Lens body machining method

Abstract

The mirror body machining method comprises the steps that a base body is obtained through machining, the base body comprises a preset face, one side face, away from the preset face, of the base body is provided with at least one concave cavity, the base body is divided into at least two base body units through the at least one concave cavity, and the to-be-polished faces of the base body units are located on the preset face; the preset face of the base body is polished; and dividing the at least two base body units according to the position of the at least one concave cavity to obtain at least two mirror bodies. According to the method, the base body is obtained through machining firstly, the base body is divided into the multiple base body units, the to-be-polished faces of the base body units are located on the preset face, the preset face of the base body is subjected to polishing treatment, and then the to-be-polished faces of the multiple base body units can be subjected to polishing treatment, so that the machining efficiency can be improved; and the edge effect of edge warping, edge collapse or inconsistent removal amount of the to-be-polished surface of the single matrix unit is reduced.

Description

Technical Field

[0001] The present invention relates to the field of optical element processing, and particularly to a method for processing a mirror body. Background Art

[0002] In the construction of synchrotron radiation light sources, X-ray mirrors are used in synchrotron radiation facilities to focus and guide X-ray beams, enabling high-resolution imaging, high-precision spectral analysis, and ultrafast dynamics research. High-performance synchrotron radiation light sources require X-ray mirrors to have a large reflectivity, better converging ability, and excellent heat dissipation. In addition, nearly a hundred X-ray mirrors are used in synchrotron radiation light sources, so higher requirements are put forward for the batch and efficient processing and manufacturing technology of X-ray mirrors.

[0003] The small grinding head polishing machine (CCOS) is an important means for processing X-ray mirrors. The small grinding head technology is a technology that uses a computer to control a relatively small grinding disc (generally 1 / 10 of the aperture of the optical element) to polish the optical element. In small grinding head polishing, a chemical reaction occurs between the polishing liquid and the workpiece surface to generate a loose Beilby layer. Driven by the polishing tool, the abrasive grains mechanically remove the workpiece surface to obtain an ultrasmooth surface.

[0004] There are also some limitations in small grinding head polishing for the processing of X-ray mirrors. X-ray mirrors are mostly long strips, and the aspect ratio is usually greater than 10:1, and the common width is about 50 mm, which affects the selection of the grinding disc size and the planning of the polishing path. During processing, if the grinding disc size is too small, the medium and high frequency phenomena of the processed X-ray mirror are serious, and the processing cycle is long and the efficiency is low. In addition, when the grinding disc processes at the edge of the mirror surface, the contact area decreases, the pressure increases, and the grinding disc cannot move out of the mirror surface, resulting in incomplete convolution and thus causing warping. The grinding disc will also tilt when processing at the edge of the mirror surface, and the shear direction is no longer parallel to the mirror surface, resulting in a large extrusion on the edge of the mirror surface and thus causing collapse. The warping and collapse phenomena seriously affect the convergence efficiency and processing accuracy. The convergence efficiency refers to the speed of reducing the surface roughness during processing. During the small grinding head polishing process, if the center of the tool protrudes too much from the mirror, the grinding disc will jump on the mirror, and the removal amount on the surface may be inconsistent, which affects the surface accuracy of the final workpiece and thus affects the overall optical performance. Summary of the Invention

[0005] The purpose of the present invention is to provide a method for processing a mirror body, which can improve the processing efficiency and reduce the edge effect of mirror body processing.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] A method for processing a mirror body, comprising:

[0008] A substrate is processed, the substrate includes a preset surface, at least one concave cavity is arranged on a side surface of the substrate away from the preset surface, the at least one concave cavity divides the substrate into at least two substrate units, and the surface to be polished of the substrate unit is located on the preset surface;

[0009] Polish the preset surface of the substrate;

[0010] Divide the at least two substrate units according to the positions of the at least one concave cavity to obtain at least two mirror bodies.

[0011] Optionally, the substrate unit is strip-shaped, and the at least one concave cavity divides the substrate into the at least two substrate units arranged side by side.

[0012] Optionally, the concave cavity is strip-shaped, and the length direction of the concave cavity is consistent with the length direction of the substrate unit.

[0013] Optionally, after dividing the at least two substrate units, the inner side surface of the concave cavity forms the side end surface of the substrate unit adjacent to the concave cavity.

[0014] Optionally, a through hole is arranged at the bottom of the concave cavity, and the through hole penetrates from the bottom of the concave cavity to the preset surface;

[0015] Dividing the at least two substrate units according to the positions of the at least one concave cavity includes: dividing the substrate according to the positions of the through holes to divide out the at least two substrate units.

[0016] Optionally, at least two through holes arranged in sequence along the bottom edge of the concave cavity are arranged at the bottom edge of the concave cavity, and the through holes penetrate from the bottom of the concave cavity to the preset surface;

[0017] Dividing the at least two substrate units according to the positions of the at least one concave cavity includes: performing wire cutting on the substrate along the straight line where the at least two through holes are located to divide out the at least two substrate units.

[0018] Optionally, before polishing the preset surface of the substrate, it further includes:

[0019] A support member is arranged in the concave cavity, and the support member is used to support the area of the preset surface corresponding to the concave cavity.

[0020] Optionally, polishing the preset surface of the substrate includes:

[0021] Place the substrate below a grinding disc, a polishing layer is arranged on the grinding disc, the grinding disc is connected to a motion device, and the motion device is used to drive the grinding disc to move;

[0022] Bring the polishing layer of the grinding disc into contact with the preset surface of the substrate, and the moving device drives the grinding disc to move on the preset surface to polish the preset surface.

[0023] Optionally, polishing the preset surface of the substrate includes:

[0024] Detect the roughness of the preset surface after polishing. When the roughness of the preset surface does not meet the requirements, polish the preset surface of the substrate again until the roughness of the preset surface meets the requirements.

[0025] Optionally, manufacturing the substrate includes:

[0026] Simulate and model the polishing of the preset surface of the substrate to obtain the optimal thickness and the optimal width that minimize the deformation of the corresponding area of the cavity on the preset surface after polishing the preset surface of the substrate, so as to manufacture the substrate according to the optimal thickness and the optimal width. The optimal thickness is the thickness from the bottom surface of the cavity to the preset surface, and the optimal width is the width of the cavity between two adjacent substrate units.

[0027] As can be seen from the above technical solutions, a method for manufacturing a mirror body provided by the present invention includes: manufacturing a substrate, the substrate includes a preset surface, at least one cavity is provided on a side surface of the substrate away from the preset surface, the at least one cavity divides the substrate into at least two substrate units, and the surface to be polished of the substrate unit is located on the preset surface; polishing the preset surface of the substrate; dividing the at least two substrate units according to the positions of the at least one cavity to obtain at least two mirror bodies. In the method for manufacturing a mirror body of the present invention, the substrate is first manufactured. The substrate is a substrate divided into multiple substrate units, and the surface to be polished of the substrate unit is located on the preset surface. Polishing the preset surface of the substrate can polish the surfaces to be polished of multiple substrate units, so as to achieve batch polishing of the surfaces to be polished of multiple mirror bodies and improve the processing efficiency. Moreover, compared with the existing method of polishing a single mirror body separately by a small grinding head, in this method, polishing the preset surface of the substrate to polish the surfaces to be polished of multiple substrate units can reduce the edge effects such as warping, collapsing or inconsistent removal amount on the surface to be polished of a single substrate unit. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0029] Figure 1 Flow chart of a mirror body processing method provided by an embodiment of the present invention;

[0030] Figure 2 Schematic diagram of the substrate viewed from the back in the mirror body processing method according to an embodiment of the present invention;

[0031] Figure 3 Schematic diagram of polishing a preset surface of the substrate in the mirror body processing method according to an embodiment of the present invention;

[0032] Figure 4 Flow chart of a mirror body processing method provided by another embodiment of the present invention;

[0033] Figure 5 Schematic diagram of dividing the substrate into substrate units in the mirror body processing method according to an embodiment of the present invention;

[0034] Figure 6 Schematic diagram of processing an X-ray mirror by polishing with a small grinding head in the prior art.

[0035] Reference numerals in the accompanying drawings of the specification include:

[0036] 1 - Substrate, 2 - Polishing layer, 3 - Flexible layer, 4 - Grinding disc, 5 - Clamping portion, 6 - Passive deformation portion, 7 - Mirror body, 10 - Preset surface, 11 - Substrate unit, 12 - Concave cavity, 13 - Bottom edge of the concave cavity. Detailed implementation manners

[0037] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] Reference may be made to Figure 1 , Figure 1 For a flow chart of a mirror body processing method provided by an embodiment, the mirror body processing method includes the following steps:

[0039] S11: Process to obtain a substrate, the substrate includes a preset surface, at least one concave cavity is provided on a side surface of the substrate away from the preset surface, the at least one concave cavity divides the substrate into at least two substrate units, and the surface to be polished of the substrate unit is located on the preset surface.

[0040] The substrate includes the at least two substrate units, and the at least two substrate units are separated by the at least one concave cavity.

[0041] S12: Polish the preset surface of the substrate.

[0042] The surface to be polished of the substrate unit is located on the preset surface of the substrate. Then, polishing the preset surface of the substrate can polish the surface to be polished of the substrate unit.

[0043] S13: Divide the at least two substrate units according to the positions of the at least one cavity to obtain at least two lens bodies.

[0044] After dividing the substrate units of the substrate, the substrate units form lens bodies, and the surfaces to be polished of the substrate units form the mirror surfaces of the lens bodies.

[0045] The lens body processing method of this embodiment first processes to obtain a substrate. The substrate is a substrate divided into multiple substrate units. The surface to be polished of the substrate unit is located on the preset surface. Polishing the preset surface of the substrate can polish the surfaces to be polished of multiple substrate units. In this way, batch polishing of the surfaces to be polished of multiple lens bodies can be realized, and the processing efficiency can be improved. Moreover, compared with the existing method of polishing a single lens body separately by a small grinding head, in this method, polishing the preset surface of the substrate to polish the surfaces to be polished of multiple substrate units can reduce the edge effects such as warping, collapsing or inconsistent removal amount on the surfaces to be polished of individual substrate units.

[0046] The cavity is arranged on a side surface of the substrate away from the preset surface. The depth of the cavity is less than the thickness of the substrate. The bottom of the cavity connects two adjacent substrate units. The connecting part between two adjacent substrate units has a certain thickness. In the area corresponding to the cavity on the preset surface of the substrate, it is connected to the surfaces to be polished of the substrate units on both sides of the cavity, and they are all located on the preset surface.

[0047] In some embodiments, the substrate unit is strip-shaped. The at least one cavity divides the substrate into the at least two substrate units arranged side by side, and two adjacent substrate units are divided by the cavity located between them. It is easier to process strip-shaped substrate units on the substrate, and correspondingly strip-shaped lens bodies will be processed. The at least two substrate units on the substrate are arranged side by side to form an array of substrate units, and an array processing method is used to process multiple lens bodies in an array.

[0048] In some embodiments, the cavity is strip-shaped, and the length direction of the cavity is the same as the length direction of the substrate unit. Exemplarily, reference can be made to Figure 2 , Figure 2Schematic diagram of the substrate viewed from the back in the mirror body processing method of an embodiment, where it is illustrated by taking the substrate including three substrate units as an example. As shown in the figure, two concave cavities 12 are provided on the back of the substrate 1, dividing the substrate 1 into three substrate units 11. The back of the substrate 1 is the side of the substrate 1 away from the preset surface 10. The substrate units 11 are strip-shaped and the three substrate units 11 are arranged side by side, and the concave cavities 12 are strip-shaped. The connecting part between two adjacent substrate units 11 (i.e., the bottom of the concave cavity 12) has a thickness d. In some embodiments, the substrate unit 11 can be a cuboid, and the concave cavity 12 is a cuboid.

[0049] In some embodiments, the obtained substrate 1 includes: simulating and modeling the polishing treatment of the preset surface 10 of the substrate 1 to obtain the optimal thickness and optimal width that minimize the deformation of the corresponding area of the concave cavity 12 on the preset surface 10 after polishing the preset surface 10 of the substrate 1, so as to process the substrate 1 according to the optimal thickness and the optimal width. The optimal thickness is the thickness from the bottom surface of the concave cavity 12 to the preset surface 10, and the optimal width is the width of the concave cavity 12 between two adjacent substrate units 11. Before processing the substrate 1, the structure of the substrate 1 is designed first to determine the shape and size of the substrate unit 11 and the shape and size of the concave cavity 12. In this embodiment, simulating and modeling the polishing treatment of the preset surface 10 of the substrate 1 to optimize the thickness from the bottom surface of the concave cavity 12 to the preset surface 10 (i.e., the thickness of the connecting part between two adjacent substrate units 11) and the width of the concave cavity 12 between two adjacent substrate units 11, so that the deformation of the corresponding area of the concave cavity 12 on the preset surface 10 is minimized after polishing the preset surface 10 of the substrate 1, and the optimal thickness d and the optimal width t are obtained. In this way, the substrate 1 is processed according to the optimal thickness d and the optimal width t to ensure that the preset surface 10 hardly deforms during the actual polishing treatment of the substrate 1.

[0050] In some embodiments, before polishing the preset surface 10 of the substrate 1, it further includes: arranging a support member in the concave cavity 12, and the support member is used to support the area of the preset surface 10 corresponding to the concave cavity 12. This makes it difficult for the connecting part between two adjacent substrate units 11 to deform when polishing the preset surface 10 of the substrate 1 or when performing other processing on the substrate 1. In this embodiment, the structure of the support member is not limited. In some embodiments, the support member can be a mesh support member, which can evenly support the bottom of the concave cavity 12 and evenly disperse the force.

[0051] In some embodiments, the polishing process of the preset surface 10 of the substrate 1 includes: placing the substrate 1 below the grinding wheel 4, where a polishing layer 2 is provided on the grinding wheel 4, and the grinding wheel 4 is connected to a motion device for driving the grinding wheel 4 to move; bringing the polishing layer 2 of the grinding wheel 4 into contact with the preset surface 10 of the substrate 1, and the motion device drives the grinding wheel 4 to move on the preset surface 10 for polishing the preset surface 10. Compared with the surface to be polished of a single substrate unit 11, the preset surface 10 of the substrate 1 is larger, so a large-sized grinding wheel can be used for the grinding wheel 4, which can improve the processing efficiency and help reduce edge effects such as warping, collapse, or inconsistent removal amount on the surface to be polished of the substrate unit 11. Exemplarily, reference can be made to Figure 3 , Figure 3 FIG. is a schematic diagram of polishing the preset surface of a substrate in a mirror body processing method of an embodiment.

[0052] In some embodiments, a flexible layer 3 is provided between the grinding wheel 4 and the polishing layer 2. The flexible layer 3 is used to evenly distribute the pressure, so that the pressure applied by the grinding wheel 4 is evenly distributed to adapt to the surface topography of the workpiece to be polished, such as the surface topography of the preset surface 10. The flexible layer 3 is also used to enhance the abrasive action or absorb vibration. Reference can be made to Figure 3 as shown. The grinding wheel 4 and the flexible layer 3 can be bonded, and the flexible layer 3 and the polishing layer 2 can be bonded, which can be adhered by glue.

[0053] In some embodiments, the grinding wheel 4 is connected to a passive deformation part 6, and the passive deformation part 6 is connected to a motion device. The passive deformation part 6 is used to dynamically adjust the contact state between the grinding wheel 4 and the preset surface 10, and dynamically adjust the contact state between the grinding wheel 4 and the preset surface 10 of the substrate 1 during the polishing process of the preset surface 10 by the grinding wheel 4. The passive deformation part 6 and the motion device can be threadedly connected. Reference can be made to Figure 3 as shown, where a thread is provided at the upper end of the passive deformation part 6. In some embodiments, the passive deformation part 6 and the grinding wheel 4 are connected through a clamping part 5. A groove is provided at the upper end of the clamping part 5. The passive deformation part 6 includes a sphere and a threaded column. One end of the threaded column is connected to the sphere, and the sphere is embedded in the groove of the clamping part 5, so that the passive deformation part 6 can rotate flexibly relative to the clamping part 5. The passive deformation part 6 can be a high-degree-of-freedom passive deformation part. The motion device can be, but is not limited to, a machine tool or a robotic arm.

[0054] When polishing the preset surface 10, a polishing liquid is provided on the preset surface 10. The polishing layer 2 contacts the preset surface 10 of the substrate 1 through the polishing liquid and performs polishing.

[0055] Exemplarily, reference can be made to Figure 4 , Figure 4A flowchart of a method for processing a lens body provided for another embodiment. In some embodiments, a suitable polishing program may be set according to the shape and size of the preset surface 10 of the substrate 1. The polishing program is set with parameters such as a polishing path, pressure, and rotation speed. The polishing path is the movement path of the grinding disc 4 on the preset surface 10. Further, the polishing program is run by a computer to control the movement device to drive the grinding disc 4 to grind and polish the preset surface 10 of the substrate 1 according to the polishing path, pressure, and rotation speed set in the polishing program.

[0056] In some embodiments, before polishing the preset surface 10 of the substrate 1, it further includes: milling the preset surface 10 of the substrate 1.

[0057] In some embodiments, polishing the preset surface 10 of the substrate 1 includes: detecting the roughness of the preset surface 10 after polishing. When the roughness of the preset surface 10 does not meet the requirements, polishing the preset surface 10 of the substrate 1 again until the roughness of the preset surface 10 meets the requirements. If it is determined through detection that the roughness of the preset surface 10 of the substrate 1 meets the requirements, the polishing is completed. If the roughness of the preset surface 10 of the substrate 1 does not meet the requirements, continue to polish the preset surface 10 of the substrate 1, or the polishing parameters can be changed and polished again until the roughness of the preset surface 10 of the substrate 1 meets the requirements or the roughness is better than the expected requirements. Exemplarily, an interferometer can be used to detect the roughness of the preset surface 10, such as a white light interferometer.

[0058] In some embodiments, a through hole is provided at the bottom of the cavity 12, and the through hole penetrates from the bottom of the cavity 12 to the preset surface 10; dividing the at least two substrate units 11 according to the position of the at least one cavity 12 includes: dividing the substrate 1 according to the position of the through hole to divide out the at least two substrate units 11. In this embodiment, by providing a through hole at the bottom of the cavity 12 on the substrate 1 and marking the division position of the substrate units 11 on the substrate 1 through the through hole, the at least two substrate units 11 can be divided more accurately and it helps to improve the processing efficiency.

[0059] In some embodiments, at least two through holes arranged in sequence along the bottom edge of the concave cavity 12 are provided at the bottom edge of the concave cavity 12, and the through holes penetrate from the bottom of the concave cavity 12 to the preset surface 10; dividing the at least two substrate units 11 according to the position of the at least one concave cavity 12 includes: performing wire cutting on the substrate 1 along the straight line where the at least two through holes are located to divide the at least two substrate units 11. In this embodiment, by providing a plurality of through holes at the bottom edge 13 of the concave cavity on the substrate 1, and the respective through holes are arranged in sequence along the bottom edge 13 of the concave cavity, the dividing positions of the substrate 1 are marked by the through holes, which is convenient for wire cutting, enabling the at least two substrate units 11 to be divided more accurately and helping to improve the processing efficiency. Exemplarily, reference can be made to Figure 5 , Figure 5 which is a schematic diagram of dividing a substrate into substrate units in the mirror body processing method of an embodiment. In the figure, the left figure is the substrate 1, and the right figure is the substrate unit 11 obtained by dividing the substrate 1 in the left figure. As shown in the left figure, a plurality of through holes arranged in sequence along the bottom edge 13 of the concave cavity are provided at the bottom edge 13 of the concave cavity, and wire cutting is performed at the through holes to obtain three substrate units 11.

[0060] In some embodiments, after dividing the at least two substrate units 11, the inner side surface of the concave cavity 12 forms the side end surface of the substrate unit 11 adjacent to the concave cavity 12. Exemplarily, reference can be made to Figure 5 as shown, which is convenient for dividing the substrate 1 to divide out each substrate unit 11.

[0061] In some embodiments, after dividing the at least two substrate units 11 according to the position of the at least one concave cavity 12, it further includes: using an ion beam to modify the surface to be polished of the substrate unit 11 that has been polished, so that the surface shape accuracy of the surface to be polished of the substrate unit 11 meets the requirements, that is, the mirror surface of the mirror body meets the requirements.

[0062] In some embodiments, obtaining the substrate 1 by processing includes: obtaining the substrate 1 by firing. The integrally formed substrate 1 is obtained by firing, and the obtained substrate 1 has at least one concave cavity 12, and the at least one concave cavity 12 divides at least two substrate units 11. In some embodiments, obtaining the substrate 1 by processing includes: using a material to grow a raw substrate, and processing the concave cavity 12 on the raw substrate to obtain the substrate 1. Processing the raw substrate to process the concave cavity 12 on the raw substrate. Processing the raw substrate includes but is not limited to cutting or turning the raw substrate.

[0063] The mirror body processing method of this embodiment can be applied to process X-ray mirrors, which can be long-strip X-ray mirrors. The mirror body processing method of this embodiment can be applied to process plane mirror bodies, cylindrical mirror bodies, spherical mirror bodies, or tire surface mirror bodies, etc.

[0064] Figure 6 The figure shows a schematic diagram of the existing method for processing an X-ray mirror using a small grinding head for polishing. As shown in the figure, a small-sized grinding disc 4 is used to polish a single mirror body 7. In the mirror body processing method of this embodiment, the substrate is a substrate divided into multiple substrate units. Polishing the preset surface of the substrate can polish the surfaces to be polished of multiple substrate units, which can be considered as array processing of the mirror body, facilitating the use of various processing techniques and formulating appropriate polishing procedures for processing. Compared with using a small-sized grinding disc, a large-sized grinding disc can be used in this method, which has the advantages of reducing medium and high-frequency phenomena, improving polishing efficiency, and reducing polishing time. After processing, the mirror body is obtained by wire cutting. The mirror body can reduce the edge effect and will not show the phenomena of edge collapse and edge warping.

[0065] In the existing method, to improve processing efficiency, multiple long-strip mirror bodies are bonded together with an adhesive for overall processing. However, during polishing, the grinding disc may jump due to the existence of the bonding seam, resulting in changes in the removal amount and affecting the final mirror surface accuracy. When bonding two mirror bodies, local differences in the thickness or density of the adhesive, as well as differences in the thermal expansion coefficients of the adhesive and the mirror surface material during the use of the adhesive, will all cause non-uniform stress, resulting in convex or concave surfaces of the mirror. Long-term storage and vibrations during processing will cause redistribution of the stress in the bonding layer, resulting in slow deformation of the mirror surface. Compared with this existing method, the mirror body processing method of this embodiment can directly use a large-sized grinding disc for array processing of the mirror body, and will not have problems such as non-uniform stress generated during processing due to the use of the adhesive, resulting in mirror surface deformation and unstable removal amount.

[0066] Compared with the traditional method, the mirror body processing method of this embodiment uses array processing. The mirror body is not limited to a plane, and large-aperture cylindrical surfaces, spherical surfaces, or tire surfaces can also be processed and wire cut. Compared with the single-piece processing method of a small grinding head, there are more choices for the size of the grinding disc, polishing path, interval, etc., facilitating the use of various processing techniques and formulating appropriate polishing procedures for processing. Using array processing reduces a large amount of mirror body installation and adjustment time during milling. In the grinding and polishing stages, a large-sized grinding disc is selected for processing. The medium and high-frequency phenomena of the mirror body processed by the large-sized grinding disc are better than those of the small-sized grinding disc. At the same time, the large-sized grinding disc is 2 to 4 times larger than the small-sized grinding disc, and the efficiency in the grinding and polishing stages is several times to more than a dozen times that of the small-sized grinding disc, greatly reducing the polishing time.

[0067] The above has introduced in detail a method for processing a lens body provided by the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements and modifications can still be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A method for processing a lens body, characterized in that, Including: A substrate is processed. The substrate includes a preset surface. At least one concave cavity is provided on a side surface of the substrate away from the preset surface. The at least one concave cavity divides the substrate into at least two substrate units. The surface to be polished of the substrate unit is located on the preset surface. Polish the preset surface of the substrate. Divide the at least two substrate units according to the positions of the at least one concave cavity to obtain at least two mirror bodies.

2. The mirror body processing method according to claim 1, characterized in that The substrate unit is strip-shaped, and the at least one concave cavity divides the substrate into the at least two substrate units arranged side by side.

3. The mirror body processing method according to claim 2, characterized in that, The concave cavity is strip-shaped, and the length direction of the concave cavity is consistent with the length direction of the substrate unit.

4. The method for machining the lens body according to claim 1, wherein, After dividing the at least two substrate units, the inner side surface of the concave cavity forms the side end surface of the substrate unit adjacent to the concave cavity.

5. The mirror body processing method according to claim 1, wherein A through hole is provided at the bottom of the concave cavity, and the through hole penetrates from the bottom of the concave cavity to the preset surface. Dividing the at least two substrate units according to the positions of the at least one concave cavity includes: dividing the substrate according to the position of the through hole to divide out the at least two substrate units.

6. The method for machining a lens body according to claim 1, characterized in that At least two through holes arranged in sequence along the bottom edge of the concave cavity are provided at the bottom edge of the concave cavity, and the through holes penetrate from the bottom of the concave cavity to the preset surface. Dividing the at least two substrate units according to the positions of the at least one concave cavity includes: performing wire cutting on the substrate according to the straight line where the at least two through holes are located to divide out the at least two substrate units.

7. The method for machining a lens body according to claim 1, wherein, Before polishing the preset surface of the substrate, it further includes: A support member is arranged in the concave cavity, and the support member is used to support the area of the preset surface corresponding to the concave cavity.

8. The method for machining a lens body according to claim 1, wherein, Polishing the preset surface of the substrate includes: Place the substrate below the grinding disc. A polishing layer is provided on the grinding disc. The grinding disc is connected to a motion device, and the motion device is used to drive the grinding disc to move. Make the polishing layer of the grinding disc contact the preset surface of the substrate, and the motion device drives the grinding disc to move on the preset surface to polish the preset surface.

9. The method for machining a lens body according to claim 1, wherein, Polishing the preset surface of the substrate includes: Detect the roughness of the preset surface after polishing. When the roughness of the preset surface does not meet the requirements, polish the preset surface of the substrate again until the roughness of the preset surface meets the requirements.

10. The method for machining a lens body according to any one of claims 1 to 9, characterized in that, Processing to obtain the substrate includes: Simulating and modeling the polishing of the preset surface of the substrate to obtain the optimal thickness and optimal width that minimize the deformation of the area corresponding to the concave cavity on the preset surface after polishing the preset surface of the substrate, so as to process the substrate according to the optimal thickness and optimal width. The optimal thickness is the thickness from the bottom surface of the concave cavity to the preset surface, and the optimal width is the width of the concave cavity between two adjacent substrate units.

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