Shield assembly for printed circuit board

Abstract

A shroud assembly is shown and disclosed. In one embodiment, a shroud assembly includes a housing having a plurality of walls that collectively define a cavity sized to receive a printed circuit board (PCB) having a plurality of pins. The housing includes one or more retainers that secure the PCB to one or more of the plurality of walls. The shroud assembly additionally includes a handle attached to the housing. In other embodiments, the housing includes a first bonding structure that corresponds to a second bonding structure of at least one wall that at least partially defines an opening of a component that is distinct and separate from the shroud component. The opening is sized to receive a housing of the shroud assembly. The first and second bonding structures are positioned to allow the opening to receive the housing only in a predetermined orientation. In other embodiments, the assembly includes an electromagnetic interference (EMI) shield.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 433,930, filed on Dec. 20, 2022, the content of which is incorporated herein by reference in its entirety. Background of the Invention

[0003] The subject matter of this application relates to a shroud assembly for a printed circuit board (PCB) and other electronic components. The PCB and other electronic components have pins that are received in sockets of different and separate electronic devices. Sometimes the PCB must be separated from the electronic device, so the pins of the PCB must be separated from the sockets of the electronic device and then reinstalled in the future. During removal and installation, the user must take care not to damage the various components attached to the PCB. Additionally, when the pins of the PCB are received in the sockets, the operation of the PCB can emit radio frequency (RF) signals that can interfere with one or more other components of the electronic device.

[0004] Accordingly, there is a desire for a shroud assembly that receives a PCB and protects the PCB components, that allows for easy installation and removal of the PCB, and / or shields any RF signals from escaping the immediate area of the PCB. Brief Description of the Drawings

[0005] To better understand the present invention and to show how it may be implemented, reference will now be made, by way of example, to the accompanying drawings, in which:

[0006] Figure 1 is an isometric view of an example of the shroud assembly.

[0007] Figure 2 is Figure 1 another isometric view of the shroud assembly.

[0008] Figure 3 is Figure 1 the front view of the shroud assembly.

[0009] Figure 4 is Figure 1 the bottom view of the shroud assembly.

[0010] Figure 5 is Figure 1 the exploded view of the shroud assembly.

[0011] Figure 6 is the isometric view of the shroud assembly with a PCB attached Figure 1 to it.

[0012] Figure 7 is Figure 6 the front view of the shroud assembly.

[0013] Figure 8 is Figure 6 a bottom view of a shield assembly.

[0014] Figure 9 is a partial view of an example of an electronic device having an opening of a shield assembly that receives Figure 6 . DETAILED DESCRIPTION

[0015] Referring Figures 1 - 5 to Figures 1 - 5 , an example of a shield assembly 10 is shown. The shield assembly includes a housing 12, an electromagnetic interference (EMI) shield 14, and a handle 16. In the example shown in

[0016] , the EMI shield is disposed between the housing and the handle. Figures 1 - 5 , the housing 12 includes a plurality of walls 18 that define a cavity 20 sized to receive at least one printed circuit board (PCB) and / or other electronic component(s). In the example shown in Figures 1 - 5 , the walls 18 include opposing sidewalls 22, a rear wall 24 that connects and / or spans the sidewalls, and a top wall 26 that connects and / or spans the rear wall and the sidewalls. The sidewalls 22, rear wall 24, and top wall 26 together define the cavity 20. However, other examples of the housing 12 may utilize fewer than all of the walls 18 to define the cavity 20. In the example shown in

[0017] , the walls 18 are formed together. However, other examples of the housing 12 may include one or more walls 18 that are attached together. Figures 1 - 5 , the housing 12 further includes one or more retainers 28 that secure the PCB in the cavity 20 and / or to one or more of the walls 18. The retainers may be attached to one or more of the walls 18 or formed therewith. The retainers 28 may include any suitable structure. In the example shown in Figures 1 - 5 , the retainers 28 are in the form of cantilever latches 30, each cantilever latch having a beam or planar portion 32 and a capture or receiving portion 34. Other examples of the retainers 28 may include mounting bosses, mounting brackets, and mounting rails (and their associated fasteners, if applicable). The retainers 28 may be attached to one or more of the walls 18 of the housing 12 or formed therewith. In the example shown in

[0018] The housing 12 also includes one or more bonding structures 36 that correspond to bonding structures of a component or device that is different from and separate from the shield assembly 10. The bonding structures 36 of the housing 12 require the user to attach the housing 12 and / or receive the PCB in the cavity 20 only in a predetermined orientation and / or position. In Figures 1 - 5 In the example shown, the bonding structure 36 includes at least one protrusion or projection 38 that corresponds to at least one groove or channel of a separate component or device. Other examples of the bonding structure 36 include protruding structures, holes, threads, etc.

[0019] The housing 12 additionally includes one or more ribs or reinforcing structures 40 that are attached to or formed with one or more walls 18. In Figures 1 - 5 In the example shown, the ribs 40 include a U-shaped horizontal rib 42 and three spaced-apart vertical ribs 44 that are attached to or formed with the horizontal rib. The U-shaped horizontal rib is formed with the side walls 22 and the rear wall 24, and the vertical ribs 44 are formed with the rear wall. The ribs 40 also include an inclined surface 46 that is formed with the side walls 22 and the rear wall 24. However, other examples of the housing 12 may include ribs or reinforcing structures having different shapes and / or sizes.

[0020] In Figures 1 - 5 In the example shown, the housing 12 also includes one or more bosses or protruding structures 48 that are attached to or formed with the top wall 26. Each boss 48 includes an orifice 49 that has threads 50 corresponding to the threads 52 of a fastener 54. In Figures 1 - 5 In the example shown, the fastener 54 is a screw, but other examples of the fastener 54 include bolts and other suitable fasteners. Additionally, other examples of the housing 12 may exclude or omit the threads 50 (such as when the fastener does not include corresponding threads), or exclude or omit the bosses 48 (such as when the top wall 26 includes an orifice 49 without a boss 48). In other examples, the housing 12, the EMI shield 14, and / or the handle 16 may be attached together without the fastener 54 (such as via ultrasonic welding).

[0021] The EMI shield 14 includes a base portion 56 and an extension portion 58. In Figures 1 - 5 In the example shown, the base portion 56 is planar and the extension portion is expanded. The base portion 56 is the majority of the EMI shield 14 and is attached to the top wall 26 of the housing 12. The base portion includes one or more holes 60 that receive the bosses 48 and / or the fastener 54 of the top wall 26. However, the EMI shield may alternatively or additionally be attached to one or more other walls of the plurality of walls 18.

[0022] The extension portions 58 are attached to or formed with the base portion 56. The extension portions are spaced apart from each other. Although two spaced-apart extension portions 58 are shown attached to or formed with each end of the base portion 56, and three spaced-apart extension portions 58 are shown attached to or formed with each side of the base portion 56, other examples of the EMI shield 14 may include fewer or more extension portions. For example, a single extension portion 58 may be attached to or formed with each end of the base portion 56, and / or one or two spaced-apart extension portions 58 may be attached to or formed with each side of the base portion 56.

[0023] The EMI shield is disposed between the handle and the housing. In other words, the EMI shield is "sandwiched" between the handle and the housing (e.g., when the handle and the housing have approximately the same size, "sandwiched" between two halves). As further discussed below, the EMI shield 14 is sized to completely or at least substantially cover or span the opening in which the housing is received to block any potential RF leakage from the PCB received in the cavity 20 of the housing 12.

[0024] The handle 16 is attached to the EMI shield 14 and / or the housing 12, such as to the top wall 26 of the housing 12. However, the handle may alternatively or additionally be attached to one or more other walls 18 of the housing 12. The handle 16 may be of any suitable shape(s) and / or size(s). In Figures 1 - 5 the example shown, the handle 16 includes two planar or flat portions 62, 64 and a rectangular parallelepiped portion 66 disposed between the planar portions. The planar portions 62, 64 and the rectangular parallelepiped portion 66 each include one or more openings 68 that correspond to the aperture(s) 49 of the housing 12 and / or the holes 60 of the EMI shield 14, and the one or more openings receive fasteners 54 to attach, secure, or fasten the handle 16 to the EMI shield 14 and / or the housing 12. Although the handle 16 is shown attached to the housing 12, in some embodiments, the handle may be formed with the housing 12. In these embodiments, the housing and / or the handle may include a slot or opening for receiving the EMI shield 14.

[0025] Reference Figures 6 - 8 to Figures 6 - 8 , the shield assembly 10 is shown having a PCB 100 received in the cavity 20. The PCB 100 includes a board 102 and a plurality of pins 104. In Figures 6 - 8When fixed to the housing 12 as shown, most of the volume of the cavity 20 can be used to accommodate or receive electronic components (not shown) attached to the board 102. In other words, as Figure 8 best shown in, the sidewall 22 has a certain height such that the board 102 is fixed at a position spaced apart from the rear wall 24 to provide a gap between the board 102 and the rear wall 24 for the electronic components attached to the board.

[0026] Referring Figure 9 , an example of an electronic device 108 that receives the shield assembly 10 and the PCB 100 is shown. The electronic device 108 includes one or more slots, cavities, or openings 110 for receiving the shield assembly 10, to which the PCB is attached. The opening 110 includes a length 112 and a width 114. As Figure 9 shown in, the EMI shield 14 of the shield assembly 10 has a length and a width that are substantially the same as the length 112 and the width 114 to substantially cover the opening 110 to block any potential RF leakage from the PCB 100. The housing 12 of the shield assembly 10 is sized such that when the shield assembly and the PCB 100 are inserted into the opening 110, at least the housing and the EMI shield 14 are received in the opening, wherein all or most of the handle 16 extends outside the opening 110 to facilitate the insertion and removal of the shield assembly 10.

[0027] The slot 110 is defined by a plurality of walls 116, and one or more of those walls have at least one bonding structure 118 that corresponds to at least one bonding structure 36 of the housing 12 to ensure the insertion of the shield assembly in a predetermined orientation. In Figure 9 the example shown, the bonding structure 118 is in the form of a groove or a channel 120. Other examples of the bonding structure 118 include protrusions, projections, projecting structures, holes, threads, etc. The bottom surface or walls (not shown) of the slot 110 include sockets and / or other structures for receiving the pins 104 of the PCB 100.

[0028] The shield assembly of the present disclosure protects the PCB components and allows for the easy installation and removal of the PCB. Other advantages of the present disclosure include shielding RF signals to prevent those signals from escaping the cavity in which the PCB is installed. Additionally, having the EMI shield as part of the shield assembly allows for easier and faster installation without the need for separate and / or loose shields that might otherwise be lost or damaged. Further, the (multiple) bonding features or (multiple) bonding structures of the shield assembly act as alignment keys and guides for easier installation of the shield assembly.

[0029] It should be understood that the present invention is not limited to the specific embodiments described, and variations can be made therein without departing from the scope of the present invention as defined in the appended claims, which scope is interpreted according to the principles of prevailing law, including the doctrine of equivalents or any other principle that extends the enforceable scope of the claims beyond their literal scope. Unless the context otherwise indicates, a reference in a claim to the number of instances of an element, whether a reference to one instance or more than one instance, requires at least the specified number of instances of the element, but is not intended to exclude from the scope of the claim a structure or method having more instances of that element than the specified number. When used in a claim, the word "comprising" or its derivatives is used in a non-exclusive sense, which non-exclusive sense is not intended to exclude the presence of other elements or steps in the claimed structure or method.

Claims

1. A shield assembly, comprising: a housing having a plurality of walls that together define a cavity sized to receive a printed circuit board (PCB) having a plurality of pins, wherein the housing includes one or more retainers for securing the PCB to one or more of the plurality of walls; and a handle attached to the housing.

2. The assembly according to claim 1, wherein the plurality of walls include opposing side walls, a rear wall connecting the side walls, and a top wall connecting the rear wall and the side walls, wherein the side walls, the rear wall, and the top wall together define the cavity.

3. The assembly according to claim 2, wherein the handle is attached to the top wall.

4. The assembly according to claim 2, wherein the one or more retainers are attached to or formed with at least one of the opposing side walls.

5. The assembly according to claim 4, wherein each of the one or more retainers includes a cantilever snap.

6. The assembly according to claim 2, wherein one or more of the plurality of walls include a first bonding structure corresponding to a second bonding structure of at least one wall that at least partially defines an opening for an electronic component that is different from and separate from the shield assembly, the opening sized to receive at least the housing of the shield assembly, the first bonding structure and the second bonding structure positioned to allow the opening to receive at least the housing of the shield assembly only in a predetermined orientation.

7. The assembly according to claim 6, wherein the rear wall includes the first bonding structure.

8. The assembly according to claim 1, wherein the plurality of walls are formed together.

9. The assembly according to claim 1, wherein the handle includes at least one opening and the housing includes at least one orifice corresponding to the at least one opening, and the assembly further includes a fastener received in the at least one opening of the handle and the at least one orifice of the housing to secure the handle to the housing.

10. The assembly according to claim 1, further comprising an electromagnetic interference (EMI) shield disposed between the handle and the housing.

11. The assembly according to claim 10, wherein the handle includes at least one opening, the EMI shield includes at least one hole corresponding to the at least one opening, and the housing includes at least one orifice corresponding to the at least one opening and the at least one hole, and the assembly further includes a fastener received in the at least one opening of the handle, the at least one hole of the EMI shield, and the at least one orifice of the housing to secure the handle and the EMI shield to the housing.

12. A shield assembly, comprising: A housing having a plurality of walls that collectively define a cavity sized to receive a printed circuit board (PCB) having a plurality of pins, wherein the housing includes a first bonding structure corresponding to a second bonding structure of at least one of the walls, the at least one wall at least partially defining an opening for an electronic component that is different from and separated from the shield assembly, the opening sized to receive at least the housing of the shield assembly, the first bonding structure and the second bonding structure positioned to allow the opening to receive the housing of the shield assembly only in a predetermined orientation.

13. The assembly of claim 12, wherein the first bonding structure is at least one protrusion or projection formed with at least one of the plurality of walls, and the second bonding structure is at least one groove or channel formed with at least one of the walls that at least partially defines the opening for the electronic component.

14. The assembly of claim 12, further comprising an electromagnetic interference (EMI) shield attached to at least one of the plurality of walls.

15. A shield assembly comprising: A housing having a plurality of walls that collectively define a cavity sized to receive a printed circuit board (PCB) having a plurality of pins; And An electromagnetic interference (EMI) shield attached to at least one of the plurality of walls.

16. The assembly of claim 15, wherein the housing is sized to be received in an opening for an electronic component that is different from and separated from the shield assembly, and wherein when the housing is received in the opening, the EMI shield at least substantially covers the opening.

17. The assembly of claim 15, wherein a majority of the EMI shield is planar.

18. The assembly of claim 15, wherein the EMI shield includes one or more peripheral portions that curve away from the housing.

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