Process formula display editing method and electronic equipment
Through the process formula parameter acquisition interface in the form of a spreadsheet, the problem of unintuitive and error-prone process formula configuration in molecular beam epitaxial equipment is solved, and the rapid and accurate configuration of process parameters and simplified equipment operation is achieved.
Patent Information
- Application Number
- CN202510221427.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2025-07-29
AI Technical Summary
The process formula configuration of existing molecular beam epitaxial equipment is not intuitive, error-prone and inefficient, especially for those without programming background, it is difficult for people with accurate understanding and configuration of various process parameters.
The process formula parameter acquisition interface is adopted in the form of a spreadsheet, including the key parameter configuration column group, the sample rack parameter configuration column group and the source furnace parameter configuration column group. The parameters are entered through the interface and the target process formula file is generated, which supports quick editing and historical formula file comparison.
It realizes intuitive and rapid configuration of process parameters, reduces human errors, improves process accuracy and controllability, simplifies the equipment operation process, and improves configuration efficiency.
Smart Images

Figure CN120386294A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of semiconductor process equipment control, and particularly to a process recipe display and editing method and an electronic device. Background Art
[0002] Currently, the process recipes required to be loaded by the control software of molecular beam epitaxy equipment are usually presented in the form of text format process recipe files, and it is required that process engineers manually write and adjust each parameter. Although this method can meet the requirements in some cases, there are also the following main problems:
[0003] 1. Unintuitive operation: The text editing method lacks an intuitive interface, making it easy for process engineers to make mistakes when configuring parameters. Especially for those without a programming background, it is difficult to accurately understand and correctly configure each process parameter.
[0004] 2. Prone to human errors: Manually writing text format process recipe files is prone to format errors, syntax inconsistencies, or missing key parameters. These problems may cause the recipe to not be correctly loaded into the equipment, affecting the equipment operation and process stability.
[0005] 3. Low configuration efficiency: Configuring each parameter using the traditional text editing method requires a lot of time and effort. Especially when the recipe needs to be frequently adjusted and modified, the operation is cumbersome and time-consuming, seriously affecting work efficiency. Summary of the Invention
[0006] In view of this, embodiments of this application provide a process recipe display and editing method and an electronic device to solve at least one problem in the background art.
[0007] In a first aspect, embodiments of this application provide a process recipe display and editing method, and the process recipe display and editing method includes:
[0008] Configuring, obtaining, and displaying a process recipe parameter acquisition interface in the form of a spreadsheet; the process recipe parameter acquisition interface includes a key parameter configuration column group, a sample rack parameter configuration column group, and a source furnace parameter configuration column group;
[0009] Displaying according to the process recipe parameters input through the process recipe parameter acquisition interface, and generating a target process recipe file according to the display according to preset requirements to provide to a target device, so that the target device executes a process corresponding to the target process recipe file.
[0010] Combined with the first aspect, in an optional implementation manner,
[0011] The key parameter configuration column group includes at least one of the following: a description column; a material column; a time column; a pause column; a cycle column;
[0012] The parameter configuration column group of the sample rack includes at least one of the following: the sample rack rotation speed column; the sample rack temperature column;
[0013] The parameter configuration column group of the source furnace includes one or more source furnace columns; each source furnace column includes at least one of the following: heating rate; set temperature; valve switch state; valve opening size; set temperature offset.
[0014] In a first aspect, in an alternative embodiment,
[0015] The configuration obtains and displays a process recipe parameter acquisition interface in the form of a spreadsheet, including:
[0016] Obtain one or more source furnace numbers;
[0017] According to the source furnace numbers, generate the parameter configuration column group of the source furnace to configure and obtain and display the process recipe parameter acquisition interface.
[0018] In a first aspect, in an alternative embodiment,
[0019] The display according to the process recipe parameters input through the process recipe parameter acquisition interface includes:
[0020] Obtain the current source furnace column valve switch state in the parameter configuration column group of the source furnace;
[0021] According to the current source furnace column valve switch state, determine the growth material of the current growth layer, and display the growth material of the current growth layer in the set row of the material column in the key parameter configuration column group.
[0022] In a first aspect, in an alternative embodiment,
[0023] The display according to the process recipe parameters input through the process recipe parameter acquisition interface includes:
[0024] Obtain the heating rate and set temperature in the parameter configuration column group of the sample rack;
[0025] According to the heating rate and set temperature of the sample rack, determine the time required to reach the set temperature, and display the time at the row corresponding to the set temperature in the time column of the key parameter configuration column group.
[0026] In a first aspect, in an alternative embodiment,
[0027] The display according to the process recipe parameters input through the process recipe parameter acquisition interface includes:
[0028] Obtain the set temperature offset in the sample rack parameter configuration column group or the source furnace parameter configuration column group; the offset includes a positive offset or a negative offset;
[0029] Adjust all the set temperatures corresponding to the offset by the offset amount and display them.
[0030] Combined with the first aspect, in an alternative embodiment, the process recipe display editing method further includes:
[0031] In response to the obtained quick editing operation instruction, display a quick editing box at the position of the trigger point of the quick editing operation instruction to obtain the instruction content required for the line where the trigger point is located; the quick editing box is used to display the instruction content; the instruction content includes at least one of the following: adding a line; copying a line; deleting a line.
[0032] Combined with the first aspect, in an alternative embodiment, the process recipe display editing method further includes:
[0033] Obtain the set temperature in the sample rack parameter configuration column group, and judge the heating process or the cooling process according to the difference value between the set temperatures of adjacent rows, so as to monitor the heating process or the cooling process until the required set temperature is reached.
[0034] Combined with the first aspect, in an alternative embodiment, the process recipe display editing method further includes:
[0035] Obtain the historical process recipe file, and compare the target process recipe file with the historical process recipe file to obtain and display the process recipe parameters that are different between the target process recipe file and the historical process recipe file.
[0036] In a second aspect, an embodiment of the present application provides an electronic device, and the electronic device includes:
[0037] A memory that stores instructions; and
[0038] A processor configured to execute the instructions to implement the process recipe display editing method as described in the first aspect.
[0039] The beneficial effects brought by the technical solution provided in the embodiment of the present application include: by adopting a visual process recipe parameter acquisition interface in the form of a spreadsheet, allowing users to intuitively input and adjust various parameters in the molecular beam epitaxy process, such as time, source furnace temperature, switch state, sample holder temperature, rotation speed, etc.; and according to the parameters input by the user, automatically generating corresponding target process recipe files, such as saving them as text files for use during actual operation, enabling the target device to execute the operation process according to the target process recipe file. Therefore, users can simply, intuitively, and quickly configure MBE process parameters, simplify the configuration process of the process recipe, and be able to generate directly usable recipe files, thus avoiding problems such as format errors, syntax inconsistencies, and low configuration efficiency that may occur in the traditional text editing method; it can also simplify the device operation process and improve the accuracy and controllability of the process.
[0040] Additional aspects and advantages of the embodiments of the present application will be given in part in the following description, become apparent in part from the following description, or be understood through the practice of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0041] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. Among them, the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of local features. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation of the present application. In the drawings:
[0042] Figure 1 It is a schematic flowchart of a specific example of the process recipe display and editing method in the embodiment of the present application;
[0043] Figure 2 It is a schematic diagram of a specific example of the process recipe parameter acquisition interface in the embodiment of the present application;
[0044] Figure 3 It is a schematic diagram of a specific example of the Loop setting interface in the embodiment of the present application;
[0045] Figure 4 It is a schematic diagram of a specific example of the RPM setting interface in the embodiment of the present application;
[0046] Figure 5 It is a schematic diagram of a specific example of the source furnace configuration interface in the embodiment of the present application;
[0047] Figure 6 It is a schematic diagram of a specific example of the time column display value in the embodiment of the present application;
[0048] Figure 7Schematic diagram of a specific example of the quick editing function in an embodiment of the present application;
[0049] Figure 8 Schematic block diagram of a specific example of the process recipe display and editing device in an embodiment of the present application;
[0050] Figure 9 Schematic block diagram of a specific example of an electronic device in an embodiment of the present application. Detailed implementation manners
[0051] To make the technical solutions and beneficial effects of the present application more obvious and understandable, the following provides a detailed description by listing specific embodiments. Among them, the drawings are not necessarily drawn to scale, and local features can be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical and scientific fields to which the present application belongs.
[0052] The embodiments of the present application are not exhaustive, but only schematic of some embodiments, and do not specifically limit the protection scope of the present application. Without contradiction, each step in an embodiment can be implemented as an independent embodiment, and the steps can be combined arbitrarily. For example, the solution after removing some steps in an embodiment can also be implemented as an independent embodiment, and the order of the steps in an embodiment can be arbitrarily exchanged. In addition, the optional implementation manners in an embodiment can be arbitrarily combined; furthermore, the embodiments can be arbitrarily combined. For example, some or all of the steps of different embodiments can be arbitrarily combined, and an embodiment can be arbitrarily combined with the optional implementation manners of other embodiments.
[0053] In each embodiment of the present application, if there is no special explanation and logical conflict, the terms and / or descriptions among the embodiments are consistent and can be cited from each other. The technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.
[0054] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended as a limitation to the present application.
[0055] In the embodiments of the present application, unless otherwise specified, elements expressed in the singular form, such as "a", "one kind", "the", "above-mentioned", "said", "aforementioned", "this", etc., can mean "one and only one", or can also mean "one or more", "at least one", etc. For example, in the case of using articles such as "a", "an", "the" in English in the translation, the noun after the article can be understood as a singular expression form or a plural expression form.
[0056] In the embodiments of the present application, "a plurality of" means two or more.
[0057] In some embodiments, terms such as "at least one (at least one, at least one item, at least one)(at least one of)", "one or more", "a plurality of", "multiple", etc. can be replaced with each other.
[0058] The prefix words such as "first", "second", etc. in the embodiments of the present application are only used to distinguish different described objects, and do not constitute limitations on the position, order, priority, value or content of the described objects, etc. The description of the described objects refers to the description in the context of the claims or embodiments, and no redundant limitations should be formed due to the use of prefix words. For example, the value of the described object is not limited by the ordinal number, and can be one or more. Taking "the first device" as an example, the value of "device" can be one or more. In addition, the objects modified by different prefix words can be the same or different. For example, if the described object is "device", then "the first device" and "the second device" can be the same device or different devices, and their types can be the same or different.
[0059] In some embodiments, the term "connection" can mean that there is a transfer of electrical signals or data between the connected end and the connected-to end, and can be understood as "electrical connection", "communication connection", etc. "Connection" can be a direct connection between two components, or an indirect connection established through other components, or a connection within two components, or any other possible connection form.
[0060] This specification provides method operation steps such as in embodiments or flowcharts, but based on routine or non-creative labor, it can include more or fewer operation steps. The order of steps listed in the embodiments is only one way among the execution orders of numerous steps, and does not represent the only execution order. When the actual device, system or server product is executed, it can be executed in the order shown in the embodiments or the drawings, or executed in parallel (for example, in an environment of parallel processors or multi-threaded processing).
[0061] The embodiments of the present application provide a process recipe display and editing method, which can be used to provide a user-friendly interface for users to create, load, edit and save process recipes in molecular beam epitaxy (MBE). Figure 1 The flowchart showing a specific example of the process recipe display and editing method in the embodiments of the present application is as shown. As shown, the process recipe display and editing method includes:
[0062] S10: Configure to obtain and display a process recipe parameter acquisition interface in the form of a spreadsheet; the process recipe parameter acquisition interface includes a key parameter configuration column group, a sample rack parameter configuration column group, and a source furnace parameter configuration column group;
[0063] S20: Display according to the process recipe parameters input through the process recipe parameter acquisition interface, and generate a target process recipe file according to the display according to preset requirements to provide to a target device, so that the target device executes a process corresponding to the target process recipe file.
[0064] In the embodiment of the present application, in the spreadsheet displayed by the process recipe parameter acquisition interface, the configuration items set in each column of the key parameter configuration column group, the sample rack parameter configuration column group, and the source furnace parameter configuration column group can all be set according to actual needs.
[0065] The preset requirements for the target process recipe file can be preset and determined according to the actual required file format, file type, etc. of the target device. The preset requirements can correspond to the target device, and different preset requirements can be configured for different target devices to automatically generate the desired target process recipe file.
[0066] In an exemplary embodiment, Figure 2 shows a schematic diagram of a specific example of the process recipe parameter acquisition interface in the embodiment of the present application. As shown in the figure, the key parameter configuration column group includes at least one of the following: a description column; a material column; a time column; a pause column; a cycle column.
[0067] Description column (Comments): It can support the recording of remarks information to prompt users of special operation steps. For example, a certain row under the description column can record "The heating rate of the sample rack is different", which is used to prompt other users that the set heating rate of the row where this line is located is very different from the set heating rates in the past.
[0068] Material column (Layer): It is used to automatically display the growth material of the current growth layer according to the source furnace switch state set by the user.
[0069] Time column (Time): It is used to display the maximum required heating time (or cooling time) corresponding to any row of Layer automatically calculated according to the set heating rate of the sample rack and the set temperature (i.e., the target temperature).
[0070] Pause column (Pause): It is used to configure the total growth time corresponding to any row of Layer, that is, the pause time or the actual time, and the user can directly input the corresponding value. For example, fill in 300.0, and the unit can be seconds (s), which can indicate that the maximum growth time required for the row corresponding to 300.0 in Layer is 300.0 s.
[0071] Loop: Used to perform corresponding loop settings for any row of the Layer. For example, Figure 3 FIG. Figure 3 shows a schematic diagram of a specific example of the Loop setting interface in an embodiment of the present application. As shown in the figure, the loop settings may include unified configurations of the growth time, growth material, gas switch state (such as the opening size of the As and P valves), and the number of loops for each layer. From Figure 3 it can be seen that the loop settings corresponding to a certain row of the Layer are as follows: the growth time of the Ga2AsAl2 layer is 22 s and the As valve opening is 50%, the growth time of the Ga2As layer is 120 s and the As valve opening is 50%, and the sequence from growing the Ga2AsAl2 layer to growing the Ga2As layer is looped 11 times.
[0072] Refer to Figure 2 , in an exemplary embodiment, the sample holder parameter configuration column group includes at least one of the following: the sample holder rotation speed column; the sample holder temperature rotation column.
[0073] Sample holder rotation speed column (RPM): Used to perform corresponding sample holder rotation speed settings for any row of the Layer. For example, Figure 4 FIG. Figure 4 shows a schematic diagram of a specific example of the RPM setting interface in an embodiment of the present application. As shown in the figure, the rotation speed settings may include unified configurations of the starting rotation speed (i.e., the initial value), the ending rotation speed (i.e., the final value), the rotation speed step, and the interval (unit: s), etc. From Figure 4 it can be seen that the rotation speed settings corresponding to a certain row of the Layer are as follows: the initial value is 2 RPM, the final value is 20 RPM, the rotation speed step is 2 RPM, and the interval is 5 s; it can be understood that starting from 2 RPM, the rotation speed increases by 2 RPM every 5 s until 20 RPM.
[0074] Sample holder temperature rotation column (Manipulator): Used to perform corresponding sample holder temperature rotation settings for any row of the Layer; for example, it may include unified configurations of the heating rate (unit: °C / min), the set temperature, the rotation speed, and the azimuth angle (0 - 360°), etc.; for another example, it may further include configurations of the set temperature offset amount (such as positive offset + and negative offset -), etc. The azimuth angle may be the angle of rotation of the sample holder, and the initial position of the sample holder is 0°. The set temperature of the sample holder can be used to heat the sample holder and the substrate, thereby controlling the growth temperature. The setting of the sample holder rotation speed can be selected at any one of the rotation speed columns in RPM and Manipulator, or in the case where both are set, it can be defaulted to be based on the setting of one of them, and can be selected according to actual needs.
[0075] Refer to Figure 2, in an exemplary embodiment, the source furnace parameter configuration column group includes one or more source furnace columns; the source furnace column includes at least one of the following: heating rate; set temperature; valve switch state; valve opening size; set temperature offset (such as positive offset + and negative offset -). The source furnace set temperature can be used to independently heat high-purity raw materials in their respective beam source furnaces to generate molecular beams. The setting of the source furnace valve opening size can be set either in the source furnace column or in the Loop, or in the case where both are set, it can be defaulted to be based on the setting of one of them, and can be selected according to actual needs. Exemplarily, the source furnace column can be at least divided into a top region Top, a valve region Valve, and a storage tank region Tank, and each region can include setting items such as heating rate, set temperature, valve switch state, etc.
[0076] Thus, in the embodiment of the present application, by adopting a visual process recipe parameter acquisition interface in the form of a spreadsheet, the user is allowed to intuitively input and adjust various parameters in the molecular beam epitaxy process, such as parameters like time, source furnace temperature, switch state, sample holder temperature, rotation speed, etc.; and according to the parameters input by the user, a corresponding target process recipe file is automatically generated, such as saved as a text file, etc., for use during actual operation, enabling the target device to execute the operation process according to the target process recipe file. Therefore, the user can simply, intuitively, and quickly configure MBE process parameters, simplify the configuration process of the process recipe, and can generate a directly usable recipe file, thus avoiding problems such as format errors, syntax inconsistencies, and low configuration efficiency that may occur in the traditional text editing method; it can also simplify the device operation process and improve the accuracy and controllability of the process.
[0077] In an exemplary embodiment, the spreadsheet supports fixed column headers and drag-and-drop operations to optimize the user input experience. Among them, when scrolling vertically, the names of various parameters as column headers can remain fixed; when scrolling horizontally, the general columns on the left (such as the key parameter configuration column group, the sample holder parameter configuration column group, etc.) can be fixed, ensuring convenient operation for the user when inputting a large number of parameters.
[0078] In an alternative embodiment, the step S10 of configuring to obtain and display a process recipe parameter acquisition interface in the form of a spreadsheet includes:
[0079] S111: Obtain one or more source furnace numbers;
[0080] S112: According to the source furnace numbers, generate the source furnace parameter configuration column group to configure, obtain, and display the process recipe parameter acquisition interface.
[0081] In the embodiment of the present application, the source furnace numbers can be the same as or corresponding to the numbers set by the control software of the target device (such as an MBE device).
[0082] In an exemplary embodiment, Figure 5 A schematic diagram showing a specific example of the source furnace configuration interface in an embodiment of the present application is shown. As shown in the figure, according to one or more source furnace numbers input through the source furnace configuration interface, a spreadsheet including a corresponding source furnace parameter configuration column group is generated (refer to Figure 2 ). The way to input one or more source furnace numbers can be to select through a drop-down menu or other ways such as manually inputting through a dialog box, which can be set according to actual needs.
[0083] In this way, the source furnace parameters to be configured can be quickly matched through the source furnace number, further improving the simplicity and intuitiveness of the process recipe configuration.
[0084] In an alternative embodiment, the displaying according to the process recipe parameters input through the process recipe parameter acquisition interface in step S20 includes:
[0085] S211: Obtain the current source furnace column valve switch state in the source furnace parameter configuration column group;
[0086] S212: Determine the growth material of the current growth layer according to the current source furnace column valve switch state, and display the growth material of the current growth layer in the set row of the material column in the key parameter configuration column group.
[0087] In an embodiment of the present application, the growth material of the current generation layer can correspond to the material in the source furnace with the current valve switch state being open, and when the source furnace valve switch is opened, the material in the furnace can be output.
[0088] The set row for displaying the growth material of the current growth layer can be selected according to actual needs, which can be a fixed row or a row with variable position corresponding to the row where the growth time, cycle setting, etc. are located.
[0089] In this way, by automatically displaying the growth material of the current growth layer in the material column, the user can intuitively and real-time observe what material is growing at the current stage, which is convenient for the user to control the subsequent growth link and adjust at any time according to the growth requirements, improving the accuracy and controllability of the process.
[0090] In an alternative embodiment, the displaying according to the process recipe parameters input through the process recipe parameter acquisition interface in step S20 includes:
[0091] S221: Obtain the heating rate and set temperature in the sample rack parameter configuration column group;
[0092] S222: Determine the time required to reach the set temperature according to the heating rate and set temperature of the sample rack, and display the time at the row corresponding to the set temperature in the time column of the key parameter configuration column group.
[0093] In an exemplary embodiment, Figure 6 A schematic diagram showing a specific example of the display value in the time column in an embodiment of the present application is shown. As shown in the figure, the time required to heat up to 400.0 °C is 400.0 s (displayed at the row corresponding to 400.0 °C in Time), the time required to heat up to 600.0 °C is 400.0 s, the time required to heat up to 750.0 °C is 300.0 s, and the total time is 400.0 s + 400.0 s + 300.0 s = 1100.0 s.
[0094] In this way, the time required for heating / cooling calculated and displayed through the time column can be intuitively and real-time observed by the user, and the heating / cooling process can be monitored, facilitating the user to adjust at any time and improving the accuracy and controllability of the process.
[0095] In an alternative embodiment, the displaying according to the process recipe parameters input through the process recipe parameter acquisition interface in step S20 includes:
[0096] S231: Obtain the set temperature offset in the sample rack parameter configuration column group or the source furnace parameter configuration column group; the offset includes a positive offset or a negative offset;
[0097] S232: Adjust all the set temperatures corresponding to the offset by the offset amount and display them.
[0098] In this way, all the saved set temperatures can be uniformly adjusted through the offset amount, and all the temperature values under the set temperature column are all increased by the positive offset or decreased by the negative offset. For example, referring to Figure 2 , fill in 0.5 in the offset amount item and click the + button on the right, and +0.5 °C will be added to all the temperature values in this column, further improving the editing efficiency.
[0099] In an alternative embodiment, in order to improve the editing flexibility, the table design supports a quick editing function. The process recipe display and editing method further includes:
[0100] S30: In response to the obtained quick editing operation instruction, display a quick editing box at the position of the trigger point of the quick editing operation instruction to obtain the instruction content required for the row where the trigger point is located; the quick editing box is used to display the instruction content; the instruction content includes at least one of the following: adding a row; copying a row; deleting a row.
[0101] In the embodiments of the present application, the quick editing operation instruction can be generated by operations such as right - clicking the mouse, long - pressing the touch display screen, etc.; the trigger point position can be the mouse pointer position, the touch contact position, etc., and can be set according to actual needs. According to the obtained instruction content, directly perform the corresponding operation on this line to change the number of layers of alternating growth of materials during the cycle process.
[0102] Figure 7 The figure shows a schematic diagram of a specific example of the quick - editing function in the embodiments of the present application. As shown in the figure, after the user edits any line, addition, copying, or deletion operations can be directly performed on this line through the right - click menu, avoiding repetitive input.
[0103] At the same time, "Save" and "Generate" buttons can be set in the upper - left corner of the table interface. Clicking the "Save" button can save the configuration displayed on the current table interface as a data file (such as a.pkl format); clicking the "Generate" button can automatically export it as a text - format process recipe file, which is convenient for directly loading into the device software for use. In an exemplary embodiment, Figure 6 The content of the target process recipe file corresponding to the display configuration can be automatically exported as:
[0104] Total Time:1100.0
[0105] Set Manipulator Setpoint 750.0
[0106] Set Manipulator Ramp Rate 30.0
[0107] Wait Until Manipulator Temperature>399.9
[0108] Open As
[0109] Set As Valve Position 20.0
[0110] Wait Until Manipulator Temperature>599.9
[0111] Set As Valve Position 40.0
[0112] Wait Until Manipulator Temperature>749.9
[0113] Set As Valve Position 48.0
[0114] End
[0115] In this way, a corresponding recipe file in text form including temperature change steps and valve adjustment instructions is generated. Therefore, by introducing a user interface in the form of a spreadsheet, process engineers can input, adjust, and view various process parameters in an intuitive environment. There is no need to write complex code or text, reducing the operation difficulty, especially suitable for users without a programming background. The generated process recipe file is not only intuitive and clear but also effectively reduces redundant and repetitive code, making the configuration process more efficient.
[0116] In an alternative embodiment, the process recipe display and editing method further includes:
[0117] S40: Obtain the set temperature in the sample rack parameter configuration column group, and determine whether it is a heating process or a cooling process based on the difference value between the set temperatures of adjacent rows, so as to monitor the heating process or the cooling process until the required set temperature is reached.
[0118] In the embodiment of the present application, the heating / cooling of the sample rack is an increasing / decreasing process, and the set temperature parameters of the sample rack filled in the interface increase or decrease continuously. Therefore, it is possible to determine whether it is a heating or cooling process based on whether the data filled in by the user increases or decreases continuously, so as to monitor the heating and cooling processes to monitor whether the temperature reaches the maximum or minimum temperature set value (i.e., the target value) in the set temperature, such as when the temperature reaches ±0.1 °C of the target value. In this way, the automatic optimization function of the process recipe can be realized, such as optimizing the temperature control to the target value, improving the accuracy of process control.
[0119] In an alternative embodiment, the process recipe display and editing method further includes:
[0120] S50: Obtain the historical process recipe file, and compare the target process recipe file with the historical process recipe file to obtain and display the process recipe parameters that are different between the target process recipe file and the historical process recipe file.
[0121] In an exemplary embodiment, the first source furnace number used in the target process recipe file can be compared with the second source furnace number used in the historical process recipe file; if the first source furnace number and the second source furnace number are the same, the process recipe parameters that are different between the target process recipe file and the historical process recipe file are obtained by comparison, and can be displayed in at least one of the target process recipe file and the historical process recipe file in a bold, red, shaded, etc. manner; if the first source furnace number and the second source furnace number are different, no comparison can be made.
[0122] Thus, by introducing the function of comparing process recipe files, it is allowed to load and compare two saved process recipe files. And it can clearly show the parameter differences between them, helping engineers quickly identify and analyze the changes in the recipes, and then optimize the process configuration.
[0123] The process recipe display and editing method provided by the embodiments of this application focuses on solving the problems of low efficiency and error-proneness existing in the configuration process of molecular beam epitaxy process recipe files. By designing a user interface in the form of a spreadsheet, process engineers can intuitively and quickly complete the input and adjustment of process parameters, and generate the process recipe files required by the device software, realizing the visualization and standardization of process configuration. Through this automated and visual way of process recipe editing and comparison, the embodiments of this application greatly improve the configuration efficiency, reduce human errors, improve the accuracy and optimization speed of process recipes, and significantly improve the control precision and working efficiency of the molecular beam epitaxy process.
[0124] The following describes the devices, electronic devices, storage media, etc. used to execute the process recipe display and editing method provided by this application. For the specific implementation process and technical effects, refer to the above, and will not be elaborated below.
[0125] The embodiments of this application also provide a process recipe display and editing device. Figure 8 The schematic block diagram shows a specific example of the process recipe display and editing device in the embodiments of this application. As shown in the figure, the process recipe display and editing device includes:
[0126] The first processing module 10 is used to configure, obtain and display a process recipe parameter acquisition interface in the form of a spreadsheet; the process recipe parameter acquisition interface includes a key parameter configuration column group, a sample rack parameter configuration column group, and a source furnace parameter configuration column group;
[0127] The second processing module 20 is used to display the process recipe parameters input through the process recipe parameter acquisition interface, and generate a target process recipe file according to the display according to preset requirements to provide to the target device, so that the target device executes the process corresponding to the target process recipe file.
[0128] Regarding the above device embodiments, the specific ways and technical effects of each module (for example, the first processing module, the second processing module) to perform operations can refer to the corresponding descriptions in the above method embodiments, and will not be elaborated here.
[0129] It should be understood that the division of each unit or module in the above device is only a division of logical functions. In actual implementation, it can be fully or partially integrated into a physical entity, or physically separated. In addition, the units or modules in the device can be implemented in the form of a processor calling software. For example, the device includes a processor, the processor is connected to a memory, and instructions are stored in the memory. The processor calls the instructions stored in the memory to implement any of the above methods or the functions of each unit or module of the above device.
[0130] An embodiment of the present application also provides an electronic device. Figure 9 The schematic block diagram of the principle of a specific example of the electronic device in the embodiment of the present application is shown. As shown in the figure, the electronic device includes:
[0131] A memory that stores instructions; and
[0132] A processor configured to execute the instructions to implement the process recipe display and editing method as described in the above embodiment.
[0133] As Figure 9 shown, the electronic device may include a processor, a memory, a network interface, a display, and an input device connected through a system bus. Among them, the processor can be used to provide computing and control capabilities. The memory may include a non-volatile storage medium and an internal memory. The non-volatile storage medium may store an operating system and a computer program. The internal memory may provide an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface can be used to communicate with an external terminal through a network connection. The display can be a liquid crystal display or an electronic ink display. The input device can be a touch layer covering the display, or a button, a trackball, or a touchpad provided on the housing of the electronic device, or an external keyboard, touchpad, or mouse, etc.
[0134] Those skilled in the art can understand that Figure 9 the structure shown in
[0135] is only a block diagram of some structures related to the solution of the present application, and does not constitute a limitation on the electronic device to which the solution of the present application is applied. The specific electronic device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements. Figure 9It runs on the electronic device shown. The memory of the electronic device contains each program module that constitutes the above process recipe display and editing device. When the computer program constituted by each program module is executed, it can realize the functions corresponding to each step in the process recipe display and editing method described in the above embodiments.
[0136] An embodiment of the present application also provides a computer program product or a computer program. The computer program product or the computer program includes computer instructions, and the computer instructions are stored in a computer-readable storage medium. The processor of the electronic device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the electronic device executes the process recipe display and editing method provided in the above various implementation manners.
[0137] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in the present application may include non-volatile and / or volatile memories. Non-volatile memories may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.
[0138] It should be understood that the above embodiments are all exemplary and are not used to cover all possible implementation manners included in the claims. Without departing from the scope of the present disclosure, various deformations and changes can also be made on the basis of the above embodiments. Similarly, the various technical features of the above embodiments can also be arbitrarily combined to form other embodiments of the present application that may not be clearly described. Therefore, the above embodiments only represent several implementation manners of the present application and do not limit the protection scope of the patent of the present application.
Claims
1. A process recipe display and editing method, characterized in that, The process recipe display and editing method includes: Configuring, obtaining, and displaying a process recipe parameter acquisition interface in the form of a spreadsheet; the process recipe parameter acquisition interface includes a key parameter configuration column group, a sample rack parameter configuration column group, and a source furnace parameter configuration column group; Displaying according to the process recipe parameters input through the process recipe parameter acquisition interface, and generating a target process recipe file according to the display according to preset requirements to be provided to a target device for the target device to execute a process corresponding to the target process recipe file.
2. The process recipe display and editing method according to claim 1, wherein The key parameter configuration column group includes at least one of the following: a description column; a material column; a time column; a pause column; a cycle column; The sample rack parameter configuration column group includes at least one of the following: a sample rack rotation speed column; a sample rack temperature column; The source furnace parameter configuration column group includes one or more source furnace columns; the source furnace column includes at least one of the following: a heating rate; a set temperature; a valve switch state; a valve opening size; a set temperature offset amount.
3. The process recipe display and editing method according to claim 1, wherein The configuring, obtaining, and displaying a process recipe parameter acquisition interface in the form of a spreadsheet includes: Obtaining one or more source furnace numbers; Generating the source furnace parameter configuration column group according to the source furnace numbers to configure, obtain, and display the process recipe parameter acquisition interface.
4. The process recipe display and editing method according to claim 1, wherein The displaying according to the process recipe parameters input through the process recipe parameter acquisition interface includes: Obtaining the valve switch state of the current source furnace column in the source furnace parameter configuration column group; Determining the growth material of the current growth layer according to the valve switch state of the current source furnace column, and displaying the growth material of the current growth layer in the set row of the material column in the key parameter configuration column group.
5. The process recipe display and editing method according to claim 1, wherein The displaying according to the process recipe parameters input through the process recipe parameter acquisition interface includes: Obtaining the heating rate and the set temperature in the sample rack parameter configuration column group; Determining the time required to reach the set temperature according to the heating rate and the set temperature of the sample rack, and displaying the time at the row corresponding to the set temperature in the time column in the key parameter configuration column group.
6. The process recipe display and editing method according to claim 1, wherein The displaying according to the process recipe parameters input through the process recipe parameter acquisition interface includes: Obtaining the set temperature offset amount in the sample rack parameter configuration column group or the source furnace parameter configuration column group; the offset amount includes a positive offset or a negative offset; Adjusting and displaying all the set temperatures corresponding to the offset amount by the offset amount.
7. The editing method for process formula display according to claim 1, characterized in that, The process recipe display and editing method further includes: In response to the obtained quick editing operation instruction, a quick editing box is displayed at the position of the trigger point of the quick editing operation instruction to obtain the instruction content required for the line where the trigger point is located; the quick editing box is used to display the instruction content; the instruction content includes at least one of the following: adding a line; copying a line; deleting a line.
8. The editing method for displaying a process recipe according to claim 1, characterized in that, The process recipe display editing method further includes: Obtaining the set temperature in the set temperature column group of the sample rack parameters, and judging the heating process or the cooling process according to the difference value between the set temperatures of adjacent rows, so as to monitor the heating process or the cooling process until the required set temperature is reached.
9. The editing method for displaying a process recipe according to any one of claims 1-8, characterized in that, The process recipe display editing method further includes: Obtaining a historical process recipe file, and comparing the target process recipe file with the historical process recipe file to obtain and display the process recipe parameters with differences between the target process recipe file and the historical process recipe file.
10. An electronic device, characterized in that, The electronic device includes: a memory that stores instructions; and a processor configured to execute the instructions to implement the process recipe display editing method according to any one of claims 1-9.
Citation Information
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