Wafer contour measuring instrument

Abstract

The utility model discloses a wafer contour measuring instrument, and relates to the field of wafer production equipment. The wafer contour measuring instrument comprises a machine body, wherein a workbench is arranged in the machine body; the wafer contour measuring instrument further comprises a loading and unloading module which is arranged on the machine body and used for loading and unloading a wafer, and a bearing module, an edge searching module, an adjusting module, an original point detection module and a measuring module which are arranged on the workbench. The carrying module is used for transferring the wafer between the loading and unloading module and the bearing module; the bearing module is used for driving the wafer to move; the edge searching module is used for acquiring edge image information of the wafer; the adjusting module is used for adjusting the position of the wafer, so that the center of the wafer is aligned with the rotating center of the bearing module; the bearing module is also used for driving the wafer to move to the original point of the wafer to be aligned with the detection point of the original point detection module; the measuring module is used for measuring the contour of the wafer. The wafer contour measuring instrument provided by the utility model is higher in measuring efficiency and better in measuring precision.

Description

Technical Field

[0001] The utility model relates to the field of wafer production equipment, and in particular to a wafer profile measuring instrument. Background Art

[0002] During the wafer production process, after the wafer is polished, the wafer profile needs to be measured. The measurement content includes thickness, angle, chamfer status and notch width.

[0003] At present, the wafer profile measuring instruments on the market have a low degree of automation and require manual loading, unloading and transportation of wafers, as well as manual center adjustment and origin positioning of wafers. This results in low measurement efficiency and poor measurement accuracy. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer profile measuring instrument, which has the characteristics of higher measurement efficiency and better measurement accuracy.

[0005] The embodiment of the present utility model provides a technical solution:

[0006] A wafer profile measuring instrument includes a body, a loading and unloading module, a transport module, a carrying module, an edge-finding module, an adjustment module, an origin detection module, and a measurement module. The loading and unloading module is arranged on the body and is used to load and unload wafers. A workbench is arranged in the body, and the carrying module, the edge-finding module, the adjustment module, the origin detection module, and the measurement module are all arranged on the workbench.

[0007] The transport module is used to transport the wafer to be measured at the loading and unloading module to the carrying module; the carrying module is used to drive the wafer to move; the edge-finding module is used to obtain edge image information of the wafer during the process of the carrying module driving the wafer to rotate; the adjustment module is used to adjust the position of the wafer on the carrying module according to the edge image information so that the center of the wafer is aligned with the rotation center of the carrying module; the carrying module is also used to drive the wafer to move to align the origin of the wafer with the detection point of the origin detection module after the adjustment module completes the adjustment of the wafer; the measuring module is used to perform contour measurement on the wafer when the origin of the wafer is aligned with the detection point of the origin detection module; the transport module is also used to transport the wafer that has completed contour measurement from the carrying module to the loading and unloading module.

[0008] In an optional embodiment, the wafer profile measuring instrument further includes a fan filter module, which is disposed on the body and is used to provide clean air to the interior of the body.

[0009] In an optional embodiment, the transport module includes a first linear module located inside the body and connected to the body, and a transport robot connected to the first linear module, the transport robot being used to move in a first horizontal direction driven by the first linear module, and the transport robot being used to transfer the wafer between the loading and unloading module and the carrying module.

[0010] In an optional embodiment, the carrying module includes a second linear module, a rotary motor and a suction cup. The second linear module is arranged on the workbench, and the rotary motor is arranged on the second linear module for moving in a first horizontal direction under the drive of the second linear module. The rotary motor is connected to the suction cup for driving the suction cup to rotate, and the suction cup is used to adsorb or release the wafer.

[0011] In an optional embodiment, the adjustment module includes a double-motor linear module and two cam bearing followers. The double-motor linear module has two linear movers that can move in a second horizontal direction. The two linear movers are respectively located on opposite sides of the supporting module in the second horizontal direction. The two cam bearing followers are respectively arranged on the two linear movers. The two cam bearing followers are used to push the wafer to move relative to the supporting module under the drive of the two linear movers.

[0012] In an optional embodiment, the edge-finding module includes an edge-finding bracket, an edge-finding camera and an edge-finding light source. The edge-finding bracket is upright on the workbench. The edge-finding camera and the edge-finding light source are both arranged on the edge-finding bracket and arranged up and down. In the vertical direction, the supporting module is located below the edge-finding light source.

[0013] In an optional embodiment, the origin detection module includes an optical fiber holder and an optical fiber sensor, the optical fiber holder is erected on the workbench, and the optical fiber sensor is arranged on the optical fiber holder for detecting the origin of the wafer.

[0014] In an optional embodiment, the measurement module includes a vertical shooting component and a horizontal shooting component respectively arranged on the workbench, the vertical shooting component is used to shoot the wafer from a vertical direction to obtain vertical image information of the wafer; the horizontal shooting component is used to shoot the wafer from a horizontal direction to obtain horizontal image information of the wafer.

[0015] In an optional embodiment, the vertical shooting assembly includes a vertical slide, an intermediate pad, a horizontal slide, a mounting member, a vertical camera and a vertical light source. The vertical slide is upright on the workbench, and the intermediate pad is connected to the vertical slide for sliding in the vertical direction along the vertical slide; the mounting member is connected to the intermediate pad through the horizontal slide, for moving in the horizontal direction relative to the intermediate pad under the drive of the horizontal slide, the vertical camera is arranged on the mounting member, and the vertical light source and the vertical slide are located below the vertical camera.

[0016] In an optional embodiment, the horizontal shooting assembly includes a camera adjustment assembly, a horizontal camera assembly, a light source adjustment assembly and a horizontal light source assembly. The camera adjustment assembly and the horizontal light source assembly are respectively arranged on the workbench. The horizontal camera assembly is arranged on the camera adjustment assembly and is used to move in a horizontal plane under the drive of the camera adjustment assembly. The horizontal light source assembly is arranged on the light source adjustment assembly and is used to move in a horizontal plane under the drive of the light source adjustment assembly. The horizontal camera assembly and the horizontal light source assembly are respectively located on opposite sides of the supporting module in the second horizontal direction.

[0017] Compared to existing technologies, the wafer profile measuring instrument provided by the present invention achieves automatic wafer loading and unloading through a loading and unloading module, automatic wafer transport through a handling module, automatic wafer edge detection through a carrying module in conjunction with an edge detection module, automatic wafer center adjustment through an adjustment module, and automatic wafer positioning through an origin detection module. Once positioning is complete, the measurement module automatically measures the wafer. Therefore, the beneficial effects of the wafer profile measuring instrument provided by the present invention include: higher measurement efficiency and better measurement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and should not be considered as limiting the scope of the present invention. Those skilled in the art can also derive other relevant drawings based on these drawings without inventive effort.

[0019] Figure 1 A schematic structural diagram of a wafer profile measuring instrument provided in an embodiment of the present utility model;

[0020] Figure 2 A schematic diagram of a portion of the structure of a wafer profile measuring instrument provided in an embodiment of the present utility model;

[0021] Figure 3 for Figure 2Schematic diagram of the structure of the functional integration module in practical application;

[0022] Figure 4 Schematic diagram of the connection structure between the carrier module and the workbench;

[0023] Figure 5 This is a schematic diagram of the connection structure between the edge-finding module, the origin detection module, and the workbench;

[0024] Figure 6 Schematic diagram of the connection structure between the adjustment module and the workbench;

[0025] Figure 7 Schematic diagram of the connection structure between the measurement module and the workbench.

[0026] Icons: 100-wafer profile measuring instrument; 110-machine body; 111-workbench; 120-loading and unloading module; 130-handling module; 131-first linear module; 132-handling robot; 140-carrying module; 141-second linear module; 142-rotating motor; 143-suction cup; 150-edge-finding module; 151-edge-finding bracket; 152-edge-finding camera; 153-edge-finding light source; 160-adjustment module; 161-double-acting linear module; 1611-linear Mover; 162-Cam bearing follower; 170-Origin detection module; 171-Fiber optic bracket; 172-Fiber optic sensor; 180-Measurement module; 181-Vertical slide; 182-Intermediate pad; 183-Horizontal slide; 184-Mounting part; 185-Vertical camera; 186-Vertical light source; 187-Camera adjustment assembly; 188-Horizontal camera assembly; 189-Light source adjustment assembly; 1891-Horizontal light source assembly; 190-Fan filter module; 200-Wafer. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the embodiments of the present invention. It should be understood that the described embodiments are only a portion of the embodiments of the present invention, not all of them. Generally, the components of the embodiments of the present invention described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0030] In the description of the present utility model, it should be understood that the terms "upper", "lower", "inside", "outside", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are directions or positional relationships in which the utility model product is usually placed when in use, or are directions or positional relationships commonly understood by those skilled in the art. These directions or positional relationships are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present utility model.

[0031] Furthermore, the terms “first”, “second”, etc. are merely used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0032] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, terms such as "disposed" and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0033] The specific implementation of the present invention is described in detail below with reference to the accompanying drawings.

[0034] Example

[0035] See also Figure 1 , Figure 1 FIG. 1 is a schematic structural diagram of a wafer profile measuring instrument 100 provided in this embodiment.

[0036] The wafer profile measuring instrument 100 provided in this embodiment is used to perform profile measurement on a polished wafer 200 . The entire process is fully automatic and has the characteristics of higher measurement efficiency and better measurement accuracy.

[0037] Please refer to Figure 2 , Figure 2 FIG. 1 is a partial structural diagram of the wafer profile measuring instrument 100 .

[0038] The wafer profile measuring instrument 100 provided in this embodiment includes a body 110 , a loading and unloading module 120 , a transport module 130 and a function integration module. The loading and unloading module 120 is disposed on the body 110 and is used for automatically loading and unloading wafers 200 .

[0039] The interior of the machine body 110 is provided with a workbench 111, and the functional integration module is integrated on the workbench 111. The transport module 130 is used to transfer the wafers 200 to be measured, which are loaded from the loading and unloading module 120, to the functional integration module for measurement, and is also used to transfer the wafers 200 that have been measured from the functional integration module back to the loading and unloading module 120 for unloading.

[0040] To ensure that wafer 200 is not contaminated during the measurement process and to ensure the accuracy of the measurement results, in this embodiment, wafer profile measuring instrument 100 further includes a fan filter module 190. Fan filter module 190 is disposed on body 110 and is configured to provide clean air to the interior of body 110. It will be appreciated that fan filter module 190 filters external air before delivering it to the interior of body 110.

[0041] In this embodiment, in order to improve loading and unloading efficiency, there are two loading and unloading modules 120 , both of which are wafer 200 loaders and unloaders. The two loading and unloading modules 120 are arranged sequentially in the first horizontal direction.

[0042] The transport module 130 includes a first linear module 131 and a transport robot 132. The first linear module 131 is located within and connected to the housing 110. The first linear module 131 is connected to the transport robot 132. The transport robot 132 is driven by the first linear module 131 to move in a first horizontal direction. The transport robot 132 is used to transfer wafers 200 between the loading and unloading module 120 and the functional integration module.

[0043] Please refer to Figure 3 , Figure 3 The figure shows the structural diagram of the functional integration module in actual application.

[0044] In this embodiment, the functional integration module includes a carrying module 140 , an edge-finding module 150 , an adjustment module 160 , an origin detection module 170 , and a measurement module 180 , which are respectively disposed on the workbench 111 .

[0045] Figure 3 The direction indicated by the Y arrow is the first horizontal direction, the direction indicated by the X arrow is the second horizontal direction, and the direction indicated by the Z arrow is the vertical direction. The first horizontal direction and the second horizontal direction form an angle. In this embodiment, the first horizontal direction and the second horizontal direction are substantially perpendicular.

[0046] The transport module 130 is used to transfer the wafer 200 to be measured at the loading and unloading module 120 to the carrying module 140; the carrying module 140 is used to drive the wafer 200 to move, specifically including displacement in the first horizontal direction and rotation within the horizontal plane; the edge-finding module 150 is used to obtain edge image information of the wafer 200 during the process of the wafer 200 being rotated by the carrying module 140.

[0047] The adjustment module 160 is used to adjust the position of the wafer 200 on the carrier module 140 according to the edge image information so that the center of the wafer 200 is aligned with the rotation center of the carrier module 140; the carrier module 140 is also used to drive the wafer 200 to move to align the origin of the wafer 200 with the detection point of the origin detection module 170 after the adjustment module 160 completes the adjustment of the wafer 200.

[0048] The measurement module 180 is used to perform contour measurement on the wafer 200 when the origin of the wafer 200 is aligned with the detection point of the origin detection module 170; the transport module 130 is also used to transfer the wafer 200 after contour measurement from the carrying module 140 to the loading and unloading module 120.

[0049] Please refer to Figure 4 , Figure 4 It is a schematic diagram of the connection structure between the carrying module 140 and the workbench 111.

[0050] In this embodiment, the carrying module 140 includes a second linear module 141, a rotating motor 142 and a suction cup 143. The second linear module 141 is arranged on the workbench 111, and the rotating motor 142 is arranged on the second linear module 141, and is used to move in the first horizontal direction under the drive of the second linear module 141. The rotating motor 142 is connected to the suction cup 143, and is used to drive the suction cup 143 to rotate. The suction cup 143 is used to adsorb or release the wafer 200.

[0051] In this embodiment, a mounting groove extending in a first horizontal direction is concavely formed on the surface of the workbench 111 , and the second linear module 141 is accommodated in the mounting groove.

[0052] It is understood that before the transport module 130 transfers the wafer 200 to be measured from the loading and unloading module 120 to the carrier module 140, the rotary motor 142 and the suction cup 143 are located at one end of the second linear module 141 in the first horizontal direction. After the transport module 130 places the wafer 200 on the suction cup 143, the second linear module 141 drives the rotary motor 142 and the suction cup 143 to move toward the other end of the first horizontal direction, moving the wafer 200 into the area where the edge finding module 150, the adjustment module 160, the origin detection module 170, and the measurement module 180 are located.

[0053] The first linear module 131 and the second linear module 141 can both be linear motors. In this embodiment, the rotary motor 142 is a direct drive motor, and the suction cup 143 is a vacuum suction cup 143 .

[0054] Please refer to Figure 5 , Figure 5 It is a schematic diagram of the connection structure of the edge-finding module 150 , the origin detection module 170 and the workbench 111 .

[0055] The edge-finding module 150 and the origin detection module 170 are both located on the same side of the second linear module 141 in the second horizontal direction. The edge-finding module 150 includes an edge-finding bracket 151, an edge-finding camera 152, and an edge-finding light source 153. The edge-finding bracket 151 is vertically mounted on the workbench 111. The edge-finding camera 152 and the edge-finding light source 153 are both mounted on the edge-finding bracket 151 and arranged vertically. In the vertical direction, the supporting module 140 is located below the edge-finding light source 153.

[0056] The surface of the wafer 200 is coded. In this embodiment, the edge-finding camera 152 not only captures edge image information of the wafer 200 during rotation, but also acquires the wafer 200 code. After the edge-finding camera 152 acquires the edge image information of the wafer 200, the controller of the wafer profilometer 100 obtains the center position information of the current wafer 200 based on the edge image information. The controller of the wafer profilometer 100 also stores the measurement data of the current wafer 200 based on the code information acquired by the edge-finding camera 152.

[0057] Please refer to Figure 6 , Figure 6 FIG. 1 is a schematic diagram of the connection structure between the adjustment module 160 and the workbench 111 .

[0058] In this embodiment, the adjustment module 160 includes a double-motor linear module 161 and two cam bearing followers 162. The double-motor linear module 161 has two linear movers 1611 that can move in the second horizontal direction. The two linear movers 1611 are respectively located on the opposite sides of the supporting module 140 in the second horizontal direction. The two cam bearing followers 162 are respectively arranged on the two linear movers 1611. The two cam bearing followers 162 are used to push the wafer 200 to move relative to the supporting module 140 under the drive of the two linear movers 1611.

[0059] In actual application, after obtaining the center position information of wafer 200 through edge-finding module 150, the controller controls second linear module 141 to drive rotary motor 142 to move wafer 200 along a first horizontal direction until the edge of wafer 200 is between two cam bearing followers 162. The controller then controls dual-motor linear module 161 to operate, driving two linear movers 1611 to move in a second horizontal direction, which in turn drives two cam bearing followers 162 to move in the second horizontal direction, thereby pushing wafer 200 to move horizontally until the center of wafer 200 is aligned with the center of rotary motor 142.

[0060] It is understood that the position adjustment of the wafer 200 can be performed multiple times in multiple directions. For example, after completing adjustment of the wafer 200 in a certain horizontal direction, the rotary motor 142 drives the suction cup 143 to rotate the wafer 200 by a certain angle. The dual-motor linear module 161 then drives the two linear movers 1611 to move in a second horizontal direction, pushing the wafer 200 through the two cam bearing followers 162 to complete the position adjustment in another horizontal direction.

[0061] After the adjustment module 160 completes the position adjustment of the wafer 200, the origin detection module 170 positions the wafer 200. Specifically, the origin detection module 170 includes an optical fiber support 171 and an optical fiber sensor 172. The optical fiber support 171 is vertically mounted on the workbench 111, and the optical fiber sensor 172 is mounted on the optical fiber support 171 to detect the origin of the wafer 200.

[0062] It is understood that the origin of wafer 200 refers to the notch reserved at the edge of wafer 200 during the early production process. During the positioning process, the detection point of fiber optic sensor 172 is at the edge of wafer 200. Rotary motor 142 drives wafer 200 to rotate, causing the edge of wafer 200 to sequentially scan the detection points of fiber optic sensor 172 until the notch at the edge of wafer 200 is aligned with the detection point of fiber optic sensor 172. At this point, the controller controls rotary motor 142 to stop, completing the positioning of wafer 200. After the origin of wafer 200 is positioned, measurement module 180 performs contour measurement on wafer 200.

[0063] Please refer to Figure 7 , Figure 7 FIG. 1 is a schematic diagram of the connection structure between the measurement module 180 and the workbench 111 .

[0064] The measurement module 180 includes a vertical shooting component and a horizontal shooting component respectively arranged on the workbench 111. The vertical shooting component is used to shoot the wafer 200 from a vertical direction to obtain vertical image information of the wafer 200; the horizontal shooting component is used to shoot the wafer 200 from a horizontal direction to obtain horizontal image information of the wafer 200.

[0065] In this embodiment, the vertical shooting assembly includes a vertical slide 181, an intermediate pad 182, a horizontal slide 183, a mounting member 184, a vertical camera 185 and a vertical light source 186. The vertical slide 181 is upright on the workbench 111, and the intermediate pad 182 is connected to the vertical slide 181 for sliding in the vertical direction along the vertical slide 181; the mounting member 184 is connected to the intermediate pad 182 through the horizontal slide 183, and is driven by the horizontal slide 183 to move in the horizontal direction relative to the intermediate pad 182. The vertical camera 185 is arranged on the mounting member 184, and the vertical light source 186 and the vertical slide 181 are located below the vertical camera 185.

[0066] The vertical slide 181 includes a vertical slide rail and a vertical slider. The vertical slide rail extends vertically upward, and the vertical slider slides with the vertical slide rail. The middle pad 182 is connected to the vertical slider. By adjusting the position of the vertical slider on the vertical slide rail, the height of the middle pad 182 can be adjusted, thereby achieving the height adjustment of the vertical camera 185 for easy focusing.

[0067] The horizontal slide 183 includes a horizontal slide rail extending in the second horizontal direction, and a horizontal slider that slides with the horizontal slide rail. The horizontal slide rail is connected to the intermediate pad 182 through a mounting plate, and the mounting member 184 is connected to the horizontal slider. It can drive the vertical camera 185 to move in the second horizontal direction under the action of external force to obtain an ideal shooting effect.

[0068] The vertical slide 181 has two vertical sliders: the upper slider is connected to the middle pad 182, and the lower slider is connected to the vertical light source 186, allowing the height of the vertical light source 186 to be adjusted. When the vertical camera 185 is taking pictures, the vertical camera 185 is above the wafer 200, and the vertical light source 186 is below the wafer 200.

[0069] The horizontal shooting assembly includes a camera adjustment assembly 187, a horizontal camera assembly 188, a light source adjustment assembly 189 and a horizontal light source assembly 1891. The camera adjustment assembly 187 and the horizontal light source assembly 1891 are respectively arranged on the workbench 111. The horizontal camera assembly 188 is arranged on the camera adjustment assembly 187 and is used to move in the horizontal plane under the drive of the camera adjustment assembly 187. The horizontal light source assembly 1891 is arranged on the light source adjustment assembly 189 and is used to move in the horizontal plane under the drive of the light source adjustment assembly 189. The horizontal camera assembly 188 and the horizontal light source assembly 1891 are respectively located on opposite sides of the supporting module 140 in the second horizontal direction.

[0070] Camera adjustment assembly 187 is capable of adjusting the position of horizontal camera assembly 188 in the first and second horizontal directions, as well as the deflection angle within the horizontal plane, in response to external forces. Horizontal camera assembly 188 comprises a horizontal camera and a camera grating located in front of the horizontal camera lens. Light source adjustment assembly 189 is capable of adjusting the position of horizontal light source assembly 1891 in the first and second horizontal directions in response to external forces. In this embodiment, horizontal light source assembly 1891 comprises a horizontal light source and a light source grating located in front of the horizontal light source.

[0071] When the horizontal shooting assembly is working, the camera adjustment assembly 187 and the light source adjustment assembly 189 ensure that the horizontal camera assembly 188 and the horizontal light source assembly 1891 are aligned in the second horizontal direction, thereby obtaining an ideal shooting effect.

[0072] After the vertical shooting assembly and the horizontal shooting assembly complete vertical shooting and horizontal shooting of the wafer 200 , various contour information of the wafer 200 is collected, and then the transport module 130 transfers the wafer 200 after measurement to the loading and unloading module 120 .

[0073] In summary, the wafer profile measuring instrument 100 provided in this embodiment has the characteristics of higher measurement efficiency and better measurement accuracy.

[0074] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer profile measuring instrument, characterized in that: The invention comprises a machine body (110), a loading and unloading module (120), a transport module (130), a carrying module (140), an edge-finding module (150), an adjustment module (160), an origin detection module (170) and a measurement module (180), wherein the loading and unloading module (120) is arranged on the machine body (110) and is used for loading and unloading wafers (200); a workbench (111) is arranged in the machine body (110), and the carrying module (140), the edge-finding module (150), the adjustment module (160), the origin detection module (170) and the measurement module (180) are all arranged on the workbench (111); The transport module (130) is used to transport the wafer (200) to be measured at the loading and unloading module (120) to the carrying module (140); the carrying module (140) is used to drive the wafer (200) to move; the edge-finding module (150) is used to obtain edge image information of the wafer (200) during the process of the wafer (200) being driven to rotate by the carrying module (140); the adjustment module (160) is used to adjust the position of the wafer (200) on the carrying module (140) according to the edge image information, so that the center of the wafer (200) is aligned with the rotation of the carrying module (140). Center alignment; the carrying module (140) is also used to drive the wafer (200) to move to align the origin of the wafer (200) with the detection point of the origin detection module (170) after the adjustment module (160) completes the adjustment of the wafer (200); the measuring module (180) is used to perform contour measurement on the wafer (200) when the origin of the wafer (200) is aligned with the detection point of the origin detection module (170); the transport module (130) is also used to transfer the wafer (200) that has completed the contour measurement from the carrying module (140) to the loading and unloading module (120).

2. The wafer profile measuring instrument according to claim 1, wherein: The wafer profile measuring instrument (100) further includes a fan filter module (190), which is arranged on the machine body (110) and is used to provide clean air to the interior of the machine body (110).

3. The wafer profile measuring instrument according to claim 1, wherein: The transport module (130) includes a first linear module (131) located inside the body (110) and connected to the body (110), and a transport robot (132) connected to the first linear module (131). The transport robot (132) is used to move in a first horizontal direction under the drive of the first linear module (131). The transport robot (132) is used to transfer the wafer (200) between the loading and unloading module (120) and the carrying module (140).

4. The wafer profile measuring instrument according to claim 1, wherein: The carrying module (140) includes a second linear module (141), a rotating motor (142) and a suction cup (143), wherein the second linear module (141) is arranged on the workbench (111), and the rotating motor (142) is arranged on the second linear module (141) and is used to move in a first horizontal direction under the drive of the second linear module (141), and the rotating motor (142) is connected to the suction cup (143) and is used to drive the suction cup (143) to rotate, and the suction cup (143) is used to adsorb or release the wafer (200).

5. The wafer profile measuring instrument according to claim 1, wherein: The adjustment module (160) includes a double-moving linear module (161) and two cam bearing followers (162). The double-moving linear module (161) has two linear movers (1611) that can move in a second horizontal direction. The two linear movers (1611) are respectively located on opposite sides of the supporting module (140) in the second horizontal direction. The two cam bearing followers (162) are respectively arranged on the two linear movers (1611). The two cam bearing followers (162) are used to push the wafer (200) to move relative to the supporting module (140) under the drive of the two linear movers (1611).

6. The wafer profile measuring instrument according to claim 1, wherein: The edge-finding module (150) includes an edge-finding bracket (151), an edge-finding camera (152) and an edge-finding light source (153). The edge-finding bracket (151) is vertically arranged on the workbench (111). The edge-finding camera (152) and the edge-finding light source (153) are both arranged on the edge-finding bracket (151) and arranged up and down. In the vertical direction, the supporting module (140) is located below the edge-finding light source (153).

7. The wafer profile measuring instrument according to claim 1, wherein: The origin detection module (170) includes an optical fiber bracket (171) and an optical fiber sensor (172), wherein the optical fiber bracket (171) is vertically arranged on the workbench (111), and the optical fiber sensor (172) is arranged on the optical fiber bracket (171) for detecting the origin of the wafer (200).

8. The wafer profile measuring instrument according to claim 1, wherein: The measuring module (180) includes a vertical shooting component and a horizontal shooting component respectively arranged on the workbench (111), wherein the vertical shooting component is used to shoot the wafer (200) in a vertical direction to obtain vertical image information of the wafer (200); and the horizontal shooting component is used to shoot the wafer (200) in a horizontal direction to obtain horizontal image information of the wafer (200).

9. The wafer profile measuring instrument according to claim 8, characterized in that: The vertical shooting assembly comprises a vertical slide (181), an intermediate pad (182), a horizontal slide (183), a mounting member (184), a vertical camera (185) and a vertical light source (186). The vertical slide (181) is erected on the workbench (111). The intermediate pad (182) is connected to the vertical slide (181) and is used to slide in a vertical direction along the vertical slide (181). The mounting member (184) is connected to the intermediate pad (182) through the horizontal slide (183) and is used to move in a horizontal direction relative to the intermediate pad (182) under the drive of the horizontal slide (183). The vertical camera (185) is arranged on the mounting member (184). The vertical light source (186) and the vertical slide (181) are located below the vertical camera (185).

10. The wafer profile measuring instrument according to claim 8, wherein: The horizontal shooting assembly includes a camera adjustment assembly (187), a horizontal camera assembly (188), a light source adjustment assembly (189) and a horizontal light source assembly (1891). The camera adjustment assembly (187) and the horizontal light source assembly (1891) are respectively arranged on the workbench (111). The horizontal camera assembly (188) is arranged on the camera adjustment assembly (187) and is used to move in a horizontal plane under the drive of the camera adjustment assembly (187). The horizontal light source assembly (1891) is arranged on the light source adjustment assembly (189) and is used to move in a horizontal plane under the drive of the light source adjustment assembly (189). The horizontal camera assembly (188) and the horizontal light source assembly (1891) are respectively located on opposite sides of the carrier module (140) in the second horizontal direction.

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