Coupling platform, coupling method and related device

Abstract

The invention discloses a coupling platform, a coupling method and a related device, and relates to the field of photoelectrons. The coupling platform is used for coupling the first photoelectric chip and the first optical element, and the first photoelectric chip is arranged under an illumination condition. The coupling platform comprises an imaging unit, a control unit and an adjusting unit, and the first optical element is arranged between the first photoelectric chip and the imaging unit. According to the coupling platform, the control unit controls the adjusting unit based on the first image, and then the adjusting unit executes the corresponding control instruction to adjust the relative pose of the first photoelectric chip and the first optical element, so that the coupling of the first photoelectric chip and the first optical element can be completed. According to the optical product assembling method, complicated power-on and power-off processes are not needed, operation is easy, consumed time is short, automatic assembling of the optical product can be achieved, and therefore the process time of the optical product assembling process is shortened, and the assembling efficiency and the per-hour yield of the optical product are improved.

Description

Technical Field

[0001] This application relates to the field of optoelectronics, and in particular, to a coupling platform, a coupling method, and related devices. Background Art

[0002] In optical products, due to small assembly tolerances (for example, the assembly tolerance is less than 5 microns), the assembly difficulty is very high, and the passive assembly method cannot ensure the assembly accuracy. Therefore, active assembly methods are usually used to assemble optical products to ensure the assembly accuracy. Taking the active alignment (AA) often used in lens modules as an example, the AA process includes: loading, powering on (for example, lighting the TX / RX board), calibration, and unloading. The power-on process is complex, time-consuming, and difficult to automate. Summary of the Invention

[0003] This application provides a coupling platform, a coupling method, and related devices, which relate to the field of optoelectronics. The coupling platform realizes clear imaging of an optical element on an imaging unit through active illumination. The coupling platform provided by this application is simple to operate, short in time consumption, and easy to automate the coupling process.

[0004] In a first aspect, this application provides a coupling platform for coupling a first optoelectronic chip and a first optical element, and the first optoelectronic chip is placed under illumination conditions. The coupling platform includes: an imaging unit, a control unit, and an adjustment unit. Among them, the first optical element is disposed between the first optoelectronic chip and the imaging unit. The imaging unit is configured to receive the light beam passing through the first optical element and generate a first image, and the first image includes an image of the light spot on the first optoelectronic chip. The control unit is configured to control the adjustment unit based on the first image. The adjustment unit is configured to adjust the relative pose of the first optoelectronic chip and the first optical element.

[0005] This application provides a coupling platform, which includes an imaging unit, a control unit, and an adjustment unit. The coupling platform is used to couple a first optoelectronic chip and a first optical element, and the first optical element is disposed between the first optoelectronic chip and the imaging unit. Among them, the first optoelectronic chip (also called a photosensitive chip) is, for example, a light emitter or a light receiver, and a preset pattern will be displayed when it is placed under light conditions. This application does not limit the number of lenses included in the optical element. For example, the first optical element includes one or more lenses. This application also does not limit the type of the optical element. For example, the first optical element is an emission optical system or a reception optical system.

[0006] The above-mentioned first optical element is disposed between the first optoelectronic chip and the imaging unit. It can be understood that the light beam reflected by the first optoelectronic chip can reach the imaging unit through the first optical element. Therefore, the first image generated by the imaging unit contains the image of the light spot on the first optoelectronic chip.

[0007] The above-mentioned control unit controls the adjustment unit based on the first image, and is used to enable the adjustment unit to adjust the relative position and pose of the first optoelectronic chip and the first optical element. It can be that the control unit controls the adjustment unit based on the clarity of the first image. Specifically, the control unit can obtain the through-focus curve of the first optical element through the first image, so as to obtain the optimal focal length of the first optical element, and control the adjustment unit based on the optimal focal length of the first optical element. The adjustment unit adjusts the relative position and pose of the first optoelectronic chip and the first optical element, so that the first optoelectronic chip is located on the focal plane of the first optical element, and then the coupling of the first optoelectronic chip and the first optical element is completed.

[0008] For the above-mentioned coupling platform, only the control unit needs to control the adjustment unit based on the first image, and then let the adjustment unit execute the corresponding control instruction to adjust the relative position and pose of the first optoelectronic chip and the first optical element, and the coupling of the first optoelectronic chip and the first optical element can be completed. There is no need to perform complex power-on and power-off processes, which not only has simple operation and short time consumption, but also can realize the automatic assembly of optical products, thereby reducing the circle time (CT) of the optical product assembly process and improving the assembly efficiency and the units per hour (UPH) of optical products.

[0009] In a possible implementation manner, the adjustment unit controls the relative position and pose of the first optoelectronic chip and the first optical element, so that the imaging unit acquires multiple first images. The control unit obtains the through-focus curve of the first optical element based on the multiple first images, and then the control unit controls the adjustment unit based on the through-focus curve, and enables the adjustment unit to adjust the relative position and pose of the first optoelectronic chip and the first optical element.

[0010] In the above-mentioned implementation manner, adjusting the relative position and pose of the first optoelectronic chip and the first optical element based on the through-focus curve to couple the first optoelectronic chip and the first optical element has the advantages of simple control logic and high precision.

[0011] In a possible implementation manner, the coupling platform further includes an illumination unit, and the illumination unit is used to provide an illumination light beam for the first optoelectronic chip.

[0012] In the above embodiments, the coupling platform further includes an illumination unit for providing an illumination beam to the first optoelectronic chip, enabling the imaging unit to clearly observe the illuminated pattern on the first optoelectronic chip, facilitating accurate control by the control unit, and helping to save the time required for coupling the first optoelectronic chip and the first optical element.

[0013] In a possible embodiment, the beam provided by the illumination unit can irradiate the first optoelectronic chip through the first optical element, and the beam reflected by the first optoelectronic chip is then received by the imaging unit through the first optical element for imaging.

[0014] In the above embodiments, the beam provided by the illumination unit can irradiate the first optoelectronic chip through the first optical element, making the design of the illumination unit relatively simple, easy to implement, and with low cost. For example, the illumination unit is a combination of a floodlight, an optical fiber, and a ground glass.

[0015] In another possible embodiment, the beam provided by the illumination unit can directly irradiate the first optoelectronic chip (alternatively, the beam provided by the illumination unit can directly irradiate the first optoelectronic chip without passing through the first optical element), and the beam reflected by the first optoelectronic chip is received by the imaging unit through the first optical element for imaging.

[0016] In the above embodiments, the beam provided by the illumination unit directly irradiates the first optoelectronic chip without passing through the first optical element. As a result, the beam provided by the illumination unit is not interfered by the first optical element, can provide a balanced and properly bright beam for the first optoelectronic chip, enabling the imaging unit to clearly observe the illuminated pattern on the first optoelectronic chip, facilitating accurate control by the control unit, and helping to save the time required for coupling the first optoelectronic chip and the first optical element.

[0017] In a possible embodiment, the adjustment unit is used to adjust the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element.

[0018] In the above embodiments, the adjustment unit is used to adjust the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element. Exemplarily, taking a three-dimensional coordinate system (x, y, z) as an example, adjusting the spatial position can refer to adjusting one or more of the following: the x-axis, the y-axis, the z-axis, and the rotation angle on each axis.

[0019] In a possible implementation, a coupling platform is used to couple a second optoelectronic chip with a second optical element. The second optoelectronic chip is placed under illumination conditions, and the second optical element is disposed between the second optoelectronic chip and the imaging unit. The imaging unit is further configured to receive the light beam passing through the second optical element and generate a second image, where the second image includes an image of the light spot on the second optoelectronic chip. The control unit is further configured to control the adjustment unit based on the first image and the second image. The adjustment unit is further configured to adjust the relative pose of the second optoelectronic chip and the second optical element.

[0020] In the above implementation, the coupling platform is also used to couple the second optoelectronic chip with the second optical element. The second optoelectronic chip is placed under illumination conditions, and the second optical element is disposed between the second optoelectronic chip and the above imaging unit. For the introduction of the second optoelectronic chip and the second optical element, reference can be made to the introduction of the first optoelectronic chip and the first optical element above, which will not be elaborated here. It should be noted that the first optoelectronic chip is different from the second optoelectronic chip, and the first optical element is also different from the second optical element. Alternatively, the first optoelectronic chip and the first optical element belong to the first lens module, and the second optoelectronic chip and the second optical element belong to the second lens module, and the first lens module is different from the second lens module. Therefore, the above coupling platform can couple two sets of lens modules simultaneously, thereby improving the assembly efficiency and the hourly output of optical products.

[0021] The imaging unit generates a first image and a second image by receiving the light beam passing through the first optical element and the light beam passing through the second optical element respectively. The first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip. The control unit controls the adjustment unit based on the first image and the second image, and is configured to let the adjustment unit adjust the relative pose of the second optoelectronic chip and the second optical element.

[0022] The adjustment process of the above adjustment unit can be that the control unit controls the adjustment unit based on the clarity of the light spot image on the second optoelectronic chip. Specifically, the control unit can obtain the through-focus curve of the second optical element through the second image, so as to obtain the optimal focal length of the second optical element, and control the adjustment unit based on the optimal focal length of the second optical element. The adjustment unit adjusts the relative pose of the second optoelectronic chip and the second optical element, so that the second optoelectronic chip is located on the focal plane of the second optical element, and then the coupling of the second optoelectronic chip and the second optical element is completed.

[0023] The adjustment process of the above adjustment unit can also be that the control unit obtains the relative position of the spot image on the first optoelectronic chip and the spot image on the second optoelectronic chip through the first image and the second image, and controls the adjustment unit based on this relative position. The adjustment unit adjusts the relative pose of the second optoelectronic chip and the second optical element, so that the spot image on the first optoelectronic chip coincides with the spot image on the second optoelectronic chip, and then completes the coupling of the first lens module and the second lens module.

[0024] Optionally, the process of realizing the coupling of the first lens module and the second lens module can also be achieved by the adjustment unit adjusting the relative pose of the first optoelectronic chip and the first optical element, or by the adjustment unit simultaneously adjusting the relative pose of the first optoelectronic chip and the first optical element, and the relative pose of the second optoelectronic chip and the second optical element.

[0025] For the above coupling platform, the control unit only needs to control the adjustment unit based on the first image and the second image, and then let the adjustment unit execute the corresponding control instruction to adjust the relative pose of the second optoelectronic chip and the second optical element, so as to complete the coupling of the second optoelectronic chip and the second optical element, and the coupling of the first lens module (including the first optical element and the first optoelectronic chip) and the second lens module (including the second optical element and the second optoelectronic chip). On the one hand, the above coupling platform can simultaneously perform the coupling of the first optoelectronic chip and the first optical element, and the coupling of the second optoelectronic chip and the second optical element, which can improve the assembly efficiency and the hourly output of optical products. On the other hand, based on the realization of the coupling between the optical element and the optoelectronic chip, the above coupling platform can also realize the automatic coupling of the first lens module and the second lens module, which also helps to reduce the process time in the assembly process of optical products, improve the assembly efficiency and the hourly output of optical products.

[0026] In a possible implementation manner, the adjustment unit controls the relative pose of the second optoelectronic chip and the second optical element, so that the imaging unit acquires multiple second images. The control unit obtains the defocus curve of the second optical element based on the multiple second images, and then the control unit controls the adjustment unit based on this defocus curve, so that the adjustment unit adjusts the relative pose of the second optoelectronic chip and the second optical element.

[0027] In the above implementation manner, adjusting the relative pose of the second optoelectronic chip and the second optical element based on the defocus curve to couple the second optoelectronic chip and the second optical element has the advantages of simple control logic and high precision.

[0028] In a possible implementation manner, the coupling platform further includes an illumination unit, and the illumination unit is used to provide an illumination beam for the second optical element.

[0029] In the above embodiments, the illumination unit is further configured to provide an illumination beam for the second optoelectronic chip, so that the imaging unit can clearly observe the illuminated pattern on the second optoelectronic chip, facilitating accurate control by the control unit and saving time for coupling the second optoelectronic chip and the second optical element.

[0030] In a possible embodiment, the beam provided by the illumination unit can irradiate the second optoelectronic chip through the second optical element, and the beam reflected by the second optoelectronic chip is received by the imaging unit through the second optical element and imaged.

[0031] In the above embodiments, the beam provided by the illumination unit can irradiate the second optoelectronic chip through the second optical element, making the design of the illumination unit relatively simple, easy to implement and low in cost. For example, the illumination unit is a combination of a floodlight, an optical fiber and a ground glass.

[0032] In another possible embodiment, the beam provided by the illumination unit can directly irradiate the second optoelectronic chip (or the beam provided by the illumination unit can directly irradiate the second optoelectronic chip without passing through the second optical element), and the beam reflected by the second optoelectronic chip is received by the imaging unit through the second optical element and imaged.

[0033] In the above embodiments, the beam provided by the illumination unit does not need to pass through the second optical element and directly irradiates the second optoelectronic chip. As a result, the beam provided by the illumination unit will not be interfered by the second optical element, and can provide a balanced and properly bright beam for the second optoelectronic chip, enabling the imaging unit to clearly observe the illuminated pattern on the second optoelectronic chip, facilitating accurate control by the control unit and saving time for coupling the second optoelectronic chip and the second optical element.

[0034] In a possible embodiment, the adjustment unit is further configured to adjust the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element.

[0035] In the above embodiments, the adjustment unit is used to adjust the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element. Exemplarily, taking a three-dimensional coordinate system (x, y, z) as an example, adjusting the spatial position may refer to adjusting one or more of the following: the x-axis, the y-axis, the z-axis and the rotation angle on each axis.

[0036] In a possible embodiment, the first optoelectronic chip is a light-emitting chip and the second optoelectronic chip is a light-receiving chip. Or, the first optoelectronic chip is a light-receiving chip and the second optoelectronic chip is a light-emitting chip. Or, both the first optoelectronic chip and the second optoelectronic chip are light-emitting chips. Or, both the first optoelectronic chip and the second optoelectronic chip are light-receiving chips.

[0037] In the above embodiments, when the first optoelectronic chip is a light-emitting chip and the second optoelectronic chip is a light-receiving chip, the first optical element is an emission optical system (light-emitting lens), and the second optical element is a reception optical system (light-receiving lens). When the first optoelectronic chip is a light-receiving chip and the second optoelectronic chip is a light-emitting chip, the first optical element is a reception optical system (light-receiving lens), and the second optical element is an emission optical system (light-emitting lens). When both the first optoelectronic chip and the second optoelectronic chip are light-emitting chips, both the first optical element and the second optical element are emission optical systems (light-emitting lenses). When both the first optoelectronic chip and the second optoelectronic chip are light-receiving chips, both the first optical element and the second optical element are reception optical systems (light-receiving lenses).

[0038] In a possible embodiment, the first optoelectronic chip is rigidly connected to the second optoelectronic chip, and / or the first optical element is rigidly connected to the second optical element.

[0039] In the above embodiments, the first optoelectronic chip being rigidly connected to the second optoelectronic chip can be understood as the relative positions of the first optoelectronic chip and the second optoelectronic chip being fixed. Similarly, the first optical element being rigidly connected to the second optical element can be understood as the relative positions of the first optical element and the second optical element being fixed. The first optoelectronic chip being rigidly connected to the second optoelectronic chip enables the adjustment unit to simultaneously adjust the spatial positions of the first optoelectronic chip and the second optoelectronic chip. The first optical element being rigidly connected to the second optical element enables the adjustment unit to simultaneously adjust the spatial positions of the first optical element and the second optical element, thereby reducing the process time in the assembly process of the optical product and improving the assembly efficiency and the hourly output of the optical product.

[0040] In a possible embodiment, the adjustment unit includes a six-axis adjustment stage or a three-axis adjustment stage.

[0041] In the above embodiments, the number of six-axis adjustment stages or three-axis adjustment stages included in the adjustment unit is not limited. For example, when the adjustment unit is used to adjust the relative pose of the first optoelectronic chip and the first optical element, two three-axis adjustment stages can be used to separately adjust the relative pose of the first optoelectronic chip and the first optical element, two six-axis adjustment stages can also be used to separately adjust the relative pose of the first optoelectronic chip and the first optical element, one six-axis adjustment stage can be used to adjust the relative pose of the first optoelectronic chip or the first optical element, and one six-axis adjustment stage and one three-axis adjustment stage can also be used to separately adjust the relative pose of the first optoelectronic chip and the first optical element. The adjustment of various positions can be achieved through the six-axis adjustment stage or the three-axis adjustment stage, thereby reducing the process time in the assembly process of the optical product and improving the assembly efficiency and the hourly output of the optical product.

[0042] In a possible implementation, the imaging unit includes an imaging optical element and an image sensor. Among them, the imaging optical element includes a telephoto lens or a collimator, and the image sensor is used to generate an image based on the light beam collected by the imaging optical element.

[0043] In the above implementation, the imaging unit includes an imaging optical element and an image sensor. Among them, the imaging optical element includes a telephoto lens or a collimator, both of which have a relatively high magnification factor and can acquire the light beam reflected by the first optoelectronic chip and / or the second optoelectronic chip, reducing the interference of stray light beams on the light beam reflected by the first optoelectronic chip and / or the second optoelectronic chip. Thus, the image sensor can clearly image the light spot on the first optoelectronic chip and the light spot on the second optoelectronic chip, facilitating accurate control by the control unit and saving the assembly time of the first optoelectronic chip and the first optical element.

[0044] Optionally, the angular resolution A of the imaging optical element and the angular resolution B of the first optical element satisfy the following relationship: A≥10B. Similarly, the angular resolution A of the imaging optical element and the angular resolution C of the second optical element also satisfy the following relationship: A≥10C.

[0045] Optionally, the image sensor is a high-resolution and low-light detector.

[0046] Optionally, an imaging optical element with an appropriate magnification factor can be selected according to one or more of the following. For example: the specifications of the first optical element and the second optical element (such as angular resolution), and the pixel size of the first optoelectronic chip and the second optoelectronic chip.

[0047] In a possible implementation, the lighting unit includes any one or more of the following: optical fiber, optical fiber, ground glass or mirror.

[0048] In the above implementation, the lighting unit includes any one or more of the following: optical fiber, optical fiber, ground glass or mirror. For example, a floodlight source can be formed by an optical fiber and ground glass, and then the light beam can be reflected towards the first optoelectronic chip and / or the second optoelectronic chip by a mirror. For another example, a light source can be directly provided for the first optoelectronic chip and / or the second optoelectronic chip by an optical fiber. Optical fiber, optical fiber, ground glass or mirror are low-cost and easy to operate, which is beneficial to saving the cost of the coupling platform.

[0049] In a second aspect, the present application provides a coupling platform for coupling a first lens module and a second lens module, where the distances between the first lens module and the second lens module and the imaging unit are equal. The first lens module includes a first optoelectronic chip and a first optical element, and the second lens module includes a second optoelectronic chip and a second optical element. The first optoelectronic chip and the second optoelectronic chip are placed under illumination conditions. The coupling platform includes an imaging unit, a control unit, and an adjustment unit. The imaging unit is configured to receive the light beams that have passed through the first optical element and the second optical element and generate a first image and a second image respectively. The first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip. The control unit is configured to control the adjustment unit based on the first image and the second image. The adjustment unit is configured to adjust the relative pose of the first lens module and the second lens module.

[0050] The present application provides a coupling platform, which includes an imaging unit, a control unit, and an adjustment unit. The coupling platform is used to couple a first lens module and a second lens module. The first lens module includes a first optoelectronic chip and a first optical element, and the second lens module includes a second optoelectronic chip and a second optical element. The first optoelectronic chip and the second optoelectronic chip are also referred to as photosensitive chips. For example, they are light emitters or light detectors, and a preset pattern will be displayed when they are placed under illumination conditions. The present application does not limit the number of lenses included in the optical element. For example, both the first optical element and the second optical element include one or more lenses. The present application also does not limit the type of the optical element. For example, the first optical element is an emission optical system, and the second optical element is a receiving optical system. Another example is that the first optical element is a receiving optical system, and the second optical element is an emission optical system. It can be understood that both the first lens module and the second lens module refer to the optoelectronic chip and the optical element that complete the coupling module. For example, the first optoelectronic chip and the first optical element can be coupled to obtain the first lens module through any one of the implementation manners and related possible implementation manners in the first aspect above. The second optoelectronic chip and the second optical element can be coupled to obtain the second lens module through any one of the implementation manners and related possible implementation manners in the first aspect above.

[0051] The distances between the first lens module and the second lens module and the imaging unit are equal, so that the sizes of the light spot images on the first optoelectronic chip and the second optoelectronic chip obtained by the imaging unit are equal, which is convenient for the control unit to perform reasonable control, so that the first lens module and the second lens module can be quickly coupled.

[0052] The imaging unit generates a first image and a second image by receiving the light beam passing through the first optical element and the light beam passing through the second optical element respectively. The first image contains the image of the light spot on the first optoelectronic chip, and the second image contains the image of the light spot on the second optoelectronic chip. The control unit controls the adjustment unit based on the first image and the second image to enable the adjustment unit to adjust the relative pose of the first lens module and the second lens module. For example, the control unit obtains the relative position of the image of the light spot on the first optoelectronic chip and the image of the light spot on the second optoelectronic chip through the first image and the second image, and controls the adjustment unit based on this relative position. The adjustment unit adjusts the relative pose of the first lens module and the second lens module, so that the image of the light spot on the first optoelectronic chip coincides with the image of the light spot on the second optoelectronic chip, and then completes the coupling of the first lens module and the second lens module.

[0053] For the above coupling platform, only the control unit needs to control the adjustment unit based on the first image and the second image, and then let the adjustment unit execute the corresponding control instructions to adjust the relative pose of the first lens module and the second lens module, so as to complete the coupling of the first lens module and the second lens module. There is no need to perform complex power-on and power-off processes, which is not only simple in operation and short in time consumption, but also can realize the automatic assembly of optical products, thereby reducing the process time in the assembly process of optical products and improving the assembly efficiency and the hourly output of optical products.

[0054] Optionally, when the distances between the first lens module and the second lens module and the imaging unit are not equal, the adjustment unit can adjust the relative pose of the first lens module and the second lens module to make the distances between the first lens module and the second lens module and the imaging unit equal.

[0055] In a possible implementation manner, the coupling platform further includes an illumination unit, and the illumination unit is used to provide an illumination beam for the first optoelectronic chip and / or the second optoelectronic chip.

[0056] In the above implementation manner, the coupling platform further includes an illumination unit for providing an illumination beam for the first optoelectronic chip and / or the second optoelectronic chip, so that the imaging unit can clearly observe the illuminated pattern on the first optoelectronic chip and / or the second optoelectronic chip, which is convenient for the control unit to perform accurate control and is beneficial to saving the time consumed for coupling the first lens module and the second lens module.

[0057] In a possible implementation manner, the beam provided by the illumination unit can irradiate the first optoelectronic chip through the first optical element, and the beam reflected by the first optoelectronic chip is received by the imaging unit through the first optical element and imaged. Similarly, the beam provided by the illumination unit can irradiate the second optoelectronic chip through the second optical element, and the beam reflected by the second optoelectronic chip is received by the imaging unit through the second optical element and imaged.

[0058] In the above embodiments, the light beam provided by the lighting unit can be irradiated onto the first optoelectronic chip through the first optical element, or can also be irradiated onto the second optoelectronic chip through the second optical element, making the design of the lighting unit relatively simple, easy to implement and with a low cost. For example, the lighting unit is a combination of a floodlight, an optical fiber and a ground glass.

[0059] In another possible embodiment, the light beam provided by the lighting unit can directly irradiate the first optoelectronic chip (alternatively, the light beam provided by the lighting unit can directly irradiate the first optoelectronic chip without passing through the first optical element). The light beam reflected by the first optoelectronic chip is received by the imaging unit through the first optical element and imaged. Similarly, the light beam provided by the lighting unit can directly irradiate the second optoelectronic chip (alternatively, the light beam provided by the lighting unit can directly irradiate the second optoelectronic chip without passing through the second optical element). The light beam reflected by the second optoelectronic chip is received by the imaging unit through the second optical element and imaged.

[0060] In the above embodiments, the light beam provided by the lighting unit directly irradiates the first optoelectronic chip and the second optoelectronic chip without passing through the first optical element and the second optical element. As a result, the light beam provided by the lighting unit will not be interfered by the first optical element and the second optical element, and can provide a balanced and appropriately bright light beam for the first optoelectronic chip and the second optoelectronic chip, so that the imaging unit can clearly observe the illuminated patterns on the first optoelectronic chip and the second optoelectronic chip, facilitating accurate control by the control unit and being beneficial to saving the time consumed in coupling the first lens module and the second lens module.

[0061] In a possible embodiment, the adjusting unit is used to adjust the spatial positions of the first lens module and / or the second lens module.

[0062] In the above embodiments, the adjusting unit is used to adjust the spatial positions of the first lens module and / or the second lens module. Exemplarily, taking the three-dimensional coordinate system (x, y, z) as an example, adjusting the spatial position can refer to adjusting one or more of the following: the x-axis, the y-axis, the z-axis and the rotation angle on each axis.

[0063] In a possible embodiment, the first lens module is a light emitting module, and the second lens module is a light receiving module.

[0064] In a possible embodiment, the adjusting unit includes a six-dimensional adjustment table or a three-dimensional adjustment table.

[0065] In the above embodiments, the number of six-axis adjustment stages or three-axis adjustment stages included in the adjustment unit is not limited. For example, when the adjustment unit is used to adjust the relative pose of the first lens module and the second lens module, two three-axis adjustment stages can be used to adjust the first lens module and the second lens module respectively, or two six-axis adjustment stages can be used to adjust the first lens module and the second lens module respectively, or one six-axis adjustment stage can be used to adjust the first lens module and the second lens module, or one six-axis adjustment stage and one three-axis adjustment stage can be used to adjust the first lens module and the second lens module respectively. The adjustment of various positions can be achieved through the six-axis adjustment stage or the three-axis adjustment stage, thereby reducing the process time of the coupling process of the optical product and improving the assembly efficiency and the hourly output of the optical product.

[0066] In a possible embodiment, the imaging unit includes an imaging optical element and an image sensor. Among them, the imaging optical element includes a telephoto lens or a collimator, and the image sensor is used to generate an image based on the light beam collected by the imaging optical element.

[0067] In the above embodiments, the imaging unit includes an imaging optical element and an image sensor. Among them, the imaging optical element includes a telephoto lens or a collimator, both of which have a relatively high magnification and can acquire the light beam reflected by the first optoelectronic chip and / or the second optoelectronic chip, reducing the interference of stray light beams on the light beam reflected by the first optoelectronic chip and / or the second optoelectronic chip. Thus, the image sensor can clearly image the light spots on the first optoelectronic chip and the second optoelectronic chip, which is convenient for the control unit to perform accurate control and is beneficial to saving the time consumed for coupling the first lens module and the second lens module.

[0068] Optionally, the angular resolution A of the imaging optical element and the angular resolution B of the first optical element satisfy the following relationship: A ≥ 10B. Similarly, the angular resolution A of the imaging optical element and the angular resolution C of the second optical element also satisfy the following relationship: A ≥ 10C.

[0069] Optionally, the image sensor is a high-resolution and low-light detector.

[0070] Optionally, an imaging optical element with a suitable magnification can be selected according to one or more of the following. For example: the specifications (such as angular resolution) of the first optical element and the second optical element, and the pixel sizes of the first optoelectronic chip and the second optoelectronic chip.

[0071] In a possible embodiment, the illumination unit includes any one or more of the following: optical fiber, optical fiber, ground glass or mirror.

[0072] In the above embodiments, the lighting unit includes any one or more of the following: optical fiber, optical fiber, ground glass or mirror. For example, a floodlight source can be formed by an optical fiber and ground glass, and then the light beam can be reflected towards the first optoelectronic chip and / or the second optoelectronic chip by a mirror. For another example, the optical fiber can directly provide a light source for the first optoelectronic chip and / or the second optoelectronic chip. The optical fiber, optical fiber, ground glass or mirror has low cost and simple operation, which is beneficial to saving the cost of the coupling platform.

[0073] In a third aspect, the present application provides a coupling method, including: receiving a light beam passing through a first optical element and generating a first image, and adjusting the relative pose of the first optoelectronic chip and the first optical element based on the first image. Wherein, the first optoelectronic chip is placed under lighting conditions, and the first image includes an image of a light spot on the first optoelectronic chip.

[0074] The coupling method provided by the present application can be applied to the coupling platform shown in the first aspect above.

[0075] In a possible implementation, adjusting the relative pose of the first optoelectronic chip and the first optical element includes: adjusting the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element.

[0076] In a possible implementation, the above method further includes: receiving a light beam passing through a second optical element and generating a second image, the second image includes an image of a light spot on the second optoelectronic chip, and the first optoelectronic chip is placed under lighting conditions. Based on the first image and the second image, adjust the relative pose of the second optoelectronic chip and the second optical element.

[0077] In a possible implementation, adjusting the relative pose of the second optoelectronic chip and the second optical element includes: adjusting the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element.

[0078] In a possible implementation, the first optoelectronic chip is a light emitting chip, and the second optoelectronic chip is a light receiving chip. Or, both the first optoelectronic chip and the second optoelectronic chip are light emitting chips. Or, both the first optoelectronic chip and the second optoelectronic chip are light receiving chips.

[0079] In a possible implementation, the first optoelectronic chip and the second optoelectronic chip are rigidly connected, and / or, the first optical element and the second optical element are rigidly connected.

[0080] Regarding the beneficial effects of the third aspect and any possible implementation of this aspect, reference can be made to the beneficial effects of the corresponding implementation in the first aspect, which will not be elaborated here.

[0081] Fourth aspect, the present application provides a coupling method for coupling a first lens module and a second lens module. The first lens module includes a first optoelectronic chip and a first optical element, and the second lens module includes a second optoelectronic chip and a second optical element. The above method includes: receiving light beams passing through the first optical element and the second optical element and generating a first image and a second image respectively. The first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip. The first optoelectronic chip and the second optoelectronic chip are placed under illumination conditions. Based on the first image and the second image, adjust the relative pose of the first lens module and the second lens module.

[0082] A possible implementation manner, adjusting the relative pose of the first lens module and the second lens module includes: an adjustment unit is used to adjust the spatial position of the first lens module and / or the second lens module.

[0083] A possible implementation manner, the first lens module is a light emission module, and the second lens module is a light receiving module.

[0084] Regarding the beneficial effects of the fourth aspect and any possible implementation manner thereof, reference can be made to the beneficial effects of the corresponding implementation manner in the second aspect, which will not be elaborated here.

[0085] Fifth aspect, the present application provides a coupling device, which includes at least one coupling platform as shown in the first aspect or the coupling platform as shown in the second aspect.

[0086] A possible implementation manner, the above coupling device is used to execute the method of any one of the third aspect to the fourth aspect and any possible implementation manner thereof.

[0087] Sixth aspect, the present application provides a coupling device, which includes a processor and a memory. Among them, the memory is used to store a computer program, and the processor is used to execute the computer program so that the coupling device executes the method of any one of the third aspect to the fourth aspect and any possible implementation manner thereof.

[0088] Seventh aspect, the present application provides a computer-readable storage medium, which is used to store a computer program (which can also be called code or instruction). When the computer program runs on a computer, it enables the method of any one of the third aspect to the fourth aspect and any possible implementation manner thereof.

[0089] Eighth aspect, the present application provides a computer program product, which includes: a computer program (which can also be called code or instruction). When the computer program runs, it enables the computer to execute the method of any one of the third aspect to the fourth aspect and any possible implementation manner thereof.

[0090] In a ninth aspect, the present application provides a chip, which includes a processor for executing instructions. When the processor executes the instructions, the chip is caused to execute the method according to any one of the third aspect to the fourth aspect and any possible implementation manner thereof.

[0091] In a tenth aspect, the present application provides a terminal device, which includes at least one coupling platform according to the first aspect, or a coupling platform according to the second aspect, or a coupling device according to the fifth aspect, or a coupling device according to the sixth aspect, or a chip according to the ninth aspect.

[0092] In the present application, a coupling platform is provided. The coupling platform includes an imaging unit, a control unit, and an adjustment unit. The imaging unit generates a first image by receiving a light beam that has passed through a first optical element. The first image includes an image of a light spot on a first optoelectronic chip. The control unit controls the adjustment unit based on the acquired first image, and is used to cause the adjustment unit to adjust the relative pose of the first optoelectronic chip and the first optical element, thereby completing the coupling of the first optoelectronic chip and the first optical element. For the above-mentioned coupling platform, only the control unit needs to control the adjustment unit based on the first image, and then cause the adjustment unit to execute the corresponding control instruction to adjust the relative pose of the first optoelectronic chip and the first optical element, so as to complete the coupling of the first optoelectronic chip and the first optical element. There is no need to perform complex power-on and power-off processes, which not only has simple operation and short time consumption, but also can realize the automatic coupling between the first optoelectronic chip and the first optical element, thereby reducing the process time of the coupling process of optical products and improving the assembly efficiency and the hourly output of optical products. Description of the Drawings

[0093] In order to more clearly illustrate the technical solutions of the present application, the drawings required for the present application will be briefly introduced below. Obviously, the following described drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0094] Figure 1 Schematic diagram of a coupling platform provided by an embodiment of the present application;

[0095] Figure 2 Schematic diagram of another coupling platform provided by an embodiment of the present application;

[0096] Figure 3 Schematic diagram of another coupling platform provided by an embodiment of the present application;

[0097] Figure 4 Schematic diagram of another coupling platform provided by an embodiment of the present application;

[0098] Figure 5Schematic diagram of another coupling platform provided by an embodiment of the present application;

[0099] Figure 6 Schematic diagram of another coupling platform provided by an embodiment of the present application;

[0100] Figure 7 Schematic diagram of a coordinate system provided by an embodiment of the present application;

[0101] Figure 8A Schematic diagram of a method for measuring image sharpness provided by an embodiment of the present application;

[0102] Figure 8B Schematic diagram of a spot image on an optoelectronic chip provided by an embodiment of the present application;

[0103] Figure 8C Schematic diagram of a defocus curve provided by an embodiment of the present application;

[0104] Figure 9A Schematic diagram of an illumination unit provided by an embodiment of the present application;

[0105] Figure 9B Schematic diagram of another illumination unit provided by an embodiment of the present application;

[0106] Figure 10 Schematic diagram of a coupling method provided by an embodiment of the present application;

[0107] Figure 11A Schematic diagram of a coupling process provided by an embodiment of the present application;

[0108] Figure 11B Schematic diagram of another coupling process provided by an embodiment of the present application;

[0109] Figure 12A Schematic diagram of another coupling process provided by an embodiment of the present application;

[0110] Figure 12B Schematic diagram of an imaging provided by an embodiment of the present application;

[0111] Figure 12C Schematic diagram of another coupling process provided by an embodiment of the present application;

[0112] Figure 13 Schematic diagram of another coupling method provided by an embodiment of the present application;

[0113] Figure 14 Schematic diagram of another coupling method provided by an embodiment of the present application;

[0114] Figure 15A Schematic diagram of another coupling process provided by an embodiment of the present application;

[0115] Figure 15B Another imaging schematic diagram provided by the embodiment of the present application;

[0116] Figure 15C Another imaging schematic diagram provided by the embodiment of the present application;

[0117] Figure 16A Another schematic diagram of the coupling process provided by the embodiment of the present application;

[0118] Figure 16B Another imaging schematic diagram provided by the embodiment of the present application;

[0119] Figure 16C Another imaging schematic diagram provided by the embodiment of the present application;

[0120] Figure 16D Another imaging schematic diagram provided by the embodiment of the present application;

[0121] [[ID=2�]] Figure 17A Another imaging schematic diagram provided by the embodiment of the present application;

[0122] Figure 17B Another imaging schematic diagram provided by the embodiment of the present application. Detailed implementation manners

[0123] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be described below in conjunction with the accompanying drawings in the present application.

[0124] Terms such as "first" and "second" in the specification, claims and drawings of the present application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device, etc. that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices, etc.

[0125] The "embodiment" mentioned herein means that the specific features, structures or characteristics described in combination with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art can explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0126] It should be understood that in this application, "at least one (item)" means one or more, "a plurality" means two or more, "at least two (items)" means two, three or more, and "and / or" is used to describe the association relationship of associated objects, indicating that three relationships can exist. For example, "A and / or B" can mean: only A exists, only B exists, and both A and B exist at the same time. Among them, A and B can be singular or plural. The character " / " generally means that the associated objects before and after are in an "or" relationship. "At least one (item) of the following" or its similar expression means any combination of these items, including any combination of single item (item) or plural items (items). For example, at least one (item) of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0127] To describe the solution of this application more clearly, some technical terms related to the following will be introduced first.

[0128] 1. Through - focus curve

[0129] The through - focus curve refers to changing the axial distance (the distance in the optical axis direction) between the optical element (abbreviated as the optical element) and the optoelectronic chip (photosensitive chip) in the test optical path, measuring the resolution data of each identification pattern on the target board corresponding to each axial distance respectively, and then drawing the curve of each identification pattern based on these measured data. In other words, a measured through - focus curve corresponding to each identification pattern can be measured. In the measured through - focus curve, the abscissa can represent the axial distance, and the ordinate can represent the resolution data, such as the spatial frequency response (SFR) value, the modulation transfer function (MTF) value. Simply put, the through - focus curve is a curve representing the image sharpness and the deviation of the optoelectronic chip from the best focal length. The horizontal axis can be set as the value of the deviation of the optoelectronic chip from the best focal length, and the vertical axis can be set as the value of the image sharpness.

[0130] In some scenarios, since the optoelectronic chip itself has patterns, imaging the light beam emitted by the optoelectronic chip can obtain the corresponding image. Therefore, the through - focus curve of the optical element and the optoelectronic chip can be obtained without using a target board.

[0131] 2. Relative pose

[0132] The relative pose refers to the relative position and relative attitude of two objects. Among them, the relative position of the two objects can be understood as the relative position of the two objects in space. The relative attitude can be understood as the relative attitude of the two objects. Taking an optical element and an optoelectronic chip as an example, by adjusting the relative attitude of the two, the optical axes of the two can be overlapped, parallel, intersecting, or non-intersecting, etc. Adjusting the relative position of the two objects can refer to adjusting the position and / or attitude of one of the objects, or can also refer to adjusting the positions and / or attitudes of the two objects simultaneously. Adjusting the position and / or attitude includes adjustment methods such as translation and rotation.

[0133] 3. Optoelectronic Chip

[0134] The optoelectronic chip includes a light-emitting chip and / or a light-receiving chip.

[0135] As a possible implementation, the light-emitting chip includes one or more of the following light sources: vertical cavity surface emitting laser (VCSEL), photonic crystal surface emitting semiconductor lasers (PCSEL), edge emitting laser (EEL), laser diode (LD), distributed feedback laser diode (DFB-LD), grating coupledsampling reflection LD (GCSR-LD), or micro opto electromechanical system LD (MOEMS-LD), etc. For example, the light-emitting chip includes one or more VCSEL chips, or the light-emitting chip includes multiple EEL chips.

[0136] As a possible implementation, the optical receiving chip includes a detector and / or an image sensor. Among them, the detector is used to obtain point cloud and / or ranging information. The ranging information is, for example, TOF information, which is also called a radar detector or a ranging detector in some solutions. Exemplarily, the detector includes one or more of the following detection units: single-photon avalanche diode (SPAD), Silicon photomultiplier (SiPM), multi-pixel photon counter (MPPC), avalanche photo detector (APD), or positive-intrinsic-negative (PIN) diode (or P-type semiconductor-impurity-N-type semiconductor diode), etc. In the case where the detector includes multiple detection units, the multiple detection units can be arranged in an array to form an array detector. For example, the receiving module includes a SPAD array detector. The image sensor includes one or more of the following photosensitive elements: complementary metal oxide semiconductor (CMOS), charge-coupled device (CCD), Live MOS, etc. For example, the image sensor includes a CMOS image sensor (CIS), and the CIS is used to convert an optical image into an electrical signal.

[0137] The descriptions of the above technical terms can be optionally used in the following embodiments.

[0138] As described in the background art, the AA process of an optical product includes processes such as loading, power-on (for example, lighting the TX / RX board), calibration, and unloading. Among them, the power-on process is time-consuming and difficult to automate. The present application provides a coupling platform, a coupling method, and related devices, which relate to the field of optoelectronics. Without the need for complex power-on and power-off processes, it is not only simple to operate and time-consuming, but also can realize the automatic assembly of optical products, thereby reducing the process time of the optical product assembly process and improving the assembly efficiency and the hourly output of optical products.

[0139] Next, the present application will be introduced with reference to the accompanying drawings.

[0140] Please refer to Figure 1 , Figure 1Schematic diagram of a coupling platform provided by an embodiment of the present application. The coupling platform 100 includes an imaging unit 101, a control unit 102, and an adjustment unit 103. The coupling platform 100 is used to couple a first optical element 104 and a first optoelectronic chip 105. As Figure 1 shown, the first optical element 104 and the first optoelectronic chip 105 can be placed on the coupling platform 100. Further, the first optical element 104 and / or the first optoelectronic chip may be disposed on the adjustment unit 103. Wherein:

[0141] The first optoelectronic chip 105 is placed under illumination conditions. In some solutions, a pattern may be provided on the first optoelectronic chip 105. In this case, when the first optoelectronic chip 105 is placed under illumination conditions, the pattern on the first optoelectronic chip 105 can be illuminated. Optionally, the illumination conditions here may be provided by a natural light source or by an artificial light source.

[0142] The first optical element 104 is disposed between the first optoelectronic chip 105 and the imaging unit 101. Exemplarily, the first optical element 104 includes one or more lenses. Again exemplarily, the first optical element 104 may be an imaging lens. In some solutions, the first optical element 104 may be used for imaging. For example, the first optical element 104 is an imaging lens with a converging effect. When the light beam passes through the first optical element 104 from the object side, the light beam can be converged and imaged on the other side of the first optical element 104. It is not difficult to understand that since the first optoelectronic chip 105 is placed under illumination conditions, when the light beam from the first optoelectronic chip 105 passes through the first optical element 104, the light beam can be imaged on the imaging unit 101.

[0143] The imaging unit 101 is used to receive the light beam and image based on the received light beam. Its definition and possible implementation are described in detail in the following introduction to the imaging unit. Exemplarily, the imaging unit 101 may be an image sensor, such as a contact image sensor (CIS), or for example, an RGB sensor, a monosensor, etc. As a possible implementation, the light beam received by the imaging unit 101 includes the light beam reflected by the pattern on the first optoelectronic chip 105. Therefore, the first image generated by the imaging unit 101 includes an image of the light spot on the first optoelectronic chip 105.

[0144] The control unit 102 is used to control the adjustment unit 103. For its definition and possible implementation, please refer to the detailed introduction of the control unit below. As a possible implementation, the control unit 102 can control the adjustment unit 103 based on the first image. Exemplarily, the control unit 102 generates corresponding control instructions by analyzing the image of the light spot on the first optoelectronic chip 105, and is used to control the adjustment unit 103. For example, the control unit 102 generates a control instruction for adjusting the relative distance between the first optical element 104 and the first optoelectronic chip 105 by analyzing the clarity of the image of the light spot on the first optoelectronic chip 105, and is used to control the adjustment unit 103 to make the adjustment unit 103 adjust the relative distance between the first optical element 104 and the first optoelectronic chip 105. For the specific implementation manner, please refer to the subsequent relevant introduction.

[0145] The adjustment unit 103 is used to adjust the relative position and attitude between the first optical element 104 and the first optoelectronic chip 105. For its definition and possible implementation, please refer to the detailed introduction of the adjustment unit below. Optionally, the adjustment unit 103 can adjust the position and / or attitude of the first optical element 104 and / or the first optoelectronic chip 105, etc. Exemplarily, based on the control instruction of the control unit 102, the adjustment unit 103 adjusts the relative position and attitude between the first optoelectronic chip 105 and the first optical element 104, so that the first image generated by the imaging unit 101 includes a clear and complete image of the light spot on the first optoelectronic chip 105, thereby completing the coupling of the first optical element 104 and the first optoelectronic chip 105.

[0146] In short, for the above coupling platform, only the control unit needs to control the adjustment unit based on the first image, and then let the adjustment unit execute the corresponding control instruction to adjust the relative position and attitude between the first optoelectronic chip and the first optical element, so as to complete the coupling of the first optoelectronic chip and the first optical element. There is no need to perform complex power-on and power-off processes, which is not only simple in operation and short in time consumption, but also can realize the automatic assembly of optical products, thereby reducing the process time in the assembly process of optical products and improving the assembly efficiency and the hourly output of optical products.

[0147] For the convenience of understanding the following introduction, the following simple explanation is made: The imaging of the illuminated pattern on the optoelectronic chip in the imaging unit is called the image of the light spot on the optoelectronic chip. For example, the imaging of the illuminated pattern on the first optoelectronic chip 105 in the imaging unit is called the image of the light spot on the first optoelectronic chip 105. For another example, the imaging of the illuminated pattern on the second optoelectronic chip 107 in the following text in the imaging unit is called the image of the light spot on the second optoelectronic chip 107. For the convenience of understanding, in the following text, the "image of the light spot on the first optoelectronic chip 105" can be simply referred to as "image A", and the "image of the light spot on the second optoelectronic chip 107" can be simply referred to as "image B".

[0148] The optical path in the above-mentioned coupling platform 100 includes the following two cases:

[0149] Case 1: The light beam passing through the first optical element 104 illuminates the first optoelectronic chip 105. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 again and is received by the imaging unit 101. As shown by the dotted line with arrows in Figure 1 .

[0150] Case 2: The light beam directly illuminates the first optoelectronic chip 105 without passing through the first optical element 104. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 and is received by the imaging unit 101. As shown by the solid line with arrows in Figure 1 .

[0151] In a possible implementation manner, the above-mentioned coupling platform 100 further includes an illumination unit, which is used to provide an illumination light beam for the first optoelectronic chip 105. Its definition and possible implementation can be referred to the detailed introduction of the illumination unit below.

[0152] Please refer to Figure 2 , Figure 2 which is a schematic diagram of another coupling platform provided by the embodiment of the present application. The coupling platform 100 includes an imaging unit 101, a control unit 102, an adjustment unit 103, and an illumination unit. Among them, the illumination unit is Figure 2 the illumination unit 108 and / or the illumination unit 109 shown in

[0153] In a possible illumination design, the light beam provided by the illumination unit 108 passes through the first optical element 104 and then illuminates the first optoelectronic chip 105. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 again and is received by the imaging unit 101.

[0154] In another possible illumination design, the light beam provided by the above-mentioned illumination unit 109 directly illuminates the first optoelectronic chip 105 without passing through the first optical element 104. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 and is received by the imaging unit 101.

[0155] Of course, the above two illumination designs can also be combined. For example, the coupling platform 100 includes both the illumination unit 108 and the illumination unit 109 at the same time, in order to provide sufficient illumination for the first optoelectronic chip 105 and facilitate the imaging unit 101 to generate a clear image A.

[0156] By illuminating the first optoelectronic chip 105 with the illumination beam, the pattern on the first optoelectronic chip 105 can be clearly illuminated, avoiding the situation that the first optoelectronic chip 105 is unevenly illuminated. As a result, the imaging unit 101 can generate a clear image A, facilitating the accurate control of the control unit 102 and helping to save the time-consuming of coupling the first optoelectronic chip 105 and the first optical element 104.

[0157] The above Figure 1 and Figure 2 The provided coupling platform 100 can couple a set of optical products, such as the first optical element 104 and the first optoelectronic chip 105, at the same time. To further improve the assembly efficiency of optical products, another coupling platform is provided in this application, which can couple two sets of optical products at the same time, thereby improving the assembly efficiency of optical products and the hourly output.

[0158] Please refer to Figure 3 , Figure 3 which is a schematic diagram of another coupling platform provided in the embodiment of this application. The coupling platform 200 includes an imaging unit 201, a control unit 202 and an adjustment unit 203. In addition to coupling the first optical element 104 and the first optoelectronic chip 105, the coupling platform is also used to couple the second optical element 106 and the second optoelectronic chip 107. As Figure 3 shown, the first optical element 104, the first optoelectronic chip 105, the second optical element 106 and the second optoelectronic chip 107 can be placed on the above-mentioned coupling platform 200. Further, one or more of the first optical element 104, the first optoelectronic chip 105, the second optical element 106 and the second optoelectronic chip 107 can be arranged on the adjustment unit 203. Among them:

[0159] The first optoelectronic chip 105 and the second optoelectronic chip 107 are placed under illumination conditions. In some solutions, patterns can be provided on the first optoelectronic chip 105 and the second optoelectronic chip 107. In this case, when the first optoelectronic chip 105 and the second optoelectronic chip 107 are placed under illumination conditions, the patterns on the first optoelectronic chip 105 and the second optoelectronic chip 107 can be illuminated. Optionally, the illumination conditions here can be provided by natural light sources or artificial light sources.

[0160] The first optical element 104 is disposed between the first optoelectronic chip 105 and the imaging unit 201, and the second optical element 106 is disposed between the second optoelectronic chip 107 and the imaging unit 201. Exemplarily, the first optical element 104 and the second optical element 106 include one or more lenses. Additionally, the first optical element 104 and the second optical element 106 can be imaging lenses. In some solutions, the first optical element 104 and the second optical element 106 can be used for imaging. For example, the first optical element 104 and the second optical element 106 are imaging lenses with a converging effect. When a light beam passes through the first optical element 104 from the object side, the light beam can be converged and imaged on the other side of the first optical element 104. Similarly, when a light beam passes through the second optical element 106 from the object side, the light beam can be converged and imaged on the other side of the second optical element 106. It is not difficult to understand that since the first optoelectronic chip 105 and the second optoelectronic chip 107 are placed under illumination conditions, when the light beam from the first optoelectronic chip 105 passes through the first optical element 104, the light beam can be imaged on the imaging unit 201. Similarly, when the light beam from the second optoelectronic chip 107 passes through the second optical element 106, the light beam can also be imaged on the imaging unit 201.

[0161] Optionally, the above-mentioned first optoelectronic chip 105 is a light-emitting chip, and the above-mentioned second optoelectronic chip 107 is a light-receiving chip; or, the above-mentioned first optoelectronic chip 105 is a light-receiving chip, and the above-mentioned second optoelectronic chip 107 is a light-emitting chip; or, the above-mentioned first optoelectronic chip 105 and the above-mentioned second optoelectronic chip 107 are both light-emitting chips; or, the above-mentioned first optoelectronic chip 105 and the above-mentioned second optoelectronic chip 107 are both light-receiving chips. Correspondingly, when the first optoelectronic chip 105 includes a light-emitting chip, the first optical element 104 includes an emission optical system (light-emitting lens). When the first optoelectronic chip 105 includes a light-receiving chip, the first optical element 104 includes a reception optical system (light-receiving lens). When the second optoelectronic chip 107 is a light-emitting chip, the second optical element 106 is an emission optical system (light-emitting lens). When the second optoelectronic chip 107 is a light-receiving chip, the second optical element 106 is a reception optical system (light-receiving lens).

[0162] The imaging unit 201 is configured to receive a light beam and perform imaging based on the received light beam. Its definition and possible implementations are described in detail in the following introduction to the imaging unit. Exemplarily, the imaging unit 201 may be an image sensor, such as a CIS, or for example, an RGB sensor, a monosensor, etc. As a possible implementation, the light beam received by the imaging unit 201 includes the light beam reflected by the pattern on the first optoelectronic chip 105. Therefore, the first image generated by the imaging unit 201 includes image A. As another possible implementation, the light beam received by the imaging unit 201 includes the light beam reflected by the pattern on the second optoelectronic chip 107. Therefore, the second image generated by the imaging unit 201 includes image B.

[0163] The control unit 202 is used to control the adjustment unit 203. Its definition and possible implementation are described in detail in the following introduction to the control unit. As a possible implementation, the control unit 202 can control the adjustment unit 203 based on the first image. Exemplarily, the control unit 202 analyzes image A, generates corresponding control instructions, and uses them to control the adjustment unit 203. For example, by analyzing the clarity of image A, the control unit 202 generates a control instruction to adjust the relative distance between the first optical element 104 and the first optoelectronic chip 105, and uses it to control the adjustment unit 203 to adjust the relative distance between the first optical element 104 and the first optoelectronic chip 105. The specific implementation method refers to the subsequent relevant introduction. As another possible implementation, the control unit 202 can control the adjustment unit 203 based on the second image. Exemplarily, the control unit 202 analyzes image B, generates corresponding control instructions, and uses them to control the adjustment unit 203. For example, by analyzing the clarity of image B, the control unit 202 generates a control instruction to adjust the relative distance between the second optical element 106 and the second optoelectronic chip 107, and uses it to control the adjustment unit 203 to adjust the relative distance between the second optical element 106 and the second optoelectronic chip 107. The specific implementation method refers to the subsequent relevant introduction. As another possible implementation, the control unit 202 can control the adjustment unit 203 based on the first image and the second image. Exemplarily, the lens module obtained by coupling the first optical element 104 and the first optoelectronic chip 105 is called the first lens module, and the lens module obtained by coupling the second optical element 106 and the second optoelectronic chip 107 is called the second lens module. The control unit 202 controls the adjustment unit 203 by analyzing image A and image B. For example, by analyzing the relative positions of image A and image B, the control unit generates a control instruction to adjust the relative pose between the first lens module and the second lens module, and uses it to control the adjustment unit 203 to adjust the relative pose between the first optical element 104 and the first optoelectronic chip 105, and / or the relative pose between the second optical element 106 and the second optoelectronic chip 107, so that image A and image B coincide, and then complete the coupling of the first lens module and the second lens module. The specific implementation method refers to the subsequent relevant introduction.

[0164] The difference between the adjustment unit 203 and the adjustment unit 103 is that the adjustment unit 203 can simultaneously adjust the relative poses of the optical elements and optoelectronic chips in multiple sets of optical products, thereby improving the assembly efficiency of optical products and the hourly output of optical products.

[0165] The adjustment unit 203 is used to adjust the relative position and orientation between the first optical element 104 and the first optoelectronic chip 105, and / or the relative position and orientation between the second optical element 106 and the second optoelectronic chip 107. For its definition and possible implementation, please refer to the detailed introduction of the adjustment unit below. As a possible implementation, the adjustment unit 203 can adjust the position and / or orientation of the first optical element 104 and / or the first optoelectronic chip 105. Exemplarily, based on the control instruction of the control unit 202, the adjustment unit 203 adjusts the relative position and orientation between the first optical element 104 and the first optoelectronic chip 105, so that the first image generated by the imaging unit 201 includes a clear and complete image A, thereby completing the coupling of the first optical element 104 and the first optoelectronic chip 105. As another possible implementation, the adjustment unit 203 can adjust the position and / or orientation of the second optical element 106 and / or the second optoelectronic chip 107. Exemplarily, based on the control instruction of the control unit 202, the adjustment unit 203 adjusts the relative position and orientation between the second optical element 106 and the second optoelectronic chip 107, so that the second image generated by the imaging unit 201 includes a clear and complete image B, thereby completing the coupling of the second optical element 106 and the second optoelectronic chip 107.

[0166] In short, for the above coupling platform, the control unit only needs to control the adjustment unit based on the first image and the second image, and then let the adjustment unit execute the corresponding control instructions to adjust the relative position and orientation between the first optoelectronic chip and the first optical element, and adjust the relative position and orientation between the second optoelectronic chip and the second optical element, so as to complete the coupling of the first optoelectronic chip and the first optical element, and the coupling of the second optoelectronic chip and the second optical element. There is no need to perform complex power-on and power-off processes, which is not only simple to operate and time-consuming, but also can realize the automatic assembly of optical products, thereby reducing the process time of the optical product assembly process and improving the assembly efficiency and the hourly output of optical products.

[0167] The optical path in the above coupling platform 200 includes the following two cases:

[0168] Case 1: The light beam passing through the first optical element 104 illuminates the first optoelectronic chip 105, and the light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 again and is received by the imaging unit 201. The light beam passing through the second optical element 106 illuminates the second optoelectronic chip 107, and the light beam reflected by the pattern on the second optoelectronic chip 107 passes through the second optical element 106 again and is received by the imaging unit 201. As shown by the dotted line with arrows in Figure 3 .

[0169] Case 2: The light beam directly illuminates the first optoelectronic chip 105 without passing through the first optical element 104. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 and is received by the imaging unit 201. The light beam directly illuminates the second optoelectronic chip 107 without passing through the second optical element 106. The light beam reflected by the pattern on the second optoelectronic chip 107 passes through the second optical element 106 and is received by the imaging unit 201. As shown by the solid line with arrows in Figure 3 shown.

[0170] In a possible implementation, the above coupling platform 200 further includes an illumination unit for providing illumination light beams for the first optoelectronic chip 105 and the second optoelectronic chip 107. For its definition and possible implementation, please refer to the detailed introduction of the illumination unit below.

[0171] Please refer to Figure 4 , Figure 4 which is a schematic diagram of another coupling platform provided by the embodiments of the present application. The coupling platform 200 includes an imaging unit 201, a control unit 202, an adjustment unit 203, and an illumination unit. Among them, the illumination unit is Figure 4 the illumination unit 401 and / or the illumination unit 402 shown in

[0172] In a possible illumination design, the light beam provided by the illumination unit 401 passes through the first optical element 104 and illuminates the first optoelectronic chip 105. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 again and is received by the imaging unit 201. The light beam provided by the illumination unit 401 also passes through the second optical element 106 and illuminates the second optoelectronic chip 107. The light beam reflected by the pattern on the second optoelectronic chip 107 passes through the second optical element 106 again and is received by the imaging unit 201. It should be noted that in the specific implementation process, the illumination unit may be composed of two sets of light sources, which are respectively used to illuminate the first optoelectronic chip 105 and the second optoelectronic chip 107. The illumination unit may also be composed of one set of light sources, which can illuminate the first optoelectronic chip 105 and the second optoelectronic chip 107 simultaneously.

[0173] In another possible illumination design, the light beam provided by the above illumination unit 402 directly illuminates the first optoelectronic chip 105 without passing through the first optical element 104. The light beam reflected by the pattern on the first optoelectronic chip 105 passes through the first optical element 104 and is received by the imaging unit 201. The light beam provided by the illumination unit 402 also does not pass through the second optical element 106 and directly illuminates the second optoelectronic chip 107. The light beam reflected by the pattern on the second optoelectronic chip 107 passes through the second optical element 106 and is received by the imaging unit 201.

[0174] Of course, the above two lighting designs can also be combined. For example, the coupling platform 200 can also use the lighting unit 401 and the lighting unit 402 simultaneously, in order to provide sufficient lighting for the first optoelectronic chip 105 and the second optoelectronic chip 107, facilitating the imaging unit 201 to generate clear images A and B.

[0175] By means of the lighting unit providing lighting beams for the first optoelectronic chip 105 and the second optoelectronic chip 107, the patterns on the first optoelectronic chip 105 and the second optoelectronic chip 107 can be clearly illuminated, avoiding the situation that the first optoelectronic chip 105 and the second optoelectronic chip 107 are unevenly illuminated. Thus, the imaging unit 201 can generate clear images A and B, facilitating the accurate control by the control unit 202, and being beneficial to saving the time-consuming for coupling the first optoelectronic chip 105 with the first optical element 104 and saving the time-consuming for coupling the second optoelectronic chip 107 with the second optical element 106.

[0176] Some devices include at least two lens modules. In the case where the lens modules of the device are in a coupled state, the device can work properly (realize functions such as shooting and detecting). Among them, the lens module is, for example, a module obtained by coupling an optical element and an optoelectronic chip, that is, the optical element and the optoelectronic chip in the lens module are in an optimal coupled state. Exemplarily, the transmitting lens module and the receiving lens module of a lidar need to be placed at preset positions to ensure that the lidar can work properly. For example, it is necessary to ensure that the optical axes of the transmitting lens module and the receiving lens module of the lidar are parallel to ensure the normal operation of the lidar. Further, on the basis that the optical axes of the transmitting lens module and the receiving lens module are parallel, it is also necessary to ensure that the interval between the transmitting lens module and the receiving lens module is a preset value (for example, the interval is less than 3 mm).

[0177] In view of this, the present application provides another schematic diagram of a coupling platform for coupling a first lens module and a second lens module.

[0178] As Figure 5 shown, the coupling platform 300 includes an imaging unit 301, a control unit 302, and an adjustment unit 303. The coupling platform 300 is used for coupling a first lens module 501 and a second lens module 502. As Figure 5 shown, the first lens module 501 and the second lens module 502 can be placed on the coupling platform 300. Further, the first lens module 501 and / or the second lens module 502 can be arranged on the adjustment unit 303. Among them:

[0179] The first lens module 501 is obtained by coupling a third optical element and a third optoelectronic chip, and the second lens module 502 is obtained by coupling a fourth optical element and a fourth optoelectronic chip. Among them, the third optical element is, for example, the first optical element 104 described above, and the third optoelectronic chip is, for example, the first optoelectronic chip 105 described above. The fourth optical element is, for example, the second optical element 106 described above, and the fourth optoelectronic chip is, for example, the second optoelectronic chip 107 described above.

[0180] Optionally, the first lens module 501 is a light emitting module, and the second lens module 502 is a receiving lens module; or, the first lens module 501 is a light receiving module, and the second lens module 502 is a transmitting lens module. Exemplarily, the light emitting module is used to generate and emit a detection beam, and the light receiving module is used to receive the beam reflected by the target object.

[0181] The third optoelectronic chip and the fourth optoelectronic chip are placed under illumination conditions. In some solutions, patterns may be provided on the third optoelectronic chip and the fourth optoelectronic chip. In this case, when the third optoelectronic chip and the fourth optoelectronic chip are placed under illumination conditions, the patterns on the third optoelectronic chip and the fourth optoelectronic chip can be illuminated. Optionally, the illumination conditions here can be provided by natural light sources or by artificial light sources.

[0182] The distances between the first lens module 501 and the second lens module 502 and the imaging unit 301 are equal. For example, the distances between the centroids of the first lens module 501 and the second lens module 502 and the centroid of the imaging unit 301 can be set to be equal. For another example, the distances between the third optoelectronic chip and the fourth optoelectronic chip and the centroid of the imaging unit 301 are equal. By controlling the equal distances between the first lens module 501 and the second lens module 502 and the imaging unit 301, it is possible to make the sizes of the images of the light spots on the third optoelectronic chip and the fourth optoelectronic chip generated by the imaging unit 301 equal, which is convenient for the control unit 302 to perform reasonable control, so that the first lens module 501 and the second lens module 502 can be quickly coupled. As a possible implementation, the control unit 302 controls the adjustment unit to adjust the control positions of the first lens module 501 and / or the second lens module 502 so that the sizes of the images of the light spots on the third optoelectronic chip and the fourth optoelectronic chip are equal.

[0183] Optionally, the imaging unit 301 is configured to receive a light beam and perform imaging based on the received light beam. For its definition and possible implementation, refer to the detailed introduction of the imaging unit below. Exemplarily, the imaging unit 301 may be an image sensor, such as a CIS, or for example, an RGB sensor, a monosensor, etc. As a possible implementation, the light beam received by the imaging unit 301 includes the light beam reflected by the pattern on the third optoelectronic chip. Therefore, the third image generated by the imaging unit 301 includes an image of the light spot on the third optoelectronic chip. As another possible implementation, the light beam received by the imaging unit 301 includes the light beam reflected by the pattern on the fourth optoelectronic chip. Therefore, the fourth image generated by the imaging unit 301 includes an image of the light spot on the fourth optoelectronic chip.

[0184] The control unit 302 is configured to control the adjustment unit 303. For its definition and possible implementation, refer to the detailed introduction of the control unit below. As a possible implementation, the control unit 302 may control the adjustment unit 303 based on the third image and the fourth image. Exemplarily, the control unit 302 generates corresponding control instructions by analyzing the images of the light spots on the third optoelectronic chip and the fourth optoelectronic chip, and is used to control the adjustment unit 303. For example, the control unit 302 generates a control instruction by analyzing the sharpness of the images of the light spots on the third optoelectronic chip and the fourth optoelectronic chip. This control instruction is used to control the adjustment unit 303 to adjust the distances between the first lens module 501 and the second lens module 502 and the imaging unit 301. For the specific implementation manner, refer to the subsequent related introduction.

[0185] The adjustment unit 303 is configured to adjust the relative position and pose of the first lens module 501 and the second lens module 502. For its definition and possible implementation, refer to the detailed introduction of the adjustment unit below. Optionally, the adjustment unit 303 may adjust the position and / or pose of the first lens module 501 and the second lens module 502, etc. Exemplarily, based on the control instruction of the control unit 302, the adjustment unit 303 adjusts the relative position and pose of the first lens module 501 and the second lens module 502, so that the images of the light spots on the third optoelectronic chip generated by the imaging unit 301 overlap with the images of the light spots on the fourth optoelectronic chip, thereby completing the coupling of the first lens module 501 and the second lens module 502.

[0186] In short, for the above coupling platform, only the control unit needs to control the adjustment unit based on the third image and the fourth image, and then let the adjustment unit execute the corresponding control instruction to adjust the relative position and pose of the first lens module and the second lens module, so as to complete the coupling of the first lens module and the second lens module. There is no need to perform complex power-on and power-off processes, which is not only simple in operation and short in time consumption, but also can realize the automatic assembly of optical products, thereby reducing the process time in the assembly process of optical products and improving the assembly efficiency and the hourly output of optical products.

[0187] Continuing with the naming of "Image A" and "Image B" in the above text, the imaging of the illuminated pattern on the third optoelectronic chip in the imaging unit can be referred to as the image of the light spot on the third optoelectronic chip, simply abbreviated as "Image C". The imaging of the illuminated pattern on the fourth optoelectronic chip in the imaging unit can be referred to as the image of the light spot on the fourth optoelectronic chip, simply abbreviated as "Image D".

[0188] The optical path in the above coupling platform 300 is as follows: The light beam passes through the third optical element and illuminates the third optoelectronic chip. The light beam reflected by the pattern on the third optoelectronic chip passes through the third optical element again and is received by the imaging unit 301. The light beam passes through the fourth optical element and illuminates the fourth optoelectronic chip. The light beam reflected by the pattern on the fourth optoelectronic chip passes through the fourth optical element again and is received by the imaging unit 301. As Figure 5 shown by the dashed line in the figure

[0189] In a possible implementation, the above coupling platform 300 further includes an illumination unit, which is used to provide illumination light beams for the first lens module and the second lens module. Specifically, the illumination unit is used to provide illumination light beams for the third optoelectronic chip included in the first lens module and the fourth optoelectronic chip included in the second lens module. Its definition and possible implementation can be seen in the detailed introduction to the illumination unit below.

[0190] Please refer to Figure 6 , Figure 6 which is a schematic diagram of another coupling platform provided by the embodiment of the present application. The coupling platform 300 includes an imaging unit 301, a control unit 302, an adjustment unit 303, and an illumination unit 601.

[0191] As Figure 6 shown, the light beam provided by the illumination unit 601 enters the first lens module 501 and the second lens module 502, and illuminates the optoelectronic chips included in the first lens module 501 and the second lens module 502. The light beams reflected by the light spot images on the two optoelectronic chips are both received by the imaging unit 301.

[0192] In a possible illumination design, when the first lens module 501 includes a third optical element and a third optoelectronic chip, and the second lens module 502 includes a fourth optical element and a fourth optoelectronic chip, the optical path of the coupling platform 300 is: The light beam provided by the illumination unit 601 passes through the third optical element and the fourth optical element, and is respectively received by the third optoelectronic chip and the fourth optoelectronic chip. The light beams reflected by the light spot images on the third optoelectronic chip and the fourth optoelectronic chip pass through the third optical element and the fourth optical element again, and are received by the imaging unit 301. The imaging unit 301 generates a third image and a fourth image. The third image includes Image C, and the fourth image includes Image D.

[0193] By means of providing an illumination beam for the first lens module 501 and the second lens module 502 through the illumination unit 601, the patterns on the third optoelectronic chip included in the first lens module 501 and the fourth optoelectronic chip included in the second lens module 502 can be clearly illuminated, avoiding the situation that the third optoelectronic chip and the fourth optoelectronic chip are unevenly illuminated. As a result, the imaging unit 301 can generate clear images C and D, facilitating the accurate control by the control unit 302 and being beneficial to saving the time-consuming of coupling the first lens module 501 and the second lens module 502.

[0194] In order to clearly describe how the adjustment unit adjusts the relative position and orientation between the optical element and the optoelectronic chip, the above-mentioned relative position and orientation are further introduced with reference to the accompanying drawings.

[0195] The position and orientation refer to the position and orientation of an object in space. For example, the position refers to the position of the first optoelectronic chip 105 in space, or the position refers to the position of the centroid of the first optoelectronic chip 105 in space. The orientation can refer to the orientation of the first optoelectronic chip 105 in space, or the direction in which the optical axis of the first optoelectronic chip 105 is located in space. The relative position and orientation refer to the relative position and relative orientation of two objects. It is easy to understand that the relative position and orientation of two objects can be generated based on the position and orientation of the two objects.

[0196] Exemplarily, the position and orientation of an object in space can be represented by a coordinate system, such as a Cartesian coordinate system, a spherical coordinate system, or a cylindrical coordinate system, etc. The present application does not limit this. For the sake of easy understanding, an embodiment of the present application provides a possible coordinate system, as Figure 7 shown.

[0197] Please refer to Figure 7 , Figure 7 which is a schematic diagram of a coordinate system provided by an embodiment of the present application. The coordinate system includes an x-axis, a y-axis, and a z-axis. The origin, the pointing directions of the x-axis, the y-axis, and the z-axis of this coordinate system can be predefined.

[0198] The orientation of the optical product can be described by the Euler angles of the optical product relative to this coordinate system. For example, an optical product coordinate system is established with the centroid of the optical product as the origin. The x-axis is parallel to the optical axis of the optical product and points in the direction of light reception (or the direction of light emission), the y-axis is perpendicular to the optical axis of the optical product and points to the left (or right) of the optical product, and the z-axis is perpendicular to the x-axis and points above (or below) the optical product. The angles by which the optical product rotates around the three coordinate axes of the optical product coordinate system are the pitch angle (x-axis), the roll angle (y-axis), and the yaw angle (z-axis) respectively. The optical product and Figure 7The relationship of the coordinate system shown is three Euler angles, which reflect the attitude of the optical product relative to this coordinate system. Euler angles are the simplest way to express rotation. Formally, it is a three-dimensional vector, and its values respectively represent the rotation angles of the object around the three axes (x, y, z axes) of the coordinate system, which are called pitch (pitching angle), roll (rolling angle), and yaw (yaw angle), and are translated as pitching angle, rolling angle, and yaw angle.

[0199] The above-mentioned optical product is, for example, the first optical element 104, the first optoelectronic chip 105, the second optical element 106, or the second optoelectronic chip 107. Optionally, the above-mentioned optical product can also be the first lens module or the second lens module mentioned below.

[0200] Exemplarily, taking the centroid of the first optical element 104 as the origin to establish an optical product coordinate system as an example, the relative pose between the first optical element 104 and the first optoelectronic chip 105 can be determined based on the coordinate values (0, 0, 0) of the first optical element 104, the three Euler angles of the first optical element 104, the coordinate values of the first optoelectronic chip 105, and the three Euler angles of the first optoelectronic chip 105.

[0201] For example, the three Euler angles of the first optical element 104 are (0°, 0°, 0°) in sequence, the coordinate values of the first optoelectronic chip 105 are (10, 5, 3), and the three Euler angles of the first optoelectronic chip 105 are (10°, -10°, 0°) in sequence. Then the relative position between the first optical element 104 and the first optoelectronic chip 105 is (10, 5, 3), and the relative attitude between the first optical element 104 and the first optoelectronic chip 105 is (10°, -10°, 0°). The relative attitude between the first optical element 104 and the first optoelectronic chip 105 can be represented by the above relative position (10, 5, 3) and relative attitude (10°, -10°, 0°).

[0202] Optionally, the units of the three coordinate axes in the above-mentioned optical product coordinate system can be micrometers (um), millimeters (mm), centimeters (cm), or meters (m), and this application does not make any limitations on this.

[0203] In the same way, the relative pose between the second optical element 106 and the second optoelectronic chip 107 can be determined, and the relative pose between the first lens module and the second lens module mentioned below can also be determined.

[0204] It should be noted that the above method for determining the relative pose is exemplary and does not constitute a limitation to this application.

[0205] As can be known from the above, the accuracy of optical product coupling affects the clarity of the image in the imaging unit. Therefore, the clarity of the image generated by the imaging unit when the optical products are in different relative poses can be measured, and the relative poses of the optical products can be adjusted based on data such as the clarity of the image, so as to achieve the coupling of the optical products. For this purpose, the present application provides a method for measuring the image clarity.

[0206] Please refer to Figure 8A , Figure 8A which is a schematic diagram for measuring the image clarity provided by an embodiment of the present application, and is used to measure the clarity (also known as the resolution) of the image generated by the imaging unit when the optical products are in different relative poses.

[0207] As Figure 8A shown, Figure 8A it includes an imaging unit, an optical element, and a photoelectric chip. Among them, the imaging unit is, for example, the above-mentioned imaging unit 101, imaging unit 201, or imaging unit 301, the optical element is, for example, the above-mentioned first optical element 104 or second optical element 106, and the photoelectric chip is, for example, the above-mentioned first photoelectric chip 105 or second photoelectric chip 107.

[0208] Please refer to Figure 8B , Figure 8B which is a schematic diagram of the spot image on the photoelectric chip provided by an embodiment of the present application. Figure 8B The shown spot image is, for example, Figure 8A the imaging of the pattern on the photoelectric chip shown in Figure 8B in the imaging unit. In order to obtain the clarity of the image generated by the imaging unit when the optical products are in different relative poses, one or more points can be preset on the image generated by the imaging unit as the sampling points for clarity. As

[0209] shown, the preset points A, B, C, D, and E are used as the sampling points for the image clarity of the spot on the photoelectric chip. Among them, point E is the center point of the image of the spot on the photoelectric chip, and points A, B, C, and D are respectively the points on the edge of the spot image.

[0210] A possible implementation is to adjust the distance between the optoelectronic chip and the optical element in the optical axis direction of the imaging unit, and make the imaging unit generate images corresponding to different spacings. Further, the sharpness of each image at points A, B, C, D, and E is obtained respectively, so as to generate a curve graph showing the change of the sharpness of each point with the distance between the optoelectronic chip and the optical element (also called the defocus curve corresponding to each point). Based on the defocus curve graph, the optimal sharpness of the image and the spacing between the optoelectronic chip and the optical element when the image has the optimal sharpness can be obtained. This application does not limit how to represent the sharpness. For example, the sharpness of the image can be represented by the SFR value or the MTF value.

[0211] Exemplarily, as Figure 8A shown, the position of the optoelectronic chip is adjusted in the optical axis direction of the imaging unit, which are position A, position B (the focal plane of the optical element), …, position N respectively, where N is an integer greater than 2. The imaging unit generates images of the light spots on the optoelectronic chip when the optoelectronic chip is at position A, position B, …, position N respectively. Further, based on preset sampling points (for example, Figure 8B points A, B, C, D, and E shown in

[0212] ), defocus curves at multiple points are generated.

[0213] Method 1: Adjust the position of the optoelectronic chip in the optical axis direction of the imaging unit.

[0214] Method 2: Adjust the position of the optical element in the optical axis direction of the imaging unit.

[0215] Method 3: Adjust the positions of the optical element and the optoelectronic chip in the optical axis direction of the imaging unit.

[0216] This application does not limit how to adjust the spacing between the optoelectronic chip and the optical element in the optical axis direction of the imaging unit.

[0217] Please refer to Figure 8C , Figure 8C which is a schematic diagram of a defocus curve provided by an embodiment of this application. As Figure 8C shown, the horizontal axis is used to represent the spacing between the optical element and the optoelectronic chip, and the vertical axis is used to represent the sharpness (MTF). Figure 8C Points A, B, C, D, and E corresponding defocus curves are shown in Figure 8CAs shown, the MTF values of the optimal sharpness of points A, B, C, D, and E imaged in the imaging unit are all 70% (in actual implementation, the optimal imaging sharpness of multiple points may be different). When the distance between the optical element and the optoelectronic chip is 1.78 mm, the defocus curve corresponding to point E indicates that the imaging of point E in the imaging unit has the optimal sharpness. Since point E is the center point of the image of the light spot on the optoelectronic chip, the distance between the optical element and the optoelectronic chip when point E has the optimal sharpness can be used as the focal length of the optical element, and then the focal plane of the optical element can be calculated.

[0218] It should be noted that in the specific implementation process, other methods can also be used to obtain the sharpness of the imaging unit, and the embodiments of the present application do not limit this.

[0219] Next, the imaging unit, control unit, adjustment unit, and illumination unit provided in the present application will be introduced in sequence.

[0220] 1. Imaging Unit

[0221] The imaging unit is, for example, the imaging unit 101, imaging unit 201, or imaging unit 301 in the above content, etc. The imaging unit includes an imaging optical element and an image sensor. Among them, the imaging optical element is used to obtain the light beam reflected by the pattern on the optoelectronic chip (for example, the first optoelectronic chip 105, the second optoelectronic chip 107, the third optoelectronic chip, or the fourth optoelectronic chip), and the image transmitter is used to generate an image based on the light beam obtained by the imaging optical element.

[0222] In a possible implementation manner, the angular resolution of the imaging optical element is greater than or equal to X times the angular resolution of the optical element to be coupled, where X is an integer greater than or equal to 5.

[0223] Among them, the optical element to be coupled is, for example, the first optical element 104, the second optical element 106, the third optical element, or the fourth optical element above.

[0224] Exemplarily, X = 10, and the angular resolution of the imaging optical element is greater than or equal to 10 times the angular resolution of the optical element to be coupled. For example, if the angular resolution of the optical element to be coupled is 8 pixels per degree (PPD), the angular resolution of the imaging optical element needs to be at least 80 PPD.

[0225] Optionally, the focal length of the imaging optical element is greater than or equal to 80 mm. For example, the focal length of the imaging optical element is 80 mm, 200 mm, 300 mm, or 500 mm.

[0226] Optionally, the imaging optical element is, for example, a telephoto lens or a collimator. Among them, the focal length of the telephoto lens is greater than or equal to 80 mm, such as 100 mm, 300 mm or 500 mm, etc. Among them, the focal length of the collimator is greater than or equal to 200 mm, such as 200 mm, 300 mm, 600 mm or 800 mm.

[0227] Optionally, the focal length of the imaging optical element is related to the attributes of the optical product to be coupled.

[0228] For example, the focal length of the imaging optical element is related to the size of the pixels on the optoelectronic chip in the optical product to be coupled. In the case where the area occupied by the pixels on the optoelectronic chip is large, an imaging optical element with a short focal length can be used. In the case where the area occupied by the pixels on the optoelectronic chip is small, an imaging optical element with a long focal length can be used. Thus, the size of the spot image on the optoelectronic chip in the image generated by the imaging unit is moderate, which is convenient for analysis. It is avoided that the imaging of the pixels on the optoelectronic chip in the imaging unit is too small or too large, resulting in inaccurate analysis or difficult analysis.

[0229] In a possible implementation manner, the imaging unit is a high-resolution detector.

[0230] Exemplarily, the resolution of the imaging unit is greater than or equal to 1080 pixels per inch (PPI). For example, the resolution of the imaging unit is 1080 PPI, 2056 PPI or 4080 PPI, etc. The imaging unit being a high-resolution detector can make the image generated by the imaging unit clearer, which is convenient for the control unit to analyze and process it, so as to generate accurate control instructions, and further improve the assembly accuracy (coupling accuracy).

[0231] Optionally, the imaging unit also has the ability of low-light detection.

[0232] Exemplarily, the lowest brightness that the imaging unit can collect is 1 lux. For example, the lowest brightness collected by the imaging unit is 10 lux or 25 lux, etc. The imaging unit having the ability of low-light detection can enable the imaging unit to generate an image of the spot on the optoelectronic chip under a lower light intensity, avoiding the situation where an image of the spot on the optoelectronic chip cannot be generated, and expanding the application scenarios of the coupling platform.

[0233] 2. Control Unit

[0234] The control unit is, for example, the above-mentioned control unit 102, control unit 202 or control unit 302, etc. The control unit is used to process the image generated by the imaging unit and generate a control instruction for controlling the adjustment unit based on the processing result. For example, it includes one or more of the following forms:

[0235] Form 1: The control unit sends a control instruction to the adjustment unit to let the adjustment unit adjust the distance between the optical element and the optoelectronic chip in the imaging unit axis direction in the optical product. The control unit then obtains the defocus curve of the optical element based on multiple images generated by the imaging unit. The specific implementation can refer to the relevant description above Figure 8A - Figure 8C and will not be elaborated here.

[0236] Form 2: Based on the size of the image of the light spot on the optoelectronic chip, control the distance between the optoelectronic chip and the imaging unit.

[0237] For example, when the image of the pattern on the optoelectronic chip in the imaging unit is too small, the distance between the optoelectronic chip and the imaging unit can be controlled to be reduced. For another example, when the image of the optoelectronic chip in the imaging unit is too large, the distance between the optoelectronic chip and the imaging unit can be controlled to be increased. By this way, the size of the image of the light spot on the optoelectronic chip is made appropriate, which is convenient for subsequent analysis and processing.

[0238] Form 3: Based on the clarity of the image of the light spot on the optoelectronic chip, control the relative pose of the optoelectronic chip and the imaging unit so that the clarity of the image of the light spot on the optoelectronic chip is the best clarity.

[0239] Combined with the above Figure 8C , first adjust the distance between the optoelectronic chip and the optical element in the optical axis direction so that the image corresponding to point E has the best clarity. Then, by adjusting one or more of the pitch angle, roll angle, and yaw angle, the images corresponding to points A, B, C, and D also have the best clarity, thereby completing the coupling of the optoelectronic chip and the optical element.

[0240] Form 4: Based on the size of the image of the light spot on the optoelectronic chips in the two lens modules and the positions in the imaging unit, control the relative pose of the two lens modules so that the sizes of the images of the light spots on the optoelectronic chips in the two lens modules and the positions in the imaging unit are the same, thereby completing the coupling of the two lens modules.

[0241] It should be noted that the two lens modules can be the first lens module 501 and the second lens module 502. The two lens modules can also be the lens module obtained by coupling the first optical element 104 and the first optoelectronic chip 105, and the lens module obtained by coupling the second optical element 106 and the second optoelectronic chip 107.

[0242] In a possible implementation, the control unit can be implemented in the form of a processor invoking software. For example, the device includes a processor, which is connected to a memory. Instructions are stored in the memory, and the processor invokes the instructions stored in the memory to implement any of the above control forms or to implement the functions of each unit of the device. The processor is, for example, a general-purpose processor, such as a central processing unit (CPU) or a microprocessor, and the memory is a memory inside or outside the device. Alternatively, the units in the device can be implemented in the form of hardware circuits, and the functions of some or all of the units can be implemented by designing the hardware circuits, which can be understood as one or more processors. For example, the hardware circuit is an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a field programmable gate array (FPGA), etc.

[0243] 3. Adjustment unit

[0244] The adjustment unit is, for example, the adjustment unit 103, the adjustment unit 203, or the adjustment unit 303 in the above embodiments. The adjustment unit is used to adjust the relative pose of the optical products to be coupled, and thus complete the coupling between the optical products to be coupled.

[0245] In a possible implementation, the adjustment unit includes a three-dimensional adjustment frame and / or a six-dimensional adjustment frame. Among them, the three-dimensional adjustment frame can realize the adjustment of an object in three dimensions, and the six-dimensional adjustment frame can realize the adjustment of an object in six dimensions. Combining the above Figure 7 , the three-dimensional adjustment frame can adjust the values of an object in any three of the x-axis, y-axis, z-axis, pitch angle, roll angle, and yaw angle. For example, the three-dimensional adjustment frame can adjust the values of an object in the x-axis, y-axis, and z-axis. For another example, the three-dimensional adjustment frame can adjust the values of an object in the pitch angle, roll angle, and yaw angle. The six-dimensional adjustment frame can adjust the values of an object in the x-axis, y-axis, z-axis, pitch angle, roll angle, and yaw angle.

[0246] Taking the optical products to be coupled as the first optical element 104 and the first optoelectronic chip 105 as an example, the adjustment unit can have the following combinations:

[0247] Combination 1. The adjustment unit is a six-dimensional adjustment frame, and the adjustment unit adjusts the relative pose of the first optical element 104 and the first optoelectronic chip 105 by adjusting the poses of the first optical element 104 and the first optoelectronic chip 105.

[0248] Combination 2. The adjustment unit is two six - dimensional adjustment frames. The adjustment unit adjusts the poses of the first optical element 104 and the first optoelectronic chip 105 respectively through the two six - dimensional adjustment frames, so as to adjust the relative pose between the first optical element 104 and the first optoelectronic chip 105.

[0249] Combination 3. The adjustment unit is two three - dimensional adjustment frames. The adjustment unit adjusts the poses of the first optical element 104 and the first optoelectronic chip 105 respectively through the two three - dimensional adjustment frames, so as to adjust the relative pose between the first optical element 104 and the first optoelectronic chip 105.

[0250] Optionally, when the product to be coupled is the second optical element 106 and the second optoelectronic chip 107, or when the product to be coupled is the first lens module 501 and the second lens module 502, the specific implementation of the adjustment unit can refer to the corresponding content above and will not be elaborated here.

[0251] Optionally, when the product to be coupled includes the first optical element 104 and the first optoelectronic chip 105, the second optical element 106 and the second optoelectronic chip 107, the adjustment unit can be two six - dimensional adjustment frames, three six - dimensional adjustment frames, four six - dimensional adjustment frames or four three - dimensional adjustment frames, etc. For example, when the adjustment unit is two six - dimensional adjustment frames, the two six - dimensional adjustment frames are respectively used to adjust the poses of the first optical element 104 and the second optical element 106, or the two six - dimensional adjustment frames are respectively used to adjust the poses of the first optical element 104 and the second optoelectronic chip 107, or the two six - dimensional adjustment frames are respectively used to adjust the poses of the first optoelectronic chip 105 and the second optical element 106, or the two six - dimensional adjustment frames are respectively used to adjust the poses of the first optoelectronic chip 105 and the second optoelectronic chip 107. Regarding the specific implementation of how the adjustment unit adjusts in the case of other combinations of the adjustment unit, reference can be made to the relevant descriptions above and will not be introduced one by one here.

[0252] In a possible implementation manner, the adjustment unit is used to adjust the spatial position of the optical product to be coupled.

[0253] Taking the product to be coupled as the first optical element 104 and the first optoelectronic chip 105 as an example, the adjustment unit is used to adjust the spatial position of the first optical element 104 and / or the first optoelectronic chip 105. For example, the adjustment unit is a six - dimensional adjustment frame, which is used to adjust the spatial position of the first optical element 104 and / or the first optoelectronic chip 105. For another example, the adjustment unit is two six - dimensional adjustment frames, which are used to adjust the spatial positions of the first optical element 104 and the first optoelectronic chip 105 respectively. For yet another example, the adjustment unit is two three - dimensional adjustment frames, which are used to adjust the spatial positions of the first optical element 104 and the first optoelectronic chip 105 respectively.

[0254] Taking the products to be coupled as the second optical element 106 and the second optoelectronic chip 107 as an example, the adjustment unit is used to adjust the spatial positions of the second optical element 106 and / or the second optoelectronic chip 107. For the specific implementation, reference can be made to the relevant description of the products to be coupled as the first optical element 104 and the first optoelectronic chip 105 above, which will not be elaborated here.

[0255] Taking the products to be coupled as the first lens module 501 and the second lens module 502 as an example, the adjustment unit is used to adjust the spatial positions of the first lens module 501 and / or the second lens module 502. For the specific implementation, reference can be made to the relevant description of the products to be coupled as the first optical element 104 and the first optoelectronic chip 105 above, which will not be elaborated here.

[0256] 4. Illumination unit

[0257] The illumination unit is, for example, the above-mentioned illumination unit 108, illumination unit 109, illumination unit 401, illumination unit 402 or illumination unit 601. The illumination unit is used to provide an illumination beam for the optoelectronic chip, so that the imaging unit can clearly observe the illuminated pattern on the optoelectronic chip, which is convenient for the control unit to perform accurate control and is conducive to saving the coupling time.

[0258] In a possible implementation manner, the illumination unit includes any one or more of the following: optical fiber, optical lens, optical fiber, ground glass or mirror.

[0259] Among them, the optical fiber and the ground glass can form a floodlight source, and combined with the mirror, the light beam generated by the formed floodlight source can illuminate the optoelectronic chip. Due to its small volume, the optical fiber can directly emit a light beam to the optoelectronic chip and illuminate the optoelectronic chip.

[0260] Optionally, the illumination unit 108, illumination unit 401 and illumination unit 601 are, for example, composed of an optical fiber, ground glass and a mirror, and are used to provide a floodlight source. This method has simple operation and low production cost, which is conducive to saving the cost of the coupling platform.

[0261] Optionally, the illumination unit 108, illumination unit 401 and illumination unit 601 are, for example, composed of an optical fiber, an optical lens and a mirror, and are used to provide a directional light source. The light source provided by this method is a fixed light source, which can increase the light intensity received by the optoelectronic chip, and avoid the situation that the light intensity received by the imaging unit from the reflection of the optoelectronic chip is relatively low due to too small an aperture of the optical element or weak reflection ability of the optoelectronic chip, ensuring that the imaging unit can clearly image the illuminated pattern on the optoelectronic chip.

[0262] Optionally, the illumination unit 109 and illumination unit 402 are, for example, composed of optical fibers.

[0263] A possible implementation manner is to select a suitable light source based on the attributes of the optical product to be coupled. Specifically, it includes one or more of the following situations:

[0264] In the first situation, a suitable light source can be selected based on the aperture of the optical element in the optical product to be coupled.

[0265] Exemplarily, when the aperture of the optical element is relatively large, a floodlight source illumination can be selected. For example, a lighting unit composed of an optical fiber, a ground glass, and a reflector is used to generate a floodlight source, and a lighting beam is provided for the optoelectronic chip. Please refer to Figure 9A , Figure 9A which is a schematic diagram of a lighting unit provided by an embodiment of the present application. As Figure 9A shown, Figure 9A it includes an optical fiber, a ground glass, and a reflector. The optical fiber and the ground glass form a floodlight source, and the floodlight beam provided by the floodlight source is reflected by the reflector, thereby illuminating the optoelectronic chip.

[0266] Exemplarily, when the aperture of the optical element is relatively small, a directional light source illumination can be selected. For example, a lighting unit composed of an optical fiber, an optical lens, and a reflector is used to generate a directional light source, and a lighting beam is provided for the optoelectronic chip. Please refer to Figure 9B , Figure 9B which is a schematic diagram of another lighting unit provided by an embodiment of the present application. As Figure 9B shown, Figure 9B it includes an optical fiber, an optical lens, and a reflector. The optical fiber and the optical lens form a directional light source, and the directional beam provided by the directional light source is reflected by the reflector, thereby illuminating the optoelectronic chip.

[0267] In the second situation, a suitable light source can be selected based on the light reflection ability of the optoelectronic chip in the optical product to be coupled.

[0268] Exemplarily, when the light reflection ability of the optoelectronic chip is relatively strong, a floodlight source illumination can be selected. For example, a lighting unit composed of an optical fiber, a ground glass, and a reflector is used to generate a floodlight source, and a lighting beam is provided for the optoelectronic chip. The specific implementation can refer to the relevant introduction above Figure 9A .

[0269] Exemplarily, when the light reflection ability of the optoelectronic chip is relatively weak, a directional light source illumination can be selected. For example, a lighting unit composed of an optical fiber, an optical lens, and a reflector is used to generate a directional light source, and a lighting beam is provided for the optoelectronic chip. The specific implementation can refer to the relevant introduction above Figure 9B .

[0270] In the implementation manner of the present application, the light intensity of the optical fiber or optical fiber in the lighting unit is not limited. The beam intensity provided by the lighting unit only needs to enable the beam reflected by the optoelectronic chip to meet the requirement for clear imaging of the imaging unit.

[0271] Among the above-introduced content, the optical elements included in the optical product to be coupled (e.g., the first optical element 104, the second optical element 106, the third optical element, or the fourth optical element) or the optoelectronic chips (e.g., the first optoelectronic chip 105, the second optoelectronic chip 107, the third optoelectronic chip, or the fourth optoelectronic chip) all exist independently. In some scenarios, there are cases where two optical elements or two optoelectronic chips are rigidly connected. For example, the first optical element 104 is rigidly connected to the second optical element 106, and for another example, the first optoelectronic chip 105 is rigidly connected to the second optoelectronic chip 107, etc.

[0272] It can be understood that when coupling multiple sets of optical products (e.g., the coupling platform 200 can simultaneously couple the first optical element 104 and the first optoelectronic chip 105, and the second optical element 106 and the second optoelectronic chip 107), if the optical elements and / or optoelectronic chips to be coupled are rigidly connected, the adjustment unit can simultaneously adjust the poses of multiple optical elements (e.g., the first optical element 104 and the second optical element 106) and / or multiple optoelectronic chips (e.g., the first optoelectronic chip 105 and the second optoelectronic chip 107), thereby reducing the process time in the optical product assembly process and improving the assembly efficiency and the hourly output of the optical product. The specific implementation method can refer to the description of the subsequent related embodiments and will not be elaborated here for the time being.

[0273] In some other scenarios, there are also cases where multiple optical elements or multiple optoelectronic chips are rigidly connected. This application will not list them one by one. For the coupling scenarios where multiple optical elements and / or multiple optoelectronic chips are connected, reference can be made to the coupling scenarios where two optical elements and / or two optoelectronic chips are connected.

[0274] The above content respectively introduces the coupling platform 100, the coupling platform 200, and the coupling platform 300. Next, the coupling method provided by this application is introduced as applied to the above coupling platforms to achieve the coupling of the optical product to be coupled.

[0275] Please refer to Figure 10 , Figure 10 which is a schematic diagram of a coupling method provided by an embodiment of this application for coupling the first optical element and the first optoelectronic chip, and the first optoelectronic chip is placed under illumination conditions. As Figure 10 shown, Figure 10 the described coupling method includes step S1001 - step S1002, which is applied to the above coupling platform 100 or coupling platform 200, and is specifically introduced as follows:

[0276] Step S1001: The coupling platform receives the light beam passing through the first optical element and generates a first image.

[0277] Among them, the coupling platform is, for example, the above-mentioned coupling platform 100 or coupling platform 200. For the introduction of the coupling platform 100, reference can be made to the above Figure 1 or Figure 2 for the relevant description, which will not be elaborated here. For the introduction of the coupling platform 200, reference can be made to the above Figure 3 or Figure 4 for the relevant description, which will not be elaborated here.

[0278] In a possible implementation manner, the imaging unit in the coupling platform receives the light beam passing through the first optical element and generates a first image.

[0279] Exemplarily, the imaging unit 101 in the coupling platform 100 receives the light beam passing through the first optical element and generates a first image. Among them, the light beam received by the imaging unit 101 includes the light beam reflected by the illuminated pattern on the first optoelectronic chip, and the first image includes image A. For the relevant introduction of the imaging unit 101, reference can be made to the corresponding content above, which will not be elaborated here. The first optical element is, for example, the first optical element 104 shown in the above Figure 1 or Figure 2 , and the first optoelectronic chip is, for example, the first optoelectronic chip 105 shown in the above Figure 1 or Figure 2 . For the introduction of the first optical element 104 and the first optoelectronic chip 105, reference can be made to the above Figure 1 or Figure 2 for the relevant description, which will not be elaborated here.

[0280] Exemplarily, the imaging unit 201 in the coupling platform 200 receives the light beam passing through the first optical element and generates a first image. Among them, the light beam received by the imaging unit 201 includes the light beam reflected by the illuminated pattern on the first optoelectronic chip, and the first image includes the image of the light spot on the first optoelectronic chip. For the relevant introduction of the imaging unit 201, reference can be made to the corresponding content above, which will not be elaborated here. The first optical element is, for example, the first optical element 104 shown in the above Figure 3 or Figure 4 , and the first optoelectronic chip is, for example, the first optoelectronic chip 105 shown in the above Figure 3 or Figure 4 . For the introduction of the first optical element 104 and the first optoelectronic chip 105, reference can be made to the above Figure 3 or Figure 4 for the relevant description, which will not be elaborated here.

[0281] It should be noted that the above coupling platform 200 is used to couple two sets of optical products simultaneously. For example, the coupling platform 200 is used to couple the first optical element 104 with the first optoelectronic chip 105, and the second optical element 106 with the second optoelectronic chip 107 simultaneously. However, in some scenarios, the above coupling platform 200 can also couple a set of optical products. For example, the coupling platform 200 is used to couple the first optical element 104 with the first optoelectronic chip 105, or the coupling platform 200 is used to couple the second optical element 106 with the second optoelectronic chip 107.

[0282] Step S1002: The coupling platform adjusts the relative pose of the first optoelectronic chip and the first optical element.

[0283] In a possible implementation manner, the control unit in the coupling platform controls the adjustment unit in the coupling platform based on the above first image, and the adjustment unit adjusts the relative pose of the first optoelectronic chip and the first optical element based on the control instruction of the control unit.

[0284] Among them, the control unit is, for example, the above control unit 102 or control unit 202. When the control unit is control unit 102, the adjustment unit is the above adjustment unit 103; when the control unit is control unit 202, the adjustment unit is the above adjustment unit 203. For the specific introduction of control unit 102, control unit 202, adjustment unit 103 or adjustment unit 203, reference can be made to the above Figure 1 - Figure 4 corresponding description, which will not be elaborated here.

[0285] Optionally, the control unit can obtain the defocus curve of the first optical element based on the first image, and the specific implementation process can be referred to the above Figure 8A - Figure 8C related description, which will not be elaborated here. The above obtaining the defocus curve of the first optical element can be to obtain the defocus curves of multiple points. For example, the defocus curves corresponding to point A, point B, point C, point D, and point E. It should be noted that the defocus curve is a curve graph used to represent the relationship between imaging clarity and the object's distance from the focal plane. In the specific implementation process, it can also be represented by other methods such as tables, matrices, databases, etc. to represent the relationship between imaging clarity and the object's distance from the focal plane. Further, the storage form and representation form of the defocus curve in the control unit are not limited in this application. Being able to obtain the focal plane of the first optical element based on the first image falls within the protection scope of this application.

[0286] After obtaining the defocus curve and calculating the focal plane of the first optical element, the control unit can control the adjustment unit to let the adjustment unit adjust the relative pose of the first optoelectronic chip and the first optical element, so that the first optoelectronic chip is in the focal plane of the first optical element, thereby completing the coupling of the first optoelectronic chip and the first optical element. Combining the above Figure 8B, the focal plane of the first optical element can be a plane determined by the best focus based on point A, point B, point C, point D, or point E. For example, if the spacing corresponding to the best focus of point E is 1.78 mm, then the focal distance of the first optical element based on the best focus of point E is 1.78 mm from the first optical element, and the focal plane of the first optical element is the plane containing this focus point.

[0287] Next, in combination with the above Figure 7 , several possible adjustment methods are exemplarily shown:

[0288] It should be noted that all the control instructions made by the adjustment unit in the following text are issued by the control unit. For the sake of smoothness and conciseness of the language, in the following text, the adjustment unit is taken as the main body to perform the adjustment actions, and the relevant descriptions of the control unit issuing control instructions are not shown. Therefore, it should not be understood that the control unit does not issue any control instructions or perform any actions during the adjustment process.

[0289] Adjustment method 1: The adjustment unit adjusts the axial spacing (z-axis direction) between the first optical element and the first optoelectronic chip so that a certain position of the first optoelectronic chip is located in the focal plane of the first optical element.

[0290] Based on the above Figure 8A - Figure 8C shown content, the focal plane of the first optical element can be obtained. By adjusting the axial spacing between the first optical element and the first optoelectronic chip, it is possible to make a certain position of the first optoelectronic chip located in the focal plane of the first optical element. Combining Figure 8B , by adjusting the axial spacing between the first optical element and the first optoelectronic chip, it is possible to make point E of the first optoelectronic chip located in the focal plane of the first optical element, that is, the spacing between the optical element and the optoelectronic chip is 1.78 mm.

[0291] It should be noted that the above adjustment of the axial spacing between the first optical element and the first optoelectronic chip can be achieved by adjusting the position of the first optical element in the x-axis direction, or by adjusting the position of the first optoelectronic chip in the x-axis direction, or by jointly adjusting the positions of the first optical element and the first optoelectronic chip in the x-axis direction.

[0292] Adjustment method 2: The adjustment unit can also adjust the relative positions of the first optical element and the first optoelectronic chip in the up-down, left-right directions so that the imaging unit can generate a complete spot image on the first optoelectronic chip. Please refer to Figure 11A , Figure 11A is a schematic diagram of a coupling process provided by an embodiment of the present application, used to show the situation where the imaging unit cannot generate a complete spot on the first optoelectronic chip.

[0293] As Figure 11AAs shown, the first optical element does not completely overlap with the first optoelectronic chip. For example, the first optical element does not completely overlap with the first optoelectronic chip in the y-axis direction, and / or the first optical element does not completely overlap with the first optoelectronic chip in the z-axis direction. Among them, in the first optoelectronic chip, the area overlapping with the first optical element is called area 1. In the first optoelectronic chip, the area not overlapping with the first optical element is called area 2. From Figure 11A it can be seen that the light beam reflected by area 1 can pass through the first optical element and be received by the imaging unit. Since area 2 does not overlap with the first optical element, the light beam reflected by area 2 cannot pass through the first optical element and thus cannot be received by the imaging unit. Therefore, the first image generated by the imaging unit may not include the entire image of the pattern on the first optoelectronic chip. By adjusting the relative positions of the first optical element and the first optoelectronic chip up, down, left, and right, the first image includes the entire image of the pattern on the first optoelectronic chip. It should be noted that Figure 11A area 2 shown in

[0294] may also not be illuminated because it does not overlap with the first optical element, resulting in area 2 not reflecting a light beam, and further causing the first image not to include the entire image of the pattern on the first optoelectronic chip. Figure 11B , Figure 11B is another schematic diagram of the coupling process provided by the embodiment of the present application, used to show the situation where the first optical element and the first optoelectronic chip completely overlap in the up and down (z-axis direction) and / or left and right (y-axis direction).

[0295] As Figure 11B shown, Figure 11B the first optical element and the first optoelectronic chip shown completely overlap, so that the light beam reflected by area 2 on the first optoelectronic chip can be received by the imaging unit, or so that area 2 on the first optoelectronic chip can be illuminated, so that the reflected light beam can also be received by the imaging unit.

[0296] It should be noted that the above adjustment of the relative positions of the first optical element and the first optoelectronic chip up, down, left, and right can be achieved by adjusting the position of the first optical element in the y-axis direction and / or the z-axis direction, or by adjusting the position of the first optoelectronic chip in the y-axis direction and / or the z-axis direction, or by jointly adjusting the positions of the first optical element and the first optoelectronic chip in the y-axis direction and / or the z-axis direction.

[0297] Adjustment method three: The adjustment unit can also make the first optoelectronic chip be in the focal plane of the first optical element by adjusting the Euler angles of the first optical element and the first optoelectronic chip. Please refer to Figure 12A , Figure 12AAnother schematic diagram of the coupling process provided by the embodiment of the present application is used to show the situation where the Euler angles of the first optical element and the first optoelectronic chip are inconsistent.

[0298] As Figure 12A shown, if the Euler angles of the first optical element and the first optoelectronic chip are inconsistent, for example, one or more of the roll angle or yaw angle of the first optical element and the first optoelectronic chip are inconsistent, it will lead to inconsistent clarity of the pattern on the first optoelectronic chip when imaging in the imaging unit. As Figure 12A shown, the light beams reflected by points A, C, and E on the optoelectronic chip are respectively shown. Among them, points A and C are not located on the focal plane of the first optical element, and point E is located on the focal plane of the first optical element. Therefore, the imaging clarity corresponding to points A and C in the imaging unit will be lower than the imaging clarity corresponding to point E in the imaging unit. By adjusting the Euler angles of the first optical element and the first optoelectronic chip, the first optoelectronic chip can be located on the focal plane of the first optical element, so that the pattern on the first optoelectronic chip has the best clarity when imaging in the imaging unit, and the imaging clarity of each position on the first optoelectronic chip in the imaging unit is consistent.

[0299] For another example, the angle of the pattern on the first optoelectronic chip when imaging in the imaging unit can be adjusted by adjusting the pitch angle (rotation around the optical axis) of the first optoelectronic chip.

[0300] Please refer to Figure 12B , Figure 12B which is an imaging schematic diagram provided by the embodiment of the present application and is used to show the imaging of the illuminated pattern on the first optoelectronic chip in the imaging unit.

[0301] As Figure 12B shown, where Figure 12B (a) is the imaging of the pattern on the first optoelectronic chip in the imaging unit before adjusting the pitch angle of the first optoelectronic chip. Figure 12B (b) is the imaging of the pattern on the first optoelectronic chip in the imaging unit after adjusting the pitch angle of the first optoelectronic chip. It can be understood that by adjusting the pitch angle of the first optoelectronic chip, the angle of image A can be adjusted.

[0302] Please refer to Figure 12C , Figure 12C Another schematic diagram of the coupling process provided by the embodiment of the present application is used to show the situation where the Euler angles of the first optical element and the first optoelectronic chip are consistent.

[0303] As Figure 12C shown, Figure 12CThe Euler angles of the first optical element and the first optoelectronic chip shown are the same, and the first optoelectronic chip is located in the focal plane of the first optical element, so that the image of the light spot on the first optoelectronic chip has the best clarity, and the clarity of imaging at each position (point A, point C, and point E) on the first optoelectronic chip in the imaging unit is the same. In addition, the image of the light spot on the first optoelectronic chip can be made the same as the preset imaging.

[0304] It should be noted that the above adjustment of the Euler angle between the first optical element and the first optoelectronic chip can be achieved by adjusting the Euler angle of the first optical element, or by adjusting the Euler angle of the first optoelectronic chip, or by jointly adjusting the Euler angles of the first optical element and the first optoelectronic chip.

[0305] Optionally, in the specific adjustment process, the execution order of the above three adjustment methods is not limited.

[0306] For example, the first adjustment method can be executed first so that a certain position in the first optoelectronic chip is located in the focal plane of the first optical element. Then, the second adjustment method is executed so that a complete light spot of the first optoelectronic chip can be generated on the imaging unit. Finally, the third adjustment method is executed so that the entire first optoelectronic chip is located in the focal plane of the first optical element, thereby completing the coupling.

[0307] For another example, the second adjustment method can be executed first so that a complete light spot of the first optoelectronic chip can be generated on the imaging unit. Then, the first adjustment method is executed so that a certain position in the first optoelectronic chip is located in the focal plane of the first optical element. Finally, the third adjustment method is executed so that the entire first optoelectronic chip is located in the focal plane of the first optical element, thereby completing the coupling.

[0308] For another example, the third adjustment method can be executed first so that the first optoelectronic chip is perpendicular to the optical axis of the first optical element. Then, the second adjustment method is executed so that a complete light spot of the first optoelectronic chip can be generated on the imaging unit. Finally, the first adjustment method is executed so that the entire first optoelectronic chip is located in the focal plane of the first optical element, thereby completing the coupling.

[0309] Optionally, in the specific adjustment process, the above three adjustment methods can be adjusted sequentially, or multiple adjustment methods can be adjusted simultaneously.

[0310] For example, the first adjustment method and the second adjustment method can be executed simultaneously, or the second adjustment method and the third adjustment method can be executed simultaneously, or the first adjustment method and the third adjustment method can be executed simultaneously, or the first adjustment method, the second adjustment method, and the third adjustment method can be executed simultaneously.

[0311] The above has been exemplarily described on how to couple a set of optical products (e.g., the first optical element 104 and the first optoelectronic chip 105). Next, an example is given on how to couple two sets or multiple sets of optical products simultaneously. For example, the above coupling platform 200 can couple the first optical element 104 and the first optoelectronic chip 105, and the second optical element 106 and the second optoelectronic chip 107 simultaneously.

[0312] Please refer to Figure 13 , Figure 13 which is a schematic diagram of another coupling method provided by an embodiment of the present application, for simultaneously coupling the first optical element and the first optoelectronic chip, and the second optical element and the second optoelectronic chip, and the first optoelectronic chip and the second optoelectronic chip are placed under illumination conditions. As Figure 13 shown, Figure 13 the coupling method includes step S1301 - step S1302, which is applied to the above coupling platform 200, and is specifically introduced as follows:

[0313] Step S1301: The coupling platform receives the light beam passing through the first optical element and generates a first image. The coupling platform also receives the light beam passing through the second optical element and generates a second image.

[0314] Among them, the coupling platform is, for example, the above coupling platform 200. The introduction of the coupling platform 200 can refer to the relevant descriptions above Figure 3 or Figure 4 and will not be elaborated here.

[0315] In a possible implementation manner, the imaging unit in the coupling platform receives the light beam passing through the first optical element and generates a first image. For the specific implementation process, reference can be made to the description of the above step S1001 and will not be elaborated here.

[0316] In a possible implementation manner, the imaging unit in the coupling platform receives the light beam passing through the second optical element and generates a second image.

[0317] Exemplarily, the imaging unit 201 in the coupling platform 200 receives the light beam passing through the second optical element and generates a second image. Among them, the light beam received by the imaging unit 201 includes the light beam reflected by the illuminated pattern on the second optoelectronic chip, and the second image includes image B. The relevant introduction of the imaging unit 201 can refer to the corresponding content above and will not be elaborated here. The second optical element is, for example, the second optical element 106 shown in the above Figure 3 or Figure 4 , and the second optoelectronic chip is, for example, the second optoelectronic chip 107 shown in the above Figure 3 or Figure 4 . The introduction of the second optical element 106 and the second optoelectronic chip 107 can refer to the above Figure 3 orFigure 4 The relevant descriptions in it will not be elaborated here.

[0318] Step S1302: The coupling platform adjusts the relative position and pose between the first optoelectronic chip and the first optical element, and the coupling platform also adjusts the relative position and pose between the second optoelectronic chip and the second optical element.

[0319] In a possible implementation, the control unit in the coupling platform controls the adjustment unit in the coupling platform based on the above-mentioned first image, and the adjustment unit adjusts the relative position and pose between the first optoelectronic chip and the first optical element based on the control instruction of the control unit. For the specific implementation process, reference can be made to the description of step S1002 above, which will not be elaborated here.

[0320] In another possible implementation, the control unit in the coupling platform controls the adjustment unit in the coupling platform based on the above-mentioned second image, and the adjustment unit adjusts the relative position and pose between the second optoelectronic chip and the second optical element based on the control instruction of the control unit.

[0321] Among them, the control unit is, for example, the above-mentioned control unit 202, and the adjustment unit is, for example, the above-mentioned adjustment unit 203. For the specific introduction of the control unit 202 and the adjustment unit 203, reference can be made to the above Figure 3 and Figure 4 the corresponding descriptions, which will not be elaborated here.

[0322] Regarding how the control unit adjusts the relative position and pose between the second optoelectronic chip and the second optical element based on the second image, reference can be made to the relevant description in step S1002 above, where the control unit adjusts the relative position and pose between the first optoelectronic chip and the first optical element based on the first image, which will not be elaborated here.

[0323] It can be understood that the above-mentioned coupling platform 200 can couple only one set of optical products. For example, it can only couple the first optical element and the first optoelectronic chip, or only couple the second optical element and the second optoelectronic chip. It can also couple two sets of optical products at the same time. For example, it can couple the first optical element and the first optoelectronic chip, and the second optical element and the second optoelectronic chip at the same time. It should be noted that coupling two sets of optical products at the same time should not be understood as starting to couple the two sets of optical products at the same time, and / or ending the coupling of the two sets of optical products at the same time. It only means that the above-mentioned coupling platform 200 can perform the coupling operation on two sets of optical products at the same time.

[0324] In addition to being able to perform the coupling operation on two sets of optical products at the same time, the above-mentioned coupling platform 200 can also couple two sets of optical modules. The specific implementation can be referred to the subsequent Figure 14 corresponding content, which will not be elaborated here for the time being.

[0325] In a possible implementation, the first optical element is rigidly connected to the second optical element, and / or the first optoelectronic chip is rigidly connected to the second optoelectronic chip. Next, the implementation process of the coupling platform in this case will be introduced in different situations.

[0326] Situation 1: The first optical element is rigidly connected to the second optical element.

[0327] The coupling platform can first couple one set of optical products based on the Figure 10 coupling method shown above. For example, first couple the first optical element and the first optoelectronic chip based on the Figure 10 coupling method shown above.

[0328] Then, the coupling platform realizes the coupling of the second optical element and the second optoelectronic chip by adjusting the spatial position of the second optoelectronic chip. For the specific implementation process, the above Figure 10 shown coupling method can also be referred to. The difference is that only the spatial position of the second optoelectronic chip is adjusted in this implementation process.

[0329] Optionally, the coupling platform can also realize the coupling of the second optical element and the second optoelectronic chip by adjusting the spatial position of the second optical element. In this implementation process, it is necessary to ensure that the relative pose of the first optical element and the first optoelectronic chip remains unchanged (because the first optical element and the first optoelectronic chip have been coupled).

[0330] Situation 2: The first optoelectronic chip is rigidly connected to the second optoelectronic chip.

[0331] The coupling platform can first couple one set of optical products based on the Figure 10 coupling method shown above. For example, first couple the first optical element and the first optoelectronic chip based on the Figure 10 coupling method shown above.

[0332] Then, the coupling platform realizes the coupling of the second optical element and the second optoelectronic chip by adjusting the spatial position of the second optical element. For the specific implementation process, the above Figure 10 shown coupling method can also be referred to. The difference is that only the spatial position of the second optical element is adjusted in this implementation process.

[0333] Optionally, the coupling platform can also realize the coupling of the second optical element and the second optoelectronic chip by adjusting the spatial position of the second optoelectronic chip. In this implementation process, it is necessary to ensure that the relative pose of the first optical element and the first optoelectronic chip remains unchanged (because the first optical element and the first optoelectronic chip have been coupled).

[0334] Situation 3: The first optical element is rigidly connected to the second optical element, and the first optoelectronic chip is rigidly connected to the second optoelectronic chip.

[0335] In this case, the coupling unit can also first perform coupling on one set of optical products based on the above-mentioned Figure 10 shown coupling method. For example, first perform coupling on the first optical element and the first optoelectronic chip based on the above-mentioned Figure 10 shown coupling method. Then, by adjusting the pitch angle (rotation around the x-axis direction) of the first optical element and / or the first optoelectronic chip, the coupling of the second optical element and the second optoelectronic chip can be achieved.

[0336] In addition, it is also possible to ensure that during the relative pose adjustment process, the first optoelectronic chip is located in the focal plane of the first optical element and the second optoelectronic chip is located in the focal plane of the second optical element based on the imaging of the illuminated patterns on the first optoelectronic chip and the second optoelectronic chip in the imaging unit, thereby completing the coupling. This implementation method can save the assembly time of optical products and improve the assembly efficiency.

[0337] In some devices, including at least two lens modules, the device can work properly (realize functions such as shooting and detection) only when the lens modules of the device are in a coupled state. Exemplarily, the transmitting lens module and the receiving lens module of a lidar need to be placed in a preset position to ensure that the lidar can work properly. For example, it is necessary to ensure that the optical axes of the transmitting lens module and the receiving lens module of the lidar are parallel to ensure the normal operation of the lidar. Further, on the basis that the optical axes of the transmitting lens module and the receiving lens module are parallel, it is also necessary to ensure that the distance between the transmitting lens module and the receiving lens module is a preset value (for example, the distance is less than 3 mm).

[0338] The above has exemplarily described how to couple to obtain a set of optical products (such as a lens module). Next, an example of how to couple the lens module will be introduced.

[0339] Please refer to Figure 14 , Figure 14 , which is a schematic diagram of another coupling method provided by an embodiment of the present application for coupling the first lens module and the second lens module. Among them, the first lens module is, for example, obtained by coupling the third optical element and the third optoelectronic chip, the second lens module is, for example, obtained by coupling the fourth optical element and the fourth optoelectronic chip, and the third optoelectronic chip and the fourth optoelectronic chip are placed under illumination conditions. As Figure 14 shown, Figure 14 the described coupling method includes step S1401-step S1402, which is applied to the above-mentioned coupling platform 200 or the above-mentioned coupling platform 300, and is specifically introduced as follows:

[0340] Step S1401: The coupling platform receives the light beams passing through the third optical element and the fourth optical element and generates a third image and a fourth image respectively.

[0341] Among them, the coupling platform is, for example, the above-mentioned coupling platform 200 or coupling platform 300. For the introduction of the coupling platform 200, reference can be made to the relevant description above Figure 3 or Figure 4 and will not be elaborated here. For the introduction of the coupling platform 300, reference can be made to the relevant description above Figure 5 or Figure 6 and will not be elaborated here.

[0342] Optionally, the first lens module is, for example, the above-mentioned first lens module 501, and the second lens module is, for example, the above-mentioned second lens module 502. For the introduction of the first lens module 501 and the second lens module 502, reference can be made to the relevant description above Figure 5 or Figure 6 and will not be elaborated here.

[0343] Optionally, the first lens module is obtained by coupling the first optical element 104 and the first optoelectronic chip 105, and the second lens module is obtained by coupling the second optical element 106 and the second optoelectronic chip 107. Correspondingly, the third optical element is, for example, the first optical element 104, the third optoelectronic chip is, for example, the first optoelectronic chip 105, the fourth optical element is, for example, the second optical element 106, and the fourth optoelectronic chip is, for example, the second optoelectronic chip 107.

[0344] In a possible implementation manner, the imaging unit in the coupling platform receives the light beams passing through the third optical element and the fourth optical element and respectively generates a third image and a fourth image.

[0345] Among them, the imaging unit is, for example, the above-mentioned imaging unit 201, or may also be the above-mentioned imaging unit 301. The light beam passing through the third optical element includes the light beam reflected by the illuminated pattern on the third optoelectronic chip, and the light beam passing through the fourth optical element includes the light beam reflected by the illuminated pattern on the fourth optoelectronic chip. For the specific implementation process of the imaging unit receiving the light beam passing through the third optical element to generate the third image and the imaging unit receiving the light beam passing through the fourth optical element to generate the fourth image, reference can be made to the description of step S1001 above and will not be elaborated here.

[0346] Step S1402: The coupling platform adjusts the relative pose of the first lens module and the second lens module based on the third image and the fourth image.

[0347] Since the first lens module and the second lens module are two lens modules to be coupled, the images C and D are the same in shape. And, when the first lens module and the second lens module are in the coupled state, the images C and D will completely overlap. The complete overlap of the images C and D when the first lens module and the second lens module are in the coupled state can be referred to as implementation manner one.

[0348] In some possible implementations, when the first lens module and the second lens module are in a coupled state, image C and image D may not completely overlap. The situation where image C and image D do not completely overlap when the first lens module and the second lens module are in a coupled state can be referred to as implementation method two. In this case, there is still a preset standard that can determine the coupling situation of the first lens module and the second lens based on the features of image C and image D. For example, when the first lens module and the second lens module are in a coupled state and image C and image D are adjacent, this application does not make any limitations in this regard.

[0349] For ease of understanding, in the following text, taking the above "implementation method one" as an example, the coupling process of the first lens module and the second lens module will be introduced exemplarily.

[0350] In a possible implementation manner, the control unit in the coupling platform controls the adjustment unit in the coupling platform based on the above third image and fourth image, and the adjustment unit adjusts the relative pose of the first lens module and the second lens module based on the control instruction of the control unit.

[0351] Among them, the control unit is, for example, the above control unit 202 or control unit 302. When the control unit is control unit 202, the adjustment unit is the above adjustment unit 203; when the control unit is control unit 302, the adjustment unit is the above adjustment unit 303. For the specific introduction of control unit 202, control unit 302, adjustment unit 203 or adjustment unit 303, reference can be made to the corresponding descriptions above, which will not be elaborated here. Figure 3 - Figure 6 The corresponding descriptions will not be repeated here.

[0352] The control unit can control the adjustment unit to adjust the relative pose of the first lens module and the second lens module so that image C and image D completely overlap, thereby completing the coupling of the first lens module and the second lens module.

[0353] Next, in combination with the above Figure 7 , several possible adjustment methods will be exemplarily shown:

[0354] It should be noted that all the control instructions made by the adjustment unit in the following text are issued by the control unit. For the sake of smooth and concise language, in the following text, the adjustment unit is taken as the main body to execute the adjustment action, and the relevant description of the control unit issuing the control instruction is not shown. Therefore, it should not be understood that the control unit does not issue any control instructions or perform any actions during the adjustment process.

[0355] Adjustment method A: The adjustment unit adjusts the distances between the first lens module and the second lens module and the imaging unit in the axial direction (x-axis direction) so that the sizes of image C and image D are equal.

[0356] Please refer to Figure 15A , Figure 15A , which is another schematic diagram of the coupling process provided by the embodiment of the present application, used to show the situation where the distances between the first lens module, the second lens module and the imaging unit are not equal. As Figure 15A shown, the distance between the first lens module 501 and the imaging unit is pitch A, the distance between the second lens module 502 and the imaging unit is pitch B, and pitch A and pitch B are not equal.

[0357] Please refer to Figure 15B , Figure 15B , which is another imaging schematic diagram provided by the embodiment of the present application, used to show the imaging of the optoelectronic chips in the first lens module and the second lens module in the imaging unit. Taking the above-mentioned pitch A being greater than pitch B as an example, it can be seen from Figure 15B that image C is smaller than image D.

[0358] By adjusting the pitch between the first lens module 501 and / or the second lens module 502 and the imaging unit in the axial direction, pitch A can be made equal to pitch B, so that image C and image D are of the same size, as Figure 15C shown.

[0359] In adjustment method B, the adjustment unit can also make the center point of image C coincide with the center point of image D by adjusting one or more of the yaw angle, roll angle, y-axis spatial position, and z-axis spatial position of the first lens module and / or the second lens module.

[0360] Please refer to Figure 16A , Figure 16A , which is another schematic diagram of the coupling process provided by the embodiment of the present application, used to show the situation where the center points of image C and image D do not coincide.

[0361] It can be understood that since the imaging optical element used in the imaging unit is a telephoto lens or a collimator, when the first lens module 501 and the second lens module 502 are in a coupled state, the center points of image C and image D coincide or are substantially coincident (the distance between the center points is less than 1 mm).

[0362] Please refer to Figure 16B , Figure 16B , which is another imaging schematic diagram provided by the embodiment of the present application, used to show the positions of the center points of image C and image D when the first lens module 501 and the second lens module 502 are not in a coupled state. As Figure 16B shown, the distance between the center point of image C and the center point of image D is pitch C. Combining the above Figure 7 , the distance between the center point of image C and the center point of image D in the y-axis direction is pitch D, and the distance in the z-axis direction is pitch E.

[0363] For example, the distance between the center point of image C and the center point of image D in the z-axis direction can be reduced by adjusting the roll angle of the first lens module 501 and / or the second lens module 502. Figure 16C , Figure 16C Another imaging diagram provided in an embodiment of the present application is used to show the case where the distance between the center point of image C and the center point of image D in the z-axis direction is 0 ( Figure 16B The spacing E shown is equal to 0, and the spacing C is equal to the spacing D. Optionally, the spacing between the center points of image C and image D in the z-axis direction can be reduced by adjusting the spatial position of the first lens module 501 and / or the second lens module 502 in the z-axis direction.

[0364] For example, the distance between the center point of image C and the center point of image D in the y-axis direction can be reduced by adjusting the navigation angle of the first lens module 501 and / or the second lens module 502. Figure 16D , Figure 16D Another imaging diagram provided in an embodiment of the present application is used to show the case where the distance between the center point of image C and the center point of image D in the y-axis direction is 0 ( Figure 16B The spacing D shown is equal to 0, and the spacing C is equal to the spacing E. Optionally, the spacing between the center points of image C and image D in the y-axis direction can be reduced by adjusting the spatial position of the first lens module 501 and / or the second lens module 502 in the y-axis direction.

[0365] It should be noted that the above-mentioned adjustment of one or more of the yaw angle, roll angle, y-axis spatial position and z-axis spatial position of the first lens module and / or the second lens module can be achieved by adjusting one or more of the yaw angle, roll angle, y-axis spatial position and z-axis spatial position of the first lens module, and can also be achieved by adjusting one or more of the yaw angle, roll angle, y-axis spatial position and z-axis spatial position of the second lens module.

[0366] Adjustment method C: The adjustment unit can also adjust the pitch angle of the first lens module and / or the second lens module so that image C overlaps or substantially overlaps with image D.

[0367] It can be understood that when the first lens module and the second lens module are coupled, image C and image D overlap or substantially overlap (the distance between the center points of image C and image D is less than 1 mm).

[0368] See Figure 17A , Figure 17A Another imaging schematic diagram provided in an embodiment of the present application is used to illustrate a situation where the center points of image C and image D coincide with each other, but image C and image D do not completely coincide with each other.

[0369] As Figure 17A shown, the center points of image C and image D coincide. However, due to the different rotation angles of image C and image D around the x-axis, image C and image D do not completely coincide. Therefore, by adjusting the pitch angles of the first lens module and / or the second lens module, image C and image D can be made to completely coincide.

[0370] Please refer to Figure 17B , Figure 17B which is another imaging schematic diagram provided by the embodiment of the present application for showing the situation where image C and image D completely coincide.

[0371] Exemplarily, by adjusting the pitch angles of the first lens module and / or the second lens module, image C and image D are made to completely coincide, and then the coupling of the first lens module and the second lens module is completed.

[0372] Optionally, in the specific adjustment process, the execution sequence of the above three adjustment methods is not limited.

[0373] For example, adjustment method A can be executed first to make the sizes of image C and image D equal. Then adjustment method B is executed to make the center points of image C and image D coincide. Finally, adjustment method C is executed to make image C and image D coincide or substantially coincide, thereby completing the coupling.

[0374] For another example, adjustment method B can be executed first to make the center points of image C and image D coincide. Then adjustment method A is executed to make the sizes of image C and image D equal. Finally, adjustment method C is executed to make image C and image D coincide or substantially coincide, thereby completing the coupling.

[0375] Optionally, in the specific adjustment process, the above three adjustment methods can be adjusted sequentially, or multiple adjustment methods can be adjusted simultaneously.

[0376] For example, adjustment method A and adjustment method B can be executed simultaneously, or adjustment method B and adjustment method C can be executed simultaneously, or adjustment method A and adjustment method C can be executed simultaneously, or adjustment method A, adjustment method B, and adjustment method C can be executed simultaneously.

[0377] In summary, the coupling platform provided by the present application only requires the control unit to control the adjustment unit based on the first image, and then let the adjustment unit execute the corresponding control instructions to adjust the relative pose of the first optoelectronic chip and the first optical element, thereby completing the coupling of the first optoelectronic chip and the first optical element. There is no need to perform complex power-on and power-off processes, which not only has simple operation and short time consumption, but also can realize the automatic assembly of optical products, thus reducing the process time in the assembly process of optical products and improving the assembly efficiency and the hourly output of optical products.

[0378] In addition, the coupling platform provided by the present application can also couple multiple sets of optical products simultaneously. Further, the coupling platform provided by the present application can also couple lens modules.

[0379] The embodiments of the present application also provide a coupling device, which includes the above-mentioned Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 or Figure 6 coupling platforms shown in one or more of them.

[0380] The embodiments of the present application also provide a coupling device, which includes a processor and a memory. Among them, the memory is used to store a computer program, and the processor is used to execute the computer program, so that the device executes the above-mentioned Figure 10 , Figure 13 or Figure 14 coupling method.

[0381] The embodiments of the present application provide a computer program product, which includes: a computer program (which can also be called code or instruction); when the computer program is run, it enables the computer to execute the above-mentioned Figure 10 , Figure 13 or Figure 14 coupling method.

[0382] The embodiments of the present application provide a chip, which includes a processor. The processor is used to execute instructions. When the processor executes the instructions, it enables the chip to execute the above-mentioned Figure 10 , Figure 13 or Figure 14 coupling method.

[0383] The embodiments of the present application also provide a computer-readable storage medium, in which instructions are stored. When the instructions are run on at least one processor, the above-mentioned Figure 10 , Figure 13 or Figure 14 coupling method is implemented.

[0384] Those of ordinary skill in the art can understand that all or part of the steps to implement the above embodiments can be completed by hardware, or can be completed by a program instructing relevant hardware. The program mentioned above can be stored in a computer-readable storage medium. The storage medium mentioned above can be a read-only memory, a disk or an optical disc, etc.

Claims

1. A coupling platform, characterized in that, The coupling platform is used to couple a first optoelectronic chip with a first optical element. The first optoelectronic chip is placed under illumination conditions. The coupling platform includes: an imaging unit, a control unit, and an adjustment unit. The first optical element is disposed between the first optoelectronic chip and the imaging unit; The imaging unit is configured to receive a light beam passing through the first optical element and generate a first image, the first image including an image of a light spot on the first optoelectronic chip; The control unit is configured to control the adjustment unit based on the first image; The adjustment unit is configured to adjust the relative position and orientation between the first optoelectronic chip and the first optical element.

2. The coupling platform according to claim 1, wherein the coupling platform further includes an illumination unit configured to provide an illumination light beam for the first optoelectronic chip.

3. The coupling platform according to claim 1 or 2, characterized in that, The adjustment unit is configured to adjust the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element.

4. The coupling platform according to any one of claims 1 to 3, characterized in that The coupling platform is used to couple a second optoelectronic chip with a second optical element. The second optoelectronic chip is placed under illumination conditions. The second optical element is disposed between the second optoelectronic chip and the imaging unit; The imaging unit is further configured to receive a light beam passing through the second optical element and generate a second image, the second image including an image of a light spot on the second optoelectronic chip; The control unit is further configured to control the adjustment unit based on the first image and the second image; The adjustment unit is further configured to adjust the relative position and orientation between the second optoelectronic chip and the second optical element.

5. The coupling platform according to claim 4, wherein, The adjustment unit is further configured to adjust the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element.

6. The coupling platform according to claim 4 or 5, characterized in that, The first optoelectronic chip is a light-emitting chip, and the second optoelectronic chip is a light-receiving chip; or, the first optoelectronic chip is a light-receiving chip, and the second optoelectronic chip is a light-emitting chip; or, both the first optoelectronic chip and the second optoelectronic chip are light-emitting chips; or, both the first optoelectronic chip and the second optoelectronic chip are light-receiving chips.

7. The coupling platform according to any one of claims 4-6, characterized in that, The first optoelectronic chip and the second optoelectronic chip are rigidly connected, and / or, the first optical element and the second optical element are rigidly connected.

8. The coupling platform according to any one of claims 1-7, characterized in that, The adjustment unit includes a six-axis adjustment stage or a three-axis adjustment stage.

9. The coupling platform according to any one of claims 1-8, characterized in that, The imaging unit includes an imaging optical element and an image sensor; the imaging optical element includes a telephoto lens or a collimator, and the image sensor is configured to generate an image based on the light beam collected by the imaging optical element.

10. The coupling platform according to claim 2, characterized in that, The illumination unit includes any one or more of the following: Optical fiber, optical fiber, ground glass or mirror.

11. A coupling platform, characterized in that, The coupling platform is used to couple a first lens module and a second lens module. The coupling platform includes an imaging unit, a control unit, and an adjustment unit; the first lens module includes a first optoelectronic chip and a first optical element, and the second lens module includes a second optoelectronic chip and a second optical element; the first optoelectronic chip and the second optoelectronic chip are placed under illumination conditions, and the distances between the first lens module and the second lens module and the imaging unit are equal; The imaging unit is configured to receive the light beams that have passed through the first optical element and the second optical element and generate a first image and a second image respectively; the first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip; The control unit is configured to control the adjustment unit based on the first image and the second image; The adjustment unit is configured to adjust the relative pose of the first lens module and the second lens module.

12. The coupling platform according to claim 11, wherein the coupling platform further includes an illumination unit, and the illumination unit is configured to provide an illumination light beam for the first optoelectronic chip and / or the second optoelectronic chip.

13. The coupling platform according to claim 11 or 12, characterized in that, The adjustment unit is configured to adjust the spatial position of the first lens module and / or the second lens module.

14. The coupling platform according to any one of claims 11-13, characterized in that, The first lens module is a light emission module, and the second lens module is a light reception module.

15. The coupling platform according to any one of claims 11-14, characterized in that, The adjustment unit includes a six-axis adjustment stage or a three-axis adjustment stage.

16. The coupling platform according to any one of claims 11-15, characterized in that, The imaging unit includes an imaging optical element and an image sensor; the imaging optical element includes a telephoto lens or a collimator, and the image sensor is configured to generate an image based on the light beam collected by the imaging optical element.

17. The coupling platform according to any one of claims 11-16, characterized in that, The illumination unit includes any one or more of the following: Optical fiber, optical fiber, ground glass or mirror.

18. A coupling method, characterized in that, The method includes: Receiving the light beam that has passed through the first optical element and generating a first image, where the first image includes an image of the light spot on the first optoelectronic chip, and the first optoelectronic chip is under illumination conditions; Adjusting the relative pose of the first optoelectronic chip and the first optical element based on the first image.

19. The method according to claim 18, wherein Adjusting the relative pose of the first optoelectronic chip and the first optical element includes: Adjusting the spatial position of the first optoelectronic chip and / or the spatial position of the first optical element.

20. The method according to claim 18 or 19, characterized in that The method further includes: Receiving the light beam that has passed through the second optical element and generating a second image, where the second image includes an image of the light spot on the second optoelectronic chip, and the first optoelectronic chip is under illumination conditions; Adjusting the relative pose of the second optoelectronic chip and the second optical element based on the first image and the second image.

21. The method according to claim 20, wherein Adjusting the relative pose of the second optoelectronic chip and the second optical element includes: Adjusting the spatial position of the second optoelectronic chip and / or the spatial position of the second optical element.

22. The method according to claim 20 or 21, characterized in that, The first optoelectronic chip is a light emission chip, and the second optoelectronic chip is a light reception chip; or, both the first optoelectronic chip and the second optoelectronic chip are light emission chips; or, both the first optoelectronic chip and the second optoelectronic chip are light reception chips.

23. The method according to any one of claims 20-22, characterized in that, The first optoelectronic chip and the second optoelectronic chip are rigidly connected, and / or, the first optical element and the second optical element are rigidly connected.

24. A coupling method, characterized in that, The method is used for coupling a first lens module and a second lens module, where the first lens module includes a first optoelectronic chip and a first optical element, and the second lens module includes a second optoelectronic chip and a second optical element; the method includes: Receive the light beam passing through the first optical element and the second optical element and generate a first image and a second image respectively. The first image includes an image of the light spot on the first optoelectronic chip, and the second image includes an image of the light spot on the second optoelectronic chip. The first optoelectronic chip and the second optoelectronic chip are placed under illumination conditions; Based on the first image and the second image, adjust the relative pose of the first lens module and the second lens module.

25. The method according to claim 24, wherein Adjusting the relative pose of the first lens module and the second lens module includes: The adjusting unit is used to adjust the spatial position of the first lens module and / or the second lens module.

26. The method according to claim 24 or 25, characterized in that, The first lens module is a light emitting module, and the second lens module is a light receiving module.

27. A coupling device, characterized in that, The device includes the coupling platform according to any one of claims 1-10, or the coupling platform according to any one of claims 11-17.

28. The device according to claim 27, characterized in that, The device is used to execute the method according to any one of claims 18-23, or the method according to any one of claims 24-26.

29. A coupling device, characterized in that, The device includes a processor and a memory. Among them, the memory is used to store a computer program, and the processor is used to execute the computer program so that the device executes the method according to any one of claims 18-23, or the method according to any one of claims 24-26.

30. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes instructions, and when the instructions are run by a processor, the method according to any one of claims 18-23, or the method according to any one of claims 24-26 is implemented.

31. A computer program product, characterized in that, The computer program product includes instructions, and when the instructions are run by a processor, the method according to any one of claims 18-23, or the method according to any one of claims 24-26 is implemented.

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