Low-deformation framework laser precision welding device for semiconductor equipment

Abstract

The invention provides a low-deformation framework laser precision welding device for semiconductor equipment, which comprises a low-deformation framework, the low-deformation framework is mounted on a processing table through a bolt, a sliding block bracket controlled by an electric push rod is slidably connected in a sliding rail of the low-deformation framework, an electric telescopic rod is assembled on the sliding block bracket through a bolt, and the electric telescopic rod is connected with the low-deformation framework through a bolt. A laser welding head is assembled at the telescopic rod position of the electric telescopic rod through a bolt, a protection assembly is assembled on the laser welding head, through the arrangement of the protection assembly, when the laser welding head is not used, the laser welding head is integrally sealed through two sealing frames, dust or water vapor is prevented from entering the laser welding head, and meanwhile, the laser welding head is prevented from being damaged. The whole sealing frame is made of the light-proof material, corrosive light such as ultraviolet rays can be prevented from entering the laser welding head, the rubber sealing gaskets are assembled on the edges of the opposite sides of the two sealing frames, and the sealing performance after the two sealing frames are combined can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of welding devices for semiconductor equipment, and particularly to a low-deformation skeleton laser precision welding device for semiconductor equipment. Background Art

[0002] After decades of development, semiconductor lasers have become increasingly well-known in society and have been applied in many fields. The photoelectric conversion efficiency of semiconductor lasers is above 60%, far higher than that of other similar products. They have low energy consumption, and the devices have advantages such as less heat accumulation, long lifespan, good collimation, and long illumination distance. As an emerging technology application in the same industry in society, they are becoming more and more widely used. The various advantages of semiconductor lasers determine that they are attracting more and more extensive attention from all walks of life. The welding of high-power semiconductor lasers is one of the most important processes in the entire manufacturing process. Among them, a precise welding device is the prerequisite and guarantee for high-quality welding, and it is also a crucial foundation for subsequent packaging. Only when the welding effect is good can the high-power semiconductor lasers perform excellently in various links such as packaging, testing, and aging, significantly improving key indicators such as the reliability, firmness, and service life of the products. However, currently, there is only a device for welding semiconductor laser chips, and there is no device for welding the housing and the stepped heat sink, resulting in low welding efficiency and poor welding quality between the housing and the stepped heat sink, affecting the use of the products.

[0003] The invention patent with the publication number of CN116174955A discloses an optical communication semiconductor laser welding device with a heat dissipation function, including a welding chamber, and further including a housing. A heat dissipation component is provided inside the housing, a fan is provided on the housing, and several buttons are provided inside the mounting seat. The buttons are electrically connected to the second motor; a control component, the control component is slidably connected to the support, the control component is in movable abutment with the buttons, and the control component adjusts the wind speed of the fan by pressing different buttons; a lifting component, the lifting component is hermetically slidably connected to the inner wall of the housing, and the hot air drives the lifting component to move, and the lifting component is used to drive the control component to move.

[0004] The laser welding head in the above application document is exposed to the air for a long time, and dust or water vapor will enter the laser welding head, which will not only affect the welding state during welding, but also the water vapor in the air will corrode the laser welding head and its connectors. Summary of the Invention

[0005] The present invention provides a low-deformation skeleton laser precision welding device for semiconductor equipment to solve the defect that in the prior art, the laser welding head is exposed to the air for a long time, and dust or water vapor will enter the laser welding head, which will not only affect the welding state during welding, but also the water vapor in the air will corrode the laser welding head and its connectors.

[0006] On the one hand, the present invention provides a low-deformation framework laser precision welding device for semiconductor devices, comprising: A low-deformation framework, which is installed on a processing table through bolts. A slider bracket controlled by an electric push rod is slidably connected in a slide rail of the low-deformation framework. An electric telescopic rod is assembled on the slider bracket through bolts. A laser welding head is assembled at the telescopic rod of the electric telescopic rod through bolts, and a protection component is assembled on the laser welding head; The protection component includes a three-way hydraulic chamber assembled on the side of the slider bracket and a small bracket fixed on the side of the laser welding head. One end of the interior of the three-way hydraulic chamber is slidably connected with a first hydraulic rod by a piston, and the other two ends of the interior of the three-way hydraulic chamber are both slidably connected with second hydraulic rods by pistons. Both sides of the laser welding head are rotatably connected with first rotating rods through small brackets. Arc-shaped brackets are fixed on the outer sides of the two first rotating rods. Sealing frames are fixed at the bottoms of each arc-shaped bracket. Elastic telescopic rods are assembled between each arc-shaped bracket and the laser welding head. By setting the protection component, when the laser welding head is not in use, the laser welding head is integrally enclosed by the two sealing frames to prevent dust or water vapor from entering the laser welding head. At the same time, the overall sealing frame of the present application is made of light-impermeable material, which can prevent corrosive light such as ultraviolet rays from entering the laser welding head. Rubber gaskets are assembled at the edges of the opposite sides of the two sealing frames, which can improve the sealing performance after the two sealing frames are combined.

[0007] On the other hand, a connecting plate is welded in the middle of the arc-shaped bracket. The two second hydraulic rods are respectively attached to the connecting plates of the two arc-shaped brackets, and one side of the two second hydraulic rods close to the connecting plates of the two arc-shaped brackets is of an arc structure.

[0008] On the other hand, the overall sealing frame is made of light-impermeable material, and rubber gaskets are assembled at the edges of the opposite sides of the two sealing frames.

[0009] On the other hand, a dust-removing and temperature-reducing component for rapid cooling is assembled on the side of the laser welding head.

[0010] On the other hand, the dust cleaning and cooling assembly includes a cooling fan assembled on the side of the laser welding head through an L-shaped bracket, a rotating rod 2 fixed on the side of the rotating rod 1, a rotating rod 3 rotatably connected to the side of the L-shaped bracket, and a disc rotatably connected to the cooling fan. The air outlet of the cooling fan is equipped with a soft glue nozzle. A baffle is hinged at the bottom of the cooling fan near the soft glue nozzle. A spring is fixed between the baffle and the air outlet of the cooling fan. The rotating rod 2 is connected to the rotating rod 3 through bevel gear 1 and bevel gear 2. A rotating rod 4 is fixed to one side of the disc, and the rotating rod 4 is connected to the rotating rod 3 through a transmission chain. A cylindrical rod is fixed to the other side of the disc. By setting up the dust cleaning and cooling assembly, during the descent of the laser welding head, preliminary dust cleaning can be performed by the cooling fan. At the same time, during the welding process, the welding point can be quickly cooled down, which can improve the welding efficiency during the welding process.

[0011] On the other hand, the bevel gear 1 is fixed on the side of the second rotating rod, the bevel gear 2 is fixed on the side of the third rotating rod, and the bevel gear 1 is vertically meshed with the bevel gear 2, and the cylindrical rod is located between the air outlet of the cooling fan and the baffle.

[0012] A cleaning brush is rotatably connected to the cooling fan's air inlet. A torsion spring is installed inside the hinged connection between the brush and the cooling fan. A slot is defined in the center of the disc, and a long rod at the end of the cleaning brush is located within the slot. Multiple vertical rods are fixed to the sides of the disc, each with a long rubber rod attached to its side. The cleaning brush cleans the cooling fan's air inlet, while the long rubber rods sequentially impact the soft-gel nozzle, changing the nozzle's airflow direction and improving cleaning effectiveness.

[0013] A method for a low-deformation frame laser precision welding device for semiconductor equipment includes the following steps: Step 1: First, install the low-deformation frame on the processing table with bolts, and then use the electric push rod to control the slider bracket to move downward; Step 2: As the slider bracket moves downward, the two sealing frames in the protective assembly open, allowing the laser welding head to leak out for welding operations; Step three: while the sealing frame is opened in step two, turn on the cooling fan and clean the dust first, which can quickly cool down the welding process. At the same time, the cleaning brush works synchronously to clean the dust attached to the cooling fan air inlet.

[0014] The benefits of this application are: (1) The low-deformation framework laser precision welding device for semiconductor equipment, by setting a protection component, when the laser welding head is not in use, the laser welding head is integrally enclosed by two sealing frames, preventing dust or water vapor from entering the laser welding head. At the same time, the sealing frames of the present application are made of light-impermeable materials as a whole, which can prevent erosive light such as ultraviolet rays from entering the laser welding head. Rubber gaskets are assembled at the edges of the two sealing frames facing each other, which can improve the sealing performance after the two sealing frames are combined.

[0015] (2) The low-deformation framework laser precision welding device for semiconductor equipment, by setting a dust cleaning and temperature reduction component, during the descent of the laser welding head, preliminary dust cleaning operations can be carried out through the cooling fan. At the same time, during the welding process, rapid cooling of the welding area can improve the welding efficiency during the welding process.

[0016] (3) The low-deformation framework laser precision welding device for semiconductor equipment, by setting a cleaning brush to clean the air inlet of the cooling fan, and at the same time, by using a rubber long rod to sequentially impact the soft rubber nozzle to change the air spraying direction of the soft rubber nozzle, the cleaning effect is improved. Brief Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is a schematic structural diagram of the overall appearance of the present invention; Figure 2 It is a schematic structural diagram of the protection component of the present invention; Figure 3 It is a schematic diagram of the working state of the protection component of the present invention; Figure 4 It is a schematic diagram of a partial structure of the protection component of the present invention; Figure 5 It is a schematic diagram of the dust cleaning and temperature reduction component of the present invention Figure 1 ; Figure 6 It is a schematic diagram of the dust cleaning and temperature reduction component of the present invention Figure 2 ; Figure 7 It is a schematic diagram of the dust cleaning and temperature reduction component of the present invention Figure 3 ; Figure 8 It is a schematic diagram of the dust cleaning and temperature reduction component of the present invention Figure 4 .

[0019] In the above figures, 100, Low-deformation skeleton; 200, Slide block bracket; 300, Electric telescopic rod; 400, Laser welding head; 500, Protection component; 501, Three-way hydraulic chamber; 502, Arc-shaped bracket; 503, Small bracket; 504, Sealing frame; 505, Elastic telescopic rod; 506, Hydraulic rod 1; 507, Hydraulic rod 2; 508, Rotating rod 1; 600, Dust cleaning and temperature reduction component; 601, Cooling fan; 602, L-shaped bracket; 603, Rotating rod 2; 604, Bevel gear 1; 605, Bevel gear 2; 606, Disc; 607, Rotating rod 4; 608, Transmission chain; 609, Cylindrical rod; 610, Baffle; 611, Soft rubber nozzle; 612, Rotating rod 3; 701, Cleaning brush; 702, Card slot; 703, Vertical rod; 704, Rubber long rod. Specific implementation mode

[0020] In order to enable the personnel in the technical field to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0021] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. This application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0022] Example 1, see Figures 1-4 , This embodiment provides a low-deformation skeleton laser precision welding device for semiconductor equipment, including: Low-deformation skeleton 100, the low-deformation skeleton 100 is installed on the processing table by bolts. A slide block bracket 200 controlled by an electric push rod is slidably connected in the slide rail of the low-deformation skeleton 100. An electric telescopic rod 300 is assembled on the slide block bracket 200 by bolts. A laser welding head 400 is assembled at the telescopic rod of the electric telescopic rod 300 by bolts. A protection component 500 is assembled on the laser welding head 400; The protection component 500 includes a three-way hydraulic chamber 501 assembled on the side of the slider bracket 200 and a small bracket 503 fixed on the side of the laser welding head 400. One end of the piston inside the three-way hydraulic chamber 501 is slidably connected to a first hydraulic rod 506, and the other two ends inside the three-way hydraulic chamber 501 are both slidably connected to second hydraulic rods 507. Both sides of the laser welding head 400 are rotatably connected to a first rotating rod 508 through the small bracket 503. Arc-shaped brackets 502 are fixed on the outer sides of the two first rotating rods 508. A sealing frame 504 is fixed at the bottom of each arc-shaped bracket 502. An elastic telescopic rod 505 is assembled between each arc-shaped bracket 502 and the laser welding head 400. A connecting plate is welded to the middle of the arc-shaped bracket 502. The two second hydraulic rods 507 are respectively attached to the connecting plates of the two arc-shaped brackets 502. One side of the two second hydraulic rods 507 close to the connecting plates of the two arc-shaped brackets 502 is of an arc structure. The sealing frame 504 is made of a light-tight material as a whole. Rubber sealing gaskets are assembled at the edges of the two opposite sides of the two sealing frames 504. For this low-deformation skeleton laser precision welding device for semiconductor equipment, by setting the protection component 500, when the laser welding head 400 is not in use, the laser welding head 400 is completely enclosed by the two sealing frames 504 to prevent dust or moisture from entering the laser welding head 400. At the same time, the sealing frame 504 of this application is made of a light-tight material as a whole, which can prevent erosive light such as ultraviolet rays from entering the laser welding head 400. Rubber sealing gaskets are assembled at the edges of the two opposite sides of the two sealing frames 504, which can improve the sealing performance after the two sealing frames 504 are combined.

[0023] When the above equipment is specifically used, first, the low-deformation skeleton 100 is installed on the processing table through bolts. Subsequently, the slider bracket 200 is controlled to move downward by the electric push rod. As the slider bracket 200 moves downward, the first hydraulic rod 506 will be squeezed by the low-deformation skeleton 100 and thus retracted into the three-way hydraulic chamber 501, increasing the internal liquid pressure, and then simultaneously pushing the two second hydraulic rods 507 to extend horizontally through the liquid pressure. The simultaneous extension of the two second hydraulic rods 507 will synchronously squeeze the two arc-shaped brackets 502 to rotate, and then simultaneously squeeze the two elastic telescopic rods 505. At this time, under the action of the two arc-shaped brackets 502, the two sealing frames 504 are simultaneously driven to unfold, exposing the laser welding head 400. At this time, welding operations can be carried out. When the laser welding head 400 is not in use, the laser welding head 400 is completely enclosed by the two sealing frames 504 to prevent dust or moisture from entering the laser welding head 400. At the same time, the sealing frame 504 of this application is made of a light-tight material as a whole, which can prevent erosive light such as ultraviolet rays from entering the laser welding head 400. Rubber sealing gaskets are assembled at the edges of the two opposite sides of the two sealing frames 504, which can improve the sealing performance after the two sealing frames 504 are combined.

[0024] Example 2, seeFigure 1 , Figures 5-7 , in this embodiment, on the basis of Embodiment 1, a dust cleaning and temperature reduction component 600 for rapid temperature reduction is assembled on the side of the laser welding head 400. The dust cleaning and temperature reduction component 600 includes a cooling fan 601 assembled on the side of the laser welding head 400 through an L-shaped bracket 602, a second rotating rod 603 fixed to the side of the first rotating rod 508, a third rotating rod 612 rotatably connected to the side of the L-shaped bracket 602, and a disc 606 rotatably connected to the cooling fan 601. A soft rubber nozzle 611 is assembled at the air outlet of the cooling fan 601. A baffle 610 is hinged near the soft rubber nozzle 611 at the bottom of the cooling fan 601. A spring is fixed between the baffle 610 and the air outlet of the cooling fan 601. The second rotating rod 603 is drivingly connected to the third rotating rod 612 through a first bevel gear 604 and a second bevel gear 605. A fourth rotating rod 607 is fixed to one side of the disc 606, and the fourth rotating rod 607 is drivingly connected to the third rotating rod 612 through a transmission chain 608. A cylindrical rod 609 is fixed to the other side of the disc 606. The first bevel gear 604 is fixed to the side of the second rotating rod 603, the second bevel gear 605 is fixed to the side of the third rotating rod 612, and the first bevel gear 604 is vertically meshed with the second bevel gear 605. The cylindrical rod 609 is located between the air outlet of the cooling fan 601 and the baffle 610. For this low-deformation skeleton laser precision welding device for semiconductor equipment, by setting the dust cleaning and temperature reduction component 600, during the downward movement of the laser welding head 400, preliminary dust cleaning operations can be carried out through the cooling fan 601. At the same time, during the welding process, rapid cooling of the welding area can improve the welding efficiency during the welding process.

[0025] When the above equipment is specifically used, on the basis of Embodiment 1, the cooling fan 601 is started. As the arc-shaped bracket 502 is pushed and rotates, the first rotating rod 508 connected to it rotates, and then the second rotating rod 603 fixedly connected to it rotates. The rotation of the second rotating rod 603 will drive the first bevel gear 604 to rotate. The first bevel gear 604 drives the third rotating rod 612 to rotate through the second bevel gear 605. Subsequently, under the action of the transmission chain 608, the fourth rotating rod 607 is driven to rotate, and then the disc 606 rotates. At this time, the cylindrical rod 609 on the back of the disc 606 will push the baffle 610 to rotate and unfold. At this time, the spring is in a stretched state, and the soft rubber nozzle 611 of the cooling fan 601 is opened. At this time, the wind blown out by the cooling fan 601 will blow off the dust on the surface of the semiconductor equipment to be welded. During the welding process, air can be quickly supplied to cool the welding area, which can improve the welding efficiency; After the equipment is reset, the baffle 610 will be pulled back to its original position under the action of the spring, and then the soft rubber nozzle 611 of the cooling fan 601 will be blocked again to prevent dust from entering.

[0026] Embodiment 3, see Figures 5-8, on the basis of Embodiment 2, a cleaning brush 701 is rotatably connected to the air inlet of the cooling fan 601. A torsion spring is assembled inside the hinge joint of the cleaning brush 701 and the cooling fan 601. A clamping groove 702 is formed in the middle of the disc 606. The long rod at the end of the cleaning brush 701 is located inside the clamping groove 702. A plurality of vertical rods 703 are fixed to the side surface of the disc 606, and a rubber long rod 704 is fixed to the side surface of each vertical rod 703. In this semiconductor device with a low-deformation skeleton laser precision welding device, the air inlet of the cooling fan 601 is cleaned by setting the cleaning brush 701. At the same time, the rubber long rod 704 is used to sequentially impact the soft rubber nozzle 611 to change the air spraying direction of the soft rubber nozzle 611, thereby improving the cleaning effect.

[0027] When the above device is specifically used, on the basis of Embodiment 2, as the disc 606 rotates, the cleaning brush 701 is pushed to rotate through the formed clamping groove 702 to clean the air inlet of the cooling fan 601. At this time, the torsion spring is in a compressed state. At the same time, as the disc 606 rotates, a plurality of vertical rods 703 on its side surface will drive a plurality of rubber long rods 704 to rotate simultaneously. The rubber long rod 704 sequentially impacts the soft rubber nozzle 611 to make the soft rubber nozzle 611 swing up and down, so as to improve the cleaning efficiency of the soft rubber nozzle 611 before laser welding. When the device is reset, the disc 606 will rotate in the reverse direction to reset. At this time, the rubber long rod 704 will rotate in the reverse direction and impact the soft rubber nozzle 611 again in sequence to improve the cooling efficiency; When the disc 606 is reset, under the action of the torsion spring, the cleaning brush 701 will also be reset, and the cleaning brush 701 will be controlled to rotate and clean again through the rotation of the disc 606 during the next welding operation, so as to form a reciprocating cleaning effect.

[0028] Embodiment 4, a method for a semiconductor device with a low-deformation skeleton laser precision welding device, includes the following steps: Step 1, first install the low-deformation skeleton 100 on the processing table through bolts, and then control the slider bracket 200 to move downward through the electric push rod; Step 2, as the slider bracket 200 moves downward, two sealing frames 504 in the protection component 500 are opened, so that the laser welding head 400 is exposed for welding operations; Step 3, while the sealing frame 504 is opened in Step 2, the cooling fan 601 is turned on to first clean the ash, which can achieve the effect of quickly cooling down during the welding process. At the same time, the cleaning brush 701 works synchronously to clean the dust attached to the air inlet of the cooling fan 601.

[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A low-deformation framework laser precision welding device for semiconductor equipment, characterized in that, include: A low-deformation frame (100), the low-deformation frame (100) being mounted on a processing table via bolts, a slider bracket (200) being slidably connected within a slide rail of the low-deformation frame (100) and being controlled by an electric push rod, an electric telescopic rod (300) being assembled to the slider bracket (200) via bolts, a laser welding head (400) being assembled to the telescopic rod of the electric telescopic rod (300) via bolts, and a protective assembly (500) being assembled to the laser welding head (400); The protective component (500) includes a three-way hydraulic chamber (501) assembled on the side of the slider bracket (200) and a small bracket (503) fixed on the side of the laser welding head (400). One end of the interior of the three-way hydraulic chamber (501) is piston-slidingly connected to a hydraulic rod 1 (506), and the other two ends of the interior of the three-way hydraulic chamber (501) are piston-slidingly connected to a hydraulic rod 2 (507). Both sides of the laser welding head (400) are rotatably connected to a rotating rod 1 (508) through the small bracket (503). The outer sides of the two rotating rods 1 (508) are fixed with an arc bracket (502), the bottom of each arc bracket (502) is fixed with a sealing frame (504), and an elastic telescopic rod (505) is assembled between each arc bracket (502) and the laser welding head (400).

2. The low-deformation skeleton laser precision welding device for a semiconductor device according to claim 1, wherein A connecting plate is welded to the middle of the arc-shaped bracket (502), and the two hydraulic rods (507) are respectively attached to the connecting plates of the two arc-shaped brackets (502). The sides of the two hydraulic rods (507) close to the connecting plates of the two arc-shaped brackets (502) are both arc-shaped structures.

3. A low-deformation skeleton laser precision welding device for semiconductor devices according to claim 1, characterized in that, The sealing frame (504) is made entirely of opaque material, and rubber sealing pads are installed at the edges of the two sealing frames (504) facing each other.

4. A low-deformation skeleton laser precision welding device for semiconductor equipment according to claim 1, characterized in that, A dust removal and cooling component (600) for rapid cooling is installed on the side of the laser welding head (400).

5. A low-deformation skeleton laser precision welding device for semiconductor devices according to claim 4, characterized in that, The dust cleaning and cooling assembly (600) includes a cooling fan (601) assembled on the side of the laser welding head (400) through an L-shaped bracket (602), a rotating rod (603) fixed on the side of the rotating rod (508), a rotating rod (612) rotatably connected to the side of the L-shaped bracket (602), and a disc (606) rotatably connected to the cooling fan (601). The air outlet of the cooling fan (601) is equipped with a soft glue nozzle (611). The bottom of the cooling fan (601) is close to the soft glue nozzle (611). 11) is hinged with a baffle (610), a spring is fixed between the baffle (606) and the air outlet of the cooling fan (601), the rotating rod 2 (603) is connected to the rotating rod 3 (612) through the bevel gear 1 (604) and the bevel gear 2 (605), a rotating rod 4 (607) is fixed on one side of the disc (606), and the rotating rod 4 (607) is connected to the rotating rod 3 (612) through the transmission chain (608), and a cylindrical rod (609) is fixed on the other side of the disc (606).

6. A low-deformation skeleton laser precision welding device for semiconductor devices according to claim 5, characterized in that, The bevel gear one (604) is fixed to the side of the rotating rod two (603), the bevel gear two (605) is fixed to the side of the rotating rod three (612), and the bevel gear one (604) is vertically meshed with the bevel gear two (605). The cylindrical rod (609) is located between the air outlet of the cooling fan (601) and the baffle (610).

7. A low-deformation skeleton laser precision welding device for semiconductor devices according to claim 6, characterized in that, A cleaning brush (701) is rotatably connected to the air inlet of the cooling fan (601). A torsion spring is assembled inside the hinge joint of the cleaning brush (701) and the cooling fan (601). A clamping groove (702) is formed in the middle of the disc (606). The long rod at the end of the cleaning brush (701) is located inside the clamping groove (702). A plurality of vertical rods (703) are fixed to the side of the disc (606), and a rubber long rod (704) is fixed to the side of each vertical rod (703).

8. A method for a low-deformation framework laser precision welding device for a semiconductor device according to claims 1-7, characterized in that, It includes the following steps: Step 1: First, install the low-deformation skeleton (100) on the processing table through bolts, and then control the slider bracket (200) to move downward through the electric push rod; Step 2: As the slider bracket (200) moves downward, the two sealing frames (504) in the protection component (500) open, so that the laser welding head (400) is exposed for welding operations; Step 3: While the sealing frame (504) is opened in Step 2, turn on the cooling fan (601). First, perform dust cleaning, which can achieve the effect of rapid cooling during the welding process. At the same time, the cleaning brush (701) works synchronously to clean the dust attached to the air inlet of the cooling fan (601).

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