Material taking mechanism for wafer cleaning machine and using method of material taking mechanism

Abstract

The invention discloses a material taking mechanism for a wafer cleaning machine and a use method of the material taking mechanism, and belongs to the technical field of wafer cleaning and material taking. By arranging a reciprocating screw rod, a reciprocating screw sleeve, an electric push rod, an I-shaped mounting plate and a pneumatic suction cup, the electric push rod is controlled to extend to push the I-shaped mounting plate to be close to a wafer disc; the electric push rod is controlled to continuously extend until four pneumatic suckers at the bottom of the I-shaped mounting plate are tightly attached to the surface of the wafer disc, so that the I-shaped mounting plate extrudes buffer springs to deform, the pneumatic suckers are tightly pressed on the surface of the wafer disc under the rebound action of the buffer springs, and the pneumatic suckers are adsorbed and fixed to the surface of the wafer disc; and a rotary motor is started again to enable a reciprocating screw sleeve to drive an electric push rod and an I-shaped mounting plate to move, the wafer discs are pulled out from the interior of a U-shaped placement groove to move to a designated position for cleaning, and therefore the batch wafer discs can be conveniently taken and placed to the designated position for cleaning.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer cleaning and picking, and specifically relates to a picking mechanism for a wafer cleaning machine and its usage method. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. Its raw material is silicon, usually extracted from sand. In the field of semiconductor manufacturing, as the core basic material, every link in the production and processing process of the wafer is crucial. Wafer cleaning is one of the key processes to ensure the quality and performance of the wafer, which can effectively remove impurities, particles, and chemical residues contaminated on the wafer surface during the manufacturing process, thereby ensuring the smooth progress of subsequent chip manufacturing processes and the yield rate of chips. With the rapid development of the semiconductor industry, higher and higher requirements are put forward for the precision, efficiency, and production capacity of wafer manufacturing. When using a wafer cleaning machine to clean wafers, a picking mechanism is often used to move the wafers from the placement seat to the wafer cleaning machine for cleaning, so as to improve the efficiency of wafer cleaning.

[0003] When the existing picking mechanism for a wafer cleaning machine picks up a wafer disk, it generally adsorbs on the surface of the wafer disk through a suction cup for adsorption and picking. When the suction cup is pressed tightly against the surface of the wafer disk, affected by the pressure, when the pressure is small, the adsorption between the suction cup and the wafer disk is unstable, resulting in the wafer disk falling during the movement process. When the pressure is large, it is easy to cause the suction cup to squeeze the wafer disk and damage the wafer disk. Therefore, improvement is needed. Summary of the Invention

[0004] In order to overcome the above defects, the present invention provides a picking mechanism for a wafer cleaning machine and its usage method, which solves the problem that when the existing picking mechanism for a wafer cleaning machine picks up a wafer disk, it generally adsorbs on the surface of the wafer disk through a suction cup for adsorption and picking. When the suction cup is pressed tightly against the surface of the wafer disk, affected by the pressure, when the pressure is small, the adsorption between the suction cup and the wafer disk is unstable, resulting in the wafer disk falling during the movement process. When the pressure is large, it is easy to cause the suction cup to squeeze the wafer disk and damage the wafer disk.

[0005] To achieve the above object, the present invention provides the following technical solution: A material taking mechanism for a wafer cleaning machine, including a base, a wafer placing seat is slidably installed inside the base, two support frames are symmetrically and fixedly installed on one side of the surface of the wafer placing seat, a fixing mechanism is fixedly installed at the central position between the two support frames on the surface of the wafer placing seat, a plurality of U-shaped placing grooves are equidistantly arranged on the inner wall of the wafer placing seat, rubber cushion pads are respectively fixedly installed at the top and bottom of the inner wall of the U-shaped placing groove, a wafer disk is slidably installed through the inside of the U-shaped placing groove, a moving top frame is fixedly installed on the top of the base, a moving seat is slidably installed inside the moving top frame, electric push rods are symmetrically and fixedly installed on both sides of the moving seat, and the bottom ends of the two electric push rods pass through the moving seat and are fixedly installed with an I-shaped mounting plate.

[0006] As a further solution of the present invention: The fixing mechanism includes a rectangular plate, two installation grooves are respectively symmetrically arranged inside both sides of the rectangular plate, a moving chute is communicated at one end of the installation groove located inside the rectangular plate, rectangular chutes are respectively arranged on both sides of the rectangular plate, and the installation groove is communicated with the rectangular chute, a moving rod is slidably installed through the inside of the installation groove, and both ends of the moving rod pass through the installation groove and extend into the moving chute and the rectangular chute respectively.

[0007] As a further solution of the present invention: A limiting plate is fixedly installed on the surface of the moving rod close to the rectangular chute inside the installation groove, a fixing spring is sleeved on the surface of the moving rod located inside the installation groove, the two moving rods on the same side of the rectangular plate pass through the moving chute and are fixedly connected with a connecting strip, a trapezoidal clamping block is slidably installed through the inside of the rectangular chute, and the trapezoidal clamping block is fixedly connected with one end of the moving rod located inside the rectangular chute.

[0008] As a further solution of the present invention: The base includes a placing box, a U-shaped top plate is fixedly installed on the top of the placing box, support bars are respectively fixedly installed at the central positions of both sides of the bottom of the opening of the U-shaped top plate, and the support bars are fixedly connected with one side of the placing box, trapezoidal clamping grooves are respectively arranged on the inner wall of the placing box far away from the support bar, and the positions of the trapezoidal clamping grooves correspond to and have the same shape as the trapezoidal clamping blocks.

[0009] As a further solution of the present invention: Limiting chutes are symmetrically arranged on both sides of the inner wall of the moving top frame, a reciprocating lead screw is rotatably installed through the bearing at the central position of both sides inside the moving top frame, one end of the reciprocating lead screw passes through the moving top frame and is fixedly installed with a gear one, a rotating motor is fixedly installed at the central position of one side of the moving top frame close to the gear one, and an output end of the rotating motor is fixedly installed with a gear two, and the gear two and the gear one are meshed with each other.

[0010] As a further solution of the present invention: The moving seat includes a reciprocating nut sleeve, which is threadedly connected through the surface of the reciprocating screw rod. On both sides of the reciprocating nut sleeve, mounting side plates are symmetrically and fixedly installed. On one side of the mounting side plate away from the reciprocating nut sleeve, a limit roller is rotatably installed through a rotating shaft, and the limit roller is slidably connected inside the limit chute.

[0011] As a further solution of the present invention: Buffer rods are respectively installed through the four corners of the I-shaped mounting plate in a sliding manner. The top of the buffer rod passes through the I-shaped mounting plate and is fixedly installed with a limit top plate. One end of the buffer rod at the bottom of the I-shaped mounting plate is fixedly installed with a pneumatic suction cup. An anti-detachment sleeve is fixedly installed on the surface of the buffer rod at the bottom of the pneumatic suction cup. A buffer spring is provided on the surface of the buffer rod between the I-shaped mounting plate and the anti-detachment sleeve.

[0012] A method of using a material taking mechanism for a wafer cleaning machine, the method of use includes the following steps:

[0013] After the handling base moves to the designated position, a plurality of wafer trays are sequentially inserted into the U-shaped placement groove, so that the surface of the wafer tray presses the surface of the rubber gasket, and the wafer tray is clamped and fixed inside the U-shaped placement groove. Then, the wafer placement seat with a plurality of wafer trays is inserted into the placement box. When the wafer placement seat is inserted into the placement box, the trapezoidal block is in close contact with the inner wall of the placement box, pushing the trapezoidal block to shrink into the rectangular chute, so that the moving rod drives the limit plate to slide inside the installation groove, squeezing the fixing spring to deform inside the installation groove until the positions of the trapezoidal block and the trapezoidal card slot correspond. The fixing spring rebounds to push up the limit plate to reset inside the installation groove, so that the trapezoidal block pops out of the rectangular chute and is clamped into the trapezoidal card slot, thereby clamping and fixing the wafer placement seat inside the placement box, and making the opening of the wafer placement seat fit and correspond to the opening of the U-shaped top plate;

[0014] Control the rotation of the rotation motor through the meshing of the second gear and the first gear, so that the reciprocating screw rod rotates inside the moving top frame, and the reciprocating nut sleeve moves on the surface of the reciprocating screw rod until the reciprocating nut sleeve drives the I-shaped mounting plate to move to the top of the wafer tray. Control the electric push rod to extend and push the I-shaped mounting plate down to approach the wafer tray until the pneumatic suction cup is tightly attached to the top of the wafer tray. Control the electric push rod to continue to push the I-shaped mounting plate down to approach the wafer tray, so that the buffer spring is deformed by squeezing between the anti-detachment sleeve and the I-shaped mounting plate. Under the rebounding action of the buffer spring, the pneumatic suction cup adsorbs and presses tightly on the top of the wafer tray. The reciprocating nut sleeve moves on the surface of the reciprocating screw rod to drive the pneumatic suction cup to draw out the wafer tray from the U-shaped placement groove until the wafer tray is drawn out of the U-shaped placement groove and away from the placement box. Control the telescopic movement of the electric push rod to place the wafer tray at the designated position and then release the pneumatic suction cup, so that the wafer tray is placed at the designated position for cleaning, which is convenient for taking and placing the wafer tray.

[0015] Meanwhile, the reciprocating screw sleeve moves reciprocally as the reciprocating screw rod rotates, so as to sequentially extract the multiple crystal discs placed inside the wafer placement seat and place them at a designated position for cleaning. After all the crystal discs inside the wafer placement seat are completely extracted, the connecting bar is pushed to drive the moving rod to slide inside the installation groove, so that the trapezoidal clamping block disengages from the trapezoidal clamping groove and retracts into the rectangular sliding groove, and the wafer placement seat is extracted from the placement box for replacement, improving the cleaning efficiency of the batch of crystal discs.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] 1. In the present invention, by setting the reciprocating screw rod, the reciprocating screw sleeve, the electric push rod, the I-shaped mounting plate and the pneumatic suction cup, the rotation motor is started to control the second gear to rotate. Under the meshing of the second gear and the first gear, the reciprocating screw rod is controlled to rotate synchronously, so that the reciprocating screw sleeve reciprocates on the surface of the reciprocating screw rod, driving the electric push rod and the I-shaped mounting plate to be suspended above the crystal disc and then stopping the rotation motor. The electric push rod is controlled to extend to push the I-shaped mounting plate close to the crystal disc until the four pneumatic suction cups at the bottom of the I-shaped mounting plate are tightly attached to the surface of the crystal disc. The electric push rod is controlled to continue to extend, so that the I-shaped mounting plate squeezes the buffer spring to deform. Under the resilience of the buffer spring, the pneumatic suction cup is pressed tightly on the surface of the crystal disc, so that the pneumatic suction cup is adsorbed and fixed on the surface of the crystal disc, avoiding damage to the crystal disc caused by the pneumatic suction cup squeezing the crystal disc. The rotation motor is started again to make the reciprocating screw sleeve drive the electric push rod and the I-shaped mounting plate to move, extracting the crystal disc from the U-shaped placement groove and moving it to a designated position for cleaning, thus facilitating the taking and placing of the batch of crystal discs to a designated position for cleaning.

[0018] 2. In the present invention, by setting the placement box, the wafer placement seat, the moving rod, the fixing spring and the trapezoidal clamping block, the wafer placement seat is inserted into the placement box. The trapezoidal clamping block is in close contact with the inner wall of the placement box. The inner wall of the placement box squeezes the trapezoidal clamping block to push the trapezoidal clamping block into the rectangular sliding groove, jacking up the moving rod to drive the limiting plate to slide inside the installation groove, so that the fixing spring is squeezed and deformed inside the installation groove until the wafer placement seat is completely inserted into the placement box. After the positions of the trapezoidal clamping block and the trapezoidal clamping groove correspond to each other, the fixing spring rebounds to jack up the limiting plate to reset inside the installation groove, driving the moving rod to push the trapezoidal clamping block out of the rectangular sliding groove and snap into the trapezoidal clamping groove, thereby clamping and fixing the wafer placement seat inside the placement box, facilitating the disassembly, replacement and clamping and fixing of the wafer placement seat, and improving the cleaning efficiency of the crystal discs clamped and placed inside the wafer placement seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic cross-sectional structure diagram of the present invention;

[0020] Figure 2 is a schematic structure diagram of the placement box and the U-shaped top plate of the present invention;

[0021] Figure 3 Schematic cross-sectional structure diagram of the wafer placement seat and rectangular plate of the present invention;

[0022] Figure 4 of the present invention Figure 3 Enlarged structure diagram at position A in;

[0023] Figure 5 Schematic cross-sectional structure diagram of the moving top frame, moving seat and electric push rod of the present invention;

[0024] Figure 6 Schematic structure diagram of the I-shaped mounting plate, buffer rod and pneumatic suction cup of the present invention;

[0025] In the figure: 1. Base; 101. Placement box; 102. U-shaped top plate; 103. Support bar; 104. Trapezoidal card slot; 2. Wafer placement seat; 201. Support frame; 202. U-shaped placement groove; 203. Rubber gasket; 3. Fixing mechanism; 301. Rectangular plate; 302. Installation groove; 303. Moving chute; 304. Rectangular chute; 305. Moving rod; 306. Limiting plate; 307. Fixing spring; 308. Connecting bar; 309. Trapezoidal card block; 4. Crystal disc; 5. Moving top frame; 501. Limiting chute; 502. Reciprocating lead screw; 503. Gear one; 504. Rotating motor; 505. Gear two; 6. Moving seat; 601. Reciprocating nut sleeve; 602. Installation side plate; 603. Limiting roller; 7. Electric push rod; 8. I-shaped mounting plate; 801. Buffer rod; 802. Limiting top plate; 803. Pneumatic suction cup; 804. Anti-disengagement sleeve; 805. Buffer spring. Specific embodiments

[0026] The technical solutions of the present application will be further described in detail below in conjunction with specific embodiments.

[0027] As Figures 1-6 shown, the present invention provides a technical solution: a material taking mechanism for a wafer cleaning machine, including a base 1, the base 1 includes a placement box 101, the top of the placement box 101 is fixedly installed with a U-shaped top plate 102, and the central positions on both sides of the bottom of the opening of the U-shaped top plate 102 are respectively fixedly installed with support bars 103, and the support bars 103 are fixedly connected to one side of the placement box 101. The top end and an adjacent side of the placement box 101 are open, and a U-shaped wafer placement seat 2 is slidably installed inside the placement box 101. The wafer placement seat 2 is clamped and fixed inside the placement box 101, so that the outer side wall of the opening of the wafer placement seat 2 is attached to the U-shaped top plate 102, thereby ensuring that when the crystal disc 4 inside the wafer placement seat 2 is taken, it will not be blocked and affect the taking efficiency of the crystal disc 4.

[0028] The inner wall of the wafer placement seat 2 is provided with a plurality of U-shaped placement grooves 202 at equal distances in the vertical and horizontal levels. Rubber cushion pads 203 are fixedly installed at the top and bottom of the inner wall of the U-shaped placement groove 202 respectively. A crystal disc 4 is slidably installed through the U-shaped placement groove 202. Due to the provision of the U-shaped placement groove 202 and the rubber cushion pads 203, the crystal disc 4 is correspondingly inserted into the U-shaped placement groove 202. The edge surface of the crystal disc 4 presses the rubber cushion pads 203, causing the rubber cushion pads 203 to be squeezed and deformed between the inner wall of the U-shaped placement groove 202 and the surface of the crystal disc 4, thereby clamping the crystal disc 4 and placing it inside the U-shaped placement groove 202 to ensure that the crystal disc 4 is clamped inside the U-shaped placement groove 202 and will not easily fall off.

[0029] On one side of the surface of the wafer placement seat 2, support frames 201 are symmetrically and fixedly installed on the left and right. A fixing mechanism 3 is fixedly installed at the central position between the two support frames 201 on the surface of the wafer placement seat 2. The fixing mechanism 3 includes a rectangular plate 301. Specifically, the ends of the support frames 201 are in a groove shape, and both ends of the rectangular plate 301 are fixed in the grooves. Two installation grooves 302 are symmetrically provided respectively inside both sides of the rectangular plate 301. A moving chute 303 is provided at one end inside the rectangular plate 301 and communicates with the installation groove 302. Rectangular chutes 304 are provided respectively on the other side of both sides of the rectangular plate 301 opposite to the installation groove 302 and the moving chute 303, and the installation groove 302 communicates with the rectangular chute 304; A moving rod 305 is slidably installed through the installation groove 302, and both ends of the moving rod 305 pass through the installation groove 302 and extend into the moving chute 303 and the rectangular chute 304 respectively. A limiting plate 306 is fixedly installed on the surface of the moving rod 305 close to the rectangular chute 304 inside the installation groove 302, and a fixing spring 307 is sleeved on the surface of the moving rod 305 inside the installation groove 302.

[0030] Two moving rods 305 pass through the moving chute 303 and are fixedly connected to a connecting strip 308. A trapezoidal clamping block 309 is slidably installed through both ends of the two sides of the rectangular plate 301 inside the rectangular chute 304, and the trapezoidal clamping block 309 is fixedly connected to one end of the moving rod 305 inside the rectangular chute 304.

[0031] Trapezoidal clamping grooves 104 are provided respectively on both sides of the inner wall of the placement box 101 far away from the support strip 103. The trapezoidal clamping grooves 104 correspond to the positions of the trapezoidal clamping blocks 309 and have the same shape. Due to the provision of the trapezoidal clamping blocks 309 and the trapezoidal clamping grooves 104, after the trapezoidal clamping blocks 309 are clamped into the trapezoidal clamping grooves 104, the wafer placement seat 2 is clamped and fixed inside the placement box 101 to ensure that the wafer placement seat 2 is clamped inside the placement box 101 and will not be separated randomly, and at the same time, it is convenient to disassemble or install the wafer placement seat 2.

[0032] Push the connecting bar 308 to move left and right in the moving chute 303, drive the moving rod 305 to slide inside the installation groove 302, so that the trapezoidal clamping block 309 retracts into the rectangular chute 304. At the same time, the limiting plate 306 synchronously squeezes and deforms the fixed spring 307 inside the installation groove 302. When the wafer placement seat 2 is placed inside the placement box 101 and the positions of the trapezoidal clamping block 309 and the trapezoidal card slot 104 correspond to each other, release the connecting bar 308. Under the action of the elastic return of the fixed spring 307, the limiting plate 306 is lifted to reset inside the installation groove 302, and the moving rod 305 is pushed to push the trapezoidal clamping block 309 out of the rectangular chute 304 and snap into the trapezoidal card slot 104, thereby clamping and fixing the wafer placement seat 2 inside the placement box 101.

[0033] A moving top frame 5 is fixedly installed at the top of the U-shaped top plate 102. At the central positions on both sides inside the moving top frame 5, a reciprocating lead screw 502 is rotatably installed through a bearing. One end of the reciprocating lead screw 502 passes through the moving top frame 5 and is fixedly installed with a first gear 503. At the central position on one side of the moving top frame 5 near the first gear 503, a rotating motor 504 is fixedly installed. The output end of the rotating motor 504 is fixedly installed with a second gear 505, and the second gear 505 and the first gear 503 mesh with each other. A moving seat 6 is slidably installed inside the moving top frame 5. The moving seat 6 includes a reciprocating nut sleeve 601. The reciprocating nut sleeve 601 is threadedly connected through the surface of the reciprocating lead screw 502. By providing the reciprocating lead screw 502, starting the rotating motor 504 drives the second gear 505 to rotate. Since the second gear 505 meshes with the first gear 503, the reciprocating lead screw 502 is controlled to rotate inside the moving top frame 5. When the rotating motor 504 rotates forward and backward, the reciprocating nut sleeve 601 reciprocates on the surface of the reciprocating lead screw 502, driving the I-shaped mounting plate 8 at the bottom of the moving seat 6 to move to the designated position.

[0034] Limiting chutes 501 are symmetrically arranged on the other two sides of the inner wall of the moving top frame 5. Installation side plates 602 are symmetrically and fixedly installed on both sides of the reciprocating nut sleeve 601. On the side of the installation side plate 602 away from the reciprocating nut sleeve 601, a limiting roller 603 is rotatably installed through a rotating shaft, and the limiting roller 603 is slidably connected inside the limiting chute 501. Due to the provision of the limiting chute 501 and the limiting roller 603, when the reciprocating nut sleeve 601 drives the installation side plate 602 to move inside the moving top frame 5 as the reciprocating lead screw 502 rotates, the limiting roller 603 rolls inside the corresponding limiting chute 501, thereby reducing the friction when the installation side plate 602 moves on the inner wall of the moving top frame 5. At the same time, the movement of the reciprocating nut sleeve 601 on the surface of the reciprocating lead screw 502 is limited to ensure that the reciprocating nut sleeve 601 does not tilt and deflect as the reciprocating lead screw 502 rotates.

[0035] An electric push rod 7 is fixedly installed on the installation side plate 602. The bottom ends of the two electric push rods 7 pass through the installation side plate 602 and are fixedly installed with an I-shaped installation plate 8. Buffer rods 801 are respectively installed through the four corners of the I-shaped installation plate 8 in a sliding manner. The top ends of the buffer rods 801 pass through the I-shaped installation plate 8 and are fixedly installed with limit top plates 802. One end of the buffer rod 801 located at the bottom of the I-shaped installation plate 8 is fixedly installed with a pneumatic suction cup 803. A anti-disengagement sleeve 804 is fixedly installed on the surface of the bottom end of the buffer rod 801 above the pneumatic suction cup 803. A buffer spring 805 is arranged on the surface of the buffer rod 801 between the I-shaped installation plate 8 and the anti-disengagement sleeve 804. By providing the buffer spring 805, when the pneumatic suction cup 803 contacts the surface of the crystal disk 4, the I-shaped installation plate 8 is controlled to continue to press down, so that the buffer spring 805 is squeezed and deformed between the I-shaped installation plate 8 and the anti-disengagement sleeve 804. Under the rebounding action of the buffer spring 805, the pneumatic suction cup 803 is pressed tightly on the surface of the crystal disk 4, so that the pneumatic suction cup 803 is adsorbed and fixed on the surface of the crystal disk 4, ensuring that the pneumatic suction cup 803 is buffered when pressed tightly on the surface of the crystal disk 4 and will not damage the crystal disk 4. At the same time, the buffer spring 805 is squeezed and deformed inside the anti-disengagement sleeve 804, ensuring that the buffer spring 805 will not tilt and disengage from the surface of the buffer rod 801.

[0036] A method for using a material taking mechanism for a wafer cleaning machine, the method for using includes the following steps:

[0037] After the handling base 1 moves to the designated position, a plurality of crystal disks 4 are sequentially inserted into the U-shaped placement groove 202, so that the surface of the crystal disk 4 squeezes the surface of the rubber gasket 203, and the crystal disk 4 is clamped and fixed inside the U-shaped placement groove 202. Then, the wafer placement seat 2 with a plurality of crystal disks 4 is inserted into the placement box 101. When the wafer placement seat 2 is inserted into the placement box 101, the trapezoidal block 309 is in close contact with the inner wall of the placement box 101, and the trapezoidal block 309 is pushed to retract into the rectangular sliding groove 304, so that the moving rod 305 drives the limiting plate 306 to slide inside the installation groove 302, squeezing the fixing spring 307 to deform inside the installation groove 302 until the position of the trapezoidal block 309 corresponds to the trapezoidal slot 104. The fixing spring 307 rebounds to push up the limiting plate 306 to reset inside the installation groove 302, so that the trapezoidal block 309 pops out of the rectangular sliding groove 304 and is clamped into the trapezoidal slot 104, thereby clamping and fixing the wafer placement seat 2 inside the placement box 101, and making the opening of the wafer placement seat 2 fit and correspond to the opening of the U-shaped top plate 102;

[0038] Control the rotation of the rotating motor 504 through the meshing of the second gear 505 and the first gear 503, so that the reciprocating lead screw 502 rotates inside the moving top frame 5. The reciprocating nut 601 moves on the surface of the reciprocating lead screw 502 until the reciprocating nut 601 drives the I-shaped mounting plate 8 to move to the top of the crystal disk 4. Control the electric push rod 7 to extend and push the I-shaped mounting plate 8 downward to approach the crystal disk 4 until the pneumatic suction cup 803 is tightly attached to the top of the crystal disk 4. Control the electric push rod 7 to continue to push the I-shaped mounting plate 8 downward to approach the crystal disk 4, so that the buffer spring 805 is squeezed and deformed between the anti-detachment sleeve 804 and the I-shaped mounting plate 8. Under the rebounding action of the buffer spring 805, the pneumatic suction cup 803 is adsorbed and pressed tightly on the top of the crystal disk 4. The reciprocating nut 601 moves on the surface of the reciprocating lead screw 502 to drive the crystal disk 4 to be drawn out from the inside of the U-shaped placement groove 202. Until the crystal disk 4 is drawn out of the U-shaped placement groove 202 and away from the placement box 101, control the telescopic movement of the electric push rod 7 to place the crystal disk 4 at the designated position and then release the pneumatic suction cup 803, so that the crystal disk 4 is placed at the designated position for cleaning, which is convenient for taking and placing the crystal disk 4;

[0039] At the same time, the reciprocating nut 601 moves reciprocally with the rotation of the reciprocating lead screw 502, so as to sequentially draw out the multiple crystal disks 4 placed inside the wafer placement seat 2 and place them at the designated position for cleaning. After all the crystal disks 4 inside the wafer placement seat 2 are completely drawn out, push the connecting bar 308 to drive the moving rod 305 to slide inside the installation groove 302, so that the trapezoidal block 309 disengages from the trapezoidal card slot 104 and retracts into the rectangular sliding groove 304, and draw out the wafer placement seat 2 from the inside of the placement box 101 for replacement, improving the cleaning efficiency of the batch of crystal disks 4.

[0040] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0041] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0042] In the present invention, unless otherwise clearly specified or defined, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or a communication connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication between two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In the present invention, unless otherwise clearly specified or defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the description with reference to terms such as "one solution", "some solutions", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the solution or example are included in at least one solution or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same solution or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more solutions or examples.

Claims

1. A material taking mechanism for a wafer cleaning machine, comprising a base (1), characterized in that: A wafer placement seat (2) is slidably installed inside the base (1). On one side of the surface of the wafer placement seat (2), support frames (201) are symmetrically and fixedly installed. A fixing mechanism (3) is fixedly installed at the central position between the two support frames (201) on the surface of the wafer placement seat (2). A plurality of U-shaped placement grooves (202) are equidistantly arranged on the inner wall of the wafer placement seat (2). Rubber cushion pads (203) are respectively fixedly installed at the top and bottom of the inner wall of the U-shaped placement groove (202). A wafer disc (4) is slidably installed through the U-shaped placement groove (202). A moving top frame (5) is fixedly installed at the top of the base (1). A moving seat (6) is slidably installed inside the moving top frame (5). Electric push rods (7) are symmetrically and fixedly installed on both sides of the moving seat (6). The bottom ends of the two electric push rods (7) pass through the moving seat (6) and are fixedly installed with I-shaped mounting plates (8).

2. The material taking mechanism for a wafer cleaning machine according to claim 1, wherein: The fixing mechanism (3) includes a rectangular plate (301). Two mounting grooves (302) are symmetrically arranged inside both sides of the rectangular plate (301). A moving chute (303) is communicated at one end of the mounting groove (302) located inside the rectangular plate (301). Rectangular chutes (304) are respectively arranged on both sides of the rectangular plate (301), and the mounting groove (302) is communicated with the rectangular chute (304). A moving rod (305) is slidably installed through the mounting groove (302). The two ends of the moving rod (305) pass through the mounting groove (302) and extend into the moving chute (303) and the rectangular chute (304) respectively.

3. The material taking mechanism for a wafer cleaning machine according to claim 2, characterized in that: A limiting plate (306) is fixedly installed on the surface of the moving rod (305) close to one side of the rectangular chute (304) inside the mounting groove (302). A fixing spring (307) is sleeved on the surface of the moving rod (305) inside the mounting groove (302). The two moving rods (305) on the same side of the rectangular plate (301) pass through the moving chute (303) and are fixedly connected with a connecting bar (308). A trapezoidal clamping block (309) is slidably installed through the rectangular chute (304). The trapezoidal clamping block (309) is fixedly connected with one end of the moving rod (305) located inside the rectangular chute (304).

4. The material taking mechanism for a wafer cleaning machine according to claim 3, wherein: The base (1) includes a placement box (101). A U-shaped top plate (102) is fixedly installed at the top of the placement box (101). Support bars (103) are respectively fixedly installed at the central positions on both sides of the bottom of the opening of the U-shaped top plate (102), and the support bars (103) are fixedly connected with one side of the placement box (101). Trapezoidal clamping grooves (104) are respectively arranged on the inner wall of the placement box (101) away from the support bar (103). The trapezoidal clamping grooves (104) correspond to the positions of the trapezoidal clamping blocks (309) and have the same shape.

5. The material taking mechanism for a wafer cleaning machine according to claim 1, wherein: On both sides of the inner wall of the moving top frame (5), there are symmetrically arranged limiting sliding grooves (501). At the central positions on both sides inside the moving top frame (5), a reciprocating lead screw (502) is rotatably installed through bearings. One end of the reciprocating lead screw (502) passes through the moving top frame (5) and is fixedly installed with a first gear (503). At the central position on one side of the top of the moving top frame (5) close to the first gear (503), a rotating motor (504) is fixedly installed. The output end of the rotating motor (504) is fixedly installed with a second gear (505), and the second gear (505) meshes with the first gear (503).

6. The material taking mechanism for a wafer cleaning machine according to claim 5, characterized in that: The moving seat (6) includes a reciprocating nut sleeve (601). The reciprocating nut sleeve (601) is threadedly connected through the surface of the reciprocating lead screw (502). On both sides of the reciprocating nut sleeve (601), there are symmetrically fixedly installed mounting side plates (602). On the side of the mounting side plate (602) away from the reciprocating nut sleeve (601), a limiting roller (603) is rotatably installed through a rotating shaft, and the limiting roller (603) is slidably connected inside the limiting sliding groove (501).

7. The material taking mechanism for a wafer cleaning machine according to claim 1, characterized in that: At the four corners of the I-shaped mounting plate (8), buffer rods (801) are respectively installed through sliding. The top end of the buffer rod (801) passes through the I-shaped mounting plate (8) and is fixedly installed with a limiting top plate (802). At one end of the buffer rod (801) located at the bottom of the I-shaped mounting plate (8), a pneumatic suction cup (803) is fixedly installed. At the surface of the top of the pneumatic suction cup (803) at the bottom end of the buffer rod (801), an anti-detachment sleeve (804) is fixedly installed. A buffer spring (805) is arranged on the surface of the buffer rod (801) between the I-shaped mounting plate (8) and the anti-detachment sleeve (804).

8. A method of using a wafer picking mechanism for a wafer cleaning machine, according to any one of claims 1-7, a wafer picking mechanism for a wafer cleaning machine, characterized in that: The usage method includes the following steps: After the handling base (1) is moved to the designated position, a plurality of crystal disks (4) are sequentially inserted into the U-shaped placement groove (202) so that the surface of the crystal disk (4) presses the surface of the rubber cushion (203), and the crystal disk (4) is clamped and fixed inside the U-shaped placement groove (202). Then, the wafer placement seat (2) with a plurality of crystal disks (4) is inserted into the placement box (101). When the wafer placement seat (2) is inserted into the placement box (101), the trapezoidal block (309) is in close contact with the inner wall of the placement box (101), pushing the trapezoidal block (309) to shrink into the rectangular sliding groove (304), so that the moving rod (305) drives the limiting plate (3) to slide inside the installation groove (302), squeezing the fixing spring (307) to deform inside the installation groove (302) until the position of the trapezoidal block (309) corresponds to the trapezoidal slot (104). The fixing spring (307) rebounds to push up the limiting plate (306) to reset inside the installation groove (302), so that the trapezoidal block (309) pops out of the rectangular sliding groove (304) and is clamped into the trapezoidal slot (104), thereby clamping and fixing the wafer placement seat (2) inside the placement box (101), and making the opening of the wafer placement seat (2) fit and correspond to the opening of the U-shaped top plate (102). Control the rotation of the rotation motor (504). Through the meshing of the second gear (505) and the first gear (503), the reciprocating lead screw (502) rotates inside the moving top bracket (5). The reciprocating nut sleeve (601) moves on the surface of the reciprocating lead screw (502) until the reciprocating nut sleeve (601) drives the I-shaped mounting plate (8) to move to the top of the crystal disc (4). Control the electric push rod (7) to extend and push the I-shaped mounting plate (8) to move downwards close to the crystal disc (4) until the pneumatic suction cup (803) closely adheres to the top of the crystal disc (4). Control the electric push rod (7) to continue pushing the I-shaped mounting plate (8) to press down close to the crystal disc (4) so that the buffer spring (805) is compressed and deformed between the anti-detachment sleeve (804) and the I-shaped mounting plate (8). Under the rebound effect of the buffer spring (805), the pneumatic suction cup (803) adsorbs and presses tightly on the top of the crystal disc (4). The reciprocating nut sleeve (601) moves on the surface of the reciprocating lead screw (502) to drive the crystal disc (4) to be withdrawn from the U-shaped placement groove (202). Until the crystal disc (4) is withdrawn from the U-shaped placement groove (202) and away from the placement box (101), control the telescopic movement of the electric push rod (7) to place the crystal disc (4) at the designated position and then release the pneumatic suction cup (803) so that the crystal disc (4) is placed at the designated position for cleaning, which is convenient for taking and placing the crystal disc (4); At the same time, the reciprocating nut sleeve (601) makes reciprocating movements along with the rotation of the reciprocating lead screw (502), thereby sequentially withdrawing multiple crystal discs (4) placed inside the wafer placement seat (2) and placing them at the designated position for cleaning. After all the crystal discs (4) inside the wafer placement seat (2) are completely withdrawn, push the connecting bar (308) to drive the moving rod (305) to slide inside the installation groove (302) so that the trapezoidal block (309) disengages from the trapezoidal card slot (104) and retracts into the rectangular sliding groove (304), and withdraw the wafer placement seat (2) from the placement box (101) for replacement, improving the cleaning efficiency of the batch of crystal discs (4).

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