Test probes, probe cards, and methods of making test probes

Abstract

The present application relates to chip detection technical field, specifically to test probe, probe card and test probe manufacturing method, the test probe includes probe body, the outside of probe body is equipped with plating layer, plating layer includes at least two elements;Wherein, in the thickness direction of plating layer, the content of at least two elements in plating layer is continuously linearly changed, so that the conduction coefficient and the anti-deformation coefficient of plating layer are continuously linearly changed in the thickness direction of plating layer.In the present application, all elements that affect the conduction coefficient and the anti-deformation coefficient exist in the same plating layer, that is, these elements are connected to form a whole, compared with the alloy plating layer of two stacked settings in the prior art, the plating layer of the present application is more firm, and the repeated bending deformation of the test probe will not cause the separation of the plating layer itself, thereby avoiding the overall performance reduction of the test probe.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, specifically to test probes, probe cards, and methods for manufacturing test probes. Background Technology

[0002] Probes are important components used for chip signal testing. The exterior of probes is typically coated with an alloy plating layer to improve resistance to deformation and another alloy plating layer to improve conductivity, and these two alloy plating layers are stacked sequentially.

[0003] During signal testing, to prevent poor contact, the substrate presses the probe against the surface of the object under test. The pressure from the substrate causes the probe to bend and deform. Since the two alloy plating layers on the outside of the probe are stacked, repeated bending and deformation of the probe can cause the two alloy plating layers to separate, resulting in a decrease in the overall performance of the probe. Summary of the Invention

[0004] The purpose of this invention is to overcome the following technical problem: the two alloy coating layers on the outside of the probe are stacked, and repeated bending deformation of the probe will cause the two alloy coating layers to separate, which will lead to a decrease in the overall performance of the probe.

[0005] To achieve the above objectives, the present invention provides a test probe comprising a probe body, the probe body having an outer coating layer containing at least two elements; wherein, in the thickness direction of the coating layer, the content of the at least two elements in the coating layer varies continuously and linearly, so that the conductivity coefficient and the deformation resistance coefficient of the coating layer vary continuously and linearly in the thickness direction of the coating layer.

[0006] In some embodiments, the coating layer comprises two elements; wherein, the content of the two elements in the coating layer varies continuously and linearly in the thickness direction of the coating layer, so that the conductivity coefficient and the deformation resistance coefficient of the coating layer vary continuously and linearly in the thickness direction of the coating layer.

[0007] In some embodiments, the coating layer comprises three elements; wherein, in the thickness direction of the coating layer, the content of at least two elements in the coating layer varies continuously and linearly, so that the conductivity coefficient and the deformation resistance coefficient of the coating layer vary continuously and linearly in the thickness direction of the coating layer.

[0008] In some embodiments, each element contained in the coating layer has a different effect on the conductivity and / or resistance to deformation.

[0009] In some embodiments, in a straight line direction from the inner surface of the plating layer to the outer surface thereof, the content of at least one element in the plating layer continuously linearly increases, the content of at least one element in the plating layer continuously linearly decreases, one of the conductive coefficient and the deformation resistance coefficient of the plating layer continuously linearly increases along the direction, and the other of the conductive coefficient and the deformation resistance coefficient of the plating layer continuously linearly decreases along the direction.

[0010] In some embodiments, the plating layer is attached to the outer surface of the probe body.

[0011] Another aspect of the present application also provides a probe card, which comprises a substrate and a plurality of test probes of the above-mentioned embodiments, and the plurality of test probes are spaced apart and mounted on the bottom of the substrate.

[0012] Still another aspect of the present application also provides a test probe manufacturing method, which comprises: performing an electroplating step on a probe body, and dynamically adjusting electroplating conditions in the electroplating step to form a plating layer on the outside of the probe body; and in the thickness direction of the plating layer, the content of at least two elements in the plating layer continuously linearly changes, so that the conductive coefficient and the deformation resistance coefficient of the plating layer continuously linearly change in the thickness direction of the plating layer.

[0013] In some embodiments, the dynamic adjustment of the electroplating conditions at least includes at least one of the following adjustment items: (I) dynamically adjusting the current density of the electroplating over time; (II) dynamically adjusting the concentration of the complexing agent in the electroplating solution over time; (III) dynamically adjusting the temperature of the electroplating solution over time; (IV) dynamically adjusting the pH value of the electroplating solution over time.

[0014] The above technical solutions of the present application have the following technical effects:

[0015] The outside of the probe body is provided with a plating layer, and the plating layer contains at least two elements. In the plating layer, the content of the at least two elements continuously linearly changes in the thickness direction thereof, so that the conductive coefficient and the deformation resistance coefficient of the plating layer continuously linearly change in the thickness direction thereof, and the plating layer can simultaneously optimize the conductive performance and the deformation resistance performance of the probe body. Moreover, all the elements that affect the conductive coefficient and the deformation resistance coefficient exist in the same plating layer, that is, these elements are connected to form a whole, and compared with the two stacked alloy plating layers in the prior art, the plating layer of the present application is more firm, and repeated bending deformation of the test probe will not cause the plating layer itself to separate, thereby avoiding the overall performance of the test probe from being reduced. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a schematic view of a test probe in an embodiment of the present application;

[0017] Figure 2is a content variation diagram of the first element and the second element in one embodiment of the present application;

[0018] Figure 3 is a content variation diagram of the first element and the second element in another embodiment of the present application;

[0019] Figure 4 is a content variation diagram of the first element and the second element in yet another embodiment of the present application.

[0020] Reference Signs List

[0021] 1, probe body; 2, plating layer; 21, inner surface of plating layer; 22, outer surface of plating layer; 23, first element; 24, second element. DETAILED DESCRIPTION

[0022] The features and exemplary embodiments of the various aspects of the present application will be described in detail below with reference to the drawings. To make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. The present application can be implemented without some of the specific details by those skilled in the art. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application.

[0023] As Figures 1 to 4 shown, one aspect of the present application provides a test probe, which comprises a probe body 1, and the outer part of the probe body 1 is provided with a plating layer 2, and the plating layer 2 contains at least two elements. In the thickness direction of the plating layer 2, the content of the at least two elements in the plating layer 2 changes continuously and linearly, so that the conductive coefficient and the deformation resistance coefficient of the plating layer 2 change continuously and linearly in the thickness direction of the plating layer 2.

[0024] Specifically, the outer part of the probe body 1 is provided with a plating layer 2, and the plating layer 2 contains at least two elements. In the plating layer 2, the content of the at least two elements changes continuously and linearly in the thickness direction, so that the conductive coefficient and the deformation resistance coefficient of the plating layer 2 change continuously and linearly in the thickness direction, and thus the plating layer 2 can simultaneously optimize the conductive performance and the deformation resistance performance of the probe body 1. Moreover, all the elements that affect the conductive coefficient and the deformation resistance coefficient exist in the same plating layer 2, i.e., these elements are connected to form a whole. Compared with the two stacked alloy plating layers in the prior art, the plating layer 2 of the present application is more firm, and the repeated bending deformation of the test probe will not cause the plating layer 2 to separate itself, thereby avoiding the overall performance of the test probe from being reduced.

[0025] As Figures 2 to 4As shown, in some embodiments of the present application, the plating layer 2 comprises two elements; wherein the content of the two elements in the plating layer 2 is continuously linearly changed in the thickness direction of the plating layer 2, so that the conductive coefficient and the deformation resistance coefficient of the plating layer 2 are continuously linearly changed in the thickness direction of the plating layer 2.

[0026] Specifically, the two elements that affect the conductive coefficient and the deformation resistance coefficient are both present in the same plating layer 2, that is, the two elements are connected to form a firm whole, so that the plating layer 2 can simultaneously optimize the conductive performance and the deformation resistance performance of the probe body 1, for example, can simultaneously optimize the heat conduction performance, the magnetic conduction performance, the electrical conduction performance, the hardness performance and the strength performance, etc.

[0027] For example, in some embodiments, as shown in the figure, Figures 2 to 4 As shown, the plating layer 2 comprises two elements, the first element 23 is cobalt element, and the second element 24 is nickel element. In the thickness direction of the plating layer 2, the content of the cobalt element is continuously linearly changed, so that the deformation resistance coefficient of the plating layer 2 is continuously linearly changed in the thickness direction of the plating layer 2; the content of the nickel element is continuously linearly changed, so that the conductive coefficient of the plating layer 2 is continuously linearly changed in the thickness direction of the plating layer 2. Of course, the plating layer 2 can also be two other elements, for example, copper element and chromium element, which are not limited by the present application.

[0028] In some embodiments of the present application, the plating layer 2 comprises three elements. Among them, in the thickness direction of the plating layer 2, the content of at least two elements in the plating layer 2 is continuously linearly changed, so that the conductive coefficient and the deformation resistance coefficient of the plating layer 2 are continuously linearly changed in the thickness direction of the plating layer 2.

[0029] Specifically, among the three elements, two or three elements can affect the conductive coefficient and the deformation resistance coefficient. Similarly, all elements that affect the conductive coefficient and the deformation resistance coefficient are present in the same plating layer 2, that is, the two elements are connected to form a firm whole, so that the plating layer 2 can simultaneously optimize the conductive performance and the deformation resistance performance of the probe body 1, for example, can simultaneously optimize the heat conduction performance, the magnetic conduction performance, the electrical conduction performance, the hardness performance and the strength performance, etc.

[0030] For example, in some embodiments, as shown in the figure, Figure 2As shown, the coating layer 2 contains three elements: cobalt (element 23), nickel (element 24), and iron (element 3). The cobalt content varies linearly along the thickness of the coating layer 2, ensuring that the deformation resistance coefficient of the coating layer 2 varies linearly along its thickness. Similarly, the nickel content varies linearly, ensuring that the conductivity coefficient of the coating layer 2 varies linearly along its thickness. The iron content can vary linearly or remain constant. Of course, the coating layer 2 can also contain three other elements, such as palladium, silver, and copper; this invention is not limited to these three elements.

[0031] In some embodiments of the present invention, each element contained in the coating layer has a different effect on the conductivity and / or resistance to deformation.

[0032] Specifically, each element in the coating layer can affect the conductivity and / or deformation resistance coefficient. For example, one element can affect either the conductivity or the deformation resistance coefficient, or one element can affect both simultaneously. Furthermore, the influence of each element on the conductivity and / or deformation resistance coefficient changes with the element content. Ultimately, under the combined influence of various elements, the conductivity and deformation resistance coefficient of the coating layer 2 exhibit a continuous linear variation along its thickness direction. This allows the coating layer 2 to simultaneously optimize the conductivity and deformation resistance of the probe body 1, such as simultaneously optimizing thermal conductivity, magnetic permeability, electrical conductivity, hardness, and strength.

[0033] For example, in some embodiments, the coating layer 2 contains cobalt and nickel. Cobalt primarily affects the coefficient of deformation, thus influencing hardness and strength properties. Nickel primarily affects the conductivity, thus influencing thermal conductivity, magnetic conductivity, and electrical conductivity.

[0034] like Figure 2 As shown, in some embodiments of the present invention, in a straight direction from the inner surface to the outer surface of the coating layer 2, the content of the first element 23 in the coating layer 2 increases continuously and linearly, and the content of the second element 24 in the coating layer 2 decreases continuously and linearly, so that one of the conductivity coefficient and the deformation resistance coefficient of the coating layer 2 increases continuously and linearly in this direction, and the other of the conductivity coefficient and the deformation resistance coefficient of the coating layer 2 decreases continuously and linearly in this direction.

[0035] Specifically, the plating layer 2 can contain two, three or more than three elements. All the elements that affect the conductive coefficient and the deformation resistance coefficient are present in the same plating layer 2, that is, these elements are connected to form a firm whole, so that the plating layer 2 can simultaneously optimize the conductive performance and the deformation resistance performance of the probe body 1, such as simultaneously optimizing the heat conduction performance, the magnetic conduction performance, the electric conduction performance, the hardness performance and the strength performance, etc. Moreover, the content of at least one element continuously linearly increases, and the content of at least one element continuously linearly decreases, so that the content variation trend of the main component elements in the plating layer 2 is relatively stable, and the plating layer 2 is a single layer structure as a whole, which is helpful to make the plating layer 2 more stable and firm.

[0036] For example, in some embodiments, as shown in FIG. 2, the plating layer 2 contains three elements, the first element 23 is cobalt element, the second element 24 is nickel element, and the third element is iron element. The inner surface of the plating layer 2 is defined as the plating inner surface 21, and the outer surface of the plating layer 2 is defined as the plating outer surface 22. In the straight line direction from the plating inner surface 21 to the plating outer surface 22, the content of the cobalt element linearly increases, so that the deformation resistance coefficient of the plating layer 2 continuously linearly increases; the content of the nickel element linearly decreases, so that the conductive coefficient of the plating layer 2 continuously linearly decreases; and the content of the iron element can remain stable, continuously linearly increase or continuously linearly decrease. Figure 2 In other embodiments, as shown in FIG. 3, in the straight line direction from the plating inner surface 21 to the plating outer surface 22, the content of at least one element first decreases and then increases, and the variation trend is approximately a continuous curve with the opening upward; and the content of at least one element first increases and then decreases, and the variation trend is approximately a continuous curve with the opening downward. For example, as shown in FIG. 3, the content variation trend of the first element 23 is a continuous curve with the opening upward, and the content variation trend of the second element 24 is a continuous curve with the opening downward. Of course, in these embodiments, the plating layer 2 can also contain two, three or more than three elements.

[0037] Figure 3 Figure 3 Of course, the content variation trend of the elements in the plating layer 2 can also be other forms, which are not limited in the present application. For example, as shown in FIG. 4, it can also be a continuous curve approximately similar to the image of an exponential function.

[0038] Figure 4

[0039] ​​​​In some embodiments of the present invention, the material selected for the coating layer 2 includes at least one of gold (Au), silver (Ag), copper (Cu), nickel (Ni), chromium (Cr), platinum (Pt), palladium (Pd), iron (Fe), tantalum (Ta), zirconium (Zr), aluminum (Al), rhodium (Rh), molybdenum (Mo), titanium (Ti), ruthenium (Ru), cobalt (Co), zinc (Zn), tungsten carbide (WC), diamond-like carbon (DLC), and titanium nitride (TiN). Of course, other materials may also be used, and the present invention does not limit this selection.

[0040] In some embodiments, the various materials in the plating layer 2 may exist in the form of elements, and the material of the plating layer 2 is a mixture of at least two elements, such as a mixture of nickel metal and cobalt metal.

[0041] In some other embodiments, the various elements in the coating layer 2 may exist in the form of solid solution alloys or intermetallic compound alloys, that is, the material of the coating layer 2 is an alloy material composed of at least two elements, such as nickel-cobalt alloy material (Ni-Co), nickel-boron alloy material (Ni-B), platinum-nickel alloy material (Pt-Ni), copper-silver alloy material (Cu-Ag), palladium-silver-copper alloy material (Pd-Ag-Cu), or phosphorus-palladium alloy material (Pd-P), etc.

[0042] like Figure 1 As shown, in some embodiments of the present invention, the plating layer 2 is adhered to the outer surface of the probe body 1 to ensure a firm connection between the plating layer 2 and the probe body 1. For example, the plating layer 2 can be formed on the outer surface of the probe body 1 using an electroplating process.

[0043] In some embodiments, the entire outer surface of the probe body 1 is covered by the coating layer 2. In other embodiments, only the lower middle portion of the outer surface of the probe body 1 is covered by the coating layer 2.

[0044] In some embodiments, a cross-section is taken in a direction perpendicular to the length of the probe body 1, and the cross-section of the probe body 1 is circular and the cross-section of the coating layer 2 is annular; alternatively, the cross-section of the probe body 1 is rectangular and the cross-section of the coating layer 2 is square annular. Of course, the cross-sections of the probe body 1 and the coating layer 2 can also be other shapes, and the present invention is not limited thereto.

[0045] In another aspect, the present invention provides a probe card, which includes a substrate and a plurality of test probes as described above, wherein the plurality of test probes are spaced apart and mounted on the bottom of the substrate.

[0046] Specifically, the probe card of the present invention uses the test probes of the above embodiments, so it can also achieve the above technical effects.

[0047] In some embodiments, the plating layer 2 of the present application can also be plated on the interface of other plating layers or coating layers. In the same way, there will be no peeling off between the various elements in the plating layer 2 of the present application. In some embodiments, the other plating layers or coating layers can be other conductive or insulating layers.

[0048] Another aspect of the present application also provides a test probe manufacturing method, which comprises: performing an electroplating step on a probe body 1, and dynamically adjusting electroplating conditions in the electroplating step to form a plating layer 2 on the outside of the probe body 1; and in the thickness direction of the plating layer 2, the content of at least two elements in the plating layer 2 changes continuously and linearly, so that the conductive coefficient and the deformation resistance coefficient of the plating layer 2 change continuously and linearly in the thickness direction of the plating layer 2.

[0049] Specifically, by dynamically adjusting the electroplating conditions in the electroplating step, the outside of the probe body 1 forms a plating layer 2 containing at least two elements. In this plating layer 2, the content of at least two elements changes continuously and linearly in its thickness direction, so that the conductive coefficient and the deformation resistance coefficient of the plating layer 2 change continuously and linearly in its thickness direction, thereby enabling the plating layer 2 to simultaneously optimize the conductive performance and deformation resistance performance of the probe body 1, such as simultaneously optimizing the heat conduction performance, magnetic conduction performance, electrical conduction performance, hardness performance, and strength performance, etc. Moreover, all elements that affect the conductive coefficient and the deformation resistance coefficient exist in the same plating layer 2, that is, these elements are connected to form a whole. Compared with the two stacked alloy plating layers 2 in the prior art, the plating layer 2 of the present application is more solid, and repeated bending deformation of the test probe will not cause the plating layer 2 itself to separate, thereby avoiding the overall performance of the test probe from being reduced.

[0050] In some embodiments of the present application, dynamically adjusting the electroplating conditions at least includes at least one of the following adjustment items: (I) dynamically adjusting the current density (ASD) of electroplating over time; (II) dynamically adjusting the concentration of complexing agent in the electroplating solution over time; (III) dynamically adjusting the temperature of the electroplating solution over time; (IV) dynamically adjusting the pH value of the electroplating solution over time.

[0051] Specifically, by adjusting at least one of the above items, the plating amount of at least two elements plated on the probe body 1 can change continuously and linearly. Therefore, after the formation of the plating layer 2, the content of at least two elements changes continuously and linearly in its thickness direction.

[0052] In some embodiments, the electroplating material can be selected from at least one of gold (Au), silver (Ag), copper (Cu), nickel (Ni), chromium (Cr), platinum (Pt), palladium (Pd), iron (Fe), tantalum (Ta), zirconium (Zr), aluminum (Al), rhodium (Rh), molybdenum (Mo), titanium (Ti), ruthenium (Ru), cobalt (Co), zinc (Zn), tungsten carbide (WC), diamond-like carbon (DLC), and titanium nitride (TiN). Of course, the electroplating material can also be selected from other materials, and the present application is not limited thereto.

[0053] The principles and implementations of the present application are described herein with specific examples. The above examples are only used to help understand the method of the present application and its core idea. The above is only a preferred embodiment of the present application. It should be pointed out that due to the limited expression of the text, there are objectively infinite specific structures. For ordinary skilled persons in the art, without departing from the principles of the present application, several improvements, refinements or changes can be made, and the above technical features can be combined in an appropriate manner. These improvements, refinements, changes or combinations, or the direct application of the concepts and technical solutions of the present application to other occasions without improvement, shall be regarded as the protection scope of the present application.

Claims

1. A test probe, characterized by, The probe body (1) is provided with a plating layer (2) on the outside, and the plating layer (2) contains at least two metal elements. The content of the at least two metal elements in the plating layer (2) continuously and linearly changes in the thickness direction of the plating layer (2), so that the conductivity and the deformation resistance of the plating layer (2) continuously and linearly change in the thickness direction of the plating layer (2). The plating layer (2) is a single-layer structure as a whole, and all elements affecting the conductivity and the deformation resistance are present in the same plating layer (2), that is, these elements are connected to form a firm whole, so that the plating layer (2) can simultaneously optimize the conductivity and the deformation resistance of the probe body (1).

2. The test probe of claim 1, wherein, The plating layer (2) contains two metal elements, and the content of the two metal elements in the plating layer (2) continuously and linearly changes in the thickness direction of the plating layer (2), so that the conductivity and the deformation resistance of the plating layer (2) continuously and linearly change in the thickness direction of the plating layer (2).

3. The test probe of claim 1, wherein, The plating layer (2) contains three metal elements, and the content of the at least two metal elements in the plating layer (2) continuously and linearly changes in the thickness direction of the plating layer (2), so that the conductivity and the deformation resistance of the plating layer (2) continuously and linearly change in the thickness direction of the plating layer (2).

4. The test probe of claim 1, wherein, The influence of each metal element contained in the plating layer (2) on the conductivity and / or the deformation resistance is different.

5. The test probe of claim 1, wherein, In the straight line direction from the inner surface to the outer surface of the plating layer (2), the content of the first metal element in the plating layer (2) continuously and linearly increases, and the content of the second metal element in the plating layer (2) continuously and linearly decreases, so that one of the conductivity and the deformation resistance of the plating layer (2) continuously and linearly increases in this direction, and the other of the conductivity and the deformation resistance of the plating layer (2) continuously and linearly decreases in this direction.

6. The test probe of claim 1, wherein, The plating layer (2) is attached to the outer surface of the probe body (1).

7. A probe card characterized by, The substrate and a plurality of test probes according to any one of claims 1-6 are installed on the bottom of the substrate.

8. A test probe manufacturing method characterized by, The substrate and a plurality of test probes according to any one of claims 1-6 are installed on the bottom of the substrate. The plating layer (2) is formed on the outside of the probe body (1) by performing an electroplating step on the probe body (1) and dynamically adjusting the electroplating conditions in the electroplating step, and in the thickness direction of the plating layer (2), the content of the at least two metal elements in the plating layer (2) continuously and linearly changes, so that the conductivity and the deformation resistance of the plating layer (2) continuously and linearly change in the thickness direction of the plating layer (2). The plating layer (2) is a single-layer structure as a whole, and all elements affecting the conductivity and the deformation resistance are present in the same plating layer (2), that is, these elements are connected to form a firm whole, so that the plating layer (2) can simultaneously optimize the conductivity and the deformation resistance of the probe body (1).

9. The test probe of claim 8, wherein, The dynamic adjustment of the electroplating conditions comprises at least one of the following adjustment items: (I) dynamically adjusting the current density of the electroplating over time; (II) dynamically adjusting the concentration of the complexing agent in the electroplating solution over time; (III) dynamically adjusting the temperature of the electroplating solution over time; (IV) dynamically adjusting the pH value of the electroplating solution over time.

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