Chip detection device and method

Abstract

The invention relates to a chip detection device and method, and belongs to the field of chip detection. The chip detection device comprises a test light source, an incident optical fiber and analysis equipment; the test light source irradiates on the tested chip through the incident optical fiber and forms a light spot on the tested chip, and the tested chip is in a working state; and the analysis equipment is connected with the tested chip and is used for receiving and analyzing the actual output signal of the tested chip to obtain a test result. The incident optical fiber is used for enabling the light generated by the test light source to form the light spot on the tested chip, then the analysis equipment judges whether the tested chip is influenced by the light according to the actual output signal of the tested chip, and the effect of judging whether the tested chip can keep stable performance under the light condition is achieved.

Description

Technical Field

[0001] This application relates to the technical field of chip detection, and particularly to a chip detection device and method. Background Art

[0002] Optical injection refers to injecting light energy into a semiconductor material to excite electrons to transition from the valence band to the conduction band, thereby forming electron-hole pairs. This process requires that the photon energy be greater than the bandgap energy of the semiconductor material to be able to excite the electron transition. The principle of optical injection is based on the photoelectric effect of the semiconductor material, that is, after the photon energy is absorbed, it will excite electrons to transition from the valence band to the conduction band, thereby forming electron-hole pairs.

[0003] From the optical injection effect, it can be known that when a semiconductor material is irradiated with light, some of the properties of the semiconductor material will change. However, when designing most chips, it is more desirable that the performance of the chip remains stable and is not affected by environmental factors. Therefore, how to determine whether the chip can maintain stable performance under light illumination is a problem that needs to be solved currently. Summary of the Invention

[0004] In order to determine whether a chip can maintain stable performance under light illumination, this application provides a chip detection device and method.

[0005] In the first aspect of this application, a chip detection device is provided. The device includes a test light source, an incident optical fiber, and an analysis device; The test light source irradiates the chip under test through the incident optical fiber and forms a light spot on the chip under test, and the chip under test is in a working state; The analysis device is connected to the chip under test and is used to receive and analyze the actual output signal of the chip under test to obtain a test result.

[0006] From the above technical solutions, through the incident optical fiber, the light generated by the test light source forms a light spot on the chip under test, irradiates all or part of the devices on the chip under test, and then uses the analysis device to obtain the actual output signal of the chip under test in the working state and analyze the actual output signal to determine whether the actual output result of the chip under test is affected by light illumination, so as to obtain a test result, realizing the detection of the performance of the chip under test, that is, achieving the effect of determining whether the chip can maintain stable performance under light illumination.

[0007] In a possible implementation manner, the device further includes a reflection optical fiber, a light intensity detection device, and a light intensity control device; The reflection optical fiber is used to reflect the light spot on the chip under test; The light intensity detection device faces the test light source or the reflection optical fiber and outputs a light illumination intensity signal, and the light illumination intensity signal represents the light illumination intensity of the test light source and / or the light illumination intensity reflected by the reflection optical fiber; The analysis device is respectively connected to the light intensity detection device and the light intensity control device, and is used to receive the light intensity signal and output the light intensity adjustment signal; The light intensity control device is connected to the test light source and is used to receive the light intensity adjustment signal and adjust the light intensity of the test light source.

[0008] As can be seen from the above technical solution, since there is transmission loss in the process of optical fiber transmitting light, the light intensity of the test light source is stronger than the light intensity of the light spot on the chip under test. Therefore, the light intensity of the light reflected by the light spot is obtained through the reflection optical fiber, and the light intensity detection device is used to detect the light intensity at the outlet of the reflection optical fiber. The analysis device will output a light intensity adjustment signal to the light intensity control device according to the light intensity to control the light intensity control device to adjust the light intensity of the test light source, so as to realize the detection of the chip under test with different light intensities and achieve a more accurate test effect.

[0009] In a possible implementation manner, the device further includes a light intensity detection device and a light intensity control device; The light intensity detection device faces the test light source and outputs a light intensity signal, and the light intensity signal represents the light intensity of the test light source; The analysis device is respectively connected to the light intensity detection device and the light intensity control device, and is used to receive the light intensity signal and output the light intensity adjustment signal; The light intensity control device is connected to the test light source and is used to receive the light intensity adjustment signal and adjust the light intensity of the test light source.

[0010] As can be seen from the above technical solution, by using the light intensity detection device to detect the light intensity of the test light source, the analysis device will output a light intensity adjustment signal to the light intensity control device according to the light intensity to control the light intensity control device to adjust the light intensity of the test light source, so as to realize the detection of the chip under test with different light intensities and achieve a more accurate test effect.

[0011] In a possible implementation manner, the device further includes an angle adjustment mechanism, and the angle adjustment mechanism is used to adjust the angle of the incident optical fiber and / or the reflection optical fiber to change the relative position of the incident optical fiber and / or the reflection optical fiber and the chip under test.

[0012] As can be seen from the above technical solution, by adjusting the position of the incident optical fiber through the angle adjustment mechanism, the position of the light spot on the chip under test changes; by adjusting the position of the reflection optical fiber through the angle adjustment mechanism, the incident port of the reflection optical fiber is aligned with the reflected light of the light spot on the chip under test, thereby improving the accuracy of the light intensity obtained through the reflection optical fiber.

[0013] In a possible implementation, the angle adjustment mechanism includes a support column, an adjustment component, and a fixing member. Both the support column and the fixing member are fixedly connected to the adjustment component, and the relative positions of the support column and the fixing member are changed through the adjustment component; The fixing member is a cylinder with openings at both ends. The opening area at the lower end of the cylinder is less than or equal to the opening area at the upper end of the cylinder. The incident optical fiber and / or the reflected optical fiber penetrate through the cylinder and fit with the opening at the upper end of the cylinder.

[0014] In a possible implementation, the adjustment component includes a fixing rod, a rotating rod, and a rotating connecting member. One end of the fixing rod is provided with a first connection hole, and the other end of the fixing rod is fixedly connected to the support column. One end of the rotating rod is provided with a second connection hole, and the other end of the rotating rod is fixedly connected to the fixing member. The rotating connecting member passes through the first connection hole and the second connection hole, and the rotating connecting member is fixedly connected to the rotating rod.

[0015] In a possible implementation, the device further includes a light source alignment mechanism, which is used to align the test light source and the end of the incident optical fiber away from the chip under test.

[0016] In the second aspect of the present application, a chip detection method is provided. The method includes: The analysis device obtains the working state of the chip under test and the actual output signal of the chip under test; Compare the difference between the theoretical output signal corresponding to the working state and the actual output signal to obtain the test result.

[0017] In a possible implementation, the chip under test includes multiple chip modules, and there is a corresponding relationship between the actual output signal and the chip module; Comparing the difference between the theoretical output signal corresponding to the working state and the actual output signal to obtain the test result includes: Compare the theoretical output signal and the actual output signal of the working state to obtain the relative position of the signal difference and the actual output signal; Use the chip module corresponding to the relative position as the abnormal module to obtain the test result.

[0018] In a possible implementation, adjust the excitation signal applied to the chip under test, and the excitation signal is used to make the chip under test in a working state; When the output signal output by the chip under test is the same as the preset signal, determine the adjustment scheme of the chip under test according to the excitation signal.

[0019] In summary, the present application includes at least one beneficial technical effect: The light generated by the test light source is made to form a light spot on the chip under test through the incident optical fiber, irradiating all or part of the devices on the chip under test, and then an analysis device is used to obtain the actual output signal of the chip under test in the working state, and the actual output signal is analyzed to determine whether the actual output result of the chip under test is affected by the irradiation, obtaining the test result, realizing the detection of the performance of the chip under test, that is, achieving the effect of judging whether the chip can maintain stable performance under the illumination condition. Description of the Drawings

[0020] Figure 1 It is a structural block diagram of the chip detection device provided by an embodiment of the present application.

[0021] Figure 2 It is a schematic structural diagram of the chip detection device provided by an embodiment of the present application.

[0022] Figure 3 It is a schematic structural diagram of the chip detection device provided by an embodiment of the present application.

[0023] Figure 4 It is a schematic structural diagram of the chip detection device provided by an embodiment of the present application.

[0024] Figure 5 It is a schematic flowchart of the chip detection method provided by an embodiment of the present application.

[0025] Figure 6 It is a schematic diagram of the chip under test provided by an embodiment of the present application.

[0026] In the figure, 1. Chip under test; 11. Light spot; 2. Incident optical fiber; 3. Reflection optical fiber; 4. Angle adjustment mechanism; 41. Support column; 42. Adjustment component; 43. Fixing piece; 44. Fixing rod; 45. Rotating rod; 46. Rotating connecting piece; 5. Test light source; 6. Analysis device; 7. Light intensity detection device; 8. Light intensity control device; 9. Light source alignment mechanism; 91. Light source support column; 92. Optical fiber support plate; 93. Toothed pressing plate; 94. Adjusting gear; 95. Adjusting knob; 10. Driving base. Detailed Embodiments

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0028] In addition, the term "and / or" in this text is merely a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this text generally represents an "or" relationship between the associated objects before and after, unless otherwise specified.

[0029] Semiconductors are the basic materials required for manufacturing chips and integrated circuits. A chip is a carrier made of semiconductor materials, on which multiple electronic components are integrated. These components can be transistors, resistors, capacitors, etc., and are used to perform various circuit functions.

[0030] Since a chip is made of semiconductor materials, the optical injection effect of the semiconductor materials will have more or less impact on the chip. The application of optical injection is very extensive. For example, in optoelectronic devices, optical injection can be used to manufacture optoelectronic devices such as photodiodes, phototransistors, and photodetectors. In the research of semiconductor materials, optical injection can be used to study physical properties such as the energy band structure and carrier concentration of semiconductor materials. In addition, optical injection can also be used to manufacture optoelectronic devices such as solar cells and lasers.

[0031] In the design process of most chips, the influence degree of environmental factors such as light irradiation on the chip is minimized. However, there is still no way to avoid that some of the finally obtained chips or some modules in the chips will be somewhat sensitive to light irradiation. Therefore, after the chip design is completed, during the chip testing process, light irradiation conditions are added to detect the influence degree of light irradiation on the chip, and then find out the weak points or design errors in the chip design process. How to judge whether the chip can maintain stable performance under light irradiation conditions is a problem that needs to be solved currently.

[0032] The embodiments of the present application will be further described in detail below with reference to the accompanying drawings of the specification.

[0033] The embodiments of the present application provide a chip detection device. Referring to Figure 1 and Figure 2 , the chip detection device includes a test light source 5, an incident optical fiber 2, and an analysis device 6; the above test light source 5 irradiates on the chip under test 1 through the above incident optical fiber 2 and forms a light spot 11 on the above chip under test 1, and the above chip under test 1 is in a working state; the above analysis device 6 is connected to the above chip under test 1 and is used to receive and analyze the actual output signal of the above chip under test 1 to obtain a test result. In the embodiment provided by the present application, the above test light source 5 is a laser light source. In other embodiments, other light sources such as LED light sources can also be used, and the type of the test light source 5 is not limited herein.

[0034] Since the size of the chip is relatively small, it is difficult to limit the illumination area of the light on the chip. Therefore, in the embodiments of the present application, the incident optical fiber 2 is used to control the illumination area of the test light source 5 on the chip, and then the analysis device 6 is used to analyze the actual output signal of the chip under test 1 to obtain the test result of the chip under test 1.

[0035] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working process of the described analysis device 6 can refer to the corresponding process in the embodiments of the chip detection method described later, and will not be elaborated here.

[0036] To detect and control the light intensity of the light spot 11 irradiated on the chip under test 1, the chip detection device further includes a reflection optical fiber 3, a light intensity detection device 7, and a light intensity control device 8. The above reflection optical fiber 3 is used to reflect the light spot 11 on the chip under test 1. The above light intensity detection device 7 faces the above test light source 5 or the above reflection optical fiber 3 and outputs a light intensity signal, and the above light intensity signal represents the light intensity of the above test light source 5 or the light intensity reflected by the above reflection optical fiber 3. The above analysis device 6 is respectively connected to the above light intensity detection device 7 and the above light intensity control device 8, and is used to receive the above light intensity signal and output a light intensity adjustment signal; the above light intensity control device 8 is connected to the above test light source 5 and is used to receive the above light intensity adjustment signal and adjust the light intensity of the above test light source 5.

[0037] The control of the above light intensity control device 8 over the test light source 5 can be achieved through a wireless communication module, for example, a Bluetooth module, a wifi module, etc. The control of the above light intensity control device 8 over the test light source 5 can also be achieved through a wired communication method, for example, using an internet call center (ICC), a serial peripheral interface (SPI), a serial interface, a controller area network (CAN), etc. The control of the above light intensity control device 8 over the test light source 5 can also be achieved through a wired button method.

[0038] In the embodiments provided in the embodiments of the present application, the light intensity detection device 7 is a light intensity meter, and in other embodiments, other devices capable of detecting light intensity can also be used, which is not limited here.

[0039] In a specific example, the above light intensity detection device 7 is used to detect the light intensity of the test light source 5, output a light intensity signal, the analysis device 6 receives the above light intensity signal, and determines and outputs a corresponding light intensity adjustment signal according to a preset light intensity adjustment rule. The light intensity control device 8 receives the above light intensity adjustment signal and adjusts the light intensity of the test light source 5. For example, the above light intensity control device 8 can be a signal generator, which controls the brightness change of the LED light source by emitting a pulse width modulation signal. In other embodiments, other devices can also be used to control the brightness of the test light source 5, which is not limited herein.

[0040] It should be understood that there is transmission loss in the optical fiber. After the optical signal propagates through the optical fiber, part of the optical energy will be attenuated. When light enters from one end of the optical fiber and exits from the other end, the intensity of the light will decrease. Therefore, there is a difference between the light intensity of the test light source 5 detected by the light intensity detection device 7 and the light intensity of the light spot 11 on the chip under test 1. It is not accurate to adjust the light intensity on the chip under test 1 by adjusting the light intensity of the test light source 5. So in another specific example, the above light intensity detection device 7 is used to detect the light intensity reflected from the light spot 11 of the chip under test 1 by the reflection optical fiber 3, output a light intensity signal, the analysis device 6 receives the above light intensity signal, and determines and outputs a corresponding light intensity adjustment signal according to a preset light intensity adjustment rule. The light intensity control device 8 receives the above light intensity adjustment signal and adjusts the light intensity of the test light source 5.

[0041] According to the transmission loss of the optical fiber, it can be known that the detected light intensity of the test light source 5 is higher than the light intensity of the light spot 11 on the chip under test 1, and the detected light intensity reflected by the reflection optical fiber 3 is lower than the light intensity of the light spot 11 on the chip under test 1. Therefore, in other embodiments, the light intensity of the test light source 5 and the light intensity reflected by the reflection optical fiber 3 can be detected simultaneously, and the light intensity of the light spot 11 on the chip under test 1 can be obtained according to the two light intensities. For example, the average value of the two light intensities can be obtained to get a relatively accurate light intensity of the light spot 11 on the chip under test 1. For another example, according to the length ratio or transmission loss ratio of the incident optical fiber 2 and the reflection optical fiber 3, the corresponding light intensity ratios of the test light source 5 and the reflection optical fiber 3 are determined respectively. After multiplying the light intensity by the corresponding light intensity ratio and then adding the obtained products, a more accurate light intensity of the light spot 11 on the chip under test 1 can be obtained.

[0042] The sizes of the above incident optical fiber 2 and reflection optical fiber 3 are specifically determined according to the size of the chip under test 1, which is not limited herein. The output ends of the above incident optical fiber 2 and reflection optical fiber 3 can be adjusted to other shapes such as a circular cross-section perpendicular to the optical fiber axis, an elliptical cross-section at a certain angle to the optical fiber axis, a spherical or ellipsoidal surface tangent to the side surface of the cylindrical structure of the optical fiber according to requirements.

[0043] In order to enable the light spot 11 emitted by the incident optical fiber 2 to move to any position on the chip 1 to be measured, the above device further includes an angle adjustment mechanism 4, and the angle adjustment mechanism 4 is used to adjust the angle of the incident optical fiber 2 and / or the reflection optical fiber 3 so as to change the position of the light spot 11 on the chip 1 to be measured.

[0044] Referring to Figure 2 , in a specific example, when only the incident optical fiber 2 is used in the chip detection device, the angle adjustment mechanism 4 is used to adjust the angle of the incident optical fiber 2. The angle adjustment mechanism 4 includes a support column 41, an adjustment component 42 and a fixing member 43. Both the support column 41 and the fixing member 43 are fixedly connected to the adjustment component 42, and the relative positions of the support column 41 and the fixing member 43 are changed through the adjustment component 42. The adjustment component 42 includes a fixing rod 44, a rotating rod 45 and a rotating connecting member 46. A first connection hole is opened at one end of the fixing rod 44, and the other end of the fixing rod 44 is fixedly connected to the support column 41. A second connection hole is opened at one end of the rotating rod 45, and the other end of the rotating rod 45 is fixedly connected to the fixing member 43. The rotating connecting member 46 passes through the first connection hole and the second connection hole, and the rotating connecting member 46 is fixedly connected to the rotating rod 45. The fixing member 43 is a cylinder with openings at both ends, and the opening area at the lower end of the cylinder is less than or equal to the opening area at the upper end of the cylinder. The incident optical fiber 2 passes through the cylinder and fits with the opening at the upper end of the cylinder.

[0045] Referring to Figure 3 , in another specific example, when both the incident optical fiber 2 and the reflection optical fiber 3 are used in the chip detection device, the angle adjustment mechanism 4 is used to adjust the angles of the incident optical fiber 2 and the reflection optical fiber 3. The structure of the angle adjustment mechanism 4 is the same as that in the above specific example. The difference is that the incident optical fiber 2 and the reflection optical fiber 3 are placed in parallel and jointly pass through the cylinder and fit with the opening at the upper end of the cylinder. Referring to Figure 4 , in other embodiments, two angle adjustment mechanisms 4 can also be provided to respectively adjust the incident optical fiber 2 and the reflection optical fiber 3.

[0046] In the embodiment provided by the present application, the lower opening of the fixing member 43 is close to the chip 1 to be measured, and the upper opening of the fixing member 43 is far from the chip 1 to be measured.

[0047] When using the above-mentioned angle adjustment mechanism 4, the above-mentioned rotary connector 46 can be manually rotated. The rotary connector 46 will drive the rotary rod 45 to move, and the position of the fixing member 43 on the rotary rod 45 will also change. The incident optical fiber 2 and / or the reflection optical fiber 3 placed on the fixing member 43 will also move, and the purpose of moving the position of the light spot 11 on the chip 1 to be measured can be achieved. Similarly, a driving motor can also be provided on the rotary connector 46, and the output shaft of the driving motor is fixedly connected to the above-mentioned rotary connector 46, and the rotation of the rotary connector 46 is realized by controlling the start of the driving motor.

[0048] During the process of chip detection, the outgoing port of the incident optical fiber 2 faces the side of the chip 1 to be measured where there are active devices. The included angle range between the straight line where the light emitted from the above-mentioned outgoing port is located and the plane where the chip 1 to be measured is located is within (0°, 90°]. When the light emitted from the incident optical fiber 2 is reflected by the surface of the chip 1 to be measured, a reflection optical fiber 3 is provided at the position of the reflected light to receive the reflected light, and the brightness of the reflected light can reflect the illumination degree of the light spot 11 area of the chip 1 to be measured.

[0049] It can be understood that when the above-mentioned angle is 90°, the incident optical fiber 2 vertically irradiates the chip 1 to be measured with light, and the reflected light will be emitted vertically. At this time, both the outgoing port of the incident optical fiber 2 and the incoming port of the reflection optical fiber 3 are perpendicular to the chip 1 to be measured. Therefore, in this case, the incident optical fiber 2 and the reflection optical fiber 3 are arranged on the same fixing member 43, and the incident optical fiber 2 and the reflection optical fiber 3 are coplanar at the position close to the area to be measured of the chip 1 to be measured, and their normal lines are perpendicular to the chip 1 to be measured. The incident optical fiber 2 and the reflection optical fiber 3 can also be arranged on two mutually independent angle adjustment mechanisms 4. In a specific example, the light intensity detection device 7 is a photodetector. A photodetector is provided at the outgoing port of the reflection optical fiber 3 to obtain the light intensity of the reflected light and convert the light intensity into an electrical signal, that is, output a light intensity signal.

[0050] In order to facilitate the detection personnel to observe the light intensity of the light spot 11 on the chip 1 to be measured, the above-mentioned device further includes a light intensity display device for displaying the above-mentioned light intensity signal. In a specific example, the light intensity display device is a digital display. The electrical signal generated by the photodetector is converted into a digital signal through an analog-to-digital converter, and then the digital signal is displayed on the digital display, so that the light intensity of the light spot 11 on the chip 1 to be measured can be viewed through the digital display. In other embodiments, other devices such as an oscilloscope can also be used to realize the display of the light intensity signal, which is not limited herein.

[0051] To ensure that the chip 1 under test is in a working state, the above device further includes a driving base 10. The chip 1 under test is placed on the driving base 10, and related devices such as chip probes are arranged on the driving base 10. The driving base 10 can provide the voltage and current necessary for the operation of the chip 1 under test and the signals required for the operation of the chip 1 under test.

[0052] The above device further includes a light source alignment mechanism 9. The light source alignment mechanism 9 is used to align the test light source 5 and the end of the incident optical fiber 2 away from the chip 1 under test. The light source alignment mechanism 9 includes a light source support column 9141, an optical fiber support plate 92, a toothed pressing plate 93, an adjusting gear 94, and an adjusting knob 95. The light source support column 9141 is fixedly connected to the test light source 5 and is used to support the test light source 5. The optical fiber support plate 92 is provided with a sliding groove, the toothed pressing plate 93 is slidably connected to the light ray support plate through the sliding groove, the adjusting gear 94 meshes with the toothed pressing plate 93, the adjusting gear 94 is fixedly connected to the adjusting knob 95 through a fixed shaft, the fixed shaft passes through the toothed pressing plate 93, one end is fixedly connected to the adjusting gear 94, and one end is fixedly connected to the adjusting knob 95 located on the other side of the toothed pressing plate 93.

[0053] When it is necessary to adjust the relative positions of the test light source 5 and the incident optical fiber 2, by rotating the adjusting knob 95 to drive the adjusting gear 94 to rotate, the adjusting gear 94 meshes with the toothed pressing plate 93, thereby realizing the up and down movement of the toothed pressing plate 93 along the direction of the sliding groove. Since the incident optical fiber 2 passes through the toothed pressing plate 93, the movement of the toothed pressing plate 93 will drive the incident optical fiber 2 to move, and finally the positions of the test light source 5 and the incident optical fiber 2 are adjusted.

[0054] An embodiment of the present application provides a chip detection method, and the main process of the above method is described as follows. [[ID=IO]]

[0055] As Figure 5 shown: Step S101: The analysis device 6 obtains the working state of the chip 1 under test and the actual output signal of the chip 1 under test.

[0056] It can be understood that the overall architecture of the chip 1 under test is composed of several chip modules combined in series, in parallel, or in a combination of series and parallel. There are relationships of signal generation and signal reception between the chip modules. After a chip module is abnormal, an abnormal signal is generated or no signal is generated, which will also cause an abnormality in the next-level chip module. Therefore, there is a corresponding relationship between the above actual output signals. Similarly, on the premise of knowing the working state of the chip 1 under test, the theoretical output signal in this working state can be obtained.

[0057] Step S102: Compare the differences between the theoretical output signal and the actual output signal in the working state to obtain the test result.

[0058] Specifically, compare the theoretical output signal corresponding to the working state with the actual output signal to obtain the relative position of the signal difference with respect to the above-mentioned actual output signal; use the chip module corresponding to the above relative position as the abnormal module to obtain the test result.

[0059] For analog circuits, signals can be compared from multiple aspects such as phase, amplitude, and bandwidth. For digital circuits, signal differences can be described in terms of clock jitter, delay time, etc.

[0060] The specific detection process is as follows: First, power on the chip under test 1 to make it in the working state. Then, adjust the position of the exit port of the incident optical fiber 2 by adjusting the rotating connector 46 so that a light spot 11 with a size comparable to the suspicious area on the chip under test 1 is obtained. The above-mentioned suspicious area is determined by the tester based on experience or analysis. Subsequently, gradually adjust the illumination intensity of the test light source 5 and observe and analyze the change in the actual output signal of the chip under test 1. If the difference between the actual output signal and the theoretical output signal is obvious, it indicates that the suspicious area is sensitive to light, and the test result is obtained. The tester will analyze according to the circuit principle of the suspicious area to determine whether the suspicious area needs to have the characteristic of being sensitive to light. If not, it indicates that there is a problem with the circuit design of the suspicious area. If so, it indicates that the circuit design of the suspicious area is problem-free.

[0061] According to the above process, traverse all suspicious areas to obtain the test results corresponding to the suspicious areas.

[0062] Refer to Figure 6 , in a specific example, the light spot 11 of the optical fiber emitted from the exit port of the incident optical fiber 2 on the chip under test 1 is elliptical or circular. By adjusting the rotating connector 46, the incident angle of the incident optical fiber 2 can be controlled, thereby realizing the control of the major axis length of the elliptical light spot 11, so that the major axis of the elliptical light spot 11 can cover the effective circuit area of the chip; then move the position of the light spot 11 to scan the area that may have problems. When a suspicious area is found, adjust the incident angle of the incident optical fiber 2 again to shrink the light spot 11 and scan within the range of the above elliptical light spot 11 to determine the specific suspicious area. After determining the suspicious area, use the light intensity control device 8 to control the illumination intensity of the test light source 5, and then observe the voltage-current characteristics of the chip under test 1. Also, check the step response, amplitude response, frequency response, etc. of the circuit corresponding to the suspicious area to obtain the test result of the suspicious area.

[0063] In another specific example, according to the circuit principle of the chip under test 1, the chip modules that may have problems are determined, and the light spot 11 is irradiated on the corresponding positions of the above chip modules. Then, the corresponding excitation is applied to the above chip modules, and it is observed whether the actual output signal and the theoretical output signal of the chip under test 1 are consistent to obtain the test result.

[0064] In other embodiments, different light output effects can also be achieved by changing the cross-sectional shape of the outlet of the incident optical fiber 2, for example, circular cross-section, elliptical cross-section, hemispherical surface, etc. When a circular cross-section is used, a circular light spot 11 or an elliptical light spot 11 will be formed on the chip under test 1; when an elliptical cross-section is used, an elliptical light spot 11 will be formed on the chip under test 1, and the major axis of the elliptical light spot 11 corresponding to the elliptical cross-section is longer than that of the elliptical light spot 11 corresponding to the circular cross-section; when a hemispherical surface is used, the incident optical fiber 2 will generate divergent light, and a larger irradiation area can be formed on the chip under test 1.

[0065] To determine the adjustment scheme when the chip under test is abnormal, the above method further includes: Adjust the excitation signal applied to the chip under test 1, and the excitation signal is used to make the chip under test 1 in a working state; when the output signal output by the chip under test 1 is the same as the preset signal, determine the adjustment scheme of the chip under test 1 according to the excitation signal.

[0066] In one embodiment, the above device can also be used to enhance the signal strength. By increasing the light illumination on the chip under test 1 or the chip module, the input signal strength of the chip under test 1 or the chip module is enhanced. For example, a certain chip module requires an input signal of 10 intensity, but an input signal of 12 intensity is actually required to generate the corresponding output signal. At this time, it is necessary to increase the light illumination on this chip module to increase the input of the 10 intensity signal to the input of the 12 intensity signal. The same is true for reverse suppression. For example, an operational amplifier has a positive input and a negative input. It is possible to select the positive input device or the negative input device of the operational amplifier for irradiation to apply a positive or negative excitation to the subsequent circuit. The adjustment of the excitation signal is achieved by adjusting the light intensity and the light area irradiated on the chip under test. In this way, when the output signal of the chip under test is the same as the preset signal, it means that the chip under test is in a normal state at this time. According to the light intensity and the light area irradiated on the chip under test, the chip under test is adjusted to a chip that can achieve such a signal strength in a normal environment, and the adjustment scheme of the chip under test is determined.

[0067] In other embodiments, other methods can also be used to achieve the adjustment of the excitation signal, which is not limited here.

[0068] For digital circuits, the key to digital circuits is analog input devices. Taking a comparator as an example, an analog comparator inputs two analog quantities A and B to be compared. When A is greater than B, a high-level signal, i.e., logic 1, is output; otherwise, a low-level signal, i.e., logic 0, is output. The output of the comparator can be affected by applying a square-wave excitation signal to the input device of the comparator.

[0069] The embodiment of the present application provides a chip detection device. By irradiating light on the chip module or the input / output devices of the chip module, the purpose of changing the output signal or input signal of the chip module is achieved, that is, making a normal chip module output an abnormal signal, or making an abnormal chip module output a normal signal. Making a normal chip module output an abnormal signal can be used to judge the suppression effect of the next-level module on abnormal signals. Making an abnormal chip module output a normal signal can be used to realize the adjustment of the abnormal module.

[0070] The above description is only the preferred embodiment of the present application and the explanation of the technical principles applied. Those skilled in the art should understand that the scope of the application involved in the present application is not limited to the technical solution formed by the specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the foregoing application concept. For example, the technical solutions formed by mutually replacing the above features with the technical features (but not limited to) having similar functions applied in the present application.

Claims

1. A chip detection device, characterized in that, It includes a test light source (5), an incident optical fiber (2), and an analysis device (6); The test light source (5) irradiates the chip under test (1) through the incident optical fiber (2) and forms a light spot (11) on the chip under test (1), and the chip under test (1) is in a working state; The analysis device (6) is connected to the chip under test (1) and is used to receive and analyze the actual output signal of the chip under test (1) to obtain a test result.

2. The chip detection device according to claim 1, characterized in that, The device further includes a reflection optical fiber (3), a light intensity detection device (7), and a light intensity control device (8); The reflection optical fiber (3) is used to reflect the light spot (11) on the chip under test (1); The light intensity detection device (7) faces the test light source (5) or the reflection optical fiber (3) and outputs a light intensity signal, and the light intensity signal represents the light intensity of the test light source (5) and / or the light intensity reflected by the reflection optical fiber (3); The analysis device (6) is respectively connected to the light intensity detection device (7) and the light intensity control device (8), and is used to receive the light intensity signal and output a light intensity adjustment signal; The light intensity control device (8) is connected to the test light source (5) and is used to receive the light intensity adjustment signal and adjust the light intensity of the test light source (5).

3. The chip detection device according to claim 1, characterized in that, The device further includes a light intensity detection device (7) and a light intensity control device (8); The light intensity detection device (7) faces the test light source (5) and outputs a light intensity signal, and the light intensity signal represents the light intensity of the test light source (5); The analysis device (6) is respectively connected to the light intensity detection device (7) and the light intensity control device (8), and is used to receive the light intensity signal and output a light intensity adjustment signal; The light intensity control device (8) is connected to the test light source (5) and is used to receive the light intensity adjustment signal and adjust the light intensity of the test light source (5).

4. The chip detection device according to claim 1 or 2, characterized in that, The device further includes an angle adjustment mechanism (4), and the angle adjustment mechanism (4) is used to adjust the angle of the incident optical fiber (2) and / or the reflection optical fiber (3) to change the relative position between the incident optical fiber (2) and / or the reflection optical fiber (3) and the chip under test (1).

5. The chip detection device according to claim 4, wherein, The angle adjustment mechanism (4) includes a support column (41), an adjustment component (42), and a fixing member (43). The support column (41) and the fixing member (43) are both fixedly connected to the adjustment component (42), and the relative position between the support column (41) and the fixing member (43) is changed through the adjustment component (42); The fixing member (43) is a cylinder with openings at both ends, and the opening area at the lower end of the cylinder is less than or equal to the opening area at the upper end of the cylinder. The incident optical fiber (2) and / or the reflection optical fiber (3) passes through the cylinder and fits with the opening at the upper end of the cylinder.

6. The chip detection device according to claim 5, wherein, The adjustment assembly (42) includes a fixed rod (44), a rotating rod (45) and a rotating connector (46). One end of the fixed rod (44) is provided with a first connection hole, and the other end of the fixed rod (44) is fixedly connected to the support column (41). One end of the rotating rod (45) is provided with a second connection hole, and the other end of the rotating rod (45) is fixedly connected to the fixing member (43). The rotating connector (46) passes through the first connection hole and the second connection hole, and the rotating connector (46) is fixedly connected to the rotating rod (45).

7. The chip detection device according to claim 1, wherein The device further includes a light source alignment mechanism (9) for aligning the test light source (5) and the end of the incident optical fiber (2) away from the chip under test (1).

8. A chip detection method, characterized in that, Applied to the chip detection device according to any one of claims 1-7, comprising: The analysis device (6) obtains the working state of the chip under test (1) and the actual output signal of the chip under test (1). Compare the difference between the theoretical output signal corresponding to the working state and the actual output signal to obtain a test result.

9. The chip detection method according to claim 8, wherein The chip under test (1) includes a plurality of chip modules, and there is a corresponding relationship between the actual output signal and the chip modules. The comparing the difference between the theoretical output signal corresponding to the working state and the actual output signal to obtain a test result includes: Comparing the theoretical output signal of the working state with the actual output signal to obtain the relative position of the signal difference and the actual output signal. Taking the chip module corresponding to the relative position as an abnormal module to obtain a test result.

10. The chip detection method according to claim 8, characterized in that, The method further includes: Adjusting the excitation signal applied to the chip under test (1), and the excitation signal is used to make the chip under test (1) in a working state. When the output signal output by the chip under test (1) is the same as the preset signal, determining an adjustment scheme for the chip under test (1) according to the excitation signal.

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