Liquid cooling case with internal and external double circulation systems
Through the liquid-cooled chassis of the internal and external dual circulation system, the cooling medium is circulated and converted into the upper and lower spaces of the chassis, solving the problem of weakening cooling efficiency caused by the increase in the temperature of the cooling medium and achieving a more efficient cooling effect.
Patent Information
- Application Number
- CN202510495146.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-18
- Publication Date
- 2025-08-01
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The cooling medium in the existing liquid-cooled chassis is distributed in the same space, resulting in rapid heat transfer, the cooling efficiency weakens with the increase of temperature, and the overall cooling effect becomes worse.
The internal and external dual circulation system is adopted, and the chassis space is divided into two upper and lower layers through the internal circulation device and the external circulation device. The cooling medium is circulated and converted into the two spaces. The external circulation components are used to replace the high-temperature medium and inject it into the low-temperature medium to improve the cooling effect.
Effectively reduce the temperature of the cooling medium inside the chassis, improve the cooling effect on the motherboard and other parts, and enhance the overall cooling efficiency.
Smart Images

Figure CN120406687A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of liquid-cooled computer cases, and particularly to a liquid-cooled computer case with an internal and external double-circulation system. Background Art
[0002] A liquid-cooled computer case is a device that achieves efficient heat dissipation by means of liquid circulation. It is widely used in the field of electronic devices, especially suitable for high-heat-generating computers, servers, and industrial control devices, etc. It mainly consists of a circulation system, a radiator, a control system, and a computer case body. The liquid-cooled computer case has significant advantages. Compared with traditional air cooling, its heat dissipation efficiency is greatly improved, and it can effectively meet the heat dissipation requirements of high-power density devices, such as high-performance gaming computers and data center servers, and can prevent performance degradation and failures caused by overheating.
[0003] When the liquid-cooled computer case is applied as the key main structure of devices such as servers and computers, its cooling principle mainly relies on the coordinated operation of the cooling medium injected inside, heat dissipation fins, and fans to achieve the heat exchange process of the cooling medium. Under normal operating conditions, the cooling medium in the liquid-cooled computer case is usually in a relatively unified space environment without effective partitioning; when various structures in the computer case, such as the motherboard, CPU of the server, and components such as the graphics card and hard disk of the computer, generate heat during operation, since the cooling medium is distributed in the same space, these heats will quickly and without difference be transferred to all the cooling medium. When the internal structure of the computer case operates at a high load for a long time, heat is continuously released and incorporated into the cooling medium, and the temperature of the cooling medium will gradually rise accordingly; and the cooling efficiency of the cooling medium is closely related to its own temperature. As the temperature rises, the temperature difference between it and the heat-generating components gradually decreases. According to the heat transfer principle, the ability of the cooling medium to absorb heat weakens, thereby resulting in a deterioration of the overall cooling effect. For this reason, we propose a liquid-cooled computer case with an internal and external double-circulation system. Summary of the Invention
[0004] (1) Technical Problems to be Solved
[0005] Aiming at the deficiencies of the prior art, the present invention provides a liquid-cooled computer case with an internal and external double-circulation system, which solves the problem that the cooling medium in the existing liquid-cooled computer case is usually in a relatively unified space environment without effective partitioning. When components such as the motherboard, CPU, graphics card, and hard disk of the computer generate heat during operation, since the cooling medium is distributed in the same space, these heats will quickly and without difference be transferred to all the cooling medium. When the internal structure of the computer case operates at a high load for a long time, heat is continuously released and incorporated into the cooling medium, and the temperature of the cooling medium will gradually rise accordingly; and the cooling efficiency of the cooling medium is closely related to its own temperature. As the temperature rises, the temperature difference between it and the heat-generating components gradually decreases. According to the heat transfer principle, the ability of the cooling medium to absorb heat weakens, thereby resulting in a deterioration of the overall cooling effect.
[0006] (2) Technical solution
[0007] To achieve the above object, the present invention is realized by the following technical solutions: A liquid-cooled chassis with an internal and external double-loop system, including a base, on the upper surface of the base is fixedly connected a frame, on the inner wall of the frame is fixedly connected a glass plate, on the upper surface of the frame is installed a cover plate, on the inner wall of the cover plate is installed a control panel, and inside the frame is provided an internal circulation device;
[0008] The internal circulation device includes a cooling component composed of a partition plate, a liquid sprayer, a first pump, a connector, a heat dissipation rack, a second pump, a guiding pipe, and a heat dissipation fan;
[0009] The internal circulation device includes a pressure regulating component composed of an adsorption iron ring, a support leg, a magnet, a load-bearing plate, and a conical column;
[0010] The internal circulation device further includes a temperature sensor;
[0011] On the rear surface of the frame is provided an external circulation device composed of a first external water tank, a connecting pipe, a solenoid valve I, a second external water tank, a third pump, a solenoid valve II, and a solenoid valve III.
[0012] Preferably, the cooling component includes a partition plate, which is fixedly connected to the inner wall of the frame, on the lower surface of the partition plate is fixedly connected a liquid sprayer, on the upper surface of the base is fixedly connected a first pump, the output end of the first pump is fixedly connected to a connector, the connector is fixedly connected to the input end of the liquid sprayer, on the rear inner wall of the frame is fixedly connected a heat dissipation rack, inside the right glass plate is installed a second pump, the output end of the second pump is fixedly connected to a guiding pipe, the guiding pipe is fixedly connected to the inner wall of the heat dissipation rack, and inside the guiding pipe is fixedly connected a spline heat conduction fin;
[0013] On the rear surface of the frame is fixedly connected a protective cover, the protective cover is sleeved outside the heat dissipation rack, on the rear surface of the protective cover is fixedly connected a heat dissipation fan, on the air inlet end of the heat dissipation fan is installed a filter screen, on the lower surface of the partition plate is fixedly connected a support column, the support column is fixedly connected to the upper surface of the base, and the use of the spline heat conduction fin can increase the heat exchange efficiency between the cooling medium flowing through the guiding pipe and the guiding pipe, and at the same time can increase the residence time of the cooling medium in the guiding pipe to enhance the heat exchange effect between the guiding pipe and the cooling medium.
[0014] Preferably, the pressure regulating component includes an adsorption iron ring. An installation cavity is formed on the inner wall of the liquid sprayer. The adsorption iron ring is fixedly connected to the inner wall of the installation cavity. A support foot is slidably connected to the inner wall of the installation cavity of the liquid sprayer. A magnetic block is fixedly connected to the lower surface of the support foot. The magnetic block is magnetically attracted to the upper surface of the adsorption iron ring. A load-bearing plate is fixedly connected to the inner side of the support foot. A conical column is fixedly connected to the upper surface of the load-bearing plate. The conical column is located inside the liquid outlet of the liquid sprayer. With the cooperation of the magnetic block and the adsorption iron ring, the position of the load-bearing plate can be restricted when the load-bearing plate is not impacted by a cooling medium greater than the magnetic force.
[0015] Preferably, the temperature sensor is fixedly connected to the side surface of the second pump. The temperature sensor is electrically connected to the control panel. The temperature sensor can be used to sense the temperature of the cooling medium above the partition, so as to cooperate with the control panel to automatically control the electrical equipment connected to the control panel.
[0016] Preferably, the external circulation device includes a first external water tank. The first external water tank is fixedly connected to the rear surface of the frame. A first solenoid valve is fixedly connected to the input end of the first external water tank. The input end of the first solenoid valve is fixedly connected to a connecting pipe. A second external water tank is fixedly connected to the rear surface of the frame. A third pump is fixedly connected to the rear surface of the second external water tank. The first external water tank can store the cooling medium in the storage area formed by the base, the frame, the glass plate and the cover plate, so that the heat-exchanged cooling medium can be sent out of the chassis.
[0017] Preferably, a second solenoid valve is fixedly connected to the rear surface of the second external water tank. The output end of the second solenoid valve is fixedly connected to the input end of the third pump. A first conduit is fixedly connected inside the left interface of the second solenoid valve. The first conduit is fixedly connected to the surface of the first external water tank. A second conduit is fixedly connected inside the right interface of the second solenoid valve. The second conduit is fixedly connected to the surface of the second external water tank. The first conduit is communicated with the inside of the first external water tank. The second conduit is communicated with the inside of the second external water pipe. The second solenoid valve can be used to control the third pump to extract the cooling medium in the first external water tank or the second external water tank under the control of the control panel, so that the cooling medium in the first external water tank can be sent into the second external water tank, and at the same time, the cooling medium in the second external water tank can be sent back into the chassis.
[0018] Preferably, a third solenoid valve is fixedly connected to the rear surface of the second outer water tank. The input end of the third solenoid valve is fixedly connected to the output end of the third pump. A water inlet pipe is fixedly connected to the left interface of the third solenoid valve. The water inlet pipe is fixedly connected to the upper surface of the cover plate. A water outlet pipe is fixedly connected to the right interface of the solenoid valve. An installation hole is formed in the upper surface of the cover plate. The water outlet pipe is fixedly connected to the inner wall of the installation hole. The water inlet pipe is communicated with the inside of the second outer water tank. The water outlet pipe penetrates through the lower surface of the cover plate. The water outlet pipe can be used to connect the third solenoid valve and the chassis, so that the third pump can pump the cooling medium in the second outer water tank into the chassis to reduce the temperature of the cooling medium in the upper layer of the chassis.
[0019] Preferably, a through hole is formed in the upper surface of the partition plate. The nozzle of the sprayer is located inside the through hole. The first pump is communicated with the inside of the connector. The first pump is electrically connected to the control panel. The connector is communicated with the inside of the sprayer. The second pump is electrically connected to the control panel. A round hole is formed in the upper surface of the partition plate. The output end of the guiding pipe is fixedly connected to the inner wall of the round hole. With the cooperation of the second pump and the guiding pipe, the cooling medium in the upper layer of the partition plate can be pumped back to the lower layer of the partition plate, and the cooling medium can be thermally conductive and cooled while being pumped in cooperation with the heat dissipation rack.
[0020] Preferably, the connecting pipe penetrates through the inside of the heat dissipation rack. The connecting pipe is communicated with the inside of the frame. The connecting pipe is communicated with the inside of the first outer water tank. The first solenoid valve is electrically connected to the control panel. The third pump is electrically connected to the control panel. The communication between the connecting pipe and the first outer water tank can be controlled through the first solenoid valve, so that when the temperature of the cooling medium reaches the threshold value, the cooling medium in the chassis can be sent into the first outer water tank.
[0021] Preferably, the second solenoid valve is electrically connected to the control panel. The third solenoid valve is electrically connected to the control panel. Through the cooperation of the third solenoid valve and the control panel, the output direction of the output end of the third pump can be controlled.
[0022] In summary, the technical effects and advantages of the present invention are as follows:
[0023] In the present invention, by setting the inner circulation component and the outer circulation component, when the liquid-cooled chassis works, the space inside itself can be divided into upper and lower layers. At the same time, the cooling medium can circulate and convert between the upper and lower layers of the chassis to improve the cooling effect of the liquid-cooled chassis on parts such as the motherboard. At the same time, the outer circulation component can replace part of the high-temperature cooling medium and inject the low-temperature cooling medium into the chassis, so that the temperature of the cooling medium inside the chassis can be effectively reduced, and the cooling effect of the liquid-cooled chassis is further improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1Schematic diagram of the overall structure of a liquid-cooled chassis with an internal and external double-loop system according to the present invention;
[0025] Figure 2 Rear view structure schematic diagram of a liquid-cooled chassis with an internal and external double-loop system according to the present invention;
[0026] Figure 3 Right side cross-sectional view of a liquid-cooled chassis with an internal and external double-loop system according to the present invention;
[0027] Figure 4 Partial structure schematic diagram of a liquid-cooled chassis with an internal and external double-loop system according to the present invention;
[0028] Figure 5 Schematic diagram of the structure of the internal circulation device of a liquid-cooled chassis with an internal and external double-loop system according to the present invention;
[0029] Figure 6 For a liquid-cooled chassis with an internal and external double-loop system according to the present invention Figure 5 Schematic diagram of the upward view structure;
[0030] Figure 7 Partial structure schematic diagram of the cooling component of a liquid-cooled chassis with an internal and external double-loop system according to the present invention;
[0031] Figure 8 For a liquid-cooled chassis with an internal and external double-loop system according to the present invention Figure 7 Schematic diagram of the structure at position A;
[0032] Figure 9 Schematic diagram of the voltage regulating component of a liquid-cooled chassis with an internal and external double-loop system according to the present invention;
[0033] Figure 10 Schematic diagram of the structure of the external circulation device of a liquid-cooled chassis with an internal and external double-loop system according to the present invention.
[0034] In the figure: 1, base; 2, frame; 3, glass plate; 4, cover plate; 5, control panel; 6, internal circulation device;
[0035] 61, cooling component; 61-1, partition; 61-2, sprayer; 61-3, first pump; 61-4, connector; 61-5, heat dissipation rack; 61-6, second pump; 61-7, guiding pipe; 61-8, spline heat conduction fin; 61-9, protective cover; 61-10, heat dissipation fan; 61-11, filter screen; 61-12, support column;
[0036] 62, voltage regulating component; 62-1, installation cavity; 62-2, adsorption iron ring; 62-3, support leg; 62-4, magnetic block; 62-5, load-bearing plate; 62-6, conical column;
[0037] 63, temperature sensor;
[0038] 7. Outer circulation device; 71. First outer water tank; 72. Connecting pipe; 73. Solenoid valve 1; 74. Second outer water tank; 75. Third pump; 76. Solenoid valve 2; 77. Conduit 1; 78. Conduit 2; 79. Solenoid valve 3; 710. Water inlet pipe; 711. Water outlet pipe. Detailed implementation
[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.
[0040] Refer to Figures 1 - 10 A liquid-cooled chassis with an internal and external double circulation system as shown, a base 1, the upper surface of the base 1 is fixedly connected with a frame 2, the inner wall of the frame 2 is fixedly connected with a glass plate 3, the upper surface of the frame 2 is provided with a cover plate 4, the inner wall of the cover plate 4 is provided with a control panel 5, and an internal circulation device 6 is arranged inside the frame 2;
[0041] The internal circulation device 6 includes a cooling component 61 composed of a partition 611, a sprayer 612, a first pump 613, a connector 614, a heat dissipation rack 615, a second pump 616, a guiding pipe 617, and a heat dissipation fan 6110;
[0042] The internal circulation device 6 includes a pressure regulating component 62 composed of an adsorption iron ring 622, a support foot 623, a magnetic block 624, a load-bearing plate 625, and a conical column 626;
[0043] The internal circulation device 6 further includes a temperature sensor 63;
[0044] The rear surface of the frame 2 is provided with an external circulation device 7 composed of a first outer water tank 71, a connecting pipe 72, a solenoid valve 1 73, a second outer water tank 74, a third pump 75, a solenoid valve 2 76, and a solenoid valve 3 79.
[0045] Among them, the cooling component 61 includes a partition 611, the partition 611 is fixedly connected with the inner wall of the frame 2, the lower surface of the partition 611 is fixedly connected with a sprayer 612, the upper surface of the base 1 is fixedly connected with a first pump 613, the output end of the first pump 613 is fixedly connected with a connector 614, the connector 614 is fixedly connected with the input end of the sprayer 612, the rear inner wall of the frame 2 is fixedly connected with a heat dissipation rack 615, the second pump 616 is installed inside the right glass plate 3, the output end of the second pump 616 is fixedly connected with a guiding pipe 617, the guiding pipe 617 is fixedly connected with the inner wall of the heat dissipation rack 615, and a spline heat conducting sheet 618 is fixedly connected to the inner wall of the guiding pipe 617;
[0046] A protective cover 619 is fixedly connected to the rear surface of the frame 2. The protective cover 619 is sleeved outside the heat dissipation rack 615. A heat dissipation fan 6110 is fixedly connected to the rear surface of the protective cover 619. A filter screen 6111 is installed at the air inlet end of the heat dissipation fan 6110. Support columns 6112 are fixedly connected to the lower surface of the partition plate 611. The support columns 6112 are fixedly connected to the upper surface of the base 1. The spline heat conducting sheet 618 can increase the heat exchange efficiency between the cooling medium flowing through the guiding pipe 617 and the guiding pipe 617, and at the same time can increase the residence time of the cooling medium in the guiding pipe 617 to enhance the heat exchange effect between the guiding pipe 617 and the cooling medium.
[0047] Among them, the pressure regulating component 62 includes an adsorption iron ring 622. An installation cavity 621 is formed in the inner wall of the liquid sprayer 612. The adsorption iron ring 622 is fixedly connected to the inner wall of the installation cavity 621. A support leg 623 is slidably connected to the inner wall of the installation cavity 621 of the liquid sprayer 612. A magnetic block 624 is fixedly connected to the lower surface of the support leg 623. The magnetic block 624 is magnetically attracted to the upper surface of the adsorption iron ring 622. A load-bearing plate 625 is fixedly connected to the inner side of the support leg 623. A conical column 626 is fixedly connected to the upper surface of the load-bearing plate 625. The conical column 626 is located in the liquid outlet of the liquid sprayer 612. With the cooperation of the magnetic block 624 and the adsorption iron ring 622, the position of the load-bearing plate 625 can be restricted when the load-bearing plate 625 is not impacted by the cooling medium with a force greater than the magnetic force.
[0048] Among them, the temperature sensor 63 is fixedly connected to the side surface of the second pump 616. The temperature sensor 63 is electrically connected to the control panel 5. The temperature sensor 63 can sense the temperature of the cooling medium above the partition plate 611, so as to cooperate with the control panel 5 to automatically control the electrical equipment connected to the control panel 5.
[0049] Among them, the external circulation device 7 includes a first external water tank 71. The first external water tank 71 is fixedly connected to the rear surface of the frame 2. The input end of the first external water tank 71 is fixedly connected with a first solenoid valve. The input end of the first solenoid valve is fixedly connected with a connecting pipe 72. A second external water tank 74 is fixedly connected to the rear surface of the frame 2. A third pump 75 is fixedly connected to the rear surface of the second external water tank 74. The first external water tank 71 can store the cooling medium in the storage area formed by the base 1, the frame 2, the glass plate 3 and the cover plate 4, so that the heat-exchanged cooling medium can be sent out of the chassis.
[0050] Among them, a second solenoid valve 76 is fixedly connected to the rear surface of the second outer water tank 74. The output end of the second solenoid valve 76 is fixedly connected to the input end of the third pump 75. A first conduit 77 is fixedly connected inside the left interface of the second solenoid valve 76. The first conduit 77 is fixedly connected to the surface of the first outer water tank 71. A second conduit 78 is fixedly connected inside the right interface of the second solenoid valve 76. The second conduit 78 is fixedly connected to the surface of the second outer water tank 74. The first conduit 77 communicates with the inside of the first outer water tank 71, and the second conduit 78 communicates with the inside of the second outer water pipe. By using the second solenoid valve 76, under the control of the control panel 5, the third pump 75 can extract the cooling medium in the first outer water tank 71 or the second outer water tank 74, so that the cooling medium in the first outer water tank 71 can be sent into the second outer water tank 74, and at the same time, the cooling medium in the second outer water tank 74 can be sent back into the chassis again.
[0051] Among them, a third solenoid valve is fixedly connected to the rear surface of the second outer water tank 74. The input end of the third solenoid valve is fixedly connected to the output end of the third pump 75. A water inlet pipe 710 is fixedly connected inside the left interface of the solenoid valve. The water inlet pipe 710 is fixedly connected to the upper surface of the cover plate 4. A water outlet pipe 711 is fixedly connected inside the right interface of the solenoid valve. An installation hole is formed in the upper surface of the cover plate 4, and the water outlet pipe 711 is fixedly connected to the inner wall of the installation hole. The water inlet pipe 710 communicates with the inside of the second outer water tank 74, and the water outlet pipe 74 penetrates through the lower surface of the cover plate 4. By using the water outlet pipe 711, the third solenoid valve and the chassis can be connected, so that the third pump 75 can pump the cooling medium in the second outer water tank 74 into the chassis to reduce the temperature of the cooling medium in the upper layer of the chassis.
[0052] Among them, a through hole is formed in the upper surface of the partition plate 611. The nozzle of the sprayer 612 is located inside the through hole. The first pump 613 communicates with the inside of the connector 614. The first pump 613 is electrically connected to the control panel 5. The connector 614 communicates with the inside of the sprayer 612. The second pump 616 is electrically connected to the control panel 5. A round hole is formed in the upper surface of the partition plate 611. The output end of the guiding pipe 617 is fixedly connected to the inner wall of the round hole. By using the cooperation of the second pump 616 and the guiding pipe 617, the cooling medium in the upper layer of the partition plate 611 can be pumped back to the lower layer of the partition plate 611 again, and at the same time, the cooling medium can be thermally conductive and cooled during the pumping process in cooperation with the heat dissipation rack 615.
[0053] Among them, the connecting pipe 72 penetrates through the inside of the heat dissipation rack 615. The connecting pipe 72 communicates with the inside of the frame 2. The connecting pipe 72 communicates with the inside of the first outer water tank 71. The first solenoid valve 73 is electrically connected to the control panel 5. The third pump 75 is electrically connected to the control panel 5. The communication between the connecting pipe 72 and the first outer water tank 71 can be controlled through the first solenoid valve 73, so that when the temperature of the cooling medium reaches the threshold value, the cooling medium located inside the chassis can be sent into the first outer water tank 71.
[0054] Among them, the second solenoid valve 76 is electrically connected to the control panel 5, and the third solenoid valve 79 is electrically connected to the control panel 5. Through the cooperation of the third solenoid valve and the control panel 5, the output direction of the output end of the third pump 75 can be controlled.
[0055] Working principle of the present invention: When using a liquid-cooled chassis as the housing, open the cover plate 4, install the motherboard structure composed of accessories such as the motherboard, graphics card, and CPU on the upper layer of the partition 611. After the installation is completed, inject the cooling medium into the lower layer space of the partition 611 through the round holes on the partition 611. After the injection of the cooling medium is completed, fix the guiding pipe 617 in the round hole, and then inject the cooling medium into the upper layer space of the partition 611. After the injection of the cooling medium in the upper layer space is completed, fix the cover plate 4 above the frame 2 again, and fix the water outlet pipe 711 into the installation hole. After the above operations are completed, inject the cooling medium into the second outer water tank 74 through the hole of the installation conduit two 78. After the injection of the cooling medium is completed, fix the conduit two 78 into the hole again;
[0056] After the above entire preparation process is completed, power on the chassis. When the temperature of the cooling medium in the upper layer of the partition 611 reaches 50 °C ± 5 °C, the temperature sensor 63 cooperates with the control panel 5 to control the operation of the first pump 613 and the second pump 616. The first pump 613 is powered on and pumps the cooling medium in the lower layer of the partition 611 into the connector 614 at a speed of 1.5 L / min through its input end. The connector 614 cooperates with the sprayer 612 to pressurize and send the cooling medium pumped by the first pump 613 into the cooling medium in the upper layer of the partition 611. When the next cooling medium pumped by the first pump 613 enters the upper layer cooling medium, the upper layer cooling medium is disturbed by the lower layer cooling medium, generating a flowing effect, and cools down the cover plate 4 above the partition 611 and the motherboard structure composed of accessories such as the motherboard, graphics card, and CPU in the flowing state;
[0057] When the second pump 616 is working, it pumps the upper layer cooling medium to the guiding pipe 617. The guiding pipe 617 cooperates with the spline heat conducting sheet 618 to transfer the heat in the flowing cooling medium to the heat dissipation frame 615. The heat dissipation frame 615 transfers the heat to the outside. At the same time, the heat dissipation fan 6110 is powered on and works under the control of the control panel 5, and blows air to the outside of the heat dissipation frame 615, so that the heat of the heat dissipation frame 615 is dissipated through the grid part under the protective cover 619;
[0058] When the temperature of the upper cooling medium reaches 65°C ± 5°C, the control panel 5 controls the first pump 613 to increase its working power so that the power of the first pump 613 reaches 2.5 L / min. At the same time, when the pumped cooling medium passes through the outlet of the sprayer 612, it pushes the load-bearing plate 625 upward. At this time, the acting force on the load-bearing plate 625 is greater than the adsorption force between the magnet 624 and the adsorption iron ring 622. Under the action of the cooling medium, the load-bearing plate 625 pushes the conical column 626 upward. The conical column 626 moves downward and blocks the outlet of the sprayer 612, reducing the outlet specification of the sprayer 612. Immediately, the spraying speed and pressure of the cooling medium increase to enhance the disturbance effect on the upper cooling medium and improve the fluidity and heat dissipation efficiency of the upper cooling medium;
[0059] When the temperature of the upper cooling medium reaches 75°C ± 5°C, the control panel 5 controls the first solenoid valve 73 to open. The first solenoid valve 73 is powered on and works, and cooperates with the connecting pipe 72 to connect the inside of the chassis and the first external water tank 71. Immediately, the upper cooling medium inside the chassis flows into the first external water tank 71. After the first solenoid valve 73 is opened for 5 minutes, the control panel 5 controls the first solenoid valve 73 to close. At the same time, the control panel 5 controls the second solenoid valve 76 and the third solenoid valve 79 so that the second conduit 78 and the water outlet pipe 711 are respectively connected to the third pump 75. Immediately, under the control of the control panel 5, the third pump 75 pumps the room-temperature cooling medium in the second external water tank 74 into the upper cooling medium of the chassis through the cooperation of the second solenoid valve 76, the third solenoid valve 79, the second conduit 78 and the water outlet pipe 711. When the upper cooling medium is mixed with the cooling medium in the second external water tank 74, the temperature of the upper cooling medium will decrease;
[0060] After the third pump 75 works for 5 minutes, the control panel 5 controls the second solenoid valve 76 and the third solenoid valve 79 so that the first conduit 77 and the water inlet pipe 710 are respectively connected to the third pump 75. The third pump 75 works and pumps the cooling medium in the first external water tank 71 into the second external water tank 74. After the cooling medium in the first external water tank 71 is pumped into the second external water tank 74, the control panel 5 controls the third pump 75, the second solenoid valve 76 and the third solenoid valve 79 to close, so that the replaced cooling medium is stored in the second external water tank 74. At the same time, the second external water tank 74 gradually transfers the heat in the cooling medium through its own heat conduction effect;
[0061] By setting the internal circulation component and the external circulation component, when the liquid-cooled chassis is working, the internal space of the chassis can be divided into upper and lower layers. At the same time, the cooling medium can circulate and convert between the upper and lower layers of the chassis to improve the cooling effect of the liquid-cooled chassis on components such as the motherboard. At the same time, the external circulation component can replace some high-temperature cooling medium and inject low-temperature cooling medium into the chassis, so that the temperature of the cooling medium inside the chassis can be effectively reduced, further improving the cooling effect of the liquid-cooled chassis.
[0062] All the electrical components appearing in this article are connected to the external main controller and the 220V mains power supply, and the main controller can be a conventional known device such as a computer for control.
[0063] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A liquid-cooled chassis with an internal and external double-loop system, comprising a base (1), characterized in that: The upper surface of the base (1) is fixedly connected with a frame (2). The inner wall of the frame (2) is fixedly connected with a glass plate (3). The upper surface of the frame (2) is provided with a cover plate (4). The inner wall of the cover plate (4) is provided with a control panel (5). An internal circulation device (6) is arranged inside the frame (2). The internal circulation device (6) includes a cooling component (61) composed of a partition plate (611), a liquid sprayer (612), a first pump (613), a connector (614), a heat dissipation rack (615), a second pump (616), a guiding pipe (617), and a heat dissipation fan (6110). The internal circulation device (6) includes a pressure regulating component (62) composed of an adsorption iron ring (622), a support leg (623), a magnet (624), a load-bearing plate (625), and a conical column (626). The internal circulation device (6) further includes a temperature sensor (63). The rear surface of the frame (2) is provided with an external circulation device (7) composed of a first external water tank (71), a connecting pipe (72), a first solenoid valve (73), a second external water tank (74), a third pump (75), a second solenoid valve (76), and a third solenoid valve (79).
2. The liquid cooling chassis of an internal and external double circulation system according to claim 1, characterized in that: The cooling component (61) includes a partition plate (611). The partition plate (611) is fixedly connected with the inner wall of the frame (2). The lower surface of the partition plate (611) is fixedly connected with a liquid sprayer (612). The upper surface of the base (1) is fixedly connected with a first pump (613). The output end of the first pump (613) is fixedly connected with a connector (614). The connector (614) is fixedly connected with the input end of the liquid sprayer (612). The rear inner wall of the frame (2) is fixedly connected with a heat dissipation rack (615). The second pump (616) is installed inside the right glass plate (3). The output end of the second pump (616) is fixedly connected with a guiding pipe (617). The guiding pipe (617) is fixedly connected with the inner wall of the heat dissipation rack (615). A spline heat conducting sheet (618) is fixedly connected to the inner wall of the guiding pipe (617). A protective cover (619) is fixedly connected to the rear surface of the frame (2). The protective cover (619) is sleeved outside the heat dissipation rack (615). The rear surface of the protective cover (619) is fixedly connected with a heat dissipation fan (6110). A filter screen (6111) is installed at the air inlet end of the heat dissipation fan (6110). The lower surface of the partition plate (611) is fixedly connected with a support column (6112). The support column (6112) is fixedly connected with the upper surface of the base (1).
3. The liquid-cooled chassis of an internal and external double-loop system according to claim 1, wherein: The pressure regulating component (62) includes an adsorption iron ring (622). An installation cavity (621) is formed in the inner wall of the liquid sprayer (612). The adsorption iron ring (622) is fixedly connected to the inner wall of the installation cavity (621). A support leg (623) is slidably connected to the inner wall of the installation cavity (621) of the liquid sprayer (612). A magnetic block (624) is fixedly connected to the lower surface of the support leg (623). The magnetic block (624) is magnetically attracted to the upper surface of the adsorption iron ring (622). A load-bearing plate (625) is fixedly connected to the inner side of the support leg (623). A conical column (626) is fixedly connected to the upper surface of the load-bearing plate (625). The conical column (626) is located in the liquid outlet of the liquid sprayer (612).
4. The liquid-cooled chassis of an internal and external double-loop system according to claim 1, characterized in that: The temperature sensor (63) is fixedly connected to the side surface of the second pump (616). The temperature sensor (63) is electrically connected to the control panel (5).
5. The liquid-cooled chassis of an internal and external double-loop system according to claim 1, characterized in that: The external circulation device (7) includes a first external water tank (71). The first external water tank (71) is fixedly connected to the rear surface of the frame (2). A first electromagnetic valve is fixedly connected to the input end of the first external water tank (71). A connecting pipe (72) is fixedly connected to the input end of the first electromagnetic valve. A second external water tank (74) is fixedly connected to the rear surface of the frame (2). A third pump (75) is fixedly connected to the rear surface of the second external water tank (74).
6. The liquid cooling chassis of an internal and external double circulation system according to claim 1 or 5, characterized in that: A second electromagnetic valve (76) is fixedly connected to the rear surface of the second external water tank (74). The output end of the second electromagnetic valve (76) is connected to the input end of the third pump (75). A conduit one (77) is fixedly connected to the left interface of the second electromagnetic valve (76). The conduit one (77) is fixedly connected to the surface of the first external water tank (71). A conduit two (78) is fixedly connected to the right interface of the second electromagnetic valve (76). The conduit two (78) is fixedly connected to the surface of the second external water tank (74). The conduit one (77) is communicated with the inside of the first external water tank (71). The conduit two (78) is communicated with the inside of the second external water pipe.
7. A liquid-cooled chassis with an internal and external double-loop system according to claim 1 or 5, characterized in that: A third electromagnetic valve is fixedly connected to the rear surface of the second external water tank (74). The input end of the third electromagnetic valve is connected to the output end of the third pump (75). An inlet pipe (710) is fixedly connected to the left interface of the electromagnetic valve. The inlet pipe (710) is fixedly connected to the upper surface of the cover plate (4). An outlet pipe (711) is fixedly connected to the right interface of the electromagnetic valve. An installation hole is formed in the upper surface of the cover plate (4). The outlet pipe (711) is fixedly connected to the inner wall of the installation hole. The inlet pipe (710) is communicated with the inside of the second external water tank (74). The outlet pipe (711) penetrates through the lower surface of the cover plate (4).
8. The liquid-cooled chassis of an internal and external double-loop system according to claim 1, characterized in that: The upper surface of the partition plate (611) is provided with through holes, the nozzle of the liquid sprayer (612) is located inside the through holes, the first pump (613) is connected to the inside of the connector (614), the first pump (613) is electrically connected to the control panel (5), the connector (614) is connected to the inside of the liquid sprayer (612), the second pump (616) is electrically connected to the control panel (5), the upper surface of the partition plate (611) is provided with round holes, and the output end of the guide pipe (617) is fixedly connected to the inner wall of the round holes.
9. The liquid cooling chassis of an internal and external double circulation system according to claim 1 or 5, characterized in that: The connecting pipe (72) penetrates through the inside of the heat dissipation frame (615), the connecting pipe (72) is connected to the inside of the frame (2), the connecting pipe (72) is connected to the inside of the first external water tank (71), the first electromagnetic valve (73) is electrically connected to the control panel (5), and the third pump (75) is electrically connected to the control panel (5).
10. The liquid-cooled chassis of an internal and external double-loop system according to claim 1, characterized in that: The second electromagnetic valve (76) is electrically connected to the control panel (5), and the third electromagnetic valve (79) is electrically connected to the control panel (5).
Citation Information
Patent Citations
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