Display module, glue pouring mold and preparation process of display module

Abstract

The invention provides a display module, a glue pouring mold and a preparation process of the display module. The display module comprises a substrate, a plurality of lamp beads and a protective layer. The substrate is provided with a plurality of light holes at intervals. The lamp beads are arranged on the surface of the substrate at intervals, and the lamp beads and the light holes are distributed at intervals. The protective layer is arranged on the surface and the peripheral wall of the substrate, and the protective layer wraps the peripheral sides of the lamp beads so that the lamp beads can be fixed to the substrate. The protection layer is provided with a plurality of through holes which are arranged in one-to-one correspondence with the light-transmitting holes and are communicated with the light-transmitting holes. The protective layer is arranged on the substrate and wraps the peripheral sides of the lamp beads at the same time, and the continuous connecting interface is formed between the surface of the substrate and the lamp beads, so that the lamp beads can be fixed and protected in a reinforced mode in the circumferential direction, the connecting strength of the lamp beads and the substrate can be remarkably enhanced, the pushing force of the lamp beads is improved, and the service life of the lamp beads is prolonged. Meanwhile, an isolation effect can be achieved, so that media such as water vapor and dust are prevented from entering the connecting positions of the lamp beads and the substrate, and the service life of the display module is prolonged.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and particularly relates to a display module, a potting mold and a preparation process of the display module. Background Art

[0002] With the development of the LED (Light Emitting Diode) display screen industry, transparent LED display screens have emerged and are used in large-scale events such as concerts. In such application scenarios, the requirements for the light transmittance and protection performance of the display screen are becoming increasingly stringent. In a transparent LED display screen, the light transmittance effect of the display screen is usually achieved by providing light-transmitting holes on its substrate to form a light-transmitting area.

[0003] Currently, generally, the light transmittance of the transparent LED display screen is improved by enlarging the area of the light-transmitting area. However, this design will cause the installation area for the lamp beads on the substrate to become narrower, resulting in insufficient space reserved on both opposite sides of the lamp beads to install a mask or apply dot reinforcing glue to protect the lamp beads. As a result, the thrust of the lamp beads is relatively low, and it is easy to cause the lamp beads to be knocked off, resulting in some unnecessary subsequent repairs. Summary of the Invention

[0004] The purpose of the present invention is to provide a display module, a potting mold and a preparation process of the display module to improve the thrust of the lamp beads. [[ID=!7]]

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] According to one aspect of the present application, the present application provides a display module, including:

[0007] A substrate, on which a plurality of light-transmitting holes are provided at intervals;

[0008] A plurality of lamp beads, which are arranged on the surface of the substrate at intervals, and the lamp beads and the light-transmitting holes are distributed at intervals;

[0009] A protective layer, which is provided on the surface and the outer peripheral wall of the substrate, and the protective layer covers the periphery of the lamp beads to fix the lamp beads on the substrate; a plurality of through holes are provided on the protective layer, and the plurality of through holes are arranged and communicated with the plurality of light-transmitting holes one by one.

[0010] In some embodiments, the protective layer includes a protective part and a protection part. The protective part protrudes from the surface of the substrate and is located outside the light-transmitting holes, and the protective part covers the periphery of the lamp beads to fix the lamp beads on the substrate;

[0011] The protection portion is arranged on the outer peripheral wall of the substrate, the surface of the protection portion protrudes from the surface of the substrate, and the inner wall of the protection portion is connected to the outer periphery of the protection portion;

[0012] The surface of the protection portion is flush with a side of the shield portion facing away from the substrate.

[0013] In some embodiments, along a direction perpendicular to the surface of the substrate, a ratio of the thickness of the protective portion to the thickness of the lamp bead ranges from 1 / 2 to 3 / 4;

[0014] The distance between the inner wall and the outer wall of the protection portion is 0.15 mm to 0.5 mm;

[0015] Along a direction perpendicular to the surface of the substrate, a ratio of a thickness of a portion of the protection portion located on the outer peripheral wall of the substrate to a thickness of the substrate is in a range of 1 / 2 to 2 / 3.

[0016] In some embodiments, the protective layer further includes a plurality of reinforcing portions, each of the reinforcing portions being arranged on an inner peripheral wall of a corresponding light-transmitting hole and protruding from the surface of the substrate, and the outer periphery of each reinforcing portion being in contact with the protective portion;

[0017] A side of each reinforcing portion facing away from the base plate is flush with a side of the protecting portion facing away from the base plate.

[0018] In some embodiments, the reinforcement portion is ring-shaped;

[0019] The distance between the inner wall and the outer wall of the reinforcement portion is 0.15 mm to 0.5 mm;

[0020] Along a direction perpendicular to the surface of the substrate, a ratio of a thickness of a portion of the reinforcing portion located on the inner peripheral wall of the light-transmitting hole to a thickness of the substrate is in a range of 1 / 2 to 2 / 3.

[0021] In some embodiments, the protective layer is formed by solidifying a liquid black packaging glue on the substrate;

[0022] The protective layer is prepared from epoxy material, polyurethane material or acrylic material.

[0023] In some embodiments, the plurality of lamp beads are distributed in an array on the surface of the substrate; the substrate includes a plurality of mounting portions distributed at intervals, with at least one light-transmitting hole provided between two adjacent mounting portions; each mounting portion is provided with a row of lamp beads; and the ratio of the width of the mounting portion to the width of the lamp beads is in a range of 1.2 to 1.5;

[0024] The display module includes a plurality of solder pads, which are arranged in an array on the surface of the substrate, and the plurality of solder pads are fixedly connected to the plurality of lamp beads in a one-to-one correspondence;

[0025] The display module further includes a plurality of driving chips, which are arranged on the substrate, and the driving chips and the lamp beads are arranged on two opposite sides of the substrate.

[0026] According to another aspect of the present application, the present application further provides a glue-filling mold for preparing a display module as described in any one of the above items, wherein the display module includes a substrate and a plurality of lamp beads spaced apart on a surface of the substrate, and the glue-filling mold includes:

[0027] The mold body has a top opening formed with a receiving groove, the receiving groove being used to receive a substrate on which a plurality of lamp beads are arranged and liquid glue;

[0028] A plurality of protrusions are arranged at intervals on the top surface of the bottom wall of the mold body. The arrangement positions of the plurality of protrusions on the mold body correspond one-to-one with the arrangement positions of the plurality of light-transmitting holes on the substrate. The protrusions can extend into the corresponding light-transmitting holes.

[0029] In some embodiments, the peripheral side wall of the mold body includes a glue-blocking portion and a glue-containing portion connected vertically, the glue-blocking portion is connected between the top surface of the bottom wall of the mold body and the glue-containing portion, and the glue-blocking portion protrudes inwardly from the glue-containing portion along the circumferential direction;

[0030] The distance between the inner circumference of the adhesive blocking portion and the inner circumference of the adhesive receiving portion is 0.2 mm to 0.6 mm;

[0031] The ratio of the height of the adhesive blocking portion to the thickness of the substrate is in a range of 1 / 3 to 1 / 2;

[0032] The inner peripheral side of the adhesive containing portion is used to form a first interval with the outer peripheral wall of the substrate, and the distance of the first interval is 0.15 mm to 0.5 mm.

[0033] In some embodiments, the height of each of the bumps is greater than the thickness of the substrate, so that when the bump is inserted into the corresponding light-transmitting hole, the bump can protrude from the surface of the substrate;

[0034] Along a direction perpendicular to the surface of the substrate, a relationship between a height h of the protrusion protruding from the surface of the substrate and a thickness l of the lamp bead is: h≥0.5l.

[0035] In some embodiments, each of the protrusions includes a first boss and a second boss connected vertically, the first boss being fixed between the top surface of the bottom wall of the mold body and the second boss; the first boss protrudes outwardly from the second boss along the circumferential direction;

[0036] The distance between the outer circumference of the first boss and the inner circumference of the second boss is 0.2 to 0.6 mm;

[0037] The ratio of the height of the first boss to the thickness of the substrate is in a range of 1 / 3 to 1 / 2;

[0038] The outer peripheral side of the second boss is used to form a second gap with the inner peripheral wall of the light-transmitting hole, and the distance of the second gap is 0.15 mm to 0.5 mm.

[0039] According to another aspect of the present application, the present application further provides a process for preparing a display module, for preparing any one of the display modules described above, the process for preparing the display module comprising:

[0040] Providing a substrate, and arranging a plurality of light-transmitting holes at intervals on the substrate;

[0041] A plurality of lamp beads are arranged at intervals on the surface of the substrate;

[0042] A casting mold as described in any one of the above items is provided, and a substrate on which a plurality of lamp beads are arranged is placed in the casting mold, so that each corresponding protrusion of the casting mold extends into one of the light-transmitting holes on the substrate;

[0043] Injecting liquid glue into the glue-filling mold until it covers the surface and periphery of the substrate and wraps around the periphery of the lamp bead;

[0044] The liquid glue is solidified to form a protective layer to fix the lamp beads on the substrate; a plurality of through holes are formed on the protective layer, and the plurality of through holes are arranged in a one-to-one correspondence with the plurality of light-transmitting holes and are in communication with each other.

[0045] In some embodiments, when liquid glue is injected into the glue-filling mold, the thickness of the liquid glue in a direction perpendicular to the surface of the substrate is controlled so that the ratio of the thickness to the thickness of the lamp bead is in a range of 1 / 2 to 3 / 4; and / or,

[0046] controlling the thickness of the portion of the liquid glue covering the outer peripheral wall of the substrate in a direction perpendicular to the surface of the substrate so that the ratio of the liquid glue to the thickness of the substrate is in a range of 1 / 2 to 2 / 3; and / or,

[0047] The liquid glue is controlled to flow between the inner peripheral wall of each light-transmitting hole and the protrusion, and the thickness of the portion of the liquid glue attached to the inner wall of the light-transmitting hole in a direction perpendicular to the surface of the substrate is controlled so that the ratio of the thickness to the thickness of the substrate is in the range of 1 / 2 to 2 / 3.

[0048] As can be seen from the above technical solutions, the present invention has at least the following advantages and positive effects:

[0049] In the present application, a protective layer is integrally formed on the surface and the outer peripheral wall of the substrate, and the circumferences of each light-emitting diode (LED) are covered simultaneously, so that a continuous connection interface can be formed between the surface of the substrate and each LED, and each LED can be strengthened and fixed and protected circumferentially, significantly enhancing the connection strength between the LED and the substrate, achieving the protection of the LED circumferentially, and further increasing the thrust of the LED and the service life of the display module. At the same time, the protective layer can also isolate media such as water vapor and dust from entering the connection between the LED and the substrate, avoiding problems such as poor contact of the LED, thereby increasing the service life of the display module.

[0050] Moreover, since a plurality of through holes are provided on the protective layer, and the plurality of through holes are arranged in one-to-one correspondence and communicate with the plurality of light-transmitting holes, the light-transmitting holes can be fully or partially exposed through the through holes to allow light to pass through, so that when the purpose of increasing the thrust of the LED is achieved, the display module can have a high light transmittance and a good light-transmitting effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is a three-dimensional structural schematic diagram of the display module in this embodiment.

[0052] Figure 2 is a front view of a partial structure of the display module in this embodiment.

[0053] Figure 3 is Figure 2 a cross-sectional view of the display module along the A-A direction in

[0054] Figure 4 is Figure 3 an enlarged schematic view of the structure at B in

[0055] Figure 5 is a structural schematic diagram of the potting mold in this embodiment.

[0056] Figure 6 is a usage effect diagram of the potting mold in this embodiment.

[0057] Figure 7 is Figure 6 a cross-sectional view of along the C-C direction in

[0058] Figure 8 is Figure 7 an enlarged schematic view of the structure at D in

[0059] Figure 9 is Figure 5 an enlarged schematic view of the structure at E in

[0060] Figure 10It is a schematic diagram of the manufacturing method of the display module in this embodiment.

[0061] The descriptions of the reference numerals are as follows:

[0062] 100, display module; 1, substrate; 11, light-transmitting hole; 12, mounting portion; 13, connecting portion; 2, lamp bead; 3, protective layer; 31, protective portion; 32, protection portion; 33, reinforcement portion;

[0063] 200, potting mold; 4, mold body; 41, glue-blocking portion; 42, glue-containing portion; 43, accommodation groove; 5, bump; 51, first boss; 52, second boss. Detailed implementation manners

[0064] Typical implementation manners reflecting the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different implementation manners, all of which do not depart from the scope of the present invention, and the descriptions and illustrations therein are for illustrative purposes in essence and are not used to limit the present invention.

[0065] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indication of the direction or positional relationship (such as up, down, left, right, front, and back, etc.) is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. When these elements are in the positions shown in the drawings, these descriptions are appropriate. If the description of the positions of these elements changes, then the indication of these directions also changes accordingly.

[0066] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.

[0067] According to the first aspect of the present application, the present application provides a display module, which can be used for a display screen. Specifically, the present application takes the display module applied to a transparent display screen as an example for illustration.

[0068] The following will describe in detail the specific embodiments of the display module of the present application with reference to the drawings.

[0069] Figure 1 It is a schematic diagram of the structure of the display module in this embodiment, Figure 2 It is a front view of the partial structure of the display module in this embodiment, Figure 3 is Figure 2The cross-sectional view of the display module along the A-A direction is shown, Figure 4 is Figure 3 the enlarged structural schematic diagram at position B in

[0070] Refer to Figures 1 to 4 , the display module 100 includes a substrate 1, a plurality of lamp beads 2 and a protective layer 3. A plurality of light-transmitting holes 11 are provided at intervals on the substrate 1. The plurality of lamp beads 2 are arranged at intervals on the surface of the substrate 1, and the lamp beads 2 and the light-transmitting holes 11 are distributed at intervals. The protective layer 3 is provided on the surface and the outer peripheral wall of the substrate 1, and the protective layer 3 covers the periphery of the lamp beads 2 to fix the lamp beads 2 on the substrate 1. A plurality of through holes are provided on the protective layer 3, and the plurality of through holes are arranged in one-to-one correspondence with and communicate with the plurality of light-transmitting holes 11.

[0071] In this application, since a plurality of light-transmitting holes 11 are provided on the substrate 1 to achieve the light transmission of the display module 100, the setting of the light-transmitting holes 11 will cause the area for mounting the lamp beads 2 on the substrate 1 to become smaller and narrower, and it is impossible to adopt the method of reserving sufficient positions on the opposite sides of the lamp beads 2 in the prior art to mount the mask or apply dot reinforcing glue to increase the thrust of the lamp beads 2. Therefore, in this application, the protective layer 3 is integrally formed on the surface and the outer peripheral wall of the substrate 1, and the protective layer 3 covers the periphery of each lamp bead 2 at the same time, replacing the functions of the mask or glue dot in the prior art with the protective layer 3. A continuous connection interface is formed between the surface of the substrate 1 and each lamp bead 2 through the protective layer 3, and each lamp bead 2 can be strengthened and fixed and protected circumferentially, which can significantly strengthen the connection strength between the lamp bead 2 and the substrate 1, thereby increasing the thrust of the lamp bead 2 and improving the service life of the display module 100. At the same time, the protective layer 3 can also isolate media such as water vapor and dust from entering the connection between the lamp bead 2 and the substrate 1, avoiding problems such as poor contact of the lamp bead 2, thereby improving the service life of the display module 100.

[0072] Moreover, since a plurality of through holes are provided on the protective layer 3, and the plurality of through holes are arranged in one-to-one correspondence with and communicate with the plurality of light-transmitting holes 11, the light-transmitting holes 11 can be fully exposed or partially exposed through the through holes to allow light to pass through. Thus, when the purpose of increasing the thrust of the lamp bead 2 is achieved, it is ensured that the display module 100 has a high light transmittance and a good light transmission effect.

[0073] Refer to Figures 1 to 3 , the opposite sides of the substrate 1 are the front and the back respectively. It should be noted that the front of the substrate 1 in this article is also the front of the overall structure of the display module 100, and the back of the substrate 1 is also the back of the overall structure of the display module 100.

[0074] A plurality of light-transmitting holes 11 are provided at intervals on the substrate 1, so that light can pass through the light-transmitting holes 11, making the entire display module 100 have a light-transmitting effect. While enabling the front surface of the display module 100 to display an image, it is also possible to observe an object located on the reverse side of the display module 100 through the light-transmitting holes 11. Specifically, the light-transmitting holes 11 can be in any shape such as rectangular, oval, or circular, and the aperture sizes of the respective light-transmitting holes 11 can be the same or different.

[0075] Specifically, the substrate 1 includes a plurality of mounting portions 12 distributed at intervals, and at least one light-transmitting hole 11 is provided between two adjacent mounting portions 12. Among them, when there is one light-transmitting hole 11 between two adjacent mounting portions 12, the length dimension of the light-transmitting hole 11 can be enlarged to enable more light to pass through the light-transmitting hole 11, thereby increasing the light transmittance of the display module 100. When there are a plurality of light-transmitting holes 11 between two adjacent mounting portions 12, the plurality of light-transmitting holes 11 are distributed at intervals along the length direction of the mounting portion 12. The length dimension of the light-transmitting hole 11 can be enlarged or the number of light-transmitting holes 11 can be increased, etc., to enable more light to pass through the light-transmitting hole 11, thereby increasing the light transmittance of the display module 100.

[0076] The substrate 1 further includes a plurality of connecting portions 13, and at least two connecting portions 13 are connected at intervals between two adjacent mounting portions 12. Among them, two mounting portions 12 and two adjacent connecting portions 13 connected therebetween jointly enclose a light-transmitting hole 11.

[0077] A plurality of lamp beads 2 are provided at intervals on the surface of the substrate 1, and the lamp beads 2 and the light-transmitting holes 11 are distributed at intervals. Specifically, the plurality of lamp beads 2 are distributed in a multi-row and multi-column array form on the front surface of the substrate 1. One column of lamp beads 2 is correspondingly provided on each mounting portion 12.

[0078] In this embodiment, the ratio range of the width of the mounting portion 12 to the width of the lamp bead 2 is 1.2 to 1.5. This makes the mounting portion 12 have a smaller width. While it can meet the spatial conditions for the installation of the lamp bead 2, etc., it can also make the light-transmitting hole 11 between two adjacent mounting portions 12 have a larger cross-sectional area, so that more light can pass through the light-transmitting hole 11, thereby increasing the light transmittance of the display module 100 and improving the light-transmitting effect of the display module 100.

[0079] In this embodiment, the display module 100 further includes a plurality of pads, and the plurality of pads are arranged in an array on the surface of the substrate 1. The plurality of pads are fixedly connected to the plurality of lamp beads 2 in one-to-one correspondence, and each lamp bead 2 is electrically connected to the substrate 1 through the pad. Specifically, the lamp bead 2 is fixedly connected to the pad by soldering.

[0080] In this embodiment, each lamp bead 2 has a light-emitting surface. Specifically, the light-emitting surface is located on the front surface of the lamp bead 2.

[0081] refer to Figure 2 、 Figure 3 The protective layer 3 is provided on the surface and outer peripheral wall of the substrate 1, and the protective layer 3 covers the circumference of the lamp bead 2 to fix the lamp bead 2 on the substrate 1. This design can increase the fixation of the lamp bead 2 in the circumferential direction, thereby strengthening the connection strength between the lamp bead 2 and the substrate 1, and realizing circumferential protection of the lamp bead 2, thereby increasing the thrust of the lamp bead 2 and prolonging the service life of the display module 100.

[0082] In addition, the protective layer 3 is provided with a plurality of through holes, and the plurality of through holes are arranged in a one-to-one correspondence with and communicate with the plurality of light-transmitting holes 11, so that the light-transmitting holes 11 can be fully or partially exposed through the through holes to allow light to pass through, thereby ensuring that the display module 100 has a higher light transmittance and a better light transmission effect while achieving the purpose of increasing the thrust of the lamp beads 2.

[0083] In this embodiment, the protective layer 3 includes a protective portion 31 and a protection portion 32 .

[0084] Specifically, the protective portion 31 covers the front surface of the substrate 1. The protective portion 31 is provided with a plurality of through holes. The positions of the through holes on the protective portion 31 correspond one-to-one with the positions of the light-transmitting holes 11 on the substrate 1. The inner wall of each through hole is flush with the inner circumferential wall of the corresponding light-transmitting hole 11 in the circumferential direction. This fully exposes the light-transmitting hole 11, thereby improving the light transmittance and light transmission effect of the display module 100.

[0085] In this embodiment, the ratio of the thickness H of the protective portion 31 to the thickness of the lamp bead 2, along a direction perpendicular to the surface of the substrate 1, is in the range of 1 / 2 to 3 / 4. That is, in this design, the thickness of the protective portion 31 is less than the thickness of the lamp bead 2. This prevents the protective portion 31 from obstructing the light-emitting surface of the lamp bead 2, allowing it to cover only the outer periphery of the lamp bead 2, thereby ensuring that the lamp bead 2 can emit light normally. At the same time, this design allows the protective portion 31 to have a relatively large thickness. Specifically, the protective portion 31 protrudes from the surface of the substrate 1 to cover the connection between the lamp bead 2 and the solder pad, while also covering the outer periphery of the lamp bead 2. The covered portion of the lamp bead 2 accounts for 1 / 2 to 3 / 4 of its total thickness in the thickness direction. This design results in a larger covered area of the lamp bead 2, and the protective portion 31 forms a larger continuous connection interface between the lamp bead 2 and the surface of the substrate 1, which can significantly improve the connection strength between the lamp bead 2 and the substrate 1, thereby increasing the thrust of the lamp bead 2.

[0086] In this embodiment, the protective portion 32 is disposed around the outer peripheral wall of the substrate 1. The surface of the protective portion 32 protrudes from the surface of the substrate 1, and the inner wall of the protective portion 32 is connected to the outer periphery of the guard portion 31. This design can increase the coating thickness of the outer side of the lamp beads 2 located at the edge of the substrate 1, thereby further strengthening the connection strength between the lamp beads 2 located at the edge of the substrate 1 and the substrate 1, thereby achieving the purpose of increasing the thrust of the lamp beads 2 and extending the service life of the display module 100.

[0087] The surface of the protective portion 32 is flush with the side of the protective portion 31 facing away from the substrate 1, so that the protective portion 32 can completely cover the protective portion 31 in the direction perpendicular to the surface of the substrate 1, and the part of the outer side of the lamp bead 2 located at the edge of the substrate 1 that is covered by the protective portion 31 is also covered with the protective portion 32, thereby evenly increasing the coating thickness of the outer side of the lamp bead 2 located at the edge of the substrate 1, improving the connection strength between the lamp bead 2 and the substrate 1, and achieving the purpose of increasing the thrust of the lamp bead 2.

[0088] The distance M1 between the inner and outer walls of the protection portion 32 is 0.15 mm to 0.5 mm. This design allows the protection portion 32 to have a smaller width, increasing the outer width of the lamp beads 2 at the edge of the substrate 1 while reducing the volume and weight of the protection portion 32, thereby achieving a lightweight display module 100.

[0089] In a direction perpendicular to the surface of substrate 1, the ratio of the thickness L1 of the portion of protective portion 32 located on the outer peripheral wall of substrate 1 to the thickness of substrate 1 is in the range of 1 / 2 to 2 / 3. That is, in a direction perpendicular to the surface of substrate 1, protective portion 32 does not completely cover the outer peripheral wall of substrate 1, resulting in a smaller volume and weight of protective portion 32, thereby reducing the weight of display module 100.

[0090] refer to Figure 2 and Figure 3 In this embodiment, the protective layer 3 further includes multiple reinforcement portions 33. Each reinforcement portion 33 is disposed around the inner circumference of a corresponding light-transmitting hole 11 and protrudes from the surface of the substrate 1. The outer periphery of each reinforcement portion 33 is in one-to-one contact with the inner circumference of each through-hole of the protective layer 31. This design increases the width of the cover on the side of the lamp bead 2 closest to the light-transmitting hole 11, thereby further strengthening the connection between the lamp bead 2 and the substrate 1, thereby increasing the thrust of the lamp bead 2 and extending the service life of the display module 100.

[0091] In this embodiment, the side of each reinforcing portion 33 facing away from the substrate 1 is flush with the side of the protective portion 31 facing away from the substrate 1, so that the reinforcing portion 33 can completely cover the protective portion 31 in the direction perpendicular to the surface of the substrate 1, and the portion of the light-emitting diode 2 near the light-transmitting hole 11 covered by the protective portion 31 is further covered by the reinforcing portion 33, thereby uniformly increasing the covering width of the side of the light-emitting diode 2 near the light-transmitting hole 11, improving the connection strength between the light-emitting diode 2 and the substrate 1, and achieving the purpose of increasing the thrust of the light-emitting diode 2.

[0092] The reinforcing portion 33 is annular. Specifically, the reinforcing portion 33 is provided with a perforation, and the perforation communicates with the corresponding light-transmitting hole 11 to allow light to pass through.

[0093] The distance M2 between the inner wall and the outer wall of the reinforcing portion 33 is 0.15 mm to 0.5 mm. This design makes the reinforcing portion 33 have a smaller thickness. While increasing the covering thickness of the side of the light-emitting diode 2 near the light-transmitting hole 11, the reinforcing portion 33 has a smaller volume, and reduces its occupied volume of the light-transmitting hole 11 to ensure that the light-transmitting hole 11 has a high light transmittance.

[0094] In the direction perpendicular to the surface of the substrate 1, the ratio range of the thickness L2 of the portion of the reinforcing portion 33 located on the inner peripheral wall of the light-transmitting hole 11 to the thickness of the substrate 1 is 1 / 2 to 2 / 3. That is, in the direction perpendicular to the surface of the substrate 1, the protective portion 32 does not completely cover the inner peripheral wall of the light-transmitting hole 11, so that the protective portion 32 has a smaller volume, weight, etc., thereby realizing the light weight of the display module 100.

[0095] In this embodiment, the protective layer 3 is a black encapsulation glue layer, which is formed by curing liquid black encapsulation glue on the substrate 1. The black encapsulation glue layer can absorb the excess stray light emitted by the light-emitting diode 2, prevent light leakage from the side of the display module 100, and ensure the ink color consistency of the substrate 1, thereby enhancing the contrast of the display module 100 and improving the display effect. Specifically, the liquid black encapsulation glue can be disposed on the surface of the substrate 1 by means of glue injection or vacuum glue injection, etc., and the curing method can be selected from room temperature curing, heat curing or ultraviolet curing. Exemplarily, when the ultraviolet curing method is selected, ultraviolet rays with a wavelength of 340 nm to 400 nm can be selected for irradiation curing.

[0096] Since a plurality of light-transmitting holes 11 are provided on the substrate 1 to achieve light transmission of the display module 100, the arrangement of the light-transmitting holes 11 will cause the area on the substrate 1 for mounting the lamp beads 2 to become narrower, and it is impossible to adopt the method in the prior art of reserving sufficient positions on the opposite sides of the lamp beads 2 to mount the mask or apply dot reinforcing glue to increase the thrust of the lamp beads 2. Therefore, in the present application, a liquid black encapsulation glue is poured on the substrate 1 in the form of glue injection, and it is fixed to integrally form a protective layer 3 on the surface of the substrate 1, the outer peripheral wall of the substrate 1, and the inner peripheral wall of the light-transmitting holes 11, and the protective layer 3 simultaneously covers the peripheral sides of the respective lamp beads 2, using the protective layer 3 which is convenient and simple to manufacture to replace the functions of the mask or glue application in the prior art, so as to directly and significantly improve the thrust of the lamp beads 2. At the same time, the cured protective layer 3 has a small weight, which is also convenient for realizing the light weight of the display module 100.

[0097] The preparation material of the protective layer 3 includes matte materials such as epoxy materials, polyurethane materials, or acrylic materials. The matte surface can reduce the direct light through diffuse reflection, so that glare generated under the irradiation of ambient light can be effectively avoided, thereby affecting the viewing effect. Moreover, the matte surface can also evenly scatter light, so as to improve the display effect of the display module 100.

[0098] In other embodiments, the protective layer 3 can also be made of bright materials.

[0099] In this embodiment, the hardness of the protective layer 3 is 40D to 80D. That is, the protective layer 3 has a relatively high hardness, so that it can withstand high impact forces and external impacts such as vibrations, so as to improve the protection effect on the lamp beads 2.

[0100] In this embodiment, the display module 100 further includes a plurality of driving chips. The plurality of driving chips are arranged on the substrate 1, and the driving chips and the lamp beads 2 are arranged on opposite sides of the substrate 1. Each driving chip is electrically connected to the substrate 1.

[0101] According to the second aspect of the present application, the present application also provides a glue injection mold 200 for preparing the above-mentioned display module 100.

[0102] Figure 5 is a schematic structural diagram of the glue injection mold 200 in this embodiment, Figure 6 is a usage effect diagram of the glue injection mold 200 in this embodiment, Figure 7 is Figure 6 a cross-sectional view taken along the C-C direction in

[0103] Refer to Figure 5 and Figure 6 , the glue injection mold 200 includes a mold body 4 and a plurality of bumps 5.

[0104] An accommodation groove 43 is formed at the top opening of the mold body 4. The accommodation groove 43 is used to accommodate the substrate 1 arranged with a plurality of lamp beads 2 and liquid glue. Here, the glue is also the black encapsulation glue mentioned above, and the same applies hereinafter.

[0105] Specifically, the shape of the accommodation groove 43 is the same as that of the substrate 1, so as to facilitate placing the substrate 1 into the accommodation groove 43.

[0106] Figure 8 For Figure 7 the enlarged structural schematic diagram at D in

[0107] Refer to Figure 7 and Figure 8 In this embodiment, the circumferential side wall of the mold body 4 includes a glue-blocking part 41 and a glue-containing part 42 that are vertically connected. Among them, the glue-blocking part 41 is connected between the top surface of the bottom wall of the mold body 4 and the glue-containing part 42. The glue-blocking part 41 protrudes inward circumferentially from the glue-containing part 42. The inner circumferential side of the glue-blocking part 41 is used to press against the outer circumferential wall of the substrate 1, and the inner circumferential side of the glue-containing part 42 is used to form a first interval with the outer circumferential wall of the substrate 1. At this time, the inner circumferential side of the glue-containing part 42, the top surface of the glue-blocking part 41, and the outer circumferential wall of the substrate 1 enclose a glue-containing groove for accommodating liquid glue. And because the shape of the accommodation groove 43 is the same as that of the substrate 1, this enables the interval between the inner circumferential side of the glue-containing part 42 and the outer circumferential wall of the substrate 1 to be evenly distributed, so that the liquid glue accommodated in the subsequent glue-containing groove can be evenly distributed on the outer circumferential wall of the substrate 1.

[0108] Specifically, the distance between the inner circumferential side of the glue-blocking part 41 and the inner circumferential side of the glue-containing part 42 is 0.2 mm to 0.6 mm. The distance of the first interval formed between the inner circumferential side of the glue-containing part 42 and the outer circumferential wall of the substrate 1 is 0.15 mm to 0.5 mm. That is to say, the cross-sectional area of the inner circumferential side of the glue-blocking part 41 is actually smaller than the cross-sectional area of the substrate 1.

[0109] The glue-blocking part 41 has elasticity, so that its inner circumferential side can expand and contract in the inner and outer directions for elastic contact with the outer circumferential wall of the substrate 1. Specifically, during the process of placing the substrate 1 into the accommodation groove 43, by making the inner circumferential side of the glue-blocking part 41 compress outward to expand its cross-sectional area, so that the substrate 1 can be smoothly placed into the accommodation groove 43. After that, the glue-blocking part 41 will maintain the state of wanting to restore elastic deformation and press against the outer circumferential wall of the substrate 1 to play a sealing role, so as to completely eliminate the gap between the inner circumferential side of the glue-blocking part 41 and the outer circumferential wall of the substrate 1, prevent the liquid glue from continuing to flow downward from the glue-containing groove, ensure that the glue will not leak, and cooperate with the glue-containing part 42 to facilitate meeting the preparation requirements of the protection part 32 of the above-mentioned protective layer 3, so as to directly form the protection part 32 subsequently without performing other operations such as glue cutting, thereby simplifying the preparation operation of the protective layer 3.

[0110] Of course, in other embodiments, the inner peripheral side of the mold body 4 is an annular surface, that is, the inner peripheral sides of the glue-blocking part 41 and the glue-containing part 42 are flush. At this time, the entire inner peripheral side of the mold body 4 is used to form a first gap with the outer peripheral wall of the substrate 1. This design enables the subsequently formed protective part 32 to completely cover the outer peripheral wall of the substrate 1 in the direction perpendicular to the surface of the substrate 1, and conditions such as glue cutting can be used to meet the conditions of the above-mentioned protective part 32.

[0111] The ratio range of the height of the glue-blocking part 41 to the thickness of the substrate 1 is 1 / 3 to 1 / 2. This design makes the linear distance between the top surface of the glue-blocking part 41 and the surface of the substrate 1 and the thickness of the substrate 1 within the ratio range of 1 / 2 to 2 / 3 after the substrate 1 is placed in the accommodation groove 43, that is, the linear distance between the bottom surface of the glue-containing part 42 and the surface of the substrate 1 and the thickness of the substrate 1 is within the ratio range of 1 / 2 to 2 / 3, which is convenient for meeting the preparation requirements of the protective part 32 of the protective layer 3 as described above, that is, the ratio range of the thickness of the part of the protective part 32 located on the outer peripheral wall of the substrate 1 to the thickness of the substrate 1 is 1 / 2 to 2 / 3, which is convenient for directly forming the protective part 32 subsequently without other operations such as glue cutting, thus simplifying the preparation operation of the protective layer 3.

[0112] Reference Figure 5 and Figure 6 , in this embodiment, a plurality of bumps 5 are spaced and protrude from the top surface of the bottom wall of the mold body 4. The arrangement positions of the plurality of bumps 5 on the mold body 4 correspond one-to-one to the arrangement positions of the plurality of light-transmitting holes 11 on the substrate 1. The bumps 5 can extend into the corresponding light-transmitting holes 11 to block the light-transmitting holes 11, preventing the liquid glue from flowing towards the light-transmitting holes 11 during the subsequent glue injection process and blocking the light-transmitting holes 11 after curing, so that the light-transmitting holes 11 cannot transmit light, and further facilitating meeting the preparation requirements of the above-mentioned protective layer 3, so as to directly form the protective layer 3 integrally subsequently without other operations such as glue cutting, thus simplifying the preparation operation of the protective layer 3.

[0113] Figure 9 For Figure 5 the enlarged structural schematic diagram at position E in

[0114] Reference Figure 8 , Figure 9 and Figure 10The height of each bump 5 is greater than the thickness of the substrate 1, so that when the bump 5 extends into the corresponding light-transmitting hole 11, the bump 5 can protrude from the surface of the substrate 1. This design facilitates further preventing the liquid glue from flowing to the top of the light-transmitting hole 11 during the subsequent glue pouring process and blocking the light-transmitting hole 11 after curing, making it impossible for the light-transmitting hole 11 to pass light, so as to meet the preparation requirements of the above-mentioned protective layer 3, so that the protective layer 3 can be directly formed in one piece in the subsequent process without the need for other operations such as tapping, thereby simplifying the preparation operation of the protective layer 3.

[0115] Specifically, along a direction perpendicular to the surface of the substrate 1, the height h of the bump 5 protruding from the surface of the substrate 1 and the thickness l of the lamp bead 2 are related to: h ≥ 0.5l. This design ensures that the height of the bump 5 protruding from the surface of the substrate 1 is greater than or equal to the maximum thickness of the protective layer 3. This facilitates the glue pouring process. Regardless of the thickness of the protective layer 3 required, the bump 5 can block the liquid glue to prevent the liquid glue from flowing above the light-transmitting hole 11 and blocking the light-transmitting hole 11 after curing, thereby preventing light from passing through the light-transmitting hole 11. This simplifies the preparation process of the protective layer 3.

[0116] Of course, in other embodiments, the relationship between the height h of the bump 5 protruding from the surface of the substrate 1 and the thickness l of the lamp bead 2 can also be: 0≤h<0.5l, so that when the bump 5 extends into the corresponding light-transmitting hole 11, the surface of the bump 5 is flush with the surface of the substrate 1, or the height of the bump 5 protruding from the surface of the substrate 1 is less than the maximum thickness of the protective layer 3. This design allows the subsequently formed protective layer 3 to cover the top surface of the bump 5, but there is a possibility of blocking the light-transmitting hole 11. The above-mentioned conditions for the protective layer 3 can be met later by tapping or other methods.

[0117] In this embodiment, each protrusion 5 includes a first boss 51 and a second boss 52 vertically connected. The first boss 51 is fixed between the top surface of the bottom wall of the mold body 4 and the second boss 52. The first boss 51 circumferentially extends outward to the second boss 52. The outer circumference of the first boss 51 is used to press against the inner circumferential wall of the light transmission hole 11, while the outer circumference of the second boss 52 is used to form a second gap with the inner circumferential wall of the light transmission hole 11. The second boss 52, the first boss 51, and the inner circumferential wall of the light transmission hole 11 together form a glue filling groove for accommodating liquid glue.

[0118] The distance between the outer periphery of the first boss 51 and the inner periphery of the second boss 52 is 0.2-0.6 mm. The distance of the second interval is 0.15-0.5 mm. That is, the cross-sectional area of the first boss 51 is actually larger than the cross-sectional area of the light-transmitting hole 11.

[0119] The first boss 51 is elastic, so that its outer peripheral side can be stretched and retracted in the inward and outward directions and is used to elastically contact the inner peripheral wall of the light-transmitting hole 11. Specifically, during the process of placing the substrate 1 in the accommodating groove 43, the outer peripheral side of the first boss 51 is compressed inward to reduce its cross-sectional area, so that the first boss 51 can smoothly extend into the light-transmitting hole 11 of the substrate 1. Thereafter, the first boss 51 will maintain a state of wanting to restore the elastic deformation and press against the inner peripheral wall of the light-transmitting hole 11 to play a sealing role, so as to completely eliminate the gap between the outer peripheral side of the first boss 51 and the inner peripheral wall of the light-transmitting hole 11, prevent liquid glue from continuing to flow downward from the glue filling tank, and ensure that the glue does not leak. It cooperates with the second boss 52 to meet the preparation requirements of the reinforcement portion 33 of the above-mentioned protective layer 3, so that the reinforcement portion 33 can be directly formed subsequently without performing other operations such as tapping, thereby simplifying the preparation operation of the protective layer 3.

[0120] Of course, in other embodiments, the outer periphery of the bump 5 is an annular surface, that is, the outer periphery of the first boss 51 is flush with the outer periphery of the second boss 52. In this case, the entire outer periphery of the bump 5 is used to form a second gap with the inner peripheral wall of the light-transmitting hole 11. This design allows the subsequently formed reinforcement portion 33 to completely cover the inner peripheral wall of the light-transmitting hole 11 in a direction perpendicular to the surface of the substrate 1. The above-mentioned conditions for the reinforcement portion 33 can be met by methods such as cutting rubber.

[0121] The ratio of the height of the first boss 51 to the thickness of the substrate 1 is in the range of 1 / 3 to 1 / 2. This design makes it possible for the straight-line distance between the top surface of the first boss 51 and the surface of the substrate 1 to have a ratio of 1 / 2 to 2 / 3 to the thickness of the substrate 1 after the substrate 1 is placed in the accommodating groove 43. That is, the straight-line distance between the bottom surface of the second boss 52 and the surface of the substrate 1 to have a ratio of 1 / 2 to 2 / 3 to the thickness of the substrate 1, which facilitates meeting the preparation requirements of the subsequent reinforcement portion 33 of the protective layer 3 as described above, that is, the thickness of the portion of the reinforcement portion 33 located on the inner peripheral wall of the light-transmitting hole 11 to the thickness of the substrate 1 is in the range of 1 / 2 to 2 / 3, which facilitates the subsequent direct formation of the reinforcement portion 33 without the need for other operations such as tapping, thereby simplifying the preparation operation of the protective layer 3.

[0122] According to the third aspect of the present application, the present application further provides a method for preparing a display module 100 , which uses the above-mentioned glue-filling mold 200 to prepare the above-mentioned display module 100 .

[0123] Figure 10 FIG. 1 is a schematic diagram illustrating a method for manufacturing the display module 100 in this embodiment.

[0124] refer to Figure 10 The method for preparing the display module 100 includes the following steps:

[0125] S1. Provide a substrate 1 and arrange a plurality of light-transmitting holes 11 on the substrate 1 at intervals.

[0126] S2. A plurality of lamp beads 2 are arranged at intervals on the surface of the substrate 1.

[0127] S3. Provide a potting mold 200 as described above, and place the substrate 1 with multiple lamp beads 2 arranged thereon in the potting mold 200 so that each protrusion 5 of the potting mold 200 extends into a corresponding light-transmitting hole 11 on the substrate 1 .

[0128] S4 , injecting liquid glue into the glue-filling mold 200 to cover the surface and periphery of the substrate 1 and wrap around the periphery of the lamp bead 2 .

[0129] S5. Solidify the liquid glue to form a protective layer 3 to fix the lamp beads 2 on the substrate 1. A plurality of through holes are formed on the protective layer 3, and the plurality of through holes are arranged in a one-to-one correspondence with the plurality of light-transmitting holes 11 and communicate with each other.

[0130] In step S1, the substrate 1 has been pre-treated by cleaning. The light holes 11 are used to transmit light, so that the display module 100 has a light-transmitting effect. For the specific shape of the light holes 11 and the specific arrangement on the substrate 1, please refer to the above.

[0131] Before step S2, the method further includes step S6, arranging a plurality of pads at intervals on the substrate 1. Specifically, the plurality of pads are distributed in an array on the substrate 1, and at least one light-transmitting hole 11 is provided between two adjacent rows of pads.

[0132] After completing step S6 and before proceeding to step S2, the process further includes step S7 of applying solder paste on each pad.

[0133] After completing step S7, proceed to step S2. Specifically, each lamp bead 2 is arranged corresponding to a solder pad, and solder paste is used to achieve a preliminary bonding and fixation between the pad. The solder paste is then heated to melt and then solidify between the lamp bead 2 and the pad, thereby achieving a fixed connection between the lamp bead 2 and the pad.

[0134] Before step S3 , the method further includes step S8 , in which a plurality of driver chips are spaced apart on the side surface of the substrate 1 opposite to the lamp beads 2 . The driver chips are electrically connected to the substrate 1 .

[0135] After completing the above steps, proceed to step S3, placing the substrate 1 in the glue-potting mold 200 with the LED 2 facing upward. At this point, the glue-blocking portion 41 of the mold body 4 remains compressed against the outer wall of the substrate 1, eliminating any gap between them and providing a seal. The glue-receiving portion 42 is evenly spaced from the outer wall of the substrate 1 along the circumference, so that the glue-receiving portion 42, the glue-blocking portion 41, and the substrate 1 together form a glue sol tank for containing liquid glue.

[0136] Moreover, each bump 5 protrudes from the surface of the substrate 1. Specifically, the first boss 51 of each bump 5 will be in a compressed state and abut against the inner peripheral wall of the light-transmitting hole 11, eliminating the gap therebetween to play a sealing role. The second bosses 52 are evenly spaced along the circumferential direction from the inner peripheral wall of the light-transmitting hole 11, such that the first boss 51, the second bosses 52 and the inner peripheral wall of the light-transmitting hole 11 enclose a potting groove for accommodating liquid glue.

[0137] After completing step S3 and proceeding to step S4, liquid glue is injected into the potting mold 200 by means of potting or vacuum potting.

[0138] Moreover, during the above process, the thickness of the liquid glue in the direction perpendicular to the surface of the substrate 1 is controlled such that the ratio range of this thickness to the thickness of the lamp bead 2 is between 1 / 2 and 3 / 4.

[0139] The thickness of the part of the liquid glue covering the outer peripheral wall of the substrate 1 in the direction perpendicular to the surface of the substrate 1 is controlled such that the ratio range of this thickness to the thickness of the substrate 1 is between 1 / 2 and 2 / 3. Specifically, the liquid glue is controlled to flow into and fill the sol tank.

[0140] The liquid glue is controlled to flow between the inner peripheral wall of each light-transmitting hole 11 and the bump 5, and the thickness of the part of the liquid glue adhering to the inner wall of the light-transmitting hole 11 in the direction perpendicular to the surface of the substrate 1 is controlled such that the ratio range of this thickness to the thickness of the substrate 1 is between 1 / 2 and 2 / 3. Specifically, the liquid glue is controlled to flow into and fill the potting groove.

[0141] Before completing step S4 and proceeding to step S5, it further includes step S9 of controlling the liquid glue at the surface, outer periphery, and inner peripheral wall of the substrate 1 to be in the same plane so that the thickness of the part of the liquid glue above the surface of the substrate 1 is consistent. Specifically, the liquid glue can be leveled by means of vibration, shaking, etc. During this process, the bubbles inside the liquid glue can be eliminated simultaneously. Alternatively, the bubbles inside the liquid glue can also be eliminated by means of additional vacuum pumping, etc.

[0142] After completing step S9 and proceeding to step S5, the curing method can be selected from room temperature curing, heat curing, or ultraviolet curing. Exemplarily, when the ultraviolet curing method is selected, ultraviolet light with a wavelength of 340 nm to 400 nm can be used for irradiation curing.

[0143] After completing step S5, the display module 100 formed through the above steps is taken out from the potting mold 200, and then multiple display modules 100 can be assembled as needed to obtain a display screen with a larger display surface. Among them, in the demolded display module 100, a plurality of through holes are formed on the protective layer 3, and the plurality of through holes are arranged in one-to-one correspondence with and communicate with the plurality of light-transmitting holes 11, so that light can pass through.

[0144] That is to say, through the above preparation process of the display module 100, a protective layer 3 can be integrally formed on the substrate 1. Compared with the method of dispensing glue on the opposite sides of the lamp beads 2 in the prior art, the protective layer 3 can simultaneously cover the surface of the substrate 1, the outer peripheral wall of the substrate 1, and the inner peripheral wall of the light-transmitting holes 11 to strengthen and fix the lamp beads 2 in the circumferential direction, significantly improving the thrust of the lamp beads 2; compared with the method of installing a face mask in the prior art, the present application does not need to consider whether the position of the area of the substrate 1 used for installing the lamp beads 2 is sufficient, and since the formed protective layer 3 has a smaller weight than the face mask, it is also convenient to realize the lightweight of the display module 100.

[0145] Although the present invention has been described with reference to several exemplary embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be broadly construed within the spirit and scope defined by the appended claims. Therefore, all changes and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A display module, characterized in that, include: A substrate having a plurality of light-transmitting holes spaced apart thereon; A plurality of lamp beads are arranged at intervals on the surface of the substrate, and the lamp beads are spaced apart from the light-transmitting holes; A protective layer is provided on the surface and outer wall of the substrate, and the protective layer covers the peripheral side of the lamp bead to fix the lamp bead on the substrate; a plurality of through holes are provided on the protective layer, and the plurality of through holes are arranged in a one-to-one correspondence with the plurality of light-transmitting holes and are connected.

2. The display module according to claim 1, wherein The protective layer includes a protective portion and a protection portion, wherein the protective portion is protruding from the surface of the substrate and is located outside the light-transmitting hole, and the protective portion covers the circumference of the lamp bead to fix the lamp bead on the substrate; The protection portion is arranged on the outer peripheral wall of the substrate, the surface of the protection portion protrudes from the surface of the substrate, and the inner wall of the protection portion is connected to the outer periphery of the protection portion; The surface of the protection portion is flush with a side of the shield portion facing away from the substrate.

3. The display module according to claim 2, wherein Along a direction perpendicular to the surface of the substrate, a ratio of the thickness of the protective portion to the thickness of the lamp bead ranges from 1 / 2 to 3 / 4; The distance between the inner wall and the outer wall of the protection portion is 0.15 mm to 0.5 mm; Along a direction perpendicular to the surface of the substrate, a ratio of a thickness of a portion of the protection portion located on the outer peripheral wall of the substrate to a thickness of the substrate is in a range of 1 / 2 to 2 / 3.

4. The display module according to claim 2, wherein The protective layer further includes a plurality of reinforcement portions, each of which is correspondingly arranged on the inner peripheral wall of one of the light-transmitting holes and protrudes out of the surface of the substrate, and the outer periphery of each reinforcement portion is in contact with the protective portion; A side of each reinforcing portion facing away from the base plate is flush with a side of the protecting portion facing away from the base plate.

5. The display module according to claim 4, wherein The reinforcement portion is annular; The distance between the inner wall and the outer wall of the reinforcement portion is 0.15 mm to 0.5 mm; Along a direction perpendicular to the surface of the substrate, a ratio of a thickness of a portion of the reinforcing portion located on the inner peripheral wall of the light-transmitting hole to a thickness of the substrate is in a range of 1 / 2 to 2 / 3.

6. The display module according to claim 1, wherein The protective layer is formed by solidifying liquid black packaging glue on the substrate; The protective layer is prepared from epoxy material, polyurethane material or acrylic material.

7. The display module according to claim 1, wherein The plurality of lamp beads are distributed in an array on the surface of the substrate; the substrate includes a plurality of mounting portions distributed at intervals, with at least one light-transmitting hole provided between two adjacent mounting portions; each mounting portion is provided with a corresponding row of lamp beads; and the ratio of the width of the mounting portion to the width of the lamp beads is in a range of 1.2 to 1.5; The display module includes a plurality of solder pads, which are arranged in an array on the surface of the substrate, and the plurality of solder pads are fixedly connected to the plurality of lamp beads in a one-to-one correspondence; The display module further includes a plurality of driving chips, which are arranged on the substrate, and the driving chips and the lamp beads are arranged on two opposite sides of the substrate.

8. A potting mold for preparing the display module according to any one of claims 1 to 7, the display module comprising a substrate and a plurality of lamp beads spaced on the surface of the substrate, characterized in that, The glue pouring mold comprises: The mold body has a top opening formed with a receiving groove, the receiving groove being used to receive a substrate on which a plurality of lamp beads are arranged and liquid glue; A plurality of bumps are convexly arranged at intervals on the top surface of the bottom wall of the mold body, and the arrangement positions of the plurality of bumps on the mold body correspond one-to-one to the arrangement positions of the plurality of light-transmitting holes on the substrate; the bumps can extend into the corresponding light-transmitting holes.

9. The potting mold according to claim 8, wherein The peripheral side wall of the mold body includes a glue-blocking part and a glue-containing part that are connected vertically. The glue-blocking part is connected between the top surface of the bottom wall of the mold body and the glue-containing part, and the glue-blocking part protrudes inward in the circumferential direction beyond the glue-containing part; The distance between the inner circumferential side of the glue-blocking part and the inner circumferential side of the glue-containing part is 0.2 mm to 0.6 mm; The ratio range of the height of the glue-blocking part to the thickness of the substrate is 1 / 3 to 1 / 2; The inner circumferential side of the glue-containing part is used to form a first interval with the outer peripheral wall of the substrate, and the distance of the first interval is 0.15 mm to 0.5 mm.

10. The potting mold according to claim 8, characterized in that, The height of each bump is greater than the thickness of the substrate, so that when the bump extends into the corresponding light-transmitting hole, the bump can protrude from the surface of the substrate; In the direction perpendicular to the surface of the substrate, the relationship between the height h of the bump protruding from the surface of the substrate and the thickness l of the lamp bead is: h≥0.5l.

11. The potting mold according to claim 8, wherein, Each bump includes a first boss and a second boss that are connected vertically. The first boss is fixed between the top surface of the bottom wall of the mold body and the second boss; the first boss protrudes outward in the circumferential direction beyond the second boss; The distance between the outer circumferential side of the first boss and the inner circumferential side of the second boss is 0.2 to 0.6 mm; The ratio range of the height of the first boss to the thickness of the substrate is 1 / 3 to 1 / 2; The outer circumferential side of the second boss is used to form a second interval with the inner circumferential wall of the light-transmitting hole, and the distance of the second interval is 0.15 mm to 0.5 mm.

12. A manufacturing process of a display module, characterized in that, For manufacturing the display module according to any one of claims 1 to 7, the manufacturing process of the display module includes: Providing a substrate and arranging a plurality of light-transmitting holes at intervals on the substrate; Arranging a plurality of lamp beads at intervals on the surface of the substrate; Providing a potting mold according to any one of claims 8 to 11, and arranging the substrate with a plurality of lamp beads in the potting mold, so that when each bump of the potting mold extends into a corresponding light-transmitting hole on the substrate; Injecting liquid glue into the potting mold until it covers the surface and the outer periphery of the substrate and wraps around the outer periphery of the lamp beads; Curing the liquid glue to form a protective layer to fix the lamp beads on the substrate; a plurality of through holes are formed on the protective layer, and the plurality of through holes are arranged and communicated with the plurality of light-transmitting holes one-to-one.

13. The manufacturing process of the display module according to claim 12, characterized in that, When injecting liquid glue into the potting mold, controlling the thickness of the liquid glue in the direction perpendicular to the surface of the substrate, so that the ratio range of the thickness to the thickness of the lamp bead is 1 / 2 to 3 / 4; and / or, Controlling the thickness of the part of the liquid glue covering the outer peripheral wall of the substrate in the direction perpendicular to the surface of the substrate, so that the ratio range of the thickness to the thickness of the substrate is 1 / 2 to 2 / 3; and / or, Control the liquid glue to flow into the space between the inner peripheral wall of each of the light-transmitting holes and the bump, and control the thickness of the part of the liquid glue adhering to the inner wall of the light-transmitting hole in the direction perpendicular to the surface of the substrate, such that the ratio of this thickness to the thickness of the substrate ranges from 1 / 2 to 2 / 3.

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