Temperature monitoring method, device and system for copper bar energy storage connector

Abstract

The invention relates to the technical field of data processing, in particular to a copper bar energy storage connector temperature monitoring method, device and system. The method comprises the following steps: acquiring a temperature data sequence and a current data sequence of the connector; according to the temperature data sequence and the current data sequence, obtaining a heat conduction efficiency index of the current segment; obtaining the standard degree of the current segment according to the heat conduction efficiency index; obtaining the corrected temperature conduction delay of the current segment; merging the current segments according to the corrected temperature conduction delay; obtaining the predicted temperature of the merged current segments; and monitoring the temperature of the connector in real time according to the predicted temperature. According to the embodiment of the invention, a series of data processing is carried out on the monitored current data and temperature data, the hysteresis effect caused by the thermal inertia effect can be overcome, the accuracy and timeliness of the temperature monitoring of the copper bar energy storage connector are improved, and the safe operation of an energy storage system is ensured.

Description

Technical Field

[0001] This application belongs to the technical field of data processing, and particularly relates to a temperature monitoring method, device and system for copper busbar energy storage connectors. Background Art

[0002] A copper busbar energy storage connector is a key component specifically used for power transmission and connection in an energy storage system, usually composed of a copper busbar and a connector. It is typically designed to connect battery packs, inverters and other energy storage devices, and has low resistance, high current-carrying capacity and good heat resistance, which can ensure efficient energy transmission and reliable operation of the devices.

[0003] During the high-current operation of the energy storage system, the connector may generate heat due to resistance or poor contact, resulting in a temperature rise. If the temperature is too high, it may cause material aging, performance degradation and even potential safety hazards such as short circuits or fires. By real-time temperature monitoring, abnormal temperature rises can be detected in a timely manner, potential faults can be prevented, the safety and stability of the system operation can be improved, and at the same time, the device life can be extended. Temperature monitoring is one of the important guarantee measures for the reliable operation of the energy storage system.

[0004] However, in the prior art, when using a temperature sensor for temperature monitoring, due to the existence of the thermal inertia effect, that is, the copper busbar and the connector have a certain heat capacity, and their temperature changes are affected by material heat conduction and heat capacity, resulting in the change detected by the temperature sensor lagging behind the actual temperature change. This lag effect may lead to the failure to detect sudden abnormal temperature rises in a timely manner, especially when a high-temperature abnormal fault occurs within a short period of time, and the safety of the system cannot be ensured. Summary of the Invention

[0005] In order to solve the above problems, the embodiments of this application provide a temperature monitoring method, device and system for copper busbar energy storage connectors.

[0006] According to the first aspect of the embodiments of this application, a temperature monitoring method for copper busbar energy storage connectors is provided, and the method includes: Obtain the temperature data sequence and current data sequence of the connector; According to the temperature data sequence and the current data sequence, obtain the heat conduction efficiency index of current segments; According to the heat conduction efficiency index, obtain the standard degree of the current segments; Obtain the corrected temperature conduction delay of the current segments; According to the corrected temperature conduction delay, perform the merging of the current segments; Obtain the predicted temperature of the merged current segments; According to the predicted temperature, perform real-time monitoring on the temperature of the connector.

[0007] Optionally, obtaining the heat conduction efficiency index of the current segment includes: Obtaining the duration from the start time to the peak time of the current segment; Obtaining the current amplitude at the start time of the current segment; Obtaining the peak current amplitude of the current segment; Obtaining the heat conduction efficiency index of the current segment according to the duration, the current amplitude at the start time, and the peak current amplitude.

[0008] Optionally, obtaining the standard degree of the current segment includes: Obtaining the first standard degree of the current segment; The obtaining of the first standard degree of the current segment includes: Obtaining the number and sequence number of the current segments after the current segment; Obtaining the heat conduction efficiency index of the current segments after the current segment; Obtaining the first standard degree of the current segment according to the heat conduction efficiency index of the current segment, the number, the sequence number, and the heat conduction efficiency index of the current segments after the current segment; Obtaining the second standard degree of the current segment; The obtaining of the second standard degree of the current segment includes: Obtaining the number of the current segments before the current segment and the time distance between the current segment and the current segments before it; Obtaining the variance of the current amplitudes of the current segments before the current segment; Obtaining the second standard degree of the current segment according to the number, the time distance, and the variance; Obtaining the standard degree of the current segment according to the first standard degree and the second standard degree.

[0009] Optionally, obtaining the corrected temperature conduction delay of the current segment includes: Obtaining the temperature conduction delay of the current segment; Obtaining the conduction similarity weight of the current segment; Obtaining the corrected temperature conduction delay of the current segment according to the standard degree, the temperature conduction delay, and the conduction similarity weight.

[0010] Optionally, obtaining the temperature conduction delay of the current segment includes: Obtaining the proportionality index of the current segment relative to the target temperature segment; Obtaining the degree of dispersion of the proportionality index of the current segment relative to the target temperature segment; Segment the target temperature with the smallest degree of dispersion as the matching temperature segment for the current segment; Use the time difference between the peak temperature moment of the matching temperature segment and the peak current moment of the current segment as the temperature conduction delay of the current segment.

[0011] Optionally, obtaining the proportionality index of the current segment relative to the target temperature segment includes: Obtain the temperature peak of the target temperature segment; Obtain the current peak of the current segment; Obtain the proportionality index of the current segment relative to the target temperature segment according to the temperature peak and the current peak.

[0012] Optionally, obtaining the predicted temperature of the merged current segment includes: Obtain the similarity between the merged current segment and the previously merged current segment; Obtain the temperature matching value of the previously merged current segment; The obtaining of the temperature matching value of the previously merged current segment includes: Use the temperature segment corresponding to the moment of the corrected temperature conduction delay of the current segment where the last current peak in the previously merged current segment is located as the corrected temperature matching segment of the previously merged current segment; Use the peak temperature amplitude of the corrected temperature matching segment as the temperature matching value of the previously merged current segment; Obtain the predicted temperature of the merged current segment according to the similarity and the temperature matching value.

[0013] Optionally, obtaining the similarity between the merged current segment and the previously merged current segment includes: Obtain a first average current, where the first average current is the average current of the merged current segment; Obtain a second average current, where the second average current is the average current of the previously merged current segment; Obtain a first duration, where the first duration is the duration of the merged current segment; Obtain a second duration, where the second duration is the duration of the previously merged current segment; Obtain the similarity between the merged current segment and the previously merged current segment according to the first average current, the second average current, the first duration, and the second duration.

[0014] According to the second aspect of the embodiments of the present application, there is provided a temperature monitoring device for a copper bus energy storage connector, the device comprising: A first acquisition module, configured to acquire the temperature data sequence and the current data sequence of the connector; A second acquisition module, configured to acquire the heat conduction efficiency index of current segments according to the temperature data sequence and the current data sequence; A third acquisition module, configured to acquire the standard degree of the current segments according to the heat conduction efficiency index; A fourth acquisition module, configured to acquire the corrected temperature conduction delay of the current segments; A merging module, configured to merge the current segments according to the corrected temperature conduction delay; A fifth acquisition module, configured to acquire the predicted temperature of the merged current segments; A monitoring module, configured to perform real-time monitoring on the temperature of the connector according to the predicted temperature.

[0015] According to the third aspect of the embodiments of the present application, there is provided a temperature monitoring system for a copper bus energy storage connector, the system comprising a temperature monitoring platform, and the temperature monitoring platform comprises: A memory, on which a computer program is stored; A processor, configured to execute the computer program in the memory to implement the steps of the method according to any one of the first aspect.

[0016] In summary, the embodiments of the present application provide a temperature monitoring method for a copper bus energy storage connector, the method comprising: acquiring the temperature data sequence and the current data sequence of the connector; acquiring the heat conduction efficiency index of current segments according to the temperature data sequence and the current data sequence; acquiring the standard degree of the current segments according to the heat conduction efficiency index; acquiring the corrected temperature conduction delay of the current segments; merging the current segments according to the corrected temperature conduction delay; acquiring the predicted temperature of the merged current segments; performing real-time monitoring on the temperature of the connector according to the predicted temperature. By performing a series of data processing on the monitored current data and temperature data, the embodiments of the present application can overcome the lag effect caused by the thermal inertia effect, improve the accuracy and timeliness of the temperature monitoring of the copper bus energy storage connector, and thus ensure the safe operation of the energy storage system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application, the drawings required for the embodiments will be briefly introduced below. It should be understood that the drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained according to the drawings without creative efforts.

[0018] Figure 1 It is a flowchart of a method for monitoring the temperature of a copper bus energy storage connector shown according to an exemplary embodiment.

[0019] Figure 2 It is a flowchart of a method for obtaining the heat conduction efficiency index of current segments shown according to an exemplary embodiment.

[0020] Figure 3 It is a flowchart of a method for obtaining the standard degree of current segments shown according to an exemplary embodiment.

[0021] Figure 4 It is a flowchart of a method for obtaining the corrected temperature conduction delay of current segments shown according to an exemplary embodiment.

[0022] Figure 5 It is a flowchart of a method for obtaining the temperature conduction delay of current segments shown according to an exemplary embodiment.

[0023] Figure 6 It is a flowchart of a method for obtaining the ratio index of current segments relative to target temperature segments shown according to an exemplary embodiment.

[0024] Figure 7 It is a flowchart of a method for obtaining the predicted temperature of merged current segments shown according to an exemplary embodiment.

[0025] Figure 8 It is a flowchart of a method for obtaining the similarity between merged current segments and previously merged current segments shown according to an exemplary embodiment.

[0026] Figure 9 It is a block diagram of a temperature monitoring device for a copper bus energy storage connector shown according to an exemplary embodiment.

[0027] Figure 10 It is a block diagram of a temperature monitoring system for a copper bus energy storage connector shown according to an exemplary embodiment.

[0028] Figure 11 It is a block diagram of a temperature monitoring platform shown according to an exemplary embodiment. Detailed implementation manners

[0029] To clearly illustrate the technical features of this solution, the present application will be elaborated in detail below through specific implementation manners in combination with the accompanying drawings.

[0030] Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although some embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Instead, these embodiments are provided to more thoroughly and completely understand the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not used to limit the protection scope of the present application.

[0031] It should be understood that the various steps recited in the method embodiments of the present application can be executed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this regard.

[0032] As used herein, the term "comprising" and its variations are open-ended, i.e., "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0033] It should be noted that the concepts such as "first" and "second" mentioned in the present application are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0034] It should be noted that the modifications of "one" and "plural" mentioned in the present application are illustrative rather than restrictive. Those skilled in the art should understand that unless otherwise clearly specified in the context, it should be understood as "one or more". In the description of the present application, unless otherwise stated, "plural" means two or more, and other quantifiers are similar; "at least one (item)", "one (item) or more (items)" or their similar expressions refer to any combination of these items (items), including any combination of single item (item) or plural items (items). For example, at least one (item) a can represent any number of a; for another example, one (item) or more (items) of a, b and c can represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, c can be single or plural; "and / or" is a description of the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Among them, A and B can be singular or plural.

[0035] In the embodiments of the present application, although operations or steps are described in a specific order in the drawings, it should not be understood that these operations or steps are required to be performed in the specific order shown or in a serial order, or that all the operations or steps shown are required to obtain the desired result. In the embodiments of the present application, these operations or steps can be performed serially; they can also be performed in parallel; or a part of these operations or steps can be performed.

[0036] Meanwhile, it can be understood that the data involved in this technical solution (including but not limited to the data itself, the acquisition or use of data) should comply with the requirements of corresponding laws, regulations and related provisions.

[0037] First, the application scenario of the present application is described. In the monitored connector current sequence and connector temperature sequence, since the current fluctuates relatively fast and the temperature delay caused by different current fluctuations is different, there will be a situation where multiple current segments correspond to the same temperature segment. The present invention determines the standard degree of the current, determines whether each current segment is affected by adjacent current segments according to the standard degree, and then merges the current segments. After obtaining the merged current segments, since it is necessary to match the merged current segments and temperature segments, the present invention obtains the temperature matching value of the merged current segments by correcting the temperature conduction delay, and obtains the predicted temperature according to the similarity between the latest merged current segments and other merged current segments, so that the temperature of the copper bus energy storage connector can be monitored more accurately and timely, ensuring the safe operation of the energy storage system. The present application is described below with reference to specific embodiments.

[0038] Figure 1 is a flowchart of a method for monitoring the temperature of a copper bus energy storage connector shown according to an exemplary embodiment. As Figure 1 shown, the embodiments of the present application provide a method for monitoring the temperature of a copper bus energy storage connector, which may include the following steps: In step S10, obtain the temperature data sequence and current data sequence of the connector.

[0039] In this step, the temperature data sequence and current data sequence of the connector are obtained. Exemplarily, during the operation of the copper bus energy storage connector, the greater the current passing through the copper bus energy storage connector, the higher the temperature of the copper bus energy storage connector. Therefore, too high a temperature is an indication of too large a current, and too high a temperature can cause material aging, performance degradation and even safety hazards. Therefore, in order to improve the sensitivity of temperature monitoring, the current data and temperature data are collected simultaneously.

[0040] Install a Hall effect sensor near the joint of the copper bus energy storage connector to monitor the current passing through the copper bus energy storage connector in real time. The acquisition frequency can be once every 0.1 seconds to obtain the connector current sequence. Install a temperature sensor on the surface of the copper bus to monitor the temperature of the copper bus surface in real time. The acquisition time and frequency are the same as those of the current, and the connector temperature sequence is obtained.

[0041] In step S20, according to the temperature data sequence and the current data sequence, obtain the heat conduction efficiency index of the current segment.

[0042] In this step, according to the temperature data sequence and the current data sequence, obtain the heat conduction efficiency index of the current segment. Exemplarily, the connector current data sequence and the connector temperature data sequence can be segmented respectively. The segmentation method is to obtain all the minimum value points in the sequence, and record the interval range between adjacent minimum values as a current segment or a temperature segment. Then for any current segment, first obtain the duration from the start time to the peak time of the current segment, then obtain the current amplitude at the start time of the current segment, then obtain the peak current amplitude of the current segment, and finally obtain the heat conduction efficiency index of the current segment according to the duration, the current amplitude at the start time, and the peak current amplitude.

[0043] In step S30, according to the heat conduction efficiency index, obtain the standard degree of the current segment.

[0044] In this step, according to the heat conduction efficiency index, obtain the standard degree of the current segment. Exemplarily, first obtain the first standard degree of the current segment, and then obtain the second standard degree of the current segment. Then, according to the first standard degree and the second standard degree, obtain the standard degree of the current segment.

[0045] In step S40, obtain the corrected temperature conduction delay of the current segment.

[0046] In this step, obtain the corrected temperature conduction delay of the current segment. Exemplarily, first obtain the temperature conduction delay of the current segment, then obtain the conduction similarity weight of the current segment, and then obtain the corrected temperature conduction delay of the current segment according to the standard degree, the temperature conduction delay, and the conduction similarity weight.

[0047] In step S50, according to the corrected temperature conduction delay, perform the merging of the current segments.

[0048] In this step, the current segments are merged according to the corrected temperature conduction delay. Exemplarily, for any current segment, if the corrected temperature conduction delay of the current segment plus the time difference between the current segment and the temperature peak corresponding to the next current segment is less than the corrected temperature conduction delay of the next current segment, then the current segment is merged with the next current segment.

[0049] Since the current changes are relatively sensitive while the temperature changes are relatively slow, it is possible that a temperature segment is the result of the combined changes of several current segments. Therefore, it is necessary to merge several current segments, so that a merged current segment can correspond to a temperature segment.

[0050] The temperature changes corresponding to different current changes are different. A sudden large current change will cause rapid heating with a short heating-up delay; while a slowly changing current results in a more obvious heating-up delay. So for any current segment, if the heat generated by the current segment has not been conducted to the position monitored by the temperature sensor, and the heat of the next current segment has been conducted to the monitored position of the temperature sensor due to a large current change and a small delay, then the heating effects generated by the two current segments will be superimposed, so the two current segments can be merged.

[0051] In addition, if there are three current segments 1, 2, and 3 arranged in sequence, and if 1 and 2 can be merged, and 2 and 3 can be merged, then 1, 2, and 3 can be merged into one current segment.

[0052] In step S60, the predicted temperature of the merged current segment is obtained.

[0053] In this step, the predicted temperature of the merged current segment is obtained. Exemplarily, the similarity between the merged current segment and the previously merged current segment can be obtained first, then the temperature matching value of the previously merged current segment is obtained, and then the predicted temperature of the merged current segment is obtained according to this similarity and this temperature matching value.

[0054] In step S70, the temperature of the connector is monitored in real time according to the predicted temperature.

[0055] In this step, the temperature of the connector is monitored in real time according to the predicted temperature. Exemplarily, an alarm prompt can be given when the predicted temperature is greater than or equal to a preset temperature threshold; continuous monitoring is performed when the predicted temperature is less than the preset temperature threshold. The preset temperature threshold can be 110°C.

[0056] In summary, the embodiment of the present application provides a method for monitoring the temperature of a copper bus energy storage connector. The method includes: obtaining a temperature data sequence and a current data sequence of the connector; obtaining a heat conduction efficiency index for current segments according to the temperature data sequence and the current data sequence; obtaining a standard degree for the current segments according to the heat conduction efficiency index; obtaining a corrected temperature conduction delay for the current segments; merging the current segments according to the corrected temperature conduction delay; obtaining a predicted temperature for the merged current segments; and performing real-time monitoring of the temperature of the connector according to the predicted temperature. By performing a series of data processing on the monitored current data and temperature data, the embodiment of the present application can overcome the lag effect caused by the thermal inertia effect, improve the accuracy and timeliness of the temperature monitoring of the copper bus energy storage connector, and thus ensure the safe operation of the energy storage system.

[0057] Figure 2 FIG. is a flowchart of a method for obtaining a heat conduction efficiency index for current segments according to an exemplary embodiment. As Figure 2 shown, the obtaining of the heat conduction efficiency index for current segments may include the following steps: In step S201, obtain the duration from the start time to the peak time of the current segment.

[0058] In this step, obtain the duration from the start time to the peak time of current segment a .

[0059] In step S202, obtain the current amplitude at the start time of the current segment.

[0060] In this step, obtain the current amplitude at the start time of current segment a . In step S203, obtain the peak current amplitude of the current segment.

[0061] In this step, obtain the peak current amplitude of current segment a .

[0062] In step S204, obtain the heat conduction efficiency index for the current segment according to the duration, the current amplitude at the start time, and the peak current amplitude.

[0063] In this step, according to the duration , the current amplitude at the start time , and the peak current amplitude , obtain the heat conduction efficiency index of current segment a . Exemplarily, the heat conduction efficiency index of current segment a can be obtained by the following formula: (1) Among them, the duration from the starting moment to the peak moment of current segment a is not zero.

[0064] The temperature heating power of the copper bar energy storage connector is related to the current. The greater the change in the current within a short period of time, the greater the temperature conduction rate and the thermal conduction efficiency index is greater.

[0065] Figure 3 is a flowchart of a method for obtaining the standard degree of a current segment shown according to an exemplary embodiment. As Figure 3 shown, obtaining the standard degree of the current segment may include the following steps: In step S301, obtain the first standard degree of the current segment. Among them, obtaining the first standard degree of the current segment may include the following sub-steps: Step S3011, obtain the number and sequence number of the current segments after the current segment.

[0066] In this step, obtain the number of all current segments after current segment a , and the sequence number of current segment c after current segment a .

[0067] Step S3012, obtain the thermal conduction efficiency index of the current segments after the current segment.

[0068] In this step, obtain the thermal conduction efficiency index of current segment c after current segment a .

[0069] Step S3013, obtain the first standard degree of the current segment according to the thermal conduction efficiency index of the current segment, the number, the sequence number, and the thermal conduction efficiency index of the current segments after the current segment.

[0070] In this step, according to the thermal conduction efficiency index of current segment a , the number , the sequence number c, and the thermal conduction efficiency index of current segment c after current segment a , obtain the first standard degree of current segment a . Exemplarily, the first standard degree of current segment a can be obtained by the following formula: (2) Among them, exp is the exponential function with the natural number e as the base.

[0071] The requirements for being able to be a standard current segment are as follows: not affected by other current segments, that is, for any current segment, the current segment before this current segment tends to be stable, and the temperature conduction rate caused by the current segment after this current segment is less than the temperature conduction rate caused by this current segment.

[0072] For any current segment, the closer the current segment after this current segment is to this current segment, the less the temperature conduction rate caused by it is than the temperature conduction rate caused by this current segment, indicating that the subsequent current segment will not cause the influence of temperature superposition on this current segment, and the current current segment is more likely to be a standard current segment.

[0073] In step S302, obtain the second standard degree of the current segment. Among them, The obtaining of the second standard degree of the current segment may include the following sub-steps: Step S3021, obtain the number of current segments before this current segment, and the time distance between this current segment and the current segments before it.

[0074] In this step, obtain the number of current segments before current segment a , and the time distance between current segment a and current segment d before current segment a .

[0075] Step S3022, obtain the variance of the current amplitudes of the current segments before this current segment.

[0076] In this step, obtain the variance of the current amplitudes of current segment d before current segment a .

[0077] Step S3023, obtain the second standard degree of the current segment according to the number, the time distance, and the variance.

[0078] In this step, according to the number , the time distance , and the variance , obtain the second standard degree of current segment a . Exemplarily, the second standard degree of current segment a can be obtained by the following formula: (3)[[ID=:45]] Among them, exp is the exponential function with the natural number e as the base.

[0079] For any current segment, the closer the current segment before it is in terms of time distance, the more stable it tends to be, indicating that there is not much current fluctuation before this current segment, and this current segment is relatively independent and not affected by other current segments. Then, this current segment is more likely to be used as a standard current segment.

[0080] In step S303, according to the first standard degree and the second standard degree, obtain the standard degree of the current segment.

[0081] In this step, according to the first standard degree and the second standard degree , obtain the standard degree of current segment a . Exemplarily, the standard degree of current segment a can be obtained by the following formula: = (4) Figure 4 is a flowchart of a method for obtaining the corrected temperature conduction delay of a current segment shown according to an exemplary embodiment. As Figure 4 shown, the obtaining of the corrected temperature conduction delay of the current segment may include the following steps: In step S401, obtain the temperature conduction delay of the current segment.

[0082] In this step, obtain the temperature conduction delay of the current segment . Exemplarily, first obtain the proportionality index of the current segment relative to the target temperature segment, then obtain the degree of dispersion of the proportionality index of the current segment relative to the target temperature segment, then take the target temperature segment with the smallest degree of dispersion as the matching temperature segment of the current segment, and finally take the time difference between the peak temperature moment of the matching temperature segment and the peak current moment of the current segment as the temperature conduction delay of the current segment .

[0083] In step S402, obtain the conduction similarity weight of the current segment.

[0084] In this step, obtain the conduction similarity weight between current segment a and current segment f . Exemplarily, the conduction similarity weight between current segment a and current segment f can be obtained by the following formula: (5) Wherein, is the heat conduction efficiency index of current segment a, is the heat conduction efficiency index of current segment f, and current segment f is any current segment other than current segment a, is the weight normalization function.

[0085] In step S403, according to the standard degree, the temperature conduction delay, and the conduction similarity weight, obtain the corrected temperature conduction delay of the current segment.

[0086] In this step, according to the standard degree , , the temperature conduction delay , , and the conduction similarity weight , obtain the corrected temperature conduction delay of current segment a . Exemplarily, the corrected temperature conduction delay of current segment a can be obtained by the following formula: (6) Wherein, is the total number of current segments, is the standard degree of current segment a, and this value is not zero, is the standard degree of current segment f, and this value is not zero. Current segment f is any current segment other than current segment a, is the temperature conduction delay of current segment a, is the temperature conduction delay of current segment f.

[0087] For any current segment, the temperature segment may be affected by other current segments. The temperature fluctuation caused by a current segment with a higher standard degree is less affected by other current segments. Therefore, correct the temperature conduction delay of each current segment according to the temperature conduction delay of the current segment with a higher standard degree.

[0088] Figure 5 is a flowchart of a method for obtaining the temperature conduction delay of a current segment shown according to an exemplary embodiment. As Figure 5 shown, obtaining the temperature conduction delay of the current segment may include the following steps: In step S4011, obtain the proportionality index of the current segment relative to the target temperature segment.

[0089] In this step, obtain the proportionality index of the current segment relative to the target temperature segment. Exemplarily, first obtain the temperature peak value of the target temperature segment, then obtain the current peak value of the current segment, and then obtain the proportionality index of the current segment relative to the target temperature segment according to the temperature peak value and the current peak value.

[0090] In step S4012, obtain the degree of dispersion of the proportionality index of the current segment relative to the target temperature segment.

[0091] In this step, obtain the degree of dispersion of the proportionality index of the current segment with respect to the target temperature segment. Exemplarily, denote any current segment as the target current segment, and denote any one of the 10 temperature segments after the moment when its peak value occurs as the target temperature segment.

[0092] Obtaining the degree of dispersion of the proportionality index of the current segment with respect to the target temperature segment may include the following sub-steps: Step 1: Denote the current segment with the highest standard degree as the main current segment; denote the proportionality index of the main current segment with respect to the first target temperature segment as the main proportionality index.

[0093] Step 2: For any current segment, denote the proportionality index with the smallest difference from the main proportionality index as the reference proportionality index.

[0094] Step 3: Denote the variance of the main proportionality index and all reference proportionality indices, where (1 - standard degree) is used as the weight for calculating the variance of each reference proportionality index, as the degree of dispersion of the main current segment with respect to the first target temperature segment.

[0095] Step 4: Denote the proportionality index of the main current segment with respect to the next target temperature segment as the new main proportionality index, and obtain the corresponding degree of dispersion until all target temperature segments of the current segment are traversed.

[0096] In step S4013, use the target temperature segment with the smallest degree of dispersion as the matching temperature segment of the current segment.

[0097] In this step, use the target temperature segment with the smallest degree of dispersion as the matching temperature segment of the current segment.

[0098] In step S4014, use the time difference between the peak temperature moment of the matching temperature segment and the peak current moment of the current segment as the temperature conduction delay of the current segment.

[0099] In this step, use the time difference between the peak temperature moment of the matching temperature segment and the peak current moment of the current segment as the temperature conduction delay of the current segment.

[0100] Figure 6 is a flowchart of a method for obtaining the proportionality index of the current segment with respect to the target temperature segment shown according to an exemplary embodiment. As Figure 6 shown, obtaining the proportionality index of the current segment with respect to the target temperature segment may include the following steps: In step S40111, obtain the temperature peak of the target temperature segment.

[0101] In this step, obtain the temperature peak of the target temperature segment 。

[0102] In step S40112, obtain the current peak value of the current segment.

[0103] In this step, obtain the current peak value of the current segment 。

[0104] In step S40113, according to the temperature peak value and the current peak value, obtain the proportionality index of the current segment relative to the target temperature segment.

[0105] In this step, according to the temperature peak value , and the current peak value , obtain the proportionality index of the current segment relative to the target temperature segment 。Exemplarily, the proportionality index of the current segment relative to the target temperature segment can be obtained by the following formula: (7) wherein, the current peak value is not zero.

[0106] Figure 7 is a flowchart of a method for obtaining the predicted temperature of the merged current segment shown according to an exemplary embodiment. As Figure 7 shown, the obtaining of the predicted temperature of the merged current segment may include the following steps: In step S601, obtain the similarity between the merged current segment and the previously merged current segment.

[0107] In this step, obtain the similarity between the merged current segment and the previously merged current segment 。Exemplarily, first obtain the first average current, where the first average current is the average current of the merged current segment, then obtain the second average current, where the second average current is the average current of the previously merged current segment, then obtain the first duration, where the first duration is the duration of the merged current segment, then obtain the second duration, where the second duration is the duration of the previously merged current segment, and finally, according to the first average current, the second average current, the first duration, and the second duration, obtain the similarity between the merged current segment and the previously merged current segment 。

[0108] In step S602, obtain the temperature matching value of the previously merged current segment. Wherein, the obtaining of the temperature matching value of the previously merged current segment may include the following sub-steps: Step S6021: Use the temperature segment corresponding to the moment of the corrected temperature conduction delay of the current segment where the last current peak in the previously merged current segments is located as the corrected temperature matching segment of the previously merged current segments.

[0109] Step S6022: Use the peak temperature amplitude of the corrected temperature matching segment as the temperature matching value of the previously merged current segments. 。

[0110] In step S603, obtain the predicted temperature of the merged current segments based on the similarity and the temperature matching value.

[0111] In this step, based on the similarity , and the temperature matching value , obtain the predicted temperature of the merged current segments 。Exemplarily, the predicted temperature of the merged current segments can be obtained by the following formula: (8) where is the number of the merged current segments, is the similarity between the merged current segments and the previously merged current segments , is the temperature matching value of the previously merged current segments , is the weight normalization function.

[0112] Figure 8 is a flowchart of a method for obtaining the similarity between the merged current segments and the previously merged current segments according to an exemplary embodiment. As Figure 8 shown, obtaining the similarity between the merged current segments and the previously merged current segments may include the following steps: In step S6011, obtain a first average current, where the first average current is the average current of the merged current segments.

[0113] In this step, obtain the first average current , and the first average current is the average current of the merged current segments.

[0114] In step S6012, obtain a second average current, where the second average current is the average current of the previously merged current segments.

[0115] In this step, obtain the second average current , and the second average current The average current of the previously merged current segments .

[0116] In step S6013, obtain a first duration, where the first duration is the duration of the merged current segments

[0117] In this step, obtain the first duration , and the first duration is the duration of the merged current segments

[0118] In step S6014, obtain a second duration, where the second duration is the duration of the previously merged current segments

[0119] In this step, obtain the second duration , and the second duration is the duration of the previously merged current segments .

[0120] In step S6015, according to the first average current, the second average current, the first duration, and the second duration, obtain the similarity between the merged current segments and the previously merged current segments

[0121] In this step, according to the first average current , the second average current , the first duration , and the second duration , obtain the similarity between the merged current segments and the previously merged current segments . Exemplarily, the similarity between the merged current segments and the previously merged current segments can be obtained by the following formula (9) where exp is the exponential function with the natural number e as the base

[0122] In summary, the embodiment of the present application provides a method for monitoring the temperature of a copper bus energy storage connector, and the method includes: obtaining a temperature data sequence and a current data sequence of the connector; obtaining a heat conduction efficiency index for current segments according to the temperature data sequence and the current data sequence; obtaining a standard degree of the current segments according to the heat conduction efficiency index; obtaining a corrected temperature conduction delay of the current segments; merging the current segments according to the corrected temperature conduction delay; obtaining a predicted temperature of the merged current segments; and performing real-time monitoring of the temperature of the connector according to the predicted temperature. By performing a series of data processing on the monitored current data and temperature data, the embodiment of the present application can overcome the lag effect caused by the thermal inertia effect, improve the accuracy and timeliness of the temperature monitoring of the copper bus energy storage connector, and thus ensure the safe operation of the energy storage system.

[0123] Figure 9 FIG. is a block diagram of a temperature monitoring device for a copper bus energy storage connector shown according to an exemplary embodiment. As Figure 9 shown, the embodiment of the present application provides a temperature monitoring device for a copper bus energy storage connector, which may include the following modules: A first acquisition module 910, configured to acquire a temperature data sequence and a current data sequence of the connector.

[0124] A second acquisition module 920, configured to obtain a heat conduction efficiency index for current segments according to the temperature data sequence and the current data sequence.

[0125] A third acquisition module 930, configured to obtain a standard degree of the current segments according to the heat conduction efficiency index.

[0126] A fourth acquisition module 940, configured to obtain a corrected temperature conduction delay of the current segments.

[0127] A merging module 950, configured to merge the current segments according to the corrected temperature conduction delay.

[0128] A fifth acquisition module 960, configured to obtain a predicted temperature of the merged current segments.

[0129] A monitoring module 970, configured to perform real-time monitoring of the temperature of the connector according to the predicted temperature.

[0130] Optionally, the second acquisition module 920 is further configured to: obtain the duration from the start time to the peak time of the current segment; obtain the current amplitude at the start time of the current segment; obtain the peak current amplitude of the current segment; Obtain the heat conduction efficiency index of the current segment according to the duration, the current amplitude at the starting moment, and the peak current amplitude.

[0131] Optionally, the third obtaining module 930 is further configured to: Obtain the first standard degree of the current segment; Obtain the second standard degree of the current segment; Obtain the standard degree of the current segment according to the first standard degree and the second standard degree.

[0132] Optionally, the fourth obtaining module 940 is further configured to: Obtain the temperature conduction delay of the current segment; Obtain the conduction similarity weight of the current segment; Obtain the corrected temperature conduction delay of the current segment according to the standard degree, the temperature conduction delay, and the conduction similarity weight.

[0133] Optionally, the fourth obtaining module 940 is further configured to: Obtain the ratio index of the current segment relative to the target temperature segment; Obtain the degree of dispersion of the ratio index of the current segment relative to the target temperature segment; Use the target temperature segment with the smallest degree of dispersion as the matching temperature segment of the current segment; Use the time difference between the peak temperature moment of the matching temperature segment and the peak current moment of the current segment as the temperature conduction delay of the current segment.

[0134] Optionally, the fourth obtaining module 940 is further configured to: Obtain the temperature peak of the target temperature segment; Obtain the current peak of the current segment; Obtain the ratio index of the current segment relative to the target temperature segment according to the temperature peak and the current peak.

[0135] Optionally, the fifth obtaining module 960 is further configured to: Obtain the similarity between the merged current segment and the previously merged current segment; Obtain the temperature matching value of the previously merged current segment; Obtain the predicted temperature of the merged current segment according to the similarity and the temperature matching value.

[0136] Optionally, the fifth obtaining module 960 is further configured to: Obtain a first average current, where the first average current is the average current of the merged current segments; Obtain a second average current, where the second average current is the average current of the previously merged current segments; Obtain a first duration, where the first duration is the duration of the merged current segments; Obtain a second duration, where the second duration is the duration of the previously merged current segments; According to the first average current, the second average current, the first duration, and the second duration, obtain the similarity between the merged current segments and the previously merged current segments.

[0137] In summary, an embodiment of the present application provides a temperature monitoring device for a copper bus energy storage connector. The device includes: a first acquisition module for acquiring a temperature data sequence and a current data sequence of the connector; a second acquisition module for obtaining a heat conduction efficiency index of current segments according to the temperature data sequence and the current data sequence; a third acquisition module for obtaining a standard degree of the current segments according to the heat conduction efficiency index; a fourth acquisition module for obtaining a corrected temperature conduction delay of the current segments; a merging module for merging the current segments according to the corrected temperature conduction delay; a fifth acquisition module for obtaining a predicted temperature of the merged current segments; and a monitoring module for monitoring the temperature of the connector in real time according to the predicted temperature. By performing a series of data processing on the monitored current data and temperature data, the embodiment of the present application can overcome the lag effect caused by the thermal inertia effect, improve the accuracy and timeliness of the temperature monitoring of the copper bus energy storage connector, and thus ensure the safe operation of the energy storage system.

[0138] The present application also provides a computer-readable storage medium, on which computer program instructions are stored. When the program instructions are executed by a processor, the steps of the temperature monitoring method for a copper bus energy storage connector provided by the present application are implemented.

[0139] Figure 10 is a block diagram of a temperature monitoring system for a copper bus energy storage connector shown according to an exemplary embodiment. As Figure 10 shown, an embodiment of the present application provides a temperature monitoring system 1000 for a copper bus energy storage connector, including a temperature monitoring platform 1100.

[0140] Figure 11 is a block diagram of a temperature monitoring platform shown according to an exemplary embodiment. For example, the temperature monitoring platform 1100 can be provided as a server. Refer to Figure 11, the temperature monitoring platform 1100 includes a processing component 1122, which further includes one or more processors, and memory resources represented by a memory 1132 for storing instructions executable by the processing component 1122, such as application programs. The application programs stored in the memory 1132 may include one or more modules each corresponding to a set of instructions. In addition, the processing component 1122 is configured to execute instructions to perform the above copper busbar energy storage connector temperature monitoring method.

[0141] The temperature monitoring platform 1100 may further include a power supply component 1126 configured to perform power management of the temperature monitoring platform 1100, a communication component 1150 configured to connect the temperature monitoring platform 1100 to a network, and an input / output interface 1158. The temperature monitoring platform 1100 may operate based on an operating system stored in the memory 1132.

[0142] In another exemplary embodiment, a computer program product is also provided, which includes a computer program executable by a programmable electronic device. The computer program has a code portion for performing the above copper busbar energy storage connector temperature monitoring method when executed by the programmable electronic device.

[0143] The above embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application.

Claims

1. A temperature monitoring method for a copper bar energy storage connector, characterized in that, The method includes: Obtain the temperature data sequence and current data sequence of the connector; Obtain the heat conduction efficiency index of the current segment according to the temperature data sequence and the current data sequence; Obtain the standard degree of the current segment according to the heat conduction efficiency index; Obtain the corrected temperature conduction delay of the current segment; Merge the current segments according to the corrected temperature conduction delay; Obtain the predicted temperature of the merged current segment; Monitor the temperature of the connector in real time according to the predicted temperature.

2. The method for monitoring the temperature of the copper bus energy storage connector according to claim 1, characterized in that, The obtaining of the heat conduction efficiency index of the current segment includes: Obtain the duration from the start time to the peak time of the current segment; Obtain the current amplitude at the start time of the current segment; Obtain the peak current amplitude of the current segment; Obtain the heat conduction efficiency index of the current segment according to the duration, the current amplitude at the start time, and the peak current amplitude.

3. The method for monitoring the temperature of the copper bus energy storage connector according to claim 1, wherein The obtaining of the standard degree of the current segment includes: Obtain the first standard degree of the current segment; Obtain the second standard degree of the current segment; Obtain the standard degree of the current segment according to the first standard degree and the second standard degree.

4. The method for monitoring the temperature of the copper bar energy storage connector according to claim 1, characterized in that, The obtaining of the corrected temperature conduction delay of the current segment includes: Obtain the temperature conduction delay of the current segment; Obtain the conduction similarity weight of the current segment; Obtain the corrected temperature conduction delay of the current segment according to the standard degree, the temperature conduction delay, and the conduction similarity weight.

5. The method for monitoring the temperature of the copper bar energy storage connector according to claim 4, wherein, The obtaining of the temperature conduction delay of the current segment includes: Obtain the ratio index of the current segment relative to the target temperature segment; Obtain the degree of dispersion of the ratio index of the current segment relative to the target temperature segment; Take the target temperature segment with the smallest degree of dispersion as the matching temperature segment of the current segment; Take the time difference between the peak temperature time of the matching temperature segment and the peak current time of the current segment as the temperature conduction delay of the current segment.

6. The method for monitoring the temperature of the copper bar energy storage connector according to claim 5, wherein, The obtaining of the ratio index of the current segment relative to the target temperature segment includes: Obtain the temperature peak of the target temperature segment; Obtain the current peak of the current segment; Obtain the ratio index of the current segment relative to the target temperature segment according to the temperature peak and the current peak.

7. The temperature monitoring method of the copper bar energy storage connector according to claim 1, wherein The obtaining of the predicted temperature of the merged current segment includes: Obtain the similarity between the merged current segment and the previously merged current segment; Obtain the temperature matching value of the previously merged current segment; Obtain the predicted temperature of the merged current segment according to the similarity and the temperature matching value.

8. The method for monitoring the temperature of the copper bar energy storage connector according to claim 7, wherein, The obtaining of the similarity between the merged current segment and the previously merged current segment includes: Obtain a first average current, where the first average current is the average current of the merged current segment; Obtain a second average current, where the second average current is the average current of the previously merged current segment; Obtain a first duration, where the first duration is the duration of the merged current segment; Obtain a second duration, where the second duration is the duration of the previously merged current segment; Obtain the similarity between the merged current segments and the previously merged current segments based on the first average current, the second average current, the first duration, and the second duration.

9. A temperature monitoring device for a copper bar energy storage connector, characterized in that, The device includes: A first acquisition module, configured to acquire the temperature data sequence and the current data sequence of the connector; A second acquisition module, configured to acquire the heat conduction efficiency index of the current segments according to the temperature data sequence and the current data sequence; A third acquisition module, configured to acquire the standard degree of the current segments according to the heat conduction efficiency index; A fourth acquisition module, configured to acquire the corrected temperature conduction delay of the current segments; A merging module, configured to merge the current segments according to the corrected temperature conduction delay; A fifth acquisition module, configured to acquire the predicted temperature of the merged current segments; A monitoring module, configured to perform real-time monitoring of the temperature of the connector according to the predicted temperature.

10. A temperature monitoring system for a copper bar energy storage connector, characterized in that, The system includes a temperature monitoring platform, and the temperature monitoring platform includes: A memory, on which a computer program is stored; A processor, configured to execute the computer program in the memory to implement the steps of the method according to any one of claims 1-8.

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