Probe for packaging and testing chip or packaging substrate and preparation process of probe

Abstract

The invention relates to a probe for packaging and testing a chip or a packaging substrate, a metal layer is plated at one end, close to a probe head, of an insulating coating layer and between the insulating coating layer and a probe body to form an annular positioning piece, a clear angle is formed between the annular positioning piece and the probe body, and the flatness of the outer side annular surface of the annular positioning piece is better, so that the chip or the packaging substrate can be packaged and tested. Uneven supporting points such as burrs are avoided; meanwhile, the hardness and the stability of the metal layer are superior to those of the insulating coating layer, so that in the long-term use process, even if the metal layer is collided with the surface of a jig plate, the metal layer is not prone to deformation or displacement and can keep good perpendicularity, the coating side face of the probe middle section has high flatness and perpendicularity, uniform support is formed when the probe middle section makes contact with the jig plate, and the service life of the probe middle section is prolonged. Probe inclination caused by burrs or deformation of the insulation coating layer is avoided, it is ensured that the needle top points of all probes on the detection jig are located on the same plane, good contact between all the probes and a chip is ensured, and the chip detection precision is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip detection, and specifically, to a probe for chip or package substrate sealing and testing and its preparation process. Background Art

[0002] As a basic material for manufacturing semiconductor devices (such as chips), during the manufacturing process of a wafer, it is necessary to use probes to contact the chip circuits on the wafer, so as to detect various electrical parameters of the chips, such as voltage, current, resistance, capacitance, etc. Vertical probe contact is the most common form of contact. In this method, the probe is perpendicular to the wafer surface, and relying on a precise mechanical control device, the test fixture is adjusted to approach the wafer, so that the probes on the test fixture contact the pads or test points on the wafer.

[0003] On the fixture clamp plate of the existing test fixture, multiple rhenium-tungsten alloy probes are densely arranged. The surface of each probe is gold-plated, and an insulating coating is applied to the middle section of the probe, with only the gold-plated layers at both ends exposed. The multiple probes on the fixture clamp plate correspond one-to-one with the test points on the wafer. The end of each probe is electrically connected to the test equipment, and the tip of the probe passes through the fixture clamp plate so as to directly contact the test point when the wafer approaches. The fixture clamp plate is composed of a front plate and a rear plate. The front plate is provided with several through holes corresponding to the number of probes, and the rear plate is provided with several fixing holes corresponding to the number of probes. The end of the probe is connected to the fixing hole and the power connection operation is completed inside the hole; the tip of the probe passes through the front plate and the tip is movable relative to the through hole. A gap is reserved between the front plate and the rear plate, and the insulating coating at the middle section of the probe is exactly located at the gap position between the front and rear plates.

[0004] During the testing process of the test fixture, due to the fact that the rhenium-tungsten alloy probe has a certain elasticity and toughness, when the tip of the probe contacts and is stressed by the chip pad, the middle part of the probe body bends and deforms at the gap of the fixture clamp plate, and the tip of the probe will retract into the front plate. When the tip of the probe moves away from the chip, the middle part of the probe body returns to a straight state, and the retracted tip penetrates the front plate again. At this time, the edge side of the insulating coating at the middle section of the probe abuts against the front plate surface of the fixture clamp plate, playing a limiting role.

[0005] During actual use, it is found that the flatness of the edge side of the insulation coating of the probe is not good, and there are burrs to a certain extent. When the edge side of the insulation coating contacts the front plate surface, some protruding burrs or uneven parts contact the front plate first, forming uneven support points, resulting in the probe being skewed. In addition, even if the flatness of the edge side of the insulation coating is initially controlled, due to the relatively soft material of the insulation coating and insufficient bonding firmness with the probe body, when the probe returns to a straight state, the edge of the insulation coating collides with the front plate surface and is stressed. After long-term collisions, the edge of the insulation coating is prone to irregular deformation or displacement, resulting in insufficient perpendicularity of the edge side of the insulation coating, which will also cause the probe to be skewed.

[0006] As is well known, the tip points of individual skewed probes in the test fixture are bound to be not in the same plane as the tip points of other probes. During chip detection, it is impossible to ensure good contact between all probes and the chip, seriously affecting the detection accuracy.

[0007] The above problems are worthy of being solved. Summary of the Invention

[0008] In order to overcome the problem that the perpendicularity of the edge side of the insulation coating of the existing probe for chip testing is insufficient, resulting in insufficient detection accuracy of the test fixture, the present invention provides a preparation process for a probe for chip or package substrate sealing and testing.

[0009] The technical solution of the present invention is as follows:

[0010] A probe for chip or package substrate sealing and testing includes a probe body with a gold-plated surface. An insulation coating is plated outside the gold-plated layer in the middle section of the probe body. It is characterized in that a ring-shaped metal layer is plated around the probe body between the insulation coating and the probe body at one end of the insulation coating close to the needle tip, so as to form a ring-shaped positioning member at one end of the insulation coating close to the needle tip, and the outer ring surface of the ring-shaped positioning member is perpendicular to the probe body, forming a clear angle between the ring-shaped positioning member and the probe body; when the probe is reset and its needle tip penetrates through the fixture plate, the outer ring surface of the ring-shaped positioning member abuts against the fixture plate surface.

[0011] As a preferred solution of the present invention, the thickness of the ring-shaped positioning member is uniform.

[0012] As a preferred solution of the present invention, the thickness of the ring-shaped positioning member gradually increases in the direction from the needle tail to the needle tip, and the thickness of the ring-shaped positioning member remains the same in the circumferential direction of the probe body.

[0013] As a preferred solution of the present invention, a self-lubricating coating film layer is coated on the surface of the probe body in the area between the ring-shaped positioning member and the needle tip.

[0014] As a preferred embodiment of the present invention, the material of the annular positioning member is metal, such as nickel, gold, or silver.

[0015] As a preferred embodiment of the present invention, the material of the probe body is one of tungsten, rhenium-tungsten alloy, or P7 alloy.

[0016] As a preferred embodiment of the present invention, the shape of the needle tip of the probe body is a pointed tip, a round tip, a chisel tip, or a pointed-round tip.

[0017] As a preferred embodiment of the present invention, the length of the probe body is 200 micrometers to 30 millimeters; the diameter of the probe body is 10 micrometers to 110 micrometers.

[0018] As a preferred embodiment of the present invention, the thickness of the insulating coating is 10 ± 5 micrometers.

[0019] The present invention also provides a process for manufacturing the probe for chip or package substrate sealing and testing described in the above embodiments, including the following steps:

[0020] Step 1: Prepare the probe body;

[0021] Cut a small section that meets the length requirement from the coil stock, add one element of gold, silver, copper, nickel, iron, lead, or zinc in the gold salt content, and straighten it to form the probe body;

[0022] Step 2: Pretreat the gold salt;

[0023] Use electrolysis technology to remove a certain element in the gold salt content, and the removed element is the same as the element added in Step 1;

[0024] Step 3: Form a gold plating layer on the surface of the probe body by electroplating the treated gold salt;

[0025] Step 4: Electroplate a metal layer around the gold plating layer on the surface of the probe body near the needle tip in the middle section of the probe body to form an annular positioning member on the probe body;

[0026] Step 5: Process the outer ring surface of the annular positioning member by 3D lithography technology and micro-etching technology so that the outer ring surface is perpendicular to the probe body, and the joint between the annular positioning member and the probe body is a sharp corner;

[0027] Step 6: Coat an insulating coating on the middle section area of the probe body, and make the edge of the insulating coating near the needle tip not exceed the outer ring surface of the annular positioning member;

[0028] Step 7: Coat a self-lubricating coating layer on the surface of the gold plating layer in the area between the annular positioning member and the needle tip.

[0029] Further, the straightening process is carried out in a vacuum environment. The two ends of the cut segment are clamped by clamping plates, and through several cold and hot cycles until the bent cut segment is straightened.

[0030] For the present invention according to the above solution, its beneficial effects are as follows:

[0031] In the present invention, the rigid limit of the annular positioning member is used to replace the soft limit of the insulating coating. The outer circumferential surface of the annular positioning member is perpendicular to the probe body. Since the outer circumferential surface of the annular positioning member has better flatness, there will be no uneven support points such as burrs; at the same time, the hardness and stability of the metal annular positioning member are better than those of the insulating coating. During long-term use, even when subjected to the collision force with the surface of the fixture plate, it is not easy to deform or shift, and can maintain good perpendicularity, forming a uniform support when contacting the fixture plate;

[0032] It can be seen that the annular positioning member plays a stable limiting role during the probe reset process, avoiding the probe skew caused by burrs or deformation of the insulating coating, ensuring that the tip points of all probes on the detection fixture are on the same plane, ensuring good contact between all probes and the chip, so as to improve the accuracy of chip detection. Description of the Drawings

[0033] Figure 1 is a schematic structural diagram of Embodiment 1 in the present invention;

[0034] Figure 2 is a schematic structural diagram of Embodiment 2 in the present invention;

[0035] Figure 3 is a schematic diagram of the usage scenario of the probe;

[0036] Figure 4 is a schematic structural diagram of the existing probe.

[0037] In the figure,

[0038] 1. Probe body; 2. Insulating coating; 3. Annular positioning member; 4. Self-lubricating coating layer; 5. Chamfering; 6. Fixture plate. Detailed Embodiments

[0039] In order to better understand the purpose, technical solution and technical effect of the present invention, the present invention will be further explained below with reference to the drawings and embodiments. It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, it is stated that the embodiments described below are only used to explain the present invention and are not used to limit the present invention.

[0040] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time.

[0041] The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is customarily placed during use, or the orientation or positional relationship commonly understood by those skilled in the art, or the orientation or positional relationship in which the product of this application is customarily placed during use. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0042] Embodiment 1

[0043] As Figure 1 and Figure 3 shown, a probe for chip or package substrate sealing and testing includes a probe body 1 with a gold-plated surface. An insulating coating layer 2 is plated outside the gold-plated layer in the middle section of the probe body 1. A section of annular metal layer is plated around the probe body between the insulating coating layer 2 and the probe body 1 near one end of the needle tip to form an annular positioning member 3 at this end of the insulating coating layer 2. The outer circumferential surface of the annular positioning member 3 is perpendicular to the probe body 1, and a clear angle 5 is formed between the annular positioning member 3 and the probe body 1. When the probe is reset and the needle tip penetrates through the jig plate 6 (the front plate of the test jig), the outer circumferential surface of the annular positioning member 3 abuts against the surface of the jig plate 6.

[0044] In the present invention, a metal layer is plated between the insulating coating layer 2 and the probe body 1 near one end of the needle tip to form an annular positioning member 3. During the electroplating process, metal ions can be deposited on the surface of the probe body 1 more uniformly. Compared with the soft material used for the insulating coating layer 2, after the metal material solidifies and forms, its texture is relatively hard and uniform. The hard texture makes it not easy to produce irregular protrusions or depressions during the process of forming the circumferential surface, which is beneficial to ensuring the flatness of the side. And once the annular positioning member 3 is formed, due to the good strength and toughness of the metal, it can better resist surface deformation caused by external forces and maintain flatness for a long time.

[0045] The outer ring surface of the annular positioning member 3 is perpendicular to the probe body 1. When the probe is reset and the needle tip passes through the jig plate 6, the outer ring surface of the annular positioning member 3 is against the jig plate 6. Compared with the edge side of the original insulating coating layer 2, the outer ring surface of the annular positioning member 3 is smoother, which effectively avoids the problem of probe skew caused by uneven support points, ensures that the needle tip vertices of all probes on the detection jig are on the same plane, and ensures that all probes are in good contact with the chip to improve the accuracy of chip detection.

[0046] The material of the probe body 1 is one of tungsten, rhenium tungsten alloy, and P7 alloy (P7 alloy is a special metal alloy containing a certain proportion of nickel, chromium and other alloy elements). The above materials each have their own advantages and can ensure the service life of the probe. For example, the high strength and toughness of rhenium tungsten alloy enable the probe body 1 to withstand these external forces without breaking or excessive deformation, effectively protecting the structural integrity of the probe; rhenium tungsten alloy has excellent fatigue resistance and can withstand such long-term, high-frequency cyclic loads without fatigue damage. P7 alloy has good processing properties, so that a more suitable process can be used during the manufacturing process to enhance the bonding strength between the annular positioning member 3 and the probe body 1, further ensuring the overall stability and service life of the probe.

[0047] The needle tip of the probe body 1 is in the shape of a pointed tip, a round tip, a chisel tip or a pointed round tip. Among them, the pointed tip structure is a needle tip with a sharp end and a small contact area, which is suitable for detecting tiny test points on the chip. The round tip structure is a needle tip with a round end, a relatively smooth surface, and a relatively large contact area, which is suitable for detecting chip test points with sensitive surfaces or easily damaged. The pointed round tip structure is a needle tip with a certain degree of sharpness and a certain arc transition, which is similar to the round tip structure, but the needle tip is sharper and thinner, which is suitable for scenarios that require high positioning accuracy of the test point and require a certain degree of protection of the test point surface. The chisel tip structure is a needle tip shaped like a chisel, with a wider flat end and a certain angle, which is suitable for test scenarios that require a larger contact area and stronger scratching ability.

[0048] In this embodiment, the thickness of the annular positioning member 3 is uniform, forming a regular and stable limiting structure. When the probe is reset, its uniform thickness allows the stress distribution of various parts of the probe to be balanced when subjected to force, effectively avoiding the probe skew caused by local uneven force, and greatly improving the stability of the probe during the test process.

[0049] like Figure 2As shown, in other preferred embodiments, the thickness of the annular positioning member 3 gradually increases from the needle tail to the needle head direction, and in the circumferential direction of the probe body 1, the thickness thereof remains the same. A slope is formed on the side of the annular positioning member 3 close to the insulation coating layer 2. The slope provides a larger surface area for the coating of the insulating material, so that more insulating material can be coated on this slope than in the conventional design, and more insulating material can provide better insulation protection. On the other hand, from the perspective of structural mechanics, the insulation coating layer 2 plays a certain buffering role on the slope of the annular positioning member 3. When the side surface of the metal positioning outer ring is subjected to an external force impact, the insulation coating layer 2 can absorb part of the energy and reduce the impact force on the annular positioning member 3 and the probe body 1.

[0050] In this embodiment, the material of the annular positioning member 3 can be nickel, gold or silver. Nickel and the common material of the probe body 1 (such as rhenium tungsten alloy) have certain similarities in crystal structure, so that nickel atoms can be well matched and combined with the atoms of the probe body 1 material during the deposition process, forming a stable crystal interface, thereby enhancing the bonding force between the two. Gold has a low surface energy. During the electroplating process, gold atoms can well wet the surface of the probe body 1, enabling it to evenly adhere to the probe body 1, which helps to form a tight contact between gold and the probe body 1 and achieve a firm bond. Silver has a high chemical activity. During the electroplating process, silver ions can chemically react with the surface of the probe body 1 to form a strong chemical bond, making the bond between silver and the probe body 1 more firm. During the chip packaging and testing process, the probe will experience frequent stretching, collision and other actions. A firm bond can ensure that the annular positioning member 3 always tightly adheres to the probe body 1 and continuously plays its limiting and positioning roles.

[0051] The length of the probe body 1 is from 200 microns to 30 millimeters, and can be 200 microns, 500 microns, 1 millimeter, 2 millimeters, 5 millimeters, 11 millimeters, 15 millimeters, 20 millimeters, 30 millimeters.

[0052] The diameter of the probe body 1 is from 10 microns to 110 microns, and can be 10 microns, 20 microns, 30 microns, 40 microns, 50 microns, 70 microns, 90 microns, 110 microns.

[0053] The thickness of the insulating coating layer 2 is 10 ± 5 microns, which can provide stable and reliable insulation protection for the probe. In actual chip testing, a certain degree of bending will occur in the middle section of the probe. The appropriate thickness of the insulating coating layer 2 can adapt to this deformation and maintain the integrity of its insulation function; the flexible insulating coating layer 2 also helps to improve the toughness of the middle section of the probe; the stable and reliable insulating coating layer 2 can reduce the failures and repeated tests caused by insulation problems during the testing process, thereby improving the efficiency of chip packaging and testing. It can be seen that the feature of the insulating coating layer 2 having a thickness of 10 ± 5 microns is of great significance in aspects such as the insulation performance, flexibility of the probe, and the efficiency of chip packaging and testing, and is one of the key factors to ensure the normal operation of the probe and the accurate testing of the chip.

[0054] To achieve a micron-level thickness of the insulating coating layer, an advanced coating process is usually adopted. In the spraying process, by precisely controlling the parameters of the spraying equipment, the deposition amount of the insulating material is adjusted to achieve the required thickness. For example, using a high-precision spraying equipment, the insulating material is sprayed onto the gold-plated layer of the probe body 1 in a uniform mist. Through multiple thin coatings and precise parameter adjustments, the final thickness of the insulating coating layer 2 is stabilized within the target range.

[0055] Example Two

[0056] As Figure 2 shown, since the probe will be subject to frequent friction with the test fixture during long-term use, which will cause wear on the surface of the probe body and affect its service life and testing accuracy, this example is an improvement based on Example One.

[0057] A probe for chip or package substrate packaging and testing includes a probe body 1 with a gold-plated surface, the same as in Example One: an insulating coating layer 2 is plated outside the gold-plated layer in the middle section of the probe body 1. A ring-shaped positioning member 3 is formed by plating a metal layer between the insulating coating layer 2 and the probe body 1 near one end of the needle tip. The difference is that a self-lubricating coating layer 4 is coated on the surface of the probe body 1 in the area between the ring-shaped positioning member 3 and the needle tip, which has an extremely low friction coefficient and generates friction with the inner wall of the hole during use. During continuous friction, it can automatically "repair" the unevenness on the surface and keep the surface of the probe body 1 in a good lubricated state.

[0058] In an alternative embodiment, the material of the self-lubricating coating layer is Teflon. During use, as Teflon rubs against other objects, the molecules on its surface will undergo a certain degree of directional arrangement. The Teflon molecular chain has high flexibility and fluidity. When the surface is subjected to friction, the molecular chain will gradually adjust its direction to make the friction surface smoother, thereby further reducing the friction coefficient and showing the characteristic of becoming more lubricated with use. Just like during continuous friction, Teflon can automatically "repair" the unevenness on the surface and keep it in a good lubricated state.

[0059] During the chip packaging and testing process, the probe needs to frequently stretch back and forth in the perforations of the test fixture board 6. After coating with the self-lubricating coating layer 4, the frictional resistance between the probe body 1 and the test fixture can be significantly reduced, making the stretching action of the probe smoother, reducing the jamming phenomenon caused by excessive friction, and thus improving the testing efficiency.

[0060] In summary, the present invention innovatively introduces a metal transition layer at the end of the insulating layer to form a composite coating structure, realizing the formation of a ring-shaped positioning member on the side surface of the coating of the probe body, effectively avoiding the probe skew problem caused by uneven support points on the side surface of the coating; during long-term use, even if the ring-shaped positioning member is subjected to collision forces with the surface of the fixture board, it is not easy to deform or shift, and can maintain good perpendicularity of the side surface of the coating, further ensuring that the probe will not skew due to problems at the edge of the insulating coating, providing stable support for the probe, making the probe more stable during use, reducing detection errors or other problems that may be caused by probe instability, and improving the overall performance and reliability of the test fixture.

[0061] The present invention also provides a preparation process method for a chip packaging and testing probe, including the following steps:

[0062] Step 1: Prepare the probe body;

[0063] Cut a small section that meets the length requirement from the coil stock. The coil stock can be tungsten coil stock or rhenium-tungsten alloy coil stock. Add one element of gold, silver, copper, nickel, iron, lead, or zinc in the gold salt content to the cut section and straighten it to form the probe body; the straightening process is carried out in a vacuum environment. Clamp both ends of the cut section with clamping plates and perform several cold and hot cycles until the bent cut section is straightened.

[0064] The principle of the straightening process is as follows: Since a large amount of internal stress will accumulate in the metal coil stock during the winding process, when straightening, external forces are applied by clamping both ends of the cut section with clamping plates, and at the same time, the cold and hot cycles cause the metal material to undergo expansion and contraction processes. During this process, the internal stress is released and redistributed. When the stress state changes, the driving force for the metal material to return to its original shape also changes, making it difficult for the metal to return to its original wound shape, thus achieving the purpose of eliminating metal memory.

[0065] The method of adding elements to the cut section can adopt the alloying method. Specifically, the element to be added is fused with the coil stock in the form of pure metal at high temperature, so that the added element is evenly distributed in the matrix of the coil stock. The method of adding elements can also be the diffusion method. Utilize the diffusion movement of atoms at high temperature to make the atoms of the added element diffuse from the high-concentration region into the interior of the coil stock, thereby realizing the addition of elements.

[0066] Step 2: Gold salt pretreatment;

[0067] Use electrolysis technology to remove a certain element in the gold salt content, and the removed element is the same as the element added in Step 1.

[0068] Step 3: Form a gold-plated layer on the surface of the probe body by electroplating the treated gold salt.

[0069] When the gold salt is untreated, gold plating on the rhenium-tungsten alloy or tungsten surface is likely to produce crystal defects and voids, and these defects will become potential hazards for the displacement of the ring-shaped positioning member. Since the gold salt is pretreated, the element added to the probe body can change the crystal structure characteristics of the probe body surface, making it more compatible with the crystal structure of the gold salt; during the electroplating process, gold atoms can deposit and grow more orderly on the probe body surface, forming a more regular and compact crystal structure, reducing crystal defects and voids, thereby improving the bonding force between the gold-plated layer and the probe body.

[0070] Step 4: Electroplate a metal layer around the probe body on the surface of the gold-plated layer near the needle tip at the middle section of the probe body to form a ring-shaped positioning member on the probe body.

[0071] Step 5: Use 3D lithography technology and micro-etching technology to process the outer ring surface of the ring-shaped positioning member so that the outer ring surface is perpendicular to the probe body, and the connection between the ring-shaped positioning member and the probe body is a clear corner.

[0072] Step 6: Coat an insulating coating layer in the middle section area of the probe body, and make the edge of the insulating coating layer near the needle tip not exceed the outer ring surface of the ring-shaped positioning member.

[0073] Step 7: Coat a self-lubricating coating film layer on the surface of the gold-plated layer in the area between the ring-shaped positioning member and the needle tip.

[0074] The material of the self-lubricating coating film layer is Teflon powder, and the spraying method can be used. Specifically, use spraying equipment to evenly spray on the surface of the gold-plated layer in the area between the ring-shaped positioning member and the needle tip to ensure that the Teflon coating evenly covers the surface.

[0075] In summary, the present invention replaces the soft limit of the insulating coating layer with the rigid limit of the ring-shaped positioning member. The outer ring surface of the ring-shaped positioning member is perpendicular to the probe body. Since the flatness of the outer ring surface of the ring-shaped positioning member is better, there will be no uneven support points such as burrs; at the same time, the hardness and stability of the metal ring-shaped positioning member are better than those of the insulating coating layer. During long-term use, even if it is subjected to the collision force with the surface of the fixture board, it is not easy to deform or shift. It can be seen that the ring-shaped positioning member plays a stable limiting role during the probe reset process, avoiding probe skew, ensuring that the needle tips of all probes on the detection fixture are in the same plane, and ensuring good contact between all probes and the chip to improve the accuracy of chip detection.

[0076] The technical features of the above embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0077] The above embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limitations on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A probe for chip or package substrate packaging and testing, including a probe body with a gold-plated surface. An insulating coating is plated outside the gold-plated layer in the middle section of the probe body. It is characterized in that, At one end of the insulating coating layer close to the needle tip, a ring-shaped metal layer is plated around the probe body between the insulating coating layer and the probe body to form a ring-shaped positioning member at one end of the insulating coating layer close to the needle tip, and the outer circumferential surface of the ring-shaped positioning member is perpendicular to the probe body, forming a sharp corner between the ring-shaped positioning member and the probe body; when the probe resets and its needle tip penetrates through the jig plate, the outer circumferential surface of the ring-shaped positioning member abuts against the surface of the jig plate.

2. The probe for chip or package substrate packaging and testing according to claim 1, characterized in that, The thickness of the ring-shaped positioning member is uniform.

3. The probe for chip or package substrate packaging and testing according to claim 1, wherein The thickness of the ring-shaped positioning member gradually increases in the direction from the needle tail to the needle tip, and the thickness of the ring-shaped positioning member remains the same in the circumferential direction of the probe body.

4. The probe for chip or package substrate packaging and testing according to claim 1, wherein A self-lubricating coating layer is coated on the surface of the probe body in the area between the ring-shaped positioning member and the needle tip.

5. The probe for chip or package substrate packaging and testing according to claim 1, characterized in that The material of the probe body is one of tungsten, rhenium-tungsten alloy or P7 alloy.

6. The probe for chip or package substrate packaging and testing according to claim 1, characterized in that The shape of the needle tip of the probe body is a pointed tip, a round tip, a chisel tip or a pointed-round tip.

7. The probe for chip or package substrate packaging and testing according to claim 1, characterized in that, The length of the probe body is 200 microns to 30 millimeters; the diameter of the probe body is 10 microns to 110 microns.

8. The probe for chip or package substrate packaging and testing according to claim 1, wherein The thickness of the insulating coating layer is 10 ± 5 microns.

9. A process for preparing a probe for chip or package substrate sealing and testing as described in any one of claims 1 to 8, characterized in that, Including the following steps: Step 1, preparing the probe body; Cut a small section that meets the length requirement from the coil stock, add one element of gold, silver, copper, nickel, iron, lead, zinc in the gold salt content, and straighten it to form the probe body; Step 2, pre-treating the gold salt; Use electrolysis technology to remove a certain element in the gold salt content, and the removed element is the same as the element added in Step 1; Step 3, plating the treated gold salt on the surface of the probe body through electroplating to form a gold plating layer; Step 4, electroplating a metal layer around the probe body on the surface of the gold plating layer at one end of the middle section of the probe body close to the needle tip to form a ring-shaped positioning member on the probe body; Step 5, using 3D lithography technology and micro-etching technology to process the outer circumferential surface of the ring-shaped positioning member so that the outer circumferential surface is perpendicular to the probe body, and the connection between the ring-shaped positioning member and the probe body is a sharp corner; Step 6, coating an insulating coating layer in the middle section area of the probe body, and making the edge of one end of the insulating coating layer close to the needle tip not exceed the outer circumferential surface of the ring-shaped positioning member; Step 7, coating a self-lubricating coating layer on the surface of the gold plating layer in the area between the ring-shaped positioning member and the needle tip.

10. The process of the probe for chip or package substrate packaging and testing according to claim 9, characterized in that, In Step 1, the straightening process is carried out in a vacuum environment. Clamp both ends of the cut section with a clamping plate, and through several cold and hot cycles until the bent cut section is straightened.

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