Heat transfer device

Abstract

The invention discloses a heat transfer device which comprises a first heat conduction shell, a second heat conduction shell and at least one condensation protruding block. The first heat conduction shell is arranged on the second heat conduction shell, so that the first heat conduction shell and the second heat conduction shell jointly form a liquid-tight cavity; the first heat conduction shell is provided with a condensation face facing the second heat conduction shell, at least one condensation protruding block is arranged on the condensation face, and the outer surface of the condensation protruding block and the condensation face jointly form a heat exchange face of the condensation end.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and in particular to a heat transfer device capable of increasing the heat exchange area of the condensation end. Background Art

[0002] Most of the heat transfer devices in the existing heat dissipation technologies use heat pipes in cooperation with heat pipes to transfer heat, and use radiators (such as fins and fans) for heat dissipation. The heat generated by the heating element is first transferred to the heat pipe, and then the heat pipe transfers the heat to the radiator through the heat pipe for heat dissipation.

[0003] The technical principle of the heat pipe is similar to that of the heat pipe, but there are differences in the conduction methods. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum chamber heat pipe is conducted on a two-dimensional plane, so the efficiency is higher. Specifically, the heat pipe mainly consists of an upper cover, upper cover capillaries, lower cover capillaries, a lower cover, and a support structure; the upper cover is stacked on the lower cover to form a hollow chamber, and the hollow chamber is used for filling a working fluid. The capillary structure is arranged in the hollow chamber. The lower cover is set as the evaporation end close to the heat source, so the heated part of the cavity is called the evaporation area; the upper cover is set as the condensation end far from the heat source, and the heat-dissipating part of the cavity is called the condensation area. The working fluid absorbs heat and vaporizes in the evaporation area and quickly expands to the entire cavity. It releases heat and condenses into a liquid state in the condensation area. Then, the liquid working medium returns to the evaporation area through the capillary structure to form a cooling cycle.

[0004] However, it is found in actual use that the inner cavity plane of the upper cover mostly adopts a flat design, and the upper cover capillaries are generally sintered or not provided on the inner cavity plane. This structure makes the structure of the inner cavity plane (i.e., the condensation surface) of the upper cover single, so that the relative heat exchange area of the inner cavity plane (i.e., the condensation surface) is limited, and further reduces the heat dissipation effect of the heat transfer device.

[0005] Therefore, how to improve the heat dissipation effect by increasing the heat exchange area of the condensation end is a major problem that the inventors of this case are eager to solve. Summary of the Invention

[0006] The present invention aims to provide a heat transfer device to improve the heat dissipation effect by increasing the heat exchange area of the condensation end.

[0007] A heat transfer device of the present invention, wherein, includes:

[0008] A first heat conducting shell;

[0009] A second heat conducting shell, the first heat conducting shell is installed on the second heat conducting shell so that the first heat conducting shell and the second heat conducting shell jointly form a liquid-tight chamber;

[0010] At least one condensation bump, the first heat conducting shell has a condensation surface facing the second heat conducting shell, at least one of the condensation bumps is arranged on the condensation surface, and the outer surface of the condensation bump and the condensation surface together form a heat exchange surface at the condensation end. After vaporization, the condensed working medium liquefies through the heat exchange surface and then flows back to the evaporation end.

[0011] The heat transfer device as described above, wherein, the second heat conducting shell includes:

[0012] A bottom plate; and

[0013] A first recessed structure, recessed and extending away from the first heat conducting shell from the bottom plate;

[0014] Wherein, at least one of the condensation bumps is arranged in the area on the condensation surface corresponding to the first recessed structure.

[0015] The heat transfer device as described above, wherein, the second heat conducting shell further includes: a second recessed structure, the second recessed structure recessed and extending away from the first heat conducting shell from the inner surface of the first recessed structure, and at least one of the condensation bumps is arranged in the area on the condensation surface corresponding to the second recessed structure.

[0016] The heat transfer device as described above, wherein, the second heat conducting shell includes:

[0017] A bottom plate; and

[0018] A first recessed structure, recessed and extending away from the first heat conducting shell from the bottom plate;

[0019] A second recessed structure, the second recessed structure recessed and extending away from the first heat conducting shell from the inner surface of the first recessed structure, and at least one of the condensation bumps is arranged in the area on the condensation surface corresponding to the second recessed structure.

[0020] The heat transfer device as described above, wherein, it further includes a first capillary structure, stacked on the condensation surface of the first heat conducting shell.

[0021] The heat transfer device as described above, wherein, it further includes a core capillary structure, stacked in the area on the first capillary structure corresponding to the second recessed structure.

[0022] The heat transfer device as described above, wherein, the first capillary structure is also stacked on at least one of the condensation bumps.

[0023] The heat transfer device as described above, wherein, it further includes a second capillary structure, stacked on the inner surface of the first recessed structure and the inner surface of the second recessed structure.

[0024] The above heat transfer device, further comprising at least one first support structure disposed on the inner surface of the first recessed structure, the first support structure passing through the second capillary structure and the first capillary structure to abut against the condensation surface.

[0025] The above heat transfer device, further comprising at least one second support structure disposed on the inner surface of the second recessed structure, the second support structure passing through the second capillary structure and the first capillary structure to abut against the condensation surface.

[0026] The above heat transfer device, further comprising at least one third capillary structure sleeved on the side surface of the second support structure, the first capillary structure being connected to the second capillary structure through the third capillary structure.

[0027] The above heat transfer device, wherein the first capillary structure and the second capillary structure are selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

[0028] The above heat transfer device, wherein the third capillary structure is a powder sintered body.

[0029] The above heat transfer device, further comprising: at least one heat pipe passing through the first heat conducting shell.

[0030] The above heat transfer device, wherein the first heat conducting shell has at least one through hole, the heat pipe is correspondingly installed on the through hole, and one end of the heat pipe passes through the through hole and the first capillary structure and abuts against the second capillary structure.

[0031] The above heat transfer device, wherein the heat pipe has a heat pipe chamber, and the heat pipe chamber is communicated with the liquid-tight chamber.

[0032] The above heat transfer device, wherein at least a part of the capillary structure of the heat pipe is connected to the second capillary structure.

[0033] The above heat transfer device, wherein at least a part of the capillary structure of the heat pipe is connected to the second capillary structure in a manner of metal bonding.

[0034] According to the heat transfer device of the above embodiment, since three-dimensional condensation bumps are provided on the condensation surface, the outer surface of the condensation bumps and the condensation surface together form the heat exchange surface of the condensation end, thereby increasing the heat exchange area of the condensation end. At the same time, a local capillary structure is designed in the core area of the condensation surface to increase the return water, which can quickly bring the water back to the evaporation area. Based on this, the heat dissipation performance of the present invention is better than that of the traditional design.

[0035] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 FIG. 1 is a perspective schematic view of a heat transfer device according to a first embodiment of the present invention.

[0037] Figure 2 is Figure 1 an exploded schematic view from a first perspective of

[0038] Figure 3 is Figure 1 an exploded schematic view from a second perspective of

[0039] Figure 4 FIG. 2 is an exploded schematic view from a first perspective of a heat transfer device according to a second embodiment of the present invention.

[0040] Figure 5 FIG. 3 is an exploded schematic view from a second perspective of a heat transfer device according to a second embodiment of the present invention.

[0041] Figure 6 FIG. 4 is an exploded schematic view from a first perspective of a heat transfer device according to a third embodiment of the present invention.

[0042] Figure 7 FIG. 5 is an exploded schematic view from a second perspective of a heat transfer device according to a third embodiment of the present invention.

[0043] Figure 8 FIG. 6 is a perspective schematic view of a heat transfer device according to a fourth embodiment of the present invention.

[0044] Figure 9 is Figure 8 an exploded schematic view from a first perspective of

[0045] Figure 10 is Figure 8 an exploded schematic view from a second perspective of

[0046] Figure 11 FIG. 7 is an exploded schematic view from a first perspective of a heat transfer device according to a fifth embodiment of the present invention.

[0047] Figure 12 FIG. 8 is an exploded schematic view from a second perspective of a heat transfer device according to a fifth embodiment of the present invention.

[0048] Figure 13 FIG. 9 is an exploded schematic view from a first perspective of a heat transfer device according to a sixth embodiment of the present invention.

[0049] Figure 14 FIG. 10 is an exploded schematic view from a second perspective of a heat transfer device according to a sixth embodiment of the present invention.

[0050] Among them, reference numerals:

[0051] The first heat conduction shell 10;

[0052] The condensation surface S1;

[0053] The first capillary structure 11;

[0054] The core capillary structure 12;

[0055] The perforation K;

[0056] The second heat conduction shell 20;

[0057] The bottom plates 21, 21a, 21b;

[0058] The first recessed structures 22, 22a, 22b;

[0059] The second recessed structures 23, 23a, 23b;

[0060] The second capillary structure 24;

[0061] The first support structure 25;

[0062] The second support structure 26;

[0063] The third capillary structure 27;

[0064] The condensation bump 30;

[0065] The liquid-tight chamber C;

[0066] The heat pipe 40. Specific embodiments

[0067] Please refer to Figures 1 to 3 . Figure 1 It is a three-dimensional schematic diagram of the first embodiment of the heat transfer device according to the present invention. Figure 2 It is Figure 1 An exploded schematic diagram from the first perspective. Figure 3 It is Figure 1 An exploded schematic diagram from the second perspective of Figures 1 to 3 As shown in , a heat transfer device of the present invention, as a planar heat transfer device, includes: a first heat conduction shell 10, a second heat conduction shell 20 and at least one condensation bump 30. The first heat conduction shell 10 is installed on the second heat conduction shell 20 so that the first heat conduction shell 10 and the second heat conduction shell 20 together form a liquid-tight chamber C. The first heat conduction shell 10 has a condensation surface S1 facing the second heat conduction shell 20. At least one condensation bump 30 is arranged at intervals on the condensation surface S1. The outer surface of the condensation bump 30 and the condensation surface S1 together constitute the heat exchange surface of the condensation end. The vaporized condensation working medium is liquefied through the heat exchange surface and then flows back to the evaporation end.

[0068] Among them, the second heat conduction shell 20 is arranged close to the heat source as the evaporation end, so the heat-receiving part of the cavity is called the evaporation area; the first heat conduction shell 10 is arranged away from the heat source as the condensation end, and the heat-dissipating part of the cavity is called the condensation area.

[0069] Furthermore, the heat transfer device of the present invention further includes a first capillary structure 11, and the first capillary structure 11 is stacked on the condensation surface S1 of the first heat conduction shell 10.

[0070] Among them, a capillary structure is provided on the outer surface of each of the condensation bumps 30. In this embodiment, this capillary structure is an integral capillary structure with the first capillary structure 11, that is, the first capillary structure 11 is also stacked on the outer surface of each of the condensation bumps 30.

[0071] Still further, the second heat conduction shell 20 includes: a bottom plate 21, a first concave structure 22 and a second concave structure 23. The first concave structure 22 extends in a concave manner from the bottom plate 21 away from the first heat conduction shell 10, and the second concave structure 23 extends in a concave manner from the inner surface of the first concave structure 22 away from the first heat conduction shell 10. Among them, at least one of the condensation bumps 30 is arranged in the area corresponding to the first concave structure 22 and the second concave structure 23 on the condensation surface S1. In this embodiment, the first concave structure 22 and the second concave structure 23 of the second heat conduction shell 20 are arranged close to the heat source as the evaporation end, so the heat-receiving part of the cavity is called the evaporation area; the first heat conduction shell 10 is arranged away from the heat source as the condensation end, and the heat-dissipating part of the cavity is called the condensation area; the heat transfer device further includes a second capillary structure 24, and the second capillary structure 24 is stacked on the inner surface of the first concave structure 22 and the inner surface of the second concave structure 23.

[0072] It should be noted that in an embodiment of the present invention, at least one of the condensation bumps 30 may also be arranged only in the area corresponding to the first concave structure 22 on the condensation surface S1.

[0073] It should be noted that the heights of these condensation bumps 30 may be the same or different. Specifically, the height of the condensation bump corresponding to the second concave structure 23 may be greater than the height of the condensation bump corresponding to the first concave structure 22.

[0074] It should also be noted that the lengths of these condensation bumps 30 may be the same or different.

[0075] Further, the heat transfer device further includes at least one first support structure 25, at least one second support structure 26, and at least one third capillary structure 27; the first support structure 25 is disposed on the inner surface of the first recessed structure 22, and the first support structure 25 passes through the second capillary structure 24 and the first capillary structure 11 to abut against the condensation surface S1; the second support structure 26 is disposed on the inner surface of the second recessed structure 23, and the second support structure 26 passes through the second capillary structure 24 and the first capillary structure 11 to abut against the condensation surface S1; the third capillary structure 27 is sleeved on the side surface of the second support structure 26, and the first capillary structure 11 is connected to the second capillary structure 24 through the third capillary structure 27;

[0076] Wherein, in this embodiment, it is a preferred implementation manner that the third capillary structure 27 and the second capillary structure 24 are an integral capillary structure, but the present invention is not limited thereto. In other embodiments of the present invention, the third capillary structure 27 and the second capillary structure 24 are also a split structure; in terms of processing technology, the third capillary structure 27 and the second capillary structure 24 can be sintered in one step or in multiple steps.

[0077] In an embodiment of the present invention, the first capillary structure 11 and the second capillary structure 24 are selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

[0078] In an embodiment of the present invention, the third capillary structure 27 is a powder sintered body.

[0079] Please refer to Figures 4 to 5 , Figure 4 which is an exploded view from the first perspective of the second embodiment of the heat transfer device according to the present invention. Figure 5 which is an exploded view from the second perspective of the second embodiment of the heat transfer device according to the present invention. As Figures 4 to 5As shown, a heat transfer device of the present invention is a planar heat transfer device. In this embodiment, the second heat conducting shell 20 includes: a bottom plate 21a, a first recessed structure 22a, and a second recessed structure 23a; the first recessed structure 22a extends in a recessed manner from the bottom plate 21a away from the first heat conducting shell 10; the second recessed structure 23a extends in a recessed manner from the inner surface of the first recessed structure 22a away from the first heat conducting shell 10. Wherein, in this embodiment, the second recessed structure 23a of the second heat conducting shell 20 is arranged close to the heat source as the evaporation end, so the heat - receiving part of the cavity is called the evaporation zone; the first heat conducting shell 10 is arranged away from the heat source as the condensation end, and the heat - dissipating part of the cavity is called the condensation zone. At least one condensation bump 30 is arranged in the area corresponding to the second recessed structure 23a on the condensation surface S1. The second capillary structure 24 is stacked on the inner surface of the first recessed structure 22a and the inner surface of the second recessed structure 23a, and the first capillary structure 11 is connected to the second capillary structure 24 through the third capillary structure 27.

[0080] In an embodiment of the present invention, the first capillary structure 11 and the second capillary structure 24 are selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

[0081] In an embodiment of the present invention, the third capillary structure 27 is a powder sintered body.

[0082] Please refer to Figures 6 - 7 , Figure 6 which is an exploded view of the third embodiment of the heat transfer device according to the present invention. Figure 7 is a second - perspective exploded view of the third embodiment of the heat transfer device according to the present invention. As Figures 6 - 7 shown, a heat transfer device of the present invention is a planar heat transfer device. In this embodiment, the second heat conducting shell 20 includes: a bottom plate 21b, a first recessed structure 22b, and a second recessed structure 23b; the first recessed structure 22b extends in a recessed manner from the bottom plate 21b away from the first heat conducting shell 10; the second recessed structure 23b extends in a recessed manner from the inner surface of the first recessed structure 22b away from the first heat conducting shell 10. Wherein, in this embodiment, the second recessed structure 23b of the second heat conducting shell 20 is arranged close to the heat source as the evaporation end, so the heat - receiving part of the cavity is called the evaporation zone; the first heat conducting shell 10 is arranged away from the heat source as the condensation end, and the heat - dissipating part of the cavity is called the condensation zone. The heat transfer device further includes a core capillary structure 12, and the core capillary structure 12 is stacked in the area corresponding to the second recessed structure 23b on the first capillary structure 11. The core capillary structure 12 is connected to the first capillary structure 11 and the third capillary structure 27 arranged on the second support structure 26.

[0083] In an embodiment of the present invention, the core capillary structure 12 is selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

[0084] In an embodiment of the present invention, the third capillary structure 27 is a powder sintered body.

[0085] It should be noted that, in this embodiment, the condensation surface S1 of the first heat conducting shell 10 is a plane and does not have condensation bumps 30 provided thereon. However, the present invention is not limited thereto. In other embodiments of the present invention, the condensation surface S1 of the first heat conducting shell 10 may also be provided with condensation bumps 30 in the manner described in the foregoing embodiments.

[0086] Please refer to Figures 8 to 10 , Figure 8 which is a three-dimensional schematic diagram of a fourth embodiment of the heat transfer device according to the present invention. Figure 9 is Figure 8 an exploded schematic diagram from a first perspective of Figure 10 is Figure 8 an exploded schematic diagram from a second perspective of Figures 8 to 10 As shown in

[0087] The heat transfer device of the present invention, as a three-dimensional heat transfer device, includes: a first heat conducting shell 10, a second heat conducting shell 20, at least one condensation bump 30, and at least one heat pipe 40; the first heat conducting shell 10 is installed on the second heat conducting shell 20 so that the first heat conducting shell 10 and the second heat conducting shell 20 together form a liquid-tight chamber C; the first heat conducting shell 10 has a condensation surface S1 facing the second heat conducting shell 20, and at least one of the condensation bumps 30 is provided on the condensation surface S1. The outer surface of the condensation bump 30 and the condensation surface S1 together constitute the heat exchange surface of the condensation end. At least one heat pipe 40 penetrates through the first heat conducting shell 10, and each heat pipe 40 has a heat pipe chamber, and the heat pipe chamber is communicated with the liquid-tight chamber C.

[0088] Furthermore, the heat transfer device of the present invention further includes a first capillary structure 11, and the first capillary structure 11 is stacked on the condensation surface S1 of the first heat conducting shell 10.

[0089] Wherein, a capillary structure is provided on the outer surface of each condensation bump 30. In this embodiment, the capillary structure and the first capillary structure 11 are an integral capillary structure, that is, the first capillary structure 11 is also stacked on the outer surface of each condensation bump 30.

[0090] Further, the second heat-conducting shell 20 includes: a bottom plate 21, a first concave structure 22, and a second concave structure 23. The first concave structure 22 extends in a concave manner away from the first heat-conducting shell 10 from the bottom plate 21, and the second concave structure 23 extends in a concave manner away from the first heat-conducting shell 10 from the inner surface of the first concave structure 22. Among them, at least one of the condensation bumps 30 is disposed in the region on the condensation surface S1 corresponding to the first concave structure 22 and the second concave structure 23. In this embodiment, the first concave structure 22 and the second concave structure 23 of the second heat-conducting shell 20 are arranged close to the heat source as the evaporation end, so the heated part of the cavity is called the evaporation zone; the first heat-conducting shell 10 is arranged away from the heat source as the condensation end, and the heat-dissipating part of the cavity is called the condensation zone; the heat transfer device further includes a second capillary structure 24, and the second capillary structure 24 is stacked on the inner surfaces of the first concave structure 22 and the second concave structure 23.

[0091] It should be noted that in an embodiment of the present invention, at least one of the condensation bumps 30 may also be disposed only in the region on the condensation surface S1 corresponding to the first concave structure 22.

[0092] Furthermore, the heat transfer device further includes at least one first support structure 25, at least one second support structure 26, and at least one third capillary structure 27; the first support structure 25 is disposed on the inner surface of the first concave structure 22, and the first support structure 25 passes through the second capillary structure 24 and the first capillary structure 11 to abut against the condensation surface S1; the second support structure 26 is disposed on the inner surface of the second concave structure 23, and the second support structure 26 passes through the second capillary structure 24 and the first capillary structure 11 to abut against the condensation surface S1; the third capillary structure 27 is sleeved on the side surface of the second support structure 26, and the first capillary structure 11 is connected to the second capillary structure 24 through the third capillary structure 27;

[0093] Among them, in this embodiment, it is a preferred embodiment that the third capillary structure 27 and the second capillary structure 24 are an integral capillary structure, but the present invention is not limited thereto. In other embodiments of the present invention, the third capillary structure 27 and the second capillary structure 24 are also a split structure; in terms of processing technology, the third capillary structure 27 and the second capillary structure 24 can be sintered in one step or in multiple steps.

[0094] In an embodiment of the present invention, the first capillary structure 11 and the second capillary structure 24 are selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

[0095] In an embodiment of the present invention, the third capillary structure 27 is a powder sintered body.

[0096] Furthermore, the first heat conducting shell 10 has at least one perforation K, the heat pipe 40 is correspondingly installed on the perforation K, and one end of the heat pipe 40 passes through the perforation K and the first capillary structure 11 and abuts against the second capillary structure 24.

[0097] Wherein, the capillary structure of at least part of the heat pipe 40 is connected to the second capillary structure 24.

[0098] In an embodiment of the present invention, the capillary structure of at least part of the heat pipe is connected to the second capillary structure 24 in a manner of metal bonding.

[0099] It should be noted that the heights of these condensation bumps 30 can be the same or different. Specifically, the height of the condensation bump corresponding to the second recessed structure 23 can be greater than the height of the condensation bump corresponding to the first recessed structure 22.

[0100] Please refer to Figures 11 - 12 。 Figure 11 FIG. is an exploded view from a first perspective of a fifth embodiment of a heat transfer device according to the present invention. Figure 12 FIG. is an exploded view from a second perspective of a fifth embodiment of a heat transfer device according to the present invention. As Figures 11 - 12 shown, the heat transfer device of the present invention is a three-dimensional heat transfer device, and its structure is substantially the same as that of the heat transfer device shown in the fourth embodiment. Therefore, the same parts will not be described in detail here. Now, the different parts will be described as follows. In this embodiment, the second heat conducting shell 20 includes: a bottom plate 21a, a first recessed structure 22a, and a second recessed structure 23a; the first recessed structure 22a extends in a recessed manner from the bottom plate 21a away from the first heat conducting shell 10; the second recessed structure 23a extends in a recessed manner from the inner surface of the first recessed structure 22a away from the first heat conducting shell 10. Wherein, in this embodiment, the second recessed structure 23a of the second heat conducting shell 20 is close to the heat source and is set as the evaporation end. Therefore, the heated part of the cavity is called the evaporation zone; the first heat conducting shell 10 is far from the heat source and is set as the condensation end, and the part of the cavity for heat dissipation is called the condensation zone. At least one condensation bump 30 is arranged in the area corresponding to the second recessed structure 23a on the condensation surface S1. The second capillary structure 24 is stacked on the inner surfaces of the first recessed structure 22a and the second recessed structure 23a. The first capillary structure 11 is connected to the second capillary structure 24 through the third capillary structure 27.

[0101] In an embodiment of the present invention, the first capillary structure 11 and the second capillary structure 24 are selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

[0102] In an embodiment of the present invention, the third capillary structure 27 is a powder sintered body.

[0103] It should be noted that, except for the aforementioned third embodiment, a core capillary structure can also be added in the same manner as in the third embodiment in the remaining embodiments. The core capillary structure is stacked in the region corresponding to the second concave structures 23 and 23a on the first capillary structure 11, and the core capillary structure is connected to the first capillary structure 11 and the third capillary structure 27 provided on the second support structure 26.

[0104] In an embodiment of the present invention, the core capillary structure 12 is selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

[0105] Please refer to Figures 13 to 14 , Figure 13 FIG. is an exploded view from a first perspective of a heat transfer device according to a sixth embodiment of the present invention. Figure 14 FIG. is an exploded view from a second perspective of a heat transfer device according to a sixth embodiment of the present invention. As Figures 13 to 14 shown, a heat transfer device of the present invention, as a three-dimensional heat transfer device, has a structure substantially the same as that of the heat transfer device shown in the fourth embodiment. Therefore, the same parts will not be described in detail here. The different parts will be described as follows. The second heat conduction shell 20 includes: a bottom plate 21b, a first concave structure 22b, and a second concave structure 23b; the first concave structure 22b extends in a concave manner away from the first heat conduction shell 10 from the bottom plate 21b; the second concave structure 23b extends in a concave manner away from the first heat conduction shell 10 from the inner surface of the first concave structure 22b. Among them, the second concave structure 23b of the second heat conduction shell 20 is close to the heat source and is set as the evaporation end. Therefore, the heated part of the cavity is called the evaporation zone; the first heat conduction shell 10 is far from the heat source and is set as the condensation end, and the part of the cavity that dissipates heat is called the condensation zone. In this embodiment, the heat transfer device further includes a core capillary structure 12. The core capillary structure 12 is stacked in the region corresponding to the second concave structure 23b on the first capillary structure 11, and the core capillary structure 12 is connected to the first capillary structure 11 and the third capillary structure 27 provided on the second support structure 26.

[0106] In an embodiment of the present invention, the core capillary structure 12 is selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

[0107] In an embodiment of the present invention, the third capillary structure 27 is a powder sintered body.

[0108] It should be noted that, in this embodiment, the condensation surface S1 of the first heat-conducting shell 10 is a flat surface and no condensation bumps 30 are provided. However, the present invention is not limited thereto. In other embodiments of the present invention, the condensation surface S1 of the first heat-conducting shell 10 may also be provided with condensation bumps 30 in the manner described in the foregoing embodiments.

[0109] According to the heat transfer device of the above embodiment, since three-dimensional condensation bumps are provided on the condensation surface, the outer surface of the condensation bumps and the condensation surface together form the heat exchange surface of the condensation end, thereby increasing the heat exchange area of the condensation end. At the same time, a local capillary structure is designed in the core area of the condensation surface to increase the return water, which can quickly bring the water back to the evaporation area. Based on this, the heat dissipation performance of the present invention is better than that of the traditional design.

[0110] Although the present invention is disclosed as the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the relevant art, without departing from the spirit and scope of the present invention, may make some modifications and refinements. Therefore, the protection scope of the present invention shall be determined by the protection scope defined by the appended claims of this application.

Claims

1. A heat transfer device, characterized in that, Comprising: A first heat-conducting shell; A second heat-conducting shell, the first heat-conducting shell being installed on the second heat-conducting shell so that the first heat-conducting shell and the second heat-conducting shell jointly form a liquid-tight chamber; At least one condensation bump, the first heat-conducting shell having a condensation surface facing the second heat-conducting shell, at least one of the condensation bumps being disposed on the condensation surface, and the outer surface of the condensation bump and the condensation surface jointly constituting the heat exchange surface of the condensation end. The vaporized condensation working fluid is liquefied through the heat exchange surface and then flows back to the evaporation end.

2. The heat transfer device according to claim 1, characterized in that, The second heat-conducting shell includes: A bottom plate; and A first recessed structure extending in a direction away from the first heat-conducting shell by recessing from the bottom plate; Wherein, at least one of the condensation bumps is disposed in a region of the condensation surface corresponding to the first recessed structure.

3. The heat transfer device according to claim 2, wherein The second heat-conducting shell further includes: a second recessed structure, the second recessed structure extending in a direction away from the first heat-conducting shell by recessing from the inner surface of the first recessed structure, and at least one of the condensation bumps is disposed in a region of the condensation surface corresponding to the second recessed structure.

4. The heat transfer device according to claim 1, characterized in that, The second heat-conducting shell includes: A bottom plate; and A first recessed structure extending in a direction away from the first heat-conducting shell by recessing from the bottom plate; A second recessed structure, the second recessed structure extending in a direction away from the first heat-conducting shell by recessing from the inner surface of the first recessed structure, and at least one of the condensation bumps is disposed in a region of the condensation surface corresponding to the second recessed structure.

5. The heat transfer device according to claim 3 or 4, characterized in that, Further including a first capillary structure stacked on the condensation surface of the first heat-conducting shell.

6. The heat transfer device according to claim 5, characterized in that, Further including a core capillary structure stacked in a region corresponding to the second recessed structure on the first capillary structure.

7. The heat transfer device according to claim 5, wherein The first capillary structure also stacks on at least one of the condensation bumps.

8. The heat transfer device according to claim 6, wherein Further including a second capillary structure stacked on the inner surface of the first recessed structure and the inner surface of the second recessed structure.

9. The heat transfer device according to claim 8, characterized in that, Further including at least one first support structure disposed on the inner surface of the first recessed structure, the first support structure passing through the second capillary structure and the first capillary structure and abutting against the condensation surface.

10. The heat transfer device according to claim 9, characterized in that, Further including at least one second support structure disposed on the inner surface of the second recessed structure, the second support structure passing through the second capillary structure and the first capillary structure and abutting against the condensation surface.

11. The heat transfer device according to claim 10, characterized in that, Further including at least one third capillary structure sleeved on the side surface of the second support structure, and the first capillary structure is connected to the second capillary structure through the third capillary structure.

12. The heat transfer device according to claim 8, wherein The first capillary structure and the second capillary structure are selected from the group consisting of a metal mesh, a powder sintered body, and a ceramic sintered body.

13. The heat transfer device according to claim 11, wherein, The third capillary structure is a powder sintered body.

14. The heat transfer device according to claim 8, characterized in that, Further including: At least one heat pipe passing through the first heat-conducting shell.

15. The heat transfer device according to claim 14, characterized in that, The first heat-conducting shell has at least one perforation, the heat pipe is correspondingly installed on the perforation, and one end of the heat pipe passes through the perforation and the first capillary structure and abuts against the second capillary structure.

16. The heat transfer device according to claim 14, characterized in that, The heat pipe has a heat pipe chamber, and the heat pipe chamber is communicated with the liquid-tight chamber.

17. The heat transfer device according to claim 14, characterized in that, At least a part of the capillary structure of the heat pipe is connected to the second capillary structure.

18. The heat transfer device according to claim 14, characterized in that, The capillary structure of at least a part of the heat pipe is connected to the second capillary structure in a manner of metallic bonding.

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