Antistatic epoxy packaging film, preparation method thereof and filter chip packaging structure

Abstract

The invention provides an antistatic epoxy packaging film and a preparation method thereof, and a filter chip packaging structure, and relates to the technical field of filter chip packaging, the antistatic epoxy packaging film comprises the following components by mass: 46%-60% of silica, 17%-25% of epoxy resin, 2%-5% of phenoxy resin, 18%-24% of a phenolic curing agent, 0.3%-0.5% of an imidazole accelerator, and 0.2%-0.3% of carbon black; the epoxy resin is composed of bisphenol F type epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50000-53000, and the phenolic aldehyde curing agent is composed of solid phenolic resin and liquid phenolic resin; the antistatic epoxy resin packaging film is prepared by introducing the antistatic epoxy resin and adopting a specific formula proportion, the antistatic epoxy packaging film has excellent antistatic property and mechanical property, and after a filter chip is packaged, filter products which are packaged perfectly and qualified can be quickly screened out through a sorting machine.

Description

Technical Field

[0001] The present invention belongs to the technical field of filter chip packaging, and particularly relates to an antistatic epoxy packaging film, a preparation method thereof, and a filter chip packaging structure. Background Art

[0002] After the filter is encapsulated with an epoxy resin film, it is marked and cut into single encapsulated filter chips. During sorting, due to the good insulation of the epoxy resin film and its high surface resistance value, it is easy to be adsorbed on the machine due to static electricity during the rotation and friction of the sorting machine, making it impossible to select normally, affecting production efficiency, and even unable to continue the subsequent processes.

[0003] Currently, the surface resistance value of the epoxy resin film is between 10 14 ~10 18 Ω, which gives it good insulation performance, but the surface resistance value is relatively high, and its charge discharge speed is slow, resulting in a longer time for the charge to be released through the material surface. The accumulation of surface charges will cause problems such as electrostatic discharge, dust absorption, and electrostatic adsorption. To make the epoxy resin film have an antistatic surface resistance value between 10 9 ~10 12 Ω, it can be improved by adding antistatic agents, conductive fillers, conductive fibers, graphite, etc. to the epoxy resin matrix. However, when adding antistatic materials, the influence on the epoxy resin matrix needs to be comprehensively considered. Therefore, how to provide an antistatic epoxy packaging film that can make the epoxy packaging film have antistatic properties by adjusting the formulation ratio, can operate normally during the sorting process, and does not affect its original use performance is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of the present invention is to provide an antistatic epoxy packaging film, a preparation method thereof, and a filter chip packaging structure to solve at least one of the above technical problems.

[0005] To achieve the above purpose, in the first aspect of the present invention, an antistatic epoxy packaging film is provided. The antistatic epoxy packaging film includes the following components by mass percentage: 46% - 60% of silicon dioxide, 17% - 25% of epoxy resin, 2% - 5% of phenoxy resin, 18% - 24% of phenolic curing agent, 0.3% - 0.5% of imidazole accelerator, and 0.2% - 0.3% of carbon black; the epoxy resin is composed of bisphenol F type epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50000 - 53000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin.

[0006] In a first aspect, the epoxy encapsulation film comprises the following components by mass percentage: 50% - 60% silica, 17% - 23% bisphenol F type epoxy resin, 0.5% - 2% antistatic epoxy resin, 2% - 5% phenoxy resin, 18% - 24% phenolic curing agent, 0.3% - 0.5% imidazole accelerator, 0.2% - 0.3% carbon black; the phenolic curing agent consists of solid phenolic resin and liquid phenolic resin.

[0007] In the first aspect, the mass ratio of the solid phenolic resin to the liquid phenolic resin is 2:1.

[0008] In the first aspect, the hydroxyl equivalent of the solid phenolic epoxy resin is 165 - 177 g / eq; the hydroxyl equivalent of the liquid phenolic epoxy resin is 130 - 152 g / eq.

[0009] In the first aspect, the epoxy equivalent of the bisphenol F type epoxy resin is 150 - 166 g / eq; the epoxy equivalent of the antistatic epoxy resin is 210 - 250 g / eq.

[0010] In the first aspect, the particle size D50 of the silica is 6 μm and D99 is 20 μm.

[0011] In the first aspect, the imidazole accelerator includes 2 - methylimidazole.

[0012] In a second aspect of the present invention, there is provided a method for preparing the antistatic epoxy encapsulation film described in the first aspect. The preparation method includes: stirring and mixing each component of the raw materials according to their respective mass percentages, grinding the mixed components to a paste by a bead mill, then obtaining a slurry through vacuum degassing, coating the slurry on a base film by a coater, and removing the base film after drying to obtain the antistatic epoxy encapsulation film; the thickness of the antistatic epoxy encapsulation film is 200 - 300 μm.

[0013] In a third aspect of the present invention, there is provided a method for encapsulating a filter chip encapsulation structure. The encapsulation method includes: stirring, mixing, bead milling and vacuum degassing each component in the antistatic epoxy encapsulation film described in the first aspect to obtain a mixed slurry; coating the mixed slurry on a base film and drying it, thereby obtaining the antistatic epoxy encapsulation film on the base film; covering the antistatic epoxy encapsulation film above and around the filter chip and fitting it with the substrate below by vacuum hot pressing to complete the encapsulation of the filter chip; the conditions of the vacuum hot pressing include: the pressure is 0.1 - 0.2 MPa, the temperature is 60 - 70 °C, and the time is 10 - 30 s; cutting the well - encapsulated filter chip structure to obtain well - encapsulated single - filter finished products.

[0014] In the fourth aspect of the present invention, a filter chip packaging structure is provided. The filter chip packaging structure includes: a filter component, a substrate, and the antistatic epoxy packaging film described in the first aspect. The filter component is connected to the substrate through a plurality of spaced metal balls to form a cavity, and the antistatic epoxy packaging film is covered above and around the filter component and adhered to the underlying substrate by means of vacuum hot pressing.

[0015] Beneficial effects: The present invention provides an antistatic epoxy packaging film, which includes the following components by mass percentage: 46% - 60% of silicon dioxide, 17% - 25% of epoxy resin, 2% - 5% of phenoxy resin, 18% - 24% of phenolic curing agent, 0.3% - 0.5% of imidazole accelerator, and 0.2% - 0.3% of carbon black; the epoxy resin is composed of bisphenol F type epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50,000 - 53,000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin; by using bisphenol F type epoxy resin and antistatic epoxy resin as the matrix materials to provide the basic properties of the system, and forming a conductive network in the system to effectively transfer and disperse charges, prevent static electricity accumulation, and achieve the antistatic effect; at the same time, combining with phenoxy resin to improve the toughness and strength of the system, and using a phenolic curing agent composed of solid phenolic resin and liquid phenolic resin to react with the matrix materials to ensure that the performance of the antistatic epoxy packaging film meets the requirements of filter chip packaging. The present invention prepares an antistatic epoxy packaging film with excellent antistatic and mechanical properties by introducing antistatic epoxy resin and using a specific formulation ratio. After packaging the filter chip, the well-packaged and qualified filter products can be quickly screened out by a sorting machine. Description of the drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present specification or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the following described drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 It is a schematic flowchart of the packaging method of a filter chip packaging structure provided by the present invention; Figure 2 It is a schematic structural diagram of a filter chip packaging structure provided by the present invention; Reference numerals: 1. Filter component; 2. Substrate; 3. Antistatic epoxy packaging film; 4. Metal ball; 5. Cavity. Detailed implementation manners

[0018] The present invention will be specifically described below in conjunction with specific embodiments and examples, and the advantages and various effects of the present invention will be presented more clearly therefrom. Those skilled in the art should understand that these specific embodiments and examples are for illustrating the present invention rather than limiting the present invention.

[0019] Throughout the specification, unless otherwise specifically stated, the terms used herein should be understood as having the meanings commonly used in the art. Therefore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as the general understanding of those skilled in the art to which the present invention pertains. In case of any contradiction, this specification shall prevail.

[0020] Unless otherwise specifically stated, various raw materials, reagents, instruments, equipment, etc. used in the present invention can be obtained through market purchase or by existing methods.

[0021] An antistatic epoxy encapsulation film provided by the present application, the antistatic epoxy encapsulation film comprises the following components in mass percentage: 46% - 60% of silicon dioxide, 17% - 25% of epoxy resin, 2% - 5% of phenoxy resin, 18% - 24% of phenolic curing agent, 0.3% - 0.5% of imidazole accelerator, 0.2% - 0.3% of carbon black; the epoxy resin is composed of bisphenol F type epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50000 - 53000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin.

[0022] Specifically, the present invention provides an antistatic epoxy encapsulation film, which comprises the following components by mass percentage: 46% - 60% of silicon dioxide, 17% - 25% of epoxy resin, 2% - 5% of phenoxy resin, 18% - 24% of phenolic curing agent, 0.3% - 0.5% of imidazole accelerator, and 0.2% - 0.3% of carbon black; the epoxy resin is composed of bisphenol F type epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50,000 - 53,000, and the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin; by using bisphenol F type epoxy resin and antistatic epoxy resin as the matrix materials, basic properties are provided for the system, and a conductive network is formed in the system to effectively transfer and disperse charges, prevent static electricity accumulation, and achieve the antistatic effect; at the same time, the toughness and strength of the system are improved by combining with phenoxy resin, and the phenolic curing agent composed of solid phenolic resin and liquid phenolic resin is used to react with the matrix materials to ensure that the properties of the antistatic epoxy encapsulation film meet the requirements of filter chip encapsulation. The present invention prepares an antistatic epoxy encapsulation film with excellent antistatic property and mechanical properties by introducing antistatic epoxy resin and using a specific formulation ratio. After encapsulating the filter chip, the well-encapsulated and qualified filter products can be quickly screened out by a sorting machine.

[0023] In some possible embodiments, the epoxy encapsulation film comprises the following components by mass percentage: 50% - 60% of silicon dioxide, 17% - 23% of bisphenol F type epoxy resin, 0.5% - 2% of antistatic epoxy resin, 2% - 5% of phenoxy resin, 18% - 24% of phenolic curing agent, 0.3% - 0.5% of imidazole accelerator, and 0.2% - 0.3% of carbon black; the phenolic curing agent is composed of solid phenolic resin and liquid phenolic resin.

[0024] Specifically, in the present invention, the mass percentage of bisphenol F type epoxy resin is 17% - 23%, and the mass percentage of antistatic epoxy resin is 0.5% - 2%. By adding a small amount of antistatic epoxy resin to the epoxy system, the surface resistance value of the material can be reduced, so that the epoxy encapsulation film has good antistatic performance and improves the subsequent sorting efficiency. Selecting the antistatic epoxy resin containing single-walled carbon nanotubes can simplify the treatment of single-walled carbon nanotubes in the form of its pre-dispersion, avoiding the problem of poor compatibility with other raw materials, enabling the single-walled carbon nanotubes in the antistatic epoxy resin to be uniformly dispersed in the system without changing the viscosity of the system. Further, the unique one-dimensional quantum structure in the single-walled carbon nanotubes can be utilized. The carbon atoms are mainly sp² hybridized, forming a large number of delocalized π bonds, and electrons can move freely therein, having good conductivity. At the same time, the single-walled carbon nanotubes have an extremely high aspect ratio and are easy to contact each other in the material to form a conductive network, thereby effectively transferring and dispersing charges, preventing electrostatic accumulation, achieving the antistatic effect, and then quickly screening out the well-encapsulated and qualified filter chips through a sorting machine.

[0025] In some possible embodiments, the mass ratio of the solid phenolic resin to the liquid phenolic resin is 2:1.

[0026] In some possible embodiments, the hydroxyl equivalent of the solid phenolic epoxy resin is 165 - 177 g / eq; the hydroxyl equivalent of the liquid phenolic epoxy resin is 130 - 152 g / eq.

[0027] In the present application, the curing agent is compounded by a solid phenolic resin and a liquid phenolic resin with a mass ratio of 2:1. Through this ratio, the viscosity of the system can be controlled, enabling the silica and carbon black to be uniformly dispersed in the system and improving the flatness of the film surface after curing.

[0028] In some possible embodiments, the epoxy equivalent of the bisphenol F type epoxy resin is 150 - 166 g / eq; the epoxy equivalent of the antistatic epoxy resin is 210 - 250 g / eq.

[0029] In some possible embodiments, the particle size D50 of the silica is 6 μm and D99 is 20 μm.

[0030] In some possible embodiments, the imidazole accelerator includes 2-methylimidazole.

[0031] In the present application, the epoxy equivalent of the epoxy resin and the hydroxyl equivalent of the curing agent are defined to facilitate the regulation of the curing reaction, and an imidazole accelerator is combined to further regulate the reaction rate. Further, silica is used as a filler, and by controlling the particle size of the silica, the thermal expansion coefficient of the antistatic epoxy encapsulation film is reduced, so as to improve the adhesion to the filter components, thereby preventing foreign objects from entering the cavity of the filter components and affecting the packaging reliability of the filter chip.

[0032] Based on a general inventive concept, the present application also provides a method for preparing the antistatic epoxy encapsulation film described in the first aspect. The preparation method includes: stirring and mixing each component of the raw materials according to their respective mass percentages, grinding the mixed components to a paste by a bead mill, then obtaining a slurry through vacuum degassing, coating the slurry on a base film by a coater, and drying to remove the base film to obtain the antistatic epoxy encapsulation film; the thickness of the antistatic epoxy encapsulation film is 200 - 300 μm.

[0033] Based on a general inventive concept, please refer to Figure 1 , the present application also provides a packaging method for a filter chip packaging structure. The packaging method includes: S1. Stirring and mixing, bead milling, and vacuum degassing each component in the antistatic epoxy encapsulation film described in the first aspect to obtain a mixed slurry; S2. Coating the mixed slurry on a base film and drying, that is, obtaining the antistatic epoxy encapsulation film on the base film; S3. Covering the antistatic epoxy encapsulation film above and around the filter chip structure and fitting it with the substrate below by vacuum hot pressing to complete the packaging of the filter chip structure; the conditions of the vacuum hot pressing include: the pressure is 0.1 - 0.2 MPa, the temperature is 60 - 70 °C, and the time is 10 - 30 s; S4. Cutting the well-packaged filter chip structure to obtain single well-packaged filter finished products.

[0034] Specifically, the present invention mixes each component of the raw materials according to a specific formulation ratio, obtains a uniformly dispersed mixed slurry after bead milling and vacuum degassing, then coats the mixed slurry on a base film for drying, so as to obtain the antistatic epoxy encapsulation film on the base film. Then, the antistatic epoxy encapsulation film is covered above and around the filter chip structure to be packaged and fitted with the substrate below by vacuum hot pressing to complete the packaging of the filter chip structure. Finally, the well-packaged filter chip structure is cut, and qualified single filter finished products that meet the requirements are screened out by a sorting machine. In addition, antistatic epoxy encapsulation films with different thicknesses can be prepared according to different epoxies used.

[0035] Based on a general inventive concept, please refer to Figure 2 , the present application also provides a filter chip packaging structure, which includes: a filter component 1, a substrate 2, and the antistatic epoxy packaging film 3 described in the first aspect. The filter component 1 is connected to the substrate 2 through a plurality of spaced metal balls 4 to form a cavity 5. The antistatic epoxy packaging film 3 is covered above and around the filter component 1 and adhered to the substrate 2 below by means of vacuum hot pressing.

[0036] The following will further elaborate on the present application in combination with specific embodiments. It should be understood that these embodiments are only used to illustrate the present application and not to limit the scope of the present application. The experimental methods without specific conditions noted in the following embodiments are usually determined according to national standards. If there is no corresponding national standard, they are carried out according to general international standards, conventional conditions, or conditions recommended by the manufacturer.

[0037] The specific raw materials used in the examples and comparative examples are as follows: Bisphenol F type epoxy resin: South Asia Epoxy Resin (Kunshan) Co., Ltd.: NPEF-170; Antistatic epoxy resin: Dalian Liansheng New Materials Group Co., Ltd.: LSE-107; Phenoxy resin: Mitsubishi Chemical: 1256; Solid phenolic resin: Shandong Shengquan New Materials Co., Ltd.: SH-4064; Liquid phenolic resin: MEWA Chemical Co., Ltd.: MTH-8000; Accelerator: Jinan Zhongwei Chemical Co., Ltd.: 2-MI; Antistatic agent: Nanbao Advanced Materials Co., Ltd.: S-20; Conductive carbon black: CABOT Corporation: XC72; Carbon black: Orion (China) Investment Co., Ltd.; Silica: Jiangsu Lianrui New Materials Co., Ltd.

[0038] The raw material components in Examples 1-5 and Comparative Examples 1-8 of the present application are as shown in Tables 1-2 by mass percentage: Table 1 Component ratios of raw materials in examples Table 2 Component ratios of raw materials in comparative examples Performance tests were carried out on the epoxy packaging films provided in Examples 1-5 and Comparative Examples 1-8. The specific test process is as follows: 1. Surface resistance value: Reference standard: GB / T33398: Cut a 90×90 mm film material, thermally transfer it to a thickness of 1000 - 1200 μm on a hot plate at 100 °C, then cure it under the conditions of 150 °C / 2H. After curing, use a resistance meter to measure the surface resistance value, measure 3 times at different positions and take the maximum value of the measurement; 2. Film tensile strength: Cut a 10 mm×50 mm film material, tear off the light release film, stick both ends of the specimen with tape, clamp the tapes at both ends with the fixtures of a universal material testing machine, tear off the heavy release film, and test the tensile strength of the film; 3. Storage modulus: Reference standard: ASTM E2254-2018. Take a sample cured completely at 150 °C / 2H, prepare the test sample with dimensions of 55 mm×10 mm×2 mm, measurement mode: dual cantilever mode, vibration frequency: 1 Hz, amplitude: 10 μm, heating rate: 5 °C / min, and take the value of the storage modulus at 25 °C; 4. Glass transition temperature Tg: Reference standard: ASTM E2254-2018. Take a sample cured completely at 150 °C / 2H, prepare the test sample with dimensions of 55 mm×10 mm×2 mm, measure it using DMA, measurement mode: dual cantilever mode, vibration frequency: 1 Hz, amplitude: 10 μm, heating rate: 5 °C / min; 5. Water absorption rate: Cut a 50 mm×50 mm film material, weigh it after curing at 150 °C / 2H (initial weight), then completely immerse the cured film sample vertically into a glass container filled with distilled water at 25 ± 1 °C, take it out after soaking for 24 h, dry the surface moisture and weigh it immediately (wet weight), and calculate the water absorption rate according to the following formula: Water absorption rate = (wet weight - initial weight) / initial weight × 100%; 6. Rheological test: Cut a 50×50 mm film material, thermally transfer it to a thickness of 1000 - 1200 μm on a hot plate at 100 °C, then cut it into circular pieces with a diameter of 20 mm, test its viscosity with a rheometer, set the fixed force to 2 N, adopt a heating program: heat from 25 °C to 150 °C, heating rate: 5 °C / min, and read the rheological viscosities at 60 °C and 70 °C.

[0039] The test results are shown in Table 3 below: Table 3 Test Results As can be seen from the above table: (1) In Comparative Example 1, antistatic epoxy resin was not used. In Comparative Example 2, the addition amount of antistatic epoxy resin was low, and the surface resistance value of the prepared epoxy encapsulation film was high, failing to achieve the antistatic effect and affecting the subsequent sorting process of the filter chip. In Comparative Example 3, the addition amount of antistatic epoxy resin was high. Although the prepared epoxy encapsulation film had a low surface resistance value, its rheological viscosity increased greatly, and poor embedding was likely to occur during vacuum hot pressing, resulting in the inability of the epoxy encapsulation film to adhere to the substrate, and foreign matters were likely to enter the cavity, affecting the normal operation of the filter chip. Therefore, in this application, it is necessary to control the addition ratio of antistatic epoxy resin. (2) In Comparative Examples 4 and 5, antistatic epoxy resin was not used, and antistatic agent S-20 was selected to be added to the system. From the experimental data, it can be seen that more mass of antistatic agent needs to be added for the prepared epoxy encapsulation film to meet the antistatic requirements, but its corresponding rheological viscosity will also decrease sharply, causing the glue to penetrate into the filter cavity during the vacuum hot pressing stage and affecting the normal operation of the filter chip. (3) In Comparative Examples 6 and 7, antistatic epoxy resin was not used, and antistatic material conductive carbon black was selected to be added to the system. From the experimental data, it can be seen that even if the addition ratio of conductive carbon black is much larger than that of antistatic epoxy resin, the surface resistance value of the prepared epoxy encapsulation film is still large, which is not conducive to the subsequent sorting machine to screen the filter chips. (4) In Comparative Example 8, although the addition ratio of antistatic epoxy resin was within the specified range, the addition ratios of silica, bisphenol F type epoxy resin, and phenolic curing agent were not within the specified range. Although the surface resistance value of the prepared epoxy encapsulation film could meet the use requirements, its rheological viscosity was low and the water absorption rate was high. During the vacuum hot pressing stage, the glue was likely to penetrate into the filter cavity, affecting the normal operation of the filter chip. Further, in Comparative Examples 4-8, the water absorption rate of the epoxy encapsulation film was large, and water molecules were likely to enter the filter chip from the outside through the epoxy encapsulation film by diffusion, damaging the filter chip. (5) In Examples 1-5, the addition amount of antistatic epoxy resin was 0.5%-2%. By a very low addition ratio, the surface resistance value of the epoxy encapsulation film could be reduced, and the rheological viscosity, film tensile strength, and storage modulus of the epoxy encapsulation film were all within the use requirements, and there would be no problems such as poor embedding or serious glue penetration during the vacuum hot pressing stage.

[0040] In summary, through a specific formulation composition and adjustment of the ratio between raw material components in this application, the prepared epoxy encapsulation film has excellent antistatic performance, can solve the problem of electrostatic adsorption in the subsequent sorting stage, and can completely adhere to the surface of the filter chip structure and the substrate and form a cavity during the vacuum hot pressing stage, preventing foreign matters from infiltrating into the cavity, and improving the reliability and lifespan of the filter chip encapsulation.

[0041] Finally, it should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or apparatus comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or apparatus.

[0042] Although the preferred embodiments of the present invention have been described, additional changes and modifications can be made to these embodiments by those skilled in the art once they learn the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0043] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. An antistatic epoxy encapsulation film, characterized in that, The antistatic epoxy encapsulation film comprises the following components by mass percentage: 46% - 60% of silicon dioxide, 17% - 25% of epoxy resin, 2% - 5% of phenoxy resin, 18% - 24% of phenolic curing agent, 0.3% - 0.5% of imidazole accelerator, and 0.2% - 0.3% of carbon black; the epoxy resin consists of bisphenol F type epoxy resin and antistatic epoxy resin, and the antistatic epoxy resin contains single-walled carbon nanotubes; the molecular weight of the phenoxy resin is 50,000 - 53,000, and the phenolic curing agent consists of solid phenolic resin and liquid phenolic resin.

2. The antistatic epoxy encapsulation film according to claim 1, wherein The antistatic epoxy encapsulation film comprises the following components by mass percentage: 50% - 60% of silicon dioxide, 17% - 23% of bisphenol F type epoxy resin, 0.5% - 2% of antistatic epoxy resin, 2% - 5% of phenoxy resin, 18% - 24% of phenolic curing agent, 0.3% - 0.5% of imidazole accelerator, and 0.2% - 0.3% of carbon black; the phenolic curing agent consists of solid phenolic resin and liquid phenolic resin.

3. The antistatic epoxy encapsulation film according to claim 1 or 2, characterized in that, The mass ratio of the solid phenolic resin to the liquid phenolic resin is 2:

1.

4. The antistatic epoxy encapsulation film according to claim 1 or 2, wherein The hydroxyl equivalent of the solid phenolic epoxy resin is 165 - 177 g / eq; the hydroxyl equivalent of the liquid phenolic epoxy resin is 130 - 152 g / eq.

5. The antistatic epoxy encapsulation film according to claim 1, characterized in that, The epoxy equivalent of the bisphenol F type epoxy resin is 150 - 166 g / eq; the epoxy equivalent of the antistatic epoxy resin is 210 - 250 g / eq.

6. The antistatic epoxy encapsulation film according to claim 1, characterized in that, The particle size D50 of the silicon dioxide is 6 μm, and D99 is 20 μm.

7. The antistatic epoxy encapsulation film according to claim 1, wherein The imidazole accelerator includes 2-methylimidazole.

8. A method for preparing the antistatic epoxy encapsulation film according to any one of claims 1-7, characterized in that, The preparation method includes: Stir and mix each component of the raw materials according to their respective mass percentages, grind the mixed components to a paste by a bead mill, then obtain a slurry through vacuum degassing, coat the slurry on a base film by a coater, and remove the base film after drying to obtain the antistatic epoxy encapsulation film; the thickness of the antistatic epoxy encapsulation film is 200 - 300 μm.

9. A packaging method for a filter chip packaging structure, characterized in that The encapsulation method includes: Stir and mix, bead mill, and vacuum degas each component in the antistatic epoxy encapsulation film according to any one of claims 1 - 7 to obtain a mixed slurry; Coat the mixed slurry on a base film and dry it, then an antistatic epoxy encapsulation film is obtained on the base film; Cover the antistatic epoxy encapsulation film above and around the filter chip and bond it to the substrate below by vacuum hot pressing to complete the encapsulation of the filter chip; the conditions of the vacuum hot pressing include: the pressure is 0.1 - 0.2 MPa, the temperature is 60 - 70 °C, and the time is 10 - 30 s; Cut the well-encapsulated filter chip structure to obtain a single well-encapsulated filter finished product.

10. A filter chip packaging structure, characterized in that, The filter chip packaging structure includes: a filter component, a substrate, and the antistatic epoxy packaging film according to any one of claims 1-7. The filter component is connected to the substrate through a plurality of spaced metal balls to form a cavity, and the antistatic epoxy packaging film is covered above and around the filter component and adhered to the substrate below by means of vacuum hot pressing.

Images