A bearing device

Abstract

A carrier device includes a carrier assembly and a drive assembly. The carrier assembly includes a carrier plate, a top film component, a conveyor component, and a drive mechanism. The carrier plate includes an adsorption section, a transition section, and a carrier section. The top film component is disposed in the transition section, and the conveyor component is disposed in the carrier section. The drive mechanism drives the top film component to rise and lift the adhesive film portion of the test piece, thus separating the test piece from the carrier plate. The drive assembly drives the conveyor component to rise and fall, thereby receiving or releasing the test piece through the conveyor component. By adsorbing the test piece using the adsorption section, the test piece can be securely fixed to the carrier plate with its front facing upwards. Furthermore, based on the cooperation between the top film component and the conveyor component, the top film component supports the adhesive film portion of the test piece, preventing the test piece from contacting the carrier plate and adjusting the tension of the adhesive film, allowing the test piece to be carried and fixed with its back facing upwards. Thus, the carrier device possesses dual functions of front and back support, providing support for both front and back inspection operations using the same testing equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor process equipment technology, and specifically to a carrier device. Background Technology

[0002] In semiconductor manufacturing processes, carrier devices are commonly used to support and fix semiconductor workpieces such as wafers, enabling the processing, transportation, and inspection of these workpieces. Taking wafers as an example, since the front side of a wafer is generally designed with circuit patterns, the front side of the wafer cannot directly contact the carrier device.

[0003] Common wafer carriers typically only support the front side, meaning the wafer is fixed to the carrier with its front side facing up. This limits inspection equipment to inspecting only the front side of the wafer. However, with increasingly demanding inspection requirements, it is necessary to inspect both the front and back sides of the wafer. Therefore, developing a wafer carrier that can perform both front and back side support functions to meet the inspection needs of semiconductor workpieces has become a pressing technical problem in this field. Summary of the Invention

[0004] The main technical problem this application addresses is to provide a support device that has both frontal and rear support functions.

[0005] To achieve the above objectives, one embodiment provides a carrying device, including a carrying component and a driving component, wherein the carrying component includes a carrying disk, a top film component, a conveying component, and a driving mechanism; wherein:

[0006] The carrier plate includes an adsorption section, a transition section surrounding the adsorption section, and a carrier section surrounding the transition section. The upper surface of the carrier section is lower than the upper surfaces of the adsorption section and the transition section. The top film member is disposed in the transition section, and the conveying member is disposed in the carrier section.

[0007] The driving mechanism is configured to drive the top film member to move up and down relative to the carrier plate, so as to lift the adhesive film portion of the test piece by the top film member, thereby spacing the test piece from the adsorption portion.

[0008] The drive component is configured to drive the conveyor to move up and down relative to the carrier plate, so as to receive or release the test object through the conveyor.

[0009] In one embodiment, the transition portion is provided with a groove, the top film member is disposed in the groove, and the upper surface of the top film member is lower than the upper surface of the transition portion.

[0010] In one embodiment, the top membrane member includes a top membrane portion near the adsorption portion and a connecting portion surrounding the top membrane portion. The upper surface of the top membrane portion is higher than the upper surface of the connecting portion. The connecting portion is connected to the driving mechanism, and the driving mechanism drives the connecting portion to move the top membrane portion up and down.

[0011] In one embodiment, the driving mechanism includes a first driving member, a first lifting plate, a first lifting column, and a first elastic member; wherein:

[0012] The first end of the first lifting column extends into the groove and connects to the top membrane component. The first driving component is connected to the bearing plate and is used to drive the first lifting plate to rise and fall. The first lifting plate acts on the second end of the first lifting column, driving the first lifting column to lift the top membrane component.

[0013] One end of the first elastic element is connected to the bearing plate, and the other end is connected to the second end of the first lifting column. The first elastic element is used to provide an elastic force that causes the first lifting column to drive the top membrane component to descend.

[0014] In one embodiment, the carrier component further includes a guide structure and / or a limiting structure, wherein:

[0015] The guide structure is used to guide the first lifting plate to move linearly. The guide structure includes a first guide member and a second guide member that are slidably connected. The first guide member is connected to the first lifting plate, and the second guide member is connected to the bearing plate.

[0016] The limiting structure is used to limit the lifting stroke of the first lifting plate. The limiting structure includes a first limiting member and a second limiting member that cooperate with each other. The first limiting member is fixedly disposed relative to the first driving member, and the second limiting member is fixedly disposed relative to the first lifting plate.

[0017] In one embodiment, the conveying component includes a second lifting column and a second elastic member. The second lifting column is disposed through the bearing portion. A first end of the second lifting column is used to contact the test piece. One end of the second elastic member is connected to the bearing plate, and the other end is connected to the second end of the second lifting column.

[0018] The second elastic element is used to provide an elastic force that causes the second lifting column to descend; the driving component acts on the second end of the second lifting column to drive the second lifting column to rise.

[0019] In one embodiment, the support assembly further includes a locking mechanism; the locking mechanism is disposed on the support portion and is used to fix the test piece.

[0020] And / or the carrier assembly further includes one or more first line connectors; the first line connectors are configured to be detachably connected to a second line connector of an external control source to enable a pneumatic or electrical connection between the carrier assembly and the external control source.

[0021] In one embodiment, the support device further includes a first positioning seat for mounting on the motion platform, and the support assembly further includes a second positioning seat for supporting the support plate; the first positioning seat and the second positioning seat are detachably connected to detachably connect the support assembly to the motion platform.

[0022] In one embodiment, the first positioning seat is provided with at least three first positioning elements, and the second positioning seat is provided with at least three second positioning elements arranged around the center of the carrier plate; the first positioning elements and the second positioning elements correspond one-to-one and are inserted and connected to prevent the carrier component from rotating and translating relative to the first positioning seat.

[0023] In one embodiment, the first positioning seat is further provided with a first magnetic suction member, and the second positioning seat is provided with a second magnetic suction member; the first magnetic suction member and the second magnetic suction member are aligned and attracted to prevent the first positioning seat and the second positioning seat from moving along the thickness direction of the bearing plate.

[0024] In one embodiment, the number of the bearing components is set to multiple, and different bearing components are used to carry test pieces of different dimensions; each bearing component includes a second positioning seat that matches the first positioning seat, so that the multiple bearing components can be interchangeably connected to the motion platform.

[0025] In one embodiment, the driving assembly includes a second driving member and a second lifting plate. The second driving member is disposed on the motion platform and is used to drive the second lifting plate to rise and fall. The second lifting plate has a support structure corresponding to the transmission member in different bearing assemblies, and the second lifting plate drives the corresponding transmission member to rise and fall through the support structure.

[0026] In one embodiment, the motion platform includes a support portion and a rotating portion that can be controllably rotated relative to the support portion; the first positioning seat is connected to the rotating portion and rotates synchronously, and the bearing assembly rotates synchronously with the first positioning seat;

[0027] The support portion is provided with a third limiting member, and the bearing assembly further includes a fourth limiting member connected to the bearing plate; the third limiting member cooperates with the fourth limiting member to limit the rotation stroke of the bearing assembly.

[0028] The carrier device according to the above embodiment includes a carrier assembly and a drive assembly. The carrier assembly includes a carrier plate, a top film member, a conveyor member, and a drive mechanism. The carrier plate includes an adsorption section, a transition section, and a carrier section. The top film member is disposed in the transition section, and the conveyor member is disposed in the carrier section. The drive mechanism drives the top film member to rise and lift the adhesive film portion of the test piece, thus separating the test piece from the carrier plate. The drive assembly drives the conveyor member to rise and fall, so as to receive or release the test piece through the conveyor member. By adsorbing the test piece using the adsorption section, the test piece can be securely fixed to the carrier plate with its front facing upwards. Based on the cooperation of the top film member and the conveyor member, the top film member supports the adhesive film portion of the test piece, preventing the test piece from contacting the carrier plate and adjusting the tension of the adhesive film, allowing the test piece to be carried and fixed with its back facing upwards. Thus, the carrier device is endowed with the dual function of front and back bearing, providing support for front and back inspection operations based on the same testing equipment. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the planar structure of a conventional iron ring wafer.

[0030] Figure 2 This is a schematic diagram of the structure of a support device according to one embodiment.

[0031] Figure 3 This is a schematic diagram of the structure of a support device in one embodiment, omitting the motion platform.

[0032] Figure 4 This is a schematic diagram of the cross-sectional structure of a support device according to one embodiment.

[0033] Figure 5 This is a schematic cross-sectional view of the load-bearing component in a load-bearing device according to one embodiment.

[0034] Figure 6 This is a schematic diagram of the structure of the support component in a support device according to one embodiment.

[0035] Figure 7 This is a schematic diagram of the front bearing principle of a bearing device according to one embodiment.

[0036] Figure 8 This is a schematic diagram of the back-side bearing principle of a bearing device according to one embodiment.

[0037] Figure 9 This is a schematic diagram illustrating the state of a support device for back-side support of an iron ring wafer according to one embodiment.

[0038] Figure 10 This is a schematic diagram of the limiting structure in a support device according to one embodiment (I).

[0039] Figure 11 This is a schematic diagram (II) of the limiting structure in a bearing device according to one embodiment.

[0040] Figure 12 This is a schematic diagram of the structure of the first positioning seat in a carrying device according to one embodiment.

[0041] Figure 13 This is a schematic diagram of the combined structure of the first positioning seat and the second positioning seat in a carrying device according to one embodiment.

[0042] In the picture:

[0043] 100. Bearing assembly; 110. Bearing plate; 111. Adsorption part; 112. Transition part; 1121. Groove; 113. Bearing part; 120. Top film component; 121. Top film part; 122. Connecting part; 130. Conveying component; 131. Second lifting column; 132. Second elastic component; 140. Drive mechanism; 141. First drive component; 142. First lifting plate; 143. First lifting column; 144. First elastic component; 151. First limiting component; 152. Second limiting component; 153. First guide component; 154. Second guide component; 160. Sealing mechanism; 161. Third drive component; 162. Pressure block; 170. Second positioning seat; 171. Second positioning component; 172. Second magnetic suction component; 180. Fourth limiting component;

[0044] 200, Drive assembly; 210, Second drive component; 220, Second lifting plate; 230, Support structure; 300, Motion platform; 310, First positioning seat; 311, First positioning component; 312, First magnetic suction component; 320, Support part; 330, Rotating part; 340, Third limiting component; A, Iron ring wafer; A1, Adhesive film part; A2, Frame part; A3, Wafer part. Detailed Implementation

[0045] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0046] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0047] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0048] In the back-end processes of semiconductor manufacturing, wafers are often mounted on a blue film with an iron ring around the edge for processing, transportation, and inspection. This type of wafer is generally called an iron ring wafer (also known as a surface mount ring wafer, frame wafer, etc.). For details, please refer to [link to relevant documentation]. Figure 1 A typical iron ring wafer A consists of a wafer, a blue film, and an iron ring surrounding the wafer. Typically, after multiple processing steps, the front side of the wafer has been etched with circuit patterns, while the back side is usually an unprocessed surface. Therefore, by attaching and fixing the back side of the wafer and the back side of the iron ring to the front side of the blue film, the wafer and the iron ring are connected together through the blue film to form the iron ring wafer A.

[0049] Currently, vacuum chucks, designed based on the principle of vacuum adsorption, are the most commonly configured carrier devices in testing equipment. Taking the iron ring wafer A as an example, when the iron ring wafer A is placed on the carrier device with the wafer face up, the wafer can be indirectly clamped and fixed by adsorbing and fixing the blue film. Since there is a layer of blue film between the wafer and the carrier device, the back of the wafer will not be contaminated by the carrier device. Therefore, by acquiring an image of the front of the wafer, the front of the wafer can be inspected (commonly known as positive inspection). However, if the back side of the wafer is inspected using the same testing equipment (commonly known as back inspection), the iron ring wafer A needs to be fixed to the carrier device with the front side facing down. In this case, the front side of the wafer will directly contact the carrier device, causing contamination of the front side of the wafer by the carrier device (e.g., damaging the circuit patterns already processed on the front side of the wafer). Obviously, this situation is not allowed in the process technology. Therefore, the existing carrier device does not have the function of back-side support for the iron ring wafer A, and cannot meet the requirement of performing both front and back inspections of the same iron ring wafer A using the same testing equipment, leading to a series of problems such as low equipment utilization and low testing efficiency.

[0050] The carrier device provided in this application has the dual functions of front and back support. By supporting and fixing semiconductor workpieces such as iron ring wafer A, it can realize the front and back inspection of semiconductor workpieces based on the same inspection equipment, which can provide support for effectively improving equipment utilization and inspection efficiency.

[0051] The following description primarily uses an iron ring wafer A as the test piece to illustrate the structure and working principle of the carrier device. However, it should be noted that the test piece can also be other semiconductor workpieces, such as those with similar structures or detection methods to iron ring wafer A. For a clearer and more detailed description of the carrier device provided in the embodiments of this application, please refer to [link to relevant documentation]. Figure 1 as well as Figures 7 to 9 The tested component includes the film portion A1, the frame portion A2, and the wafer portion A3; see details. Figure 1 Regarding the iron ring wafer A, wafer portion A3 refers to the part of the iron ring wafer A occupied by the wafer, frame portion A2 refers to the part of the iron ring wafer A occupied by the iron ring, and film portion A1 refers to the blue film in the iron ring wafer A located between the iron ring (i.e., frame portion A2) and the wafer (i.e., wafer portion A3).

[0052] Please see Figures 2 to 13 The carrier device provided in some embodiments of this application includes a carrier component 100 and a drive component 200; wherein, the carrier component 100 includes a carrier disk 110, a top membrane component 120, a conveyor component 130, a drive mechanism 140, and other functional components as needed, which are described in detail below.

[0053] Please see Figure 2 , Figure 7 and Figure 8 The carrier plate 110 is disposed on the motion platform 300. The carrier plate 110 includes a central adsorption part 111, a transition part 112 surrounding the adsorption part 111, and a carrier part 113 surrounding the transition part 112. The adsorption part 111 may include a porous ceramic part, a microporous ceramic part, a metal groove part, or other forms of adsorption structure, and the adsorption part 111 is connected to an external control source (specifically, a negative pressure air source) through an air path. When the iron ring wafer A is placed with the wafer face up, the adsorption part 111 indirectly fixes the wafer to the carrier plate 110 by adsorbing the blue film of the wafer part A3 under negative pressure, thereby realizing the front-side support of the iron ring wafer A.

[0054] The upper surface of the support portion 113 is configured to be lower than the upper surface of the adsorption portion 111 and the upper surface of the transition portion 112; for example, the upper surface of the adsorption portion 111 is flush with the upper surface of the transition portion 112, and the height difference between the upper surface of the adsorption portion 111 (or the transition portion 112) and the upper surface of the support portion 113 is not less than the thickness of the frame portion A2 (exemplarily, the upper surface of the support portion 113 may be 1-2 mm lower than the upper surface of the adsorption portion 111 (or the transition portion 112)). When the iron ring wafer A is placed with the wafer face up, the transition portion 112 can be used to support the adhesive film portion A1 (i.e., the blue film located between the adsorption portion 111 and the support portion 113); and when the iron ring wafer A is placed with the wafer face up or face down, the support portion 113 can be used to support the frame portion A2.

[0055] For example, please refer to Figure 7 and Figure 8 The inner diameter of the support portion 113 can be set to be smaller than the inner diameter of the frame portion A2 (specifically, the iron ring piece), and the outer diameter of the support portion 113 can be set to be larger than the outer diameter of the frame portion A2 (specifically, the iron ring piece). In this way, when supporting the iron ring piece wafer A, sufficient support space can be provided for the frame portion A2, avoiding structural interference between the frame portion A2 and the transition portion 112.

[0056] It should be noted that, Figure 7 and Figure 8 The bold dashed lines in the text represent the approximate boundaries between the adsorption part 111 and the transition part 112, as well as between the transition part 112 and the support part 113.

[0057] Please see Figure 5 , Figure 7 and Figure 8 The top membrane component 120 is disposed in the transition portion 112. For example, the top membrane component 120 can be an annular structure housed inside the transition portion 112. The drive mechanism 140 is configured to drive the top membrane component 120 to rise and fall relative to the support plate 110. The drive mechanism 140 can be an electric, hydraulic, or pneumatic push rod assembly or cylinder assembly, or other power components that can output linear motion and be controlled, in order to achieve automated driving of the top membrane component 120 to rise and fall. The body of the drive mechanism 140 is connected to the support plate 110, and the power end of the drive mechanism 140 is coupled to the top membrane component 120.

[0058] Please see Figure 8 When the iron ring wafer A is placed with its front side facing down, the drive mechanism 140 drives the top film member 120 to rise until its upper surface is higher than the upper surface of the adsorption portion 111. By lifting the adhesive film portion A1 with the top film member 120, the iron ring wafer A is kept at a distance from the adsorption portion 111 of the carrier disk 110, preventing the front side of the wafer from contacting the adsorption portion 111 of the carrier disk 110. Please refer to [link / reference]. Figure 7 When the iron ring wafer A is placed with the front side of the wafer facing upwards, the drive mechanism 140 drives the top film member 120 to descend to a position where the upper surface of the top film member 120 is lower than the upper surface of the transition portion 112. This allows the transition portion 112 to support the adhesive film portion A1, preventing the top film member 120 from lifting the adhesive film portion A1 and affecting the adsorption and fixing effect of the adsorption portion 111 on the wafer portion A3, and also preventing the top film member 120 from contacting the adhesive film portion A1 and causing friction or interference.

[0059] Please see Figures 2 to 4 and Figure 6 The conveyor 130 is disposed in the support portion 113. For example, the conveyor 130 can be a column structure that passes through the support portion 113 along the thickness direction of the support plate 110. The drive assembly 200 is configured to drive the conveyor 130 to move up and down relative to the support plate 110. The drive assembly 200 can be an electric, hydraulic, or pneumatic push rod assembly or cylinder assembly, or other power assembly capable of outputting linear motion and controllable, to achieve automated driving of the conveyor 130 to move up and down. The body of the drive assembly 200 can be connected to the support plate 110 or disposed on the motion platform 300, and the power end of the drive assembly 200 is coupled to the conveyor 130. Thus, by driving the conveyor 130 to move up and down with the help of the drive assembly 200, the iron ring wafer A can be received or released through the conveyor 130.

[0060] For example, please combine Figure 7 Before the positive inspection, an external gripping device (e.g., a robotic arm) moves the iron ring wafer A above the carrier tray 110 with the front side of the wafer facing upwards. The drive mechanism 140 drives the top film member 120 to descend until its upper surface is lower than the upper surface of the transition section 112. At this time, the drive assembly 200 drives the conveyor member 130 to rise until its upper surface is higher than the upper surface of the adsorption section 111. The external gripping device then transfers the iron ring wafer A, causing the conveyor member 130 to... The frame portion A2 holds or supports the iron ring wafer A, thus receiving the iron ring wafer A. Then, the external gripping device is removed, and the drive assembly 200 drives the conveyor 130 to lower the iron ring wafer A until the wafer portion A3 falls onto the adsorption portion 111, thus releasing the iron ring wafer A. Finally, the blue film of the wafer portion A3 is adsorbed by the adsorption portion 111, thereby indirectly securing the wafer to the carrier disk 110, thus achieving front-side support of the iron ring wafer A for inspection of the front side of the wafer.

[0061] For example, please combine Figure 8Before the back inspection, an external gripping device (e.g., a robotic arm) flips the iron ring wafer A so that the front side of the wafer is facing down, and then moves the iron ring wafer to above the support tray 110. At this time, the drive assembly 200 drives the conveyor 130 to rise to a position where the upper surface of the conveyor 130 is higher than the upper surface of the adsorption part 111. The iron ring wafer A is conveyed by the external gripping device, and the conveyor 130 catches and supports the frame part A2 to receive the iron ring wafer A. At the same time, the drive mechanism 140 drives the top film part 120 to rise to a position where the upper surface of the top film part 120 is higher than the upper surface of the adsorption part 111 but lower than the upper surface of the conveyor 130. Then the external gripping device is removed, and the drive assembly 200 drives the conveyor 130 to descend until the adhesive film part A1 falls on the top film part 120 and the frame part A2 falls on the support part 113, thus releasing the iron ring wafer A.

[0062] When the height of the top film component 120 is determined to be appropriate based on requirements and experience, the top film component 120 lifts the adhesive film portion A1 upwards, creating a height difference between the top film component 120 and the support portion 113, the adsorption portion 111, and the transition portion 112, as well as a height difference between the transition portion 112 and the support portion 113. This causes the adhesive film portion A1 to be stretched downwards under the gravity of the frame portion A2 when the frame portion A2 falls to the support portion 113 (i.e., the adhesive film portion A1 is stretched 360 degrees omnidirectionally by the weight of the frame portion A2). As the adhesive film portion A1 is in a taut state, the wafer portion A3 (specifically the wafer) is horizontally suspended above the adsorption portion 111, preventing the wafer from contacting the support tray 110 and being contaminated or damaged. This achieves the support of the back side of the iron ring wafer A, so that the back side of the wafer can be inspected.

[0063] Furthermore, in order to prevent insufficient weight of the test piece from causing the test piece to shift and affecting the test results, the frame part A2 can be locked onto the bearing part 113 by the locking mechanism 160 to further secure the test piece.

[0064] Furthermore, because there are differences in the quality, blue film material, blue film thickness, and blue film tension of different iron ring wafers A, when it cannot be determined whether the height of the top film component 120 is appropriate, the top film component 120 pushes the adhesive film portion A1 upward, creating a height difference between the top film component 120 and the supporting portion 113, the adsorption portion 111, and the transition portion 112, as well as a height difference between the transition portion 112 and the supporting portion 113. This ensures that when the frame portion A2 falls to the supporting portion 113, the adhesive film portion A1... The frame A2 will be stretched downwards under its own weight; then the frame A2 will be locked onto the bearing 113 by the locking mechanism 160, and the top film 120 will be driven to rise and fall by the drive mechanism 140. The height of the top film 120 will be adjusted until the film A1 is tightened and the wafer A3 (specifically the wafer) is horizontally suspended above the adsorption part 111 without moving. This avoids the wafer from contacting the bearing disk 110 and being contaminated or damaged, and also achieves back-side bearing and inspection of the iron ring wafer A.

[0065] In summary, by designing a partitioned structure for the carrier plate 110 to form corresponding adsorption section 111, transition section 112, and carrier section 113, and utilizing the height difference between the carrier section 113, adsorption section 111, and transition section 112, and through the cooperation of the drive mechanism 140, the top film component 120, the conveyor component 130, and the drive assembly 200, the carrier device is endowed with the dual functions of front and back bearing. Thus, the same inspection equipment can be used to perform both front and back inspection operations on the same iron ring wafer A, effectively improving equipment utilization and inspection efficiency. Meanwhile, when carrying the iron ring wafer A on the back side, the tension of the adhesive film section A1 can be adjusted by adjusting the lifting position of the top film component 120 to accommodate differences in the quality, blue film material, blue film thickness, and blue film tension of different iron ring wafers A. Furthermore, by utilizing the weight of the frame section A2 (specifically the iron ring), the locking mechanism 160, and the top film component 120, the adhesive film section A1 is kept taut, which not only prevents the wafer from contacting the carrier tray 110 and being contaminated or damaged, but also achieves back-side carrying, fixing, and inspection of the iron ring wafer A.

[0066] It should be noted that the terms "front-side bearing" and "back-side bearing" in this application are relative concepts. "Front-side bearing" refers to the iron ring wafer A being placed in the bearing device with the front side facing up and being fixed in place. "Back-side bearing" refers to the iron ring wafer A being placed in the bearing device with the front side facing down and being fixed in place.

[0067] In some embodiments, please refer to Figures 2 to 5The transition portion 112 is provided with a groove 1121, and the top film member 120 is disposed in the groove 1121, with the upper surface of the top film member 120 being lower than the upper surface of the transition portion 112. Exemplarily, the groove 1121 may be an annular groove surrounding the adsorption portion 111, and the top film member 120 may be a first annular structure surrounding and disposed in the groove 1121 around the center of the support disk 110. Alternatively, the top film member 120 may be a second annular structure composed of multiple arc-shaped structures spaced apart in the groove 1121.

[0068] Thus, by accommodating the top film component 120 in the groove 1121, structural integration between the top film component 120 and the carrier disk 110 can be achieved without increasing the overall thickness of the carrier disk 110. When the iron ring wafer A is supported from the front, since the top film component 120 is accommodated in the groove 1121 and the upper surface of the top film component 120 is lower than the upper surface of the transition portion 112, the top film component 120 can avoid lifting the adhesive film portion A1 and affecting the adsorption and fixing effect of the adsorption portion 111 on the wafer portion A3. Conversely, when the iron ring wafer A is supported from the back, the annular structure of the top film component 120 can provide 360-degree omnidirectional support and lift for the adhesive film portion A1. Combined with the self-weight of the frame portion A2, the wafer portion A3 or the wafer is horizontally suspended above the carrier disk 110 to meet the back inspection requirements.

[0069] In other embodiments, the top film member 120 may also adopt other suitable structural forms. For example, the top film member 120 may be a columnar structure that penetrates the transition portion 112. There may be multiple top film members 120, which are arranged at intervals around the center of the support disk 110. In this way, the multiple top film members 120 are driven to rise and fall synchronously by the drive mechanism 140. When the top film member 120 extends from the transition portion 112 to a position higher than the upper surface of the adsorption portion 111, it can support and lift the adhesive film portion A1, so that the wafer or wafer portion A3 is horizontally suspended above the adsorption portion 111. All these variations will not be described in detail here.

[0070] In some embodiments, please refer to Figure 5 The top membrane component 120 includes a top membrane portion 121 near the adsorption portion 111 and a connecting portion 122 surrounding and connecting the top membrane portion 121; wherein, the upper surface of the top membrane portion 121 is higher than the upper surface of the connecting portion 122. Thus, based on the structural form of the connecting portion 122 surrounding the top membrane portion 121 and the height difference between their upper surfaces, the top membrane component 120 can be constructed as a stepped structure.

[0071] On the one hand, by taking advantage of the relatively small width of the top film portion 121 in the top film component 120 (for example, the width of the top film portion 121 can be set to 2-3mm), the top film portion 121 can support and lift the adhesive film portion A1, while effectively reducing the contact area and friction between the top film component 120 and the adhesive film portion A1. This is beneficial for the blue film to be stretched and flattened under the self-weight of the frame portion A2, so that the wafer is horizontally suspended above the adsorption portion 111.

[0072] On the other hand, taking advantage of the relatively large width of the connecting portion 122 in the top film member 120, the stable structural connection between the connecting portion 122 and the drive mechanism 140 allows the drive mechanism 140 to stably drive the connecting portion 122 to raise and lower the top film portion 121, thereby lifting the adhesive film portion A1 by the top film portion 121 extending out of the groove 1121. It should be noted that the "width" here can be understood as the dimension of the connecting portion 122 or the top film portion 121 in the radial direction of the carrier plate 110.

[0073] In some embodiments, please refer to Figure 2 , Figure 5 and Figure 6 The drive mechanism 140 includes a first drive member 141, a first lifting plate 142, a first lifting column 143, and a first elastic member 144. The body of the first drive member 141 is connected to the support plate 110, and the power end of the first drive member 141 is connected to the first lifting plate 142 to drive the first lifting plate 142 to rise and fall relative to the support plate 110. The first end of the first lifting column 143 extends into the groove 1121 and is connected to the top membrane member 120 (specifically, the connecting part 122). One end of the first elastic member 144 is connected to the support plate 110, and the other end is connected to the second end of the first lifting column 143. For example, the first elastic member 144 can be a spring sleeved on the first lifting column 143. The first lifting plate 142 corresponds to the second end of the first lifting column 143.

[0074] When the first driving member 141 drives the first lifting plate 142 to rise, the first lifting plate 142 can abut against the second end of the first lifting column 143, thereby driving the first lifting column 143 to drive the top film member 120 to rise (at this time, the first elastic member 144 is compressed by the first lifting column 143 and stores elastic potential energy), so that the top film member 120 can lift the adhesive film part A1; conversely, when the first driving member 141 drives the first lifting plate 142 to fall, the first elastic member 144 will release elastic potential energy to provide an elastic force that causes the first lifting column 143 to drive the top film member 120 to fall synchronously, so that the top film member 120 falls to a position where its upper surface is lower than the upper surface of the bearing part 113 (for example, the top film part 121 enters the groove 1121).

[0075] Thus, by setting the drive mechanism 140 as a split-type assembly structure, the lifting and lowering of the top membrane component 120 can be made more stable with the cooperation of the first drive component 141 (together with the first lifting plate 142) and the first elastic component 144; at the same time, it also helps to reduce the difficulty of disassembling and assembling the bearing component 100.

[0076] In some embodiments, please refer to Figures 3 to 6 The number of first lifting columns 143 can be set to multiple, such as two, three, four or more. Multiple first lifting columns 143 are arranged at intervals around the center of the transition part 112, and the first ends of multiple first lifting columns 143 are respectively connected to the top membrane member 120. Correspondingly, the first elastic member 144 corresponds one-to-one with the first lifting column 143, and multiple first lifting columns 143 correspond to the same first lifting plate 142, that is, the first lifting plate 142 can simultaneously drive multiple first lifting columns 143 to rise or fall.

[0077] Thus, by setting multiple first lifting columns 143, multiple connection positions or action positions can be formed between the top membrane component 120 and the drive mechanism 140. With the cooperation of the first lifting plate 142 and the first elastic member 144, the force on the top membrane component 120 during the lifting process can be more balanced, which can not only effectively improve the stability of the lifting of the top membrane component 120, but also help to simplify the structure of the bearing component 100.

[0078] In other embodiments, the drive mechanism 140 may also adopt other suitable structural forms. For example, the first elastic element 144 may be omitted, and the second end of the first lifting column 143 may be directly connected to the first lifting plate 142. The first lifting plate 142 may be driven to rise and fall by the first driving member 141, thereby driving the top membrane member 120 to rise and fall through the first lifting column 143. Alternatively, the power end of the first driving member 141 may be directly connected to the top membrane member 120 to directly drive the top membrane member 120 to rise and fall. All these variations will not be elaborated upon here.

[0079] In some embodiments, the first driving component 141 can be an electric cylinder. Utilizing the characteristics of an electric cylinder, such as strong controllability of movement speed and acceleration, and the ability to stop at any position within its stroke range, effective control can be achieved over the rising height and speed of the top film component 120. This allows for adaptation to different iron ring wafers A, enabling precise adjustment of the blue film tension. Alternatively, the first driving component 141 can be a pneumatic cylinder. Pneumatic cylinders have the characteristics of low and controllable pneumatic pressure and short stroke, which can prevent the top film component 120 from excessively lifting the adhesive film portion A1, thus avoiding damage to the blue film.

[0080] In some embodiments, please refer to Figure 5 , Figure 6 , Figure 10 and Figure 11The supporting component 100 also includes a limiting structure, which is mainly used to limit the lifting stroke of the top membrane component 120 by limiting the lifting stroke of the first lifting plate 142, so that the top membrane component 120 can stay at the required height position. Specifically, the limiting structure includes a first limiting member 151 and a second limiting member 152; wherein, the first limiting member 151 is fixedly disposed relative to the first driving member 141, for example, the first limiting member 151 can be connected to the body of the first driving member 141 or to the supporting plate 110; the second limiting member 152 is fixedly disposed relative to the first lifting plate 142, for example, the second limiting member 152 can be connected to the first lifting plate 142 or to the power end of the first driving member 141.

[0081] For example, please refer to Figure 10 The first limiting member 151 and the second limiting member 152 cooperate to form a mechanical limiting structure. Specifically, the number of first limiting members 151 can be set to two, with the two first limiting members 151 arranged vertically at intervals, and at least a portion of the second limiting member 152 located between the two first limiting members 151. When the first driving member 141 drives the first lifting plate 142 to rise to a first preset height position, the second limiting member 152 will abut against the upper first limiting member 151, thereby preventing the first lifting plate 142 from continuing to rise; conversely, when the first driving member 141 drives the first lifting plate 142 to descend to a second preset height position, the second limiting member 152 will abut against the lower first limiting member 151, thereby preventing the first lifting plate 142 from continuing to descend. By utilizing the mechanical abutment relationship between the first limiting member 151 and the second limiting member 152, the lifting stroke of the first lifting plate 142 or the top membrane member 120 is limited.

[0082] For example, please refer to Figure 11 The first limiting member 151 and the second limiting member 152 cooperate to form a photoelectric limiting structure. Specifically, there are two first limiting members 151, which are arranged vertically at intervals. The first limiting members 151 can be stroke sensors, pressure sensors, infrared sensors, etc. At least a portion of the second limiting member 152 is located between the two first limiting members 151. When the first driving member 141 drives the first lifting plate 142 to rise to a first preset height position, the second limiting member 152 will trigger the upper first limiting member 151, and the first driving member 141 will stop driving the first lifting plate 142 to rise according to the trigger information at this time. Conversely, when the first driving member 141 drives the first lifting plate 142 to fall to a second preset height position, the second limiting member 152 will trigger the lower first limiting member 151, and the first driving member 141 will stop driving the first lifting plate 142 to fall according to the trigger information at this time. In this way, the lifting stroke of the first lifting plate 142 or the top membrane component 120 can also be limited.

[0083] In some embodiments, please refer to Figure 10 and Figure 11 The limiting structure can be set into two sets, one set being a mechanical limiting structure and the other set being a photoelectric limiting structure. This can reliably limit the lifting stroke of the first lifting plate 142 or the top film member 120 within a preset stroke range. When bearing on the back side, it ensures that the top film member 120 can effectively lift the adhesive film part A1, so that the iron ring wafer A and the adsorption part 111 are kept apart. When bearing on the front side, it ensures that the upper surface of the top film member 120 is lower than the upper surface of the transition part 112, ensuring the adsorption and fixing effect of the adsorption part 111 on the wafer part A3.

[0084] In some embodiments, please refer to Figure 3 and Figure 6 The supporting component 100 also includes a guide structure, which includes a first guide member 153 and a second guide member 154 that are slidably connected. For example, one of the first guide member 153 and the second guide member 154 can be a guide rail seat, and the other can be a slide table. The first guide member 153 is connected to the first lifting plate 142, and the second guide member 154 is connected to the supporting plate 110. During the process of the first driving member 141 driving the first lifting plate 142 to rise and fall, the sliding connection between the first guide member 153 and the second guide member 154 can guide the first lifting plate 142 to rise and fall linearly, thereby indirectly realizing the smooth rise and fall of the top membrane component 120. At the same time, the structural connection between the first lifting plate 142 and the supporting plate 110 established by the guide structure also helps to enhance the structural stability between the driving mechanism 140 and the supporting plate 110.

[0085] In some embodiments where the first lifting plate 142 drives multiple first lifting columns 143 to raise the top membrane component 120, the first driving component 141 and the guide structure can be arranged symmetrically about the center of the bearing plate 110, which can ensure the smoothness of the lifting movement of the first lifting plate 142.

[0086] In some embodiments, please refer to Figure 2 , Figure 3 , Figure 6 and Figure 9The carrier assembly 100 also includes one or more locking mechanisms 160 disposed on the carrier portion 113; wherein, the multiple locking mechanisms 160 can be arranged at intervals around the center of the carrier portion 113; during back inspection, since the iron ring wafer A is detached from the adsorption portion 111 and is not subject to vacuum adsorption, the adhesive film portion A1 is lifted by the top film member 120, and the frame portion A2 is fixed by the locking mechanism 160, which can effectively prevent the iron ring wafer A from slipping relative to the carrier disk 110, and achieve stable support of the iron ring wafer A, so as to facilitate the inspection of the back side of the wafer. Meanwhile, as mentioned above, if it is uncertain whether the lifting height of the top film component 120 is appropriate, when the top film component 120 lifts the adhesive film portion A1 and the frame portion A2 falls to the support portion 113 to stretch the adhesive film portion A1, the frame portion A2 can first be locked and fixed to the support portion 113 using the locking mechanism 160, and then the top film component 120 can be driven to rise and fall by the drive mechanism 140 to adjust the top film component 120 to a suitable height, thereby finally achieving the tensioning of the adhesive film portion A1 and ensuring that the wafer portion A3 is horizontally suspended above the adsorption portion 111 without moving.

[0087] For example, please refer to Figure 9 The locking mechanism 160 includes a third driving member 161 and a pressing block 162. The body of the third driving member 161 is connected to the support plate 110, and the power end of the third driving member 161 is coupled to the pressing block 162. By driving the pressing block 162 to rotate relative to the support plate 110, the frame portion A2 can be fixed and released. Specifically, when the top film member 120 lifts the adhesive film portion A1 and the frame portion A2 is released onto the support portion 113, the pressing block 162 can be driven by the third driving member 161 to rotate to the upper side of the frame portion A2, thereby pressing and fixing the frame portion A2 onto the support portion 113.

[0088] In other embodiments, the locking mechanism 160 can also be an adsorption structure provided on the support portion 113, such as a vacuum chuck, electromagnet, magnet, etc. When the frame portion A2 is released on the support portion 113, the frame portion A2 can also be fixed by adsorption, thus preventing the iron ring wafer A from slipping relative to the support disk 110.

[0089] In some embodiments, please refer to Figure 3 , Figure 4 and Figure 6The conveying component 130 includes a second lifting column 131 and a second elastic member 132. The second lifting column 131 is disposed through the bearing portion 113. The first end of the second lifting column 131 is used to contact the frame portion A2 of the iron ring wafer A. One end of the second elastic member 132 is connected to the bearing plate 110, and the other end is connected to the second end of the second lifting column 131. For example, the second elastic member 132 can be a spring sleeved on the second lifting column 131. Correspondingly, the driving assembly 200 includes a second driving member 210 and a second lifting plate 220. The second lifting plate 220 corresponds to the second end of the second lifting column 131. The second driving member 210 can include a cylinder, electric cylinder, or other power device capable of outputting linear motion disposed on the motion platform 300. The power end of the second driving member 210 is coupled to the second lifting plate 220.

[0090] Thus, by driving the second lifting plate 220 to rise and fall relative to the support plate 110 through the second driving member 210, the second lifting plate 220 can abut against the second end of the second lifting column 131 when it rises, thereby driving the second lifting column 131 to rise synchronously (at this time, the second elastic member 132 will be compressed by the second lifting column 131 to store elastic potential energy), thereby supporting the frame part A2 through the second lifting column 131 to realize the support of the iron ring wafer A; conversely, when the second lifting plate 220 falls, the second elastic member 132 will release elastic potential energy to provide an elastic force to cause the second lifting column 131 to drive the frame part A2 to fall synchronously, until the adhesive film part A1 falls on the top film part 120 or the frame part A2 falls on the support part 113, thereby realizing the release of the iron ring wafer A.

[0091] In some embodiments, please refer to Figure 3 and Figure 4 The number of conveying components 130 is set to multiple, and the multiple conveying components 130 are arranged at intervals around the center of the bearing part 113, and the multiple conveying components 130 correspond to the same second lifting plate 220. In this way, the multiple conveying components 130 can be driven to rise synchronously by means of the second lifting plate 220, so as to support the frame part A2 from different positions through the multiple conveying components 130, and realize the smooth acceptance and release of the iron ring wafer A. Moreover, the multiple conveying components 130 share a single drive assembly 200, which helps to reduce the overall structural complexity of the bearing device. In addition, the drive assembly 200 and the conveying components 130 adopt a relatively independent structural system and cooperate with each other, which also helps to reduce the difficulty of disassembling and assembling the bearing device.

[0092] Considering that the tested components usually have different external dimensions, such as the common wafers in 8-inch and 12-inch sizes, the corresponding dimensions of the wafer portion A3 and frame portion A2 of the iron ring wafer A are also different. Due to the large size difference between 8-inch and 12-inch iron ring wafer A, it is not easy to set up a top film 120 and related functional structures adapted to 8-inch and 12-inch iron ring wafer A on the same carrier disk 110. However, if a carrier device is set up for each size of iron ring wafer A, it will inevitably increase the configuration cost of the carrier device or testing equipment, the testing cost, etc.

[0093] Therefore, in some embodiments, the number of carrier components 100 is set to multiple, and different carrier components 100 are configured to carry test pieces of different sizes; for example, one of the multiple carrier components 100 is configured to carry a fixed 8-inch iron ring wafer A, and another of the multiple carrier components 100 is configured to carry a fixed 12-inch iron ring wafer A. See also... Figure 3 , Figure 4 , Figure 6 , Figure 12 and Figure 13 The support device also includes a motion platform 300, on which a first positioning seat 310 is provided. Each support component 100 includes a second positioning seat 170 that supports its respective support plate 110 (for example, the second positioning seat 170 is centrally located at the bottom of the support plate 110). The first positioning seat 310 and the second positioning seat 170 are matched with each other and can be detachably connected.

[0094] Thus, by utilizing the detachable connection between the first positioning seat 310 and the second positioning seat 170, a quick-change structure can be formed between the carrier component 100 and the motion platform 300. This allows multiple carrier components 100 to be detachably and interchangeably connected to the motion platform 300. Based on the different A-size specifications of the iron ring wafer, the corresponding carrier components 100 and motion platform 300 can be selectively combined to form a carrier device. This not only meets the front and back inspection requirements of test pieces of different sizes but also effectively saves time in modifying the carrier device structure and improves inspection efficiency. Simultaneously, the sharing of the same motion platform 300 by multiple carrier components 100 effectively improves the utilization rate of the motion platform 300 and related functional components, and reduces the configuration and operating costs of the carrier device.

[0095] In some embodiments, please refer to Figure 6 , Figure 12 and Figure 13The first positioning seat 310 is provided with at least three first positioning elements 311, and the second positioning seat 170 is provided with at least three second positioning elements 171 arranged at intervals along the center of the bearing disk 110. The first positioning elements 311 and the second positioning elements 171 correspond one to one and are inserted and connected. For example, one of the corresponding first positioning elements 311 and the second positioning elements 171 has a groove structure extending in the radial direction of the bearing disk 110, and the other has a protrusion structure that can be inserted into the corresponding groove structure.

[0096] When the support component 100 is connected to the motion platform 300 through the cooperation of the second positioning seat 170 and the first positioning seat 310, the insertion connection between the first positioning member 311 and the second positioning member 171, as well as their quantity and arrangement, can prevent the support component 100 from rotating and translating relative to the first positioning seat 310, thereby stably restricting the support component 100 on the motion platform 300. Conversely, if it is necessary to replace the support component 100, it is only necessary to apply an upward force along the thickness direction of the support plate 110 to the support component 100 to remove the support component 100 from the motion platform 300, thereby realizing the quick disassembly and switching of different support components 100 based on the same motion platform 300.

[0097] In some embodiments, please refer to Figure 6 , Figure 12 and Figure 13 The first positioning seat 310 is also provided with a first magnetic attractor 312, and the second positioning seat 170 is also provided with a second magnetic attractor 172 for one-to-one engagement with the first magnetic attractor 312; wherein, one of the first magnetic attractor 312 and the second magnetic attractor 172 can be a magnet, and the other can be made of a ferromagnetic material; the number of the first magnetic attractor 312 and the second magnetic attractor 172 can be set to multiple, for example, the second magnetic attractor 172 and the second positioning member 171 are arranged alternately around the center of the bearing plate 110.

[0098] Thus, by relying on the alignment and attraction between the first magnetic 312 and the second magnetic 172, the first positioning seat 310 and the second positioning seat 170 can be prevented from moving along the thickness direction of the bearing plate 110. Furthermore, under the gravity of the bearing assembly 100 and with the cooperation of the first positioning member 311 and the second positioning member 171, the bearing assembly 100 is effectively prevented from rotating, translating, and moving up and down relative to the first positioning seat 310, thereby more stably restricting the bearing assembly 100 to the motion platform 300.

[0099] Please see Figure 3 , Figure 4 and Figure 12As described in some of the embodiments above, the drive assembly 200 can be mounted on the motion platform 300. In this case, multiple sets of support structures 230 can be mounted on the second lifting plate 220, with different sets of support structures 230 corresponding to the positions of the transmission components 130 in different load-bearing assemblies 100. Thus, when the second drive assembly 210 drives the second lifting plate 220 to rise and fall, the positional correspondence between the support structures 230 and the transmission components 130 can be used to drive the corresponding transmission components 130 to rise and fall. At the same time, by sharing the drive assembly 200, it is also beneficial to simplify the structural complexity of the load-bearing assembly 100 and improve the utilization rate of the motion platform 300, the drive assembly 200, and related functional components.

[0100] In some embodiments, in order to save the structural space occupied by components such as the support plate 110, and to provide support for the installation of components such as the top membrane 120 on the support plate 110, the pipelines (such as air ducts) and lines (such as connecting cables) in the support assembly 100 can be externally routed. In this case, the corresponding pipelines can be connected to an external control source (such as a negative pressure air source, control device, etc.) using a quick-connect structure, so that the support assembly 100 can be disassembled and assembled as a whole when switching the support assembly 100.

[0101] Specifically, the carrier component 100 also includes one or more first pipeline connectors (not shown in the figure). The first pipeline connector may include a connector that is connected to the carrier plate 110 (specifically, the adsorption part 111), the drive mechanism 140 (e.g., the first drive member 141 using a cylinder) through a corresponding air passage, or a connector that is connected to the drive mechanism 140 (e.g., the first drive member 141 using an electric cylinder), the photoelectric limiting structure, etc. through a corresponding power supply or signal cable.

[0102] The first pipeline connector allows for a detachable connection (e.g., a plug-in connection) between the first pipeline connector and the second pipeline connector of the external control source. This enables both pneumatic and electrical connections between the carrier assembly 100 and the external control source, and facilitates the assembly and disassembly of the carrier assembly 100 as a whole with the motion platform 300, the external control source, and the drive assembly 200, allowing for rapid switching between different carrier assemblies 100. This further reduces the time required for modifying the structural system of the carrier device to meet the need for rapid switching between different carrier assemblies 100.

[0103] In some embodiments, the motion platform 300 is configured to drive the carrier assembly 100 to rotate, thereby synchronously rotating the iron ring wafer A through the carrier assembly 100, adjusting the detection position of the iron ring wafer A to meet the requirements of forward or back inspection. For details, please refer to... Figure 2 and Figure 4The motion platform 300 includes a support portion 320 and a rotating portion 330 that can be controllably rotated relative to the support portion 320; wherein, the first positioning seat 310 is connected to the rotating portion 330 and rotates synchronously, so that the bearing component 100 can rotate synchronously with the first positioning seat 310; and the drive component 200, etc., can be disposed on the support portion 320.

[0104] Meanwhile, the support part 320 is provided with a third limiting member 340, and the bearing assembly 100 also includes a fourth limiting member 180 connected to the bearing plate 110. Through the cooperation of the third limiting member 340 and the fourth limiting member 180, the rotation stroke of the bearing assembly 100 can be limited so that the rotating part 330 drives the bearing assembly 100 to rotate within a preset angle range, thereby avoiding the tearing of pipelines (such as airway pipelines, signal / power supply cables, etc.) in the bearing assembly 100 due to excessive rotation angle.

[0105] For example, please refer to Figure 2 The third limiting member 340 and the fourth limiting member 180 cooperate to form a mechanical limiting structure. Specifically, the number of third limiting members 340 can be set to two, and the two third limiting members 340 are arranged at intervals on the support part 320 along the rotation trajectory of the bearing assembly 100. At least a portion of the fourth limiting member 180 can be located between the two third limiting members 340. When the rotating part 330 drives the bearing assembly 100 to rotate to the first preset angle position or the second preset angle position, the fourth limiting member 180 will abut against the corresponding third limiting member 340 to prevent the bearing assembly 100 from continuing to rotate, thereby limiting the rotation stroke of the bearing assembly 100.

[0106] For example, please refer to Figure 2 The third limiting member 340 and the fourth limiting member 180 cooperate to form a photoelectric limiting structure. Specifically, there are two third limiting members 340, which are arranged at intervals on the support part 320 along the rotation trajectory of the bearing assembly 100. The third limiting member 340 can be a stroke sensor, pressure sensor, infrared sensor, etc. At least a portion of the fourth limiting member 180 is located between the two third limiting members 340. When the rotating part 330 drives the bearing assembly 100 to rotate to the first preset angle position or the second preset angle position, the fourth limiting member 180 will trigger the third limiting member 340 at the corresponding position. The motion platform 300 or related control device can stop the rotating part 330 from driving the bearing assembly 100 to rotate according to the triggering information of the third limiting member 340, thereby limiting the rotation stroke of the bearing assembly 100.

[0107] In some embodiments, the third limiting member 340 and the fourth limiting member 180 can be configured as two sets, one set being a mechanical limiting structure and the other set being a photoelectric limiting structure, so that the rotational stroke of the bearing component 100 can be reliably limited within a preset stroke range.

[0108] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A supporting device, characterized in that, It includes a support component and a drive component, wherein the support component includes a support disk, a top membrane component, a conveyor component, and a drive mechanism; wherein: The carrier plate includes an adsorption section, a transition section surrounding the adsorption section, and a support section surrounding the transition section. The upper surface of the support section is lower than the upper surfaces of the adsorption section and the transition section. The top film member is disposed in the transition section, and the conveying member is disposed in the support section. The transition section has a groove, the top film member is disposed in the groove, and the upper surface of the top film member is lower than the upper surface of the transition section. The driving mechanism is configured to drive the top film member to move up and down relative to the carrier plate, so as to lift the adhesive film portion of the test piece by the top film member, thereby spacing the test piece from the adsorption portion. The drive component is configured to drive the conveyor to move up and down relative to the carrier plate, so as to receive or release the test object through the conveyor.

2. The bearing device as described in claim 1, characterized in that, The top membrane component includes a top membrane portion near the adsorption portion and a connecting portion surrounding the top membrane portion. The upper surface of the top membrane portion is higher than the upper surface of the connecting portion. The connecting portion is connected to the driving mechanism, and the driving mechanism drives the connecting portion to move the top membrane portion up and down.

3. The bearing device as described in claim 1, characterized in that, The driving mechanism includes a first driving component, a first lifting plate, a first lifting column, and a first elastic component; wherein: The first end of the first lifting column extends into the groove and connects to the top membrane component. The first driving component is connected to the bearing plate and is used to drive the first lifting plate to rise and fall. The first lifting plate acts on the second end of the first lifting column, driving the first lifting column to lift the top membrane component. One end of the first elastic element is connected to the bearing plate, and the other end is connected to the second end of the first lifting column. The first elastic element is used to provide an elastic force that causes the first lifting column to drive the top membrane component to descend.

4. The bearing device as described in claim 3, characterized in that, The load-bearing component further includes a guide structure and / or a limiting structure, wherein: The guide structure is used to guide the first lifting plate to move linearly. The guide structure includes a first guide member and a second guide member that are slidably connected. The first guide member is connected to the first lifting plate, and the second guide member is connected to the bearing plate. The limiting structure is used to limit the lifting stroke of the first lifting plate. The limiting structure includes a first limiting member and a second limiting member that cooperate with each other. The first limiting member is fixedly disposed relative to the first driving member, and the second limiting member is fixedly disposed relative to the first lifting plate.

5. The bearing device as described in claim 1, characterized in that, The conveying component includes a second lifting column and a second elastic element. The second lifting column is disposed through the bearing portion. The first end of the second lifting column is used to contact the test piece. One end of the second elastic element is connected to the bearing plate and the other end is connected to the second end of the second lifting column. The second elastic element is used to provide an elastic force that causes the second lifting column to descend; the driving component acts on the second end of the second lifting column to drive the second lifting column to rise.

6. The bearing device as described in claim 1, characterized in that, The bearing assembly further includes a locking mechanism; the locking mechanism is disposed on the bearing portion and is used to fix the test piece; And / or the carrier assembly further includes one or more first line connectors; the first line connectors are configured to be detachably connected to a second line connector of an external control source to enable a pneumatic or electrical connection between the carrier assembly and the external control source.

7. The bearing device as described in any one of claims 1-6, characterized in that, The support device further includes a first positioning seat for mounting on the motion platform, and the support assembly further includes a second positioning seat for supporting the support plate; the first positioning seat and the second positioning seat are detachably connected to each other to detachably connect the support assembly to the motion platform.

8. The bearing device as described in claim 7, characterized in that, The first positioning seat is provided with at least three first positioning elements, and the second positioning seat is provided with at least three second positioning elements arranged around the center of the bearing plate; the first positioning elements and the second positioning elements correspond one-to-one and are inserted and connected to prevent the bearing assembly from rotating and translating relative to the first positioning seat.

9. The bearing device as described in claim 8, characterized in that, The first positioning seat is further provided with a first magnetic attraction element, and the second positioning seat is provided with a second magnetic attraction element; the first magnetic attraction element and the second magnetic attraction element are aligned and attracted to prevent the first positioning seat and the second positioning seat from moving along the thickness direction of the bearing plate.

10. The bearing device as claimed in claim 7, characterized in that, The number of the bearing components is set to multiple, and different bearing components are used to carry test pieces of different shapes and sizes; each bearing component includes a second positioning seat that matches the first positioning seat, so that the multiple bearing components can be interchangeably connected to the motion platform.

11. The bearing device as claimed in claim 7, characterized in that, The drive assembly includes a second drive member and a second lifting plate. The second drive member is disposed on the motion platform and is used to drive the second lifting plate to rise and fall. The second lifting plate has a support structure corresponding to the transmission member in different load-bearing assemblies. The second lifting plate drives the corresponding transmission member to rise and fall through the support structure.

12. The bearing device as claimed in claim 7, characterized in that, The motion platform includes a support part and a rotating part that can be controlled to rotate relative to the support part; the first positioning seat is connected to the rotating part and rotates synchronously, and the bearing component rotates synchronously with the first positioning seat; The support portion is provided with a third limiting member, and the bearing assembly further includes a fourth limiting member connected to the bearing plate; the third limiting member cooperates with the fourth limiting member to limit the rotation stroke of the bearing assembly.

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