circuit chips 200. Conduct a low temperature test on the integrated circuit chips 200 after the temperature measured by the temperature sensor 320 stabilizes at the preset value for 3 minutes;

[0054] Step S4: Start the heating device 110 to heat the air inside the box body 100. After the temperature inside the box body 100 rises to the preset temperature, slide 4 or 8 integrated circuit chips 200 to be detected onto the test fixture 300 through the conveying track 101. The test contact pieces 310 on the test fixture 300 close to clamp and fix the corresponding integrated circuit chips 200. Start the air source 800 to input compressed air into the air heater 900, start the air heater 900 to heat the compressed air flowing through the air heater 900, control the temperature of the air flowing through the temperature control heater 600 by adjusting the flow rate of the compressed air output by the air source 800 and starting the temperature control heater 600. Conduct a high temperature test on the integrated circuit chips 200 after the temperature of the integrated circuit chips 200 stabilizes at the preset value for 3 minutes.

[0055] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the art.

Claims

1. A three-temperature device for testing integrated circuit chips, characterized in that: Comprising: A box body (100), in which a heating device (110) for heating the gas inside the box body (100) is arranged, an environment nozzle (120) is arranged inside the box body (100), and a conveying track (101) for transporting an integrated circuit chip (200) penetrates through the box body (100); A test fixture (300) for fixing the integrated circuit chip (200) under test, and the conveying track (101) can transport the integrated circuit chip (200) to the test fixture (300); An evaporator (400) arranged inside the box body (100); A coolant delivery pipe (500) connected to the evaporator (400), and the coolant enters the evaporator (400) through the coolant delivery pipe (500) to absorb heat and evaporate to cool the gas inside the box body (100), and the coolant delivery pipe (500) is also connected to the environment nozzle (120) to deliver the coolant to the box body (100) through the environment nozzle (120); A temperature-controlled heater (600) connected to the evaporator (400), and the temperature-controlled heater (600) is used to heat the gas passing through the temperature-controlled heater (600); A test nozzle (700) arranged on the test fixture (300) and connected to the temperature-controlled heater (600). The coolant evaporated in the evaporator (400) enters the temperature-controlled heater (600) to be heated, and then is blown from the test nozzle (700) onto the integrated circuit chip (200) located on the test fixture (300).

2. The three-temperature device for integrated circuit chip testing according to claim 1, characterized in that: A gas source (800) for providing compressed air is arranged outside the box body (100), and the gas source (800) is connected to an air heater (900) to input compressed air into the air heater (900). After being heated by the air heater (900), the compressed air is transported to the temperature-controlled heater (600) through a compressed air pipeline (910).

3. The three-temperature device for integrated circuit chip testing according to claim 2, wherein: A one-way valve is arranged on the compressed air pipeline (910) to prevent gas from flowing from the temperature-controlled heater (600) to the air heater (900).

4. The three-temperature device for integrated circuit chip testing according to claim 3, characterized in that: A plurality of test contact pieces (310) are arranged on the test fixture (300) to clamp a plurality of the integrated circuit chips (200) simultaneously, and a plurality of the temperature-controlled heaters (600) and the test nozzles (700) are also arranged to respectively control the gas temperature blown onto each integrated circuit chip (200).

5. The three-temperature device for integrated circuit chip testing according to claim 4, characterized in that: A plurality of temperature sensors (320) are arranged on the test fixture (300) to respectively detect the gas temperature blown from the test nozzle (700) onto each integrated circuit chip (200) and the test contact piece (310).

6. The three-temperature device for integrated circuit chip testing according to claim 5, characterized in that: The temperature sensor (320) is electrically connected to a controller, and the controller adjusts the heating power of the corresponding temperature-controlled heater (600) according to the temperature detected by the temperature sensor (320) so that the air temperature at the corresponding temperature sensor (320) remains at a preset value.

7. A three-temperature device for integrated circuit chip testing according to claim 6, characterized in that: A circulation fan (140) is provided inside the box body (100) to make the gas temperature inside the box body (100) uniform.

8. A three-temperature device for integrated circuit chip testing according to claim 7, characterized in that: Two groups of the circulation fan (140), the evaporator (400), the heating device (110), and the environmental nozzle (120) are symmetrically arranged inside the box body (100).

9. The three-temperature device for integrated circuit chip testing according to claim 8, characterized in that: At least part of the box body (100) is made of heat-insulating material to reduce energy consumption and keep the temperatures of the integrated circuit chip (200) and the test contact piece (310) stable during testing.

10. A method for using a three-temperature device for integrated circuit chip testing, characterized in that: Using the three-temperature device for integrated circuit chip testing according to any one of claims 2-9, includes the following steps: Step S1: Determine the type of test to be carried out. If a normal temperature test is to be carried out, go to step S2; if a low temperature test is to be carried out, go to step S3; if a high temperature test is to be carried out, go to step S4; Step S2: The integrated circuit chip (200) to be detected slides onto the test fixture (300) through the conveying track (101). The test fixture (300) clamps and fixes the integrated circuit chip (200), and a normal temperature test is carried out on the integrated circuit chip (200). Step S3: Coolant is input into the evaporator (400) and the environmental nozzle (120) through the coolant delivery pipe (500). After the temperature inside the box body (100) drops to the preset temperature, the integrated circuit chip (200) to be detected slides onto the test fixture (300) through the conveying track (101). The test fixture (300) clamps and fixes the integrated circuit chip (200), the integrated circuit chip (200) inside the box body (100) is cooled, the temperature control heater (600) is started to heat to control the temperature of the coolant flowing through the temperature control heater (600), and the coolant is sprayed onto the surface of the integrated circuit chip (200) through the test nozzle (700) to further cool the integrated circuit chip (200). After the temperature of the integrated circuit chip (200) is stable, a low temperature test is carried out on the integrated circuit chip (200). Step S4: The heating device (110) is started to heat the air inside the box body (100). After the temperature inside the box body (100) rises to the preset temperature, the integrated circuit chip (200) to be detected slides onto the test fixture (300) through the conveying track (101). The test fixture (300) clamps and fixes the integrated circuit chip (200), the air source (800) is started to input compressed air into the air heater (900), the air heater (900) is started to heat the compressed air flowing through the air heater (900), the temperature control heater (600) is started to control the temperature of the air flowing through the temperature control heater (600). After the temperature of the integrated circuit chip (200) is stable, a high temperature test is carried out on the integrated circuit chip (200).

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