Gold plate cleaning method

Abstract

The invention discloses a gold plate cleaning method. The gold plate cleaning method comprises the following steps of plate feeding; washing with citric acid; pressurizing and washing I; cleaning with deionized water; pressurized hot water washing; pressurizing and washing for the second time; performing ultrasonic immersion cleaning; high-pressure washing; pressurizing and washing III; combining the dry plates; drying with hot air; cooling is performed; and discharging the plate. According to the gold plate cleaning method provided by the embodiment of the invention, the gold plate can be effectively cleaned.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board production, and particularly relates to a method for cleaning a gold board. Background Art

[0002] At present, due to its good soldering performance, PCB gold boards are widely used in the production of PCBs. However, during the production and processing of gold boards, if there is water, fingerprints, or other foreign substances adhered to the gold surface, or if it is slightly oxidized after being exposed to air for a long time, it will affect the soldering performance of the gold board subsequently. Therefore, it is necessary to clean it to remove foreign substances on the gold surface, but the cleaning effect of the existing technology is not good. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a method for cleaning a gold board, which can effectively clean the gold board.

[0004] A method for cleaning a gold board according to the present invention includes the following steps: S1: Loading the board, feeding the gold board into the cleaning equipment; S2: Citric acid cleaning, using citric acid to clean the gold board, with the water pressure controlled at 1 - 1.5 kgf / cm 2 ; S3: First pressurized water washing, performing the first pressurized water washing on the gold board, with the water pressure controlled at 1.5 - 2.3 kgf / cm 2 ; S4: Deionized water cleaning, using deionized cleaning agent to clean the gold board, with the water pressure controlled at 1 - 1.7 kgf / cm 2 ; S5: Pressurized hot water washing, performing pressurized hot water washing on the gold board, with the water pressure controlled at 1.5 - 2.3 kgf / cm 2 ; S6: Second pressurized water washing, performing the second pressurized water washing on the gold board, with the water pressure controlled at 1.5 - 2.3 kgf / cm 2 ; S7: Ultrasonic immersion cleaning, performing ultrasonic immersion cleaning on the gold board; S8: High-pressure water washing, performing high-pressure water washing on the gold board, with the water pressure controlled at 10 - 12 kgf / cm 2 ; S9: Third pressurized water washing, performing the third pressurized water washing on the gold board, with the water pressure controlled at 1.5 - 2.3 kgf / cm 2 ; S10: Dry board combination, performing drying treatment and temperature control on the gold board; S11: Hot air drying, using a hot air gun to dry the gold plate; S12: Cooling, cooling the gold plate; S13: Plate output, outputting the gold plate from the cleaning equipment.

[0005] The gold plate cleaning method according to the above embodiments of the present invention has at least the following beneficial effects: The gold plate cleaning method provided by the embodiments of the present invention effectively removes oxides and mild contaminants on the surface of the gold plate by using citric acid washing. Through subsequent cleaning methods including multiple pressurized water washes and deionized water cleaning, the gold plate is deeply cleaned from different angles, effectively removing various types of contaminants, further ensuring the thorough removal of contaminants, and guaranteeing the cleanliness of the gold surface. By precisely controlling the water pressure at different cleaning stages, not only the cleaning efficiency is improved, but also the potential damage to the gold plate is reduced, ensuring the safety and effectiveness of the cleaning process. Through steps such as dry plate combination, hot air drying, and cooling treatment, it is ensured that the cleaned gold plate can be quickly and completely dried, avoiding secondary pollution or corrosion problems caused by residual moisture, and at the same time providing good conditions for subsequent processing, ensuring the soldering performance of the gold plate.

[0006] According to some embodiments of the present invention, in the step S2, the treatment time of the citric acid washing is controlled at 24 s.

[0007] According to some embodiments of the present invention, in the step S2, the working temperature of the citric acid washing is controlled at 20 - 40 °C.

[0008] According to some embodiments of the present invention, in the step S2, the concentration of the citric acid is controlled at 4 - 6%.

[0009] According to some embodiments of the present invention, in the step S4, the treatment time of the deionized water cleaning is controlled at 23 s.

[0010] According to some embodiments of the present invention, in the step S4, the working temperature of the deionized water cleaning is controlled at 55 - 65 °C.

[0011] According to some embodiments of the present invention, in the step S4, the aqueous solution concentration of the deionized water cleaning agent is controlled at 10 - 15%.

[0012] According to some embodiments of the present invention, in the step S5, the working temperature of the pressurized hot water wash is controlled at 45 °C.

[0013] According to some embodiments of the present invention, the step S13 further includes performing an anti-static treatment on the output gold plate.

[0014] According to some embodiments of the present invention, the working speed of the gold plate is controlled at 5 m / min, and the spacing between two adjacent gold plates is controlled at 50 mm.

[0015] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below in conjunction with the drawings and embodiments, where: Figure 1 It is a flowchart of the gold plate cleaning method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0018] In the description of the present invention, it should be understood that with respect to the orientation description, such as the orientation or positional relationship indicated by up, down, front, back, left, right, etc., is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

[0019] In the description of the present invention, several means one or more, and multiple means two or more. Understanding of greater than, less than, exceeding, etc. does not include the recited number, and understanding of above, below, within, etc. includes the recited number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0020] In the description of the present invention, unless otherwise clearly defined, terms such as "setting", "installation", "connection", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution. In the description of the present invention, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0021] Referring to Figure 1 , a gold plate cleaning method proposed according to the present invention includes the following steps: S1: Loading the plate, feeding the gold plate into the cleaning equipment; S2: Citric acid washing, using citric acid to wash the gold plate to remove the slight oxides and slight stains on the gold surface of the gold plate, and the water pressure is controlled at 1 - 1.5 kgf / cm2; S3: First pressurized water washing, performing the first pressurized water washing on the gold plate to wash the residual citric acid and foreign matters on the surface of the gold plate, and the water pressure is controlled at 1.5 - 2.3 kgf / cm2; S4: Deionized water cleaning, using deionized cleaning agent to wash the gold plate to wash the ions on the gold plate and avoid the ion contamination exceeding the standard, and the water pressure is controlled at 1 - 1.7 kgf / cm2; S5: Pressurized hot water washing, performing pressurized hot water washing on the gold plate to wash the residual liquid medicine and foreign matters on the surface of the gold plate, and the water pressure is controlled at 1.5 - 2.3 kgf / cm2; S6: Second pressurized water washing, performing the second pressurized water washing on the gold plate to wash the residual liquid medicine and foreign matters on the surface of the gold plate, and the water pressure is controlled at 1.5 - 2.3 kgf / cm2; S7: Ultrasonic immersion washing, using ultrasonic immersion washing on the gold plate to wash the residual liquid medicine and foreign matters in the holes of the gold plate; S8: High-pressure water washing. Perform high-pressure water washing on the gold plate to further powerfully clean the residual liquid medicine and foreign matters on the surface of the gold plate. The water pressure is controlled at 10 - 12 kgf / cm2. S9: Third pressurized water washing. Perform the third pressurized water washing on the gold plate to further clean the residual liquid medicine and foreign matters on the surface of the gold plate. The water pressure is controlled at 1.5 - 2.3 kgf / cm2. S10: Dry plate combination. Perform drying treatment and temperature control on the gold plate. S11: Hot air drying. Use a hot air gun to perform drying treatment on the gold plate. S12: Cooling. Perform cooling treatment on the gold plate. S13: Plate output. Output the gold plate from the cleaning equipment.

[0022] It can be understood that the gold plate cleaning method provided by the embodiments of the present invention effectively removes oxides and mild contaminants on the surface of the gold plate by using citric acid washing. Through subsequent cleaning methods including multiple pressurized water washings and deionized water washing, etc., the gold plate is deeply cleaned from different angles, effectively removing various types of contaminants, further ensuring the thorough removal of contaminants, and guaranteeing the cleanliness of the gold surface. By precisely controlling the water pressure at different cleaning stages, not only the cleaning efficiency is improved, but also the potential damage to the gold plate is reduced, ensuring the safety and effectiveness of the cleaning process. Through steps such as dry plate combination, hot air drying, and cooling treatment, it is ensured that the cleaned gold plate can be quickly and completely dried, avoiding problems of secondary pollution or corrosion caused by residual moisture, and at the same time providing good conditions for subsequent processing, ensuring the soldering performance of the gold plate.

[0023] Preferably, according to some embodiments of the present invention, in step S2, the treatment time of citric acid washing is controlled at 24 s, so as to ensure that the cleaning time is long enough to effectively remove oxides and mild contaminants on the surface of the gold plate, while avoiding damage to the gold surface or waste of cleaning agent due to too long time. On the other hand, through precise time control, the consistency and repeatability of the cleaning process are improved, ensuring that the cleaning quality of each gold plate is the same.

[0024] Preferably, according to some embodiments of the present invention, in step S2, the working temperature of citric acid washing is controlled at 20 - 40 °C. It can be understood that through experiments, the inventors have learned that a moderate temperature range can not only promote the reaction rate between citric acid and contaminants, but also will not cause damage to the surface of the gold plate or the cleaning equipment due to too high temperature. On the other hand, the operating conditions within this temperature range are mild and stable, suitable for large-scale production environments, reducing equipment maintenance costs and energy consumption.

[0025] Preferably, in an embodiment of the present invention, the working temperature of citric acid washing is 26 °C.

[0026] Preferably, in an embodiment of the present invention, the working temperature of the citric acid cleaning is 32 °C.

[0027] Preferably, according to some embodiments of the present invention, in step S2, the concentration of citric acid is controlled at 4-6%. It can be understood that through experiments, the inventors have learned that citric acid at the above concentration can effectively dissolve the oxides and other contaminants on the surface of the gold plate, while avoiding corrosion of the gold surface or waste of the cleaning agent caused by too high a concentration. While ensuring the cleaning effect, the usage amount of chemicals is reduced, meeting the requirements of environmental protection and economy.

[0028] Preferably, in an embodiment of the present invention, the concentration of citric acid is 4.8%.

[0029] Preferably, in an embodiment of the present invention, the concentration of citric acid is 5.6%.

[0030] Preferably, according to some embodiments of the present invention, in step S4, the treatment time of the deionized water cleaning is controlled at 23 s, so as to ensure that the deionized water cleaning agent has enough time to dissolve and remove the residues on the surface of the gold plate, while avoiding a reduction in cleaning efficiency or waste of resources caused by too long a time. On the other hand, through precise time control, the stability and consistency of the cleaning process are further improved.

[0031] Preferably, according to some embodiments of the present invention, in step S4, the working temperature of the deionized water cleaning is controlled at 55-65 °C. It can be understood that through experiments, the inventors have learned that the above temperature range can accelerate the dissolution ability of the deionized water cleaning agent, so as to more effectively remove the stubborn contaminants on the surface of the gold plate, which can not only improve the cleaning effect, but also cause no thermal damage to the surface of the gold plate or the cleaning equipment.

[0032] Preferably, in an embodiment of the present invention, the working temperature of the deionized water cleaning is 57 °C.

[0033] Preferably, in an embodiment of the present invention, the working temperature of the deionized water cleaning is 62 °C.

[0034] Preferably, according to some embodiments of the present invention, in step S4, the aqueous solution concentration of the deionized water cleaning agent is controlled at 10-15%. It can be understood that through experiments, the inventors have learned that the deionized water cleaning agent at the above concentration can avoid unnecessary chemical waste while ensuring the cleaning effect. By reasonably controlling the concentration, the potential corrosion risk of the cleaning agent to the surface of the gold plate is reduced, and the difficulty of wastewater treatment is also reduced.

[0035] Preferably, in an embodiment of the present invention, the aqueous solution concentration of the deionized water cleaning agent is 12%.

[0036] Preferably, in an embodiment of the present invention, the aqueous solution concentration of the deionized water cleaning agent is 14%.

[0037] Preferably, according to some embodiments of the present invention, in step S5, the working temperature of the pressurized hot water wash is controlled at 45°C. It can be understood that through experiments, the inventor found that hot water at this temperature can effectively dissolve the oil-based pollutants on the surface of the gold plate, while maintaining low energy consumption and operational safety. It avoids the risk of deformation or other thermal damage to the gold plate caused by excessive temperature, ensuring the stability of the cleaning process.

[0038] Preferably, according to some embodiments of the present invention, in step S7, the frequency of the ultrasonic wave is controlled at 35 - 50 Hz, and ultrasonic immersion cleaning with a frequency of 45 Hz is preferably used. It can be understood that an appropriate frequency of ultrasonic wave can not only ensure sufficient cleaning power to remove stubborn stains, but also prevent damage to the surface of the gold plate due to overly violent vibration.

[0039] Preferably, according to some embodiments of the present invention, step S13 further includes performing an anti-static treatment on the output gold plate. It can be understood that removing static electricity can prevent dust or other small particles from being adsorbed on the surface of the gold plate, thereby further improving the cleanliness. After static electricity is eliminated, the gold plate is not easily interfered by static electricity during subsequent processing and storage, improving the reliability and service life of the product.

[0040] Preferably, according to some embodiments of the present invention, the working speed of the gold plate is controlled at 5 m / min, and the distance between two adjacent gold plates is controlled at 50 mm. It can be understood that reasonable working speed and distance ensure that each gold plate has enough time to complete each step during the cleaning process, avoiding incomplete cleaning caused by too fast speed. The standardized distance design reduces the interference between gold plates, avoids surface damage caused by collision or friction, and improves the operating efficiency of the cleaning equipment.

[0041] Preferably, according to some embodiments of the present invention, in step S12, a cooling device is used to cool the gold plate. The temperature of the cooling water used by the cooling device is controlled at 8-10 °C, the inlet water pressure of the cooling water is controlled at 2-3 bar, and the pressure difference between the inlet and outlet of the cooling device is controlled at 0.5-1 bar. It can be understood that the cooling water temperature of 8-10 °C can effectively reduce the temperature of the gold plate after cleaning, avoid oxidation or other chemical changes caused by high temperature, ensure the stability of the gold plate surface, and the appropriate low temperature helps to quickly cool down, reduce the cooling time, and improve production efficiency. The inlet water pressure of 2-3 bar ensures sufficient water flow velocity and cooling efficiency, can quickly take away the heat on the gold plate, and at the same time avoid physical damage to the gold plate that may be caused by too high pressure. The pressure difference between the inlet and outlet of 0.5-1 bar ensures the stable operation of the cooling system, prevents poor cooling effect or system failure caused by uneven pressure. By precisely controlling the parameters in the cooling process, the thermal stress problem caused by too fast or too slow cooling can be effectively avoided, thereby protecting the structural integrity of the gold plate. The cooling treatment can also help remove the trace moisture remaining in the cleaning process, further improve the cleanliness of the gold plate surface, and enhance the welding quality in the subsequent processing steps.

[0042] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge scope of those of ordinary skill in the art.

Claims

1. A method for cleaning a gold plate, characterized in that, It includes the following steps: S1: Loading the board, feeding the gold board into the cleaning equipment; S2: Citric acid washing, using citric acid to wash the gold plate, and controlling the water pressure at 1 - 1.5 kgf / cm 2 ; S3: Pressurized water washing I, perform the first pressurized water washing on the gold plate, and control the water pressure at 1.5 - 2.3 kgf / cm 2 ; S4: Deionized water cleaning, cleaning the gold plate with a deionized water cleaning agent, and controlling the water pressure at 1 - 1.7 kgf / cm 2 ; S5: Pressurized hot water washing. Perform pressurized hot water washing on the gold plate, and control the water pressure at 1.5 - 2.3 kgf / cm 2 ; S6: Second pressurized water washing, performing a second pressurized water washing on the gold plate, with the water pressure controlled at 1.5 - 2.3 kgf / cm 2 ; S7: Ultrasonic immersion cleaning, performing ultrasonic immersion cleaning on the gold board; S8: High-pressure water washing, perform high-pressure water washing on the gold plate, and control the water pressure at 10-12 kgf / cm 2 ; S9: Third pressure washing of the gold plate, the third pressure washing of the gold plate is carried out, and the water pressure is controlled at 1.5 - 2.3 kgf / cm 2 ; S10: Drying and temperature control of the board combination, drying and temperature controlling the gold board; S11: Hot air drying, using a hot air gun to dry the gold board; S12: Cooling, performing cooling treatment on the gold board; S13: Unloading the board, outputting the gold board from the cleaning equipment.

2. The gold plate cleaning method according to claim 1, wherein, In step S2, the treatment time of the citric acid cleaning is controlled at 24 s.

3. The gold plate cleaning method according to claim 1, wherein In step S2, the working temperature of the citric acid cleaning is controlled at 20 - 40 °C.

4. The gold plate cleaning method according to claim 1, characterized in that, In step S2, the concentration of the citric acid is controlled at 4 - 6%.

5. The gold plate cleaning method according to claim 1, characterized in that, In step S4, the treatment time of the deionized water cleaning is controlled at 23 s.

6. The gold plate cleaning method according to claim 1, characterized in that, In step S4, the working temperature of the deionized water cleaning is controlled at 55 - 65 °C.

7. The gold plate cleaning method according to claim 1, characterized in that In step S4, the aqueous solution concentration of the deionized water cleaning agent is controlled at 10 - 15%.

8. The gold plate cleaning method according to claim 1, characterized in that, In step S5, the working temperature of the pressurized hot water cleaning is controlled at 45 °C.

9. The gold plate cleaning method according to claim 1, wherein, Step S13 further includes performing static elimination treatment on the output gold board.

10. The gold plate cleaning method according to claim 1, characterized in that, The working speed of the gold board is controlled at 5 m / min, and the distance between two adjacent gold boards is controlled at 50 mm.

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