Heat dissipation cabinet

Abstract

The invention provides a heat dissipation cabinet. The heat dissipation cabinet comprises a cabinet body, wherein the cabinet body is provided with a cavity for installing a server; the circulating heat dissipation assembly is provided with a heat absorption end, a heat release end and a heat dissipation end, the heat absorption end is located in the cavity and used for abutting against the server, the heat release end is located outside the cabinet body, and the heat dissipation end is connected with the heat release end; the air cooling assembly is arranged on the heat dissipation end so as to form a heat dissipation air flow path on the heat dissipation end; the spraying assembly and the heat dissipation end form a liquid circulation path. The control module obtains the first temperature of the first temperature sensor, the second temperature of the second temperature sensor, the third temperature of the third temperature sensor, the fourth temperature of the fourth temperature sensor and the humidity data of the humidity sensor. Based on the first temperature data, the second temperature data, the third temperature data, the fourth temperature data and the humidity data, the air cooling assembly and the spraying assembly are controlled through the controller. And the air cooling assembly and the spraying assembly in the heat dissipation cabinet are controlled in real time based on the obtained temperature data and humidity data, so that the heat dissipation intensity is adjusted in real time, the flexibility is high, and the heat dissipation effect of the server is better.

Description

Technical Field

[0001] The present disclosure relates to the field of server heat dissipation, and particularly to a heat dissipation cabinet. Background Art

[0002] When the server runs at a high speed continuously, its temperature will increase significantly. Therefore, the cabinet for storing the server needs to dissipate heat from the server. In related technologies, there are methods of using a fan to generate air flow for air-cooled heat dissipation and methods of using liquid cooling for heat dissipation. However, the heat dissipation methods are relatively passive and it is difficult to adjust the heat dissipation intensity according to the temperature of the server, with poor flexibility. Summary of the Invention

[0003] The present disclosure provides a heat dissipation cabinet, which can control the air-cooled component and the spray component in the heat dissipation cabinet in real time based on the acquired temperature data and humidity data, so as to adjust the heat dissipation intensity in real time, with strong flexibility, thereby making the heat dissipation effect of the server better.

[0004] To solve the above technical problems, the present disclosure provides a heat dissipation cabinet 100, including: A cabinet body 1, the cabinet body 1 having a cavity for installing a server; A circulating heat dissipation component, the circulating heat dissipation component having an endothermic end 21, an exothermic end 22 and a heat dissipation end, the endothermic end 21 being located in the cavity and used for abutting against the server, the exothermic end 22 being located outside the cabinet body 1, and the heat dissipation end being connected to the exothermic end 22; An air-cooled component 4, the air-cooled component 4 being arranged on the heat dissipation air duct 32 to form a heat dissipation air flow path on the heat dissipation air duct 32; A spray component 5, the spray component 5 forming a liquid circulation path with the heat dissipation air duct 32; A control module, the control module including a controller, a first temperature sensor 61, a second temperature sensor 62, a third temperature sensor 63, a fourth temperature sensor 64 and a humidity sensor. The first temperature sensor 61 is arranged at the exothermic end 22, the second temperature sensor 62 is arranged at the inlet of the heat dissipation air flow path, the third temperature sensor 63 is arranged at the outlet of the heat dissipation air flow path, and the fourth temperature sensor 64 and the humidity sensor are both arranged outside the cabinet body 1, and are used for acquiring the first temperature of the first temperature sensor 61, the second temperature of the second temperature sensor 62, the third temperature of the third temperature sensor 63, the fourth temperature of the fourth temperature sensor 64 and the humidity data of the humidity sensor, and controlling the air-cooled component and the spray component through the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature and the humidity data.

[0005] A heat dissipation cabinet provided by the present disclosure includes: a cabinet body having a cavity for installing servers; a circulating heat dissipation component having an endothermic end, an exothermic end, and a heat dissipation end, the endothermic end is located inside the cavity and is used to abut against the servers, the exothermic end is located outside the cabinet body, and the heat dissipation end is connected to the exothermic end; an air cooling component is arranged on the heat dissipation air duct to form a heat dissipation air flow path on the heat dissipation air duct; a spraying component forms a liquid circulation path with the heat dissipation air duct; a control module includes a controller, a first temperature sensor, a second temperature sensor, a third temperature sensor, a fourth temperature sensor, and a humidity sensor. The first temperature sensor is arranged at the exothermic end, the second temperature sensor is arranged at the inlet of the heat dissipation air flow path, the third temperature sensor is arranged at the outlet of the heat dissipation air flow path, and the fourth temperature sensor and the humidity sensor are both arranged outside the cabinet body, and are used to obtain the first temperature of the first temperature sensor, the second temperature of the second temperature sensor, the third temperature of the third temperature sensor, the fourth temperature of the fourth temperature sensor, and the humidity data of the humidity sensor, and control the air cooling component and the spraying component through the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature, and the humidity data. Among them, based on the first temperature, the second temperature, the third temperature, the fourth temperature, and the humidity data obtained by the control module, the air cooling component and the spraying component in the heat dissipation cabinet are controlled in real time through the controller to adjust the heat dissipation intensity in real time, with strong flexibility, so as to make the heat dissipation effect of the servers better.

[0006] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The drawings are used to better understand the solution and do not constitute a limitation to the present disclosure. Among them: Figure 1 FIG. 1 is one of the structural schematic diagrams of a heat dissipation cabinet provided by an embodiment of the present disclosure; Figure 2 FIG. 2 is another structural schematic diagram of a heat dissipation cabinet provided by an embodiment of the present disclosure; Figure 3 FIG. 3 is yet another structural schematic diagram of a heat dissipation cabinet provided by an embodiment of the present disclosure; Figure 4 FIG. 4 is still another structural schematic diagram of a heat dissipation cabinet provided by an embodiment of the present disclosure; Figure 5 FIG. 5 is still another structural schematic diagram of a heat dissipation cabinet provided by an embodiment of the present disclosure; Figure 6 FIG. 6 is a sectional structural schematic diagram of a heat dissipation cabinet provided by an embodiment of the present disclosure, in which the equipment box is not shown; Figure 7Schematic diagrams of the structures of the server, the circulating heat conductor, and the heat sink provided by the embodiments of the present disclosure; Figure 8 For Figure 7 Partial structure diagram; Figure 9 Schematic flowchart of a control method based on a control module provided by the embodiments of the present disclosure; Among them, the above-mentioned drawings include the following reference numerals: 100, heat dissipation cabinet; 1, cabinet body, 11, bearing plate; 2, circulating heat conductor, 21, heat absorption end, 22, heat release end, 23, first fin, 24, second fin, 25, liquid extraction pipe, 26, liquid infusion pipe, 27, circulation pump; 3, heat sink, 31, heat sink fin, 32, heat dissipation air duct, 321, metal pipe, 322, metal rod, 33, metal cooling plate, 34, flow guide plate; 4, air cooling component, 41, intake air fan, 42, exhaust air fan; 5, spray component, 51, water storage bin, 52, atomizing nozzle, 53, water extraction pipe, 54, water pump; 61, first temperature sensor, 62, second temperature sensor, 63, third temperature sensor, 64, fourth temperature sensor; 7, equipment box; 200, server. Detailed implementation manners

[0008] In order to enable those skilled in the art of the present technology to better understand the solutions of the present disclosure, the present disclosure will be further described in detail below with reference to the drawings and specific implementation manners.

[0009] As Figures 1 to 8 shown, the embodiments of the present disclosure provide a heat dissipation cabinet 100, and the heat dissipation cabinet will be described in detail through the structure and working principle of the heat dissipation cabinet 100.

[0010] The heat dissipation cabinet 100 of the embodiments of the present disclosure includes a cabinet body 1, a circulating heat conductor 2, a heat sink 3, an air cooling component 4, a spray component 5, and a control module.

[0011] The cabinet body 1 has a cavity for installing the server 200. The circulating heat dissipation component has a heat absorption end 21, a heat release end 22, and a heat dissipation end. The heat absorption end 21 is located in the cavity and is used to abut against the server. The heat release end 22 is located outside the cabinet body 1, and the heat dissipation end is connected to the heat release end 22. The air cooling component 4 is arranged on the heat dissipation end to form a heat dissipation air flow path on the heat dissipation end. The spray component 5 forms a liquid circulation path with the heat dissipation end.

[0012] The control module includes a controller, a first temperature sensor 61, a second temperature sensor 62, a third temperature sensor 63, a fourth temperature sensor 64, and a humidity sensor. The first temperature sensor 61 is arranged at the heat release end 22, the second temperature sensor 62 is arranged at the inlet of the heat dissipation air duct 32, the third temperature sensor 63 is arranged at the outlet of the heat dissipation air duct 32, and both the fourth temperature sensor 64 and the humidity sensor are arranged outside the cabinet body 1. They are used to obtain the first temperature of the first temperature sensor 61, the second temperature of the second temperature sensor 62, the third temperature of the third temperature sensor 63, the fourth temperature of the fourth temperature sensor 64, and the humidity data of the humidity sensor, and control the air cooling component and the spraying component through the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature, and the humidity data.

[0013] When the heat dissipation cabinet 100 of the present disclosure embodiment is in use, the heat absorption end 21 of the circulating heat conducting member 2 absorbs the heat released by the server, guides the heat to the heat release end 22, thereby guiding the heat outside the cabinet body 1. The temperature of the heat dissipation end is relatively low, so the heat of the heat release end 22 is guided to itself, and the air cooling component 4 blows air to the heat dissipation end to form an air flow at the heat dissipation end, taking away the heat of the heat dissipation end to cool the heat dissipation end. The spraying component 5 sprays the heat dissipation end, and the liquid flows through the heat dissipation end, driving the heat of the heat dissipation end to cool the heat dissipation end. The liquid flowing down from the heat dissipation end flows back into the spraying component 5.

[0014] Specifically, as Figures 1 to 6 shown, the cabinet body 1 includes a frame, a footrest, a transparent door panel, transparent side panels, a top plate, a door handle, and a carrier. The bottom wall of the frame is provided with a footrest. The transparent door panel is rotatably arranged on the front side of the frame, and a door handle is arranged on the transparent door panel. The transparent side panels are arranged on the sides of the frame. The transparent door panel and the transparent side panels enclose and close the frame to define a cavity of the cabinet body 1. As Figure 8 shown, the carrier is located in the cavity of the cabinet body 1, the carrier is connected to the frame, and the carrier has a plurality of carrier plates 11 for carrying the server 200.

[0015] The cabinet body 1 uses the transparent door panel and the transparent side panels to enclose and protect the internal environment of the cabinet body 1, avoiding the risk that the air flow inside the cabinet body 1 during the heat dissipation process brings dust or flying flocs in the external environment into the cabinet body 1 and adheres to the surface of the server 200, and the risk of static electricity generated by dust accumulation, thus avoiding damage to the electronic components in the server 200.

[0016] Furthermore, an LED light strip for lighting is arranged on the inner wall of the cabinet body 1 to illuminate the server 200 inside the cabinet body 1, so that the working condition of the server 200 inside the cabinet can be directly observed without opening the door panel.

[0017] The circulating heat dissipation component includes a circulating heat conducting component 2 and a heat dissipation component 3. The circulating heat conducting component 2 has a heat conducting liquid circulation path and forms an endothermic end 21 and an exothermic end 22. The heat dissipation component 3 forms a heat dissipation end. The heat dissipation component 3 includes heat dissipation fins 31 and a heat dissipation air duct 32. The heat dissipation fins 31 are connected to the exothermic end 22 and the heat dissipation air duct 32. The heat dissipation fins 31 rapidly cool and dissipate heat from the exothermic end 22. At the same time, the air cooling component 4 and the spraying component 5 blow air and spray on the heat dissipation air duct 32, thereby taking away the heat of the heat dissipation air duct 32 and cooling the heat dissipation air duct 32. Then, the temperature of the heat dissipation air duct 32 is relatively lower than that of the exothermic end 22 and the heat dissipation fins 31. When the heat dissipation fins 31 dissipate heat from the exothermic end 22, part of the heat is transferred to the heat dissipation air duct 32, accelerating the dissipation of the heat of the exothermic end 22, thereby improving the heat dissipation effect of the heat dissipation cabinet 100 of the present disclosure embodiment on the server 200.

[0018] Such as Figure 3 , Figure 6 and Figure 7 , the circulating heat conducting component 2 includes a first fin 23, a second fin 24, a liquid extraction pipe 25, an infusion pipe 26 and a circulation pump 27. Both the first fin 23 and the second fin 24 have accommodation cavities. The first fin 23 is used to fit the server 200. The first fin 23 forms the endothermic end 21. The second fin 24 forms the exothermic end 22. The accommodation cavity of the first fin 23, the liquid extraction pipe 25, the circulation pump 27, the accommodation cavity of the second fin 24, the infusion pipe 26 and the accommodation cavity of the first fin 23 are connected in sequence to form a heat conducting liquid circulation path. In the working state of the heat dissipation cabinet 100 of the present disclosure embodiment, the heat conducting liquid circulation path is filled with a heat conducting liquid. In this embodiment, the heat conducting liquid used is heat conducting silicone oil.

[0019] During the operation of the server 200, a large amount of heat is generated. The heat conducting silicone oil in the first fin 23 absorbs the heat of the server 200. The temperature of the heat conducting silicone oil rises, cooling the server 200. The circulation pump 27 drives the circulation of the heat conducting silicone oil, so that the heat conducting silicone oil after absorbing heat in the first fin 23 enters the second fin 24 through the liquid extraction pipe 25 and the circulation pump 27. The second fin 24 is cooled by the heat dissipation component 3. The cooled heat conducting silicone oil enters the first fin 23 through the infusion pipe 26 and continues to absorb the heat generated by the server 200, realizing continuous heat dissipation and cooling of the server 200.

[0020] The heat dissipation cabinet 100 according to the embodiments of the present disclosure forms a heat-conducting liquid circulation path through the circulating heat-conducting member 2, conducts the heat generated by the server 200 from the first fin 23 to the second fin 24, and efficiently conducts the heat generated by the server 200 in the cabinet body 1 to the outside of the cabinet body 1, not only realizing the heat dissipation of the server 200, but also reducing the occupation of the internal space of the cabinet body 1. Moreover, the sheet-shaped first fin 23 has a large contact area with the server 200, which is conducive to improving the absorption of heat from the server 200 by the heat-conducting silicone oil and ensuring the efficient heat dissipation effect on the server 200.

[0021] Specifically, as Figure 6 and Figure 7 shown, the first fins 23 are attached to both the upper and lower sides of the server 200. The two first fins 23 are both attached to the server 200, simultaneously dissipating heat from and cooling the upper and lower sides of the server 200, and ensuring the heat dissipation effect of the circulating heat-conducting member 2 on the server 200.

[0022] Specifically, referring to Figures 6 to 8 , there are multiple second fins 24. The multiple second fins 24 are arranged at intervals in the front-rear direction, that is, there are multiple heat release ends 22, and the multiple heat release ends 22 are arranged at intervals in the front-rear direction. The multiple second fins 24 of the circulating heat-conducting member 2 increase the contact area between the heat release end 22 and the heat dissipation member 3, thereby increasing the heat dissipation area and improving the heat dissipation effect of the heat release end 22, ensuring the heat dissipation effect of the circulating heat-conducting member 2 on the heat-conducting silicone oil, and thus ensuring the heat dissipation effect of the heat dissipation cabinet 100 according to the embodiments of the present disclosure on the server 200.

[0023] As Figures 6 to 8 shown, the heat dissipation member 3 includes a heat sink 31, a heat dissipation air duct 32, and a metal cooling plate 33. The heat sink 31 connects the heat release end 22 and the heat dissipation air duct 32. The metal cooling plate 33 is attached to the heat release end 22. The metal cooling plate 33 is connected to the heat sink 31. The heat sink 31 is a semiconductor heat sink 31. The heat dissipation air duct 32 includes a metal pipe 321 and a metal rod 322. The metal pipe 321 is attached to the heat sink 31. The metal rod 322 is arranged on the side of the metal cooling plate 33 adjacent to the semiconductor heat sink 31. The air cooling assembly 4 is arranged on the metal rod 322. The metal cooling plate 33 is attached to the second fin 24. There are multiple second fins 24. Correspondingly, there are multiple metal cooling plates 33 and multiple metal rods 322. The multiple metal cooling plates 33, the multiple metal rods 322 correspond to the multiple second fins 24 one by one.

[0024] The second fin 24 is connected to the semiconductor heat sink 31. The semiconductor heat sink 31 dissipates heat from the second fin 24. At the same time, the semiconductor heat sink 31 conducts the heat of the second fin 24 to the metal tube 321 and the metal cooling plate 33. The metal cooling plate 33 conducts the heat to the metal rod 322, and the air-cooling component 4 and the spraying component 5 perform air-cooling and spraying to cool the metal rod 322 and the metal tube 321. It should be noted that the heat transfer effect between the metal cooling plate 33 and the second fin 24 is less than the heat transfer effect between the semiconductor heat sink 31 and the second fin 24.

[0025] The heat sink 31 uses a semiconductor heat sink 31, which utilizes the thermoelectric effect of the semiconductor material to transfer heat from the high-temperature part to the low-temperature part, so that the semiconductor transfers the heat of the high-temperature second fin 24 to the low-temperature metal tube 321 and metal rod 322, that is, transfers the heat to the heat dissipation air duct 32, realizing the conduction and transfer of heat, facilitating the setting of the air-cooling component 4 and the spraying component 5 and the dissipation and cooling of heat.

[0026] As Figure 3 、 Figure 5 、 Figure 7 and Figure 8 shown, there are two groups of the circulating heat conducting member 2 and the heat dissipating member 3. The two groups of the circulating heat conducting member 2 are symmetrically arranged about the middle of the cabinet body 1. The metal tubes 321 of the left and right heat dissipating members 3 are connected into one body, and the metal rods 322 of the left and right heat dissipating members 3 are connected into one body.

[0027] In some embodiments, the heat dissipating member 3 further includes a plurality of flow guiding plates 34. The plurality of flow guiding plates 34 are uniformly arranged in the metal tube 321 to divide the metal tube 321 into a plurality of channels. The flow guiding plates 34 increase the surface area of the metal tube 321, thereby increasing the heat dissipation area of the metal tube 321, which is beneficial to further improving the heat dissipation effect of the air-cooling component 4 and the spraying component 5 on the metal tube 321, thus ensuring the heat dissipation effect of the circulating heat conducting member 2 on the heat conducting silicone oil, and then further ensuring the heat dissipation effect of the heat dissipation cabinet 100 of the present disclosure embodiment on the server 200.

[0028] In some embodiments, the heat dissipation air duct 32 further includes fins (not shown in the figure), and the fins are arranged on the metal rod 322. The fins increase the surface area of the metal rod 322, thereby increasing the heat dissipation area of the metal rod 322, which is beneficial to further improving the heat dissipation effect of the air-cooling component 4 and the spraying component 5 on the metal tube 321, thus ensuring the heat dissipation effect of the circulating heat conducting member 2 on the heat conducting silicone oil, and then further ensuring the heat dissipation effect of the heat dissipation cabinet 100 of the present disclosure embodiment on the server 200.

[0029] Specifically, the material of the flow guiding plate 34 is the same as that of the metal tube 321, and the material of the fins is the same as that of the metal rod 322.

[0030] In some embodiments, the metal rod 322 is coated with a nano - coating. The metal tube 321 is coated with a nano - coating. The nano - coating can increase the hydrophilicity of the metal rod 322 and the metal tube 321, improve the heat exchange efficiency between the metal rod 322 and the metal tube 321 and the sprayed water, which is conducive to further improving the heat dissipation effect of the air - cooling component 4 and the spraying component 5 on the metal tube 321, thereby ensuring the heat dissipation effect of the circulating heat - conducting member 2 on the heat - conducting silicone oil, and then further ensuring the heat dissipation effect of the heat - dissipating cabinet 100 of the present disclosure on the server 200.

[0031] As Figures 3 to 6 shown, the spraying component 5 includes a water storage bin 51, an atomizing nozzle 52, a water suction pipe 53 and a water pump 54. The water storage bin 51 is arranged on one side of the heat - dissipation air duct 32 to receive the water droplets dripping from the heat - dissipation air duct 32. The atomizing nozzle 52 is arranged on the other side of the heat - dissipation air duct 32. The water suction pipe 53 connects the water storage bin 51 and the atomizing nozzle 52. The water pump 54 is arranged on the water suction pipe 53. The water storage bin 51 is located below the heat - dissipation air duct 32. There is water stored in the water storage bin 51. The water pump 54 pumps water from the water storage bin 51 through the water suction pipe 53 to the atomizing nozzle 52. The atomizing nozzle 52 atomizes the water and sprays it onto the metal rod 322 and the metal tube 321. Part of the atomized water droplets take away the heat on the metal rod 322 and the metal tube 321 and evaporate. The water droplets dripping from the metal rod 322 and the metal tube 321 fall into the water storage bin 51, and the spraying is repeated in a cycle.

[0032] In some embodiments, the semiconductor heat sink 31 is opposite to the water storage bin 51 so that the water storage bin 51 can receive the condensed water dripping from the semiconductor heat sink 31. The semiconductor heat sink 31 and the water storage bin 51 are opposite in the up - down direction, and the opening of the water storage bin 51 can cover the semiconductor heat sink 31 in the up - down direction. Since the temperature at the connection between the semiconductor heat sink 31 and the second fin 24 is relatively high, and the temperatures at the connections between the semiconductor heat sink 31 and the metal tube 321 and between the semiconductor heat sink 31 and the metal cooling plate 33 are relatively low, the temperature difference between the two sides (the high - temperature side and the low - temperature side) of the semiconductor heat sink 31 is relatively large, and condensed water is likely to be generated at the connection between the semiconductor heat sink 31 and the second fin 24. The formed condensed water drips downward into the water storage bin 51, and the water storage bin 51 recovers the condensed water, enabling the condensed water to enter the liquid circulation path formed by the spraying component 5 for reuse, avoiding direct external discharge of the condensed water and causing problems such as local water accumulation.

[0033] In some embodiments, the air - cooling component 4 includes an intake fan 41 and an exhaust fan 42. The exhaust fan 42 is arranged on one side (the lower side) of the heat - dissipation end, and the intake fan 41 is arranged on the other side (the upper side) of the heat - dissipation end. Specifically, as Figures 3 to 6As shown, the metal rod 322 is located above the metal tube 321. The intake fan 41 is arranged above the metal rod 322, and the exhaust fan 42 is arranged below the metal tube 321. The water storage bin 51 is located below the exhaust fan 42. The exhaust fan 42 faces the rear side of the cabinet body 1. The heat dissipation air flow path formed by the intake fan 41 and the exhaust fan 42 on the heat dissipation air duct 32 is a path that bends downward and then backward, dissipating the heat of the heat dissipation air duct 32 to the rear side of the heat dissipation cabinet 100 of the present disclosure embodiment.

[0034] In some embodiments, the heat dissipation cabinet 100 further includes an equipment box 7. The equipment box 7 is arranged outside the cabinet body 1, and the heat dissipation end, the heat release end 22, the fourth temperature sensor 64, and the humidity sensor are all located inside the equipment box 7. The equipment box 7 provides protection for the heat dissipation end and the heat release end 22.

[0035] Specifically, as Figures 2 to 5 shown, the water storage bin 51 is arranged on the bottom wall of the equipment box 7. The exhaust fan 42 is located between the bottom wall of the equipment box 7 and the metal tube 321. The equipment box 7 is open above the corresponding metal rod 322. The intake fan 41 is arranged above the equipment box 7, and the rear side of the equipment box 7 is open.

[0036] In addition, the heat dissipation cabinet 100 of the present disclosure embodiment is also applicable to the integrated installation of a distribution box, and the same heat dissipation effect can be achieved.

[0037] In the present disclosure embodiment, when the heat dissipation cabinet 100 is in the startup stage, the control module can control the air-cooling component to run at the lowest maintenance speed through the controller, and detect the corresponding initial temperature and initial humidity through the first temperature sensor, the second temperature sensor, the third temperature sensor, the fourth temperature sensor, and the humidity sensor.

[0038] Furthermore, in the present disclosure embodiment, when it is detected by the second temperature sensor that the surface temperature of the heat dissipation air flow path exceeds the preset threshold, the control module can start the water pump 54 through the controller. The condensed water is pressurized and conveyed to the atomizing nozzle 52 through the water extraction pipe 53 to form water mist particles with a corresponding diameter (such as 20 - 50 μm). The water mist covers the outer surface of the heat dissipation air flow path, evaporates and absorbs a large amount of heat (such as about 2260 J of heat absorption per gram of water evaporation). At the same time, the controller adjusts the air-cooling component to accelerate the evaporation process, and the unevaporated water droplets flow back to the water storage bin 51 for recycling. Among them, in the present disclosure embodiment, the above preset threshold can be determined according to experiments.

[0039] And, in the present disclosure embodiment, the control module can be based on the first temperature 、second temperature 、third temperature 、fourth temperature and humidity data The air-cooling component and the spraying component are controlled by a controller to adjust the fan speed and the water pump flow rate, so as to maintain the temperature difference of the semiconductor heat sink within an optimal range (such as 60±5°C). Among them, when the first temperature, the second temperature, the third temperature, the fourth temperature, and the humidity data meet different conditions, the methods for the corresponding controller to control the air-cooling component and the spraying component are also different.

[0040] Specifically, in the embodiments of the present disclosure, Figure 9 is a schematic flowchart of a control method based on a control module proposed in the embodiments of the present disclosure, as Figure 9 shown. The method for controlling the air-cooling component and the spraying component based on the first temperature, the second temperature, the third temperature, the fourth temperature, and the humidity data through a controller may include the following steps: Step S1: If the temperature difference between the third temperature and the second temperature is greater than a first preset value, determine a first target fan speed based on the third temperature and the second temperature, and adjust the fan speed of the air-cooling component 4 to the first target fan speed through the controller.

[0041] Among them, the first preset value is the temperature difference between the third temperature and the second temperature at the previous moment.

[0042] In the embodiments of the present disclosure, if the temperature difference between the third temperature and the second temperature at the current moment is greater than the first preset value, that is, the temperature difference between the third temperature and the second temperature at the current moment is greater than the temperature difference between the third temperature and the second temperature at the previous moment. At this time, the temperature difference between the inlet and outlet of the heat dissipation air flow path shows an upward trend. Based on this, it is necessary to increase the fan speed based on the third temperature and the second temperature at the current moment to accelerate heat dissipation.

[0043] In the embodiments of the present disclosure, a first target fan speed may be determined based on the third temperature and the second temperature, and the fan speed of the air-cooling component 4 may be adjusted to the first target fan speed through the controller. Among them, in the embodiments of the present disclosure, the method for determining the first target fan speed based on the third temperature and the second temperature may include: determining the first target fan speed through a first formula based on the third temperature and the second temperature, where the first formula is:

[0044] Among them, the is a gain coefficient that can be adjusted according to the heat dissipation requirements, is the minimum maintenance speed of the air-cooling component 4 to ensure the basic air flow, is the first target fan speed.

[0045] In the embodiments of the present disclosure, the intake fan and the exhaust fan in the above-mentioned air-cooling component 4 operate synchronously. Based on this, the controller adjusts the fan speed of the air-cooling component 4 to the first target fan speed, that is, the controller adjusts the fan speeds of both the intake fan and the exhaust fan in the air-cooling component 4 to the first target fan speed.

[0046] In the embodiments of the present disclosure, the above-mentioned first target fan speed is determined by the third temperature and the second temperature. Thus, the controller can adjust the fan speed of the air-cooling component in real time according to the third temperature and the second temperature, with strong flexibility.

[0047] Step S2: If the temperature difference between the third temperature and the fourth temperature is greater than the second preset value, and the humidity data is less than the first humidity preset value, then determine the target water spray amount based on the third temperature, the fourth temperature, the humidity data, and the first humidity preset value, and adjust the water spray amount of the atomizing nozzle 52 in the spraying component 5 to the target water spray amount through the controller.

[0048] In the embodiments of the present disclosure, if the temperature difference between the third temperature and the fourth temperature is greater than the second preset value, and the humidity data is less than the first humidity preset value, at this time, it is necessary to determine the water spray amount of the atomizing nozzle based on the third temperature, the second temperature, and the humidity data at the current moment to prevent over-wetting while accelerating heat dissipation. Among them, the above-mentioned second preset value can be determined through experimental data or set as needed, such as 10°C, and the above-mentioned first humidity preset value can be the maximum value of the current humidity and can be set as needed, such as 80%.

[0049] In the embodiments of the present disclosure, the method for determining the target water spray amount based on the third temperature, the fourth temperature, the humidity data, and the first humidity preset value may include: determining the target water spray amount through the second formula based on the third temperature, the fourth temperature, the humidity data, and the first humidity preset value, where the second formula is:

[0050] Among them, is the target water spray amount, with the unit of , is the proportional coefficient of the water spray amount, RH max is the first humidity preset value.

[0051] Step S3: If the first temperature and the fourth temperature meet the preset conditions, and the humidity data is greater than the second humidity preset value, then determine the second target fan speed, and close the water pump 54 in the spraying component 5 through the controller and adjust the fan speed of the air-cooling component 4 to the second target fan speed.

[0052] Among them, the preset condition is that the first temperature is lower than the fourth temperature by a preset temperature.

[0053] In the embodiments of the present disclosure, if the first temperature and the fourth temperature meet the preset conditions, and the humidity data is greater than the second humidity preset value, it indicates that the humidity is too high or the heat dissipation fins are too cold at this time. Based on this, the controller needs to turn off the water pump 54 in the spraying assembly 5 and adjust the fan speed of the air-cooling assembly 4 to the second target fan speed to prevent condensation. Among them, the second target fan speed can be 50% of the fan speed at the current moment.

[0054] In the embodiments of the present disclosure, the above-mentioned preset temperature can be set according to experimental data, such as 5°C, that is ; the above-mentioned second humidity preset value can be set as needed, such as 70%.

[0055] Step S4: If the fourth temperature is less than the third preset value, the controller turns off the atomizing nozzle 52 in the spraying assembly 5.

[0056] In the embodiments of the present disclosure, if the fourth temperature is less than the third preset value, it indicates that the environmental temperature is relatively low at this time and heat dissipation is not required. Based on this, the controller turns off the atomizing nozzle 52 in the spraying assembly 5 and only uses the air-cooling assembly to ensure that the waste heat is dissipated, thereby starting the energy-saving mode.

[0057] Further, in the embodiments of the present disclosure, if the main device is turned off, the control module can turn off the atomizing nozzle 52 in the spraying assembly 5 through the controller, and the air-cooling assembly delays for a preset time to stop, so as to ensure that the waste heat is dissipated and energy consumption is saved. Among them, the preset time can be set as needed, such as .

[0058] In addition, in the embodiments of the present disclosure, the above-mentioned control module further includes a liquid level sensor (not shown in the figure), and the liquid level sensor is arranged in the water storage tank 51. Among them, the above-mentioned control module can also be used to: receive the condensate liquid level of the liquid level sensor, and control the air-cooling assembly through the controller based on the condensate liquid level.

[0059] In the embodiments of the present disclosure, the method of controlling the air-cooling assembly through the controller based on the condensate liquid level may include: if the condensate liquid level is lower than the liquid level preset value, the controller turns off the water pump 54 in the spraying assembly 5 and controls the air-cooling assembly to delay for a preset time to stop, and issues a prompt message to increase the water volume in the water storage tank, so as to ensure that the waste heat is dissipated and energy consumption is saved, and can be controlled and warned in real time for timely processing. Among them, the above-mentioned liquid level preset value can be the lowest safe liquid level of the water storage tank 51, and can be set manually.

[0060] In the embodiments of the present disclosure, the control module can be based on the acquired first temperature , second temperature , third temperature , fourth temperature and humidity data , the air-cooling component and the spraying component in the heat dissipation cabinet are controlled in real time by the controller to adjust the heat dissipation intensity in real time, with strong flexibility, so that the heat dissipation effect of the server is better.

[0061] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of this disclosure.

[0062] The above has introduced in detail a heat dissipation cabinet provided by this disclosure. Specific examples are used herein to elaborate on the principle and implementation manner of this disclosure. The description of the above embodiments is only used to help understand the method and its core idea of this disclosure. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of this disclosure, several improvements and modifications can be made to this disclosure, and these improvements and modifications also fall within the protection scope of the claims of this disclosure.

Claims

1. A heat dissipation cabinet (100), characterized in that, Comprising: A cabinet body (1), the cabinet body (1) having a cavity for installing servers; A circulating heat dissipation component, the circulating heat dissipation component having a heat absorption end (21), a heat release end (22) and a heat dissipation end, the heat absorption end (21) being located inside the cavity and used for abutting against the server, the heat release end (22) being located outside the cabinet body (1), and the heat dissipation end being connected to the heat release end (22); An air-cooling component (4), the air-cooling component (4) being arranged on the heat dissipation end to form a heat dissipation air flow path on the heat dissipation end; A spraying component (5), the spraying component (5) forming a liquid circulation path with the heat dissipation end; A control module, the control module including a controller, a first temperature sensor (61), a second temperature sensor (62), a third temperature sensor (63), a fourth temperature sensor (64) and a humidity sensor, the first temperature sensor (61) being arranged on the heat release end (22), the second temperature sensor (62) being arranged at the inlet of the heat dissipation air flow path, the third temperature sensor (63) being arranged at the outlet of the heat dissipation air flow path, the fourth temperature sensor (64) and the humidity sensor both being arranged outside the cabinet body (1), the control module being used for obtaining the first temperature of the first temperature sensor (61), the second temperature of the second temperature sensor (62), the third temperature of the third temperature sensor (63), the fourth temperature of the fourth temperature sensor (64) and the humidity data of the humidity sensor, and controlling the air-cooling component and the spraying component through the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature and the humidity data.

2. The heat dissipation cabinet (100) according to claim 1, wherein The circulating heat dissipation part includes a circulating heat conduction part (2) and a heat dissipation part (3), the circulating heat conduction part (2) having a heat conduction liquid circulation path and forming the heat absorption end (21) and the heat release end (22), the heat dissipation part (3) forming the heat dissipation end, the heat dissipation part (3) including heat dissipation fins (31) and a heat dissipation air duct (32), the heat dissipation fins (31) connecting the heat release end (22) and the heat dissipation air duct (32).

3. The heat dissipation cabinet (100) according to claim 2, wherein, The heat dissipation part (3) further includes a metal cooling plate (33), the metal cooling plate (33) being attached and connected to the heat release end (22), the metal cooling plate (33) connecting the heat dissipation fins (31), the heat dissipation fins (31) being semiconductor heat dissipation fins (31), the heat dissipation air duct (32) including a metal pipe (321) and a metal rod (322), the metal pipe (321) being attached to the heat dissipation fins (31), the metal rod (322) being arranged on one side of the metal cooling plate (33) adjacent to the semiconductor heat dissipation fins (31), and the air-cooling component (4) being arranged on the metal rod (322).

4. The heat dissipation cabinet (100) according to claim 3, characterized in that, The spray assembly (5) includes a water storage bin (51), an atomizing nozzle (52), a water suction pipe (53) and a water pump (54). The water storage bin (51) is arranged on one side of the heat dissipation air duct (32) to receive the liquid dripping from the heat dissipation air duct (32). The atomizing nozzle (52) is arranged on the other side of the heat dissipation air duct (32). The water suction pipe (53) connects the water storage bin (51) and the atomizing nozzle (52). The water pump (54) is arranged on the water suction pipe (53). The semiconductor heat sink (31) is opposite to the water storage bin (51) so that the water storage bin (51) can receive the condensed water dripping from the semiconductor heat sink (31).

5. The heat dissipation cabinet (100) according to claim 3, wherein, The heat dissipation member (3) further includes a plurality of flow guiding plates (34). The plurality of flow guiding plates (34) are evenly arranged in the metal pipe (321) to divide the metal pipe (321) into a plurality of channels. And / or, the heat dissipation air duct (32) further includes fins, and the fins are arranged on the metal rod (322). And / or, the metal rod (322) and / or the metal pipe (321) is coated with a nano-coating.

6. The heat dissipation cabinet (100) according to claim 2, characterized in that, The circulating heat conducting member (2) includes a first fin (23), a second fin (24), a liquid suction pipe (25), a liquid delivery pipe (26) and a circulating pump (27). Both the first fin (23) and the second fin (24) have accommodation cavities. The first fin (23) is used to fit the server. The second fin (24) forms the heat release end (22). The first fin (23) forms the heat absorption end (21). The accommodation cavity of the first fin (23), the liquid suction pipe (25), the circulating pump (27), the accommodation cavity of the second fin (24), the liquid delivery pipe (26) and the accommodation cavity of the first fin (23) are connected in sequence to form a heat conducting liquid circulation path.

7. The heat dissipation cabinet (100) according to claim 1, characterized in that, The air cooling assembly (4) includes an intake fan (41) and an exhaust fan (42). The exhaust fan (42) is arranged on one side of the heat dissipation end. The intake fan (41) is arranged on the other side of the heat dissipation end. And / or, the heat dissipation cabinet (100) further includes an equipment box (7). The equipment box (7) is arranged outside the cabinet body (1). The heat dissipation end, the fourth temperature sensor (64) and the humidity sensor are all located in the equipment box (7).

8. The heat dissipation cabinet (100) according to claim 1, characterized in that, Controlling the air cooling assembly and the spray assembly by the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature and the humidity data includes: If the temperature difference between the third temperature and the second temperature is greater than a first preset value, then determine a first target fan speed based on the third temperature and the second temperature, and adjust the fan speed of the air cooling assembly (4) to the first target fan speed through the controller, where the first preset value is the temperature difference between the third temperature and the second temperature at the previous moment. If the temperature difference between the third temperature and the fourth temperature is greater than a second preset value, and the humidity data is less than a first humidity preset value, determine a target water spray amount based on the third temperature, the fourth temperature, the humidity data, and the first humidity preset value, and adjust the water spray amount of the atomizing nozzle (52) in the spray component (5) to the target water spray amount through the controller; If the first temperature and the fourth temperature meet a preset condition, and the humidity data is greater than a second humidity preset value, determine a second target fan speed, and turn off the water pump (54) in the spray component (5) and adjust the fan speed of the air-cooling component (4) to the second target fan speed through the controller, where the preset condition is that the first temperature is lower than the fourth temperature by a preset temperature; If the fourth temperature is less than a third preset value, turn off the atomizing nozzle (52) in the spray component (5) through the controller.

9. The heat dissipation cabinet (100) according to claim 4, characterized in that, The control module further includes a liquid level sensor, and the liquid level sensor is disposed in the water storage tank (51); the control module is further configured to: receive the condensate water level of the liquid level sensor, and control the air-cooling component through the controller based on the condensate water level.

10. The heat dissipation cabinet (100) according to claim 9, characterized in that, The controlling the air-cooling component through the controller based on the condensate water level includes: if the condensate water level is lower than a liquid level preset value, turn off the water pump (54) in the spray component (5) through the controller and control the air-cooling component to stop operating after a preset time delay, and send a prompt message for increasing the water volume in the water storage tank.

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