Grinding structure of substrate grinding equipment

Abstract

The invention discloses a grinding structure of substrate grinding equipment, which comprises a grinding disc, a plurality of first light passing pipes and a plurality of second light passing pipes, a plurality of setting holes respectively penetrate through the grinding disc, each first light passing pipe and each second light passing pipe are respectively arranged in each setting hole, each first light passing pipe and each second light passing pipe respectively penetrate through a light channel along the axial direction, and the grinding disc is provided with a plurality of light passing holes. The light-transmitting pieces are arranged on the bottom edges of the first light passing pipes and the bottom edges of the second light passing pipes correspondingly, the communication relation between the light channels and the space below the grinding disc is blocked, and muddy substances or foams generated by the grinding base plate are prevented from entering the light channels.

Description

Technical Field

[0001] The present invention relates to a substrate grinding device; in particular, it refers to a grinding structure of a substrate grinding device. Background Art

[0002] A substrate grinding device mainly drives a grinding cloth to rotate by a grinding disk, and uses the grinding cloth to perform grinding on the upper surface of a substrate disposed below the grinding cloth. The substrate can be a wafer, but is not limited to wafers.

[0003] A thickness measuring device is disposed in the substrate grinding device. During the period when the grinding disk drives the grinding cloth to grind the substrate, the thickness measuring device can simultaneously measure the thickness of the substrate.

[0004] The substrate thickness measuring device is disposed above the grinding disk and includes a light projector, a light receiver, and an arithmetic unit. A plurality of optical channels respectively penetrate through the grinding disk, and each optical channel extends through the grinding cloth. The light projector projects laser light through the optical channel to irradiate the substrate being ground, the light receiver receives the reflected light of the laser light reflected by the substrate, and the arithmetic unit calculates and obtains the thickness of the substrate based on the reflected light.

[0005] The portion of the substrate ground away by the grinding cloth forms powder, and the powder is mixed with the coolant used during grinding to form a slurry-like substance. The substance easily enters and accumulates in the optical channel, hindering the travel of the laser light or the reflected light. The coolant easily generates a number of bubbles due to the relative rotation of the grinding cloth and the substrate, and the bubbles easily enter the optical channel, causing refraction of the laser light or the reflected light, which has an adverse impact on the accuracy of the thickness calculated by the arithmetic unit. Summary of the Invention

[0006] The main object of the present invention is to provide a grinding structure of a substrate grinding device.

[0007] To achieve the foregoing object, the present invention adopts the following technical solutions.

[0008] A grinding structure of a substrate grinding device includes.

[0009] A grinding disk for disposing a grinding cloth to grind a substrate disposed below the grinding cloth.

[0010] A plurality of setting holes respectively penetrate through the grinding disk along the axial direction of the grinding disk, defining a virtual circular line. The center of the circular line is located at the rotation center of the grinding disk, and the diameter direction of the circular line is the same as the diameter direction of the grinding disk. Each setting hole is arranged at intervals along the circular line.

[0011] A plurality of first light pipes and a plurality of second light pipes are respectively disposed in each setting hole, and each first light pipe and each second light pipe respectively penetrate through an optical channel along their axial directions; and.

[0012] A plurality of light-transmitting sheets through which light can penetrate are respectively provided at the bottom edges of each first light pipe and each second light pipe. Each light-transmitting sheet respectively blocks the communication relationship between each light channel and the space below the polishing pad, thereby preventing the slurry-like substances or foams generated during the polishing of the substrate from entering each light channel.

[0013] The present invention can prevent the slurry-like substances or foams from entering each light channel, reduce the influence of the slurry-like substances or foams on the laser light passing through each light channel or its reflected light, and improve the accuracy of the thickness of the substrate obtained by the operation of the thickness measuring device. Brief Description of the Drawings

[0014] Figure 1 It is a partial perspective view of a preferred embodiment of the present invention and a thickness measuring device.

[0015] Figure 2 is Figure 1 a partial enlarged view of

[0016] Figure 3 It is a partial top view of a preferred embodiment of the present invention.

[0017] Figure 4 It is an exploded perspective view of the first light pipe and the first positioning structure of a preferred embodiment of the present invention.

[0018] Figure 5 It is a partial cross-sectional view of a preferred embodiment of the present invention.

[0019] Figure 6 It is an exploded perspective view of the second light pipe and the second positioning structure of a preferred embodiment of the present invention.

[0020] Figure 7 It is a partial cross-sectional view of a preferred embodiment of the present invention, showing the state where the second light pipe is positioned at the first position.

[0021] Figure 8 It is a partial cross-sectional perspective view of a preferred embodiment of the present invention, showing the state where the second light pipe is positioned at the second position. Detailed Description of the Preferred Embodiment

[0022] Please refer to the drawings shown. It is a preferred embodiment of the polishing structure of the substrate grinding equipment of the present invention. However, these embodiments are only for illustrative purposes and are not limited by this structure in the patent application.

[0023] As Figures 1 to 8 shown, the preferred embodiment of the present invention can cooperate with a thickness measuring device 90. During the period when the preferred embodiment polishes a substrate (not shown in the figure), it is not necessary to stop the operation of the preferred embodiment, and the thickness measuring device 90 can simultaneously measure the thickness of the substrate; the substrate can be a wafer, but is not limited to only being a wafer.

[0024] A preferred embodiment of the present invention includes a polishing platen 10, a plurality of first light pipes 20, and a plurality of second light pipes 30. The polishing platen 10 is used to dispose a polishing cloth 92, so that the polishing platen 10 drives the polishing cloth 92 to rotate, thereby polishing a substrate positioned below the polishing cloth 92.

[0025] A plurality of setting holes 12 respectively penetrate through the polishing platen 10 along the axial direction of the polishing platen 10, defining a virtual circular line 13. The center of the circular line 13 is located at the rotation center 14 of the polishing platen 10. The diameter direction of the circular line 13 is the same as the diameter direction of the polishing platen 10, and each setting hole 12 is arranged at intervals along the circular line 13.

[0026] Each first light pipe 20 and each second light pipe 30 are respectively disposed in each setting hole 12. Each first light pipe 20 and each second light pipe 30 respectively penetrate through a light channel 40 along their axial directions. A plurality of light-transmitting sheets 42 through which light can penetrate are respectively disposed at the bottom edges of each first light pipe 20 and each second light pipe 30. Each light-transmitting sheet 42 respectively blocks the communication relationship between each light channel 40 and the space below the polishing platen 10, thereby preventing mud or foam generated during substrate polishing from entering each light channel 40.

[0027] A thickness measuring device 90 is disposed and positioned above the polishing platen 10 and is opposite to any one of the light channels 40. During the process that the polishing platen 10 rotates to drive the polishing cloth 92 to polish the top surface of the substrate, each light channel 40 sequentially passes below the thickness measuring device 90. The thickness measuring device 90 sequentially projects laser light onto the substrate through each light channel 40 and receives the reflected light of the laser light reflected by the substrate through each light channel 40, so that the thickness measuring device 90 calculates and obtains the thickness of the substrate.

[0028] The thickness measuring device 90 is a prior art familiar to those skilled in the art to which the present invention belongs, and the thickness measuring device 90 has no necessary association with the technical features of the present invention. Therefore, the specific composition of the thickness measuring device 90 will not be described in detail.

[0029] In order to enable the laser light and the reflected light to pass through the polishing cloth 92 without being blocked or interfered, the polishing cloth 92 is provided with a plurality of through holes 93. The formation of each through hole 93 is a prior art familiar to those skilled in the art to which the present invention belongs. Each through hole 93 is respectively located at the axial extension of each setting hole 12, and the aperture of each through hole 93 is larger than the aperture of the setting hole 12.

[0030] The bottom ends of each first light pipe 20 and each second light pipe 30 are respectively adjacent to the bottom edge of the polishing platen 10, with the principle of avoiding any first light pipe 20 or any second light pipe 30 contacting the substrate during the period when the substrate is polished by the polishing cloth 92. Accordingly, during the period when the polishing cloth 92 performs grinding processing on the substrate, it is a preferred implementation option that the bottom ends of each first light pipe 20 and each second light pipe 30 are respectively located in the upper range of the bottom edge of the polishing cloth 92.

[0031] During the period when the abrasive cloth 92 grinds the substrate, each first light pipe 20 and each second light pipe 30 respectively rotate around the rotation center 14 along the circular line 13. The grinding disk 10 does not need to stop operating. The thickness measuring device 90 can sequentially project laser light onto the substrate through each light channel 40, and sequentially receive the reflected light of the laser light reflected by the substrate through each light channel 40. The thickness measuring device 90 calculates the thickness of the substrate based on the reflected light.

[0032] The part of the substrate ground and removed by the abrasive cloth 92 forms powder. The powder is mixed with the coolant used during the grinding period to form a slurry-like substance. The slurry-like substance cannot enter through each light-transmitting sheet 42 and accumulates in each light channel 40. The foam generated by the relative rotation of the abrasive cloth and the substrate in the coolant is also blocked by the light-transmitting sheet 42 and cannot enter the light channel. Compared with the prior art, the preferred embodiment can reduce the influence of the slurry-like substance or foam on the laser light or the reflected light, and improve the accuracy of the thickness of the substrate obtained by the thickness measuring device 90.

[0033] Several first positioning structures 50 are respectively connected to each first light pipe 20 to position each first light pipe 20 accordingly. Several second positioning structures 60 are respectively connected to each second light pipe 30 to position each second light pipe 30 accordingly.

[0034] The present invention can optionally configure each first positioning structure 50 for each first light pipe 20 respectively, and optionally not configure each second positioning structure 60 for each second light pipe 30 respectively; the present invention can also optionally configure each second positioning structure 60 for each second light pipe 30 respectively, and optionally not configure each first positioning structure 50 for each first light pipe 20 respectively; thus forming multiple different transformation implementation options.

[0035] Each first positioning structure 50 respectively includes two clamping blocks 52, wherein each clamping block 52 relatively clamps the radial outer periphery of the first light pipe 20, and each clamping block 52 respectively abuts against the top edge of the grinding disk 10 to axially position each first light pipe 20 accordingly.

[0036] Each first positioning structure 50 further respectively includes a first fastening bolt 54 and two first positioning bolts 56. Each first fastening bolt 54 respectively locks the relatively opposed clamping blocks 52, so that each clamping block 52 respectively tightly abuts against the radial outer periphery of each first light pipe 20, improving the stability of each clamping block 52 relatively clamping each first light pipe 20. Each first positioning bolt 56 respectively passes through and pivots each clamping block 52 and screws into the grinding disk 10 to lock each clamping block 52 and the grinding disk 10 accordingly, improving the positioning stability of each first positioning structure 50 on the grinding disk 10.

[0037] Each second positioning structure 60 respectively includes a beam sleeve 61 and a base 62. Each beam sleeve 61 tightly bundles the outer periphery of the radial direction of each second light pipe 30. Each beam sleeve 61 respectively protrudes downward two convex parts 63. Each convex part 63 is arranged at intervals according to the circumferential direction of each beam sleeve 61. Each base 62 respectively abuts against the top edge of the grinding disc 10. Each base 62 respectively protrudes upward two cushion blocks 64. Each cushion block 64 is arranged at intervals according to the circumferential direction of each base 62.

[0038] As Figure 7 shown, when the preferred embodiment performs the grinding operation, each convex part 63 respectively abuts against the top end of each cushion block 64. By using each cushion block 64 to raise the height of each convex part 63, each second light pipe 30 is axially positioned at a virtual first position. At this time, the bottom end of each second light pipe 30 does not protrude from the bottom edge of the grinding cloth 92; As Figure 8 shown, when setting or replacing the grinding cloth 92, select to stagger each convex part 63 and each cushion block 64, so that the bottom edge of each convex part 63 respectively abuts against the top edge of the base 62, and the top edge of each cushion block 64 respectively abuts against the bottom edge of the beam sleeve 61, reducing the height of each beam sleeve 61, so that each second light pipe 30 is axially positioned at a virtual second position. At this time, the bottom end of each second light pipe 30 protrudes more downward from the bottom edge of the grinding disc 10, and can cooperate with a plurality of through holes 93 penetrating the grinding cloth 92 to guide the positioning of the grinding cloth 92, improving the operation convenience of setting the grinding cloth 92.

[0039] The number of convex parts 63 respectively formed by each beam sleeve 61 can be increased or decreased as needed, but it is limited to forming one convex part 63 for each beam sleeve 61. The number of cushion blocks 64 respectively formed by each base 62 can be increased or decreased as needed, but it is limited to forming one cushion block 64 for each base 62, and the number of cushion blocks 64 is not less than the number of convex parts 63.

[0040] Each beam sleeve 61 respectively forms a gap 65 along its radial direction. Each gap 65 respectively extends to the outer periphery and inner periphery of the radial direction of each beam sleeve 61. Each beam sleeve 61 respectively screws a second fastening bolt 66, thereby reducing the width of each gap 65, contracting the inner periphery of the radial direction of each beam sleeve 61, making each beam sleeve 61 closely adhere to the outer periphery of the radial direction of the second light pipe 30, and improving the bonding strength between each beam sleeve 61 and each second light pipe 30.

[0041] Each second positioning structure 60 respectively further includes two second positioning bolts 67. Each second positioning bolt 67 respectively passes through and pivots the base 62 and screws into the grinding disc 10, thereby locking the base 62 and the grinding disc 10, and improving the positioning stability of each second positioning structure 60 on the grinding disc 10.

[0042] Each second light pipe 30 respectively forms a first groove 32 and a second groove 34 at intervals along its radial outer periphery in the axial direction. Each first groove 32 and each second groove 34 respectively form a ring around the radial outer periphery of each second light pipe 30 along the circumferential direction. Each second positioning structure 60 further respectively includes a set screw 68. Each set screw 68 is respectively screwed radially into each base 62. When each second light pipe 30 is positioned at the first position, each set screw 68 respectively enters each first groove 32. When each second light pipe 30 is to move downward and be positioned at the second position, rotate each set screw 68 to make it respectively withdraw from each first groove 32. After each second light pipe 30 is positioned at the second position, rotate each set screw 68 again to make it respectively enter each second groove 34, so as to improve the positioning stability of each second light pipe 30 at the first position or the second position by using each set screw 68 respectively.

[0043] Each second positioning structure 60 further respectively includes two coupling bolts 69, and each coupling bolt 69 is respectively axially connected and constituted by a cap portion 692, a connecting rod section 694 and a screw rod section 696 in sequence.

[0044] When each second light pipe 30 is positioned at the first position, each screw rod section 696 respectively penetrates through each sleeve 61 and then is screwed to each spacer 64, and each cap portion 692 respectively abuts against the top edge of each sleeve 61, so as to improve the positioning stability of each sleeve 61 relative to each base 62 respectively. The vibration that may be generated during the grinding process will not affect the relative positioning of each sleeve 61 and each base 62 respectively, and each second light pipe 30 can be more stably positioned at the first position.

[0045] When each second light pipe 30 is axially positioned at the second position, each screw rod section 696 respectively withdraws from each spacer 64 and is respectively screwed to each sleeve 61, and each cap portion 692 respectively leaves the top end of each sleeve 61. Accordingly, each coupling bolt 69 will not limit the operation of the relative dislocation of each convex portion 63 and each spacer 64 respectively. To meet the need of setting or replacing the abrasive cloth 92, during the operation process of changing the positioning of each second light pipe 30 from the first position to the second position, each coupling bolt 69 respectively maintains the connection with each sleeve 61, which can avoid the loss of each coupling bolt 69.

[0046] Each first light pipe 20 and each second light pipe 30 respectively form two stop portions 44, and each stop portion 44 is respectively located at the bottom edge of each light-transmitting sheet 42, so as to position each light-transmitting sheet 42 accordingly; the number of the stop portions 44 can be increased or decreased as needed, but it is a principle that each first light pipe 20 and each second light pipe 30 respectively form at least one stop portion 44.

Claims

1. Grinding structure of a substrate grinding device, comprising: A grinding disc for setting a grinding cloth to grind a substrate disposed below the grinding cloth; characterized in that A plurality of setting holes respectively penetrate the grinding disc along the axial direction of the grinding disc, defining a virtual circular line, the center of the circular line is located at the rotation center of the grinding disc, the diameter direction of the circular line is the same as the diameter direction of the grinding disc, and each setting hole is arranged at intervals along the circular line; A plurality of first light pipes and a plurality of second light pipes are respectively disposed in each setting hole, and each first light pipe and each second light pipe respectively penetrate a light channel along their axial directions; and A plurality of light-transmitting sheets through which light can penetrate are respectively disposed at the bottom edges of each first light pipe and each second light pipe, and each light-transmitting sheet respectively blocks the communication relationship between each light channel and the space below the grinding disc, thereby preventing slurry-like substances or foam generated during grinding of the substrate from entering each light channel.

2. The grinding structure of the substrate grinding equipment according to claim 1, characterized in that A plurality of first positioning structures are respectively connected to each first light pipe; Each first positioning structure respectively includes two clamping blocks, wherein each clamping block relatively clamps the radial outer periphery of the first light pipe, and each clamping block respectively abuts against the top edge of the grinding disc, thereby axially positioning each first light pipe.

3. The grinding structure of the substrate grinding equipment according to claim 1 or 2, characterized in that A plurality of second positioning structures are respectively connected to each second light pipe; Each second positioning structure respectively includes a sleeve and a base, wherein each sleeve respectively tightly clamps the radial outer periphery of each second light pipe, each sleeve respectively protrudes downward a convex portion, each base respectively abuts against the top edge of the grinding disc, and each base respectively protrudes upward a cushion block, so that each second light pipe is respectively axially positioned at a first position or a second position.

4. The grinding structure of the substrate grinding equipment according to claim 3, characterized in that Each sleeve respectively forms a gap along its radial direction, each gap respectively extends to the radial outer periphery and the radial inner periphery of each sleeve, and each sleeve is respectively screwed with a second fastening bolt, thereby constricting the radial inner periphery of each sleeve.

5. The grinding structure of the substrate grinding equipment according to claim 1, characterized in that Each first light pipe and each second light pipe respectively form two stop portions, and each stop portion is respectively located at the bottom edge of each light-transmitting sheet, thereby positioning each light-transmitting sheet.

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