Integrated packaging chip pin detection device

Abstract

An integrated packaging chip pin detection device relates to a chip packaging and testing technology, and comprises an upper track and a lower track which are spaced along an inclined straight line and are fixedly arranged; the swing track is used for being connected between the upper track and the lower track and rotationally arranged, and the rotating axis of the swing track is located below the swing track and parallel to the width direction of the swing track; the pin detection frame is installed on the swing track and rotates along with the swing track, a pin passing groove is formed in the pin detection frame in a penetrating mode, and the pin detection frame is used for detecting whether the chip pin bending state is normal or abnormal; the driving mechanism is mounted below the swinging track and is used for driving the swinging track to rotate; the clamping assembly is arranged at the lower end of the upper rail and is in contact fit with the upper end of the swing rail. According to the device, abnormal bending detection of the chip pins is automatically realized, and defective chips which are detected to be abnormal are effectively screened out.

Description

Technical Field

[0001] This application belongs to the technical field of chip packaging and testing, and particularly relates to an integrated packaging chip pin detection device. Background Art

[0002] After the integrated packaging chip is completed, it will undergo appearance detection and electrical detection. The appearance detection includes shell defect detection, pin bending abnormality detection, etc. To facilitate the detection of pin bending abnormalities, detection frames are generally used that match both sides of the chip. Such detection frames have passing slots that match the normal pin shape. Thus, as the chip is conveyed, chips with normal pin bending will pass through the detection frame normally, while chips with abnormal pin bending will be blocked by the detection frame. For the defective chips that are blocked, they are generally further stripped and screened. For example, in specific implementation, the blocked defective chips will be lifted from the other side to cause them to turn over out of the detection track, thereby achieving screening.

[0003] However, the products targeted by this solution need to have symmetric pins on both sides. If it is for a chip product with asymmetric pins on both sides, it may occur that when one side of the pins is passing through the detection frame but not all have passed, and the other side of the pins has an abnormality and is intercepted. At this time, the method of lifting and turning over the chip on one side will not be feasible because there are pins of the chip in the detection frame, which will cause movement interference and the chip cannot be turned over. Forcibly turning it over will cause abnormal bending damage to the pins of the chip in the detection frame. As Figure 1 shown, an SOP type packaging chip belongs to this type of chip with asymmetric pins on both sides. Since this type of chip generally integrates more than three bare chips inside to achieve more functions and has high heat dissipation requirements, in order to meet its heat dissipation performance requirements, some pins are widened and / or merged to improve the heat transfer effect. At the same time, in order to meet the convenience of installation in downstream applications, some pins are also defaulted and / or repositioned, thus forming the pin shape and layout of the chip as shown in Figure 1 shown. And as Figure 2 shown is a schematic structural diagram of an SOP type packaging chip with a warping defect formed by an abnormal pin bending. It has a warping pin on the right side, and the pin opposite to this pin on the left side is a widened pin. For the detection of such chips, it is necessary to design a new solution that can not only effectively detect whether the pin bending is normal but also effectively screen out defective chips with pin defects. Summary of the Invention

[0004] To solve the deficiencies of the above-mentioned related prior arts, this application provides an integrated packaging chip pin detection device, which realizes automatic detection of abnormal pin bending of chips and effectively screens out defective chips with detected abnormalities.

[0005] To achieve the above object, the present invention adopts the following technologies: An integrated package chip pin detection device, comprising: An upper track and a lower track which are spaced apart and fixedly arranged along an inclined straight line; A swing track which is used for connection between the upper track and the lower track and is rotatably arranged, and the rotation axis thereof is located below the swing track and parallel to the width direction of the swing track; A pin detection frame which is installed on the swing track and rotates therewith, and a pin passing slot is formed therethrough for detecting whether the bending state of the chip pins is normal or abnormal; A driving mechanism which is installed below the swing track and is used for driving the swing track to rotate; A clamping assembly which is arranged at the lower end of the upper track and is in contact and cooperation with the upper end of the swing track; Wherein, the upper track is used for conveying the chips to be detected; When the swing track rotates to be parallel to the upper track and the lower track, its upper end is connected to the upper track, and its lower end is connected to the lower track. The swing track is in the material receiving state and is used for receiving the chips to be detected from the upper track; The pin detection frame is used for detecting the pins of the chips to be detected received by the swing track; The lower track is used for receiving and conveying the normal chips detected by the pin detection frame. The normal chips refer to the chips with all the pin bending states being normal and all the pins being able to pass through the pin passing slot; When the upper end of the swing track rotates downward to be inclined downward, the swing track is in the material screening state and is used for outputting the defective chips detected and intercepted by the pin detection frame. The defective chips refer to the chips with at least one pin bending state being abnormal and some pins failing to pass through the pin passing slot; The clamping assembly is used for clamping the chips located at the lower end of the upper track under the action of the downward rotation of the upper end of the swing track, and releasing the clamping when the swing track rotates back to the material receiving state.

[0006] Furthermore, an inclined air nozzle and a proximity switch which are installed on the upper frame are arranged above the lower end of the swing track. When the swing track rotates from the material receiving state to the material screening state, the lower end of the swing track enters the detection range of the proximity switch. The proximity switch is used for sending a signal when detecting the lower end of the swing track, and the inclined air nozzle is used for jetting air to the swing track to assist in outputting the defective chips when the proximity switch sends a signal.

[0007] Further, a hanging rod parallel to its width direction is installed on the lower track, and a rotating plate is rotatably hung on the hanging rod. One side of the rotating plate is used to contact the chips received and conveyed by the lower track, so that the other side of the rotating plate turns upwards. A reflective coating is provided on the other side. Above the rotating plate, a detection component installed on the upper rack is provided. The detection component includes a transmitter and a receiver matched with it. The transmitter and the receiver are arranged at intervals along the width direction of the lower track. When the rotating plate is completely turned up, the light emitted by the transmitter is incident on the other side and reflected to the receiver through the reflective coating. The complete turn-up means that the bottom end of one side of the rotating plate rotates to contact the top surface of the chip.

[0008] Further, a contact plate protruding a predetermined distance from both sides of its upper end is installed on the upper end of the swing track, and the predetermined distance is greater than the distance that the pins of the chip protrude from the side surface of the swing track; The clamping component includes a pair of mounting brackets and a pair of clamping arms symmetrically arranged on both sides of the upper track. Rotating shafts parallel to the length direction of the upper track are provided on the mounting brackets, and the middle sections of the clamping arms are rotatably installed on the corresponding rotating shafts; A clamping block is installed on the upper section of the clamping arm, and the lower section is used to contact the contact plate. The lower section has a first contact inclined surface and a second contact inclined surface in sequence from high to low along its own height direction; The bottoms of the lower sections of the pair of clamping arms are connected by a tightening spring, and the tightening spring is always in a compressed state; When the swing track is in the material receiving state, the contact plate acts on the first contact inclined surface, and there is a distance between the clamping block and the chip at the lower end of the upper track; When the swing track rotates from the material receiving state to the material screening state, the contact plate transitions from acting on the first contact inclined surface to acting on the second contact inclined surface. The distance between the lower sections of the pair of clamping arms increases, the distance between the upper sections decreases, and the second contact inclined surface rotates to a vertical state, and the clamping block clamps the chip at the lower end of the upper track.

[0009] Further, a through rod is provided on the clamping block. The through rod slides through the two side surfaces of the upper section of the clamping arm. A return buffer spring is sleeved on the through rod between the clamping block and the inner side surface of the upper section of the clamping arm, and a limit ring is provided at the outer end of the through rod; When the return buffer spring is in a natural state, the limit ring abuts against the outer side surface of the upper section of the clamping arm, and there is a distance between the clamping block and the chip at the lower end of the upper track; A limit wall is further formed on the clamping arm, and its interval is located outside the upper section of the clamping arm; When the contact plate transitions from acting on the first contact inclined surface to acting on the second contact inclined surface: When the clamping block contacts the chip at the lower end of the upper track, the contact plate still acts on the first contact inclined surface, and there is a gap between the outer end of the through rod and the limit wall; When the contact plate acts on the second contact inclined surface, the clamping arm rotates until the second contact inclined surface is in a vertical state, and the outer end of the through rod abuts against the limit wall.

[0010] Furthermore, the bottom surface of the swing track is mounted on the swing frame, the bottom of the swing frame is connected to the swing shaft, the swing shaft is rotatably mounted on a pair of shaft seats located on the base, the first limit plate and the second limit plate are arranged at intervals on the base, one end of the swing shaft is coaxially connected with a gear, the gear meshes with a rack that is slidably fitted between the first limit plate and the second limit plate, the gear is connected with a push plate that is slidably fitted on the second limit plate, and the push plate is connected to the driving end of the pushing air cylinder.

[0011] The beneficial effects of the present invention are as follows: 1. It realizes the detection of abnormal bending of chip pins based on a pin detection frame for packaged chips with widened pins and missing pins, etc., and screens out defective chips with detection abnormalities, overcoming the problem that the existing side-top turning scheme cannot be applied to such packaged chips with asymmetric pins on both sides; 2. By rotating the swing track, the transition between the material receiving state and the material screening state is realized, so as to connect and receive the chips to be tested between the upper track and the lower track for detection. When the defective chips are intercepted by the pin detection frame, it tilts in the other direction for downward sliding screening and discharging, and at the same time, it acts on the clamping assembly to clamp the next chip to be tested at the end of the upper track. While realizing the detection and screening in the detection frame mode, the automation degree of the device is effectively improved, enabling the detection to proceed orderly; and the screening method is further optimized. By setting proximity switches and inclined air nozzles, the linkage with the material screening state is realized, and blowing is used to assist the screening and downward discharging to ensure rapid discharging; 3. After the rotating plate is lifted by the normal chips sliding down naturally, the light of the emitter of the detection component on its other side is reflected to the receiver to achieve detection response. Based on this, it can be confirmed whether there are defective chips intercepted on the swing track, so as to feedback to the driving mechanism to control the rotation timing, improving the linkage and automation degree of the device; 4. By setting the contact plate, while realizing the contact with the clamping arm to clamp or release the clamping assembly, the distance between the swing track and the clamping arm is widened, so that the defective chips during screening can slide down smoothly without collision between the pins and the clamping arm; through the setting of the through rod and the reset buffer spring, buffering can be provided when contacting the chips, and the clamping block can be reset when switching to the release state. Description of the Drawings

[0012] Figure 1 It is a three-dimensional structure diagram of a normal chip with normal pin bending to be tested.

[0013] Figure 2 It is a three-dimensional structure diagram of a defective chip with abnormal pin bending to be tested.

[0014] Figure 3 It is a three-dimensional structure diagram of the overall detection device of the embodiment of the present application.

[0015] Figure 4 is Figure 3 an enlarged view of part A in

[0016] Figure 5 a side view of the overall structure of the detection device according to an embodiment of the present application.

[0017] Figure 6 is a state diagram when a normal chip in an embodiment of the present application enters the lower track and pushes up the rotating plate and is sensed by the detection assembly.

[0018] Figure 7 is a state diagram when a defective chip in an embodiment of the present application is intercepted and the rotating plate at the lower track is not pushed up.

[0019] Figure 8 is a schematic diagram of the clamping arm structure according to an embodiment of the present application.

[0020] Figure 9 is a schematic diagram of the structure in which the clamping arm is installed on the rotating frame according to an embodiment of the present application.

[0021] Figure 10 is an end view of the positional relationship between the swinging track and the clamping assembly when the swinging track is not flipped according to an embodiment of the present application.

[0022] Figure 11 is a three-dimensional view of the positional relationship between the swinging track and the clamping assembly when the swinging track is flipped according to an embodiment of the present application.

[0023] Figure 12 is a side view of the overall structure of the detection device when the swinging track is flipped according to an embodiment of the present application.

[0024] Reference numerals: Upper track - 1; Swinging track - 2, pin detection frame - 20, swinging frame - 21, contact plate - 22; Lower track - 3, avoidance groove - 30; Driving mechanism - 4, swinging shaft - 41, shaft seat - 42, first limiting plate - 43, base - 44, rack - 45, gear - 46, second limiting plate - 47, push plate - 48, pushing cylinder - 49; Clamping assembly - 5, rotating hole - 50, clamping arm - 51, mounting frame - 52, first contact inclined surface - 53, second contact inclined surface - 54, clamping block - 55, through rod - 56, reset buffer spring - 57, limiting ring - 58, limiting wall - 59, tightening spring - 510, limiting block - 511, rotating shaft - 521, limiting rod - 522; Inclined air nozzle - 6, upper frame - 60, proximity switch - 61; Rotating plate - 7, hanging rod - 71, U - shaped frame - 72, transmitter - 73, receiver - 74. Detailed implementation manners

[0025] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the embodiments of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0026] The embodiment of the present application provides an integrated package chip pin detection device, such as Figure 3 、 Figure 5 As shown, it includes an upper track 1, a swing track 2, a lower track 3, a driving mechanism 4, a clamping assembly 5, etc., which are used to detect Figure 1 Is there any abnormal pin bending in the chip shown? Figure 2 As shown, the chip has a lifted pin on the right side.

[0027] Specifically, the upper track 1 and the lower track 3 are spaced and fixedly arranged along an inclined straight line, and are used to transport chips along the inclined straight line. Specifically, the chips can slide freely on the upper track 1 and the lower track 3.

[0028] The swing track 2 connects the upper track 1 and the lower track 3 and is rotatable, with its axis of rotation located below and parallel to its width. A drive mechanism 4 is mounted below the swing track 2 and is used to drive its rotation. A pin detection frame 20 is mounted on the swing track 2 and rotates with it. Pin detection frame 20 is formed with pin slots for detecting whether the chip pins are bent normally or abnormally.

[0029] The clamping assembly 5 is arranged at the lower end of the upper track 1 and contacts and cooperates with the upper end of the swing track 2. It is used to clamp or release the last chip at the lower end of the upper track 1 that is about to enter the swing track 2 when the upper end of the swing track 2 is at different heights.

[0030] Among them, the upper track 1 is used to transport the chip to be tested; when the swing track 2 rotates to be parallel to the upper track 1 and the lower track 3, the upper end of the swing track 2 is connected with the lower end of the upper track 1, and the lower end of the swing track 2 is connected with the upper end of the lower track 3, and the three form an integral track in the same inclined straight line. At this time, the swing track 2 is in a material receiving state and is used to receive the chip to be tested from the upper track 1. In order to facilitate the swing track 2 to rotate and interfere with the upper track 1 and the lower track 3, the upper end face of the swing track 2 is designed to be an upward-slanted inclined surface or arc surface, and the lower end face is designed to be a downward-slanted inclined surface or arc surface. The lower end face of the upper track 1 is designed to be a downward-slanted inclined surface or arc surface that matches the upper end face of the swing track 2, and the upper end face of the lower track 3 is designed to be an upward-slanted inclined surface or arc surface that matches the lower end face of the swing track 2. This not only avoids interference with rotation, but also limits excessive reset during rotation reset to maintain the formation of an integral track during reset.

[0031] The pin detection frame 20 is used to detect the pins of the chip to be tested carried by the swing track 2. The lower track 3 is used to receive and convey the normal chips detected by the pin detection frame 20. A normal chip means that the bending states of all pins are normal and all pins can pass through the pin passing slots of the pin detection frame 20. If a chip fails to pass through the pin detection frame 20, it means the chip is a defective chip, and at least one of its pins has an abnormal bending state. When no chip enters the lower track 3 for a period of time, it means that the defective chip is intercepted at the pin detection frame 20 of the swing track 2. When the upper end of the swing track 2 rotates downward to be inclined downward, the swing track 2 is in the screening state, which is used to output the defective chips detected and intercepted by the pin detection frame 20, that is, to change the inclination state of the swing track 2 to be inclined in the other direction, so as to slide the intercepted defective chips downward in the opposite direction for output, as Figure 11 、 Figure 12 shown.

[0032] The clamping assembly 5 will clamp the chip at the lower end of the upper track 1 under the action of the downward rotation of the upper end of the swing track 2, so as to prevent the next chip to be tested from entering the swing track 2, realizing the "pause" of the subsequent chips conveyed on the upper track 1; when the swing track 2 rotates and resets to the chip receiving state, the clamping assembly 5 releases the clamping to start "releasing" the subsequent chips.

[0033] As a preferred method, in order to ensure that after the swing track 2 changes to the screening state, the defective chips slide downward along the reversely inclined swing track 2 more smoothly for output to achieve screening, as Figure 3 、 Figure 5 、 Figure 12 shown, an inclined air nozzle 6 and a proximity switch 61 installed on the upper frame 60 are provided above the lower end of the swing track 2. When the swing track 2 rotates from the chip receiving state to the screening state, the lower end of the swing track 2 enters the detection range of the proximity switch 61. The proximity switch 61 is used to send a signal when detecting the lower end of the swing track 2. The inclined air nozzle 6 is used to blow air to the swing track 2 when the proximity switch 61 sends a signal to assist the output of the defective chips. The proximity switch 61 converts the change of the swing track 2 to the screening state into a signal to trigger the inclined air nozzle 6 to blow air, realizing the auxiliary blowing when the swing track 2 is in the screening state for outputting defective chips, which is beneficial to the smoother output of the defective chips through the blowing action.

[0034] As another preferred method, in order to control the timing of the driving mechanism 4 driving the swing track 2 to rotate, the lower track 3 is detected whether it can smoothly receive and convey chips, so as to improve the degree of automatic connection of the control of the driving mechanism 4. Specifically, as Figure 6 and Figure 7As shown in the figure, a hanging rod 71 parallel to the width direction of the lower track 3 is installed on the lower track 3. A rotating plate 7 is rotatably hung on the hanging rod 71. One side of the rotating plate 7 is used to contact the chips received and conveyed by the lower track 3, so that the other side of the rotating plate 7 turns upwards; above the rotating plate 7, a detection component installed on the upper frame 60 is provided. The detection component is an optoelectronic transceiver component, including a transmitter 73 and a receiver 74 matching with it. The transmitter 73 and the receiver 74 are arranged at intervals along the width direction of the lower track 3. The transmitter 73 is used to emit detection light, and the receiver 74 is used to receive the reflected detection light. As Figure 6 shown in the figure, when the rotating plate 7 is completely turned up, it means that the bottom end of one side of the rotating plate 7 rotates to contact the top surface of the chip, that is, there is a chip passing on the surface of the lower track 3. The passing chip jacks up the rotating plate 7 from the natural state to the turned-up state. Preferably, when the rotating plate 7 is completely turned up, the other side of the rotating plate 7 is horizontal, so as to better match the optical path of the detection component; preferably, a reflective coating is provided on the other side to facilitate better reflection of the detection light; in this state, the light emitted by the transmitter 73 is incident on the other side and reflected to the receiver 74 through the reflective coating. If after every predetermined time interval, the receiver 74 can continuously receive the reflected light for a short time, it means that a normal chip is received and conveyed on the lower track 3 every predetermined time interval to jack up the rotating plate 7, and the short time when the receiver 74 receives the reflected light each time is the time when the chip jacks up the rotating plate 7 when passing through; if the interval is greater than the predetermined time and the receiver 74 still does not receive the reflected light, it means that a defective chip is intercepted by the pin detection frame 20 of the swing track 2, as Figure 7 shown in the figure. Therefore, no normal chip enters the lower track 3 to act on the rotating plate 7, and this can be used as a signal to start the driving mechanism 4 to rotate the swing track 2 for screening preparation.

[0035] On the basis of the preferred method, in order to facilitate the smooth rotation of the rotating plate 7, an avoidance groove 30 is opened on the lower track 3 for avoiding the rotation of the rotating plate 7. If the lowest end of the rotating plate 7 is lower than the bottom surface of the lower track 3 when the rotating plate 7 is in the natural state, it can be avoided through the avoidance groove 30. Here, for the convenience of implementation, the rotating plate 7 can be limited to the middle of the hanging rod 71, and at the same time, the hanging rod 71 can be installed on the lower track 3 through a U-shaped frame 72. When installed, the hanging rod 71 is set at a predetermined height above the top surface of the chips on the lower track 3. Specifically, it should be based on the fact that when the chip passes through, it can act on one side of the rotating plate 7 and jack it up to the completely turned-up state, and the other side is horizontal when completely turned up.

[0036] As a specific implementation manner of the clamping component 5 and the contact manner between the swing track 2 and the clamping component 5 in this embodiment, as Figures 8 - 11As shown, a contact plate 22 protruding a predetermined distance from both sides thereof is installed at the upper end of the swing track 2. The clamping assembly 5 includes a pair of mounting brackets 52 and a pair of clamping arms 51 symmetrically arranged on both sides of the upper track 1. Rotating shafts 521 parallel to the length direction of the upper track 1 are provided on the mounting brackets 52. A rotating hole 50 is provided in the middle section of the clamping arm 51. The clamping arm 51 is rotatably installed on the corresponding rotating shaft 521 through the rotating hole 50. A clamping block 55 is installed on the upper section of the clamping arm 51, and the lower section is used to contact the contact plate 22. The lower section has a first contact inclined surface 53 and a second contact inclined surface 54 in sequence from high to low along its own height direction. The bottoms of the lower sections of the pair of clamping arms 51 are connected by a tightening spring 510, and the tightening spring 510 is always in a compressed state.

[0037] When the swing track 2 is in the state of receiving materials, the contact plate 22 acts on the first contact inclined surface 53, and there is a distance between the clamping block 55 and the chip at the lower end of the upper track 1, as Figure 10 shown. At this time, the clamping assembly 5 is in the "release" state; when the swing track 2 rotates from the state of receiving materials to the state of screening materials, as Figure 11 shown, the contact plate 22 transitions from acting on the first contact inclined surface 53 to acting on the second contact inclined surface 54. The distance between the lower sections of the pair of clamping arms 51 increases, the distance between the upper sections decreases, and the second contact inclined surface 54 rotates to a vertical state, and the clamping block 55 clamps the chip at the lower end of the upper track 1.

[0038] In order to prevent the pins from interfering with the clamping arms 51 of the clamping assembly 5 when the defective chips slide down and affecting the conveying, the predetermined distance is set to be greater than the distance that the pins of the chips protrude from the side surface of the swing track 2, so as to provide space for the defective chips to slide down and be screened out.

[0039] More specifically, a through rod 56 is provided on the clamping block 55. The through rod 56 is slidably arranged through the side surfaces of the upper sections of the clamping arms 51. A return buffer spring 57 located between the clamping block 55 and the inner side surface of the upper section of the clamping arm 51 is sleeved on the through rod 56. A limit ring 58 is provided at the outer end of the through rod 56. When the return buffer spring 57 is in a natural state, the limit ring 58 abuts against the outer side surface of the upper section of the clamping arm 51, and there is a distance between the clamping block 55 and the chip at the lower end of the upper track 1.

[0040] A limiting wall 59 is further formed on the clamping arm 51, and it is spaced outside the upper section of the clamping arm 51; when the contact plate 22 transitions from acting on the first contact inclined surface 53 to acting on the second contact inclined surface 54: when the clamping block 55 contacts the chip at the lower end of the upper track 1, the contact plate 22 still acts on the first contact inclined surface 53, and there is a gap between the outer end of the through rod 56 and the limiting wall 59, and this is the preliminary clamping at this time; when the contact plate 22 acts on the second contact inclined surface 54, the clamping arm 51 rotates until the second contact inclined surface 54 is in a vertical state, and the outer end of the through rod 56 abuts against the limiting wall 59 to achieve the fully clamped state. The reset buffer spring 57 not only provides the initial buffering effect but also provides the reset effect on the clamping block 55 when releasing the clamping subsequently. Here, since the upper section of the clamping arm 51 converges towards the middle in a curved movement rather than approaching along a straight line, in order to ensure the normal movement of the through rod 56 on the clamping arm 51, the hole in the upper section of the clamping arm 51 through which the through rod 56 passes can be set as an oval hole to provide an angular swing space for movement, ensuring that after the clamping block 55 contacts the chip and the clamping arm 51 continues to converge, the through rod 56 can move relative to the clamping arm 51 and finally abut against the limiting wall 59. Of course, the size of the limiting ring 58 is such that it cannot pass through the oval hole to achieve the limiting effect.

[0041] Although the continuous action of the contact plate 22 and the clamping arm 51 can prevent the upper section of the clamping arm 51 from rotating outward excessively due to the action of the tightening spring 510, in order to further strengthen this protection, a limiting rod 522 can also be provided on the mounting bracket 52, specifically arranged outside the limiting wall 59. When the swinging track 2 is in the material receiving state and the clamping assembly 5 returns to the "release" state, the limiting rod 522 contacts and cooperates with the outer side surface of the limiting wall 59.

[0042] Specifically, as Figures 8 - 10 shown, the first contact inclined surface 53 is set to be short enough, but it should be satisfied that when the clamping block 55 contacts the chip at the lower end of the upper track 1, the contact plate 22 still acts on the first contact inclined surface 53, and the through rod 56 starts to move relative to the upper section of the clamping arm 51. At the same time, it should also be satisfied that it can quickly transition to the second contact inclined surface 54 to achieve the fully clamped state, and during this process, the contact plate 22 only rotates a little angle. Before the swinging track 2 reaches the reverse inclined state, it still needs to rotate more angles. In order to avoid excessive clamping force caused by continued rotation, at this time, the second contact inclined surface 54 has turned into a vertical state, and the second contact inclined surface 54 is set to be long enough, so that when the contact plate 22 continues to rotate with the swinging track 2 and acts on the second contact inclined surface 54, it will not make the upper section of the clamping arm 51 converge further towards the middle, avoiding excessive clamping.

[0043] On this basis, preferably, as Figure 11As shown, a limit block 511 is provided at the bottom end of the second contact inclined surface 54, which is used to abut against the contact plate 22 to limit the downward rotation angle of the upper end of the swing track 2. Of course, the rotation amplitude of the swing track 2 can be controlled by setting the driving mechanism 4. After adding the limit block 511, the limit guarantee can be further provided.

[0044] As Figure 4 , Figure 5 shown, the bottom surface of the swing track 2 is mounted on the swing frame 21. The driving mechanism 4 includes a swing shaft 41, a gear 46, a rack 45, a pushing air cylinder 49, etc. The bottom of the swing frame 21 is connected to the swing shaft 41. The swing shaft 41 is rotatably mounted on a pair of shaft seats 42 located on the base 44. A first limit plate 43 and a second limit plate 47 are arranged at intervals on the base 44. One end of the swing shaft 41 is coaxially connected to the gear 46. The gear 46 meshes with the rack 45 slidably fitted between the first limit plate 43 and the second limit plate 47. The gear 46 is connected with a push plate 48 slidably fitted on the second limit plate 47. The push plate 48 is connected to the driving end of the pushing air cylinder 49. By extending and retracting the driving end of the pushing air cylinder 49, the movement of the rack 45 along the limit area between the first limit plate 43 and the second limit plate 47 is realized, which acts on the meshing gear 46 to rotate, drives the swing shaft 41 to rotate, and thus drives the swing frame 21 and the swing track 2 to rotate. By reasonably setting the stroke of the pushing air cylinder 49, the rotation of the swing track 2 to the material receiving state and the screening state can be better matched.

[0045] In this embodiment, the pin detection frame 20 is arranged perpendicular to the bearing surface of the swing track 2. Specifically, the length of the swing track 2 and the installation position of the pin detection frame 20 on the swing track 2 are set according to the following relationship: when the front side of the frontmost pin of the chip received by the swing track 2 is flush with the upper side of the pin detection frame 20, the bottom edge of the rear end of the chip is flush with the top edge of the upper end face of the swing track 2; and when the front side of the rearmost pin of the chip received by the swing track 2 is flush with the upper side of the pin detection frame 20, the bottom edge of the rear end of the chip covers the top edge of the lower end face of the swing track 2, and the distance from the top edge of the lower end face of the swing track 2 is greater than or equal to 0 and less than or equal to half of the length of the chip itself. That is to say, if the frontmost pin of the chip to be tested has been intercepted by the pin detection frame 20, at this time, when the swing track 2 rotates, it should not affect the intercepted chip to be carried and rotated together. The rear end of the intercepted chip should have just completely entered the bearing track 2, but the distance between the pin detection frame 20 and the upper end of the swing track 2 should not be set too long, which will cause that if the rearmost pin of the chip to be tested is intercepted by the pin detection frame 20, the next chip to be tested has already entered the swing track 2 too much or even completely, affecting the screening; at the same time, if the rearmost pin of the chip to be tested is intercepted by the pin detection frame 20, the lower end of the swing track 2 should at least carry the chip to a position of half of the chip length at this time, so that when the swing track 2 rotates, the chip can be carried and rotated together by the swing track 2 to avoid failure of the accompanying rotation or other uncontrollable chip postures, but the distance between the pin detection frame 20 and the lower end of the swing track 2 should not be set too long to avoid affecting the operation rhythm of the device and also avoid affecting the space above the lower end of the swing track 2 and affecting the setting of the inclined air nozzle 6, etc.

[0046] The above are only the preferred embodiments of the present application and are not used to limit the present application. Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application.

Claims

1. An integrated package chip pin detection device, characterized in that, Comprising: An upper track (1) and a lower track (3) which are spaced apart along an inclined straight line and fixedly arranged; A swing track (2) for connecting and rotatably arranged between the upper track (1) and the lower track (3), the rotation axis of which is located below the swing track (2) and parallel to the width direction of the swing track (2); A pin detection frame (20) installed on the swing track (2) and rotating therewith, and a pin passing slot is formed therethrough; A driving mechanism (4) installed below the swing track (2) and used to drive the swing track (2) to rotate; A clamping assembly (5) provided at the lower end of the upper track (1) and in contact and cooperation with the upper end of the swing track (2); Among them, the upper track (1) is used to convey the chips to be tested; When the swing track (2) rotates to be parallel to the upper track (1) and the lower track (3), the swing track (2) is in the material receiving state and is used to receive the chips to be tested from the upper track (1); The pin detection frame (20) is used to detect the pins of the chips to be tested received by the swing track (2); The lower track (3) is used to receive and convey the normal chips detected by the pin detection frame (20); When the upper end of the swing track (2) rotates downward to be inclined downward, the swing track (2) is in the material screening state and is used to output the defective chips detected and intercepted by the pin detection frame (20); The clamping assembly (5) is used to clamp the chips located at the lower end of the upper track (1) under the action of the downward rotation of the upper end of the swing track (2), and release the clamping when the swing track (2) rotates back to the material receiving state.

2. The integrated package chip pin detection device according to claim 1, characterized in that Above the lower end of the swing track (2), an inclined air nozzle (6) and a proximity switch (61) installed on the upper frame (60) are provided. When the swing track (2) rotates from the material receiving state to the material screening state, the lower end of the swing track (2) enters the detection range of the proximity switch (61). The proximity switch (61) is used to send a signal when detecting the lower end of the swing track (2), and the inclined air nozzle (6) is used to jet air to the swing track (2) to assist the output of the defective chips when the proximity switch (61) sends a signal.

3. The integrated package chip pin detection device according to claim 1, characterized in that, On the upper frame of the lower track (3), a hanging rod (71) parallel to its width direction is provided. A rotating plate (7) is rotatably hung on the hanging rod (71). One side thereof is used to contact the chips received and conveyed by the lower track (3) so that the other side of the rotating plate (7) turns up. Above the rotating plate (7), a detection assembly installed on the upper frame (60) is provided. The detection assembly includes a transmitter (73) and a receiver (74) matching therewith. When the rotating plate (7) turns up completely, the light emitted by the transmitter (73) is incident on the other side and reflected to the receiver (74). The complete turning up means that the bottom end of one side of the rotating plate (7) rotates to contact the top surface of the chip.

4. The integrated package chip pin detection device according to claim 1, characterized in that, A contact plate (22) protruding a predetermined distance from both sides thereof is installed at the upper end of the swing track (2), and the predetermined distance is greater than the distance that the pins of the chip protrude from the side surface of the swing track (2); The clamping assembly (5) includes a pair of mounting brackets (52) and a pair of clamping arms (51) symmetrically arranged on both sides of the upper track (1). Rotating shafts (521) parallel to the length direction of the upper guide rail (1) are provided on the mounting brackets (52), and the middle sections of the clamping arms (51) are rotatably mounted on the corresponding rotating shafts (521); A clamping block (55) is mounted on the upper section of the clamping arm (51), and the lower section is used to contact the contact plate (22). The lower section has a first contact inclined surface (53) and a second contact inclined surface (54) in sequence from high to low along its own height direction; The bottoms of the lower sections of the pair of clamping arms (51) are connected by a tightening spring (510), and the tightening spring (510) is always in a compressed state; When the swing track (2) is in the state of receiving materials, the contact plate (22) acts on the first contact inclined surface (53), and there is a distance between the clamping block (55) and the chip at the lower end of the upper track (1); When the swing track (2) rotates from the state of receiving materials to the state of screening materials, the contact plate (22) transitions from acting on the first contact inclined surface (53) to acting on the second contact inclined surface (54). The distance between the lower sections of the pair of clamping arms (51) increases, the distance between the upper sections decreases, and the second contact inclined surface (54) rotates to a vertical state, and the clamping block (55) clamps the chip at the lower end of the upper track (1).

5. The integrated package chip pin detection device according to claim 4, characterized in that, A through rod (56) is provided on the clamping block (55). The through rod (56) slidably passes through the two side surfaces of the upper section of the clamping arm (51). A return buffer spring (57) is sleeved on the through rod (56) between the clamping block (55) and the inner side surface of the upper section of the clamping arm (51). A limit ring (58) is provided at the outer end of the through rod (56); When the return buffer spring (57) is in a natural state, the limit ring (58) abuts against the outer side surface of the upper section of the clamping arm (51), and there is a distance between the clamping block (55) and the chip at the lower end of the upper track (1); A limit wall (59) is further formed on the clamping arm (51), and it is spaced on the outer side of the upper section of the clamping arm (51); When the contact plate (22) transitions from acting on the first contact inclined surface (53) to acting on the second contact inclined surface (54): When the clamping block (55) contacts the chip at the lower end of the upper track (1), the contact plate (22) still acts on the first contact inclined surface (53), and there is a gap between the outer end of the through rod (56) and the limit wall (59); When the contact plate (22) acts on the second contact inclined surface (54), the clamping arm (51) rotates until the second contact inclined surface (54) is in a vertical state, and the outer end of the through rod (56) abuts against the limit wall (59).

6. The integrated package chip pin detection device according to claim 4, wherein, A limit block (511) is provided at the bottom end of the second contact inclined surface (54) for abutting against the contact plate (22) to limit the downward rotation angle of the upper end of the swing track (2).

7. The integrated package chip pin detection device according to claim 1, characterized in that, The upper end end face of the swing track (2) is an inclined or arc-shaped surface inclined upward, the lower end end face is an inclined or arc-shaped surface inclined downward, the lower end end face of the upper track (1) is an inclined or arc-shaped surface inclined downward and matching the upper end end face of the swing track (2), and the upper end end face of the lower track (3) is an inclined or arc-shaped surface inclined upward and matching the lower end end face of the swing track (2).

8. The integrated package chip pin detection device according to claim 1, characterized in that, The bottom surface of the swinging track (2) is mounted on the swinging frame (21). The driving mechanism (4) includes a swinging shaft (41) connected to the bottom of the swinging frame (21). The swinging shaft (41) is rotatably mounted on a pair of shaft seats (42) located on the base (44). A first limiting plate (43) and a second limiting plate (47) are arranged at intervals on the base (44). One end of the swinging shaft (41) is coaxially connected with a gear (46). The gear (46) meshes with a rack (45) slidably fitted between the first limiting plate (43) and the second limiting plate (47). The gear (46) is connected with a push plate (48) slidably fitted on the second limiting plate (47). The push plate (48) is connected to the driving end of a pushing cylinder (49).

9. The integrated package chip pin detection device according to claim 3, wherein, When the rotating plate (7) is fully rotated upwards, the other side of the rotating plate (7) is horizontal.

10. The integrated package chip pin detection device according to claim 1, characterized in that The pin detection frame (20) is arranged perpendicular to the bearing surface of the swinging track (2); The length of the swinging track (2) and the setting of the installation position of the pin detection frame (20) on the swinging track (2) are based on the following relationship: When the front side of the frontmost pin of the chip received by the swinging track (2) is flush with the upper side of the pin detection frame (20), the bottom edge of the rear end of the chip is flush with the top edge of the upper end face of the swinging track (2); And when the front side of the rearmost pin of the chip received by the swinging track (2) is flush with the upper side of the pin detection frame (20), the bottom edge of the rear end of the chip covers the top edge of the lower end face of the swinging track (2), and the distance from the top edge of the lower end face of the swinging track (2) is greater than or equal to 0 and less than or equal to half of the length of the chip itself.

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