Electrical or electronic component, method for producing the electrical or electronic component, and use of such a component
The covers produced through the sol-gel process solve the problem of unstable connection between the contact pad and the contact line, and achieve stable connections within a wide temperature range, avoiding damage to the contact line by the formation of oxide layer and baking temperature.
Patent Information
- Application Number
- CN202380086699.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-12-19
- Filing Date
- 2023-11-21
- Publication Date
- 2025-07-29
AI Technical Summary
The connection between the contact pad and the contact line in existing electrical or electronic components is unstable, and the baking temperature of the glass slurry is higher than the operating temperature, resulting in complex bonding technology for the oxide layer.
The cover is produced using a sol-gel process containing organosilane compounds and ceramics, metals, glass and other materials. It forms mechanical and chemically stable covers through low-temperature baking, covering the connection area of the contact pad and the contact line.
Maintain connection stability over a wide application temperature range, avoid oxide layer formation, simplify subsequent bonding techniques, and reduce damage to the contact line by baking temperature.
Smart Images
Figure CN120391087A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an electrical or electronic component. Furthermore, the present invention relates to a method for producing an electrical or electronic component. Furthermore, the present invention includes two alternative uses of an electrical or electronic component produced by means of the method according to the present invention. Background Art
[0002] Electrical or electronic components are sometimes mass-produced in very large quantities. They include at least one functional element that provides an electrical or electronic function, and a substrate on which the functional element is mounted. Examples of such components are sensor elements, heating elements, and also signal processing and / or transmission elements such as microprocessors or radio modules.
[0003] Sensor elements are used in various applications and, depending on their design, are used for example to detect temperature, flow variables, gas concentration or composition, humidity values, pH values and / or biological variables (e.g., concentration of a substance), but can also be used as, for example, heating elements.
[0004] Such components mainly have at least one electrical connection in the form of metal contact pads. These contact pads are electrochemically connected to the functional elements by leads on, in, and / or through the substrate. To contact the component, one or more contact lines and / or contact line bundles (e.g., having a circular cross-section or a flat conductor) are connected to the contact pads. The connection of the contact line or line bundle to the contact pad is in particular achieved by a joining process such as a soldering process, a brazing process or a bonding process. In the following, when referring to a "contact line", the associated technical teachings always apply analogously to a contact line bundle or a flat strip.
[0005] However, these connections between the contact pads and the contact lines are mechanically relatively unstable. For this reason, the contact pads including the end regions of the connections of the contact lines are covered with a covering, i.e., a so-called stress relief. This is used to strengthen the connection by minimizing the shear force and tension on the connection point. The covering is also used to protect against environmental substances that may, for example, cause corrosion of the connection members.
[0006] The materials of the contact pads, contact lines and covering are selected according to the maximum operating temperature and compatibility with the connection material.
[0007] Specifically, the covering is manufactured by applying a covering paste. The paste consists of a glass-based material that is usually amorphous or semi-crystalline. Alternatively, the paste consists of a polymer selected from the group including thermoplastics, thermosets, elastomers or thermoplastic elastomers.
[0008] The covering paste can be roughly divided into three groups:
[0009] Group 1: For low application temperatures (up to approximately 250 °C), coverings can be used that are made of a polymer-based paste, in particular containing polyimides, silicones, epoxy resins, etc. The paste has a solvent content of 0% to 30%. The polymer-based material has very limited use due to its low-temperature stability and its aging process. The stress relief of the contact wire is rather low compared to other materials.
[0010] Group 2: In the application temperature range up to approximately 400 °C, low-melting glasses are used as materials.
[0011] Group 3: For higher application temperature ranges (from approximately 400 °C), glass-based materials with a higher glass transition point or melting point are used.
[0012] For glass variants, the combined proportion of solid and solvent is 70 to 90%, where the paste contains 10% to 30% filler. Solid components such as Al2O3, SiO2, ZrO2, TiO2, cordierite, forsterite, or other glasses can be considered.
[0013] The baking temperature of such a paste is at least 400 °C. The paste or the resulting covering must have a coefficient of thermal expansion compatible with the substrate.
[0014] The challenge in using glass pastes to produce glass-based materials is that they require a baking temperature above the melting temperature of the glass components. This requires that the contact wire must withstand the melting temperature of the glass and not form an oxide layer. Oxide layers are undesirable because they complicate subsequent joining techniques in final measurement and assembly. Instead, this means that, on the one hand, the maximum operating temperature in the application is always lower than the baking temperature during production, and on the other hand, the baking temperature must be lower than the oxidation temperature of the contact wire. Summary of the Invention
[0015] Accordingly, the present invention is based on the object of providing an electrical or electronic component that overcomes the above challenges.
[0016] This object is achieved by the electrical or electronic component according to claim 1, the method for manufacturing an electrical or electronic component according to claim 16, the first use according to claim 20, and the second use according to claim 21.
[0017] Regarding the electrical or electronic component, it is intended to include:
[0018] - A substrate having a first side and a second side opposite the first side;
[0019] - At least one functional element mounted on the first side or the second side or another side of the substrate;
[0020] - one or more contact pads, which are mounted on a first side of a substrate in a sub-region of the substrate for electrical contact with at least one functional element;
[0021] - for each contact pad, at least one contact wire connected to the corresponding contact pad in an end region; and
[0022] - a cover, which covers at least one contact pad or a plurality of contact pads, and corresponding end regions of one contact wire or a plurality of contact wires, wherein the cover is produced by baking a paste, which contains starting materials composed of organosilane compounds produced by means of a sol - gel process and at least one additional material from the group comprising ceramics, metals and / or glasses.
[0023] According to the invention, the cover consists of two components: a starting material in the form of an organosilane compound and an additional material. The particles of the starting material form chemical bonds with one another during baking. A ceramic - like structure is formed, which is mechanically and thermally stable and provides mechanical and chemical protection for the connection between the contact pad and the contact wire.
[0024] The sol - gel process is a method for producing solid non - metallic, inorganic or hybrid polymeric materials from a colloidal dispersion (called a sol).
[0025] The term "contact wire" should be interpreted broadly. In addition to classical wires with a circular cross - section, the term also includes, for example, one or more flat strips or wire bundles.
[0026] In addition, chemical bonds are formed with the added additional material particles, which significantly increases the strength of the cover in the cured state. Additionally, the starting material is also capable of forming chemical bonds with the substrate material, which significantly increases the bonding to the substrate.
[0027] Baking ( = curing the paste by exposure to a baking temperature) is carried out at a relatively low baking temperature. Thus, changes or damage to the contact wire or other elements of the component or the formation of oxide layers can be reduced.
[0028] A preferred embodiment of the component provides that the organosilane compound contains methylphenyl polysiloxane. The starting materials of the compound are linked by a sol - gel process to form methylphenyl polysiloxane, which has, for example, the following structural formula:
[0029]
[0030] The oxygen groups enable the formation of the described chemical bonds between the methylphenyl polysiloxane and the particles of the additional material, and, if applicable, between the methylphenyl polysiloxane and the substrate during baking.
[0031] In one embodiment, the substrate comprises a ceramic material, a metallic material, a semiconductor material or a composite material. As the ceramic material, it is possible to preferably use alumina, magnesia, aluminum nitride, mullite or other mixtures of ceramic compounds, such as zirconia. Examples of metallic materials that can be considered are stainless steel, copper or aluminum. Silicon or gallium arsenide is suitable as the semiconductor material, for example.
[0032] According to an advantageous embodiment of the component, one or more contact pads are provided which consist of a metallic material, in particular platinum. The contact pads consist of a layer applied to the substrate using thin-layer or thick-layer technology.
[0033] According to an advantageous embodiment of the component, the functional element serves as a sensor element for detecting at least one physical, chemical or biological measurement variable of a medium. In this case, the sensor element can be used to detect the temperature, humidity, conductivity and / or flow rate of the medium.
[0034] Alternatively, the functional element can serve as a heating element.
[0035] For both alternatives, it is advantageously provided that the functional element consists of, or has, a resistor structure, in particular in a meandering shape, where the resistor structure consists of, in particular, platinum, nickel or an alloy containing platinum or nickel (such as PtTh or NiCr). The resistor structure is manufactured by applying a metallic layer, which is then structured. The layer is applied using thin-layer or thick-layer processes. For example, the temperature value can be detected by measuring the resistance value. By applying electrical power, the resistor structure is heated and generates heat.
[0036] Alternatively, the functional element can be provided for signal processing and / or signal transmission. For this purpose, the functional element consists of a circuit having one or more electronic components (resistors, capacitors, coils, transistors, (light-emitting) diodes, etc.). It is also possible to provide that the functional element is an ASIC or a microprocessor, or contains other components, such as an antenna (for example, if the functional element acts as a radio module).
[0037] In one embodiment of the component, it is provided that the contact line or lines consist of a metallic material, in particular nickel, copper, gold, stainless steel, aluminum or molybdenum or an alloy. In particular, one or more contact lines are coated with an insulating material. Preferably, the contact lines are additionally coated with an electrochemically deposited metalization, where the insulating material surrounds the contact lines. Typical insulating materials include polymers, ceramic compounds or metal oxides. The connection between the contact lines and the contact pads is achieved in particular by means of a joining process, such as a soldering process, a brazing process or a bonding process.
[0038] The component can have at least two contact pads, where the contact pads are arranged on a common sub-region on the first side or the second side of the substrate, or where the contact pads are arranged on two separate end regions on the first side or the second side of the substrate. If the contact pads are not arranged in the same sub-region on one side of the substrate, then instead of one, a plurality of coverings are required such that each connection between the contact pads and the contact lines is covered by the covering.
[0039] In one embodiment of the component, it is provided that the component includes a passivation layer which is applied to the first side and / or the second side of the substrate such that the passivation layer covers at least the functional elements, where the passivation layer is composed of glass, glass-ceramic or polymer. The passivation layer serves to provide mechanical and chemical protection for the substrate and the components mounted thereon, such as the functional elements of the contact pads and / or the leads from the contact pads to the functional elements.
[0040] Regarding a method for producing such an electrical or electronic component, it is provided that the method includes:
[0041] - providing a substrate having a first side and a second side opposite the first side, having at least one functional element mounted on the first side or the second side or the other side of the substrate, having a functional layer, and having one or more contact pads mounted on a sub-region of the first side of the substrate for making electrical contact with at least one functional element, where for each contact pad, at least one contact line is provided which is connected to the corresponding contact pad in one end region;
[0042] - applying a paste which contains starting materials composed of organosilane compounds produced by means of a sol-gel process and at least one additional material from the group including ceramics and / or glass, where the paste covers at least one contact pad or a plurality of contact pads and the corresponding end regions of at least one contact line or a plurality of contact lines after application; and
[0043] - baking the paste at a baking temperature for at least a predetermined baking time to produce a covering layer.
[0044] The production process produces a component forming a covering made of a ceramic-like structure. This structure is both mechanically stable and thermally stable, and provides mechanical and chemical protection for the connection between the contact pads and the contact lines. During the baking or curing of the paste, compounds are created at least in the starting materials of the paste, which achieves the described properties.
[0045] An advantageous embodiment of the method provides for applying the paste by a dispersion process.
[0046] Select the parameters for baking or curing the paste such that the baking temperature is higher than 250 °C. The baking time is at least 2 hours. This evaporates the solvent in the paste, thereby drying the paste, and also creates the described compound (thus the paste is cured or baked).
[0047] Regarding a first use of an electrical or electronic component produced by means of the method according to the invention, it is provided that the component is used at an operating temperature higher than the baking temperature of the paste.
[0048] Regarding a second use of an electrical or electronic component produced by means of the method according to the invention, it is provided that the component is used at an operating temperature lower than the baking temperature of the paste.
[0049] Due to the specially manufactured cover, the component according to the invention allows operation in a wide range of application temperatures. (By forming a compound at least in the starting materials of the paste) forming a "quasi-ceramic" structure enables application temperatures above and below the baking temperature without other changes to the chemical structure of the cover. Description of the Drawings
[0050] The invention is explained in more detail with reference to the following drawings, in which:
[0051] Figure 1 : shows a first embodiment of a component according to the invention; and
[0052] Figure 2 : shows a second embodiment of a component according to the invention. Detailed Description
[0053] Figure 1 A first embodiment of the proposed electrical or electronic component 100 according to the invention is shown. The top view shows the component 100 in plan view, and the bottom view shows a cross-section along the longitudinal axis of the component 100.
[0054] In this embodiment, the component consists of a planar substrate 110. In other embodiments, the substrate can also be non-planar, for example in a thicker configuration or curved. The material of the substrate 110 can be arbitrarily selected, but must be suitable for mounting the components described below. For example, the substrate 110 consists of a metallic material, a ceramic material, a composite material, a polycrystalline material or a semiconductor material.
[0055] The functional element 120 is applied to the first side of the substrate. In this case, this is a resistor structure made of platinum, which is mounted on the substrate 110 by means of a thick-layer or thin-layer process and is used for temperature detection or as a heating element. However, the functional element 120 can also be designed differently and, for example, be designed as a sensor element for detecting physical, chemical or biological quantities other than temperature.
[0056] Two contact pads 131, 132 are mounted on a sub-region of the first side, more precisely on the edge region. These are composed of a metallic material and are also mounted on the substrate 110 using a thick layer or thin layer process. It is also possible that the contact pads 131, 132 are mounted on the other side of the substrate 110.
[0057] The contact pads 131, 132 are conductively connected to the functional element 120 via leads. The contact pads 131, 132 are used for external electrical contact with the functional element 120.
[0058] Furthermore, a passivation layer can be provided, which is mounted on the substrate 110 such that it covers at least a part of the substrate and a part of the functional element 120. The passivation layer is in particular composed of glass or a glass composite and is used to provide mechanical and chemical protection for the substrate 110 and the components mounted thereon, such as the functional element 120, the contact pads 131, 132 and / or the leads from the contact pads 131, 132 to the functional element 120.
[0059] For each of the contact pads 131, 132, contact lines 141, 142 are provided, which are to be connected to the corresponding contact pads 131, 132. The term "contact line" includes lines with various cross-sectional geometries. Flat conductors with a rectangular cross-section having a very large aspect ratio also belong to the term "contact line" in the context of the components according to the invention. Instead of providing contact lines, so-called contact line bundles can also be provided, which are composed of a plurality of fine bundled wire fibers instead of a single wire. In an alternative embodiment, two or more such contact lines or line bundles can also be connected to a single contact pad 131, 132.
[0060] The contact lines 141, 142 are composed of one or more materials from the group comprising copper, gold, nickel, platinum or are composed of an alloy containing one or more of the aforementioned elements, in particular CuNi, CuAg, NiPt, PtRth or stainless steel. Preferably, the contact lines 141, 142 are coated by electrochemical metallization. In the present embodiment, the contact line 142 is at least partially surrounded by a material having insulating properties. Typical insulating materials include polymers, ceramic compounds or metal oxides.
[0061] The contact lines 141, 142 are connected to the corresponding contact pads 131, 132 at their non-insulated end regions by means of a bonding process. The bonding process can be, for example, a welding process, a soldering process or a bonding process.
[0062] The cover 150 is then produced, covering at least the end regions of the contact pads 131, 132 and the contact lines 141, 142. The cover is created by applying a slurry to the surface of a substrate intended for mounting the cover 150. The slurry contains starting materials including a silane compound. The silane compound contains methylphenyl polysiloxane, which is synthesized by means of a sol-gel process. The sol-gel process creates a so-called "wet gel", which forms the starting material. Before the dispersion process, at least one additional material from the group including ceramics, metals and / or glass is added to the slurry containing the starting materials.
[0063] The slurry is then cured or baked. For this purpose, the component 110 is exposed to a baking temperature of at least 250 °C for at least 2 hours. This causes the liquid components of the slurry, such as solvents, to evaporate. On the other hand, the curing of the starting materials forms chemical bonds between the components of the slurry (i.e., the methylphenyl polysiloxane contained in the starting materials) and the additional materials, which ensures a high strength of the slurry in the cured state.
[0064] In addition, the starting materials are also able to form chemical bonds with the material of the substrate 110, thereby increasing the mechanical adhesion of the cover 150 to the substrate 110. Materials containing ceramics, such as corundum, ZrO2, etc., are preferably suitable for this purpose, as this promotes the formation of these bonds.
[0065] The additional materials provide or control other properties of the cover 150. For example, the addition of additional metal materials increases the thermal conductivity of the cover 150. Ceramics and glass as additional materials in the slurry significantly increase the thermal resistance of the cover (up to about 600 °C, and possibly even higher for glass).
[0066] The cover 150 manufactured in this way has high mechanical and thermal stability. Therefore, the component 110 can operate within a wide range of application temperatures. The baked or annealed cover 150 allows application temperatures above and below the baking temperature without changing the chemical structure of the cover 150.
[0067] In Figure 1 a second embodiment of an electrical or electronic component 200 proposed according to the present invention is shown. The top view shows the component 200 in a plan view, while the bottom view shows a cross-section along the longitudinal axis of the component 200.
[0068] The basic structure of the component 200 corresponds to Figure 1 the component 100 described in Figure 1The difference of the component 100 shown is that the functional element 220 is arranged in the middle of the substrate 210. The contact pads 231, 232 are located at each of the two end regions of the substrate 210. Each of the contact pads 231, 232 is connected to a corresponding contact line 241, 242. Each of the contact lines 241, 242 has an insulating portion.
[0069] Due to the special arrangement of the contact pads 231, 232, two coverings 250, 250' are required. The production of the coverings 250, 250' corresponds to Figure 1 the production of the covering 150 described in. However, before baking or curing, two sub-regions of the substrate 210 are provided with slurry.
[0070] List of reference numerals
[0071] Components 100, 200
[0072] Substrates 110, 210
[0073] Functional elements 120, 220
[0074] Contact pads 131, 132, 231, 232
[0075] Contact lines 141, 142, 241, 242
[0076] Coverings 150, 250, 250'
Claims
1. An electrical or electronic component (100, 200), comprising: - a substrate (110, 210) having a first side and a second side opposite to the first side; - at least one functional element (120, 220) mounted on the first side or the second side or another side of the substrate (110, 210); - one or more contact pads (131, 132, 231, 232) mounted on the first side of the substrate (110, 210) in a sub-region of the substrate (110, 210) for making electrical contact with the at least one functional element (120, 220); - for each contact pad (131, 132, 231, 232), at least one contact wire (141, 142, 241, 242) connected to the corresponding contact pad (131, 132, 231, 232) in an end region; and - at least one cover (150, 250, 250') covering at least one of the contact pads (131, 132, 231, 232) or a plurality of the contact pads and the corresponding end regions of one of the contact wires (141, 142, 241, 242) or a plurality of the contact wires, wherein the cover (150, 250, 250') is produced by baking a slurry containing starting materials composed of organosilane compounds produced by means of a sol-gel process and at least one additional material from the group including ceramics, metals and / or glasses.
2. The component according to claim 1, wherein, The organosilane compound contains methylphenyl polysiloxane.
3. The component according to any one of the preceding claims, wherein, The substrate (110, 210) includes a ceramic material, a metal material, a semiconductor material or a composite material.
4. The component according to any one of the preceding claims, wherein, One of the contact pads (131, 132, 231, 232) or a plurality of the contact pads are composed of a metal material, in particular platinum.
5. The component according to any one of the preceding claims, wherein, The functional element (120, 220) serves as a sensor element for detecting at least one physical measurement variable of a medium.
6. The component according to claim 5, wherein, The sensor element is used to detect the temperature, humidity, conductivity and / or flow rate of the medium.
7. The component according to any one of claims 1 to 4, wherein, The functional element (120, 220) serves as a heating element.
8. The component according to any one of claims 5 to 7, wherein, The functional element (120, 220) is composed of a resistor structure, in particular a meandering shape, or has such a resistor structure, wherein the resistor structure is composed of, in particular, platinum, nickel or an alloy containing platinum or nickel, such as PtTh or NiCr.
9. The component according to any one of claims 1 to 4, wherein, The functional element (120, 220) is used for signal processing and / or signal transmission.
10. The component according to any one of the preceding claims, wherein, One of the contact wires (141, 142, 241, 242) or a plurality of the contact wires have a circular cross-section, or wherein one of the contact wires (141, 142, 241, 242) or a plurality of the contact wires are flat strips.
11. The component according to any one of the preceding claims, wherein, One of the contact wires (141, 142, 241, 242) or a plurality of the contact wires are composed of a metal material, in particular nickel, copper, gold, stainless steel, aluminum or molybdenum, or an alloy.
12. A component according to any preceding claim, wherein One or more of the contact lines (141, 142, 241, 242) are coated with an insulating material.
13. The component according to any one of the preceding claims, wherein, The connection of each of the plurality of contact lines (141, 142, 241, 242) to the corresponding contact pad (131, 132, 231, 232) is achieved by means of a joining process, in particular a soldering process, a soldering process or a bonding process.
14. A component according to any preceding claim, wherein The component (100, 200) has at least two contact pads (131, 132, 231, 232), wherein the contact pads (131, 132, 231, 232) are arranged on a common sub-region on the first side or the second side of the substrate (110, 210), or wherein the contact pads (131, 132, 231, 232) are arranged on two separate end regions on the first side or the second side of the substrate (110, 210).
15. The component according to any one of the preceding claims, comprising a passivation layer, the passivation layer being applied to the first side and / or the second side of the substrate (110, 210) such that the passivation layer covers at least one of the functional elements (120, 220), wherein, The passivation layer consists of glass, glass-ceramics or polymers.
16. A method for producing an electrical or electronic component (100, 200), comprising: - providing a substrate (110, 210) having a first side and a second side opposite the first side, the substrate having at least one functional element (120, 220) mounted on the first side or the second side or another side of the substrate (110, 210), the substrate having a functional layer and having one or more contact pads (131, 132, 231, 232) mounted on a sub-region of the first side of the substrate (110, 210) for electrical contact with the at least one functional element (120, 220), wherein for each contact pad (131, 132, 231, 232), at least one contact line (141, 142, 241, 242) is provided, the at least one contact line being connected to the corresponding contact pad (131, 132, 231, 232) in one end region; - applying a slurry comprising starting materials composed of organosilane compounds produced by means of a sol-gel process and at least one additional material from the group comprising ceramics and / or glass, wherein the slurry covers at least one of the contact pads (131, 132, 231, 232) or a plurality of the contact pads and the corresponding end regions of one of the contact lines (141, 142, 241, 242) or a plurality of the contact lines after application; and - baking the slurry at a baking temperature for at least a predetermined baking time to produce a cover (150, 250, 250').
17. The method according to claim 16, wherein, The slurry is applied by a dispersion process.
18. The method according to claim 16 or claim 17, wherein, The baking temperature is higher than 250 °C.
19. The method according to any one of claims 16 to 18, wherein The baking time is at least 2 hours.
20. Use of an electrical or electronic component (100, 200) produced by the method according to any one of claims 16 to 19 at an operating temperature higher than the baking temperature of the slurry.
21. Use of the electrical or electronic component (100, 200) produced by the method according to any one of claims 16 to 19 at an operating temperature lower than the baking temperature of the paste.