Three-coordinate surface accuracy measuring instrument for semiconductor parts and its measuring method

Abstract

The present application relates to the technical field of three-coordinate measuring equipment, and in particular to a three-coordinate surface accuracy measuring instrument for semiconductor parts and a measuring method thereof. The measuring instrument comprises a machine platform, on which a detection platform, a traverse module, a measuring module and a bellows are installed. A mounting plate for fixing the bellows is installed on the machine platform and the detection platform, a plug plate is installed on the bellows, and a slot is provided on the mounting plate; a fixing rod is installed on the mounting plate, a pressure plate is rotatably installed on the fixing rod, a lifting rod is slidably installed on the mounting plate, the lifting rod abuts against the pressure plate, a fixing plate is installed on the lifting rod, a second spring is sleeved on the lifting rod, and a limit strip is installed on the end of the lifting rod away from the pressure plate; a connecting rod is installed on the fixing plate, a support plate is installed on the mounting plate, a rotating rod is rotatably installed on the support plate, the connecting rod is slidably connected to the rotating rod, and a baffle for fixing the pressure plate is connected to the rotating rod. The present application has the effect of improving the convenience of the three-coordinate surface accuracy measuring instrument for semiconductor parts during operation.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor measuring equipment, and in particular to a three-coordinate surface accuracy measuring instrument for semiconductor parts and a measuring method thereof. Background Art

[0002] A three-dimensional coordinate measuring instrument (CMM) is an instrument capable of measuring geometric shapes, lengths, and circular indexing within a hexahedron. It is also known as a three-dimensional coordinate measuring machine (CMM) or a three-dimensional coordinate measuring bed (CMB). High-precision semiconductor processing equipment requires very high surface accuracy for processed parts and products. After production, these parts require CMM testing to ensure quality.

[0003] A three-dimensional coordinate measuring machine is usually equipped with a test table to carry and move parts. In order to ensure that the test table can be accurately moved to the specified position, the three-dimensional coordinate measuring machine is usually equipped with bellows to protect the components that control the movement of the test table to prevent damage to the components and affect the measurement accuracy. After long-term use, the bellows will be cracked and damaged, so the bellows need to be replaced and maintained. When installing the bellows, most equipment uses flanges and bolts to fasten the bellows. When disassembling and assembling the bellows, auxiliary tools such as wrenches are required. In addition, the tightening degree of the bolts is difficult to control, and excessive tightening of the bolts will increase the difficulty of disassembly and assembly. Summary of the Invention

[0004] In order to improve the convenience of a three-coordinate surface accuracy measuring instrument for semiconductor parts during operation, the present application provides a three-coordinate surface accuracy measuring instrument for semiconductor parts.

[0005] This application provides a three-coordinate surface accuracy measuring instrument for semiconductor parts, which adopts the following technical solutions:

[0006] The three-coordinate surface accuracy measuring instrument for semiconductor parts includes a machine platform, a detection platform is installed on the machine platform, a traverse module for controlling the movement of the detection platform is installed on the machine platform, a bellows for protecting the traverse module is installed on the detection platform, a mounting plate for fixing the bellows is installed on the machine platform and the detection platform, a plug plate is installed on the bellows, a slot for accommodating the plug plate is opened on the mounting plate, a fixing rod is installed on the mounting plate, a pressure plate is rotatably installed on the fixing plate, a lifting rod is slidably installed on the mounting plate, one end of the lifting rod close to the pressure plate abuts against the pressure plate, a fixed plate is installed on the lifting rod, a second spring is sleeved on the lifting rod, and a limit strip is installed on one end of the lifting rod away from the pressure plate; a connecting rod is installed on the fixed plate, a support plate is installed on the mounting plate, a rotating rod is rotatably installed on the support plate, the connecting rod is slidably connected to the rotating rod, and a baffle for fixing the pressure plate is connected to the rotating rod, and a measuring module for measurement is installed on the machine platform.

[0007] By adopting the above technical solution, the parts are placed on the inspection table, the traverse module controls the movement of the inspection table to transport the parts to the inspection position, and the measuring module is used to perform rapid measurement, so as to facilitate the rapid determination of the size and accuracy of the parts. When the bellows on the measuring instrument needs to be replaced and maintained, when installing the bellows, the plug-in plate on the bellows is inserted into the slot on the mounting plate, and the pressing plate is pressed to rotate the pressing plate, which pushes the lifting rod to move toward the plug-in plate, and finally pushes the limit bar against the vertical side wall of the plug-in plate to limit the plug-in plate and prevent the plug-in plate from When the bellows is detached from the mounting plate, the bellows can be quickly fixed. The fixing plate drives the connecting rod to move, and the connecting rod drives the baffle to move to fix the pressure plate. When the bellows needs to be unlocked, the baffle is pushed away from the pressure plate to unlock the pressure plate. After the pressure plate is released, the second spring rebounds to control the movement of the lifting rod so that the limit bar leaves the plug plate, thereby facilitating the rapid unlocking of the plug plate. The entire process is completed by controlling the pressing of the pressure plate to complete the rapid disassembly and assembly of the bellows, without the need for other auxiliary tools, which is conducive to enhancing the convenience of the three-dimensional coordinate measuring instrument during use and maintenance.

[0008] In a specific possible implementation scheme, an adjusting rod is slidably mounted on the mounting plate, and meshing teeth are provided on the side wall of the adjusting rod close to the rotating rod. A toothed disc is mounted on the end of the rotating rod close to the adjusting rod, and the toothed disc is meshed with the adjusting rod. A carrier plate is mounted on the adjusting rod, and a folding groove is provided on the carrier plate. The baffle is slidably mounted on the carrier plate through the folding groove.

[0009] By adopting the above technical solution, the baffle connection is set as a movable part using a connecting rod, a gear plate and an adjusting rod. When the baffle fixes the pressure plate, the second spring rebounds to make the pressure plate and the baffle interact with each other. The mutual pressure between the pressure plate and the baffle can also enhance the stability of the baffle's resistance to the pressure plate, preventing the baffle from moving into the folding groove during use.

[0010] In a specific feasible implementation scheme, a second guide rod is installed on the mounting plate, a lifting block is slidably installed on the second guide rod, a first spring is sleeved on the second guide rod, one end of the first spring is connected to the lifting block, and the other end is connected to the mounting plate, the lifting block is set to an outward convex arc surface at one end close to the pressure plate, a protrusion is installed on the pressure plate, the protrusion abuts against the arc surface of the lifting block, and a pressure strip is installed on the end of the lifting block away from the pressure plate.

[0011] By adopting the above technical solution, the pressure plate is pressed to rotate the pressure plate, and the protrusion on the pressure plate will squeeze the lifting block. Through the action of the curved surface, the protrusion will press the lifting block to move close to the plug plate, and finally the pressure strip will be pressed on the plug plate. By pressing the plug plate with the pressure strip, the corrugated pipe can be quickly fixed, and the stability of the installation plate fixing the corrugated pipe is enhanced, making the installation of the corrugated pipe more stable.

[0012] In a specific embodiment, the pressure strip is made of rubber.

[0013] By adopting the above technical solution, the pressure strip is made of rubber material, which can increase the friction with the plug board and protect the plug board to prevent the pressure strip from being worn and broken due to hard contact between the plug board and the pressure strip.

[0014] In a specific possible implementation scheme, a shift plate is installed on the pressure plate, a limiting rod is slidably installed on the mounting plate, a shift slot is provided on the limiting rod, and one end of the shift plate away from the pressure plate extends into the shift slot, and the shift plate is movably connected to the limiting rod through the shift slot.

[0015] By adopting the above technical solution, when the pressure plate is unlocked, the dial plate will push the limit rod against the mounting plate to limit the pressure plate, preventing the pressure plate from rotating too much, so that the pressure plate can remain and rest against the lifting rod, making it easier for the staff to press the pressure plate next time.

[0016] In a specific embodiment, the pressure plate and / or the baffle are provided with anti-slip grooves.

[0017] By adopting the above technical solution, anti-slip grooves are provided on the pressure plate and the baffle, which makes it easier for staff to control the pressure plate and the baffle, press the pressure plate and push the baffle.

[0018] In a specific feasible implementation scheme, the transverse movement module includes a screw rod, which is rotatably mounted on the machine platform, and a motor for controlling the rotation of the screw rod is fixedly mounted on the machine platform. The detection platform is threadedly connected to the screw rod, and a first guide rod is fixedly mounted on the machine platform. The first guide rod is arranged parallel to the screw rod, and the first guide rod passes through the detection platform and is slidably connected to the detection platform.

[0019] By adopting the above technical solution, the motor drives the screw to rotate, and controls the detection platform to slide on the first guide rod and the screw, so as to facilitate the rapid and smooth movement of the detection platform to the detection position.

[0020] In a specific possible implementation manner, a pad is fixedly installed on the detection platform.

[0021] By adopting the above technical solution, the parts are placed on the pads, which makes it easy to quickly position the parts.

[0022] A method for measuring semiconductor parts, based on the above-mentioned three-coordinate surface accuracy measuring instrument for semiconductor parts, is characterized by comprising the following steps:

[0023] Step 1: Check the environment to ensure that the measurement environment temperature is controlled at 20±2°C, the humidity is 40%-60%, and vibration interference is avoided;

[0024] Step 2: Clean the equipment, guide rails and work surfaces;

[0025] Step 3: Fix the workpiece and place the part on the pad 21 to ensure that there is no displacement during the measurement process. Complex workpieces need to be adjusted to the best measurement posture;

[0026] Step 4: Probe configuration: select the probe type and probe accessories according to the features to be measured, and check the collision protection function after installation;

[0027] Step 5: Probe calibration: Use a standard ball to calibrate the probe to ensure measurement accuracy;

[0028] Step 6: Establish a coordinate system, collect three or more points on the workpiece surface, and define the reference plane;

[0029] Step 7: Measure, preset program control path, cooperate with measurement module, and combine multi-point sampling to complete efficient measurement of complex shapes.

[0030] By adopting the above-mentioned technical solutions, the three-dimensional coordinate measuring machine utilizes advanced measurement technology and a sophisticated mechanical system. These include high-precision self-cleaning air bearings, the use of materials such as hollow granite and aviation aluminum alloy, as well as configurations such as high-precision linear scales and DC servo drives, enabling high-precision measurement. Its system resolution can reach 0.078 microns, ensuring the accuracy and reliability of measurement results. The three-dimensional coordinate measuring machine is equipped with a computer program control system, which automates the measurement process, reduces manual intervention, and reduces operational difficulty. Through automated measurement and data processing, measurement efficiency can be significantly improved, especially in large-scale production inspections, where its automated features will greatly enhance production efficiency.

[0031] In summary, this application includes at least one of the following beneficial technical effects:

[0032] 1. Place the part on the inspection table, and the traverse module controls the movement of the inspection table to transport the part to the inspection position. Use the measuring module to perform rapid measurement, so as to quickly obtain the size and accuracy of the part. When the bellows on the measuring instrument needs to be replaced or maintained, when installing the bellows, insert the plug on the bellows into the slot on the mounting plate, press the pressure plate to rotate it, and the pressure plate will push the lifting rod to move toward the plug plate, and finally push the limit bar against the vertical side wall of the plug plate to limit the plug plate and prevent it from falling from the mounting plate. The upper part falls off, and the bellows can be quickly fixed. The fixing plate drives the connecting rod to move, and the connecting rod drives the baffle to move to fix the pressure plate. When the bellows needs to be unlocked, the baffle is pushed away from the pressure plate to unlock the pressure plate. After the pressure plate is released, the second spring rebounds to control the movement of the lifting rod to make the limit bar leave the plug-in plate, thereby facilitating the rapid unlocking of the plug-in plate. The whole process is completed by controlling the pressing of the pressure plate to complete the rapid disassembly and assembly of the bellows, without the need for other auxiliary tools, which is conducive to enhancing the convenience of the three-dimensional coordinate measuring instrument during use and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall structure of the three-coordinate measuring machine of an embodiment of the present application.

[0034] Figure 2 It is a schematic diagram of the transverse movement module of an embodiment of the present application.

[0035] Figure 3 It is a schematic diagram of the installation disk of an embodiment of the present application.

[0036] Figure 4 It is a cross-sectional view of the mounting plate of an embodiment of the present application.

[0037] Figure 5 It is a schematic diagram of the installation structure of the lifting block according to an embodiment of the present application.

[0038] Figure 6It is a schematic diagram of the installation structure of the lifting rod embodying the embodiment of the present application.

[0039] Figure 7 yes Figure 6 Enlarged view of point A in the middle.

[0040] Reference numerals: 1, machine table; 2, testing table; 21, pad; 22, bellows; 221, plug plate; 23, mounting plate; 231, slot; 232, mounting groove; 241, fixing rod; 242, pressing plate; 243, second guide rod; 244, lifting block; 245, first spring; 246, protrusion; 247, pressure strip; 251, lifting rod; 252, fixing plate; 253, second spring; 254, limit 261, support plate; 262, rotating rod; 2621, slide groove; 263, connecting rod; 2631, slide rod; 264, adjusting rod; 265, gear plate; 266, carrier plate; 2661, folding groove; 267, baffle; 27, third spring; 281, shift plate; 282, limit rod; 2821, shift groove; 3, transverse movement module; 31, screw rod; 32, motor; 33, first guide rod; 4, measuring module. DETAILED DESCRIPTION

[0041] The following is combined with Figure 1-7 This application is described in further detail.

[0042] The present application discloses a three-coordinate surface accuracy measuring instrument for semiconductor parts, referring to Figure 1 and Figure 2 , including a machine platform 1, a detection platform 2 is installed on the machine platform 1, a transverse movement module 3 for controlling the movement of the detection platform 2 is installed on the machine platform 1, and a measuring module 4 for measuring is installed on the machine platform 1.

[0043] The part is placed on the inspection table 2, and the traverse module 3 controls the movement of the inspection table 2 to transport the part to the inspection position. The measurement module 4 is used for rapid measurement, so that the size and accuracy of the part can be quickly obtained.

[0044] The transverse movement module 3 includes a screw rod 31, which is rotatably mounted on the machine platform 1. A motor 32 for controlling the rotation of the screw rod 31 is fixedly mounted on the machine platform 1. The detection platform 2 is threadedly connected to the screw rod 31. A first guide rod 33 is fixedly mounted on the machine platform 1. The first guide rod 33 is arranged parallel to the screw rod 31. The first guide rod 33 passes through the detection platform 2 and is slidably connected to the detection platform 2.

[0045] The motor 32 drives the screw rod 31 to rotate, and controls the detection platform 2 to slide on the first guide rod 33 and the screw rod 31, so as to move the detection platform 2 to the detection position quickly and smoothly.

[0046] A pad 21 is fixedly mounted on the inspection table 2 . When a part needs support, the part is placed on the pad 21 , and the pad 21 supports the part.

[0047] In the embodiment of the present application, the measuring module 4 is a prior art, and its measuring principle is the same as the working principle of the basic three-coordinate measuring machine measuring module. The embodiment of the present application will not further explain the measuring module 4 of the three-coordinate measuring machine.

[0048] Reference Figure 2 and Figure 3 The machine 1 and the test table 2 are equipped with a bellows 22 for protecting the screw rod 31 and the first guide rod 33. The machine 1 and the test table 2 are equipped with a mounting plate 23 for quickly disassembling the bellows 22. The cross-section of the mounting plate 23 is a hexagon. Figure 4 and Figure 5 The bellows 22 is fixedly mounted with an L-shaped insert plate 221. The mounting plate 23 is provided with a slot 231 for accommodating the insert plate 221. The mounting plate 23 is provided with a mounting slot 232. A fixing rod 241 is fixedly mounted on the mounting plate 23. The fixing rod 241 is disposed within the mounting slot 232. A pressure plate 242 is rotatably mounted on the fixing rod 241. The pressure plate 242 is provided with anti-slip grooves. A second guide rod 243 is fixedly mounted on the mounting plate 23. A lifting block 244 is slidably mounted on the second guide rod 243. A first spring 245 is sleeved on the second guide rod 243. One end of the first spring 245 is fixedly connected to the lifting block 244, and the other end is fixedly connected to the mounting plate 23. The lifting block 244 has an outwardly convex arc surface at one end near the pressure plate 242. A protrusion 246 is fixedly mounted on the pressure plate 242, and the protrusion 246 abuts against the arc surface of the lifting block 244. A pressure strip 247 is fixedly mounted on the bottom surface of the lifting block 244 , and the pressure strip 247 is made of soft rubber material.

[0049] When installing the bellows 22, insert the plug plate 221 on the bellows 22 into the slot 231 on the mounting plate 23, press the pressing plate 242 to make the pressing plate 242 rotate on the fixing rod 241, and the protrusion 246 on the pressing plate 242 will squeeze the lifting block 244. Through the action of the arc surface, the protrusion 246 will press the lifting block 244 to move close to the plug plate 221, and finally make the pressure strip 247 press on the plug plate 221. By pressing the plug plate 221 with the pressure strip 247, the bellows 22 can be quickly fixed. The pressure strip 247 is made of rubber material, which can increase the friction with the plug plate 221 and also protect the plug plate 221 to prevent the plug plate 221 from being worn and cracked due to hard contact between the plug plate 221 and the pressure strip 247.

[0050] Reference Figure 4 and Figure 6A lifting rod 251 is slidably installed on the mounting plate 23, and a fixed plate 252 is fixedly installed on the lifting rod 251. A second spring 253 is sleeved on the lifting rod 251, and one end of the second spring 253 is fixedly connected to the fixed plate 252, and the other end is fixedly connected to the mounting plate 23. The lifting rod 251 is vertically arranged below the pressure plate 242, and the end of the lifting rod 251 close to the pressure plate 242 abuts against the pressure plate 242, and the end of the lifting rod 251 away from the pressure plate 242 is fixedly installed with a limit strip 254.

[0051] When the pressing plate 242 is pressed, the pressing plate 242 will also push the lifting rod 251 to move towards the plugging plate 221, and finally push the limiting bar 254 against the vertical side wall of the plugging plate 221, limiting the plugging plate 221 and preventing the plugging plate 221 from falling off the mounting plate 23.

[0052] Reference Figure 5 、 Figure 6 and Figure 7 A support plate 261 is fixedly mounted on the mounting plate 23. A rotating rod 262 is rotatably mounted on the support plate 261. A sliding groove 2621 is defined on the end of the rotating rod 262 near the lifting rod 251. A connecting rod 263 is fixedly mounted on the fixed plate 252. A sliding rod 2631 is mounted on the connecting rod 263. The sliding rod 2631 passes through the sliding groove 2621 and is slidably connected to the rotating rod 262 via the sliding groove 2621. An adjusting rod 264 is slidably mounted on the mounting plate 23. Meshing teeth are defined on the sidewall of the adjusting rod 264 near the rotating rod 262. A toothed disc 265 is mounted on the end of the rotating rod 262 near the adjusting rod 264. The toothed disc 265 is meshed with the adjusting rod 264. A carrier plate 266 is fixedly mounted on the adjustment rod 264. The carrier plate 266 defines a retractable slot 2661. A baffle 267 is slidably mounted on the carrier plate 266. The baffle 267 is positioned within the retractable slot 2661 and has anti-slip grooves. A third spring 27 is fixedly mounted on the mounting plate 23. The third spring 27 is positioned below the pressure plate 242, and the end of the third spring 27 facing away from the mounting plate 23 is fixedly connected to the pressure plate 242.

[0053] When the pressing plate 242 is pressed against the lifting rod 251, the lifting rod 251 drives the connecting rod 263 to move, and the connecting rod 263 presses the rotating rod 262 to rotate through the sliding rod 2631, and the rotating rod 262 nears the end of the lifting rod 251 descends, and the end of the rotating rod 262 on which the toothed disc 265 is mounted rises, and the toothed disc 265 pushes the adjusting rod 264 to rise, and the adjusting rod 264 drives the carrying plate 266 to rise. When the pressing strip 247 and the limit strip 254 abut against the inserting plate 221, the carrying plate 266 and the baffle 267 just move to above the pressing plate 242. At this time, the pressing plate 242 is also in a horizontal state, pushing the baffle 267 to move onto the pressing plate 242. At this time, the pressing of the pressing plate 242 is stopped, and the third spring 27 rebounds to support the pressing plate 242 and makes the pressing plate 242 have a tendency to rotate, so that the top surface of the pressing plate 242 can be pressed tightly against the bottom surface of the baffle 267. At the same time, the second spring 253 will generate an upward thrust on the lifting rod 251. The lifting rod 251 has a tendency to move upward, and will push the pressure plate 242 to rotate together with the third spring 27. The lifting rod 251 will also drive the connecting rod 263 to push the rotating rod 262 to rotate, and the rotating rod 262 will drive the carrier plate 266 and the baffle 267 to move downward so that the bottom surface of the baffle 267 is pressed against the top surface of the pressure plate 242, thereby completing the rapid locking of the pressure plate 242. The mutual pressure between the pressure plate 242 and the baffle 267 can also enhance the stability of the baffle 267 against the pressure plate 242, preventing the baffle 267 from moving into the folding groove 2661 during use.

[0054] A shift plate 281 is fixedly mounted on the pressure plate 242, and a limiting rod 282 is slidably mounted on the mounting plate 23. A shift slot 2821 is provided on the limiting rod 282, and one end of the shift plate 281 away from the pressure plate 242 extends into the shift slot 2821. The shift plate 281 is movably connected to the limiting rod 282 through the shift slot 2821.

[0055] When the pressure plate 242 rotates clockwise, the dial plate 281 drives the limit rod 282 upward. When the bellows 22 is damaged or requires replacement and maintenance, the baffle 267 is pushed into the retracting groove 2661. The third spring 27 pushes the pressure plate 242 counterclockwise, and the dial plate 281 pushes the limit rod 282 against the mounting plate 23, limiting the pressure plate 242 and preventing it from rotating too much. When the lifting block 244 and the lifting rod 251 lose the pressure of the pressure plate 242, the first spring 245 pushes the lifting block 244 away from the insert plate 221, and the second spring 253 pushes the limit bar 254 away from the insert plate 221, quickly unlocking the insert plate 221 and facilitating the replacement of the bellows 22. This improves the convenience of replacing the bellows 22 during maintenance of the measuring instrument.

[0056] The present invention also provides a method for measuring a semiconductor component, comprising the following steps:

[0057] Step 1: Check the environment to ensure that the measurement environment temperature is controlled at 20±2°C, the humidity is 40%-60%, and vibration interference is avoided;

[0058] Step 2: Clean the equipment, guide rails and work surfaces;

[0059] Step 3: Fix the workpiece and place the part on the pad 21 to ensure that there is no displacement during the measurement process. Move the complex workpiece on the pad 21 to adjust it to the best measurement posture;

[0060] Step 4: Probe configuration: select the probe type and probe accessories according to the features to be measured, and check the collision protection function after installation;

[0061] Step 5: Probe calibration: Use a standard ball to calibrate the probe to ensure measurement accuracy;

[0062] Step 6: Establish a coordinate system, collect three or more points on the workpiece surface, and define the reference plane;

[0063] Step 7: Measure, preset program control path, and combine multi-point sampling to complete efficient measurement of complex shapes.

[0064] High-Precision Measurement: The CMM utilizes advanced measurement technology and a sophisticated mechanical system, including high-precision self-cleaning air bearings, hollow granite and aircraft aluminum alloy materials, as well as high-precision linear scales and DC servo drives, enabling high-precision measurement. Its system resolution can reach 0.078 microns, ensuring the accuracy and reliability of measurement results.

[0065] Automation and Efficiency: The CMM is equipped with a computer program control system, which automates the measurement process, reducing manual intervention and simplifying operation. Through automated measurement and data processing, measurement efficiency can be significantly improved, especially in large-scale production inspections, where its automation significantly enhances production efficiency.

[0066] Wide Applicability: CMMs are suitable for measuring a wide variety of workpiece types and shapes, including parts, assemblies, plastics, and rubber components. They are widely used in a variety of fields, including automotive, aerospace, electronics, and mold making. Furthermore, they can be used in conjunction with other equipment to achieve more efficient automated production lines.

[0067] Data traceability: CMMs record workpiece measurement data and generate measurement reports. This data can be used for product quality control, production process monitoring, and product traceability. By comparing measurement data with design drawings, product quality can be ensured to meet design requirements.

[0068] Efficient Measurement: Compared to traditional manual measurement methods, CMMs offer significant advantages in both time efficiency and measurement complexity. Their high-speed motion systems and optimized measurement algorithms significantly shorten the entire measurement cycle, saving valuable time and costs.

[0069] Stability and reliability: CMMs offer high stability and reliability, maintaining measurement accuracy over extended periods of use. This is crucial for the production and quality control of high-precision parts, ensuring consistent and stable product quality.

[0070] The implementation principle of the embodiment of the present application is: the part is placed on the inspection table 2, the transverse movement module 3 controls the movement of the inspection table 2 to transport the part to the inspection position, and the measurement module 4 is used for rapid measurement, so as to quickly obtain the size and accuracy of the part.

[0071] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. Three-coordinate surface accuracy measuring instrument for semiconductor parts, characterized by: The invention comprises a machine (1), wherein a detection table (2) is installed on the machine (1), a transverse module (3) for controlling the movement of the detection table (2) is installed on the machine (1), a bellows (22) for protecting the transverse module (3) is installed on the detection table (2), a mounting plate (23) for fixing the bellows (22) is installed on the machine (1) and the detection table (2), a plug plate (221) is installed on the bellows (22), a slot (231) for accommodating the plug plate (221) is provided on the mounting plate (23), a fixing rod (241) is installed on the mounting plate (23), a pressure plate (242) is rotatably installed on the fixing rod (241), and the mounting plate (23) slides upward. A lifting rod (251) is movably installed, and one end of the lifting rod (251) close to the pressure plate (242) abuts against the pressure plate (242), a fixed disk (252) is installed on the lifting rod (251), a second spring (253) is sleeved on the lifting rod (251), and a limit strip (254) is installed on one end of the lifting rod (251) away from the pressure plate (242); a connecting rod (263) is installed on the fixed disk (252), a support plate (261) is installed on the mounting plate (23), a rotating rod (262) is rotatably installed on the supporting plate (261), the connecting rod (263) is slidably connected to the rotating rod (262), and the rotating rod (262) is connected to the The pressure plate (242) is fixed with a baffle (267), an adjusting rod (264) is slidably mounted on the mounting plate (23), a meshing tooth is provided on the side wall of the adjusting rod (264) close to the rotating rod (262), a toothed disc (265) is installed on one end of the rotating rod (262) close to the adjusting rod (264), the toothed disc (265) is meshed with the adjusting rod (264), a carrier plate (266) is installed on the adjusting rod (264), a folding groove (2661) is provided on the carrier plate (266), the baffle (267) is slidably mounted on the carrier plate (266) through the folding groove (2661), and a second guide rod ( 243), a lifting block (244) is slidably mounted on the second guide rod (243), a first spring (245) is sleeved on the second guide rod (243), one end of the first spring (245) is connected to the lifting block (244), and the other end is connected to the mounting plate (23), the lifting block (244) is arranged at one end close to the pressure plate (242) as an outwardly convex arc surface, a convex block (246) is mounted on the pressure plate (242), the convex block (246) is in contact with the arc surface of the lifting block (244), a pressure strip (247) is mounted at one end of the lifting block (244) away from the pressure plate (242), and a measuring module (4) for measuring is mounted on the machine (1).

2. The three-coordinate surface accuracy measuring instrument for semiconductor parts according to claim 1, characterized in that: The pressure strip (247) is made of rubber material.

3. The three-coordinate surface accuracy measuring instrument for semiconductor parts according to claim 1, characterized in that: A shift plate (281) is mounted on the pressure plate (242), a limiting rod (282) is slidably mounted on the mounting plate (23), a shift slot (2821) is provided on the limiting rod (282), an end of the shift plate (281) away from the pressure plate (242) extends into the shift slot (2821), and the shift plate (281) is movably connected to the limiting rod (282) via the shift slot (2821).

4. The three-coordinate surface accuracy measuring instrument for semiconductor parts according to claim 1, characterized in that: Anti-slip grooves are provided on the pressure plate (242) and / or the baffle (267).

5. The three-coordinate surface accuracy measuring instrument for semiconductor parts according to claim 1, characterized in that: The transverse movement module (3) includes a screw rod (31), the screw rod (31) is rotatably mounted on the machine platform (1), a motor (32) for controlling the rotation of the screw rod (31) is fixedly mounted on the machine platform (1), the detection platform (2) is threadedly connected to the screw rod (31), a first guide rod (33) is fixedly mounted on the machine platform (1), the first guide rod (33) is arranged parallel to the screw rod (31), and the first guide rod (33) passes through the detection platform (2) and is slidably connected to the detection platform (2).

6. The three-coordinate surface accuracy measuring instrument for semiconductor parts according to claim 1, characterized in that: A cushion block (21) is fixedly mounted on the detection platform (2).

7. A method for measuring semiconductor parts, using the semiconductor parts three-coordinate surface accuracy measuring instrument according to any one of claims 1 to 6, characterized in that: The steps include: Step 1: Check the environment to ensure that the measurement environment temperature is controlled at 20±2°C, the humidity is 40%-60%, and vibration interference is avoided; Step 2: Clean the equipment, guide rails and work surfaces; Step 3: Fix the workpiece and place it on the pad to ensure that there is no displacement during the measurement process. Move the complex workpiece on the pad to adjust it to the optimal measurement posture; Step 4: Probe configuration: select the probe type and probe accessories according to the features to be measured, and check the collision protection function after installation; Step 5: Probe calibration: Use a standard ball to calibrate the probe to ensure measurement accuracy; Step 6: Establish a coordinate system, collect three or more points on the workpiece surface, and define the reference plane; Step 7: Measure, preset program control path, cooperate with measurement module, and combine multi-point sampling to complete efficient measurement of complex shapes.

Images