A semiconductor iron ring flipping and lifting device and method

Abstract

The present invention discloses a semiconductor iron ring flipping and lifting device and method. The flipping and lifting device includes a driving box and a flipping mechanism arranged on one side thereof, and the flipping mechanism includes two clamping ring arms that can move toward each other; iron ring driving and leveling parts and multiple sets of arch measuring mechanisms are evenly distributed on opposite sides of the clamping ring arms, and the iron ring driving and leveling parts include multiple ring-adapting liquid capsules; the arch measuring mechanisms and the flipping mechanism are both connected to a control system; when the iron ring is clamped by the flipping mechanism and liquid is injected into each ring-adapting liquid capsule, the multiple ring-adapting liquid capsules can form a flexible wave topological structure, and flexibly squeeze the iron ring so that it automatically slides to the same-phase wave peak and valley position of the topological structure, thereby realizing horizontal calibration of the external force of the iron ring; the arch measuring mechanism is used to generate an electrical signal when the iron ring is unevenly stressed, and the control system can dynamically adjust the clamping force parameters of the flipping mechanism according to the electrical signal. The present invention realizes flexible and lossless clamping and automatic horizontal calibration of the semiconductor iron ring through the coordinated action of the ring-adapting liquid capsule embedded in the clamping ring arm and the inelastic bundle capsule wire.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, and more particularly to a semiconductor iron ring flipping and lifting device and method. Background Art

[0002] In the field of semiconductor manufacturing, iron rings are the core components for wafer loading and transmission. Their performance is directly related to the yield and production efficiency of chip manufacturing. Through precise design, the iron rings can firmly clamp the edges of the wafers, ensure their accurate positioning on the vacuum suction cup, and effectively prevent the wafers from shifting or deforming during high-speed rotation coating, photolithography and other processes. During the automated transmission process, the iron rings need to work seamlessly with robotic arms, transmission tracks and other equipment to achieve smooth grasping, flipping and lifting of the wafers.

[0003] In semiconductor manufacturing, the clamping, flipping, and positioning of precision components such as iron rings (such as wafer carrier rings and reaction chamber sealing rings) are crucial to process yield. Conventional iron ring handling devices often use rigid mechanical grippers or pneumatic clamps for clamping. The rigid gripper's contact surface cannot adapt to even slight tilts or surface irregularities in the iron ring. Localized pressure concentration can easily cause plastic deformation in the ring, impacting subsequent process accuracy. To address this issue, the present invention proposes a semiconductor iron ring flipping and lifting device and method. Summary of the Invention

[0004] The present invention provides a semiconductor iron ring flipping and lifting device and method, which solves the technical problems in the related art that the contact surface of the rigid clamp cannot adapt to the slight tilt or surface unevenness of the iron ring, and the local pressure concentration easily causes plastic deformation of the iron ring, thereby affecting the accuracy of subsequent processes.

[0005] A first aspect of the present invention provides a semiconductor iron ring flipping and lifting device, comprising a driving box and a flipping mechanism disposed on one side of the driving box; the flipping mechanism comprises two clamping ring arms that can move toward each other in the horizontal direction, for clamping the iron ring; iron ring flattening members and multiple sets of arch measuring mechanisms are evenly distributed on opposite sides of the clamping ring arms; the arch measuring mechanisms and the flipping mechanism are both connected to a control system;

[0006] The iron ring driving and leveling member includes a plurality of ring-adapting liquid sacs arranged at equal intervals, and an inelastic bundle sac thread is fixed on the inner wall of each ring-adapting liquid sac. When the iron ring is clamped by a flipping mechanism and the plurality of ring-adapting liquid sacs are injected with liquid, the plurality of ring-adapting liquid sacs can form a flexible wave topological structure, and the iron ring is automatically slid to the wave peak and valley position of the same phase within the flexible wave topological structure through flexible extrusion, thereby realizing the horizontal calibration of the external force of the iron ring;

[0007] The arch measuring mechanism includes a conductive arch piece 1 and a conductive arch piece 2 arranged above and below the ring-adapting liquid sac. When the iron ring clamped by the flipping mechanism is subjected to uneven force and arches, the arched part of the iron ring can drive the conductive arch piece 1 to deform and contact with the conductive arch piece 2, thereby generating an electrical signal. The control system can dynamically adjust the clamping force parameters of the flipping mechanism according to the electrical signal to realize force-deformation closed-loop control.

[0008] Furthermore, a lifting main frame is provided on the side of the driving box away from the flip mechanism, the driving box is fixedly connected to the elevator in the lifting main frame, and the driving box is controlled by the elevator in the lifting main frame to rise and fall.

[0009] Furthermore, the flipping mechanism also includes a protective box, a flipping motor is fixedly provided at the center position of the protective box close to the driving box, and the flipping motor is fixed in the driving box, and the protective box can be flipped under the drive of the flipping motor.

[0010] Furthermore, a rotating shaft is fixedly provided at the inner center position of the protective box, and follow-pull plates are rotatably provided at both ends of the rotating shaft, and a limiting plate is provided on the outside of one of the two follow-pull plates, and a driving arm cylinder is fixedly provided on one side of the limiting plate, and the driving arm cylinder is fixedly connected to the back plate of the protective box, and one end of the two follow-pull plates is fixedly connected to a clamping ring arm respectively.

[0011] Furthermore, the clamping ring area of ​​the clamping ring arm is a clamping ring groove, and when in the initial state, the side wall of the ring-adapting liquid capsule is flush with the inner wall of the clamping ring groove.

[0012] Furthermore, the liquid inlet ends of several of the ring-fitting liquid sacs are fixedly connected to the liquid tube, the liquid tube is fixedly connected to the clamping ring arm, the end of the liquid tube away from the ring-fitting liquid sac is connected to the liquid outlet sac, and there are two liquid outlet sacs, corresponding to the liquid tubes on the two clamping ring arms respectively.

[0013] Furthermore, a fixed plate is fixedly provided above the two liquid outlet bags, an extrusion plate is fixedly provided on the lower wall of the fixed plate, and the lower wall of the extrusion plate is fixedly connected to the telescopic arm of the pressure control cylinder, and the fixed plate is fixedly connected to the outer shell of the pressure control cylinder through a connecting plate, and the two liquid outlet bags are clamped between the extrusion plate and the fixed plate.

[0014] Furthermore, limiting ring strips are fixedly provided on the upper and lower parts of the clamping ring groove, and the thickness of the two limiting ring strips gradually increases from the distal side to the side of the ring-adapting liquid capsule, and the conductive arch piece 1 and the conductive piece 2 of several groups are tightly attached to the limiting ring strips.

[0015] Furthermore, a measuring arch piece is fixedly provided on the upper wall of the limiting ring bar, and one side edge of the measuring arch piece is fixed to both the conductive arch piece 1 and the conductive arch piece 2. An insulating layer is provided on the inner side of the measuring arch piece close to the fixed edge, and two tilting points are fixedly provided on the insulating layer. The two tilting points correspond to the conductive arch piece 1 and the conductive piece 2 respectively, and the conductive arch piece 1 and the conductive piece 2 are respectively connected to the intelligent control module through wires.

[0016] A second aspect of the present invention provides a method for using a semiconductor iron ring flip lifting device, comprising the following steps:

[0017] S1, initial positioning stage: The elevator in the lifting main frame drives the driving box to move vertically, driving the protective box and the clamping ring arm to reach the preset working height, so that the semiconductor iron ring to be processed enters the operating area between the two clamping ring arms;

[0018] S2, synchronous clamping stage: the control system starts the arm drive cylinder, which rotates synchronously with the pull plate around the rotary axis through the limit plate, driving the two clamping ring arms to move horizontally towards each other;

[0019] During the clamping process, the wedge-shaped structure of the ring limiter guides the semiconductor iron ring into the clamping ring groove to complete the initial mechanical clamping;

[0020] S3, fluid calibration stage: After the clamping arm clamps the semiconductor iron ring according to the preset system, the pressure-controlled cylinder drives the extrusion plate to perform progressive extrusion on the liquid outlet bag, and the pressurized fluid is injected into the ring-fitting liquid bag through the liquid pipe;

[0021] The ring-fitting sac forms a periodic wave topology under the constraint of the inelastic bundle sac wire. The fluid pressure difference is used to make the iron ring automatically slide to the same phase peak-trough position of multiple ring-fitting sacs, thus realizing the hydrodynamic calibration of the iron ring's horizontal posture.

[0022] S4, deformation monitoring stage: During the continuous clamping process, the measuring arch pieces distributed on the limit ring bar monitor the deformation of the iron ring in real time:

[0023] (a) When the iron ring remains flat, the measuring arch piece maintains non-conductive contact with the conductive arch piece 1 and the conductive arch piece 2 only through the insulating layer;

[0024] (b) When the iron ring bulges due to stress concentration, the bulge compresses the measuring arch piece, causing it to elastically deform. This causes the conductive end of the measuring arch piece to contact both the first and second conductive arch pieces simultaneously, forming a closed-loop electrical signal path.

[0025] S5, dynamic adjustment stage: The intelligent control module adjusts the output pressure of the pressure control cylinder in real time through the control algorithm according to the number and distribution characteristics of the received electrical signals, and dynamically optimizes the wave topology of the ring-adapting sac;

[0026] When the electrical signal disappears, it indicates that the iron ring has returned to a flat state, and the current pressure parameters are maintained;

[0027] Finally, the flip motor drives the protective box to complete the flipping operation, realizing the spatial posture transformation of the iron ring.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The present invention achieves flexible, lossless clamping and automatic horizontal calibration of the semiconductor iron ring through the synergistic effect of the ring-fitting liquid sac embedded in the clamping ring arm and the inelastic bundle sac wire. The flexible wave topology dynamically fits the iron ring contour, and after liquid injection, the liquid sac surface forms phase-aligned wave peaks and valleys. The fluid inertia is used to guide the iron ring to slide autonomously to the theoretical horizontal position, eliminating manual alignment errors. The inelastic bundle sac wire serves as an inner lining skeleton, which not only restrains the excessive expansion of the liquid sac but also maintains the phase stability of the wave structure through its inelastic properties.

[0030] The equidistant array design of the ring-fitting liquid capsule is compatible with iron rings of different curvature radii. A single set of devices can adapt to products of multiple specifications, significantly reducing the cost of equipment replacement. This design breaks through the limitations of rigid clamping and improves calibration efficiency while ensuring the structural integrity of the iron ring. It is especially suitable for high-precision semiconductor manufacturing scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the overall structure of a semiconductor iron ring flipping and lifting device in Example 1;

[0032] Figure 2 This is a schematic diagram of the internal structure of a driving box of the present invention in Example 1;

[0033] Figure 3 yes Figure 2 A magnified schematic diagram of point A in the middle;

[0034] Figure 4 This is a schematic structural diagram of an initial state of a ring-adapting liquid capsule in Example 1;

[0035] Figure 5 This is a schematic structural diagram of a liquid discharge capsule in Example 1;

[0036] Figure 6 This is a schematic diagram of the internal structure of a ring-adapting liquid capsule in Example 1;

[0037] Figure 7 Schematic diagram of the expansion structure of a ring-adapting liquid capsule in Example 1;

[0038] Figure 8 1 is a schematic structural diagram of an arch measuring mechanism in Example 1;

[0039] Figure 9This is a schematic diagram of the back structure of an arch measuring piece in Example 1.

[0040] Explanation of the reference numerals: 11. driving box; 12. lifting main frame; 13. flipping motor component; 2. flipping mechanism; 21. clamping ring arm; 22. clamping ring groove; 221. pressure-control cylinder; 222. ring limiting strip; 223. ring-adapting liquid capsule; 224. liquid passage; 226. capsule wire; 227. fixing plate; 228. extrusion plate; 229. liquid outlet capsule; 23. protective box; 24. rotating shaft; 25. driving arm cylinder; 26. limiting plate; 27. pulling plate; 3. arch measuring mechanism; 31. conductive arch piece 1; 32. conductive piece 2; 33. arch measuring piece; 34. elastic strip; 35. insulating layer; 36. warping point; 38. intelligent control module. DETAILED DESCRIPTION

[0041] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed solely to enable those skilled in the art to better understand and implement the subject matter described herein, and that the functions and arrangements of the elements discussed may be varied without departing from the scope of this specification. Various examples may omit, substitute, or add various processes or components as needed. In addition, features described with respect to some examples may also be combined in other examples.

[0042] Example 1

[0043] like Figures 1-9 As shown, this embodiment provides a semiconductor iron ring flipping and lifting device comprising a drive box 11 and a flipping mechanism 2 disposed on one side of the drive box 11. The flipping mechanism 2 comprises two clamping arms 21 that can move horizontally toward each other to clamp the iron ring. Iron ring flattening elements and multiple sets of arch measuring mechanisms 3 are evenly distributed on opposite sides of the clamping arms 21. Both the arch measuring mechanisms 3 and the flipping mechanism 2 are connected to a control system.

[0044] The iron ring flattening element comprises multiple equally spaced ring-adapting sacs 223. Each sac 223 is secured to its inner wall with an inelastic sac thread 226. These sac threads limit lateral expansion during injection, allowing only longitudinal deformation. When the iron ring is gripped by the flipping mechanism 2 and the sacs 223 are filled with liquid, they form a flexible wave topology. Through flexible extrusion, the iron ring automatically slides to the in-phase wave peaks and valleys within this topology, achieving horizontal force calibration for the iron ring.

[0045] The arch-measuring mechanism 3 includes conductive arch piece 1 31 and conductive arch piece 2 32, positioned above and below the ring-adapting sac 223. When the iron ring held by the flipping mechanism 2 arches due to uneven force, the arched portion of the iron ring causes the conductive arch piece 1 31 to deform and contact the conductive arch piece 2 32, generating an electrical signal, such as a current signal. The control system dynamically adjusts the clamping force parameters of the flipping mechanism 2 based on this signal, achieving closed-loop force-deformation control.

[0046] A lifting main frame 12 is provided on the side of the driving box 11 away from the turning mechanism 2 . The driving box 11 is fixedly connected to the elevator in the lifting main frame 12 . The driving box 11 is controlled by the elevator in the lifting main frame 12 to move up and down.

[0047] The flipping mechanism 2 also includes a protection box 23 , which has a flipping motor 13 fixedly mounted at the center of the protection box 23 near the driving box 11 . The flipping motor 13 is fixed in the driving box 11 , and the protection box 23 can flip when driven by the flipping motor 13 .

[0048] A rotating shaft 24 is fixedly provided at the inner center position of the protective box 23, and follow-pull plates 27 are rotatably provided at both ends of the rotating shaft 24, and a limiting plate 26 is provided on the outside of the two follow-pull plates 27. A driving arm cylinder 25 is fixedly provided on one side of the limiting plate 26, and the driving arm cylinder 25 is fixedly connected to the back plate of the protective box 23. The ends of the two follow-pull plates 27 away from the follow-pull plates 27 are each fixedly connected to a clamping ring arm 21.

[0049] The clamping area of ​​the clamping arm 21 is a clamping groove 22 . In the initial state, the side wall of the ring-fitting liquid capsule 223 is flush with the inner wall of the clamping groove 22 .

[0050] The liquid inlet ends of several ring-adapting liquid capsules 223 are fixedly connected to the liquid tube 224, and the liquid tube 224 is fixedly connected to the clamping ring arm 21. The end of the liquid tube 224 away from the ring-adapting liquid capsule 223 is connected to the liquid outlet capsule 229, and there are two liquid outlet capsules 229, which correspond to the liquid tubes 224 on the two clamping ring arms 21 respectively.

[0051] A fixed plate 227 is fixedly provided above the two liquid outlet bags 229, and an extrusion plate 228 is fixedly provided on the lower wall of the fixed plate 227. The lower wall of the extrusion plate 228 is fixedly connected to the telescopic arm of the pressure control cylinder 221. The fixed plate 227 is fixedly connected to the outer shell of the pressure control cylinder 221 through a connecting plate. The two liquid outlet bags 229 are clamped between the extrusion plate 228 and the fixed plate 227.

[0052] Limiting ring strips 222 are fixedly provided at the upper and lower parts of the clamping ring groove 22 . The thickness of the two limiting ring strips 222 gradually increases from the distal side to the side of the ring-fitting liquid capsule 223 . Several groups of conductive arch pieces 1 31 and conductive pieces 2 32 are tightly attached to the limiting ring strips 222 .

[0053] A measuring arch piece 33 is fixedly provided on the upper wall of the limiting ring bar 222, and one side of the measuring arch piece 33 is fixed to both the conductive arch piece 1 31 and the conductive piece 2 32. An insulating layer 35 is provided on the inner side of the measuring arch piece 33 near the fixed side, and two tilting points 36 are fixedly provided on the insulating layer 35. The two tilting points 36 correspond to the conductive arch piece 1 31 and the conductive piece 2 32 respectively. The conductive arch piece 1 31 and the conductive piece 2 32 are respectively connected to the intelligent control module 38 through wires.

[0054] Example 2

[0055] This embodiment provides a method for using a semiconductor iron ring to flip and lift a device, comprising the following steps:

[0056] S1, initial positioning stage: The elevator in the lifting main frame 12 drives the driving box 11 to move vertically, driving the protective box 23 and the clamping ring arms 21 to reach the preset working height, so that the semiconductor iron ring to be processed enters the operating area between the two clamping ring arms 21;

[0057] S2, synchronous clamping stage: the control system starts the arm drive cylinder 25, which pulls the pull plate 27 to rotate synchronously around the rotary axis 24 through the limit plate 26, driving the two clamping ring arms 21 to move horizontally towards each other;

[0058] During the clamping process, the wedge-shaped structure of the ring-limiting bar 222 guides the semiconductor iron ring into the clamping ring groove 22 to complete the initial mechanical clamping;

[0059] S3, fluid calibration stage: After the clamping arm 21 clamps the semiconductor iron ring according to the preset system, the pressure-controlled cylinder 221 drives the extrusion plate 228 to perform progressive extrusion on the liquid outlet capsule 229, and the pressurized fluid is injected into the ring-fitting liquid capsule 223 through the liquid passage 224;

[0060] The ring-adapting liquid capsule 223 forms a periodic wave topology under the constraint of the inelastic bundle filament 226. The iron ring is automatically slid to the same phase peak-trough position of multiple ring-adapting liquid capsules 223 by using the fluid pressure difference, thus realizing the hydrodynamic calibration of the horizontal posture of the iron ring.

[0061] S4, deformation monitoring stage: During the continuous clamping process, the measuring arch pieces 33 distributed on the ring limit bar 222 monitor the deformation of the iron ring in real time:

[0062] When the iron ring is kept flat, the measuring arch piece 33 maintains non-conductive contact with the conductive arch piece 1 31 and the conductive arch piece 2 32 only through the insulating layer 35;

[0063] b. When the iron ring bulges due to stress concentration, the bulged area presses the measuring arch piece 33 to cause it to elastically deform, causing the conductive end of the measuring arch piece 33 to contact the conductive arch piece 1 31 and the conductive piece 2 32 at the same time, forming a closed-loop electrical signal path;

[0064] S5, dynamic adjustment stage: the intelligent control module 38 adjusts the output pressure of the pressure control cylinder 221 in real time through the control algorithm according to the number and distribution characteristics of the received electrical signals, and dynamically optimizes the wave topology of the ring-adapting liquid capsule 223;

[0065] When the electrical signal disappears, it indicates that the iron ring has returned to a flat state, and the current pressure parameters are maintained;

[0066] Finally, the flip motor 13 drives the protective box 23 to complete the flipping operation, thereby realizing the spatial posture conversion of the iron ring.

[0067] During operation, the elevator in the lifting main frame 12 drives the protective box 23 to the specified position, so that the semiconductor iron ring is just between the two clamping ring arms 21, and then the system controls the arm driving cylinder 25 to work and pull the limit plate 26 toward the rotating shaft 24, thereby driving the follow-up plate 27 in the same direction as the arm driving cylinder 25 to move toward the rotating shaft 24 through the rotating shaft 24, and the clamping ring arm 21 on the other side is just driven by the rotating shaft 24 to move toward the rotating shaft 24. At this time, the two clamping ring arms 21 move toward the center position at the same time until the semiconductor iron ring is clamped in the clamping ring groove 22.

[0068] When the two clamping ring arms 21 move toward the semiconductor iron ring at the same time, the semiconductor iron ring can be scooped up by the ring limiting strip 222 and just fall into the clamping ring groove 22;

[0069] When the semiconductor iron ring moves to the position set by the system, it just fits the semiconductor iron ring to be clamped. If the iron ring tilts when clamping the semiconductor iron ring, the clamping force of the two clamping ring arms 21 on the semiconductor iron ring will change, and the phenomenon of arching may occur, which will affect the semiconductor iron ring.

[0070] When the two clamping arms 21 clamp the semiconductor iron ring, the system controls the pressure-controlled cylinder 221 to work, so that the squeezing plate 228 rises and squeezes the two liquid outlet capsules 229 at the same time. The liquid in the two liquid outlet capsules 229 enters the liquid pipe 224 through the corresponding pipes, and is diverted to each suitable ring liquid capsule 223 through the liquid pipe 224. The suitable ring liquid capsule 223 is expanded by the gradual increase of hydraulic pressure. The multiple bundle capsule wires 226 in the suitable ring liquid capsule 223 exert a restraining tension on the inner wall, so that the suitable ring liquid capsule 223 forms a wave shape. If the semiconductor iron ring tilts, the wave peak and valley position of the semiconductor iron ring may be different at this time. As the peak and valley of the suitable ring liquid capsule 223 exert an extrusion force on the semiconductor iron ring, the semiconductor iron ring can automatically move to the height of the peak and valley position of most suitable ring liquid capsules 223, thereby achieving external force leveling.

[0071] If the semiconductor iron ring is deformed under pressure and forms an arch under the clamping of the two clamping ring arms 21, the arched position of the semiconductor iron ring will squeeze the measuring arch piece 33, so that the measuring arch piece 33 contacts the conductive arch piece 1 31 and the conductive arch piece 2 32 at the same time, so that the conductive arch piece 1 31 and the conductive piece 2 32 are energized. When the electrical signal is transmitted to the intelligent control module 38, the greater the arc of the semiconductor iron ring, the more measuring arch pieces 33 are squeezed, and the more electrical signals are received by the intelligent control module 38. The intelligent control module 38 can control the pressure control cylinder 221 through an intelligent algorithm to adjust the clamping force of the two clamping ring arms 21 on the semiconductor iron ring until the semiconductor iron ring can no longer contact all the measuring arch pieces 33. At this time, under the action of the elastic strip 34 and the two tilting points 36, the conductive end of the measuring arch piece 33 is no longer in contact with the conductive arch piece 1 31 and the conductive piece 2 32.

[0072] Finally, the protection box 23 and the clamping ring arm 21 are rotated 180 degrees by the turning motor 13 .

[0073] The above describes the embodiments of the present invention, but the present invention is not limited to the above specific implementation methods. The above specific implementation methods are merely illustrative and not restrictive. Ordinary technicians in this field can also make many forms based on the inspiration of this embodiment, all of which are protected by this embodiment.

Claims

1. A semiconductor iron ring flip lifting device, characterized in that: The invention comprises a driving box (11) and a flipping mechanism (2) arranged on one side of the driving box (11); the flipping mechanism (2) comprises two clamping ring arms (21) which can move toward each other in the horizontal direction and are used to clamp the iron ring; iron ring driving flattening members and multiple sets of arch measuring mechanisms (3) are evenly distributed on opposite sides of the clamping ring arms (21); the arch measuring mechanisms (3) and the flipping mechanism (2) are both connected to a control system; The iron ring driving and leveling member comprises a plurality of ring-adapting liquid capsules (223) arranged at equal intervals, wherein an inelastic bundled capsule wire (226) is fixed on the inner wall of each ring-adapting liquid capsule (223); when the iron ring is clamped by the flip mechanism (2) and the plurality of ring-adapting liquid capsules (223) are injected with liquid, the plurality of ring-adapting liquid capsules (223) can form a flexible wave topological structure, and the iron ring is automatically slid to the same-phase wave peak and valley position within the flexible wave topological structure through flexible extrusion, thereby realizing horizontal calibration of the external force of the iron ring; The arch measuring mechanism (3) includes a conductive arch piece 1 (31) and a conductive arch piece 2 (32) arranged above and below the ring-adapting liquid capsule (223). When the iron ring clamped by the flipping mechanism (2) is subjected to uneven force and arches, the arched part of the iron ring can drive the conductive arch piece 1 (31) to deform and contact with the conductive arch piece 2 (32), thereby generating an electrical signal. The control system can dynamically adjust the clamping force parameters of the flipping mechanism (2) according to the electrical signal to realize force-deformation closed-loop control.

2. A semiconductor iron ring flipping and lifting device according to claim 1, characterized in that: A lifting main frame (12) is provided on a side of the driving box (11) away from the turning mechanism (2). The driving box (11) is fixedly connected to an elevator in the lifting main frame (12). The driving box (11) is controlled by the elevator in the lifting main frame (12) to be lifted or lowered.

3. The semiconductor iron ring flipping and lifting device according to claim 1, characterized in that: The flipping mechanism (2) further comprises a protective box (23), a flipping motor component (13) being fixedly provided at a central position of the protective box (23) close to one side of the driving box (11), and the flipping motor component (13) being fixed in the driving box (11), and the protective box (23) can be flipped under the driving of the flipping motor component (13).

4. A semiconductor iron ring flipping and lifting device according to claim 3, characterized in that: A rotating shaft (24) is fixedly provided at the inner center position of the protection box (23), and pull-type plates (27) are rotatably provided at both ends of the rotating shaft (24), and a limiting plate (26) is provided on the outside of one of the two pull-type plates (27), and an arm driving cylinder (25) is fixedly provided on one side of the limiting plate (26), and the arm driving cylinder (25) is fixedly connected to the back plate of the protection box (23), and one end of the two pull-type plates (27) is fixedly connected to a clamping ring arm (21) respectively.

5. The semiconductor iron ring flipping and lifting device according to claim 1, characterized in that: The clamping ring area of ​​the clamping ring arm (21) is a clamping ring groove (22), and when in the initial state, the side wall of the ring-adapting liquid capsule (223) is flush with the inner wall of the clamping ring groove (22).

6. The semiconductor iron ring flipping and lifting device according to claim 1, characterized in that: The liquid inlet ends of the plurality of the ring-adapting liquid capsules (223) are fixedly connected to the liquid passage tube (224), the liquid passage tube (224) is fixedly connected to the clamping ring arm (21), and the end of the liquid passage tube (224) away from the ring-adapting liquid capsule (223) is connected to the liquid outlet capsule (229), and there are two liquid outlet capsules (229) in total, corresponding to the liquid passage tubes (224) on the two clamping ring arms (21) respectively.

7. A semiconductor iron ring flipping and lifting device according to claim 6, characterized in that: A fixing plate (227) is fixedly provided above the two liquid outlet capsules (229), an extrusion plate (228) is fixedly provided on the lower wall of the fixing plate (227), and the lower wall of the extrusion plate (228) is fixedly connected to the telescopic arm of the pressure control cylinder (221), and the fixing plate (227) is fixedly connected to the outer shell of the pressure control cylinder (221) via a connecting plate, and the two liquid outlet capsules (229) are clamped between the extrusion plate (228) and the fixing plate (227).

8. The semiconductor iron ring flipping and lifting device according to claim 5, characterized in that: The upper and lower parts of the clamping ring groove (22) are fixedly provided with limiting ring strips (222), and the thickness of the two limiting ring strips (222) gradually increases from the distal side to the side of the ring-fitting liquid capsule (223), and a plurality of groups of the conductive arch piece 1 (31) and the conductive piece 2 (32) are tightly attached to the limiting ring strips (222).

9. The semiconductor iron ring flipping and lifting device according to claim 8, characterized in that: A measuring arch piece (33) is fixedly provided on the upper wall of the limiting ring strip (222), and one side of the measuring arch piece (33) is fixed to both the conductive arch piece 1 (31) and the conductive arch piece 2 (32). An insulating layer (35) is provided on the inner side of the measuring arch piece (33) close to the fixed side, and two tilting points (36) are fixedly provided on the insulating layer (35). The two tilting points (36) correspond to the conductive arch piece 1 (31) and the conductive arch piece 2 (32), respectively. The conductive arch piece 1 (31) and the conductive arch piece 2 (32) are connected to the intelligent control module (38) through wires.

10. A method for using the semiconductor iron ring flipping and lifting device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, initial positioning stage: the driving box (11) is driven vertically by the elevator in the lifting main frame (12), driving the protective box (23) and the clamping ring arm (21) to reach the preset working height, so that the semiconductor iron ring to be processed enters the operating area between the two clamping ring arms (21); S2, synchronous clamping stage: the control system starts the arm drive cylinder (25), pulls the pull plate (27) through the limit plate (26) to rotate synchronously around the rotary axis (24), and drives the two clamping ring arms (21) to move horizontally toward each other; During the clamping process, the wedge-shaped structure of the ring-limiting strip (222) guides the semiconductor iron ring into the clamping ring groove (22), completing the initial mechanical clamping; S3, fluid calibration stage: after the clamping ring arm (21) clamps the semiconductor iron ring according to the preset system, the pressure-controlled cylinder (221) drives the extrusion plate (228) to perform progressive extrusion on the liquid outlet sac (229), and the pressure fluid is injected into the ring-fitting liquid sac (223) through the liquid passage (224); The ring-adapting liquid capsule (223) forms a periodic wave topology structure under the constraint of the inelastic bundle capsule wire (226), and utilizes the fluid pressure difference to make the iron ring automatically slide to the same phase peak-trough position of multiple ring-adapting liquid capsules (223), thereby realizing the hydrodynamic calibration of the horizontal posture of the iron ring; S4, deformation monitoring stage: During the continuous clamping process, the measuring arch pieces (33) distributed on the ring limit strip (222) monitor the deformation of the iron ring in real time: (a) When the iron ring is kept flat, the measuring arch piece (33) maintains non-conductive contact with the conductive arch piece 1 (31) and the conductive arch piece 2 (32) only through the insulating layer (35); (b) When the iron ring is arched due to stress concentration, the arched area presses the measuring arch piece (33) to cause it to elastically deform, causing the conductive end of the measuring arch piece (33) to contact the conductive arch piece 1 (31) and the conductive piece 2 (32) at the same time, forming a closed-loop electrical signal path; S5, dynamic adjustment stage: the intelligent control module (38) adjusts the output pressure of the pressure control cylinder (221) in real time through the control algorithm according to the number and distribution characteristics of the received electrical signals, and dynamically optimizes the wave topology structure of the ring-adapting liquid capsule (223); When the electrical signal disappears, it indicates that the iron ring has returned to a flat state, and the current pressure parameters are maintained; Finally, the flip motor (13) drives the protective box (23) to complete the flip operation, thereby realizing the spatial posture conversion of the iron ring.

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