Modularized heat dissipation computing device

Abstract

The invention relates to a modular heat dissipation computing device. Aiming at the problems of fixed computing power, limited heat dissipation effect, high maintenance cost, poor adaptability and the like in the prior art, the equipment comprises a case and a computing board, and a horizontal direct-current air duct and fans at the two ends are arranged in the case; the computing board is composed of a PCB main board and a plurality of heat dissipation computing modules, golden finger female ends are arranged on the PCB main board in a matrix mode, and the heat dissipation computing modules are connected with the female ends in an inserted mode through golden finger male ends. The module comprises a PCB (Printed Circuit Board) daughter board, a computing chip and an independent radiator (a heat conducting plate and radiating fins arranged along the direction of an air duct), wherein the radiating fins and the air duct enhance heat dissipation in the same direction. Through modular design, modules can be increased or decreased at will to adjust computing power, and multi-scene adaptation is achieved; a single module is independently replaced to simplify maintenance; the independent radiator improves the radiating efficiency; the multi-case adaptability and the space utilization rate are improved through the standardized design, and the production cost is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of computing devices, and particularly relates to a computing device with modular heat dissipation. Background Art

[0002] With the continuous improvement of the computing power requirements of computing devices, the integrated design of high-heat-generation computing chips has become the mainstream. In the prior art, multiple high-heat-generation chips are often integrated on the computing board of a computing device, and the corresponding radiator generally adopts a simple overall large-block structure design in the production process (such as the Chinese patent with the application number 202210781290.2). This structure has the following significant defects: 1. Limitation in computing power adjustment: The chips are integrated on the PCB board with a fixed number, and the computing power performance cannot be adjusted by increasing or decreasing the number of chips later, making it difficult to match the actual requirements of different scenarios and resulting in resource waste; 2. Limited heat dissipation effect: Although the whole radiator can be locally optimized for a single chip, the overall heat dissipation efficiency for the high-density integrated multi-chip PCB board is still insufficient; 3. High maintenance cost: When any chip is damaged, the whole needs to be replaced or repaired, and the maintenance operation is complex and costly; 4. Poor adaptability: The sizes and shapes of the radiators of computing devices with different chassis or configurations may be different, and the adaptation rate to the same computing board is low, with structural redundancy and high production costs. Summary of the Invention

[0003] Based on this, in view of the above technical problems, a computing device with modular heat dissipation is provided.

[0004] The technical solution adopted by the present invention is as follows: A computing device with modular heat dissipation, comprising a chassis and a computing board. There is a horizontal DC air duct for dissipating heat from the computing board inside the chassis. At least one end of the DC air duct is provided with a fan. The panels of the chassis corresponding to the two ends of the DC air duct have ventilation holes. The computing board is arranged inside the chassis. It is characterized in that the computing board includes a PCB main board and a plurality of heat dissipation computing modules. There are a plurality of female gold fingers arranged in a matrix on the PCB main board and located inside the DC air duct. The heat dissipation computing module includes a PCB sub-board and a radiator. The lower end of the PCB sub-board has male gold fingers adapted to the female gold fingers. The front of the PCB sub-board has computing chips. The radiator includes a heat conduction plate and a plurality of heat dissipation fins formed on the front of the heat conduction plate. The back of the heat conduction plate is in contact with the front of the computing chips, and the heat conduction plate is fixed to the PCB sub-board. The heat dissipation fins are arranged along the left-right direction of the PCB sub-board, and the plurality of heat dissipation fins are arranged at intervals along the up-down direction of the PCB sub-board. Each heat dissipation computing module is plugged into the PCB main board through male and female gold fingers, so that the PCB sub-board and the radiator thereon are located inside the DC air duct, and the left-right direction of the PCB sub-board is consistent with the direction of the DC air duct.

[0005] Through the innovative design of the modular heat dissipation computing module, the present invention effectively solves the defects of the prior art, and the specific beneficial effects are as follows: 1. The computing power is dynamically adjustable to adapt to the needs of multiple scenarios: Through the plug-in structure of the male and female gold fingers, the number of heat dissipation computing modules can be arbitrarily increased or decreased according to the actual scenario requirements, physically flexibly adjusting the computing power performance and operation efficiency of the computing device, avoiding resource waste, and having a wider application range; 2. Convenient maintenance and reduced costs: When a single heat dissipation computing module (including the PCB sub-board, chip and radiator) is damaged, only the faulty module needs to be replaced, without overall disassembly, significantly simplifying the maintenance operation and reducing the maintenance cost; 3. Significantly improved heat dissipation efficiency: Each heat dissipation computing module is equipped with an independent radiator (heat conduction plate + heat dissipation fins arranged along the direction of the DC air duct), and the whole module is located inside the DC air duct, and the direction of the heat dissipation fins is consistent with the air duct, effectively enhancing the heat diffusion efficiency and solving the heat dissipation bottleneck of multi-chip integration; 4. High space utilization rate: The modular design allows more heat dissipation computing modules to be arranged in the same chassis volume, realizing higher chip density and computing power performance, and solving the problem of space redundancy in the traditional structure; 5. Strong adaptability and reduced production costs: The standardized design of the heat dissipation computing module can match chassis of multiple sizes, without customizing radiators for different chassis and configurations, improving the adaptation rate and reducing the production and manufacturing costs; 6. Integrated stacking simplifies the assembly of the whole machine: The heat dissipation calculation modules can be stacked into the whole machine, and the assembly process only requires plugging operations, greatly simplifying the production and later expansion processes. Description of the Drawings

[0006] The present invention will be described in detail below in conjunction with the drawings and specific embodiments: Figure 1 An exploded view of a modular heat dissipation computing device provided by an embodiment of the present invention; Figure 2 An internal structure schematic diagram of a modular heat dissipation computing device provided by an embodiment of the present invention; Figure 3 A structure schematic diagram of a computing board according to an embodiment of the present invention; Figure 4 A structure schematic diagram of a heat dissipation calculation module according to an embodiment of the present invention; Figure 5 An exploded view of a heat dissipation calculation module according to an embodiment of the present invention; Figure 6 A structure schematic diagram of an air duct assembly according to an embodiment of the present invention; Figure 7 A structure schematic diagram of the bottom frame of the air duct assembly according to an embodiment of the present invention. Specific Embodiments

[0007] The following will describe the embodiments of the present invention in conjunction with the accompanying drawings of the specification. It should be noted that the embodiments involved in this specification are not exhaustive and do not represent the only embodiments of the present invention. The following corresponding embodiments are only for clearly explaining the inventive content of the present invention patent and do not limit its embodiments. For those of ordinary skill in the art, different forms of changes and modifications can be made based on the description of this embodiment, and any changes or modifications that belong to the technical concept and inventive content of the present invention and are obvious are also within the protection scope of the present invention.

[0008] As Figure 1 shown, an embodiment of the present application provides a modular heat dissipation computing device, including a chassis 1100, a computing board 1200, an air duct assembly 1300, an intake fan 1400, an exhaust fan 1500, and a power supply 1600.

[0009] As Figure 1 shown, the chassis 1100 is composed of a bottom plate 1110, left and right side panels 1120, a front panel 1130, a rear panel 1140, and a top plate 1150. The left and right side panels 1120 are integrally formed on the bottom plate 1110. The front panel 1130 and the rear panel 1140 both have ventilation holes, and a handle 113(1) is also provided on the front panel 1130.

[0010] As Figure 1and Figure 3 As shown in Figure 3 , the computing board 1200 includes a PCB main board 1210 and a plurality of heat dissipation computing modules 1220.

[0011] The PCB main board 1210 is fixed to the bottom board 1110 by bolts and abuts against the inner wall of the left panel 1120. See Figure 2 .

[0012] As Figure 3 shown, the PCB main board 1210 has 24 female gold fingers 1211, forming an 8 (left - right direction) * 3 (front - back direction) matrix. It can be understood that the number of female gold fingers 1211 is not limited to 24.

[0013] The female gold fingers 1211 are surface - mounted or soldered onto the PCB main board 1210.

[0014] The number of heat dissipation computing modules 1220 is less than or equal to the number of female gold fingers 1211. As Figure 4 shown, it includes a PCB sub - board 1221 and a radiator 1222.

[0015] The lower end of the PCB sub - board 1221 has male gold fingers 1221a adapted to the female gold fingers 1211. Thus, each heat dissipation computing module 1220 can be plugged into the PCB main board 1210 through the male gold fingers 1221a and the female gold fingers 1211.

[0016] As Figure 4 shown, fixing seats 1223 are respectively provided on the left and right sides of the upper end of the PCB sub - board 1221. Specifically, as Figure 5 shown, taking the fixing seat 1223 on the right side as an example, it has a tongue 1223a in the front - back direction. The tongue 1223a is inserted into the jack 1221b on the upper - right side of the PCB sub - board 1221, and the fixing seat 1223 is fixed to the PCB sub - board 1221 by bolts in the front - back direction. The fixing seat 1223 also has a sheet body 1223b outside the PCB sub - board 1221, and bolt holes in the up - down direction are formed on the sheet body 1223b, serving as the first fixing structure 1223c.

[0017] As Figure 4 shown, a pull - ring 1221c is provided in the middle of the front of the upper end of the PCB sub - board 1221, serving as a handle for facilitating the taking and placing of the heat dissipation computing module 1220.

[0018] As Figure 5 shown, four computing chips 1221d are provided on the front of the PCB sub - board 1221.

[0019] As Figure 4As shown, the heat sink 1222 includes a heat conducting plate 1222 a and a plurality of heat dissipating fins 1222 b formed on the front side of the heat conducting plate 1222 a .

[0020] The back side of the heat conducting plate 1222a contacts the front side of the computing chip 1221d, and the heat conducting plate 1222a is fixed to the PCB sub-board 1221. Specifically, the bolts connecting the fixing seat 1223 and the PCB sub-board 1221 are connected to the heat conducting plate 1222a, connecting the fixing seat 1223, the PCB sub-board 1221 and the heat conducting plate 1222a together.

[0021] The heat sinks 1222 b are arranged along the left-right direction of the PCB sub-board 1221 , and a plurality of heat sinks 1222 b are arranged at intervals along the up-down direction of the PCB sub-board 1221 .

[0022] The upper portion of the heat sink 1222 has a notch 1222c for accommodating the pull ring 1221c. Figure 5 .

[0023] The left and right widths of the heat sink 1222 are narrower than the left and right widths of the PCB daughter board 1221 , so that the left and right edges of the PCB daughter board 1221 are located outside the left and right sides of the heat sink 1222 , serving as left and right guide rails.

[0024] The air duct assembly 1300 is used to form a horizontal direct current air duct in the front-to-back direction in the chassis 1100 to dissipate heat for the computing board 1200. Figure 1 and Figure 6 As shown, it includes an air duct body 1310 , a front wind shield 1320 and a rear wind shield 1330 .

[0025] The air duct body 1310 as a whole is against the inner wall of the left panel 1120. Figure 6 As shown, it includes two air duct side panels 1311 and a bottom frame 1312. The two air duct side panels 1311 are fixed to the left and right frame edges of the bottom frame 1312 by bolts to form a left-right symmetrical arrangement. The bottom frame 1312 is fixed to the bottom plate 1110 by bolts, and the bottom frame 1312 is located on the PCB main board 1210, exposing all the gold finger female terminals 1211 on the PCB main board 1210 to the top of the bottom frame 1312.

[0026] like Figure 6 As shown, four upper cross beams 1340 are formed between the tops of the two air duct side plates 1311 and arranged in a front-to-back manner. Eight pairs of second fixing structures 1341 are formed on two adjacent upper cross beams 1340, for a total of 24 pairs. Figure 6A pair of second fixing structures 1341 are marked out. This pair of second fixing structures 1341 are respectively located on two adjacent upper cross beams 1340 and arranged front and back, and correspond to the first fixing structures 1223c on two fixing seats 1223 of the PCB daughter board 1221. The 8 pairs of second fixing structures 1341 on two adjacent upper cross beams 1340 are arranged at intervals left and right. In this embodiment, the second fixing structure 1341 is a bolt hole in the up and down direction.

[0027] Eight pairs of limiting grooves 1342 are also formed on two adjacent upper cross beams 1340, a total of 24 pairs. Among them, as Figure 6 A pair of limiting grooves 1342 are marked out. This pair of limiting grooves 1342 are formed on the opposite edges of two adjacent upper cross beams 1340 opposite to each other front and back, and correspond to the left and right two guide rails of the PCB daughter board 1221. The 8 pairs of limiting grooves 1342 on two adjacent upper cross beams 1340 are arranged at intervals left and right.

[0028] As Figure 7 As shown, two lower cross beams 1350 arranged at intervals front and back are formed between the left and right frame edges of the bottom frame 1312. A plurality of tabs 1360 arranged at intervals left and right are formed on the inner edges of the front and back frame edges of the bottom frame 1312 and the front and back edges of the lower cross beams 1350. Twenty-four pairs of guide grooves 1361 corresponding to the 24 pairs of limiting grooves 1342 one by one up and down are formed through the gaps between the left and right adjacent tabs 1360. Figure 7 A pair of guide grooves 1361 are marked out.

[0029] Among them, the top angle of the tab forming the upper notch of the guide groove 1361 is a round chamfer, see Figure 7 .

[0030] As Figure 6 As shown, both the front windshield 1320 and the rear windshield 1330 are n-shaped frames, and the two are respectively connected to the front side and the rear side of the two air duct side plates 1311. Taking the front windshield 1320 as an example, the front sides of its left and right sides have insertion slots, and the folded edges 1311b on the front edges of the air duct side plates 1311 are inserted into the insertion slots.

[0031] Based on the structure of the above air duct assembly 1300, the air duct main body 1310, the front windshield 1320, and the rear windshield 1330 cooperate with the top plate 1150 of the chassis 1100 to form a DC air duct, and all the female ends of the gold fingers 1211 are located inside the DC air duct. Thus, after inserting the heat dissipation calculation module 1220 into the PCB main board 1210, the PCB daughter board and the radiator thereon are also located inside the DC air duct, and the left-right direction of the inserted PCB daughter board is consistent with the direction of the DC air duct. When inserting the heat dissipation calculation module 1220 into the PCB main board 1210, the left and right guides of the PCB daughter board 1221 can be aligned with a pair of limit slots 1342, and the pair of limit slots 1342 can be used to move vertically downward. When the heat dissipation calculation module 1220 moves downward close to and is about to insert into the female end of the gold finger 1211, the guide is smoothly guided by the chamfer design of the guide slot 1361, so that the male end of the gold finger 1221a is inserted into the female end of the gold finger 1211. Finally, it is fixed to the chassis 1100 through the first fixing structure 1223c (bolt hole) on the two fixing seats 1223, a corresponding pair of second fixing structures 1341 (bolt hole), and bolts. Of course, the first fixing structure 1223c and the second fixing structure 1341 can also adopt other forms other than bolt holes, such as snap connection structures.

[0032] As Figure 1 and Figure 2 shown, the intake fan 1400 and the exhaust fan 1500 are respectively arranged at the front end and the rear end of the DC air duct, and are respectively close to the front panel 1130 and the rear panel 1140. At the same time, the air duct is short and sealed, which jointly improves the heat dissipation effect.

[0033] As Figure 2 shown, taking the intake fan 1400 as an example, the number of the intake fans is two. The two intake fans 1400 are fixed side by side left and right on the fan bracket 1410, and the fan bracket 1410 is connected to the front windshield 1320. Specifically, the connection method of hemming and slot insertion can also be adopted, which can refer to the description of the front windshield 1320 above. The number of the exhaust fans 1500 is also two, and the fixing method is the same as that of the intake fans 1400, so it will not be specifically described here.

[0034] Of course, it is also possible to set only one fan at one end of the DC air duct: set the intake fan 1400 at the front end of the DC air duct, or set the exhaust fan 1500 at the rear end of the DC air duct.

[0035] The power supply 1600 is located on the right side of the computing board 1200 and is fixed to the chassis 1100 through bolts for supplying power to the inside of the device.

[0036] As can be seen from the above, a modular heat dissipation computing device provided by an embodiment of the present application effectively solves the defects of the prior art through the innovative design of the modular heat dissipation calculation module. The specific beneficial effects are as follows: 1. The computing power is dynamically adjustable to adapt to the requirements of multiple scenarios: Through the plug-in structure of the male and female ends of the gold finger, the number of heat dissipation calculation modules can be arbitrarily increased or decreased according to the actual scenario requirements, physically flexibly adjusting the computing power performance and operation efficiency of the computing device, avoiding resource waste, and having a wider scope of application; 2. Easy to maintain and reduce costs: When a single heat dissipation calculation module (including the PCB daughter board, chip, and radiator) is damaged, only the faulty module needs to be replaced without overall disassembly, significantly simplifying the maintenance operation and reducing the maintenance cost; 3. Significantly improved heat dissipation efficiency: Each heat dissipation calculation module is equipped with an independent radiator (heat conduction plate + heat sink arranged along the direction of the direct current air duct), and the whole module is located in the direct current air duct, with the heat sink direction consistent with the air duct, effectively enhancing the heat diffusion efficiency and solving the heat dissipation bottleneck of multi-chip integration; 4. High space utilization rate: The modular design allows more heat dissipation calculation modules to be arranged within the same chassis volume, achieving higher chip density and computing power performance, and solving the problem of space redundancy in the traditional structure; 5. Strong adaptability and reduced production costs: The standardized design of the heat dissipation calculation module can match chassis of multiple sizes, eliminating the need to customize radiators for different chassis and configurations, improving the adaptation rate and reducing the production and manufacturing costs; 6. Integrated stacking simplifies the assembly of the whole machine: The whole machine can be stacked by heat dissipation calculation modules, and the assembly process only requires plug-in operations, greatly simplifying the production and subsequent expansion processes.

[0037] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application is also intended to include these changes and modifications.

Claims

1. A computing device with modular heat dissipation, comprising a chassis and a computing board. A horizontal DC air duct for dissipating heat from the computing board is provided inside the chassis. At least one end of the DC air duct is provided with a fan. The panels of the chassis corresponding to the two ends of the DC air duct are provided with ventilation holes. The computing board is arranged inside the chassis, and it is characterized in that, The computing board includes a PCB main board and a plurality of heat dissipation computing modules. The PCB main board has a plurality of female gold fingers arranged in a matrix and located within the DC air duct. The heat dissipation computing module includes a PCB daughter board and a radiator. The lower end of the PCB daughter board has male gold fingers adapted to the female gold fingers. The front surface of the PCB daughter board has computing chips. The radiator includes a heat conducting plate and a plurality of heat sinks formed on the front surface of the heat conducting plate. The back surface of the heat conducting plate is in contact with the front surface of the computing chips, and the heat conducting plate is fixed to the PCB daughter board. The heat sinks are arranged along the left-right direction of the PCB daughter board, and the plurality of heat sinks are arranged at intervals along the up-down direction of the PCB daughter board. Each heat dissipation computing module is plugged into the PCB main board through the male gold fingers and the female gold fingers, so that the PCB daughter board and the radiator thereon are located within the DC air duct, and the left-right direction of the PCB daughter board is consistent with the direction of the DC air duct.

2. The modular heat dissipation computing device according to claim 1, wherein, The upper end of the PCB daughter board has a pull ring.

3. The modular heat dissipation computing device according to claim 1, wherein The pull ring is fixed to the middle of the front surface of the upper end of the PCB daughter board, and the upper part of the radiator has a notch for accommodating the pull ring.

4. The modular heat dissipation computing device according to claim 1, wherein The DC air duct is along the front-back direction of the chassis. An air inlet fan and an air outlet fan are respectively provided at the front end and the rear end of the DC air duct. The front panel and the rear panel of the chassis both have ventilation holes. The PCB main board is fixed to the bottom plate of the chassis.

5. The modular heat dissipation computing device according to claim 1, wherein, It further includes an air duct assembly for forming the DC air duct. The air duct assembly includes an air duct main body, a front wind shield and a rear wind shield. The air duct main body includes a bottom frame and two air duct side plates. The bottom frame is located on the PCB main board and exposes the plurality of female gold fingers. The bottom frame is fixed to the bottom plate of the chassis. The two air duct side plates are arranged symmetrically left and right and are fixed to the bottom frame. The front wind shield and the rear wind shield are both n-shaped frames, and the two are respectively connected to the front side and the rear side of the two air duct side plates.

6. The modular heat dissipation computing device according to claim 5, wherein, Fixing seats are provided on the left and right sides of the upper end of the PCB daughter board. The fixing seats have first fixing structures. A plurality of upper cross beams arranged at intervals front and rear are formed between the tops of the two air duct side plates. A plurality of pairs of second fixing structures arranged at intervals left and right are formed on adjacent two upper cross beams. Among them, a pair of second fixing structures are respectively located on the adjacent two upper cross beams and are arranged front and rear, and correspond to the first fixing structures on the two fixing seats of the PCB daughter board. After each heat dissipation computing module is plugged into the PCB main board through the male gold fingers and the female gold fingers, it is fixed to the chassis through the first fixing structures on the two fixing seats and the corresponding pair of second fixing structures.

7. A modular heat dissipation computing device according to claim 6, wherein, Both the first fixing structure and the second fixing structure are bolt holes.

8. The computing device with modular heat dissipation according to claim 6, characterized in that, The left and right side edges of the PCB daughter board are located outside the left and right sides of the radiator and serve as two left and right guide rails. A plurality of pairs of limiting grooves arranged at intervals left and right are formed on adjacent two upper cross beams. Among them, a pair of limiting grooves are formed on the opposite edges of the adjacent two upper cross beams front and rear and correspond to the two guide rails of the PCB daughter board.

9. The computing device with modular heat dissipation according to claim 8, wherein A plurality of lower cross beams arranged at intervals front and back are formed between the left and right frame edges of the bottom frame. A plurality of tabs arranged at intervals left and right are formed on the inner edges of the front and back frame edges of the bottom frame and the front and back edges of the lower cross beams. A plurality of guide grooves corresponding to the plurality of pairs of limit grooves one by one up and down are formed through the gaps between the left and right adjacent tabs.

10. A modular heat dissipation computing device according to claim 9, characterized in that, The top angle of the tab forming the upper notch of the guide groove is a round chamfer.

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