Micro differential pressure sensor

Abstract

The invention discloses a micro differential pressure sensor. The micro differential pressure sensor comprises a substrate, an outer shell and a chip module, the outer shell is fixedly connected with the base plate, and the outer shell and the base plate are enclosed to form an accommodating cavity; the chip module is located in the containing cavity and fixed to the substrate. A pressure equalizing groove is formed in the base plate, an air hole penetrating through the outer shell is formed in the outer shell, and the pressure equalizing groove is matched with the air hole to form a pressure equalizing channel so that the interior of the containing cavity can be communicated with the external environment. Through the arrangement of the technical characteristics, the air leakage efficiency of the micro differential pressure sensor can be improved, and the working reliability of the micro differential pressure sensor is further improved.

Description

Technical Field

[0001] This application relates to the field of microelectromechanical technology, and particularly to a micro differential pressure sensor. Background Art

[0002] As a precision measurement device, the micro differential pressure sensor is widely used in the field of electronic cigarettes. By detecting the minute changes in air flow or gas pressure, it converts the pressure difference into an electrical signal output, thereby achieving precise control over the working state of the electronic cigarette atomizer.

[0003] In practical applications, the airway design in the overall structure of the electronic cigarette is unreasonable, the air vent hole is blocked by e-liquid vapor, and after a smoking action, the air return inside the overall structure of the electronic cigarette is slow, resulting in slow rebound of the MEMS chip and causing the problem of delayed output. Summary of the Invention

[0004] In view of the above-mentioned defects of the prior art, the technical problem to be solved by this application is to improve the air leakage efficiency of the micro differential pressure sensor itself to avoid the problem of delayed output caused by the air leakage defect in the overall structure.

[0005] To solve at least one of the above-mentioned technical problems, this application discloses a micro differential pressure sensor.

[0006] According to one aspect of this application, there is provided a micro differential pressure sensor, including:

[0007] A substrate;

[0008] An outer housing, fixedly connected to the substrate and enclosing with the substrate to form a receiving cavity;

[0009] A chip module, located inside the receiving cavity and fixed on the substrate;

[0010] The substrate is provided with a pressure equalizing groove, and the outer housing is provided with a ventilation hole penetrating the outer housing. The pressure equalizing groove cooperates with the ventilation hole to form a pressure equalizing channel to realize the communication between the inside of the receiving cavity and the external environment.

[0011] Optionally, the direction perpendicular to the surface of the substrate is the first direction, the direction parallel to the radial direction of the substrate and perpendicular to the first direction is the second direction, and the direction perpendicular to the first direction and the second direction is the third direction;

[0012] The pressure equalizing groove extends along the second direction on the substrate, and the size range of the pressure equalizing groove in the first direction is 0.02 mm to 0.05 mm, and the size range in the third direction is 0.05 mm to 0.3 mm.

[0013] Optionally, the substrate includes a solder mask layer, and a receiving groove is formed on the solder mask layer;

[0014] The size of the pressure equalizing groove in the second direction is greater than the size of the accommodating groove in the second direction; the second direction is the direction parallel to the radial direction of the substrate.

[0015] Optionally, the outer housing includes an extension part and a connecting part:

[0016] The extension part extends along the first direction and includes a first part and a second part. The first part is connected to the connecting part, and the second part protrudes from the first part towards the substrate;

[0017] The second part is connected to the substrate so that a gap is formed between the first part and the substrate in the first direction.

[0018] Optionally, the air vent holes are located in the connecting part and include a first air vent hole and a second air vent hole. The first air vent hole communicates with the accommodating cavity through the second air vent hole.

[0019] Optionally, the first air vent hole has a first projection on the surface of the substrate, and the second air vent hole has a second projection on the surface of the substrate. The area of the second projection is smaller than the area of the first projection, and the second projection is located inside the first projection.

[0020] Optionally, the outer housing further includes a plurality of partition parts located in the second air vent hole to divide the second air vent hole into a plurality of first through holes.

[0021] Optionally, it further includes: an adhesive layer located in the accommodating groove; the accommodating groove is arranged along the circumferential direction of the substrate so that the second part of the outer housing is fixedly connected to the substrate through the adhesive layer.

[0022] Optionally, a second through hole penetrating the substrate is provided on the substrate;

[0023] The chip module includes:

[0024] A MEMS differential pressure detection chip with a back cavity. The MEMS differential pressure detection chip covers the second through hole so that the back cavity communicates with the second through hole;

[0025] A circuit chip is connected to the MEMS differential pressure detection chip through a first bonding wire and connected to the substrate through a second bonding wire.

[0026] Optionally, it further includes: an oil-proof net covering the outer housing, and part of the oil-proof net is in contact with the air vent holes.

[0027] The differential pressure sensor according to the embodiment of the present application realizes improving the air leakage efficiency of the differential pressure sensor by opening a pressure equalizing groove and cooperating with the air vent holes to form a pressure equalizing channel.

[0028] Specifically, a pressure equalizing groove is provided on one side of the substrate connected to the outer casing, and a vent hole is provided on the outer casing. The pressure equalizing groove and the vent hole cooperate to form a pressure equalizing channel, so that the negative pressure in the accommodation cavity can be restored to the same air pressure value as the outside through the pressure equalizing channel, so as to improve the air leakage efficiency of the differential pressure sensor without affecting the product sensitivity, thereby avoiding the problem of long air leakage process time caused by reasons such as blockage of the vent hole, which may lead to delayed turn-off of the differential pressure sensor during operation, and improving its application sensitivity and reliability during operation.

[0029] Other features and advantages of the present application will be described in detail in the subsequent specific implementation part. Brief Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0031] In order to more fully understand the present application and its beneficial effects, the following description will be made in conjunction with the drawings, where the same reference numerals represent the same parts in the following description.

[0032] Figure 1 Structural cross-section of a differential pressure sensor provided by an exemplary embodiment of the present disclosure Figure 1 ;

[0033] Figure 2 Top view of the structure of a differential pressure sensor provided by an exemplary embodiment of the present disclosure;

[0034] Figure 3 Structural cross-section of a differential pressure sensor provided by an exemplary embodiment of the present disclosure Figure 2 ;

[0035] Figure 4 Structural cross-section of another differential pressure sensor provided by an exemplary embodiment of the present disclosure Figure 1 ;

[0036] Figure 5 Structural cross-section of another differential pressure sensor provided by an exemplary embodiment of the present disclosure Figure 2 ;

[0037] Figure 6 Top view of the structure of yet another differential pressure sensor provided by an exemplary embodiment of the present disclosure;

[0038] Figure 7 Structural cross-section of yet another differential pressure sensor provided by an exemplary embodiment of the present disclosure.

[0039] Description of the reference numerals:

[0040] 10 - Substrate, 11 - Second through - hole, 12 - Accommodating cavity, 13 - Accommodating groove, 14 - First region, 15 - Pressure - equalizing groove, 16 - Solder mask layer;

[0041] 20 - Outer housing, 21 - Connecting portion, 22 - First ventilation hole, 23 - Second ventilation hole, 24 - Partition portion, 25 - First through - hole, 26 - Extension portion, 27 - First part, 28 - Second part;

[0042] 30 - Chip module, 31 - MEMS differential pressure detection chip, 32 - Circuit chip, 33 - First bonding wire, 34 - Second bonding wire;

[0043] 40 - Oil - proof net;

[0044] 50 - Bonding layer;

[0045] T1 - Suction path, T2 - Pressure - equalizing path. Detailed implementation manners

[0046] Next, the technical solutions in the embodiments of this specification will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this specification. Obviously, the described embodiments are only a part of the embodiments of this specification, rather than all the embodiments. Based on the embodiments in this specification, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0047] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above - mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of this application described here can be implemented in an order other than those illustrated or described here. In addition, the terms "include" and "have" and any variations thereof are intended to cover non - exclusive inclusion. For example, a process, method, system, product, or server that includes a series of steps or units does not necessarily need to be limited to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0048] The following will detail various exemplary embodiments, features, and aspects of the present disclosure with reference to the accompanying drawings. The same reference numerals in the drawings denote elements having the same or similar functions. Although various aspects of the embodiments are shown in the drawings, the drawings do not necessarily need to be drawn to scale unless otherwise specified.

[0049] As used herein, the term "exemplary" means "serving as an example, embodiment, or illustration". Any embodiment described as "exemplary" herein need not be construed as superior or better than other embodiments.

[0050] As used herein, the term "and / or" describes an associative relationship between associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the term "at least one" as used herein means any one of a plurality or any combination of at least two of a plurality. For example, including at least one of A, B, and C may represent including any one or more elements selected from the set consisting of A, B, and C.

[0051] In addition, to better illustrate the present disclosure, numerous specific details are given in the following detailed description. Those skilled in the art should understand that the present disclosure can be implemented without certain specific details. In some instances, methods, means, elements, and circuits well-known to those skilled in the art are not described in detail to highlight the gist of the present disclosure.

[0052] Figure 1 Showing a structural cross-section of a differential pressure sensor provided by an exemplary embodiment of the present disclosure Figure 1 , Figure 2 Showing a top view of the structure of a differential pressure sensor provided by an exemplary embodiment of the present disclosure. The direction perpendicular to the surface of the substrate 10 is the first direction, the direction parallel to the radial direction of the substrate 10 and perpendicular to the first direction is the second direction, and the direction perpendicular to the first direction and the second direction is the third direction. As Figure 1 and Figure 2 shown, the first direction is the y direction, the second direction is the x direction, and the third direction is the z direction. A differential pressure sensor includes:

[0053] A substrate 10 provided with a second through hole 11 penetrating the substrate 10;

[0054] An outer housing 20 fixedly connected to the substrate 10 and enclosing a receiving cavity 12 with the substrate 10;

[0055] A chip module 30 located in the receiving cavity 12 and fixed to the substrate 10.

[0056] Among them, the substrate 10 is provided with a pressure equalizing groove 15, and the outer housing 20 is provided with a ventilation hole penetrating the outer housing 20. The pressure equalizing groove 15 cooperates with the ventilation hole to form a pressure equalizing channel to realize the communication between the inside of the receiving cavity 12 and the external environment.

[0057] In some embodiments, the differential pressure sensor may include a substrate 10, a chip module 30 located on the substrate 10, and an outer housing 20 fixedly connected to the substrate 10.

[0058] As Figure 1 shown, the substrate 10 has opposite and parallel first and second surfaces, and the chip module 30 and the outer housing 20 are mounted on the first surface of the substrate 10. The chip module 30 includes:

[0059] A MEMS differential pressure detection chip 31 having a back cavity, and the MEMS differential pressure detection chip 31 covers the second through hole 11 so that the back cavity communicates with the second through hole 11;

[0060] A circuit chip 32, which is connected to the MEMS differential pressure detection chip 31 by a first bonding wire 33 and connected to the substrate 10 by a second bonding wire 34.

[0061] In some embodiments, the chip module 30 may include a MEMS differential pressure detection chip 31 and a circuit chip 32. In a first direction, the substrate 10 has a second through hole 11 penetrating through its body. One side surface of the MEMS differential pressure detection chip 31 communicates with the second through hole 11, and the other side surface of the MEMS differential pressure detection chip 31 communicates with the outside via the accommodation cavity 12 and the air vent, so that the MEMS differential pressure detection chip 31 can sense the pressure difference signal between the second through hole 11 and the air vent.

[0062] The MEMS differential pressure detection chip 31 is connected to the circuit chip 32 by a first bonding wire 33, and the circuit chip 32 is connected to the substrate 10 by a second bonding wire 34. The MEMS differential pressure detection chip 31 is used to sense the minute pressure change of the air flow and output the pressure change in the form of an electrical signal. The circuit chip 32 is used to receive the electrical signal sent by the MEMS differential pressure detection chip 31 and process it.

[0063] In some embodiments, it is set that the back cavity of the MEMS differential pressure detection chip 31 covers the second through hole 11, so that the MEMS differential pressure detection chip 31 can directly contact the air flow flowing through the second through hole 11, thereby sensing the minute pressure change brought by the air flow and improving the accuracy of the MEMS differential pressure detection chip 31 in sensing pressure and outputting an electrical signal.

[0064] As Figure 1 shown, the differential pressure sensor further includes an accommodation groove 13 and an adhesive layer 50. The adhesive layer 50 is located in the accommodation groove 13, and the outer housing 20 is fixedly connected to the substrate 10 through the adhesive layer 50.

[0065] In some embodiments, the first surface of the substrate 10 has a solder mask layer 16 and a copper foil layer. The accommodating groove 13 can be formed by opening a window in the solder mask layer 16, that is, by removing a part of the solder mask layer 16 to form the accommodating groove 13. The accommodating groove 13 can also be formed by opening a window in both the solder mask layer 16 and the copper foil layer, that is, by removing a part of the stacked solder mask layer 16 and copper foil layer to form the accommodating groove 13. In this embodiment, the copper foil layer is not shown in the drawings, and the accommodating groove 13 is formed by opening a window in both the solder mask layer 16 and the copper foil layer and is arranged circumferentially along the substrate 10 on the first surface.

[0066] The bonding layer 50 is located in the accommodating groove 13 that is recessed relative to the solder mask layer 16, so that the second part 28 of the extending portion 26 is bonded to the first surface of the substrate 10 through the bonding layer 50. The bonding layer 50 can be glue.

[0067] In some embodiments, the shape of the accommodating groove 13 can be adaptively adjusted according to the overall shape of the differential pressure sensor. For example, as Figure 2 shown, when the top view of the differential pressure sensor is circular, the accommodating groove 13 can be annular. The setting of the accommodating groove 13 can accurately limit the position of the bonding layer 50, avoid the overflow of the bonding layer 50 and flowing into the cutting channels of the entire product plate to cause adhesion between structures, thereby improving the convenience and accuracy of product cutting.

[0068] As Figure 1 and Figure 2 shown, the pressure equalizing groove 15 can be located in the first region 14 and extend along the second direction on the substrate 10. The size of the pressure equalizing groove 15 in the third direction is between 0.05 mm and 0.3 mm, and the size in the first direction is between 0.02 mm and 0.05 mm.

[0069] In some embodiments, the pressure equalizing groove 15 can be opened on the solder mask layer 16 of the substrate 10, that is, by removing a part of the solder mask layer 16 to form the pressure equalizing groove 15; it can also be opened on the stacked solder mask layer 16 and copper foil layer, that is, by removing a part of the stacked solder mask layer 16 and copper foil layer. On the solder mask layer 16 and the copper foil layer of the substrate 10, the pressure equalizing groove 15 can be arranged in any direction. In this embodiment, the copper foil layer is not shown in the drawings, and the pressure equalizing groove 15 is opened on the stacked solder mask layer 16 and copper foil layer.

[0070] In some embodiments, the size of the pressure equalizing groove 15 in the third direction, that is, the width of the pressure equalizing groove 15, can be set between 0.05 mm and 0.3 mm, and the size of the pressure equalizing groove 15 in the first direction, that is, the height of the pressure equalizing groove 15, can be set between 0.02 mm and 0.05 mm. In this application, there are no specific limitations on the sizes of the pressure equalizing groove 15 in the first direction, the second direction, and the third direction. Under the condition of meeting the above size range and ensuring the air release cross-sectional area, it can be adaptively adjusted according to different pressure relief requirements.

[0071] The equalizing groove 15 is formed on the solder mask layer 16 of the substrate 10, and its dimensions in the second direction and the third direction are restricted. Compared with forming a venting groove on the outer housing 20 to achieve air release, the position and size settings of the equalizing groove 15 in the embodiments of the present application can, while expanding the equalizing channel, avoid the situation where when the equalizing groove 15 is provided on the outer housing 20, the size of the equalizing groove 15 is too large due to manufacturing process limitations, thereby affecting the working sensitivity of the differential pressure sensor. Therefore, the size and position settings of the equalizing groove 15 in the embodiments of the present application can ensure the working sensitivity of the differential pressure sensor.

[0072] Figure 3 The structural cross-section of a differential pressure sensor provided by an exemplary embodiment of the present disclosure Figure 2 As Figure 3 shown, in some other embodiments, the equalizing groove 15 can also be formed inside the substrate 10. Compared with Figure 1 , Figure 3 in which the equalizing groove 15 is not formed through the solder mask layer 16 and the copper foil layer, but is provided inside the substrate 10.

[0073] Furthermore, as Figure 2 shown, the dimension of the equalizing groove 15 in the second direction is larger than the dimension of the accommodating groove 13 in the second direction. By setting the dimension of the equalizing groove 15 in the second direction to be larger than the dimension of the accommodating groove 13 in the second direction, the outer housing is prevented from blocking the equalizing groove.

[0074] In some embodiments, Figure 1 the dotted line in

[0075] is the equalizing path T2 corresponding to the equalizing channel formed by the cooperation of the equalizing grooves 15. The equalizing grooves 15 cooperate with the vent holes to form an equalizing channel, thereby realizing air release, so that the negative pressure in the accommodating cavity 12 can be restored to the same air pressure value as the outside world, so as to improve the air release efficiency of the differential pressure sensor without affecting the product sensitivity, and thus can avoid the problem of delayed turn-off of the differential pressure sensor during operation and improve its application sensitivity and reliability during operation.

[0076] In a specific embodiment, an application scenario of the differential pressure sensor can be an electronic cigarette. The differential pressure sensor is assembled into a complete machine for application. When along Figure 1When starting to inhale in the direction of the arrow of the middle inhalation path T1, a negative pressure state will be generated inside the accommodation cavity 12, which will cause the MEMS diaphragm of the MEMS differential pressure detection chip 31 to deform, and then cause a change in capacitance. When the capacitance change reaches a preset value, the ignition action is started. After stopping the inhalation action, the negative pressure inside the accommodation cavity 12 will pass through Figure 1 the pressure equalization path T2 corresponding to the pressure equalization channel shown to achieve pressure equalization, that is, rapid air return is realized respectively through the air permeable holes and the pressure equalization grooves 15, so that the MEMS diaphragm rebounds, the capacitance changes to the initial value, and the circuit monitors the stop of the smoking action and stops the ignition action. Among them, the arrow direction of the pressure equalization path T2 is the gas flow channel direction during the pressure equalization and air return process. The setting of the pressure equalization channel can reduce the influence of the oil infiltration of the air permeable holes on the negative pressure change efficiency in the accommodation cavity 12, improve the air leakage efficiency, and enable the MEMS diaphragm to quickly return to the initial state after the smoking inhalation action stops, so as to improve the reliability of the application of the micro differential pressure sensor.

[0077] As Figure 1 shown, the air permeable holes include a first air permeable hole 22 and a second air permeable hole 23. The outer housing 20 includes:

[0078] An extension part 26, extending in the first direction, includes a first part 27 and a second part 28 protruding from the first part 27 towards the substrate 10. The second part 28 is connected to the substrate 10 so that a gap is formed between the first part 27 and the substrate 10 in the first direction.

[0079] A connecting part 21, connected to the first part 27 of the extension part 26; both the first air permeable hole 22 and the second air permeable hole 23 are located in the connecting part 21.

[0080] In some embodiments, the outer housing 20 may be a box structure with an open mouth. The outer housing 20 can be divided into an extension part 26 and a connecting part 21. The connecting part 21 is arranged parallel to the surface of the substrate 10, and the extension part 26 is arranged perpendicular to the surface of the substrate 10. One end of the extension part 26 is connected to the substrate 10, and the other end is connected to the connecting part 21.

[0081] In some embodiments, the extension part 26 can be further divided into a first part 27 and a second part 28 protruding from the first part 27 towards the substrate 10, so that one end of the extension part 26 connected to the substrate 10 is stepped. As Figure 1As shown, the extension part 26 is connected to the connection part 21 through the first part 27 and to the substrate 10 through the second part 28, so that there is a gap between the first part 27 of the extension part 26 and the substrate 10 in the first direction. At the same time, it is set that the diameter of the substrate 10 in the second direction is larger than the diameter of the outer housing 20 in the second direction, so as to cooperate with the stepped setting at one end of the extension part 26, so that in the manufacturing process of the differential pressure sensor, when the whole plate is cut into single products, the problems of difficult cutting and not easy to fall off are improved, thus improving the cutting convenience of the differential pressure sensor. And, the product can fall off in time after cutting into single pieces, reducing the rejection rate caused by adhesion, thus improving the overall manufacturing quality of the differential pressure sensor.

[0082] The first ventilation hole 22 has a first projection on the first surface of the substrate 10, and the second ventilation hole 23 has a second projection on the first surface of the substrate 10. The area of the second projection is smaller than the area of the first projection, and the second projection is located inside the first projection.

[0083] In some embodiments, the first ventilation hole 22 and the second ventilation hole 23 are arranged on the connection part 21, and the first ventilation hole 22 realizes the communication between the accommodation cavity 12 and the outside through the second ventilation hole 23. It is set that the area of the second projection is smaller than the area of the first projection, and the second projection is located inside the first projection, so that the cross section of the first ventilation hole 22 and the second ventilation hole 23 presents a T-shaped structure.

[0084] The size of the first ventilation hole 22 is larger, and compared with the related technology, it can effectively improve the blockage problem caused by the infiltration of e-liquid into the ventilation hole. In addition, since the area of the second projection corresponding to the second ventilation hole 23 is smaller than the area of the first projection corresponding to the first ventilation hole 22, and the second projection is located inside the first projection, when there are tiny impurity particles such as floating dust passing through the first ventilation hole 22, they will fall on the outer housing 20, which can avoid micro dust particles entering the product through the ventilation hole during the encapsulation process and falling on the chip module 30, resulting in abnormal chip performance, thus improving the product reliability of the differential pressure sensor.

[0085] Figure 4 and Figure 5 is a structural sectional view of another differential pressure sensor provided by an exemplary embodiment of the present disclosure. Figure 4 With Figure 5 are structural schematic diagrams of the differential pressure sensor corresponding to different cross-sections. Another differential pressure sensor according to an embodiment of the present application is as Figure 4 and Figure 5 shown. The difference between this embodiment and the corresponding embodiment corresponding to Figures 1 to 3 is the setting of the oil-proof net 40.

[0086] In this embodiment, in addition to the substrate 10, the outer housing 20, and the chip module 30, the differential pressure sensor further includes an oil-proof net 40. The oil-proof net 40 covers the outer housing 20. For the structures, positions, etc. of the substrate 10, the outer housing 20, and the chip module 30, reference can be made to Figures 1 to 3 the corresponding embodiment, which will not be elaborated here.

[0087] As Figure 4 and Figure 5 shown, the first vent hole 22 and the second vent hole 23 are located at the part where the outer housing 20 contacts the oil-proof net 40. The oil-proof net 40 is used for preliminary filtration of e-liquid.

[0088] The first vent hole 22 is provided to communicate with the accommodation cavity 12 through the second vent hole 23, and the first vent hole 22 contacts the oil-proof net 40, which can further prevent the second vent hole 23 from being blocked after the oil-proof net 40 is infiltrated by e-liquid.

[0089] Compared with Figures 1 to 3 the corresponding embodiment, the introduction of the oil-proof net 40 covering the positions where the first vent hole 22 and the second vent hole 23 are opened on the outer housing 20 can further improve the infiltration and blockage of the vent holes by e-liquid.

[0090] Figure 6 FIG. is a top view of the structure of another differential pressure sensor provided by an exemplary embodiment of the present disclosure. Another differential pressure sensor of the embodiment of the present application is as Figure 6 shown. The difference between this embodiment and Figures 1 to 3 the corresponding embodiment and Figures 4 to 5 the corresponding embodiment is the change in the number of the pressure equalizing grooves 15.

[0091] In this embodiment, the structures of the oil-proof net 40, the substrate 10, the outer housing 20, the chip module 30, the second through hole 11 and the accommodation groove 13 on the substrate 10 of the differential pressure sensor remain unchanged, and will not be elaborated here. The change in the number of the pressure equalizing grooves 15 will be described in detail in this embodiment below.

[0092] In some embodiments, the number of the pressure equalizing grooves 15 can be one or more. This embodiment is an exemplary illustration of the case where the number of the pressure equalizing grooves 15 is multiple. As Figure 6 shown, the number of the pressure equalizing grooves 15 in this embodiment is 2. Figure 6 is a specific form of the multi-group arrangement of the pressure equalizing grooves 15. The present application does not limit its arrangement manner, as long as the air leakage cross-sectional area of the multiple pressure equalizing grooves 15 meets the air leakage requirements of the differential pressure sensor.

[0093] In some embodiments, such as Figure 6As shown, since the pressure equalizing grooves 15 are located at the first region 14, when the number of the pressure equalizing grooves 15 is multiple, the number of the first regions 14 also synchronously changes to multiple. At this time, the accommodating groove 13 is separated into two arc-shaped structures by two first regions 14.

[0094] In this embodiment, the settings of each structure can achieve the same technical effects as those of the Figures 1 to 3 corresponding embodiment and Figure 4 and Figure 5 the corresponding embodiment, which will not be elaborated here. The setting of multiple pressure equalizing grooves 15 can further expand the air leakage path, thereby improving the air leakage efficiency and the sensitivity of the application of the differential pressure sensor.

[0095] Figure 7 The structure sectional view of another differential pressure sensor provided by an exemplary embodiment of the present disclosure. Another differential pressure sensor of the embodiment of the present application is as Figure 7 shown. The difference between this embodiment and the Figures 1 to 3 corresponding embodiment is the structural change of the second ventilation hole 23 and the setting of the oil-proof net 40; the difference from the Figure 4 and Figure 5 corresponding embodiment is the structural change of the second ventilation hole 23; the difference from the Figure 6 corresponding embodiment is the change in the number of the pressure equalizing grooves 15 and the structural change of the second ventilation hole 23.

[0096] In this embodiment, the structural settings of the oil-proof net 40, the substrate 10, the outer housing 20, the chip module 30, and the second through hole 11 on the substrate 10 of the differential pressure sensor have not changed, which will not be elaborated here. This embodiment will elaborate in detail on the structural change of the second ventilation hole 23.

[0097] The outer housing 20 further includes a plurality of partition parts 24, and the plurality of partition parts 24 are located in the second ventilation hole 23 to separate the second ventilation hole 23 into a plurality of first through holes 25.

[0098] In some embodiments, the setting of the plurality of first through holes 25 makes the size of the second ventilation hole 23 smaller than that of the previous embodiment, which can reduce the risk of foreign matters such as e-liquid, smoke, and dust particles entering the inner part of the accommodating cavity 12 during the actual application of the differential pressure sensor, and can avoid the blockage of the ventilation hole by e-liquid and the abnormal performance of the chip caused by foreign matter particles falling on the chip module 30, thereby ensuring the reliability of the differential pressure sensor and extending its service life.

[0099] Correspondingly, the present application further provides an electronic device, including the differential pressure sensor described in any of the above embodiments. The application scenarios of the electronic device can be devices such as electronic cigarettes and microphones that require the use of differential pressure sensors.

[0100] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality of" means two or more, unless otherwise specifically defined.

[0101] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0102] The embodiments, implementation manners and related technical features of the present application can be combined and replaced with each other without conflict.

[0103] The above are merely the preferred embodiments of the present application and do not impose any formal limitations on the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application. The selection of the terms used herein is intended to best explain the principles of each embodiment, practical applications or improvements to the technologies in the market, or to enable other ordinary technicians in the technical field to understand the embodiments disclosed herein.

Claims

1. A differential pressure sensor, characterized in that, Comprising: Substrate; Outer housing, fixedly connected to the substrate and enclosing a receiving cavity with the substrate; Chip module, located within the receiving cavity and fixed to the substrate; The substrate is provided with a pressure equalizing groove, and the outer housing is provided with a ventilation hole penetrating the outer housing. The pressure equalizing groove cooperates with the ventilation hole to form a pressure equalizing channel to achieve communication between the inside of the receiving cavity and the external environment.

2. The differential pressure sensor according to claim 1, characterized in that, The direction perpendicular to the surface of the substrate is the first direction, the direction parallel to the radial direction of the substrate and perpendicular to the first direction is the second direction, and the direction perpendicular to the first direction and the second direction is the third direction; The pressure equalizing groove extends along the second direction on the substrate, with a dimension range of 0.02 mm to 0.05 mm in the first direction and a dimension range of 0.05 mm to 0.3 mm in the third direction.

3. The differential pressure sensor according to claim 1, wherein, The substrate includes a solder mask layer, and a receiving groove is formed in the solder mask layer; The dimension of the pressure equalizing groove in the second direction is greater than the dimension of the receiving groove in the second direction; the second direction is the direction parallel to the radial direction of the substrate.

4. The differential pressure sensor according to claim 1, characterized in that, The outer housing includes an extension part and a connection part: The extension part extends along the first direction and includes a first part and a second part. The first part is connected to the connection part, and the second part protrudes from the first part towards the substrate; The second part is connected to the substrate so that a gap is formed between the first part and the substrate in the first direction.

5. The differential pressure sensor according to claim 4, wherein The ventilation hole is located in the connection part and includes a first ventilation hole and a second ventilation hole. The first ventilation hole communicates with the receiving cavity through the second ventilation hole.

6. The differential pressure sensor according to claim 5, wherein The first ventilation hole has a first projection on the surface of the substrate, the second ventilation hole has a second projection on the surface of the substrate. The area of the second projection is smaller than the area of the first projection, and the second projection is located inside the first projection.

7. The differential pressure sensor according to claim 5, characterized in that, The outer housing further includes a plurality of partition parts, The plurality of partition parts are located in the second ventilation hole to divide the second ventilation hole into a plurality of first through holes.

8. The differential pressure sensor according to claim 3, wherein Further comprising: Adhesive layer, located within the receiving groove; The receiving groove is arranged along the circumferential direction of the substrate so that the second part of the outer housing is fixedly connected to the substrate through the adhesive layer.

9. The differential pressure sensor according to claim 1, wherein A second through hole penetrating the substrate is provided on the substrate; The chip module includes: MEMS differential pressure detection chip, having a back cavity. The MEMS differential pressure detection chip covers the second through hole so that the back cavity communicates with the second through hole; Circuit chip, connected to the MEMS differential pressure detection chip through a first bonding wire and connected to the substrate through a second bonding wire.

10. The differential pressure sensor according to claim 1, characterized in that, Further comprising: Oil-proof net, covering the outer housing, and part of the oil-proof net is in contact with the ventilation hole.

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