Cooling cabinet

Abstract

The present disclosure provides a heat dissipation cabinet, including a cabinet body having a cavity for installing a server; a circulating heat dissipation component having a heat absorbing end, a heat releasing end, and a heat dissipation end, wherein the heat absorbing end is located in the cavity and is used to abut the server, and the heat releasing end is located outside the cabinet and is connected to the heat releasing end; an air cooling component is provided on the heat dissipation end to form a heat dissipation airflow path on the heat dissipation end; a spray component and the heat dissipation end form a liquid circulation path; a control module obtains a first temperature of a first temperature sensor, a second temperature of a second temperature sensor, a third temperature of a third temperature sensor, a fourth temperature of a fourth temperature sensor, and humidity data of a humidity sensor, and controls the air cooling component and the spray component through a controller based on the first temperature, second temperature, third temperature, fourth temperature, and humidity data. The air cooling component and the spray component in the heat dissipation cabinet are controlled in real time based on the obtained temperature and humidity data to adjust the heat dissipation intensity in real time, with high flexibility, thereby achieving a better heat dissipation effect for the server.

Description

Technical Field

[0001] The present disclosure relates to the field of server heat dissipation, and in particular to a heat dissipation cabinet. Background Art

[0002] When servers run continuously at high speeds, their temperatures rise significantly. Therefore, the cabinets housing them need to provide cooling. Related technologies include using fans to generate airflow for cooling, and liquid cooling for cooling. However, these cooling methods are relatively passive, making it difficult to adjust the cooling intensity based on the server's temperature and resulting in limited flexibility. Summary of the Invention

[0003] The present disclosure provides a heat dissipation cabinet that can control the air cooling components and spray components in the heat dissipation cabinet in real time based on the acquired temperature data and humidity data, so as to adjust the heat dissipation intensity in real time. It has strong flexibility, thereby improving the heat dissipation effect of the server.

[0004] In order to solve the above technical problems, the present disclosure provides a heat dissipation cabinet 100, comprising:

[0005] A cabinet 1 having a cavity for installing a server;

[0006] A circulating heat dissipation component, comprising a heat absorbing end 21, a heat releasing end 22, and a heat dissipation end. The heat absorbing end 21 is located in the cavity and is used to abut against the server. The heat releasing end 22 is located outside the cabinet 1, and the heat dissipation end is connected to the heat releasing end 22.

[0007] An air cooling component 4 is provided on the heat dissipation air duct 32 to form a heat dissipation air flow path on the heat dissipation air duct 32;

[0008] A spray assembly 5, wherein the spray assembly 5 and the heat dissipation duct 32 form a liquid circulation path;

[0009] A control module includes a controller, a first temperature sensor 61, a second temperature sensor 62, a third temperature sensor 63, a fourth temperature sensor 64 and a humidity sensor. The first temperature sensor 61 is arranged at the heat release end 22, the second temperature sensor 62 is arranged at the inlet of the heat dissipation airflow path, the third temperature sensor 63 is arranged at the outlet of the heat dissipation airflow path, and the fourth temperature sensor 64 and the humidity sensor are both arranged outside the cabinet 1, and are used to obtain the first temperature of the first temperature sensor 61, the second temperature of the second temperature sensor 62, the third temperature of the third temperature sensor 63, the fourth temperature of the fourth temperature sensor 64 and the humidity data of the humidity sensor, and control the air cooling component and the spray component through the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature and the humidity data.

[0010] The present disclosure provides a heat dissipation cabinet, comprising: a cabinet body having a cavity for installing a server; a circulating heat dissipation component, the circulating heat dissipation component having a heat absorption end, a heat release end and a heat dissipation end, the heat absorption end is located in the cavity and is used to abut the server, the heat release end is located outside the cabinet, and the heat dissipation end is connected to the heat release end; an air cooling component is provided on the heat dissipation air duct to form a heat dissipation airflow path on the heat dissipation air duct; the spray component and the heat dissipation air duct form a liquid circulation path; the control module includes a controller, a first temperature sensor, a second temperature sensor, a third temperature sensor, a fourth temperature sensor and a humidity sensor, the first temperature sensor is provided at the heat release end, the second temperature sensor is provided at the inlet of the heat dissipation airflow path, the third temperature sensor is provided at the outlet of the heat dissipation airflow path, and the fourth temperature sensor and the humidity sensor are both provided outside the cabinet, for obtaining the first temperature of the first temperature sensor, the second temperature of the second temperature sensor, the third temperature of the third temperature sensor, the fourth temperature of the fourth temperature sensor and the humidity data of the humidity sensor, and controlling the air cooling component and the spray component through the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature and the humidity data. Among them, based on the control module according to the obtained first temperature, second temperature, third temperature, fourth temperature and humidity data, the controller controls the air cooling components and spray components in the heat dissipation cabinet in real time to adjust the heat dissipation intensity in real time, which is highly flexible, thereby improving the heat dissipation effect of the server.

[0011] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are provided to facilitate a better understanding of the present invention and do not constitute a limitation of the present disclosure.

[0013] Figure 1 This is one of the structural schematic diagrams of a heat dissipation cabinet provided in an embodiment of the present disclosure;

[0014] Figure 2 This is a second structural diagram of a heat dissipation cabinet provided in an embodiment of the present disclosure;

[0015] Figure 3 This is a third structural diagram of a heat dissipation cabinet provided in an embodiment of the present disclosure;

[0016] Figure 4 This is a fourth structural diagram of a heat dissipation cabinet provided in an embodiment of the present disclosure;

[0017] Figure 5 This is a fifth structural diagram of a heat dissipation cabinet provided in an embodiment of the present disclosure;

[0018] Figure 6 A schematic cross-sectional view of a heat dissipation cabinet provided in an embodiment of the present disclosure, wherein the equipment box is not shown;

[0019] Figure 7 A schematic diagram of the structure of the server, circulating heat conducting element, and heat dissipating element provided in an embodiment of the present disclosure;

[0020] Figure 8 for Figure 7 Schematic diagram of the local structure;

[0021] Figure 9 A flow chart of a control method based on a control module provided in an embodiment of the present disclosure;

[0022] The above drawings include the following reference numerals:

[0023] 100. Heat dissipation cabinet;

[0024] 1. Cabinet body, 11. Loading plate;

[0025] 2. Circulating heat conducting element, 21. Heat absorbing end, 22. Heat releasing end, 23. First fin, 24. Second fin, 25. Liquid extraction pipe, 26. Liquid delivery pipe, 27. Circulating pump;

[0026] 3. Heat dissipation element, 31. Heat sink, 32. Heat dissipation duct, 321. Metal tube, 322. Metal rod, 33. Metal cooling plate, 34. Guide plate;

[0027] 4. Air cooling assembly, 41. Inlet fan, 42. Exhaust fan;

[0028] 5. Spray assembly, 51. Water storage tank, 52. Atomizing nozzle, 53. Water pump, 54. Water pump;

[0029] 61. First temperature sensor, 62. Second temperature sensor, 63. Third temperature sensor, 64. Fourth temperature sensor;

[0030] 7. Equipment box;

[0031] 200. Server. DETAILED DESCRIPTION

[0032] In order to enable those skilled in the art to better understand the present disclosure, the present disclosure is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0033] like Figures 1 to 8 As shown, an embodiment of the present disclosure provides a heat dissipation cabinet 100 , and the heat dissipation cabinet 100 is described in detail through its structure and working principle.

[0034] The heat dissipation cabinet 100 of the embodiment of the present disclosure includes a cabinet body 1, a circulating heat conducting member 2, a heat dissipating member 3, an air cooling assembly 4, a spray assembly 5 and a control module.

[0035] The cabinet 1 has a cavity for mounting the server 200. The circulating heat dissipation assembly comprises a heat absorbing end 21, a heat releasing end 22, and a heat dissipation end. The heat absorbing end 21 is located within the cavity and abuts the server. The heat releasing end 22 is located outside the cabinet 1 and is connected to the heat dissipation end 22. The air cooling assembly 4 is mounted on the heat dissipation end to form a heat dissipation airflow path. The spray assembly 5 forms a liquid circulation path with the heat dissipation end.

[0036] The control module includes a controller, a first temperature sensor 61, a second temperature sensor 62, a third temperature sensor 63, a fourth temperature sensor 64 and a humidity sensor. The first temperature sensor 61 is arranged at the heat release end 22, the second temperature sensor 62 is arranged at the inlet of the heat dissipation air duct 32, the third temperature sensor 63 is arranged at the outlet of the heat dissipation air duct 32, and the fourth temperature sensor 64 and the humidity sensor are both arranged outside the cabinet 1, and are used to obtain the first temperature of the first temperature sensor 61, the second temperature of the second temperature sensor 62, the third temperature of the third temperature sensor 63, the fourth temperature of the fourth temperature sensor 64 and the humidity data of the humidity sensor, and control the air cooling component and the spray component through the controller based on the first temperature, second temperature, third temperature, fourth temperature and humidity data.

[0037] When the heat dissipation cabinet 100 of the disclosed embodiment is in use, the heat absorption end 21 of the circulating heat conductor 2 absorbs the heat released by the server and guides the heat to the heat release end 22, thereby guiding the heat to the outside of the cabinet 1. The temperature of the heat dissipation end is relatively low, thereby reducing the heat of the heat release end 22 and guiding it to itself. The air-cooling component 4 blows air to the heat dissipation end to form an airflow at the heat dissipation end, taking away the heat of the heat dissipation end to cool the heat dissipation end. The spray component 5 sprays the heat dissipation end, and the liquid flows through the heat dissipation end, driving the heat of the heat dissipation end to cool the heat dissipation end. The liquid flowing down from the heat dissipation end flows back into the spray component 5.

[0038] Specifically, if Figures 1 to 6 As shown, the cabinet 1 includes a frame, a foot frame, a transparent door panel, transparent side panels, a top panel, a door handle and a supporting frame. The bottom wall of the frame is provided with a foot frame, the transparent door panel is rotatably provided on the front side of the frame, the transparent door panel is provided with a door handle, and the transparent side panels are provided on the side of the frame. The transparent door panel and the transparent side panels close the frame and enclose the cavity of the cabinet 1. Figure 8 As shown, the supporting frame is located in the cavity of the cabinet 1 , the supporting frame is connected to the frame, and the supporting frame has a plurality of supporting plates 11 , and the supporting plates 11 are used to support the server 200 .

[0039] The cabinet 1 uses transparent door panels and transparent side panels to seal and protect the internal environment of the cabinet 1, avoiding the risk of dust or flying catkins from the external environment being brought into the cabinet 1 by the air flow inside the cabinet 1 during the heat dissipation process and adhering to the surface of the server 200, and the accumulation of dust increasing the risk of static electricity, thereby avoiding damage to the electronic components in the server 200.

[0040] Furthermore, an LED light strip is provided on the inner wall of the cabinet 1 to illuminate the server 200 inside the cabinet 1 , so that the working status of the server 200 inside the cabinet can be directly observed without opening the door panel.

[0041] The circulating heat dissipation element includes a circulating heat conductor 2 and a heat dissipation element 3. The circulating heat conductor 2 has a heat-conducting liquid circulation path and forms a heat absorption end 21 and a heat release end 22. The heat dissipation element 3 forms the heat dissipation end. The heat dissipation element 3 includes a heat sink 31 and a heat dissipation air duct 32. The heat sink 31 connects the heat release end 22 and the heat dissipation air duct 32. The heat sink 31 quickly cools and dissipates the heat release end 22. At the same time, the air cooling component 4 and the spray component 5 blow air and spray the heat dissipation air duct 32, thereby removing heat from the heat dissipation air duct 32 and cooling the heat dissipation air duct 32. Therefore, the temperature of the heat dissipation air duct 32 is lower than that of the heat release end 22 and the heat sink 31. Therefore, while the heat sink 31 dissipates heat from the heat release end 22, it also transfers a portion of the heat to the heat dissipation air duct 32, accelerating the dissipation of heat from the heat release end 22, thereby improving the heat dissipation effect of the heat dissipation cabinet 100 on the server 200 in the embodiment of the present disclosure.

[0042] like Figure 3 、 Figure 6 and Figure 7 The circulating heat conducting member 2 includes a first fin 23, a second fin 24, a liquid extraction tube 25, a liquid infusion tube 26, and a circulating pump 27. Both the first fin 23 and the second fin 24 have a receiving cavity. The first fin 23 is used to attach to the server 200. The first fin 23 forms a heat absorbing end 21, and the second fin 24 forms a heat releasing end 22. The receiving cavity of the first fin 23, the liquid extraction tube 25, the circulating pump 27, the receiving cavity of the second fin 24, the liquid infusion tube 26, and the receiving cavity of the first fin 23 are sequentially connected to form a heat transfer liquid circulation path. When the heat dissipation cabinet 100 of the present embodiment is in use, the heat transfer liquid circulation path is filled with heat transfer liquid. In this embodiment, the heat transfer liquid used is thermal silicone oil.

[0043] A large amount of heat is generated during the operation of the server 200. The heat of the server 200 is absorbed by the thermal silicone oil in the first fin 23. The temperature of the thermal silicone oil increases, and the server 200 is cooled. The circulation pump 27 drives the thermal silicone oil to circulate, so that the thermal silicone oil in the first fin 23 after absorbing heat enters the second fin 24 through the extraction pipe 25 and the circulation pump 27. The second fin 24 is cooled and cooled by the heat sink 3. The cooled thermal silicone oil enters the first fin 23 through the infusion pipe 26 and continues to absorb the heat generated by the server 200, thereby achieving continuous heat dissipation and cooling of the server 200.

[0044] The heat dissipation cabinet 100 of the disclosed embodiment forms a heat-conducting liquid circulation path through the circulating heat-conducting member 2, transferring heat generated by the server 200 from the first fins 23 to the second fins 24. This effectively transfers heat generated by the server 200 within the cabinet 1 to the exterior of the cabinet 1, thereby not only dissipating heat from the server 200 but also reducing the space occupied within the cabinet 1. Furthermore, the large contact area between the sheet-shaped first fins 23 and the server 200 facilitates increased absorption of heat from the server 200 by the thermally conductive silicone oil, thereby ensuring efficient heat dissipation for the server 200.

[0045] Specifically, such as Figure 6 and Figure 7 As shown, first fins 23 are attached to the upper and lower sides of the server 200. Both first fins 23 are attached to the server 200, and simultaneously dissipate heat and cool the upper and lower sides of the server 200 to ensure the heat dissipation effect of the circulating heat conductive member 2 on the server 200.

[0046] For details, see Figures 6 to 8The plurality of second fins 24 are arranged at intervals along the front-to-back direction, i.e., the plurality of heat release ends 22 are arranged at intervals along the front-to-back direction. The plurality of second fins 24 of the circulating heat conductive element 2 increases the contact area between the heat release end 22 and the heat sink 3, thereby increasing the heat dissipation area and improving the heat dissipation effect of the heat release end 22. This ensures that the circulating heat conductive element 2 effectively dissipates the heat-conductive silicone oil, thereby ensuring that the heat dissipation cabinet 100 of the present embodiment effectively dissipates the heat from the server 200.

[0047] like Figures 6 to 8 As shown, the heat sink 3 includes a heat sink 31, a heat dissipation duct 32 and a metal cooling plate 33. The heat sink 31 connects the heat release end 22 and the heat dissipation duct 32. The metal cooling plate 33 is fitted and connected to the heat release end 22. The metal cooling plate 33 is connected to the heat sink 31, which is a semiconductor heat sink 31. The heat dissipation duct 32 includes a metal tube 321 and a metal rod 322. The metal tube 321 is fitted with the heat sink 31. The metal rod 322 is provided on a side of the metal cooling plate 33 adjacent to the semiconductor heat sink 31. The air cooling assembly 4 is provided on the metal rod 322. The metal cooling plate 33 is fitted and connected to the second fin 24. There are multiple second fins 24. Accordingly, there are multiple metal cooling plates 33 and metal rods 322. The multiple metal cooling plates 33 and the multiple metal rods 322 correspond one to one with the multiple second fins 24.

[0048] The second fins 24 are connected to the semiconductor heat sink 31, which dissipates heat from the second fins 24. Simultaneously, the semiconductor heat sink 31 transfers heat from the second fins 24 to the metal tube 321 and the metal cooling plate 33. The metal cooling plate 33 then transfers heat to the metal rod 322. The air cooling assembly 4 and the spray assembly 5 cool the metal rod 322 and the metal tube 321 through air cooling and spraying. It should be noted that the heat transfer effect between the metal cooling plate 33 and the second fins 24 is less than the heat transfer effect between the semiconductor heat sink 31 and the second fins 24.

[0049] The heat sink 31 uses a semiconductor heat sink 31, which utilizes the thermoelectric effect of the semiconductor material to transfer heat from the high-temperature part to the low-temperature part, so that the semiconductor transfers the heat of the high-temperature second fin 24 to the low-temperature metal tube 321 and metal rod 322, that is, transfers the heat to the heat dissipation air duct 32, realizes heat conduction and transfer, and facilitates the setting of the air-cooling component 4 and the spray component 5 as well as the dissipation and cooling of heat.

[0050] like Figure 3 、 Figure 5 、 Figure 7 and Figure 8As shown, there are two groups of circulating heat conducting elements 2 and heat dissipating elements 3. The two groups of circulating heat conducting elements 2 are symmetrically arranged on the left and right sides of the middle of the cabinet 1. The metal tubes 321 of the left and right heat dissipating elements 3 are connected to form a whole, and the metal rods 322 of the left and right heat dissipating elements 3 are connected to form a whole.

[0051] In some embodiments, the heat sink 3 further includes a plurality of guide plates 34, which are evenly arranged within the metal tube 321 to divide the metal tube 321 into a plurality of channels. The guide plates 34 increase the surface area of ​​the metal tube 321, thereby increasing the heat dissipation area of ​​the metal tube 321. This further improves the heat dissipation effect of the air cooling assembly 4 and the spray assembly 5 on the metal tube 321, thereby ensuring the heat dissipation effect of the circulating heat conductive element 2 on the thermally conductive silicone oil, and further ensuring the heat dissipation effect of the heat dissipation cabinet 100 of the present embodiment on the server 200.

[0052] In some embodiments, the heat dissipation duct 32 further includes fins (not shown) disposed on the metal rod 322. The fins increase the surface area of ​​the metal rod 322, thereby increasing the heat dissipation area of ​​the metal rod 322. This further enhances the heat dissipation effect of the air cooling assembly 4 and the spray assembly 5 on the metal pipe 321, thereby ensuring the heat dissipation effect of the circulating heat conductive element 2 on the thermally conductive silicone oil, and further ensuring the heat dissipation effect of the heat dissipation cabinet 100 on the server 200 in the embodiment of the present disclosure.

[0053] Specifically, the material of the guide plate 34 is the same as that of the metal tube 321 , and the material of the ribs is the same as that of the metal rod 322 .

[0054] In some embodiments, the metal rod 322 is coated with a nanocoating. The metal tube 321 is also coated with a nanocoating. The nanocoating can increase the hydrophilicity of the metal rod 322 and the metal tube 321, improving the heat exchange efficiency between the metal rod 322 and the metal tube 321 and the spray water. This further enhances the heat dissipation effect of the air cooling assembly 4 and the spray assembly 5 on the metal tube 321, thereby ensuring the heat dissipation effect of the circulating heat conductive element 2 on the thermally conductive silicone oil, and further ensuring the heat dissipation effect of the heat dissipation cabinet 100 on the server 200 according to the disclosed embodiment.

[0055] like Figures 3 to 6As shown, the spray assembly 5 includes a water reservoir 51, an atomizing nozzle 52, a water extraction pipe 53, and a water pump 54. The water reservoir 51 is located on one side of the heat dissipation duct 32 to collect water droplets dripping from the heat dissipation duct 32. The atomizing nozzle 52 is located on the other side of the heat dissipation duct 32. The water extraction pipe 53 connects the water reservoir 51 and the atomizing nozzle 52. The water pump 54 is located on the water extraction pipe 53. The water reservoir 51 is located below the heat dissipation duct 32. The water reservoir 51 stores water. The water pump 54 pumps water from the water reservoir 51 through the water extraction pipe 53 to the atomizing nozzle 52. The atomizing nozzle 52 atomizes the water and sprays it toward the metal rod 322 and metal tube 321. Some of the atomized water droplets evaporate, dissipating heat from the metal rod 322 and metal tube 321. Water droplets dripping from the metal rod 322 and metal tube 321 fall into the water reservoir 51, repeating the spraying cycle.

[0056] In some embodiments, the semiconductor heat sink 31 is positioned opposite a water reservoir 51 so that the reservoir 51 can collect condensed water dripping from the semiconductor heat sink 31. The semiconductor heat sink 31 and the water reservoir 51 are vertically opposed, and the opening of the reservoir 51 is able to cover the semiconductor heat sink 31 from above and below. Because the temperature at the connection between the semiconductor heat sink 31 and the second fins 24 is higher, while the temperature at the connection between the semiconductor heat sink 31 and the metal tube 321 and the connection between the semiconductor heat sink 31 and the metal cooling plate 33 is lower, the temperature difference between the two sides of the semiconductor heat sink 31 (the high-temperature side and the low-temperature side) is large, making it easy for condensed water to form at the connection between the semiconductor heat sink 31 and the second fins 24. The resulting condensed water drips downward into the water reservoir 51, where it is recovered and recirculated into the liquid circulation path formed by the spray assembly 5 for reuse, preventing the condensed water from being directly discharged and causing localized water accumulation.

[0057] In some embodiments, the air cooling assembly 4 includes an air intake fan 41 and an exhaust fan 42. The exhaust fan 42 is located on one side (lower side) of the heat dissipation end, and the air intake fan 41 is located on the other side (upper side) of the heat dissipation end. Figures 3 to 6 As shown, the metal rod 322 is located above the metal tube 321, the air intake fan 41 is located above the metal rod 322, the exhaust fan 42 is located below the metal tube 321, and the water storage tank 51 is located below the exhaust fan 42. The exhaust fan 42 faces the rear side of the cabinet 1. The heat dissipation airflow path formed by the air intake fan 41 and the exhaust fan 42 on the heat dissipation air duct 32 is a path that bends downward and then backward, dissipating heat from the heat dissipation air duct 32 to the rear side of the heat dissipation cabinet 100 of the present embodiment.

[0058] In some embodiments, the heat dissipation cabinet 100 further includes an equipment box 7, which is located outside the cabinet 1. The heat dissipation end, the heat release end 22, the fourth temperature sensor 64, and the humidity sensor are all located in the equipment box 7. The equipment box 7 provides protection for the heat dissipation end and the heat release end 22.

[0059] Specifically, such as Figures 2 to 5 As shown, the water storage tank 51 is arranged on the bottom wall of the equipment box 7, the exhaust fan 42 is located between the bottom wall of the equipment box 7 and the metal pipe 321, the equipment box 7 is open on the upper side corresponding to the metal rod 322, the air intake fan 41 is arranged on the upper side of the equipment box 7, and the rear side of the equipment box 7 is open.

[0060] In addition, the heat dissipation cabinet 100 of the embodiment of the present disclosure is also suitable for integrated installation with a distribution box, and can achieve the same heat dissipation effect.

[0061] In the embodiment of the present disclosure, when the heat dissipation cabinet 100 is in the startup phase, the control module can control the air cooling component to maintain the speed at the minimum through the controller. The system runs and detects the corresponding initial temperature and initial humidity through the first temperature sensor, the second temperature sensor, the third temperature sensor, the fourth temperature sensor and the humidity sensor.

[0062] Furthermore, in the disclosed embodiment, when the second temperature sensor detects that the surface temperature of the heat dissipation airflow path exceeds a preset threshold, the control module, through the controller, can activate water pump 54. Condensed water is pressurized and transported to atomizing nozzle 52 via pumping pipe 53 to form water mist particles with a corresponding diameter (e.g., 20-50 μm). The water mist covers the outer surface of the heat dissipation airflow path, evaporating and absorbing a large amount of heat (e.g., approximately 2260 J of heat per gram of water evaporated). Simultaneously, the controller adjusts the air cooling assembly to accelerate the evaporation process of the airflow, and unevaporated water droplets flow back to water storage tank 51 for recycling. In the disclosed embodiment, the preset threshold can be determined experimentally.

[0063] Furthermore, in the embodiment of the present disclosure, the control module can be based on the first temperature , second temperature , the third temperature , the fourth temperature and humidity data The controller controls the air cooling assembly and the spray assembly to adjust the fan speed and water pump flow rate to maintain the temperature difference of the semiconductor heat sink within the optimal range (e.g., 60±5°C). When the first temperature, second temperature, third temperature, fourth temperature, and humidity data meet different conditions, the corresponding controller controls the air cooling assembly and the spray assembly in different ways.

[0064] Specifically, in the embodiments of the present disclosure, Figure 9 A flow chart of a control method based on a control module proposed in an embodiment of the present disclosure is shown in FIG. Figure 9 As shown, the method for controlling the air cooling component and the spray component through the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature and the humidity data may include the following steps:

[0065] Step S1: If the temperature difference between the third temperature and the second temperature is greater than a first preset value, a first target fan speed is determined based on the third temperature and the second temperature, and the fan speed of the air cooling component 4 is adjusted to the first target fan speed through the controller.

[0066] The first preset value is the temperature difference between the third temperature at the previous moment and the second temperature.

[0067] In the embodiment of the present disclosure, if the temperature difference between the third temperature and the second temperature at the current moment is greater than the first preset value, that is, the temperature difference between the third temperature and the second temperature at the current moment is greater than the temperature difference between the third temperature and the second temperature at the previous moment, at this time, the inlet and outlet temperature difference of the heat dissipation airflow path shows an upward trend. Based on this, it is necessary to increase the fan speed based on the third temperature and the second temperature at the current moment to accelerate heat dissipation.

[0068] In the embodiment of the present disclosure, a first target fan speed can be determined based on the third temperature and the second temperature, and the fan speed of the air-cooling assembly 4 can be adjusted to the first target fan speed by the controller. In the embodiment of the present disclosure, the method for determining the first target fan speed based on the third temperature and the second temperature can include: determining the first target fan speed based on the third temperature and the second temperature using a first formula, wherein the first formula is:

[0069]

[0070] in, is the gain coefficient, which can be adjusted according to the heat dissipation requirements. The minimum rotation speed of the air-cooling component 4 is maintained to ensure the basic airflow. is the first target fan speed.

[0071] In the disclosed embodiment, the air inlet fan and the air outlet fan in the air cooling component 4 operate synchronously. Based on this, the controller adjusts the fan speed of the air cooling component 4 to the first target fan speed. That is, the controller adjusts the fan speeds of the air inlet fan and the air outlet fan in the air cooling component 4 to the first target fan speed.

[0072] In the embodiment of the present disclosure, the above-mentioned first target fan speed is determined by the third temperature and the second temperature. Therefore, the controller can adjust the fan speed of the air-cooling component in real time according to the third temperature and the second temperature, which is highly flexible.

[0073] Step S2: If the temperature difference between the third temperature and the fourth temperature is greater than the second preset value, and the humidity data is less than the first humidity preset value, the target water spraying volume is determined based on the third temperature, the fourth temperature, the humidity data and the first humidity preset value, and the water spraying volume of the atomizing nozzle 52 in the spray assembly 5 is adjusted to the target water spraying volume through the controller.

[0074] In the disclosed embodiment, if the temperature difference between the third and fourth temperatures is greater than the second preset value, and the humidity data is less than the first preset humidity value, the water spray rate of the atomizing nozzle is determined based on the third temperature, the second temperature, and the humidity data at the current moment to accelerate heat dissipation while preventing overhumidification. The second preset value can be set based on experimental data or as needed, such as 10°C. The first preset humidity value can be the maximum current humidity value, which can be set as needed, such as 80%.

[0075] In the embodiment of the present disclosure, the method for determining the target water spraying amount based on the third temperature, the fourth temperature, the humidity data, and the first humidity preset value may include: determining the target water spraying amount using a second formula based on the third temperature, the fourth temperature, the humidity data, and the first humidity preset value, wherein the second formula is:

[0076]

[0077] in, is the target water spraying volume, in units of , is the proportional coefficient of water spray volume, RH max The first humidity preset value.

[0078] Step S3: If the first temperature and the fourth temperature meet the preset conditions and the humidity data is greater than the second humidity preset value, the second target fan speed is determined, and the water pump 54 in the spray assembly 5 is turned off by the controller and the fan speed of the air cooling assembly 4 is adjusted to the second target fan speed.

[0079] The preset condition is that the first temperature is lower than the fourth temperature by a preset temperature.

[0080] In the disclosed embodiment, if the first and fourth temperatures meet the preset conditions and the humidity data is greater than the second preset humidity value, it indicates that the humidity is too high or the heat sink fins are too cold. Based on this, the controller needs to shut down the water pump 54 in the spray assembly 5 and adjust the fan speed of the air cooling assembly 4 to the second target fan speed to prevent condensation. The second target fan speed can be 50% of the current fan speed.

[0081] In the embodiment of the present disclosure, the above-mentioned preset temperature can be set according to experimental data, such as 5°C, which is ; The above second humidity preset value can be set as needed, such as 70%.

[0082] Step S4: If the fourth temperature is lower than the third preset value, the atomizing nozzle 52 in the spray assembly 5 is closed by the controller.

[0083] In the embodiment of the present disclosure, if the fourth temperature is lower than the third preset value, it indicates that the ambient temperature is relatively low and no heat dissipation is required. Based on this, the atomizing nozzle 52 in the spray assembly 5 is turned off by the controller, and only the air cooling assembly is used to ensure that the residual heat is dissipated, thereby starting the energy-saving mode.

[0084] Furthermore, in the embodiment of the present disclosure, if the main device is turned off, the control module can turn off the atomizing nozzle 52 in the spray assembly 5 through the controller, and the air cooling assembly will be delayed to shut down for a preset time to ensure that the residual heat is dissipated and energy consumption is saved. The preset time can be set as needed, such as .

[0085] Furthermore, in the disclosed embodiment, the control module further includes a liquid level sensor (not shown), which is disposed in the water storage tank 51. The control module can also be configured to receive the condensate level from the liquid level sensor and control the air cooling assembly via the controller based on the condensate level.

[0086] In the disclosed embodiment, the method for controlling the air-cooling assembly via a controller based on the condensate level may include: if the condensate level falls below a preset level value, the controller shuts down the water pump 54 in the spray assembly 5, controls the air-cooling assembly to delay shutdown for a preset time, and issues a prompt message to increase the water volume in the water storage tank, thereby ensuring that excess heat is dissipated and energy is saved. In addition, real-time control and warning can be provided to facilitate timely processing. The preset level value may be the minimum safe level of the water storage tank 51, which can be manually set.

[0087] In the embodiment of the present disclosure, the control module can , second temperature , the third temperature , the fourth temperature and humidity data The controller controls the air cooling components and spray components in the heat dissipation cabinet in real time to adjust the heat dissipation intensity in real time, which is highly flexible and makes the heat dissipation effect of the server better.

[0088] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this disclosure.

[0089] The above is a detailed introduction to a heat dissipation cabinet provided by the present disclosure. Specific examples are used herein to illustrate the principles and implementation methods of the present disclosure. The description of the above embodiments is only intended to help understand the method and core ideas of the present disclosure. It should be pointed out that, for ordinary technicians in this technical field, without departing from the principles of the present disclosure, several improvements and modifications can be made to the present disclosure, and these improvements and modifications also fall within the scope of protection of the claims of the present disclosure.

Claims

1. A heat dissipation cabinet (100), characterized in that: include: A cabinet (1), wherein the cabinet (1) has a cavity for installing a server; a circulating heat dissipation component, the circulating heat dissipation component comprising a heat absorbing end (21), a heat releasing end (22) and a heat dissipation end, the heat absorbing end (21) being located in the cavity and being used to abut against the server, the heat releasing end (22) being located outside the cabinet (1), and the heat dissipation end being connected to the heat releasing end (22); An air cooling component (4), the air cooling component (4) being arranged on the heat dissipation end to form a heat dissipation airflow path on the heat dissipation end; A spray assembly (5), wherein the spray assembly (5) and the heat dissipation end form a liquid circulation path; A control module, the control module comprising a controller, a first temperature sensor (61), a second temperature sensor (62), a third temperature sensor (63), a fourth temperature sensor (64) and a humidity sensor, wherein the first temperature sensor (61) is arranged at the heat release end (22), the second temperature sensor (62) is arranged at the inlet of the heat dissipation airflow path, the third temperature sensor (63) is arranged at the outlet of the heat dissipation airflow path, and the fourth temperature sensor (64) and the humidity sensor are both arranged outside the cabinet (1); the control module is used to obtain the first temperature of the first temperature sensor (61), the second temperature of the second temperature sensor (62), the third temperature of the third temperature sensor (63), the fourth temperature of the fourth temperature sensor (64) and the humidity data of the humidity sensor, and control the air cooling component and the spray component through the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature and the humidity data; The controlling the air cooling component and the spray component by the controller based on the first temperature, the second temperature, the third temperature, the fourth temperature and the humidity data includes: If the temperature difference between the third temperature and the second temperature is greater than a first preset value, a first target fan speed is determined based on the third temperature and the second temperature, and the fan speed of the air cooling component (4) is adjusted to the first target fan speed by the controller, wherein the first preset value is the temperature difference between the third temperature and the second temperature at the previous moment; If the temperature difference between the third temperature and the fourth temperature is greater than a second preset value, and the humidity data is less than a first preset humidity value, a target water spraying amount is determined based on the third temperature, the fourth temperature, the humidity data, and the first preset humidity value, and the water spraying amount of the atomizing nozzle (52) in the spray assembly (5) is adjusted to the target water spraying amount by the controller; If the first temperature and the fourth temperature meet a preset condition, and the humidity data is greater than a second humidity preset value, a second target fan speed is determined, and the water pump (54) in the spray assembly (5) is turned off by the controller, and the fan speed of the air cooling assembly (4) is adjusted to the second target fan speed, wherein the preset condition is that the first temperature is lower than the fourth temperature by a preset temperature; If the fourth temperature is less than the third preset value, the atomizing nozzle (52) in the spray assembly (5) is closed by the controller.

2. The heat dissipation cabinet (100) according to claim 1, characterized in that: The circulating heat dissipation assembly comprises a circulating heat conducting member (2) and a heat dissipation member (3); the circulating heat conducting member (2) has a heat conducting liquid circulation path and forms the heat absorbing end (21) and the heat releasing end (22); the heat dissipation member (3) forms the heat dissipation end; the heat dissipation member (3) comprises a heat dissipation fin (31) and a heat dissipation air duct (32); the heat dissipation fin (31) connects the heat releasing end (22) and the heat dissipation air duct (32).

3. The heat dissipation cabinet (100) according to claim 2, characterized in that: The heat sink (3) further comprises a metal cooling plate (33), the metal cooling plate (33) being attached to the heat release end (22), the metal cooling plate (33) being connected to the heat sink (31), the heat sink (31) being a semiconductor heat sink (31), the heat dissipation air duct (32) comprising a metal tube (321) and a metal rod (322), the metal tube (321) being attached to the heat sink (31), the metal rod (322) being arranged on a side of the metal cooling plate (33) adjacent to the semiconductor heat sink (31), and the air cooling assembly (4) being arranged on the metal rod (322).

4. The heat dissipation cabinet (100) according to claim 3, characterized in that: The spray assembly (5) comprises a water storage tank (51), an atomizing nozzle (52), a water pump (53) and a water pump (54); the water storage tank (51) is arranged on one side of the heat dissipation air duct (32) to receive liquid dripping from the heat dissipation air duct (32); the atomizing nozzle (52) is arranged on the other side of the heat dissipation air duct (32); the water pump (53) connects the water storage tank (51) and the atomizing nozzle (52); and the water pump (54) is arranged on the water pump (53); the semiconductor heat sink (31) is opposite to the water storage tank (51) so that the water storage tank (51) receives condensed water dripping from the semiconductor heat sink (31).

5. The heat dissipation cabinet (100) according to claim 3, characterized in that: The heat sink (3) further comprises a plurality of guide plates (34), wherein the plurality of guide plates (34) are evenly arranged in the metal tube (321) to separate the metal tube (321) into a plurality of channels; And / or, the heat dissipation duct (32) further comprises fins, and the fins are provided on the metal rod (322); And / or, the metal rod (322) and / or the metal tube (321) is coated with a nano coating.

6. The heat dissipation cabinet (100) according to claim 2, characterized in that: The circulating heat-conducting member (2) comprises a first fin (23), a second fin (24), a liquid extraction pipe (25), a liquid infusion pipe (26) and a circulating pump (27); the first fin (23) and the second fin (24) both have a receiving cavity; the first fin (23) is used to fit the server; the second fin (24) forms the heat-releasing end (22); the first fin (23) forms the heat-absorbing end (21); the receiving cavity of the first fin (23), the liquid extraction pipe (25), the circulating pump (27), the receiving cavity of the second fin (24), the liquid infusion pipe (26) and the receiving cavity of the first fin (23) are sequentially connected to form a heat-conducting liquid circulation path.

7. The heat dissipation cabinet (100) according to claim 1, characterized in that: The air cooling assembly (4) comprises an air intake fan (41) and an exhaust fan (42), wherein the exhaust fan (42) is arranged on one side of the heat dissipation end, and the air intake fan (41) is arranged on the other side of the heat dissipation end; And / or, the heat dissipation cabinet (100) further comprises an equipment box (7), the equipment box (7) is arranged outside the cabinet body (1), and the heat dissipation end, the fourth temperature sensor (64) and the humidity sensor are all located in the equipment box (7).

8. The heat dissipation cabinet (100) according to claim 4, characterized in that: The control module further comprises a liquid level sensor, which is arranged in the water storage tank (51); the control module is further used for receiving the condensed water level from the liquid level sensor and controlling the air cooling component through the controller based on the condensed water level.

9. The heat dissipation cabinet (100) according to claim 8, characterized in that: The control of the air cooling component by the controller based on the condensed water level includes: if the condensed water level is lower than a preset level value, the controller shuts down the water pump (54) in the spray component (5), controls the air cooling component to delay shutdown for a preset time, and issues a prompt message for increasing the water volume in the water storage tank.

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