Semiconductor device packaging structure and ball mounting device

Abstract

The invention discloses a semiconductor device packaging structure and a ball mounting device, and the semiconductor device packaging structure, and is characterized in that the semiconductor device packaging structure comprises a packaging substrate, a semiconductor device disposed at one side of the packaging substrate, and a plastic package body covering the semiconductor device; wherein one side, deviating from the semiconductor device, of the packaging substrate comprises a first welding area and a second welding area, the first welding area is provided with a first welding ball, the second welding area is provided with a second welding ball, and the strength of the first welding ball is different from that of the second welding ball. According to the embodiment of the invention, the first welding ball and the second welding ball are respectively arranged in the first welding area and the second welding area on the side, deviating from the semiconductor device, of the packaging substrate, and the strength of the first welding ball is different from that of the second welding ball, so that the electrical performance index of the packaging structure of the semiconductor device can be met; the connection strength between the semiconductor device packaging structure and other devices is improved, so that the problem that the solder balls between the semiconductor device packaging structure and other devices are cracked or fractured is avoided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor device packaging structure and a ball planting device. Background Art

[0002] In the prior art, after semiconductor devices are manufactured, they are typically packaged to provide support and protection for the semiconductor devices, reduce environmental impact, and facilitate connections between the semiconductor devices and other devices. However, during the semiconductor device packaging process, several issues remain to be addressed. Summary of the Invention

[0003] The embodiments of the present application provide a semiconductor device packaging structure and a ball planting device, which aim to solve the problem that the existing semiconductor device packaging structure cannot simultaneously meet the electrical performance indicators and connection strength.

[0004] An embodiment of the present application provides a semiconductor device packaging structure, including a packaging substrate, a semiconductor device arranged on one side of the packaging substrate, and a plastic package covering the semiconductor device; wherein the side of the packaging substrate facing away from the semiconductor device includes a first welding area and a second welding area, the first welding area is provided with a first solder ball, the second welding area is provided with a second solder ball, and the strength of the first solder ball is different from the strength of the second solder ball.

[0005] In some embodiments, the first welding regions are distributed along the circumference of the second welding regions.

[0006] In some embodiments, the strength of the first solder ball is greater than the strength of the second solder ball.

[0007] In some embodiments, the side of the packaging substrate facing away from the semiconductor device also includes a third welding area, the third welding area is located at the junction of the two adjacent sides of the second welding area, and the third welding area is provided with a third solder ball, and the strengths of the first solder ball, the second solder ball and the third solder ball are different.

[0008] In some embodiments, the packaging substrate includes at least two third welding regions, and the at least two third welding regions are distributed on both sides of the second welding region along a diagonal line of the second welding region.

[0009] In some embodiments, the third solder ball comprises a long strip structure, and a length direction of the third solder ball is consistent with an extension direction of the corresponding diagonal line.

[0010] In some embodiments, the packaging substrate includes a plurality of the first welding areas and a plurality of the third welding areas, and the plurality of the first welding areas and the plurality of the third welding areas are alternately distributed along a circumference of the second welding area.

[0011] In some embodiments, the volume of the third solder ball is greater than the volumes of the first solder ball and the second solder ball; and / or, the strength of the third solder ball is greater than the strengths of the first solder ball and the second solder ball.

[0012] In some embodiments, the first solder ball is electrically connected to the semiconductor device.

[0013] An embodiment of the present application further provides a solder ball picking device, including at least one solder ball picking component. One side of the solder ball picking component includes a first adsorption area and a second adsorption area. The first adsorption area is provided with a first adsorption hole, and the second adsorption area is provided with a second adsorption hole. The first adsorption hole is used for sucking and releasing the first solder ball, and the second adsorption hole is used for sucking and releasing the second solder ball. The strength of the first solder ball is different from the strength of the second solder ball.

[0014] In some embodiments, the first adsorption area is distributed along the circumferential direction of the second adsorption area.

[0015] In some embodiments, the strength of the first solder ball is greater than the strength of the second solder ball.

[0016] In some embodiments, one side of the solder ball picking component further includes a third adsorption area. The third adsorption area is located at the junction of adjacent sides of the second adsorption area. The third adsorption area is provided with a third adsorption hole. The third adsorption hole is used for adsorbing the third solder ball. The strengths of the first solder ball, the second solder ball, and the third solder ball are different.

[0017] In some embodiments, the solder ball picking component includes at least two of the third adsorption areas. The at least two third adsorption areas are distributed on both sides of the first adsorption area along the diagonal of the first adsorption area.

[0018] In some embodiments, the third solder ball includes an elongated structure, and the length direction of the third solder ball is consistent with the extending direction of the corresponding diagonal.

[0019] In some embodiments, the solder ball picking component includes a plurality of the first adsorption areas and a plurality of the third adsorption areas. The plurality of the first adsorption areas and the plurality of the third adsorption areas are alternately distributed along the circumferential direction of the second adsorption area.

[0020] In some embodiments, the volume of the third solder ball is greater than the volumes of the first solder ball and the second solder ball; and / or, the strength of the third solder ball is greater than the strengths of the first solder ball and the second solder ball.

[0021] In some embodiments, the solder ball picking component includes a first picking member and a second picking member that are slidably connected. The first adsorption area is located on one side of the first picking member in the sliding direction relative to the second picking member, and the second adsorption area is located on one side of the second picking member in the sliding direction relative to the first picking member.

[0022] In some embodiments, the solder ball picking component further includes a third picking member that is slidably connected to the first picking member. The third adsorption area is located on one side of the third picking member along the sliding direction of the third picking member relative to the first picking member.

[0023] In some embodiments, the ball planting device includes a plurality of the solder ball picking components that are distributed in an array.

[0024] In the semiconductor device packaging structure provided by the embodiments of the present application, a first solder ball is provided in a first welding area on the side of the packaging substrate facing away from the semiconductor device, a second solder ball is provided in a second welding area on the side of the packaging substrate facing away from the semiconductor device, and the strength of the first solder ball is different from the strength of the second solder ball, that is, the strength of the first solder ball is different from the strength of the second solder ball. Thus, the solder ball with the lower strength among the first solder ball and the second solder ball can have higher electrical performance to meet the electrical performance indicators of the semiconductor device packaging structure, while the solder ball with the higher strength among the first solder ball and the second solder ball is used to improve the connection strength between the semiconductor device packaging structure and other devices, so as to avoid cracking or breaking of the solder balls between the semiconductor device packaging structure and other devices, and further avoid the problem of open circuit between the semiconductor device packaging structure and other devices. Description of the Drawings

[0025] The following will make the technical solutions and other beneficial effects of the present application obvious by combining the drawings and describing the specific embodiments of the present application in detail.

[0026] Figure 1 It is a cross-sectional view of an embodiment of the semiconductor device packaging structure provided by the embodiments of the present application;

[0027] Figure 2 It is a bottom view of an embodiment of the semiconductor device packaging structure provided by the embodiments of the present application;

[0028] Figure 3 It is a bottom view of another embodiment of the semiconductor device packaging structure provided by the embodiments of the present application;

[0029] Figure 4 It is a structural schematic diagram of an embodiment of the ball planting device provided by the embodiments of the present application;

[0030] Figure 5 It is a structural schematic diagram of an embodiment of the solder ball picking component provided by the embodiments of the present application;

[0031] Figure 6 A structural schematic diagram of an embodiment of the storage system provided by an embodiment of the present application;

[0032] Figure 7 A structural schematic diagram of an embodiment of the electronic device provided by an embodiment of the present application.

[0033] Semiconductor device packaging structure 1; packaging substrate 11; semiconductor device 12; plastic package 13; conductive lead 14; conductive contact 15; conductive line 16; first welding area 111; first solder ball 21; second welding area 112; second solder ball 22; third welding area 113; third solder ball 23; diagonal line L; solder ball planting device 3; solder ball picking component 30; first picking part 31; first adsorption area 311; first adsorption hole 312; mounting hole 313; second picking part 32; second adsorption area 321; second adsorption hole 322; third picking part 33; third adsorption area 331; third adsorption hole 332; storage system 4; controller 5; memory 6; electronic device 7; central processing unit 8; host 9. Detailed implementation manners

[0034] Next, the technical solutions in the present disclosure will be clearly and completely described in conjunction with the accompanying drawings in the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present disclosure.

[0035] It should be understood that although terms such as first and second can be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one component from another. For example, the first component can be called the second component, and similarly, the second component can be called the first component without departing from the scope of the present disclosure.

[0036] It should be understood that when a component is said to be "on" another component or "connected" to another component, it can be directly on the other component or connected to the other component, or there can also be an inserted component. Other words used to describe the relationship between components should be interpreted in a similar manner.

[0037] As used herein, the term "layer" refers to a portion of a material that includes a region having a thickness. A layer has a top side and a bottom side, where the bottom side of the layer is relatively closer to the substrate, and the top side is relatively farther from the substrate. A layer can extend over the entire underlying or overlying structure, or can have a scope smaller than the scope of the underlying or overlying structure. Additionally, a layer can be a region of a uniform or non-uniform continuous structure with a thickness less than the thickness of the continuous structure. For example, a layer can be located between the top and bottom surfaces of a continuous structure or between any set of horizontal planes at the top and bottom surfaces. A layer can extend horizontally, vertically, and / or along a tapered surface. A substrate can be a layer, which can include one or more layers, and / or can have one or more layers on, above, and / or below it. A layer can include multiple layers. For example, an interconnect layer can include one or more conductive layers and contact layers (where contacts, interconnect lines, and one or more dielectric layers are formed).

[0038] Embodiments of the present application provide a semiconductor device packaging structure and a ball mounting device. The following will be described in detail respectively.

[0039] First, embodiments of the present application provide a semiconductor device packaging structure.

[0040] Figure 1 It is a schematic structural diagram of an embodiment of the semiconductor device packaging structure provided by the embodiments of the present application. As Figure 1 shown, the semiconductor device packaging structure 1 includes a packaging substrate 11, a semiconductor device 12 disposed on one side of the packaging substrate 11, and a plastic encapsulant 13 covering the semiconductor device 12. Among them, the packaging substrate 11 can be a printed circuit board or other substrate provided with conductive lines 16 or conductive structures. The semiconductor device 12 can include a memory chip (such as a three-dimensional memory chip, a DRAM memory chip, etc.), a peripheral control chip, or other types of chips. The number of semiconductor devices 12 disposed on one side of the packaging substrate 11 can be one or more, and moreover, when the number of semiconductor devices 12 is multiple, the multiple semiconductor devices 12 can include the same type of chips or can include different types of chips. The semiconductor device 12 can be electrically connected to the conductive lines 16 or conductive structures of the packaging substrate 11.

[0041] Specifically, a conductive contact 15 is provided on the surface of the side of the packaging substrate 11 where the semiconductor device 12 is disposed, and the conductive contact 15 is electrically connected to the conductive lines 16 or conductive structures of the packaging substrate 11. The semiconductor device 12 is connected to the conductive contact 15 through a conductive lead 14, so that the semiconductor device 12 is electrically connected to the conductive lines 16 or conductive structures of the packaging substrate 11. Among them, the number of conductive contacts 15 is multiple, and the semiconductor device 12 is connected to different conductive contacts 15 through different conductive leads 14.

[0042] The plastic package body 13 and the semiconductor device 12 are disposed on the same side of the package substrate 11, and the plastic package body 13 covers one side surface of the semiconductor device 12, the conductive leads 14 and the package substrate 11 to implement the encapsulation of the semiconductor device 12. When the number of semiconductor devices 12 is multiple, the plastic package body 13 covers the multiple semiconductor devices 12.

[0043] Continue to refer to Figure 1 , solder balls (21, 22) are provided on the side of the package substrate 11 of the semiconductor device package structure 1 facing away from the semiconductor device 12 to facilitate the soldering connection between the semiconductor device package structure 1 and other devices. Among them, the solder balls (21, 22) can be connected to the conductive lines 16 or conductive structures of the package substrate 11, so that the solder balls (21, 22) can be electrically connected to the semiconductor device 12 through the conductive lines 16 or conductive structures of the package substrate 11. After the semiconductor device package structure 1 is soldered to other devices through the solder balls (21, 22), the electrical signal transmission between the semiconductor device 12 of the semiconductor package structure and other devices can be realized. The semiconductor device package structure 1 can be a semiconductor ball grid array (Ball Grid Array, BGA) package structure or other semiconductor device package structures 1 with solder balls. The materials of the solder balls (21, 22) can include tin, lead, alloys, etc. Depending on the materials, the solder balls (21, 22) will have different performances in electrical properties and strength.

[0044] Since the semiconductor device package structure 1 has a variety of application scenarios, the semiconductor device package structure 1 may be affected by environmental changes such as vibration, shock, high temperature, current, etc. Therefore, after the package substrate 11 of the semiconductor device package structure 1 is soldered to other devices through the solder balls (21, 22), the solder balls (21, 22) provided on the package substrate 11 not only need to meet the electrical performance indicators of signal transmission, but also the solder balls (21, 22) connecting the package substrate 11 and other devices need to have sufficient strength to meet reliability tests such as board-level vibration tests, shock tests, drop (Drop Test) tests, temperature cycle tests, red ink tests, etc., to avoid the solder balls from cracking or breaking, and then causing the problem of open circuit between the semiconductor device package structure 1 and other devices.

[0045] To avoid the above problems, the side of the package substrate 11 of the semiconductor device package structure 1 provided by the embodiment of the present application facing away from the semiconductor device 12 includes a first welding area 111 and a second welding area 112. The first welding area 111 is provided with a first solder ball 21, and the second welding area 112 is provided with a second solder ball 22. The strength of the first solder ball 21 is different from the strength of the second solder ball 22.

[0046] In the semiconductor device packaging structure 1 provided by the embodiments of the present application, a first solder ball 21 is disposed in a first soldering area 111 on the side of the packaging substrate 11 facing away from the semiconductor device 12, and a second solder ball 22 is disposed in a second soldering area 112 on the side of the packaging substrate 11 facing away from the semiconductor device 12, and the strength of the first solder ball 21 is made different from the strength of the second solder ball 22, that is, the strength of the first solder ball 21 is made different from the strength of the second solder ball 22. Thus, the solder ball with a lower strength among the first solder ball 21 and the second solder ball 22 can have higher electrical performance to meet the electrical performance index of the semiconductor device packaging structure 1, while the solder ball with a higher strength among the first solder ball 21 and the second solder ball 22 is used to improve the connection strength between the semiconductor device packaging structure 1 and other devices, so as to avoid the problem of cracking or breaking of the solder balls between the semiconductor device packaging structure 1 and other devices, and further causing an open circuit between the semiconductor device packaging structure 1 and other devices.

[0047] It should be noted that the materials of the first solder ball 21 and the second solder ball 22 can be made different so that the strength of the first solder ball 21 is different from the strength of the second solder ball 22, or the volumes or shapes of the first solder ball 21 and the second solder ball 22 can be made different so that the strength of the first solder ball 21 is different from the strength of the second solder ball 22.

[0048] In some embodiments, the strength of the first solder ball 21 can be made greater than the strength of the second solder ball 22. Thus, the second solder ball 22 can be electrically connected to the semiconductor device 12, and the electrical performance index of the semiconductor device packaging structure 1 can be improved through the second solder ball 22, while the first solder ball 21 is used to improve the connection strength between the semiconductor device packaging structure 1 and other devices. Specifically, the second solder ball 22 is connected to the conductive line 16 or the conductive structure of the packaging substrate 11, so that the second solder ball 22 is electrically connected to the semiconductor device 12. The material of the second solder ball 22 can include any material with higher electrical performance. And the material of the first solder ball 21 can include any material with a strength greater than that of the second solder ball 22.

[0049] Specifically, for example: the material of the second solder ball 22 can include tin, lead, tin-lead alloy, tin-silver-copper alloy, etc. The material of the first solder ball 21 can include lead, tin-lead alloy, tin-silver-copper alloy, etc. Or, the first solder ball 21 can also include a copper core ball and a tin layer wrapped on the surface of the copper core ball. Among them, the materials of the first solder ball 21 and the second solder ball 22 can be alloys containing the same metal components, but the proportions of the metal components in the alloy are different, as long as the strength of the first solder ball 21 is different from the strength of the second solder ball 22.

[0050] Among them, the first solder ball 21 can be electrically connected to the semiconductor device 12. Specifically, the first solder ball 21 is connected to the conductive line 16 or the conductive structure of the package substrate 11, so that the first solder ball 21 is electrically connected to the semiconductor device 12, enabling the first solder ball 21 to transmit electrical signals while improving the connection strength between the semiconductor device package structure 1 and other devices. Of course, the first solder ball 21 may not be electrically connected to the semiconductor device 12, but mainly serves to enhance the connection strength between the semiconductor device package structure 1 and other devices.

[0051] In some embodiments, the first welding region 111 of the package substrate 11 can be distributed along the circumferential direction of the second welding region 112, so that the first solder ball 21 has a better effect of improving the connection strength between the semiconductor device package structure 1 and other devices. Among them, the first welding region 111 can be distributed around the second welding region 112 to further improve the connection strength between the semiconductor device package structure 1 and other devices.

[0052] Specifically, the second welding region 112 of the package substrate 11 is rectangular. The number of second solder balls 22 located in the second welding region 112 of the package substrate 11 is multiple. The multiple second solder balls 22 are arranged in an array in the second welding region 112. The first welding region 111 of the package substrate 11 extends along the circumferential direction of the second welding region 112 and is distributed around the second welding region 112. The number of first solder balls 21 located in the first welding region 111 of the package substrate 11 is multiple. The multiple first solder balls 21 are sequentially distributed along the extension direction of the first welding region 111.

[0053] Of course, the second welding region 112 of the package substrate 11 can also be distributed along the circumferential direction of the first welding region 111. Or, the first welding region 111 and the second welding region 112 of the package substrate 11 are distributed in other ways. For example: the package substrate 11 includes multiple first welding regions 111 and multiple second welding regions 112, and the multiple first welding regions 111 and the multiple second welding regions 112 are alternately distributed along a predetermined direction; or, the multiple first welding regions 111 and the multiple second welding regions 112 are both arranged in an array, and the second welding region 112 is located between two adjacent first welding regions 111.

[0054] In other embodiments, such as Figure 2As shown, the side of the encapsulation substrate 11 facing away from the semiconductor device 12 further includes a third solder joint area 113, which is located at the intersection of the adjacent two sides of the second solder joint area 112. The third solder joint area 113 is provided with third solder balls 23, and the strengths of the first solder balls 21, the second solder balls 22 and the third solder balls 23 are different. By making the third solder joint area 113 located at the intersection of the adjacent two sides of the second solder joint area 112, and the third solder balls 23 provided in the third solder joint area 113 having different strengths from the first solder balls 21 and the second solder balls 22, the adjustment of the semiconductor device packaging structure 1 in terms of electrical performance and structural strength can be made more flexible.

[0055] In some embodiments, the strength of the third solder balls 23 can be made greater than the strengths of the first solder balls 21 and the second solder balls 22 to further improve the connection strength between the semiconductor device packaging structure 1 and other devices. Among them, the volume of the third solder balls 23 can be made greater than the volumes of the first solder balls 21 and the second solder balls 22 so that the strength of the third solder balls 23 is greater than the strengths of the first solder balls 21 and the second solder balls 22. Specifically, the diameter of the third solder balls 23 can be made greater than the diameters of the first solder balls 21 and the second solder balls 22 so that the strength of the third solder balls 23 is greater than the strengths of the first solder balls 21 and the second solder balls 22.

[0056] Alternatively, the material of the third solder balls 23 can also be made different from the materials of the first solder balls 21 and the second solder balls 22 so that the strength of the third solder balls 23 is greater than the strengths of the first solder balls 21 and the second solder balls 22.

[0057] Specific examples are as follows: The material of the third solder balls 23 can include lead, tin-lead alloy, tin-silver-copper alloy, etc. Alternatively, the third solder balls 23 can also include copper core balls, and a tin layer wrapped on the surface of the copper core balls. Among them, the materials of the first solder balls 21, the second solder balls 22 and the third solder balls 23 can be different metals or alloys, or alloys containing the same metal components, but the proportions of the metal components in the alloy are different, as long as the strength of the third solder balls 23 is different from the strengths of the first solder balls 21 and the second solder balls 22.

[0058] Of course, the strength of the third solder balls 23 can also be made greater than the strength of the second solder balls 22 and less than the strength of the first solder balls 21, or the strength of the third solder balls 23 can be made greater than the strength of the second solder balls 22 and the strength of the third solder balls 23 is the same as the strength of the first solder balls 21.

[0059] In some embodiments, the encapsulation substrate 11 can include at least two third solder joint areas 113. Among them, the encapsulation substrate 11 includes a plurality of first solder joint areas 111 and a plurality of third solder joint areas 113, and the plurality of first solder joint areas 111 and the plurality of third solder joint areas 113 are alternately distributed along the circumferential direction of the second solder joint area 112.

[0060] In some embodiments, at least two third solder regions 113 are distributed on both sides of the second solder region 112 along the diagonal line L of the second solder region 112, so as to strengthen the connection strength between the two ends of the semiconductor device packaging structure 1 along the diagonal line L and other devices, and reduce the risk of warping or deformation at the two ends of the semiconductor device packaging structure 1 along the diagonal line L.

[0061] Specifically, the second solder region 112 of the packaging substrate 11 is rectangular. The number of the third solder regions 113 is four, and the four third solder regions 113 are distributed on both sides of the second solder region 112 along the two diagonal lines L of the second solder region 112. Each third solder region 113 is provided with a third solder ball 23. The orthographic projection shapes of the first solder ball 21, the second solder ball 22 and the third solder ball 23 on the packaging substrate 11 are circular. The diameter of the third solder ball 23 is larger than the diameters of the first solder ball 21 and the second solder ball 22, so that the strength of the third solder ball 23 is greater than the strengths of the first solder ball 21 and the second solder ball 22.

[0062] In other embodiments, as Figure 3 shown, the third solder ball 23 includes a strip-shaped structure, and the length direction of the third solder ball 23 is consistent with the extension direction of the corresponding diagonal line L, so as to further strengthen the connection strength between the two ends of the semiconductor device packaging structure 1 along the diagonal line L and other devices.

[0063] Specifically, the second solder region 112 of the packaging substrate 11 is rectangular. The number of the third solder regions 113 is four, and the four third solder regions 113 are distributed on both sides of the second solder region 112 along the two diagonal lines L of the second solder region 112. Each third solder region 113 is provided with a third solder ball 23. Each third solder ball 23 extends along the length direction of the corresponding diagonal line L.

[0064] In order to better implant the first solder ball 21 and the second solder ball 22 on the packaging substrate 11 of the semiconductor device packaging structure 1, an embodiment of the present application further provides a ball implanting device 3. As Figure 4 and Figure 5 shown, the ball implanting device 3 includes at least one solder ball picking component 30. One side of the solder ball picking component 30 includes a first adsorption region 311 and a second adsorption region 321. The first adsorption region 311 is provided with a first adsorption hole 312, and the second adsorption region 321 is provided with a second adsorption hole 322. The first adsorption hole 312 is used for sucking and releasing the first solder ball 21, and the second adsorption hole 322 is used for sucking and releasing the second solder ball 22. The strength of the first solder ball 21 is different from the strength of the second solder ball 22.

[0065] Thus, the first solder balls 21 and the second solder balls 22 can be respectively adsorbed by the first adsorption holes 312 and the second adsorption holes 322 of the solder ball pickup component 30 of the ball planting device 3. Then, the solder ball pickup component 30 is moved to a position opposite to the packaging substrate 11 of the semiconductor device packaging structure 1, so that the first solder balls 21 on the solder ball pickup component 30 correspond to the positions of the first welding areas 111 of the packaging substrate 11, and the second solder balls 22 on the solder ball pickup component 30 correspond to the positions of the second welding areas 112 of the packaging substrate 11. After that, the solder ball pickup component 30 releases the first solder balls 21 and the second solder balls 22, so that the first solder balls 21 are placed on the first welding areas 111 of the packaging substrate 11, and the second solder balls 22 are placed on the second welding areas 112 of the packaging substrate 11. Finally, the first solder balls 21 and the second solder balls 22 are heated and melted to connect the first solder balls 21 and the second solder balls 22 to the packaging substrate 11 respectively.

[0066] Among them, the shapes and distribution positions of the first adsorption area 311 and the second adsorption area 321 of the solder ball pickup component 30 can be determined according to the shapes and distribution positions of the first welding area 111 and the second welding area 112 of the packaging substrate 11, as long as the first solder balls 21 adsorbed by the first adsorption holes 312 of the first adsorption area 311 can be placed on the first welding area 111 of the packaging substrate 11, and the second solder balls 22 adsorbed by the second adsorption holes 322 of the second adsorption area 321 can be placed on the second welding area 112 of the packaging substrate 11. For example: if the first welding area 111 of the packaging substrate 11 is distributed along the circumferential direction of the second welding area 112, the first adsorption area 311 of the solder ball pickup component 30 can be distributed along the circumferential direction of the second adsorption area 321. Or, if the second welding area 112 of the packaging substrate 11 is distributed along the circumferential direction of the first welding area 111, the second adsorption area 321 of the solder ball pickup component 30 can be distributed along the circumferential direction of the first adsorption area 311.

[0067] Specifically, the second adsorption area 321 of the solder ball picking component 30 is rectangular. The number of second adsorption holes 322 located in the second adsorption area 321 of the solder ball picking component 30 is multiple. The multiple second adsorption holes 322 are distributed in an array in the second adsorption area 321. The first adsorption area 311 of the solder ball picking component 30 extends along the circumferential direction of the second adsorption area 321 and is distributed around the second adsorption area 321. The number of first adsorption holes 312 located in the first adsorption area 311 is multiple. The multiple first adsorption holes 312 are sequentially distributed along the extending direction of the first adsorption area 311. The ball planting device 3 may include an air extraction component (not shown in the figure), and the air extraction component is used to communicate with the first adsorption holes 312 and the second adsorption holes 322 to extract air from the first adsorption holes 312 and the second adsorption holes 322, so that the first adsorption holes 312 and the second adsorption holes 322 can adsorb corresponding solder balls. In addition, the ball planting device 3 may further include a moving component (not shown in the figure), and the moving component is connected to the solder ball picking component 30 to drive the solder ball picking component 30 to move, so that after the solder ball picking component 30 adsorbs the first solder ball 21 and the second solder ball 22, it can move to a position opposite to the packaging substrate 11 of the semiconductor device packaging structure 1.

[0068] In some embodiments, the strength of the first solder ball 21 is greater than that of the second solder ball 22. The materials and structures of the first solder ball 21 and the second solder ball 22 may refer to the above embodiments and will not be elaborated here.

[0069] Continuing to refer to Figure 4 and Figure 5 , one side of the solder ball picking component 30 may further include a third adsorption area 331. The third adsorption area 331 is located at the junction of the adjacent sides of the second adsorption area 321. The third adsorption area 331 is provided with third adsorption holes 332, and the third adsorption holes 332 are used to adsorb the third solder ball 23. The strengths of the first solder ball 21, the second solder ball 22, and the third solder ball 23 are different.

[0070] Therefore, when the packaging substrate 11 of the semiconductor device packaging structure 1 includes the third welding area 113, the first solder ball 21, the second solder ball 22, and the third solder ball 23 can be respectively adsorbed through the first adsorption hole 312, the second adsorption hole 322, and the third adsorption hole 332 of the solder ball pickup component 30 of the ball planting device 3; then, the solder ball pickup component 30 is moved to a position opposite to the packaging substrate 11 of the semiconductor device packaging structure 1, so that the first solder ball 21 on the solder ball pickup component 30 corresponds to the position of the first welding area 111 of the packaging substrate 11, the second solder ball 22 on the solder ball pickup component 30 corresponds to the position of the second welding area 112 of the packaging substrate 11, and the third solder ball 23 on the solder ball pickup component 30 corresponds to the position of the third welding area 113 of the packaging substrate 11; after that, the solder ball pickup component 30 releases the first solder ball 21, the second solder ball 22, and the third solder ball 23, so that the first solder ball 21 is placed on the first welding area 111 of the packaging substrate 11, the second solder ball 22 is placed on the second welding area 112 of the packaging substrate 11, and the third solder ball 23 is placed on the third welding area 113 of the packaging substrate 11. Finally, the first solder ball 21, the second solder ball 22, and the third solder ball 23 are heated and melted, so that the first solder ball 21, the second solder ball 22, and the third solder ball 23 are respectively connected to the packaging substrate 11.

[0071] Wherein, the shape and distribution position of the third adsorption area 331 of the solder ball pickup component 30 can be determined according to the shape and distribution position of the third welding area 113 of the packaging substrate 11, as long as the solder balls adsorbed by the adsorption holes of each adsorption area can be placed on the corresponding welding area of the packaging substrate 11.

[0072] For example: the packaging substrate 11 includes at least two third welding areas 113, and the at least two third welding areas 113 are distributed on both sides of the second welding area 112 along the diagonal line L of the second welding area 112. Then, the solder ball pickup component 30 can be made to include at least two third adsorption areas 331, and the at least two third adsorption areas 331 are distributed on both sides of the first adsorption area 311 along the diagonal line L of the first adsorption area 311, so that the number and position of the third adsorption areas 331 of the solder ball pickup component 30 correspond to the number and position of the third welding areas of the packaging substrate 11.

[0073] Wherein, the packaging substrate 11 includes a plurality of first welding areas 111 and a plurality of third welding areas 113, and the plurality of first welding areas 111 and the plurality of third welding areas 113 are alternately distributed along the circumferential direction of the second welding area 112. Then, the solder ball pickup component 30 can be made to include a plurality of first adsorption areas 311 and a plurality of third adsorption areas 331, and the plurality of first adsorption areas 311 and the plurality of third adsorption areas 331 are alternately distributed along the circumferential direction of the second adsorption area 321.

[0074] Specifically, the second welding area 112 of the encapsulation substrate 11 is rectangular. The number of the third welding areas 113 is four, and the four third welding areas 113 are distributed on both sides of the second welding area 112 along two diagonal lines L of the second welding area 112. Correspondingly, the second adsorption area 321 of the solder ball picking component 30 is rectangular. The number of the third adsorption areas 331 is four, and the four third adsorption areas 331 are distributed on both sides of the second adsorption area 321 along two diagonal lines L of the second adsorption area 321.

[0075] In some embodiments, the third solder balls 23 adsorbed by the third adsorption holes 332 of the third adsorption areas 331 of the solder ball picking component 30 include a strip-shaped structure, and the length direction of the third solder balls 23 is consistent with the extending direction of the corresponding diagonal line L. Thus, after the solder ball picking component 30 transfers the third solder balls 23 to the third welding areas 113 of the encapsulation substrate 11, the length direction of the third solder balls 23 located in the third welding areas 113 is consistent with the extending direction of the diagonal line L corresponding to the second welding area 112.

[0076] Specifically, the four third adsorption areas 331 of the solder ball picking component 30 are distributed on both sides of the second adsorption area 321 along two diagonal lines L of the second adsorption area 321. Each third adsorption area 331 is provided with one third adsorption hole 332. The length direction of the third solder balls 23 adsorbed by the third adsorption holes 332 of each third adsorption area 331 is consistent with the extending direction of the corresponding diagonal line L.

[0077] In some embodiments, the strength of the third solder balls 23 can be made greater than the strength of the first solder balls 21 and the second solder balls 22 to further improve the connection strength between the semiconductor device packaging structure 1 and other devices. Among them, the volume of the third solder balls 23 can be made greater than the volume of the first solder balls 21 and the second solder balls 22 so that the strength of the third solder balls 23 is greater than the strength of the first solder balls 21 and the second solder balls 22. Specifically, the diameter of the third solder balls 23 can be made greater than the diameter of the first solder balls 21 and the second solder balls 22 so that the strength of the third solder balls 23 is greater than the strength of the first solder balls 21 and the second solder balls 22. The shape and material of the third solder balls 23, as well as the strength relationship and size relationship between the third solder balls 23 and the first solder balls 21 and the second solder balls 22 can refer to the above embodiments and will not be elaborated here.

[0078] In some embodiments, such as Figure 5As shown, the solder ball picking component 30 can include a first picking member 31 and a second picking member 32 that are slidably connected. The first adsorption area 311 is located on one side of the first picking member 31 in the sliding direction relative to the second picking member 32, and the second adsorption area 321 is located on one side of the second picking member 32 in the sliding direction relative to the first picking member 31. Thus, it is possible to control the first picking member 31 to slide relative to the second picking member 32 along the side facing the side where the first adsorption hole 312 is provided, so as to facilitate the first picking member 31 to extend relative to the second picking member 32, making the first adsorption hole 312 closer to the first solder ball 21, so as to facilitate the first adsorption hole 312 to adsorb the first solder ball 21. Or, it is also possible to control the second picking member 32 to slide relative to the first picking member 31 along the side facing the side where the second adsorption hole 322 is provided, so as to facilitate the second picking member 32 to extend relative to the first picking member 31, making the second adsorption hole 322 closer to the second solder ball 22, so as to facilitate the second adsorption hole 322 to adsorb the second solder ball 22.

[0079] After the first adsorption hole 312 sucks the first solder ball 21 and the second adsorption hole 322 sucks the second solder ball 22, the first picking member 31 and the second picking member 32 can be slid relative to each other by a certain distance, so that the first solder ball 21 and the second solder ball 22 are basically flush, so as to facilitate the simultaneous transfer of the first solder ball 21 and the second solder ball 22 to the corresponding welding area of the packaging substrate 11.

[0080] In some embodiments, the first picking member 31 can extend along the circumferential direction of the second picking member 32, so as to facilitate the formation of the first adsorption area 311 that is distributed along the circumferential direction of the second adsorption area 321 on the first picking member 31. Specifically, the first picking member 31 extends along the circumferential direction of the second picking member 32 in an annular structure.

[0081] In some embodiments, the solder ball picking component 30 can include a driving mechanism (not shown in the figure), and the driving mechanism is connected to at least one of the first picking member 31 and the second picking member 32 to drive the first picking member 31 and the second picking member 32 to slide relative to each other.

[0082] Similarly, when the solder ball picking component 30 includes a third adsorption area 331, the solder ball picking component 30 can further include a third picking member 33. The third picking member 33 is slidably connected to the first picking member 31, and the third adsorption area 331 is located on one side of the third picking member 33 along the sliding direction of the third picking member 33 relative to the first picking member 31. Thus, it is possible to control the third picking member 33 to slide relative to the first picking member 31 and the second picking member 32 along the side facing the side where the third adsorption hole 332 is provided, so as to facilitate the third picking member 33 to extend relative to the first picking member 31 and the second picking component, making the third adsorption hole 332 closer to the third solder ball 23, so as to facilitate the third adsorption hole 332 to adsorb the third solder ball 23.

[0083] Specifically, the first picking member 31 may include a mounting hole 313, and the third picking member 33 may be slidably mounted in the mounting hole 313, so that the third picking member 33 is slidably connected to the first picking member 31. A driving mechanism may be connected to the third picking member 33 to drive the third picking member 33 to slide relative to the first picking member 31.

[0084] In some embodiments, the exhaust assembly may be connected to the third adsorption hole 332 to exhaust the third adsorption hole 332 so that the third adsorption hole 332 can adsorb the third solder ball 23 .

[0085] In some embodiments, as Figure 4 As shown, the ball planting device 3 may include multiple solder ball pickup assemblies 30. Thus, the ball planting device 3 can be used to batch transfer solder balls from multiple semiconductor device package structures 1, thereby improving ball planting efficiency. The multiple solder ball pickup assemblies 30 of the ball planting device 3 can be arranged in an array or in other ways, as long as each solder ball pickup assembly 30 is capable of picking up a corresponding solder ball and transferring the solder ball to the corresponding semiconductor device package structure 1.

[0086] See also Figure 6 An embodiment of the present application also provides a storage system 4, which includes a controller 5 and a memory 6. The controller 5 is coupled to the memory 6 and is used to control the memory 6 to store data; wherein the memory 6 includes the semiconductor device packaging structure 1 in any of the above embodiments.

[0087] The semiconductor device 12 of the semiconductor device package structure 1 may be an array wafer memory 6 or a device combined with a CMOS (Complementary Metal Oxide Semiconductor) peripheral circuit.

[0088] Specifically, the semiconductor device 12 can be stacked with the peripheral circuit or staggered with the peripheral circuit, which is not limited in this application. The peripheral circuit is electrically connected to the semiconductor device 12 to transmit signals to the semiconductor device 12. The peripheral circuit can be used for logical operations and to control and detect the switching state of each storage unit in the semiconductor device 12 through metal wiring to achieve data storage and reading.

[0089] Specifically, the memory 6 may be a three-dimensional memory (eg, a 3D NAND memory).

[0090] Specifically, the controller 5 can control the memory 6 through the channel CH, and the memory 6 can perform operations in response to requests from the host 9 based on the control of the controller 5. The memory 6 can receive a command CMD and an address ADDR from the controller 5 through the channel CH and access a region selected from the memory cell array in response to the address. In other words, the memory 6 can perform internal operations corresponding to the command on the region selected by the address.

[0091] In some embodiments, the storage system 4 can be implemented as a universal flash storage (UFS) device, a solid state drive (SSD), a multimedia card in the form of an MMC, eMMC, RS-MMC, and micro MMC, a secure digital card in the form of an SD, mini SD, and micro SD, a storage device of the personal computer memory card international association (PCMCIA) card type, a storage device of the peripheral component interconnect (PCI) type, a storage device of the high-speed PCI (PCI-E) type, a compact flash (CF) card, a smart media card, or a memory stick, etc.

[0092] Specifically, the above storage system 4 can be used in terminal products such as computers, televisions, set-top boxes, and vehicles.

[0093] Please refer to Figure 7 , the embodiment of the present application further provides an electronic device 7, which includes a central processing unit 8 and the above storage system 4 provided by the embodiment of the present application. Specifically, the electronic device 7 can be any device that can store data, such as a mobile phone, a desktop computer, a tablet computer, a laptop computer, a server, a vehicle-mounted device, a wearable device, a mobile power supply, etc.

[0094] The central processing unit 8 is used for information and data exchange with the storage system 4.

[0095] An electronic device 7 provided by the embodiment of the present application has the same beneficial effects as the above storage system 4 due to the provision of the storage system 4 provided by the embodiment of the present application.

[0096] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0097] The above has introduced in detail a semiconductor device packaging structure and a ball mounting device provided by the embodiment of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor device packaging structure, characterized in that, It includes a package substrate, a semiconductor device disposed on one side of the package substrate, and a plastic package covering the semiconductor device; wherein, one side of the package substrate facing away from the semiconductor device includes a first solder joint area and a second solder joint area, the first solder joint area is provided with a first solder ball, the second solder joint area is provided with a second solder ball, and the strength of the first solder ball is different from that of the second solder ball.

2. The semiconductor device package structure according to claim 1, wherein, The first solder joint area is distributed along the circumference of the second solder joint area.

3. The semiconductor device package structure according to claim 2, characterized in that, The strength of the first solder ball is greater than that of the second solder ball.

4. The semiconductor device package structure according to claim 1, wherein One side of the package substrate facing away from the semiconductor device further includes a third solder joint area, the third solder joint area is located at the junction of two adjacent sides of the second solder joint area, the third solder joint area is provided with a third solder ball, and the strength of the first solder ball, the second solder ball and the third solder ball is different.

5. The semiconductor device package structure according to claim 4, characterized in that, The package substrate includes at least two of the third solder joint areas, and the at least two third solder joint areas are distributed on both sides of the second solder joint area along the diagonal of the second solder joint area.

6. The semiconductor device package structure according to claim 5, wherein, The third solder ball includes a strip-shaped structure, and the length direction of the third solder ball is consistent with the extension direction of the corresponding diagonal.

7. The semiconductor device package structure according to claim 4, wherein, The package substrate includes a plurality of the first solder joint areas and a plurality of the third solder joint areas, and the plurality of first solder joint areas and the plurality of third solder joint areas are alternately distributed along the circumference of the second solder joint area.

8. The semiconductor device package structure according to claim 4, characterized in that, The volume of the third solder ball is greater than that of the first solder ball and the second solder ball; and / or, the strength of the third solder ball is greater than that of the first solder ball and the second solder ball.

9. The semiconductor device package structure according to any one of claims 1 to 8, characterized in that, The first solder ball is electrically connected to the semiconductor device.

10. A ball planting device, characterized in that, It includes at least one solder ball picking component, one side of the solder ball picking component includes a first adsorption area and a second adsorption area, the first adsorption area is provided with a first adsorption hole, the second adsorption area is provided with a second adsorption hole, the first adsorption hole is used for sucking and releasing the first solder ball, the second adsorption hole is used for sucking and releasing the second solder ball, and the strength of the first solder ball is different from that of the second solder ball.

11. The ball planting device according to claim 10, characterized in that, The first adsorption area is distributed along the circumference of the second adsorption area.

12. The ball mounting device according to claim 11, wherein, The strength of the first solder ball is greater than that of the second solder ball.

13. The ball mounting device according to claim 10, wherein One side of the solder ball picking component further includes a third adsorption area, the third adsorption area is located at the junction of two adjacent sides of the second adsorption area, the third adsorption area is provided with a third adsorption hole, the third adsorption hole is used for adsorbing the third solder ball, and the strength of the first solder ball, the second solder ball and the third solder ball is different.

14. The ball planting device according to claim 13, characterized in that, The solder ball picking component includes at least two of the third adsorption areas, and the at least two third adsorption areas are distributed on both sides of the first adsorption area along the diagonal of the first adsorption area.

15. The ball mounting device according to claim 14, characterized in that, The third solder ball includes a strip-shaped structure, and the length direction of the third solder ball is consistent with the extension direction of the corresponding diagonal.

16. The ball planting device according to claim 13, wherein, The solder ball picking component includes a plurality of the first adsorption areas and a plurality of the third adsorption areas, and the plurality of first adsorption areas and the plurality of third adsorption areas are alternately distributed along the circumference of the second adsorption area.

17. The ball mounting device according to claim 13, characterized in that The volume of the third solder ball is greater than the volumes of the first solder ball and the second solder ball; and / or, the strength of the third solder ball is greater than the strengths of the first solder ball and the second solder ball.

18. The ball mounting device according to claim 13, wherein The solder ball picking component includes a first picking member and a second picking member that are slidably connected. The first adsorption area is located on one side of the first picking member in the sliding direction relative to the second picking member, and the second adsorption area is located on one side of the second picking member in the sliding direction relative to the first picking member.

19. The ball mounting device according to claim 18, wherein The solder ball picking component further includes a third picking member. The third picking member is slidably connected to the first picking member, and the third adsorption area is located on one side of the third picking member along the sliding direction of the third picking member relative to the first picking member.

20. The ball mounting device according to claim 10, characterized in that, The ball planting device includes a plurality of the solder ball picking components that are arrayed.

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